JP2015020387A5 - - Google Patents
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- Publication number
- JP2015020387A5 JP2015020387A5 JP2013151772A JP2013151772A JP2015020387A5 JP 2015020387 A5 JP2015020387 A5 JP 2015020387A5 JP 2013151772 A JP2013151772 A JP 2013151772A JP 2013151772 A JP2013151772 A JP 2013151772A JP 2015020387 A5 JP2015020387 A5 JP 2015020387A5
- Authority
- JP
- Japan
- Prior art keywords
- mold
- holding pin
- insert
- cavity
- insert component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013151772A JP2015020387A (ja) | 2013-07-22 | 2013-07-22 | インサート部品の封止成形方法およびその金型装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013151772A JP2015020387A (ja) | 2013-07-22 | 2013-07-22 | インサート部品の封止成形方法およびその金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015020387A JP2015020387A (ja) | 2015-02-02 |
| JP2015020387A5 true JP2015020387A5 (enExample) | 2016-03-03 |
Family
ID=52485281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013151772A Pending JP2015020387A (ja) | 2013-07-22 | 2013-07-22 | インサート部品の封止成形方法およびその金型装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015020387A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3046903B1 (fr) * | 2016-01-19 | 2019-08-16 | Valeo Comfort And Driving Assistance | Dispositif electronique etanche et son procede d'obtention |
| JP2017140767A (ja) * | 2016-02-10 | 2017-08-17 | 住友電装株式会社 | インサート成形品の製造方法、および、インサート成形用金型 |
| CN113370460B (zh) * | 2021-06-24 | 2022-12-23 | 莆田市多容光学电子有限公司 | 一种标签二次注塑方法 |
| DE102022120682A1 (de) * | 2022-08-16 | 2024-02-22 | Kyocera Avx Components (Werne) Gmbh | Einbetten einer Leiterplatte in Vergussmasse |
| CN115519732A (zh) * | 2022-09-28 | 2022-12-27 | 广东恩浩内衣实业有限公司 | 一种面料封边工艺、鞋面、制鞋工艺和鞋子 |
| CN119502412B (zh) * | 2025-01-17 | 2025-04-11 | 成都正西智能装备集团股份有限公司 | 一种复合材料传递模塑成型模具及成型方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199320U (enExample) * | 1986-06-10 | 1987-12-18 | ||
| JPH0436897Y2 (enExample) * | 1987-11-16 | 1992-08-31 | ||
| JPH08148516A (ja) * | 1994-11-16 | 1996-06-07 | Toshiba Chem Corp | 樹脂封止型半導体モールド装置 |
| JP3994705B2 (ja) * | 2001-09-13 | 2007-10-24 | 松下電工株式会社 | メモリーカードの製造方法 |
-
2013
- 2013-07-22 JP JP2013151772A patent/JP2015020387A/ja active Pending
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