JP2015041731A - Dividing method of package substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently pick up a plurality of devices by releasing a protective tape that is affixed on a rear face of a rectangular substrate even in the case where an outer peripheral end material at a short side of the rectangular substrate cannot be held.SOLUTION: The package substrate is divided by predetermined dividing lines which are formed in a first direction and a second direction orthogonal to the first direction, to comprise a device part in which a package device 6 is formed on a surface, and an outer peripheral end material surrounding the device part. When dividing a package substrate 1 in a rectangular shape with which two or more device parts connected by an intermediate end material are formed in the first direction and one device part is formed in the second direction along the predetermined dividing line, a protective tape T is affixed on a rear face of the package substrate 1. When cutting the device parts after the outer peripheral end material and the intermediate end material in the second direction are removed, uncut portions 410a and 410b are left in cutting outer peripheral end materials 41a and 41b in the first direction, such that the outer peripheral end materials 41a and 41b in the first direction can be held when releasing the protective tape T.

Description

  The present invention relates to a package substrate dividing method in which a package substrate is cut and divided.

  Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and in order to meet these demands, a technology called device size package (CSP) has been developed as a package technology that can reduce the size of semiconductor devices. Has been. As one of CSP technologies, a package technology called QFN (Quad Flat Non-lead Package) has been put into practical use.

  In this packaging technology, a plurality of devices are arranged in a lattice shape and molded with resin, and the device portion on which the devices are arranged has an outer peripheral end material on the long side (first direction) and a short side (second side). The package substrate (rectangular substrate) surrounded by the outer peripheral end material in the direction) is cut along a planned division line, thereby being divided into packaged device size packages. Then, as a device used for dividing the rectangular substrate, the rectangular substrate is directly held and transported, and the cutting substrate is directly held by the holding jig to perform cutting, and the device package is placed on the tray after the division. An accommodating device has been developed (see, for example, Patent Document 1).

  However, in response to the demand for device size reduction (request for size reduction to 3 mm square or less), as in the past, when a rectangular substrate is directly fixed to a holding jig and cutting is performed, the individual device size is reduced. Since the suction area is small, the device package may scatter or move during processing, resulting in a product defect. As a method for avoiding such a problem, there is a method in which a protective tape is attached to the back side of the rectangular substrate, and a cutting blade is cut into the protective tape and divided, and the protective tape is applied to the back surface of the rectangular substrate. There has also been proposed an apparatus that efficiently picks up a device from a protective tape after a rectangular substrate is divided in a state in which the substrate is adhered (see, for example, Patent Document 2).

JP 2001-23936 A JP 2006-156777 A

  However, in recent rectangular substrates, in order to increase the number of devices per rectangular substrate, the width of the outer peripheral end material on the short side is becoming very narrow. In some cases, a method of gripping the outer peripheral end material on the short side cannot be adopted at the time of pickup.

  The present invention has been considered in view of the above problems, and its purpose is to peel off the protective tape attached to the back surface of the rectangular substrate even when the outer peripheral end material on the short side of the rectangular substrate cannot be gripped. It is to be able to efficiently pick up the device.

  The present invention surrounds a device portion and a device portion, which are partitioned by a first dividing line and a dividing line formed in a second direction perpendicular to the first direction and a plurality of package devices are formed on the surface. A package formed of two or more device parts connected by an intermediate end material in a first direction and a rectangular shape composed of one device part in a second direction. A method of dividing a package substrate that divides a substrate along a planned division line, a protective tape attaching step for attaching a protective tape having the same size as the package substrate to the back surface of the package substrate, and a protective tape attaching step After performing the above, the clearance formed in the position corresponding to the planned dividing line at the boundary between the peripheral edge member in the second direction of the package substrate and the intermediate edge member and the device part is used to release the cutting blade of the cutting blade. A holding table provided with a suction hole for sucking and holding the device portion through the groove and the protective tape, holding the protective tape side in contact with the holding substrate, and holding the package substrate; Cutting the package substrate and the protective tape by cutting the cutting blade up to the escape groove along the planned dividing line of the boundary between the outer peripheral end material and the intermediate end material in the direction of the device part and the device part, and separating it into each device part, After carrying out the second direction end material removal step and the second direction end material removal step of removing the outer peripheral end material and the intermediate end material in the second direction from the holding table together with the protective tape attached to the back surface, A device part dividing machine that cuts the cutting blade halfway in the thickness direction of the protective tape and cuts along a plurality of division lines of the device part to divide it into a plurality of package devices. After the device part dividing step, for each device part, the outer peripheral end material in the first direction is held together with the protective tape by the holding means, and the protective tape is peeled off from the back side of the plurality of package devices. And a protective tape peeling step for bulk-accommodating a plurality of packaged devices in the bulk accommodating means, and in the device portion dividing step, the first direction when cutting the dividing line in the second direction of the device portion The cutting blade is cut while leaving the uncut portion on the outer peripheral end material.

  In the present invention, since the outer peripheral end material in the first direction remains for each device portion by leaving the uncut portion in the device part dividing step, the outer peripheral end material in the first direction is gripped in the protective tape peeling step. be able to. Therefore, even when the outer peripheral end member in the second direction cannot be gripped, the outer peripheral end member in the first direction can be gripped, the protective tape can be peeled off, and the package device can be accommodated in bulk.

The disassembled perspective view which shows a package substrate and a holding table. The top view which shows a 2nd direction edge material removal process. The front view which shows a 2nd direction edge material removal process. The top view which shows the state which cuts the division | segmentation planned line of a 2nd direction in a device part division | segmentation process. The front view which shows the state which cuts the division | segmentation planned line of a 2nd direction in a device part division | segmentation process. The top view which shows the state which cuts the division | segmentation planned line of a 1st direction in a device part division | segmentation process. The front view which shows the state which cuts the division | segmentation planned line of a 1st direction in a device part division | segmentation process. The perspective view which shows each device block after completion | finish of a device part division | segmentation process. Sectional drawing which shows a protective tape peeling process. The perspective view which shows another example of each device block after completion | finish of a device part division | segmentation process. The front view which shows another example of the state which cuts the division | segmentation planned line of a 2nd direction in a device part division | segmentation process.

  The package substrate 1 shown in FIG. 1 is formed in a rectangular shape having a side extending in the first direction as a long side and a side extending in a second direction perpendicular to the first direction as a short side. The package substrate 1 has two or more (three in the example of FIG. 1) device parts 31, 32, and 33 connected by the intermediate end members 21 and 21 in the first direction, and in the second direction, One device section 31, 32, 33 is arranged side by side.

  The three device portions 31, 32, and 33 are surrounded by the outer peripheral end material 40. The outer peripheral end material 40 includes outer peripheral end materials 41a and 41b in the first direction and outer peripheral end materials 42a and 42b in the second direction. Although not shown, since the positioning holes for the holding table 7 that holds the package substrate 1 are formed on the back surfaces of the outer peripheral end members 41a and 41b in the first direction, the outer peripheral end in the first direction. The materials 41a and 41b are formed wider in width than the outer peripheral end materials 42a and 42b in the second direction.

  A plurality of package devices 6 are formed on the surface of each device unit 31, 32, 33 in a region defined by the division line 51 in the first direction and the division line 52 in the second direction. The division line 51 in the first direction is not limited to the inside of the device portions 31, 32, 33, but also the boundary between the outer peripheral end material 41a in the first direction and the device portions 31, 32, 33, and the first It also exists at the boundary between the outer peripheral end material 41 b in the direction and the device portions 31, 32, 33. Similarly, the dividing line 52 in the second direction is not limited to the inside of the device portions 31, 32, 33, but also the boundary between the outer peripheral end material 42a and the device portion 31 in the second direction, the device portion 31 and the intermediate end. The boundary between the material 21, the boundary between the intermediate end material 21 and the device portion 32, the boundary between the device portion 32 and the intermediate end material 22, the boundary between the intermediate end material 22 and the device portion 33, and the device portion 33 and the second It exists also in the outer peripheral end material 42b in the direction of.

  Hereinafter, a description will be given of a method of dividing the package substrate 1 configured as described above along the scheduled division lines 51 and 52 and accommodating the individual package devices 6 formed by the division in a predetermined place.

(1) Protection tape sticking process As shown in FIG. 1, the protection tape T is stuck on the back surface 1b of the package substrate 1. The protective tape T has a size equivalent to that of the package substrate 1 and has a role of holding the package devices 6 so that the package devices 6 are not separated even after the package substrate 1 is divided. For adhering the protective tape T, for example, a tape adhering device described in Japanese Patent Application Laid-Open No. 2011-243886 can be used.

(2) Holding step After performing the protective tape attaching step, the protective tape T side of the package substrate 1 is sucked and held in the holding table 7 shown in FIG. Of the surface 7a of the holding table 7, the boundary between the outer peripheral end member 42a and the device part 31 in the second direction, the boundary between the device part 31 and the intermediate end member 21, and the boundary between the intermediate end member 21 and the device part 32 Corresponding to the division line 52 at the boundary between the device part 32 and the intermediate end member 22, the boundary between the intermediate end member 22 and the device part 33, and the boundary between the device part 33 and the outer peripheral end member 42b in the first direction. An escape groove 70 for escaping the cutting edge 80 of the cutting blade 8 used for cutting the division line 52 is formed at the position to be cut. A suction hole 71 communicating with a suction source (not shown) is formed at a position corresponding to each package device 6 on the surface 7 a of the holding table 7.

  The package substrate 1 is aligned so that each package device 6 formed on the package substrate 1 faces each suction hole 71, and the protective tape T attached to the back surface 1 b of the package substrate 1 is attached to the front surface 7 a of the holding table 7. When a suction force is applied to the suction hole 71, the device portions 31, 32 and 33 are sucked and held via the protective tape 7.

(3) Second direction end material removing step After performing the holding step, as shown in FIG. 2, the boundary between the outer peripheral end material 42 a and the device portion 31 in the second direction, the device portion 31 and the intermediate end material 21. , The boundary between the intermediate end member 21 and the device portion 32, the boundary between the device portion 32 and the intermediate end member 22, the boundary between the intermediate end member 22 and the device portion 33, and the device portion 33 and the first direction. The rotating cutting blade 8 is cut from the front surface 1a side of the package substrate 1 along the planned dividing line 52 at the boundary with the outer peripheral end material 42b. Specifically, first, the rotating cutting blade 8 is positioned on the extension line of the division line 52 in the second direction at the boundary between the outer peripheral end member 42a in the second direction and the device portion 31, and FIG. As shown in FIG. 4, the cutting blade 8 is positioned at a height at which the lower end of the cutting edge 80 of the cutting blade 8 reaches the escape groove 70, and from this state, the cutting blade 8 and the holding table 7 holding the package substrate 1 are moved to the second position. The cutting blade 8 is cut into the planned dividing line 52. Further, when the cutting blade 8 and the package substrate 1 are relatively moved in the first direction, and the cutting edge 80 of the cutting blade 8 comes off from the outer peripheral end material 41b in the first direction, the cutting of the division line 52 is cut. finish. By such cutting, a cutting groove 520 is formed in the division line 52. During the cutting, cutting water is supplied to the contact portion between the cutting blade 8 and the package substrate 1.

  At the time of cutting, as shown in FIG. 3, the cutting blade 8 is cut so that the tip of the cutting edge 80 of the cutting blade 8 reaches the relief groove 70 of the holding table 7, whereby the package substrate 1 and the protective tape T Is cut. In this way, the boundary between the outer peripheral end material 42a and the device portion 31 in the second direction, the boundary between the device portion 31 and the intermediate end material 21, the boundary between the intermediate end material 21 and the device portion 32, and the device portion 32 When all of the dividing lines 52 at the boundary between the intermediate end member 22, the boundary between the intermediate end member 22 and the device portion 33, and the boundary between the device portion 33 and the outer peripheral end member 42b in the first direction are cut, A cutting groove 520 is formed at the boundary, and as shown in FIG. 4, outer peripheral end members 43a, 44a, 45a formed by dividing the outer peripheral end members 41a, 41b in the first direction and the respective device portions 31, 32, 33 are separated into device blocks 310, 320, and 330, outer peripheral end members 42a and 42b in the second direction, and intermediate end members 21 and 22, respectively. And the outer peripheral end materials 42a and 42b and the intermediate end materials 21 and 22 of the 2nd direction are holding tables by the rotational force of the cutting blade 8, and the force of cutting water with the protective tape T stuck on the back surface. It is skipped from 7 and removed. On the other hand, the device portions 31, 32, and 33 are held by the holding table 7 by the suction force acting on the suction holes 71 of the holding table 7. In this way, by removing the outer peripheral end members 42a, 42b and the intermediate end members 21, 22 in the second direction first, when cutting the division planned line 51 in the first direction later, Since it is not necessary to cut the outer peripheral end members 42a and 42b and the intermediate end members 21 and 22, the cutting edge 80 of the cutting blade 8 is hardly clogged, and the cutting quality can be improved.

(4) Device part dividing step After performing the second direction edge material removing step, cutting is performed along the planned division line 51 in the first direction and the planned division line 52 in the second direction, and a plurality of package devices Divide into 6.

  In the device dividing step, first, as shown in FIG. 4, a division direction line 52 (see FIG. 2) in the second direction formed in each device portion 31, 32, 33 is cut. This cutting is performed, for example, by so-called chopper traverse cutting. That is, the rotating cutting blade 8 is positioned above the division line 52 in the second direction, and the cutting blade 8 is lowered from there, and the cutting edge 80 of the cutting blade 8 is moved to the outer periphery in one first direction. Cut from the surface of the end material 43a. At this time, as shown in FIG. 5, the cutting edge 80 of the cutting blade 8 is cut halfway in the thickness direction of the protective tape T. Next, while maintaining the height of the cutting blade 8, the holding table 7 holding the package substrate 1 and the cutting blade 8 are relatively moved in the second direction, and cutting is performed along the scheduled division line 52. Then, at the stage where the tip of the cutting edge 80 of the cutting blade 8 is located in the middle of the outer peripheral end material 43b in the other first direction, the cutting blade 8 is raised, and the cutting of the division line 52 is finished. Such cutting is performed for all the division lines 52 in the second direction formed in the device portions 31, 32, 33 to form the cutting grooves 521. In this way, when cutting the planned dividing line 52 in the second direction of the device portions 31, 32, 33, the outer peripheral end members 43a, 44a, 45a, 43b, 44b, 45b in the first direction are changed to the second direction. The shape of the device blocks 310, 320, and 330 is maintained by leaving the uncut portions 430a, 440a, 450a, 430b, 440b, and 450b without completely cutting in the direction of.

  Next, as shown in FIG. 6, the division | segmentation scheduled line 51 of a 1st direction is cut. Specifically, the rotating cutting blade 8 is positioned on the extension line of the division line 51 in the first direction, and the lower end of the cutting edge 80 of the cutting blade 8 is the thickness of the protective tape T as shown in FIG. The cutting blade 8 is positioned at a height located in the middle of the vertical direction, and from this state, the cutting blade 8 and the holding table 7 holding the package substrate 1 are moved relative to each other in the first direction, and the dividing line of the device unit 33 is scheduled. The cutting blade 8 is cut into 51. Then, the cutting blade 8 and the package substrate 1 are further moved relative to each other in the first direction, and when the cutting edge 80 of the cutting blade 8 comes out of the device portion 31, the cutting of the scheduled division line 51 is finished. By such cutting, a cutting groove 510 is formed in the planned division line 51.

  When such cutting is performed on all the planned division lines 51 in the first direction, the cutting grooves 510 and 520 are cut vertically and horizontally along all the planned division lines 51 and 52 as shown in FIG. And divided into individual package devices 6. Each package device 6 is held via the protective tape T by the suction force acting on the suction hole 71 shown in FIG. 1, and an outer peripheral end member 43a extending in the first direction at both ends in the second direction. , 44a, 45a, 43b, 44b, 45b exist.

  As described above, in the device part dividing step, with respect to the division planned line 52 in the second direction, the outer peripheral end members 43a, 44a, 45a, 43b, 44b, and 45b in the first direction are not completely cut, but are left uncut. Since 430a, 440a, 450a, 430b, 440b, and 450b remain, the outer peripheral end members 43a, 44a, 45a, 43b, 44b, and 45b in the first direction are not divided.

(5) Protection tape peeling process After implementing a device part division | segmentation process, the three device blocks 310,320,330 shown in FIG. 8 are each conveyed to the device accommodating apparatus 9 shown, for example in FIG. The device housing apparatus 9 includes a peeling stage 90, a dropping table 91, a gripping means 92 for gripping the protective tape T and outer peripheral end materials 43a, 44a, 45a, 43b, 44b, and 45b in the first direction, and a bulk housing. Means 93.

  Each device block 310, 320, 330 is placed on the peeling stage 90 with the protective tape T facing down. Then, for example, the outer peripheral end material 43a in the first direction is gripped by the gripping means 92 together with the protective tape T, and the protective tape T is peeled from the back surfaces of the plurality of package devices 6 while pulling the gripping means 92 obliquely downward. The plurality of package devices 6 peeled off from the protective tape T are transferred to the dropping table 91 and then dropped and accommodated in the bulk accommodating means 93. When such dropping is performed for each of the device units 31, 32 and 33, all the package devices 6 constituting the package substrate 1 are accommodated in the bulk accommodating means 93.

  In the device part dividing step, the outer peripheral end members 43a, 44a, 45a, 43b, 44b, 45b in the first direction are not completely cut, and the uncut parts 430a, 440a, 450a, 430b, 440b, 450b are left. In the protective tape peeling step, the outer peripheral end materials 43a, 44a, 45a, 43b, 44b, 45b in the first direction can be gripped. Accordingly, even when the outer peripheral end members 42a and 42b in the second direction are narrow and cannot be gripped by the grip portion 92, the protective tape T can be peeled off using the device housing device 9.

  In the above example, in the device part dividing step, the uncut portions 430a, 440a, and 450a are left in both the outer peripheral end members 43a, 44a, and 45a in the first direction and the outer peripheral end members 43b, 44b, and 45b in the first direction. , 430b, 440b, and 450b are left, but the outer peripheral end material in one first direction may be completely cut without leaving the uncut portion. For example, as shown in FIG. 10, the uncut portions 430 b, 440 b, and 450 b are left only in the outer peripheral end members 43 b, 44 b, and 45 b in the first direction, and the outer peripheral end members 43 a, 44 a, and 45 a in the first direction are left. It can also cut so that an uncut part may not be left. In this case, in the device part dividing step, as shown in FIG. 11, the rotating cutting blade 8 is extended on the side of the peripheral end members 43 a, 44 a, 45 a in the second direction of the division line 52 in the second direction. The lower end of the cutting edge 80 of the cutting blade 8 is positioned at a height that is located in the middle of the protective tape T in the thickness direction, and from this state, the cutting blade 8 and the holding table 7 holding the package substrate 1 are moved to the first position. The cutting blade 8 is cut into the division line 52 by relative movement in the two directions. Then, the cutting blade 8 and the package substrate 1 are further moved relative to each other in the first direction. When the cutting edge 80 of the cutting blade 8 reaches the outer peripheral end members 43b, 44b, 45b in the first direction, the cutting blade 8 is moved. It raises and the cutting of the division | segmentation scheduled line 52 is complete | finished.

  When the cutting blade 8 is lowered in a direction perpendicular to the surface 1a of the package substrate 1 as in the chopper traverse cut shown in FIGS. 4 and 5, the cutting edge 80 of the cutting blade 8 is increased when the lowering speed is increased. Uneven wear is likely to occur, and the cutting edge 80 is likely to break. On the other hand, when the lowering speed of the cutting blade 8 is slowed, the productivity is lowered. However, as shown in FIG. 11, when cutting so as not to leave uncut portions in the outer peripheral end members 43 a, 44 a, and 45 a in the first direction, the cutting blade 8 is lowered when the cutting is made with respect to the division line 52. Since the cutting edge 80 of the cutting blade 8 moves in the second direction relative to the package substrate 1 from the beginning, uneven wear is unlikely to occur on the cutting edge 80, resulting in a decrease in productivity. Can be prevented.

  As shown in FIG. 10, when the uncut portions 430b, 440b, and 450b are left only in the outer peripheral end members 43b, 44b, and 45b in the first direction, the device housing shown in FIG. In the apparatus 9, if the outer peripheral end members 43b, 44b, 45b in the first direction having the uncut portions 430b, 440b, 450b are gripped by the grip portion 92, the protective tape T can be peeled off.

1: Package substrate 1a: Front side 1b: Back side 21, 22: Intermediate end members 31, 32, 33: Device portions 310, 320, 330: Device block 40: Outer end members 41a, 41b: Outer end members in the first direction 42a, 42b: outer peripheral end members 43a, 44a, 45a, 43b, 44b, 45b in the second direction: outer peripheral end members 430a, 440a, 450a, 430b, 440b, 450b in the first direction: uncut portion 51: first Scheduled division line 510 in one direction: Cutting groove 52: Scheduled division line in the second direction 520: Cutting groove 6: Package device T: Protection tape 7: Holding table 7a: Surface 70: Relief groove 71: Suction hole 8: Cutting blade 80: Cutting edge 9: Device accommodating device 90: Peeling stage 91: Dropping table 92: Holding means 93: Bulk accommodating means

Claims (1)

A device part that is partitioned by a predetermined division line formed in a first direction and a second direction perpendicular to the first direction and has a plurality of package devices formed on the surface, and a device part that surrounds the device part. Two or more device parts connected by an intermediate end material are arranged in the first direction, and the second direction is formed in a rectangular shape composed of one device part. A package substrate dividing method for dividing the package substrate along the planned dividing line,
A protective tape attaching step of attaching a protective tape having a size equivalent to that of the package substrate to the back surface of the package substrate;
A cutting blade formed at a position corresponding to a line to be divided at the boundary between the outer peripheral end member and the intermediate end member and the device portion in the second direction of the package substrate after performing the protective tape attaching step A holding step of sucking and holding the package substrate by bringing the protective tape side into contact with a holding table provided with a suction groove for sucking and holding the device portion via the protective tape through which the cutting blade escapes; and
After carrying out the holding step, a cutting blade is cut into the relief groove along a line to be divided along the boundary between the outer peripheral end member and the intermediate end member in the second direction and the device portion, and the package The substrate and the protective tape are cut and separated into each device portion, and the outer peripheral end material and the intermediate end material in the second direction are removed from the holding table together with the protective tape attached to the back surface. Direction end material removal process,
After carrying out the second direction end material removing step, the cutting blade is cut halfway in the thickness direction of the protective tape to perform cutting along a plurality of division lines of the device portion, Device part dividing step of dividing into package devices;
After performing the device part dividing step, for each device part, the outer peripheral end material in the first direction is gripped by the gripping means together with the protective tape, and the protective tape is peeled off from the back surface side of the plurality of package devices. And a protective tape peeling step for bulk accommodating the plurality of peeled package devices in a bulk accommodating means,
In the device part dividing step, when cutting the line to be divided in the second direction of the device part, the cutting blade is cut while leaving an uncut part on the outer peripheral end material in the first direction. And dividing the package substrate.

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