JP2015017315A - Surface treatment apparatus and manufacturing method of surface-treated substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment apparatus which allows satisfactory flowing process liquid on an object surface to be surface-treated in a substrate, and a manufacturing method of a surface-treated substrate.SOLUTION: An surface treatment apparatus according to the present invention is a surface treatment apparatus which transports a substrate in an in-plane direction and supplies process liquid to the surface to perform a surface treatment. The surface treatment apparatus includes: a treatment tank in which the substrate passes through and a surface treatment is performed to the substrate; and an injection part which is provided inside the treatment tank and injects the process liquid to the surface of the substrate from an injection port. Further, an injection direction of the process liquid in the injection port of the injection part is either parallel to or slant to a plane surface of the substrate.

Description

  The present invention relates to a surface treatment apparatus for performing a surface treatment on a surface of a substrate, and a method for manufacturing a surface-treated substrate obtained by performing a surface treatment on a surface of a substrate. More specifically, the present invention relates to a surface treatment apparatus that performs surface treatment of a substrate by spraying a treatment liquid onto the surface of the substrate and a method for manufacturing the surface treatment substrate.

  Conventionally, a multilayer wiring board is manufactured by laminating a plurality of conductor layers on which a wiring pattern is formed via an insulating layer. In the manufacturing process of the wiring board, various surface treatments such as desmearing, soft etching, and plating are performed on the substrate material in the manufacturing process. The surface treatment of the substrate is performed, for example, by spraying a treatment liquid onto the main surfaces at both ends of the substrate in the stacking direction while the substrate is transported by a plurality of transport roller pairs arranged along the transport path. (Patent Document 1).

JP 2006-32394 A

  However, the above prior art has the following problems. First, in order for the treatment liquid to act appropriately, it is important to cause the treatment liquid to flow well on the target surface of the surface treatment. This is because, in general, in the portion where the treatment liquid stays, the components of the treatment liquid are biased, and the surface treatment speed tends to decrease. In addition, a hole formed by drilling or laser processing or a via formed by plating the hole may be formed on the substrate when the surface treatment is performed. The via is used to connect the wiring patterns of different conductor layers with a plating layer formed on the inner wall surface of the hole.

  In the prior art, the processing liquid is jetted perpendicularly to the main surface of the substrate. For this reason, there is a problem that the flow of the processing liquid along the main surface of the substrate hardly occurs and the processing liquid tends to stay. In addition, the retention of the treatment liquid is particularly likely to occur inside the bottomed hole. For example, when the treatment liquid for performing the plating treatment stays inside the hole, the inner wall surface of the bottomed hole cannot be appropriately plated. In other words, if the processing solution for plating is retained inside the bottomed hole, there is a risk of causing a conduction failure in the completed wiring board.

  Such a problem is also common to other chemical conversion processes performed by spraying a processing liquid such as desmear process or soft etching. That is, for example, the processing liquid stays inside the bottomed hole, and the processing liquid does not act appropriately at that portion, so that there is a possibility that the wiring board may be defective.

  The present invention has been made for the purpose of solving the problems of the prior art described above. That is, the problem is to provide a surface treatment apparatus and a method for producing a surface-treated substrate that can cause the treatment liquid to flow well on the target surface of the substrate.

  The surface treatment apparatus of the present invention, which has been made for the purpose of solving this problem, is a surface treatment apparatus that supplies a treatment liquid to the surface of the substrate while conveying the substrate in the direction of the plate surface, and performs surface treatment. A treatment tank in which the substrate is passed and surface treatment is performed on the substrate inside; and an injection unit that is provided inside the treatment tank and injects the treatment liquid from the injection port onto the surface of the substrate. The surface treatment apparatus is characterized in that the treatment liquid is ejected in a direction parallel to or oblique to the substrate surface of the substrate.

  The spray unit of the surface processing apparatus of the present invention can generate a flow of a processing liquid having a high flow velocity on the plate surface of the substrate by spraying the processing solution obliquely or parallel to the plate surface of the substrate. Therefore, the processing liquid can be favorably flowed on the plate surface that is the target surface of the substrate surface treatment. Furthermore, by generating a flow of the processing liquid having a high flow velocity on the plate surface of the substrate, the processing liquid can be favorably flowed into the bottomed hole and the through hole of the substrate. Since the surface of the substrate can be satisfactorily surface-treated in a short time, the productivity of the substrate can be improved, the surface treatment apparatus can be downsized, and the deterioration of the treatment liquid can be suppressed. Moreover, a high quality wiring board can be manufactured with the surface treatment board | substrate obtained by surface-treating with the surface treatment apparatus.

  Moreover, in the surface treatment apparatus described above, it is preferable that the inclination angle of the treatment liquid ejection direction at the ejection port of the ejection unit with respect to the plate surface of the substrate is in the range of 15 ° to 45 °. This is because the processing liquid can be flowed satisfactorily on the target surface of the substrate surface treatment.

  Further, in the surface treatment apparatus described above, the injection direction of the processing liquid at the injection port of the injection unit is directed from the upstream side to the downstream side in the substrate transport direction when viewed from a direction perpendicular to the plate surface of the substrate. There may be.

  The present invention also relates to a method of manufacturing a surface-treated substrate for carrying out a surface treatment by supplying a treatment liquid to the surface of the substrate while transporting the substrate in the in-plane direction of the substrate. And a method for producing a surface-treated substrate, wherein the treatment liquid is ejected onto the surface of the substrate and the treatment liquid is ejected in a direction parallel to or oblique to the plate surface of the substrate. It extends.

  In the method for manufacturing a surface-treated substrate described above, it is preferable that an inclination angle of the treatment liquid ejection direction at the treatment liquid ejection port with respect to the plate surface of the substrate is in a range of 15 ° to 45 °.

  Further, in the method for manufacturing a surface-treated substrate described above, when the treatment liquid spray direction at the treatment liquid spray port is viewed from a direction perpendicular to the plate surface of the substrate, from the upstream side to the downstream side in the substrate transport direction. It may be the direction to go.

  Further, in the method for manufacturing a surface-treated substrate described above, a substrate having a bottomed hole formed on the surface is subjected to surface treatment, and the surface treatment is performed on the surface inside the bottomed hole of the substrate as a treatment liquid. It is good also as using. This is because, according to the present invention, it is possible to cause the treatment liquid to flow well even inside the bottomed hole of the substrate where the retention of the treatment liquid is likely to occur.

  ADVANTAGE OF THE INVENTION According to this invention, the surface treatment apparatus and the manufacturing method of a surface treatment board | substrate which can make a process liquid flow favorably on the surface of the surface treatment in a board | substrate are provided.

It is a schematic block diagram of the surface treatment apparatus which concerns on embodiment. It is a figure for demonstrating the injection nozzle of the surface treatment apparatus. It is a figure for demonstrating the flow of the plating solution inside a bottomed hole when the plating solution is injected perpendicularly | vertically with respect to the main surface of a board | substrate. It is a figure for demonstrating the flow of the plating solution inside a bottomed hole when the plating solution is injected diagonally with respect to the main surface of a board | substrate. It is a figure for demonstrating the conventional injection nozzle. It is a figure which shows the deposition rate of plating about the injection nozzle of this form, and the conventional injection nozzle.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a schematic configuration diagram of a surface treatment apparatus according to the present embodiment. The surface treatment apparatus 1 according to this embodiment is a plating treatment apparatus including a plating solution 11 inside a treatment tank 10. Further, the surface treatment apparatus 1 performs chemical copper plating on the surface of the substrate 90 with the plating solution 11. As the plating solution 11, those conventionally used for chemical copper plating can be used. The substrate 90 is a laminated substrate in which a plurality of conductor layers on which wiring patterns are formed are laminated with an insulating layer interposed therebetween. In FIG. 1, main surfaces of the substrate 90 which are both ends in the stacking direction are shown as main surfaces 91 and 92. The substrate 90 eventually becomes a wiring board mounted on an electronic device or the like by further forming an upper layer on the main surfaces 91 and 92.

  In addition, a plurality of transport rollers 20 which are roller pairs for transporting the substrate 90 from the left to the right in FIG. 1 along the transport path 80 are disposed inside the processing tank 10. The plurality of transport rollers 20 are arranged along the transport path 80 of the substrate 90 at the facing position of the roller pair. The transport roller 20 transports the substrate 90 by rotating while sandwiching the main surfaces 91 and 92 therebetween. Furthermore, the surface treatment apparatus 1 has a plurality of injection nozzles 30 above and below a conveyance path 80 in the treatment tank 10. The spray nozzle 30 is for spraying the plating solution 11 onto the main surfaces 91 and 92 of the substrate 90 transported through the transport path 80. Therefore, the injection nozzle 30 has an injection port 31 for injecting the plating solution 11 at a location facing the main surfaces 91 and 92 of the substrate 90.

  Moreover, the surface treatment apparatus 1 has the flow path 41 which connects the processing tank 10 and the injection nozzle 30, as shown in FIG. A pump 40 is connected in the middle of the flow path 41. The pump 40 sucks the plating solution 11 from the processing tank 10 into the flow path 41 and sends it out toward the spray nozzle 30. The plating solution 11 is ejected from the ejection port 31 of the ejection nozzle 30 by being sent out to the flow path 41 by the pump 40.

  FIG. 2 is an enlarged view of the injection nozzle 30 that injects the plating solution 11 onto the main surface 91 side of the substrate 90 in the injection nozzle 30 shown in FIG. 1. In FIG. 2, the injection port 31 is shown by a partial cross section of the injection nozzle 30. The ejection port 31 in this embodiment has a slit-like shape that is continuous in the width direction (the depth direction in FIGS. 1 and 2) perpendicular to the transport direction of the substrate 90. Further, the length of the ejection port 31 in the width direction of the substrate 90 is about the same as the length of the substrate 90. Further, in FIG. 2, an injection direction A that is the direction of the flow of the plating solution 11 sprayed from the spray nozzle 30 with the fastest flow velocity is indicated by an arrow. As shown by an arrow A in FIG. 2, the spray nozzle 30 of the present embodiment sprays the plating solution 11 obliquely with respect to the main surface 91 instead of being perpendicular to the main surface 91 of the substrate 90. That is, the injection angle θ, which is the angle between the injection direction A of the plating solution 11 injected from the injection port 31 of the injection nozzle 30 and the main surface 91 of the substrate 90, is an acute angle. Further, the spraying direction A of the plating solution 11 from the spray nozzle 30 is from the upstream side to the downstream side in the transport direction of the substrate 90. In addition, the ejection direction A in the present embodiment is parallel to the transport direction of the substrate 90 when viewed from a direction perpendicular to the main surface 91.

  As shown in FIG. 2, the substrate 90 is formed with a bottomed hole 93 and a through hole 94 that are vacated in the thickness direction everywhere. The bottomed hole 93 and the through hole 94 are formed by, for example, laser processing or drilling. The bottomed hole 93 opens only on the main surface 91 of the substrate 90 and does not penetrate the substrate 90. The through hole 94 passes through the substrate 90 and opens on both the main surface 91 and the main surface 92 thereof. As described above, the substrate 90 is formed by laminating a plurality of conductor layers and insulating layers. Then, both the bottomed hole 93 and the through hole 94 serve as vias for electrically connecting the wiring patterns of different conductor layers on the substrate 90 by forming a plating layer on the inner wall surface or the like thereafter. is there.

  The surface treatment apparatus 1 performs plating treatment on the main surfaces 91 and 92 of the substrate 90, the inner wall surfaces of the bottomed holes 93 and the through holes 94, and the like. And the surface treatment apparatus 1 of this form is uniform on the main surface 91 of the board | substrate 90 because the injection direction A of the plating solution 11 of the injection nozzle 30 inclines with respect to the main surface 91 of the board | substrate 90. Thus, a plating layer having a sufficient thickness can be formed in a short time. Furthermore, a uniform and sufficient plating layer can be formed in a short time on the inner wall surface of the bottomed hole 93 and the through hole 94. Hereinafter, the reason why such an effect can be obtained by the injection nozzle 30 of the present embodiment will be described in detail.

  First, the result of simulating the relationship between the flow of the plating solution 11 on the main surface 91 of the substrate 90 and the flow of the plating solution 11 inside the bottomed hole 93 opened on the main surface 91 will be described. FIG. 3 is a view showing the flow and flow velocity of the plating solution 11 inside the bottomed hole 93 at the injection position when the plating solution 11 is injected perpendicularly to the main surface 91 of the substrate 90. That is, FIG. 3 shows a case where the spray angle θ is 90 ° and the plating solution 11 is sprayed from right above the opening of the bottomed hole 93.

  Then, as shown in FIG. 3, it can be seen that the closer to the bottom surface of the bottomed hole 93, the slower the flow of the plating solution 11, and the plating solution 11 stays. This is because the flow of the plating solution 11 sprayed perpendicularly to the main surface 91 and the flow of the plating solution 11 flowing out from the inside of the bottomed hole 93 collide in the vicinity of the opening. It is thought to be a thing. For this reason, there is a possibility that the inner wall surface and the bottom surface of the bottomed hole 93 in which the plating solution 11 stays are not properly plated. This is because the depositing rate of the plating is lower than that of the surface in contact with the plating solution 11 that is flowing favorably because the components of the remaining plating solution 11 are biased. As shown in FIG. 3, the flow of the plating solution 11 injected perpendicularly to the main surface 91 is good to some extent on the main surface 91 of the substrate 90. That is, the plating solution 11 flows along the main surface 91 of the substrate 90.

  On the other hand, FIG. 4 is a diagram showing the flow and flow velocity of the plating solution 11 inside the bottomed hole 93 at the spraying position when the spraying angle θ of the plating solution 11 with respect to the main surface 91 of the substrate 90 is 45 °. It is. That is, in FIG. 4, the plating solution 11 is sprayed from the upper left of the bottomed hole 93 toward the opening of the bottomed hole 93. Note that the flow velocity and flow rate of the sprayed plating solution 11 are the same as those in FIG. 3 in FIG.

As shown in FIG. 4, the flow of the plating solution 11 sprayed with the spray angle θ being 45 ° is good both on the main surface 91 of the substrate 90 and inside the bottomed hole 93. That is, on the main surface 91 of the substrate 90, the plating solution 11 flows along the main surface 91, and the flow rate is fast. In addition, even in the bottomed hole 93, the flow flowing into the bottomed hole 93 and the flow flowing out from the bottomed hole 93 to the outside do not collide, and the plating solution 11 flows. Furthermore, the flow rate of the plating solution 11 inside the bottomed hole 93 is also fast. Therefore, in FIG. 4, the inner wall surface and the bottom surface of the bottomed hole 93 are appropriately plated with the plating solution 11. That is, the deposition rate of plating on the inner wall surface and the bottom surface of the bottomed hole 93 is fast, and the thickness of the formed plating layer is uniform. Therefore, as shown in FIGS. 3 and 4, in order to cause the plating solution 11 to flow inside the bottomed hole 93 of the substrate 90 and to perform appropriate plating on the inner wall surface or the like, the substrate 90 in which the bottomed hole 93 opens is shown. It can be seen that it is important to generate a flow of the plating solution 11 along the main surface 91. Further, even when the spray angle θ was set to 0 ° and the plating solution 11 was sprayed in parallel to the main surface 91 of the substrate 90, the same results as in FIG. 4 were obtained. This is considered to be because the plating solution 11 sprayed in parallel to the main surface 91 of the substrate 90 diffuses into the bottomed hole 93 and the like.

  Next, the result of measuring the flow rate of the plating solution 11 sprayed by the spray nozzle 30 of this embodiment and the conventional spray nozzle will be described. FIG. 5 shows a conventional injection nozzle 130. The conventional injection nozzle 130 has a direction indicated by an arrow D in FIG. 5 as a main injection direction. That is, it has an injection port 131 for injecting the plating solution 11 vertically toward the main surface 91 of the substrate 90. Then, when the plating solution 11 is sprayed from the spray nozzle 130, a flow indicated by an arrow E in FIG. 5 and a flow indicated by an arrow F are generated along the main surface 91 of the substrate 90.

  In the conveyance direction of the substrate 90, the flow E is a flow toward the downstream side, and the flow F is a flow toward the upstream side. Therefore, the flow shown in FIG. 4 is generated in the bottomed hole 93 of the substrate 90 at that position by the flow E and the flow F of the plating solution 11 generated by the conventional spray nozzle 130. Due to the flow, a plating layer is formed on the inner wall surface of the bottomed hole 93 and the like. As described with reference to FIG. 3, the flow of the plating solution 11 inside the bottomed hole 93 is not good in the vicinity of just below the injection port 131 of the injection nozzle 130. Moreover, as a result of measuring the flow velocity of the flow E and the flow F by the injection nozzle 130, both were 10% or less of the flow velocity at the outlet of the injection port 131 of the injection nozzle 130.

  On the other hand, in the spray nozzle 30 of the present embodiment shown in FIG. 2, the plating solution 11 is sprayed in the direction of arrow A, so that both are upstream along the main surface 91 of the substrate 90 in the transport direction of the substrate 90. Flows B and C are generated in the direction from the downstream side to the downstream side. The flow B is a flow generated when the plating solution 11 sprayed in the direction A by the spray nozzle 30 flows along the main surface 91 of the substrate 90. The flow C is due to the negative pressure generated in the gap between the injection nozzle 30 and the main surface 91 of the substrate 90 because the plating solution 11 injected in the direction A by the injection nozzle 30 flows in the direction B. It is. Therefore, the flow shown in FIG. 4 is generated inside the bottomed hole 93 of the substrate 90 by the flow B and the flow C of the plating solution 11 generated by the spray nozzle 30 of this embodiment. Due to the flow, a plating layer is formed on the inner wall surface of the bottomed hole 93 and the like.

  Furthermore, as a result of measuring the flow velocity of the flow C related to the injection nozzle 30 of the present embodiment when the injection angle θ is 30 °, it was about 20% of the flow velocity at the outlet of the injection nozzle 31 of the injection nozzle 30. Further, the flow rate of the flow B was 30% or more of the flow rate at the outlet of the injection port 31 of the injection nozzle 30. That is, the spray nozzle 30 according to the present embodiment has a higher flow velocity along the main surface 91 of the substrate 90 on both the upstream side and the downstream side in the transport direction of the substrate 90 than the conventional spray nozzle 30. Eleven flows can be generated. Furthermore, in the spray nozzle 30 of the present embodiment, the flow rate of the plating solution 11 on the main surface 91 of the substrate 90 is fast, so the flow of the plating solution 11 along the main surface 91 of the substrate 90 is generated in a wider range. be able to.

  Next, FIG. 6 shows the results of measurement of the deposition rate of plating by the injection nozzle 30 of this embodiment and the conventional injection nozzle 130. In FIG. 6, the horizontal axis indicates the position of the substrate 90 on the transport path, and the arrangement positions of the injection nozzle 30 of this embodiment and the conventional injection nozzle 130 are indicated by a one-dot chain line in the drawing. Further, FIG. 6 shows that the spraying solution 11 is sprayed toward the main surface 91 of the substrate 90 transported through the transport path while the spray nozzles 30 and 130 are both arranged on the transport path of the substrate 90 at equal intervals. It is a thing when. In FIG. 6, the deposition rate of the plating by the spray nozzle 30 of this embodiment is indicated by a solid line, and the deposition rate of the plating by the conventional spray nozzle 130 is indicated by a broken line. Further, FIG. 6 shows the plating deposition rate on the main surface 91 of the substrate 90 and the plating deposition rate on the bottom surface of the bottomed hole 93.

  As shown in FIG. 6, the deposition rate of plating at a position close to the spray position of the conventional spray nozzle 130 is fast. This is because the plating solution 11 does not stay at a position close to the spray nozzle 130 and the components are not biased. However, as the distance from the spray nozzle 130 increases, the deposition rate of the plating greatly decreases. In particular, the bottom surface of the bottomed hole 93 is substantially deposited in the section between the spray nozzles 130 indicated by X in FIG. I understand that there is no.

  As described above, the flow rates E and F of the plating solution 11 along the main surface 91 of the substrate 90 generated by the spray nozzle 130 are slow. For this reason, it is considered that the plating solution 11 hardly flows on the main surface 91 of the substrate 90 at a position far from the spray nozzle 130. Thereby, it is considered that the deposition rate of the plating on the main surface 91 at a position far from the injection nozzle 130 is greatly reduced. Further, in the section X far from the spray nozzle 130, the plating solution 11 does not flow on the main surface 91, so that the plating solution 11 does not flow into the bottomed hole 93. That is, in the section X, it is considered that the plating solution 11 does not flow as described with reference to FIG.

  On the other hand, in this embodiment, a peak of the deposition rate of plating appears at a position slightly downstream of the injection nozzle 30. This is because the spray nozzle 30 of the present embodiment sprays the plating solution 11 toward the downstream side in the transport direction of the substrate 90. It can be seen that the deposition rate of the plating is faster than that of the conventional injection nozzle 130 in both the main surface 91 and the bottom surface of the bottomed hole 93 in the section between the injection nozzles 30.

  As described above, the flows B and C of the plating solution 11 along the main surface 91 of the substrate 90 generated by the spray nozzle 30 of this embodiment are fast. For this reason, it is considered that the plating solution 11 flows on the main surface 91 of the substrate 90 even at a position far from the injection nozzle 30. Furthermore, the plating solution 11 flows into the bottomed hole 93 as shown in FIG. 4 and the plating solution 11 flows inside the bottomed hole 93 as shown in FIG. It is thought that. Therefore, from FIG. 6, the spray nozzle 30 of this embodiment can form a uniform and sufficient thickness plating layer on the main surface 91 of the substrate 90 and the inner wall surface and bottom surface of the bottomed hole 93 in a short time. Recognize.

In the above description, the bottomed hole 93 of the substrate 90 is described, but the same applies to the through hole 94. That is, a uniform and sufficiently thick plating layer can be formed on the inner wall surface of the through-hole 94 of the substrate 90 by the spray nozzle 30 of this embodiment in a shorter time than the conventional spray nozzle 130. This is because the plating solution 11 can flow well into the through hole 94 by generating a flow of the plating solution 11 having a high flow velocity along the main surface 91 of the substrate 90 by the spray nozzle 30 of this embodiment. . In the above description, the upper main surface 91 of the substrate 90 in the surface treatment apparatus 1 has been described, but the same applies to the lower main surface 92. That is, the plating solution 11 is sprayed obliquely with respect to the main surface 92 also on the spray nozzle 30 below the substrate 90 in FIG. In addition, the plating solution 11 is also ejected from the lower spray nozzle 30 of the substrate 90 in the downstream direction in the transport direction of the substrate 90. Therefore, a fast flow along the main surface 92 can be generated also on the lower side of the substrate 90. Therefore, a uniform and sufficient thickness of the plating layer can be formed in a short time on the main surface 92 and the bottomed hole 93 opening in the main surface 92 and the inner wall surface of the through hole 94. Further, the spray nozzle 30 may spray the plating solution 11 in parallel with the main surface 91 of the substrate 90. That is, the injection angle θ between the injection direction A of the plating solution 11 injected from the injection nozzle 30 shown in FIG. 2 and the main surface 91 of the substrate 90 may be 0 °. This is because a flow having a high flow velocity along the main surface 91 of the substrate 90 can also be generated by spraying the plating solution 11 in parallel to the main surface 91 of the substrate 90.

  Furthermore, the present inventors have confirmed the thickness of the plating layer formed on the substrate in a plurality of examples in which the conditions such as the injection angle θ in the injection nozzle according to this embodiment are different from each other. The conditions for each example are shown in Table 1 below. Further, the comparative example shown in Table 1 is based on an injection nozzle that injects a plating solution perpendicular to the main surface of the substrate described in FIG. In addition, for each of the examples and comparative examples, the conditions such as the number of spray nozzles to be arranged, the interval on the transport path, the flow rate and flow rate of the plating solution sprayed from the spray nozzle, and the transport speed of the substrate in the processing tank are the same It was. In the embodiment, as the transport roller, the main surface of the substrate is sandwiched and transported near the end in the width direction. On the other hand, in the comparative example, a transport roller that transports the main surface of the substrate while sandwiching it uniformly in the width direction is used.

  Table 1 shows the injection angle θ between the spraying direction of the plating solution and the main surface of the substrate, and the distance between the injection nozzle and the main surface of the substrate as conditions relating to the injection nozzle. Moreover, the thickness of the plating layer shown in Table 1 is expressed by the ratio to the thickness of the plating layer formed in the comparative example for both the main surface of the substrate and the bottom surface of the bottomed hole.

  As shown in Table 1, the thickness of the plating layer formed on the substrate in the example was thicker than that of the comparative example on both the main surface and the bottom surface of the bottomed hole. Further, in the example, it can be seen that a thicker plating layer is formed on the bottom surface of the bottomed hole than on the main surface as compared with the comparative example. Further, as shown in Table 1, it can be seen that the smaller the spray angle θ, the thicker the plating layer that is formed. In particular, it can be seen that a thick plating layer is formed on the bottom surface of the bottomed hole when the injection angle θ is 45 ° or less in the examples.

  Therefore, it can be seen that by using the spray nozzle according to the present embodiment, the plating solution can be favorably flowed into the main surface of the substrate and the inside of the bottomed hole. Furthermore, it can be seen that the flow of the plating solution inside the main surface and the bottomed hole is improved by making the spray angle θ 45 ° or less. This is considered to be because the flow rate of the plating solution on the main surface of the substrate can be increased by setting the spraying direction of the plating solution by the spray nozzle to an angle that is more parallel to the main surface of the substrate. It is done. That is, it is considered that the flow of the plating solution having a high flow velocity on the main surface of the substrate can be generated in a wide range. This is also considered to be because the plating solution can flow at a higher flow rate even inside the bottomed hole.

  Therefore, by using the spray nozzle according to this embodiment, it is possible to obtain a surface-treated substrate in which a plating layer having a required thickness is formed on the surface of the substrate in a short time compared to the conventional spray nozzle. That is, it is possible to improve the productivity while reducing the defect occurrence rate by ensuring the conduction in the wiring board manufactured using the surface-treated substrate. Further, since the deposition rate of plating is fast, the total length of the surface treatment apparatus in the substrate transport direction can be shorter than the conventional one. Conventionally, it has been necessary to increase the temperature of the plating solution and the concentration of copper ions in order to increase the deposition rate. However, increasing the temperature of the plating solution and the concentration of copper ions accelerates the deterioration of the plating solution and shortens the service life. On the other hand, in this embodiment, since the deposition rate of plating can be increased by spraying the plating solution, deterioration of the plating solution is not accelerated, and the life of the plating solution can be extended.

  As described above, in order to generate a flow having a high flow velocity along the main surface 91 of the substrate 90, it is preferable that the injection angle θ is small. However, it is not easy to provide an injection nozzle having an injection angle θ close to 0 ° so as not to contact the substrate 90. Therefore, the injection angle θ is preferably 15 ° or more even if it is small.

  As described above in detail, the surface treatment apparatus 1 according to the present embodiment has the spray nozzle 30 for spraying the plating solution 11 on the main surfaces 91 and 92 of the substrate 90 in the processing tank 10. . The spray nozzle 30 sprays the plating solution 11 obliquely with respect to the main surfaces 91 and 92 of the substrate 90. Thereby, a flow of the plating solution 11 having a high flow velocity is generated on the main surfaces 91 and 92 of the substrate 90. In addition, the plating solution 11 can be flowed favorably into the inside of the bottomed hole 93 formed in the substrate 90 by the flow of the plating solution 11. That is, a surface treatment apparatus and a surface treatment substrate manufacturing method capable of causing the plating solution 11 to flow satisfactorily on the target surface of the substrate 90 are realized.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the plating solution 11 is not limited to copper plating, and may be a plating solution that performs other plating such as nickel plating. Further, the surface treatment apparatus 1 is not limited to plating, and may perform other chemical conversion treatment such as desmear treatment or soft etching.

  In the above-described embodiment, the ejection direction A when viewed from the direction perpendicular to the main surface 91 is described as being parallel to the transport direction of the substrate 90, but is oblique with respect to the transport direction of the substrate 90. There may be. Further, for example, the spray nozzle 30 may spray the plating solution 11 from the downstream side in the transport direction of the substrate 90 toward the upstream side. Further, for example, in the present embodiment, the injection port 31 of the injection nozzle 30 has been described as a slit-like one formed continuously in the width direction of the substrate 90. However, the width of the substrate 90 is reduced by one or more partitions. It may be divided in the direction. Further, for example, the number of injection ports 31 of the injection nozzle 30 is not limited to two, and may be one or three or more.

DESCRIPTION OF SYMBOLS 1 Surface treatment apparatus 10 Treatment tank 11 Plating solution 30 Injection nozzle 31 Injection port 90 Substrate 91,92 Main surface 93 Bottomed hole

Claims (7)

In a surface treatment apparatus for carrying out surface treatment by supplying a treatment liquid to the surface of a substrate while conveying the substrate in the in-plane direction,
A treatment tank in which the substrate is passed and the surface treatment is performed on the substrate;
An injection unit that is provided inside the processing tank and that injects a processing liquid from an injection port onto the surface of the substrate;
The surface treatment apparatus according to claim 1, wherein the treatment liquid is ejected in parallel or obliquely to the substrate surface of the substrate at an ejection port of the ejection unit. The surface treatment apparatus according to claim 1,
The surface treatment apparatus according to claim 1, wherein an inclination angle of the treatment liquid in the injection direction of the injection unit with respect to the plate surface of the substrate is in a range of 15 ° to 45 °. In the surface treatment apparatus according to claim 1 or 2,
The surface treatment apparatus characterized in that the spray direction of the treatment liquid at the spray port of the spray unit is a direction from the upstream side to the downstream side in the substrate transport direction when viewed from a direction perpendicular to the plate surface of the substrate. . In the method of manufacturing a surface-treated substrate, the substrate is transported in the in-plane direction while a surface treatment is performed by supplying a treatment liquid to the surface.
While spraying the processing liquid onto the surface of the substrate while passing the substrate through the inside of the processing tank,
A method for producing a surface-treated substrate, characterized in that a treatment liquid spray direction at a treatment liquid ejection port is parallel or oblique to a plate surface of the substrate. In the manufacturing method of the surface treatment board | substrate of Claim 4,
A method of manufacturing a surface-treated substrate, wherein an inclination angle of a treatment liquid spray direction at a treatment liquid spray port with respect to a plate surface of the substrate is within a range of 15 ° to 45 °. In the manufacturing method of the surface treatment board | substrate of Claim 4 or Claim 5,
The surface treatment substrate is characterized in that the treatment liquid ejection direction at the treatment liquid ejection port is directed from the upstream side to the downstream side in the substrate transport direction when viewed from a direction perpendicular to the plate surface of the substrate. Production method. In the manufacturing method of the surface treatment board | substrate in any one of Claims 4-6,
A substrate with a bottomed hole formed on the surface is the target of surface treatment.
What is claimed is: 1. A method for producing a surface-treated substrate, comprising using as a treatment liquid a surface treatment on a surface inside a bottomed hole of a substrate.

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