JP2015011980A - Insulated wire, electronic part and production methods for the wire and part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulated wire which is easily and reliably connectable to a terminal of an electronic part, an electronic part connected with the insulated wire and their production methods.SOLUTION: An insulation substrate includes a conductive paste-made linear conductor and an insulator covering the outer peripheral surface of the conductor, and the insulator has a long sheet-like insulation base laminated with the conductor on the surface and an insulation film which covers the surface of the conductor and surfaces of the insulation base other than the conductor laminated part. The main ingredients of the insulation base and the insulation film are preferably the same resin. There is preferably provided a release member laminated in a peelable way on the back-surface side of the insulation base. A plurality of the insulators and a plurality of the conductors are preferably provided on the front-surface side of the peelable member.

Description

  The present invention relates to an insulated wire, an electronic component, and a manufacturing method thereof.

  In general, connection by an insulated wire is used as means for electrically connecting terminals of electronic components such as a wiring board. This insulated wire is obtained by coating a conductive conductor with an insulator. When connecting to a terminal of an electronic component, for example, as disclosed in Japanese Patent Application Laid-Open No. 09-180787, first, at the end of the insulated wire. Strip the insulator to expose the conductor, then position the exposed conductor so that the tip of the conductor overlaps the terminal, and then fix the conductor and terminal with adhesive or solder, etc. Is connected.

JP 09-180787 A

  Since the above-described conventional connection method using an insulated wire requires a conductor exposure step, a positioning step, and a conductor fixing step, when connecting a plurality of terminals and insulated wires, the labor of processing may be significantly increased. There is. Further, when the position of the insulated wire is shifted or when the conductor is not sufficiently fixed, connection failure may be caused.

  The present invention has been made in view of the above disadvantages, and provides an insulated wire that can be easily and reliably connected to a terminal of an electronic component, an electronic component to which the insulated wire is connected, and a method of manufacturing the same. The purpose is to do.

The invention made to solve the above problems is
A linear conductor made of conductive paste, and an insulator covering the outer peripheral surface of the conductor,
The insulator is
A long sheet-like insulating base on which the conductor is laminated on the surface;
An insulated wire having an insulating film covering the surface of the conductor and the surface of the insulating base other than the conductor laminated portion.

  In the insulated wire, since the conductor is formed of a conductive paste, the conductive paste is laminated by printing or the like in a state where the terminal of the electronic component that connects the insulated wire and the insulating base are brought close to each other. Thus, a continuous conductor from the insulating base to the terminal can be formed. That is, according to the insulated wire, the conductor can be easily and reliably connected to the terminal of the electronic component simultaneously with the formation of the insulated wire.

  The main components of the insulating base and the insulating coating are preferably the same resin. Thus, by forming the insulating base and the insulating film from the same resin, the adhesion between the insulating base and the insulating film can be improved, and the manufacturing efficiency of the insulated wire is improved. Can be made.

  It is preferable to further include a release member that is detachably stacked on the back side of the insulating base. In this way, by laminating the insulating base on the surface side of the release member and peeling the release member at the time of use, the insulating base and the conductor and insulating film laminated on the surface can be easily and reliably obtained. It can form, and the manufacturability of the insulated wire can be further improved.

  A plurality of the insulators and conductors may be provided on the surface side of the release member. By forming a plurality of insulators and conductors on the release member in this manner, the conductors of the plurality of insulated wires formed by means such as printing are easily and reliably connected to the plurality of terminals of the electronic component. be able to.

Moreover, another invention made in order to solve the said subject is:
The insulated wire; and
And a terminal to which a conductor of the insulated wire is connected.

  The said electronic component can form the insulated wire by which the conductor was connected to the terminal easily and reliably by laminating | stacking electrically conductive paste on a terminal at the time of the conductor formation of an insulated wire. Therefore, the electronic component has excellent productivity and reliability.

Further, another invention made to solve the above problems is as follows:
Forming a long sheet-like insulating base having insulating properties on the surface of the release member; and
Forming a linear conductor made of a conductive paste by printing on the surface of the insulating base; and
And a step of forming an insulating coating covering the surface of the conductor other than the conductor laminated portion of the insulating base.

  In the method for manufacturing the insulated wire, a conductive paste is printed on the insulating base to form a conductor, so that the terminal of the electronic component to which the insulated wire is connected and the insulating base are brought close to each other By printing the conductive paste, it is possible to easily and reliably connect the conductor to the terminal of the electronic component simultaneously with the formation of the insulated wire.

Further, another invention made to solve the above problems is as follows:
A method of manufacturing an electronic component comprising a terminal to which an insulated wire is connected,
Forming a long sheet-like insulating base having insulating properties on the surface of the release member; and
Forming a linear conductor made of a conductive paste by printing on the surface of the insulating base and the terminal in a state where the insulating base and the terminal are close to each other;
A step of forming an insulating coating covering the surface of the conductor other than the conductor laminated portion of the insulating base; and
And a step of peeling the insulating base from the release member.

  The electronic component manufacturing method can easily and reliably manufacture an electronic component in which an insulated wire is electrically connected to a terminal.

  The insulated wire can be easily and reliably electrically connected to the terminals of the electronic component, and the processing cost can be reduced and the reliability can be improved.

FIG. 1 is a schematic perspective view showing an insulated wire according to an embodiment of the present invention partially cut along a plane perpendicular to the longitudinal direction. FIG. 2 is a schematic cross-sectional view (the cut surface is a surface perpendicular to the longitudinal direction) for explaining the method of manufacturing the insulated wire of FIG. FIG. 3 is a schematic plan view showing an electronic component according to an embodiment of the present invention. FIG. 4 is a schematic plan view for explaining a method of manufacturing the electronic component of FIG. FIG. 5 is a schematic plan view (a) showing an electronic component of an embodiment different from the electronic component of FIG. 3 and a schematic cross-sectional view (b) along the line AA.

  Hereinafter, embodiments of an insulated wire and an electronic component according to the present invention will be described in detail with reference to the drawings.

[Insulated wire]
The insulated wire 1 in FIG. 1 can be peeled off on the linear conductor 2 made of conductive paste, the insulator 3 covering the outer peripheral surface of the conductor 2, and the back side of the insulator 3 (the side opposite to the conductor 2). And a release member 6 to be laminated. A plurality of the conductors 2 and the insulators 3 are provided on the surface side of the release member 6. The insulator 3 has a long sheet-like insulating base 4 on which the conductor 2 is laminated on the center surface in the width direction, the surface of the conductor 2 and the surfaces on both sides of the insulating base 4 in the width direction, That is, it has the insulating film 5 which coat | covers surfaces other than a conductor lamination | stacking part.

<Conductor>
The conductor 2 is a linear body formed by laminating a conductive paste on the surface in the center in the width direction of the insulating base 4 of the insulator 3 to be described later.

  The average width of the cross-sectional shape in the longitudinal direction and the vertical plane of the conductor 2 (average length in the direction parallel to the surface of the insulating base 4) is not particularly limited, and can be, for example, 20 μm or more and 500 μm or less. Moreover, it does not specifically limit as average height (average length of a perpendicular | vertical direction with the surface of the insulating base 4) of the said cross-sectional shape, For example, it can be 10 micrometers or more and 50 micrometers or less.

  As the conductive paste for forming the conductor 2, a paste in which conductive particles such as metal particles are dispersed in a binder can be used.

  Examples of the metal particles include silver, platinum, gold, copper, nickel, palladium, and solder. Among these, silver powder and silver-coated copper powder exhibiting excellent conductivity are preferable.

  The upper limit of the average particle diameter of the metal particles is preferably 40 μm. When the average particle diameter of the metal particles exceeds the above upper limit, the adhesion between the metal particles and the binder may be reduced, and the resistance of the conductor 2 may be increased. On the other hand, the lower limit of the average particle diameter of the metal particles is preferably 1 μm. When the average particle diameter of the metal particles is less than the above lower limit, the contact area between the metal particles may be reduced, and the resistance of the conductor 2 may be increased.

  As a minimum of the content rate of the electroconductive particle of the electroconductive paste which forms the conductor 2, 40 volume% is preferable and 50 volume% is more preferable. When the content rate of electroconductive particle is less than the said minimum, there exists a possibility that the electroconductivity of the said insulated wire 1 may fall. On the other hand, as an upper limit of the content rate of the electroconductive particle of the electroconductive paste which forms the conductor 2, 75 volume% is preferable and 70 volume% is more preferable. When the content rate of the electroconductive particle of an electroconductive paste exceeds the said upper limit, the fluidity | liquidity of an electroconductive paste falls and there exists a possibility that formation of the conductor 2 may become difficult.

  Examples of the binder include an epoxy resin, a phenol resin, a polyester resin, a polyurethane resin, an acrylic resin, a melamine resin, a polyimide resin, a polyamideimide resin, and the like, and one or more of these are used. Can do. Among these, a thermosetting resin that can improve the heat resistance of the conductive paste is preferable, and an epoxy resin is particularly preferable.

  Examples of the epoxy resin used in the conductive paste include bisphenol A type, F type, S type, AD type, copolymer type of bisphenol A type and bisphenol F type, naphthalene type, novolac type, biphenyl type, dicyclopentadiene type. And phenoxy resin which is a polymer epoxy resin.

  The binder can be used by dissolving in a solvent. Examples of the solvent include ester-based, ether-based, ketone-based, ether-ester-based, alcohol-based, hydrocarbon-based, and amine-based organic solvents, and one or more of these are used. be able to. In particular, since the conductor 2 is formed by printing a conductive paste, it is preferable to use a high boiling point solvent excellent in printability, and specifically, carbitol acetate, butyl carbitol acetate, or the like is preferably used.

  Furthermore, a curing agent can be added to the binder. Examples of the curing agent include amine curing agents, polyaminoamide curing agents, acid and acid anhydride curing agents, basic active hydrogen compounds, tertiary aminos, and imidazoles.

  In addition to the components described above, auxiliary agents such as thickeners and leveling agents can be added to the conductive paste. Moreover, an electrically conductive paste can be obtained by mixing said each component, for example with a three roll, a rotary stirring deaerator, etc.

  The cross-sectional shape of the conductor 2 is not particularly limited, and may be a semi-elliptical shape, a square shape, a trapezoidal shape, a triangular shape, or the like other than the semicircle shown in FIGS.

<Insulator>
The insulator 3 includes a long sheet-like insulating base 4 on which the conductor 2 is laminated on the center surface in the width direction as described above, and both the surface of the conductor 2 and both sides of the insulating base 4 in the width direction. And an insulating film 5 covering the surface of the film.

  The lower limit of the average thickness of the insulating base 4 is preferably 10 μm, and more preferably 15 μm. If the average thickness of the insulating base 4 is less than the above lower limit, sufficient insulation may not be obtained, and handling of the insulated wire 1 may be difficult. On the other hand, the upper limit of the average thickness of the insulating base 4 is preferably 40 μm, and more preferably 30 μm. When the average thickness of the insulating base 4 exceeds the upper limit, the diameter (thickness) of the insulated wire 1 may be increased more than necessary.

  The average width of the insulating base 4 is not particularly limited as long as it is larger than the width of the conductor 2, and can be, for example, 30 μm or more and 450 μm or less. The lower limit of the average distance w from the side edge of the conductor 2 to the side edge of the insulating base 4 (the difference between the average width of the insulating base 4 and the average width of the conductor 2 divided by 2) Is preferably 15 μm, more preferably 20 μm. When the average distance w from the side end of the conductor 2 to the side end of the insulating base 4 is less than the lower limit, the conductor 2 is likely to be exposed and insulation may not be sufficiently obtained. On the other hand, the upper limit of the average distance w from the side end of the conductor 2 to the side end of the insulating base 4 is preferably 200 μm, and more preferably 150 μm. When the average distance w from the side end portion of the conductor 2 to the side end portion of the insulating base 4 exceeds the upper limit, the diameter of the insulated wire 1 may be increased more than necessary.

  The material for forming the insulating base 4 is not particularly limited as long as it has insulating properties, and for example, a resin such as polyimide or polyethylene terephthalate can be used.

  The insulating coating 5 includes a surface of the conductor 2 laminated on the surface of the insulating base 4, and a region other than the laminated portion of the conductor 2 on the surface of the insulating base 4, that is, surfaces on both sides in the width direction. It is covered. The insulating film 5 may cover the side surface of the insulating base 4.

  As a minimum of average thickness of insulating film 5, 15 micrometers is preferred and 20 micrometers is more preferred. When the average thickness of the insulating coating 5 is less than the above lower limit, sufficient insulation may not be obtained, and handling of the insulated wire 1 may be difficult. On the other hand, the upper limit of the average thickness of the insulating coating 5 is preferably 200 μm, and more preferably 150 μm. When the average thickness of the insulating coating 5 exceeds the upper limit, the diameter (thickness) of the insulated wire 1 may be increased more than necessary.

  As a material for forming the insulating coating 5, the same material as the insulating base 4 can be used. In particular, by forming the insulating base 4 and the insulating coating 5 from the same resin, the adhesion between the insulating base 4 and the insulating coating 5 can be improved, so the quality of the insulated wire 1 is improved. Can be made. Furthermore, by making the insulating base 4 and the resin for forming the insulating coating 5 the same, it is possible to improve the manufacturability of the insulated wire 1 by sharing manufacturing equipment and the like.

  The average interval between the plurality of insulators 3 is not particularly limited, and can be, for example, 0 μm or more and 500 μm or less. Even if the insulator 3 has an average interval of 0 μm, that is, the insulators 3 are in contact with each other, the separation member 6 can be separated and then separated to function as an independent insulated wire.

  Further, the plurality of insulators 3 and the conductors 2 do not have to be formed in a straight line shape in plan view, and may be formed in a curved line shape (meandering shape). Furthermore, the multiple insulators 3 and the conductors 2 do not have to be juxtaposed in parallel, and may be arranged in a radial pattern.

  The upper limit of the number of exposed conductors in the flexibility test of the insulator 3 and the conductor 2 of the insulated wire is preferably 20, and more preferably 10. When the number of exposed conductors exceeds the above upper limit, the use of the insulated wire may be limited because the flexibility of the insulated wire is not sufficient. The flexibility test is a test in which the insulator 3 and the conductor 2 are wound 30 times along a round bar without stretching in accordance with JIS-C3216-3 (2011).

<Peeling member>
The release member 6 is a member that is peeled off from the insulating base 4 when the insulated wire 1 is used. The release member 6 is not particularly limited as long as the release member 6 can be laminated on the insulator 3 so as to be peelable. However, a sheet-like member is preferably used from the viewpoint of handleability and cost. Examples of the material of the release member 6 include polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyethylene terephthalate and other synthetic resin films, rubber sheets, paper, cloth, non-woven fabric, net, foam An appropriately shaped member made of a sheet, a metal foil, a laminate of these, or the like can be used. Moreover, in order to improve the peelability, it is preferable that the surface of the release member 6 is subjected to a peeling treatment such as a silicone treatment, a long-chain alkyl treatment, or a fluorine treatment as necessary. The peelability of the release member 6 can be controlled by adjusting the type and / or coating amount of the drug used for the peeling process.

<Insulated wire manufacturing method>
Next, a method for manufacturing the insulated wire 1 will be described with reference to FIG. The manufacturing method of the said insulated wire has the following processes.
(1) Step of forming an insulating base 4 in the form of a long sheet having insulation on the surface of the release member 6 (2) A line made of a conductive paste by printing on the center surface in the width direction of the insulating base 4 (3) The process of forming the insulating film 5 which coat | covers the said conductor 2 surface and the width direction both-sides surface of the said insulating base 4

<(1) Insulating base forming process>
In the insulating base forming step, a long sheet-like insulating base 4 is formed on the surface of the release member 6 as shown in FIG. As a method of forming the insulating base 4, for example, a method of printing or coating the forming material of the insulating base 4 on the surface of the release member 6 in a long shape can be used. The printing method is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used. Moreover, it does not specifically limit as said coating method, For example, knife coating, die coating, roll coating, etc. can be used. However, it is preferable to form the insulating base 4 by printing from the viewpoint of facilitating manufacture.

<(2) Conductor formation process>
In the conductor forming step, as shown in FIG. 2B, the conductor 2 is formed by printing a conductive paste on the surface in the center in the width direction of the insulating base 4. The method for printing this conductive paste is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, ink jet printing, dispenser printing, and the like can be used.

<(3) Insulating film forming step>
In the insulating film forming step, as shown in FIG. 2C, an insulating film 5 is formed to cover the surface of the conductor 2 and the surfaces on both sides in the width direction of the insulating base 4. As a method for forming the insulating coating 5, a method similar to the method for forming the insulating base 4 can be used. From the viewpoint of facilitating manufacturing, it is preferable to form the insulating coating 5 by printing.

<Advantages>
In the insulated wire 1, since the conductor 2 is formed of a conductive paste, the conductive paste is printed or the like in a state where the terminal of the electronic component that connects the insulated wire 1 and the insulating base 4 are brought close to each other. By laminating, the continuous conductor 2 from the insulating base 4 to the terminal can be formed. That is, according to the insulated wire 1, the conductor 2 can be easily and reliably connected to the terminal of the electronic component simultaneously with the formation of the insulated wire.

  Moreover, since the said insulated wire 1 has laminated | stacked the insulating base 4 on the surface side of the release member 6, the insulating base 4 and the conductor 2 and the insulating film 5 laminated | stacked on the surface are easy. It can be formed reliably and has excellent productivity. Furthermore, since the insulated wire 1 includes a plurality of insulators 3 and conductors 2, an insulated wire connected to a plurality of terminals of an electronic component can be easily and reliably formed.

[Electronic parts]
3 includes the insulated wire 1 including a plurality of insulators 3 and conductors 2, and a plurality of terminals 12 to which the conductors 2 of the insulated wire 1 are connected one by one. The terminal 12 is formed on the surface of an insulating substrate 11 such as polyimide, and for example, a conductive pattern made of metal such as copper can be used.

  The plurality of conductors 2 of the insulated wire 1 are exposed without being covered with the insulator 3 at the end portions on the side connected to the terminals 12, are directly laminated on the surface of the terminals 12, and are electrically connected to the terminals 12. Connected. Further, on the surface of the insulating substrate 11, the conductor 2 is also laminated in a region between the terminal 12 and the end portion of the insulating substrate 11, and in the region between the end portions, the surface of the insulating substrate 11 and the conductor 2 is stacked. An insulating film 5 is formed. Outside the insulating substrate 11, the conductor 2 is laminated on the insulating base 4, and the insulating coating 5 is formed on the surface thereof.

<Method for manufacturing electronic parts>
Next, a method for manufacturing the electronic component 10 will be described with reference to FIG. The method for manufacturing the electronic component includes the following steps.
(1) Step of forming a long sheet-like insulating base 4 having insulation on the surface of the release member 6 (2) Insulating base in a state where the insulating base 4 and the terminal 12 are brought close to each other Step of forming a linear conductor 2 made of a conductive paste by printing on the center in the width direction of 4 and the surface of the terminal 12 (3) Insulation covering both the surface of the conductor 2 and the both sides in the width direction of the insulating base 4 (4) The process of peeling the said insulating base 4 from the mold release member 6

<(1) Insulating base forming process>
In the insulating base forming step, a plurality of long base-like insulating bases 4 are formed on the surface of the release member 6 as shown in FIG. The method for forming the insulating base 4 is the same as the method for manufacturing the insulated wire 1. In addition, as shown to Fig.4 (a), you may form the insulating base 4 in the state which the terminal 12 (insulating board | substrate 11) and the mold release member 6 were adjoined, or the insulating base 4 After forming, the mold release member 6 and the insulating base 4 and the terminal 12 may be brought close to each other immediately before the next conductor forming step.

<(2) Conductor formation process>
In the conductor forming step, a conductive paste is printed on the center of the insulating base 4 in the width direction and on the surface of the terminal 12 in a state where the insulating base 4 and the terminal 12 are brought close to each other as shown in FIG. Thus, the continuous conductors 2 from the terminals 12 to the insulating base 4 are formed. The method for printing the conductive paste is the same as the method for manufacturing the insulated wire 1. The conductors 2 may be formed one by one, but the productivity can be improved by forming a plurality of conductors at the same time.

<(3) Insulating film forming step>
In the insulating coating forming step, in addition to the surface of the conductor 2 and the surfaces on both sides in the width direction of the insulating base 4 as shown in FIG. 4C, the surface of the insulating substrate 11 on which the conductor 2 is laminated. An insulating film 5 is formed to cover a part of the film. The method for forming the insulating coating 5 is the same as the method for manufacturing the insulated wire 1.

<(4) Insulating base peeling process>
In the insulating base peeling process, the electronic component 10 can be obtained by peeling the insulating base 4 from the peeling member 6 and removing the peeling member 6 as shown in FIG.

<Advantages>
The electronic component 10 can easily and reliably connect the conductor 2 to the terminal 12 by printing and laminating a conductive paste on the terminal 12 when the conductor of the insulated wire 1 is formed. Therefore, the electronic component 10 has excellent productivity and reliability.

[Other Embodiments]
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is not limited to the configuration of the embodiment described above, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims. The

  In the said embodiment, although the insulated wire was provided with the several insulator and conductor, the insulated wire which has only one set of insulator and conductor is also in the range which this invention intends. Similarly, electronic components having only one set of terminals, insulators and conductors are within the intended scope of the present invention.

  In addition, the surface of the insulating base (the surface on which the conductor is laminated) does not have to be flat, and a recess (groove) may be provided at the center so that the conductor can be easily laminated.

  Furthermore, the lamination position on the surface of the insulating base of the conductor is not limited to the center in the width direction, and if the area for laminating the insulating film covering the surface of the conductor can be secured on the surface of the insulating base, the insulating base A conductor may be laminated in a region close to the end in the width direction.

  In the electronic component, an insulating film may be formed on the terminals and the surface of the conductor laminated on the terminals. Thus, by covering the terminal and the conductor laminated on the terminal, the terminal and the conductor can be protected, and malfunction of the circuit can be prevented. Thus, when forming an insulating film on a terminal, you may form an insulating film for every terminal, For example, like the electronic component 20 shown in FIG. Covering may be performed by forming a strip-shaped insulating film 15 covering the terminal 12 and the conductor 2.

  The insulated wire of this invention can be used suitably for the connection with the terminal of a printed wiring board, for example. Moreover, the electronic component of this invention can be used suitably as a component of an electronic device.

DESCRIPTION OF SYMBOLS 1 Insulated electric wire 2 Conductor 3 Insulator 4 Insulating base 5 Insulating film 6 Release member 10, 20 Electronic component 11 Insulating substrate 12 Terminal 15 Insulating film

Claims (7)

A linear conductor made of conductive paste, and an insulator covering the outer peripheral surface of the conductor,
The insulator is
A long sheet-like insulating base on which the conductor is laminated on the surface;
An insulated wire having an insulating film covering the surface of the conductor and the surface of the insulating base other than the conductor laminated portion.   The insulated wire according to claim 1, wherein main components of the insulating base and the insulating coating are the same resin.   The insulated wire according to claim 1 or 2, further comprising a release member that is detachably laminated on the back side of the insulating base.   The insulated wire according to claim 3, wherein a plurality of the insulators and conductors are provided on a surface side of the release member. The insulated wire according to any one of claims 1 to 4,
An electronic component comprising: a terminal to which a conductor of the insulated wire is connected. Forming a long sheet-like insulating base having insulating properties on the surface of the release member; and
Forming a linear conductor made of a conductive paste by printing on the surface of the insulating base; and
And a step of forming an insulating film covering the surface of the conductor other than the conductor laminated portion of the insulating base. A method of manufacturing an electronic component comprising a terminal to which an insulated wire is connected,
Forming a long sheet-like insulating base having insulating properties on the surface of the release member; and
Forming a linear conductor made of a conductive paste by printing on the surface of the insulating base and the terminal in a state where the insulating base and the terminal are close to each other;
A step of forming an insulating coating covering the surface of the conductor other than the conductor laminated portion of the insulating base; and
And a step of peeling the insulating base from the release member.

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