JP2015045064A5 - - Google Patents

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Publication number
JP2015045064A5
JP2015045064A5 JP2013177374A JP2013177374A JP2015045064A5 JP 2015045064 A5 JP2015045064 A5 JP 2015045064A5 JP 2013177374 A JP2013177374 A JP 2013177374A JP 2013177374 A JP2013177374 A JP 2013177374A JP 2015045064 A5 JP2015045064 A5 JP 2015045064A5
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JP
Japan
Prior art keywords
silver
solution
reducing agent
silver powder
agent solution
Prior art date
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Application number
JP2013177374A
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English (en)
Japanese (ja)
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JP6135405B2 (ja
JP2015045064A (ja
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Priority to JP2013177374A priority Critical patent/JP6135405B2/ja
Priority claimed from JP2013177374A external-priority patent/JP6135405B2/ja
Publication of JP2015045064A publication Critical patent/JP2015045064A/ja
Publication of JP2015045064A5 publication Critical patent/JP2015045064A5/ja
Application granted granted Critical
Publication of JP6135405B2 publication Critical patent/JP6135405B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013177374A 2013-08-28 2013-08-28 銀粉及びその製造方法 Expired - Fee Related JP6135405B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013177374A JP6135405B2 (ja) 2013-08-28 2013-08-28 銀粉及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013177374A JP6135405B2 (ja) 2013-08-28 2013-08-28 銀粉及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015045064A JP2015045064A (ja) 2015-03-12
JP2015045064A5 true JP2015045064A5 (enExample) 2016-01-21
JP6135405B2 JP6135405B2 (ja) 2017-05-31

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ID=52670793

Family Applications (1)

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JP2013177374A Expired - Fee Related JP6135405B2 (ja) 2013-08-28 2013-08-28 銀粉及びその製造方法

Country Status (1)

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JP (1) JP6135405B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180047528A (ko) * 2016-10-31 2018-05-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
JP7598898B2 (ja) 2022-04-28 2024-12-12 Dowaエレクトロニクス株式会社 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト
JP7628981B2 (ja) 2022-04-28 2025-02-12 Dowaエレクトロニクス株式会社 球状銀粉、球状銀粉の製造方法、球状銀粉製造装置、及び導電性ペースト
JP7670920B1 (ja) 2023-10-27 2025-04-30 Dowaエレクトロニクス株式会社 銀粉及び銀粉の製造方法、銀粉製造装置並びに樹脂硬化型導電性ペースト
CN119566324B (zh) * 2024-12-04 2025-09-23 深圳市哈深智材科技有限公司 一种银粉及其规模化生产方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4489389B2 (ja) * 2003-07-29 2010-06-23 三井金属鉱業株式会社 微粒銀粉の製造方法
JP4301247B2 (ja) * 2005-01-21 2009-07-22 昭栄化学工業株式会社 球状銀粉末の製造方法
JP5355007B2 (ja) * 2008-09-17 2013-11-27 Dowaエレクトロニクス株式会社 球状銀粉の製造方法
JP5814720B2 (ja) * 2011-09-29 2015-11-17 アサヒプリテック株式会社 銀粉の製造方法

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