CN110226366A - Electromagnetic shielding film, shielding printed wiring board and electronic equipment - Google Patents
Electromagnetic shielding film, shielding printed wiring board and electronic equipment Download PDFInfo
- Publication number
- CN110226366A CN110226366A CN201880010126.3A CN201880010126A CN110226366A CN 110226366 A CN110226366 A CN 110226366A CN 201880010126 A CN201880010126 A CN 201880010126A CN 110226366 A CN110226366 A CN 110226366A
- Authority
- CN
- China
- Prior art keywords
- electromagnetic shielding
- shielding film
- layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 224
- 239000012790 adhesive layer Substances 0.000 claims abstract description 68
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 66
- 229910052709 silver Inorganic materials 0.000 claims description 65
- 239000004332 silver Substances 0.000 claims description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 47
- 239000010949 copper Substances 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 42
- 238000005452 bending Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 33
- 239000010408 film Substances 0.000 description 145
- 238000000034 method Methods 0.000 description 78
- 238000000576 coating method Methods 0.000 description 38
- 238000007639 printing Methods 0.000 description 24
- 239000011342 resin composition Substances 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 19
- 239000002245 particle Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 17
- 238000005259 measurement Methods 0.000 description 14
- 238000007747 plating Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007800 oxidant agent Substances 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 210000002469 basement membrane Anatomy 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 238000007759 kiss coating Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- -1 acryloxy Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005673 polypropylene based resin Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 230000019491 signal transduction Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229940117958 vinyl acetate Drugs 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000555268 Dendroides Species 0.000 description 1
- 241001147149 Lucina Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000914 Metallic fiber Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- LMDBVBIYWDTTJQ-UHFFFAOYSA-N phenol;pyrrolidin-2-one Chemical class O=C1CCCN1.OC1=CC=CC=C1 LMDBVBIYWDTTJQ-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The purpose of the present invention is to provide it is a kind of manufacture shield printed wiring board when shielding character be difficult to decrease and with enough folding resistances electromagnetic shielding film.Electromagnetic shielding film of the invention includes: electrically conductive adhesive layer, the shielded layer being laminated on the electrically conductive adhesive layer, the insulating layer being laminated on the shielded layer, it is characterized by: being formed with several opening portions in the shielded layer, the opening area of the opening portion is 70~71000 μm2And the aperture opening ratio of the opening portion is 0.05~3.6%.
Description
Technical field
The present invention relates to electromagnetic shielding film, shielding printed wiring board and electronic equipments.
Background technique
Electromagnetic shielding film is pasted to shield
From external electromagnetic wave.
Usually, electromagnetic shielding film includes electrically conductive adhesive layer, the shielded layer made of metallic film etc., insulation
Structure made of layer is laminated in order.Hot pressing is carried out in the state that the electromagnetic shielding film is overlapped in printed wiring board, by
This, electromagnetic shielding film can be engaged in printed wiring board by gluing oxidant layer, to make shielding printed wiring board.After the engagement,
Element is installed on printed wiring board by solder re-flow.In addition, printed wiring board is that epilamellar printing figures are insulated
Structure made of film covering.
It, can be from by hot pressing, solder re-flow heating shielding printed wiring board when manufacture shields printed wiring board
The electrically conductive adhesive layer of electromagnetic shielding film, insulating film of printed wiring board etc. generate gas.In addition, when printed wiring board
When basement membrane is formed by the bibulous resin such as polyimides, it sometimes appear that the feelings of vapor are generated from basement membrane due to heating
Condition.These volatile components generated from electrically conductive adhesive layer, insulating film, basement membrane cannot be by shielded layer, therefore can accumulate
Between shielded layer and electrically conductive adhesive layer.Therefore, if solder re-flow process sharply heat, due to accumulating in
Volatile component between shielded layer and electrically conductive adhesive layer, the interlayer of shielded layer and electrically conductive adhesive layer closely connects sometimes
Conjunction property can be destroyed, and shielding character reduces.
As above to solve the problems, such as, patent document 1, which is recorded, to be set several opening portions in shielded layer (metallic film) and makes gas permeability
The electromagnetic shielding film being improved.
If shielded layer sets several opening portions, even if producing volatile component, volatile component can also pass through opening
Portion passes through shielded layer.Therefore, it can prevent from accumulating volatile component between shielded layer and electrically conductive adhesive layer, and can prevent
The reduction of the shielding character as caused by the destruction of being tightly engaged into property of interlayer.
[existing technical literature]
[patent document]
[patent document 1] International Publication No. 2014/192494.
Summary of the invention
[technical problems to be solved by the inivention]
But electromagnetic shielding film documented by patent document 1 is due to foring opening portion in shielded layer, so shielded layer is strong
It spends weaker.
Therefore, it if electromagnetic shielding film documented by patent document 1 being used in flexible printed wiring board, can generate such as
Lower problem.
That is, flexible printed wiring board can be bent repeatedly when in use.It is used in the electromagnetism of such flexible printed wiring board
Wave screened film and the shielded layer that the electromagnetic shielding film is made can also be bent repeatedly.
As described above, the intensity of the shielded layer of electromagnetic shielding film documented by patent document 1 is weaker, therefore have repeatedly curved
The problem of shielded layer is easily destroyed if folding.
In view of the above problems, the purpose of the present invention is to provide one kind to shield the present invention when manufacture shields printed wiring board
Characteristic is difficult to decrease and the electromagnetic shielding film with enough folding resistances.
[technological means for solving technical problem]
In order to solve the above technical problems, the present inventor conscientiously studies discovery: being formed in the shielding of electromagnetic shielding film by controlling
The opening area of opening portion and the aperture opening ratio of opening portion of layer can prevent the shielding manufactured using the electromagnetic shielding film from printing
Shielding character reduces in wiring board, is further able to improve the folding resistance of shielding printed wiring board, so as to complete the present invention.
That is, electromagnetic shielding film of the invention include: electrically conductive adhesive layer, be laminated to the electrically conductive adhesive layer it
On shielded layer, the insulating layer that is laminated on the shielded layer, it is characterised in that: be formed with several openings in the shielded layer
Portion, the opening area of the opening portion are 70~71000 μm2, and the aperture opening ratio of the opening portion is 0.05~3.6%.
In electromagnetic shielding film of the invention, shielded layer is formed with several opening portions.Therefore, using electromagnetism of the invention
In hot pressing process, solder re-flow process when wave screened film manufacture shielding printed wiring board etc., even if in shielded layer and conduction
Volatile component is produced between property gluing oxidant layer, volatile component can also pass through the opening portion of shielded layer.
Therefore, it is not easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.So, interlayer can be prevented
Being tightly engaged into property is destroyed.
In electromagnetic shielding film of the invention, the opening area of the opening portion is 70~71000 μm2, and the opening
The aperture opening ratio in portion is 0.05~3.6%.
Within this range, folding resistance is enough for the opening area and aperture opening ratio for being formed in the opening portion of shielded layer, and
It can prevent from accumulating volatile component between shielded layer and electrically conductive adhesive layer.
The opening area of opening portion is less than 70 μm2If, opening portion is narrow, and volatile component not easily passs through shielded layer.This
Sample one is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.Therefore, the electromagnetic shielding film is being used
When manufacture shielding printed wiring board, the being tightly engaged into property of interlayer of shielded layer and electrically conductive adhesive layer is more easily damaged.Such one
Carrying out shielding character can reduce.
The opening area of opening portion is more than 71000 μm2If, opening portion is wide, and shielded layer dies down, and folding resistance reduces.
For the aperture opening ratio of opening portion less than 0.05%, the ratio of opening portion is too small, and volatile component not easily passs through shielding
Layer.So, it is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.
If the aperture opening ratio of opening portion is more than 3.6%, the ratio of opening portion is excessive, and shielded layer dies down, and folding resistance reduces.
In addition, " aperture opening ratio " refers to several openings for the area of the interarea entirety of shielded layer in this specification
The total opening area in portion.
In electromagnetic shielding film of the invention, the opening spacing of the preferably described opening portion is 10~10000 μm.
The opening spacing of opening portion is less than 10 μm, the large percentage in shielded layer entirety split shed portion.So, shield
It covers layer to die down, folding resistance reduces.
If the opening spacing of opening portion is more than 10000 μm, the ratio in shielded layer entirety split shed portion is smaller.Such one
Come, volatile component is easily detected by shielded layer, is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.
In addition, " the opening spacing of opening portion " refers between the center of gravity between adjacent and nearest opening portion in this specification
Distance.
In electromagnetic shielding film of the invention, the preferably described shielded layer with a thickness of 0.5 μm or more.
For the thickness of shielded layer less than 0.5 μm, shielded layer is excessively thin, therefore shielding character is lower.
In electromagnetic shielding film of the invention, the preferably described shielded layer includes layers of copper.
From the viewpoint of electric conductivity and economy, copper is suitable material for shielded layer.
In electromagnetic shielding film of the invention, optimal technical scheme are as follows: the shielded layer further includes silver layer, the silver
Layer is configured at the insulating layer side, and the layers of copper is configured at electrically conductive adhesive layer side.
The electromagnetic shielding film of this structure can easily make in the following way, i.e., apply silver paste in insulating layer and formed
Opening portion is as silver layer, and in silver layer plated copper.
It is preferred that electromagnetic shielding film of the invention is used for flexible printed wiring board.
As described above, electromagnetic shielding film of the invention is not easy in shielded layer and leads when manufacture shields printed wiring board
Accumulate volatile component between electrical gluing oxidant layer.In addition, electromagnetic shielding film of the invention has enough folding resistances.Cause
This, even if electromagnetic shielding film of the invention not cracky for flexible printed wiring board and bent repeatedly.
Therefore, electromagnetic shielding film of the invention is suitable as making for the electromagnetic shielding film of flexible printed wiring board
With.
Shielding printed wiring board of the invention include: containing be formed with printed circuit basic component, be set to the basis
On component and cover the printed circuit insulating film printed wiring board, the electromagnetic wave shielding on the printed wiring board
Film, it is characterised in that: the electromagnetic shielding film is the electromagnetic shielding film of the invention.
In addition, the preferably described printed wiring board is flexible printed wiring board in shielding printed wiring board of the invention.
Shielding printed wiring board of the invention includes the electromagnetic shielding film of the invention of enough folding resistances.Therefore,
Shielding printed wiring board of the invention also has enough folding resistances.
Electronic equipment of the invention is characterized in that: the electronic equipment is assembled with the shielding printed wiring of the invention
Plate, and the shielding printed wiring board is assembled with bending state.
As described above, shielding printed wiring board of the invention has enough folding resistances.Therefore, even if with bending state group
Dress also not cracky in the electronic device.Therefore, electronic equipment of the invention can be reduced for configuring shielding printed wiring board
Space.
Therefore, electronic equipment slimization of the invention can be made.
[invention effect]
In electromagnetic shielding film of the invention, several opening portions are formed in shielded layer, the opening area of the opening portion is 70
~71000 μm2, and the aperture opening ratio of opening portion is 0.05~3.6%.
It is formed in the feature of the opening portion of shielded layer in the range, folding resistance enough and uses electromagnetism of the invention
Wave screened film manufacture shielding printed wiring board when, can prevent between shielded layer and electrically conductive adhesive layer accumulate volatility at
Point.
Detailed description of the invention
[Fig. 1] Fig. 1 is the schematic cross-section of an example of electromagnetic shielding film of the invention；
[Fig. 2] Fig. 2 (a) and (b) are using the electromagnetic shielding film manufacture shielding track for not forming opening portion in shielded layer
The schematic diagram of the case where road plate；
[Fig. 3] Fig. 3 (a)~(c) is the one of the spread geometry in the shielded layer split shed portion of composition electromagnetic shielding film of the invention
The schematic top plan view of example；
[Fig. 4] Fig. 4 is the schematic cross-section of an example of of the invention electromagnetic shielding film of the shielded layer comprising layers of copper and silver layer；
[Fig. 5] Fig. 5 (a)~(c) is the process signal in order of an example of the manufacturing method of electromagnetic shielding film of the invention
Figure；
[Fig. 6] Fig. 6 is the process signal of an example of insulating layer preparatory process in the manufacturing method of electromagnetic shielding film of the invention
Figure；
[Fig. 7] Fig. 7 is the process schematic diagram of an example of silver paste printing process in the manufacturing method of electromagnetic shielding film of the invention；
[Fig. 8] Fig. 8 is the process schematic diagram of an example of silver paste printing process in the manufacturing method of electromagnetic shielding film of the invention；
[Fig. 9] Fig. 9 is the process schematic diagram of an example of silver paste printing process in the manufacturing method of electromagnetic shielding film of the invention；
[Figure 10] Figure 10 (a) and (b) are the processes that an example of copper process is plated in the manufacturing method of electromagnetic shielding film of the invention
Schematic diagram；
[Figure 11] Figure 11 (a) and (b) are that electrically conductive adhesive layer forms work in the manufacturing method of electromagnetic shielding film of the invention
The process schematic diagram of an example of sequence；
[Figure 12] Figure 12 is the schematic diagram of the structure of the system used in KEC method.
Specific embodiment
Just electromagnetic shielding film of the invention is specifically described below.But the present invention is not limited to following implementation,
It can be suitable for changing and being applicable in the range of not changing the gist of the invention.
Fig. 1 is the schematic cross-section of an example of electromagnetic shielding film of the invention.
As shown in Figure 1, electromagnetic shielding film 10 includes electrically conductive adhesive layer 20, is laminated on electrically conductive adhesive layer 20
Shielded layer 30, the insulating layer 40 that is laminated on shielded layer 30.
In addition, shielded layer 30 is formed with several opening portions 50.
(electrically conductive adhesive layer)
In electromagnetic shielding film 10, as long as electrically conductive adhesive layer 20 is conductive and can play a role i.e. as adhesive
Can, it can be made of any material.
For example, electrically conductive adhesive layer 20 can be made of electroconductive particle and zygosity resin combination.
Electroconductive particle is not particularly limited, and can be metal microparticle, carbon nanotube, carbon fiber, metallic fiber etc..
Electroconductive particle is the metal particle period of the day from 11 p.m. to 1 a.m, and metal microparticle is not particularly limited, and can be silver powder, copper powder, nickel powder, weldering
It is feed powder, aluminium powder, resulting silver-coated copper powder silver-plated to copper powder, resulting micro- with metal covering high molecular particle, glass microballoon etc.
Particle etc..
From the viewpoint of economy, wherein it is preferred that the copper powder or silver-coated copper powder that can be started with cheap price.
The average grain diameter of electroconductive particle is not particularly limited, and preferably 0.5~15.0 μm.The average grain diameter of electroconductive particle is
If 0.5 μm or more, the electric conductivity of electrically conductive adhesive layer is good.The average grain diameter of electroconductive particle is 15.0 μm below
Words, can make electrically conductive adhesive layer thinning.
The shape of electroconductive particle is not particularly limited, can be from spherical, flat, flakey, dendron shape, rodlike, fiber
The suitable selection such as shape.
The material of zygosity resin combination is not particularly limited, and is able to use styrene resin composite, vinyl acetate
Based resin composition, polyester resin composition, polythylene resin composition, polypropylene-based resin composition, acid imide
The thermoplastic resin compositions such as based resin composition, amide based resin composition, acrylic resin composition, phenolic resin
Composition, epoxylite composition, polyurethane based resin composition, melamine based resin composition, alkyd based resin group
Close compositions of thermosetting resin such as object etc..
The material of zygosity resin combination can be independent a kind in substance as above, be also possible to of more than two kinds group
It closes.
As needed, electrically conductive adhesive layer 20 may include curing accelerator, tackifier, antioxidant, pigment, dye
Material, plasticizer, ultraviolet absorbing agent, defoaming agent, leveling agent, filler, fire retardant, viscosity modifier etc..
The compounding amount of electroconductive particle is not particularly limited in electrically conductive adhesive layer 20, preferably 15~80 mass %, more excellent
Select 15~60 mass %.
In the range, electrically conductive adhesive layer can improve the zygosity of printed wiring board.
The thickness of electrically conductive adhesive layer 20 is not particularly limited, and can as needed be suitable for setting, and preferably 0.5~20.0 μm.
The thickness of electrically conductive adhesive layer is less than 0.5 μm, it is difficult to obtain good electric conductivity.Electrically conductive adhesive layer
Thickness be more than 20.0 μm if, the thickness of electromagnetic shielding film entirety, which thickens, to be difficult to handle.
Additionally, it is preferred that electrically conductive adhesive layer 20 has anisotropic conductive.
If electrically conductive adhesive layer 20 has anisotropic conductive, and there is the case where isotropic conductivity phase
Than that can be improved in the transmission characteristic for the high-frequency signal that the signal circuit of printed wiring board transmits.
(insulating layer)
In electromagnetic shielding film 10, insulating layer 40 has enough insulating properties, and can protect electrically conductive adhesive layer 20 and shielding
Layer 30, is not particularly limited, for example, it is preferred that by thermoplastic resin composition, compositions of thermosetting resin, active energy beam
Solidification compound etc. is made.
The thermoplastic resin composition is not particularly limited, and can enumerate styrene resin composite, vinylacetate
Based resin composition, polyester resin composition, polythylene resin composition, polypropylene-based resin composition, acid imide
Resin combination, acrylic resin composition etc..
The compositions of thermosetting resin is not particularly limited, and can enumerate phenolic resin composition, epoxylite group
Close object, polyurethane based resin composition, melamine based resin composition, alkyd based resin composition etc..
The Actinic-radiation curable composition is not particularly limited, such as can enumerate at least 2 (first in molecule
Base) acryloxy polymerizable compound etc..
Insulating layer 40 can be separately made by a kind of material, can also be made of material of more than two kinds.
As needed, insulating layer 40 also may include curing accelerator, tackifier, antioxidant, pigment, dyestuff, plastic
Agent, ultraviolet absorbing agent, defoaming agent, leveling agent, filler, fire retardant, viscosity modifier, anti-blocking agent etc..
The thickness of insulating layer 40 is not particularly limited, and can as needed be suitable for setting, and preferably 1~15 μm, more preferable 3~10 μ
m。
The thickness of insulating layer 40 is excessively thin less than 1 μm, and therefore, it is difficult to electrically conductive adhesive layer 20 and the shieldings of adequately protecting
Layer 30.
It is blocked up if the thickness of insulating layer 40 is more than 15 μm, therefore electromagnetic shielding film 10 is difficult to bend, and insulating layer
40 itself are easy breakage.Therefore, it is difficult to be applicable to the component of folding resistance.
(shielded layer)
Before the shielded layer for illustrating electromagnetic shielding film of the invention, used with Detailed description of the invention not in shielded layer formation opening portion
Electromagnetic shielding film manufacture shielding printed wiring board the case where.
Fig. 2 (a) and (b) are using the electromagnetic shielding film manufacture shielding printed wiring board for not forming opening portion in shielded layer
The case where schematic diagram.
As shown in Figure 2 (a), when manufacture shielding printed wiring board, it is configured with the shielding printed wiring of electromagnetic shielding film 510
Plate can be heated by hot pressing, solder re-flow.
By the heating, can from the electrically conductive adhesive layer 520 of electromagnetic shielding film 510, printed wiring board insulating film,
Basement membrane etc. generates volatile component 560.
If sharply heating in this case, as shown in Fig. 2 (b), due to accumulating in shielded layer 530 and electrically conductive adhesive
Volatile component 560 between layer 520, the being tightly engaged into property of interlayer of shielded layer 530 and electrically conductive adhesive layer 520 can quilt sometimes
It destroys.
But in electromagnetic shielding film 10, several opening portions 50 are formed in shielded layer 30.
Therefore, when manufacturing shielding printed wiring board using electromagnetic shielding film 10, even if due to heating and in shielded layer 30
Volatile component is produced between electrically conductive adhesive layer 20, volatile component can also pass through the opening portion 50 of shielded layer 30.
Therefore, it is not easy to accumulate volatile component between shielded layer 30 and electrically conductive adhesive layer 20.So, it can prevent
Being tightly engaged into property of interlayer is destroyed.
In electromagnetic shielding film 10, the opening area of opening portion 50 is 70~71000 μm2, and the aperture opening ratio of opening portion 50
It is 0.05~3.6%.
It is preferred that the opening area of opening portion 50 is 70~32000 μm2, more preferable 70~10000 μm2, further preferred 80~
8000μm2。
Additionally, it is preferred that the aperture opening ratio of opening portion 50 is 0.1~3.6%.
Within this range, folding resistance is enough for the opening area and aperture opening ratio for being formed in the opening portion 50 of shielded layer 30,
And it can prevent from accumulating volatile component between shielded layer 30 and electrically conductive adhesive layer 20.
The opening area of the opening portion of shielded layer is less than 70 μm2If, opening portion is narrow, and volatile component not easily passs through screen
Cover layer.So, it is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.
The opening area of the opening portion of shielded layer is more than 71000 μm2If, opening portion is wide, and shielded layer dies down, folding resistance
It reduces.
The aperture opening ratio of the opening portion of shielded layer is less than 0.05%, and the ratio of opening portion is too small, and volatile component is not easy
Pass through shielded layer.So, it is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.
If the aperture opening ratio of the opening portion of shielded layer is more than 3.6%, the ratio of opening portion is excessive, and shielded layer dies down, folding
Property reduce.
In electromagnetic shielding film 10, the shape of opening portion 50 is not particularly limited, and can be round, ellipse, racing track
(racetrack) shape, triangle, quadrangle, pentagon, hexagon, octagonal, star etc..
Wherein, from the point of view of forming the easy degree of opening portion 50, circular.
In addition, the shape of several opening portions 50 can be independent a kind, it is also possible to Several combinations.
In electromagnetic shielding film 10, preferably the opening spacing of opening portion 50 is 10~10000 μm, more preferable 25~2000 μ
M, further preferred 250~2000 μm.
The opening spacing of opening portion is less than 10 μm, the large percentage in shielded layer entirety split shed portion.So, shield
It covers layer to die down, folding resistance reduces.
If the opening spacing of opening portion is more than 10000 μm, the ratio in shielded layer entirety split shed portion is smaller.Such one
Come, volatile component is easily detected by shielded layer, is easy to accumulate volatile component between shielded layer and electrically conductive adhesive layer.
In electromagnetic shielding film 10, the spread geometry of opening portion 50 is not particularly limited, for example can be row as follows
Column figure.
Fig. 3 (a)~(c) is an example for constituting the spread geometry in shielded layer split shed portion of electromagnetic shielding film of the invention
Schematic top plan view.
As shown in Fig. 3 (a), the spread geometry of opening portion 50 can be each in equilateral triangle anyhow continuously arranged plane
The center of opening portion 50 is located at the spread geometry on the vertex of equilateral triangle.
In addition, as shown in Figure 3, the spread geometry of opening portion 50 can be in square vertical and horizontal continuously arranged plane
The center in split shed portion 50 is located at the spread geometry on the vertex of square.
In addition, as shown in Figure 3, the spread geometry of opening portion 50 can be vertical and horizontal continuously arranged flat in regular hexagon
The center in face split shed portion 50 is located at the spread geometry on the vertex of regular hexagon.
In electromagnetic shielding film 10, preferable mask layer 30 with a thickness of 0.5 μm or more, more preferable 1.0 μm or more.In addition,
Preferable mask layer 30 with a thickness of 10 μm or less.
For the thickness of shielded layer less than 0.5 μm, shielded layer is excessively thin, therefore shielding character is lower.
In addition, shielded layer 30 with a thickness of 1.0 μm or more, transmission frequency be 0.01~10GHz high-frequency signal
Signal transduction system in transmission characteristic it is good.
In addition, if shielded layer thickens, shielding printed wiring board in manufacture not in the case where shielded layer forms opening portion
When, the being tightly engaged into property of interlayer between shielded layer and electrically conductive adhesive layer is just easily destroyed.The especially thickness of shielded layer 30
If 1.0 μm, being tightly engaged into property of interlayer can be effectively destroyed.But in electromagnetic shielding film 10, shielded layer 30 is formed with
Opening portion 50, therefore the being tightly engaged into property of interlayer between shielded layer 30 and electrically conductive adhesive layer 20 can be prevented to be destroyed.
It is preferred that electromagnetic shielding film of the invention is used in the signal transduction system for the signal that transmission frequency is 0.01~10GHz
In.
It, can be by any material system as long as shielded layer has electromagnetic wave shielding performance in electromagnetic shielding film of the invention
At, for example can be made of metal layer.
Shielded layer may include the layer made of the materials such as gold, silver, copper, aluminium, nickel, tin, palladium, chromium, titanium, zinc, preferably comprise
Layers of copper.
From the viewpoint of electric conductivity and economy, copper is suitable material for shielded layer.
In addition, the shielded layer may include the layer made of the alloy of the metal.
In addition, shielded layer can be laminated by several metal layers.
Especially preferable mask layer includes layers of copper and silver layer.
The case where when the use of Detailed description of the invention shielded layer including layers of copper and silver layer.
Fig. 4 is the schematic cross-section of an example of of the invention electromagnetic shielding film of the shielded layer comprising layers of copper and silver layer.
Electromagnetic shielding film 110 shown in Fig. 4 includes electrically conductive adhesive layer 120, is laminated to electrically conductive adhesive layer 120
On shielded layer 130, the insulating layer 140 that is laminated on shielded layer 130.
In addition, shielded layer 130 includes layers of copper 132 and silver layer 131, silver layer 131 is configured at 140 side of insulating layer, and layers of copper 132 is matched
It is placed in 120 side of electrically conductive adhesive layer.
The electromagnetic shielding film 110 of this structure can easily make in the following way, i.e., apply silver paste in insulating layer 140
And opening portion is formed as silver layer, and in silver layer plated copper.
(other structures)
In electromagnetic shielding film of the invention, tackifier coating can be formed between insulating layer and shielded layer.
The material of tackifier coating can enumerate polyurethane resin, acrylic resin, using polyurethane resin as shell, with acrylic acid
Resin be the hud typed compound resin of core, epoxy resin, imide resin, amide resin, melamine resin, phenolic resin,
Urea-formaldehyde resin, blocked isocyanate, polyvinyl alcohol, the polyethylene for reacting the sealers such as polyisocyanate and phenol
Pyrrolidones etc..
In addition, can include support film in insulating layer side in electromagnetic shielding film of the invention, it can also be in electric conductivity
Gluing oxidant layer side includes stripping film.If electromagnetic shielding film includes support film, stripping film, electromagnetic shielding film of the invention
Operation whens having used shielding printed wiring board etc. of electromagnetic shielding film of the invention of transport, manufacture in, electricity of the invention
Magnetic wave screened film is easily processed.
In addition, when shielding the configuration such as printed wiring board electromagnetic shielding film of the invention, support film as above, stripping film
It can be stripped off.
Electromagnetic shielding film of the invention can be used for any purposes, as long as the purpose of shielding electromagnetic wave.
Electromagnetic shielding film especially of the invention is preferred for printed wiring board, is especially preferred for use in flexible printed wiring
Plate.
As described above, electromagnetic shielding film of the invention is not easy in shielded layer and leads when manufacture shields printed wiring board
Accumulate volatile component between electrical gluing oxidant layer.In addition, electromagnetic shielding film of the invention has enough folding resistances.Cause
This, even if electromagnetic shielding film of the invention not cracky for flexible printed wiring board and bent repeatedly.
Therefore, electromagnetic shielding film of the invention is suitable as making for the electromagnetic shielding film of flexible printed wiring board
With.
So the shielding printed wiring board containing electromagnetic shielding film of the invention is shielding printed wiring board of the invention.
That is, shielding printed wiring board of the invention include: containing be formed with printed circuit basic component, be set to the base
On plinth component and cover the printed circuit insulating film printed wiring board, the electromagnetism wave screen on the printed wiring board
Cover film, it is characterised in that: the electromagnetic shielding film is the electromagnetic shielding film of the invention.
Additionally, it is preferred that the printed wiring board is flexible printed wiring board.
Shielding printed wiring board of the invention includes the electromagnetic shielding film of the invention of enough folding resistances.Therefore,
Shielding printed wiring board of the invention also has enough folding resistances.
Shielding printed wiring board assembling of the invention uses in the electronic device.
The especially described shielding printed wiring board of the invention is electricity of the invention with the electronic equipment that bending state assembles
Sub- equipment.
As described above, shielding printed wiring board of the invention has enough folding resistances.Therefore, even if under bending state
It is assembled in electronic equipment also not cracky.Therefore, electronic equipment of the invention can be reduced for configuring shielding printed wiring board
Space.
Therefore, electronic equipment slimization of the invention can be made.
(manufacturing method of electromagnetic shielding film)
The manufacturing method of electromagnetic shielding film of the invention will be illustrated next.In addition, electromagnetic shielding film of the invention is not limited to
The method shown in following manufactures.
Firstly, to an example of electromagnetic shielding film of the invention --- an example of the manufacturing method of electromagnetic shielding film 10 into
Row explanation.
The method for manufacturing electromagnetic shielding film 10 includes (1) shielded layer formation process, (2) insulating layer formation process and (3)
Electrically conductive adhesive layer formation process.
These processes are described in detail in attached drawing used below.
Fig. 5 (a)~(c) is the process signal in order of an example of the manufacturing method of electromagnetic shielding film of the invention
Figure.
(1) shielded layer formation process
Firstly, as shown in Fig. 5 (a), preparing the sheet material 35 with electromagnetic wave shielding performance, forming opening portion 50 in sheet material 35 and making
The opening area of opening portion 50 is 70~71000 μm2, aperture opening ratio be 0.05~3.6%, make shielded layer 30.
Opening portion 50 can be formed by punching, laser irradiation etc..
In addition, may be designed as: against corrosion in the surface configuration of sheet material 35 when sheet material 35 is made of the material that copper etc. can etch
Agent, the figure of the resist form opening portion 50.
In addition, being also designed to: the cream to play a role by conductive paste, as plating catalyst is printed on the table of sheet material 35
Face.
It in the printing, may be designed as: carrying out printing by certain figure to form opening portion 50.
When printing the cream to play a role as plating catalyst, after preferably printing paste forms opening portion 50, pass through
Electroless plating method, galvanoplastic form metal film to form shielded layer.
The cream to play a role as plating catalyst can use containing by nickel, copper, chromium, zinc, gold, silver, aluminium, tin, cobalt,
The mobility object of metal made of palladium, lead, platinum, cadmium and rhodium etc..
(2) insulating layer formation process
Next, as shown in Fig. 5 (b), the face coating resin compositions for insulating layer 45 in the side of shielded layer 30 makes its solidification
Form insulating layer 40.
The method of coating resin compositions for insulating layer can enumerate well-known coating method all the time, such as recessed
Version coating method, kiss-coating mode, slit coating mode, lip type coating method, comma coating method, blade coating side
Formula, print roll coating mode, blade coating method, spray coating mode, scraper coating method, rotary coating mode, dip coated
Mode etc..
Enable the cured method of resin compositions for insulating layer according to the type of resin compositions for insulating layer using always
Since well-known various methods.
(3) electrically conductive adhesive layer formation process
Next, as shown in Fig. 5 (c), coating conductive paste in the face opposite with the face for being formed with insulating layer 40 of shielded layer 30
Adhesive layer forms electrically conductive adhesive layer 20 with composition 25.
The method of coating electrically conductive adhesive layer composition 25 can enumerate well-known coating method all the time,
Such as plate gravure coating method, kiss-coating mode, slit coating mode, lip type coating method, comma coating method, scrape cutter painting
Mode for cloth, print roll coating mode, blade coating method, spray coating mode, scraper coating method, rotary coating mode, dipping
Coating method etc..
By the above process, an example of electromagnetic shielding film of the invention can be manufactured --- electromagnetic shielding film 10.
Next, to an example of electromagnetic shielding film of the invention, i.e. the shielded layer electromagnetism wave screen that includes layers of copper and silver layer
An example for covering the manufacturing method of film 110 is illustrated.
The method for manufacturing electromagnetic shielding film 110 includes (1) insulating layer preparatory process, (2) silver paste printing process, (3) plating
Copper process and (4) electrically conductive adhesive layer formation process.
These processes are described in detail in Fig. 6~Figure 11 used below.
(1) insulating layer preparatory process
Fig. 6 is the process schematic diagram of an example of insulating layer preparatory process in the manufacturing method of electromagnetic shielding film of the invention.
Firstly, as shown in fig. 6, preparing insulating layer 140.
Insulating layer 140 can be prepared with method all the time.
(2) as plating catalyst, the printing process (silver paste printing process) of mobility object containing metal
Next, the interarea printing silver paste 133 in the side of insulating layer 140 is used as plating catalyst.At this point, can be formed in silver paste
Opening area is 70~71000 μm2And several opening portions 150 that aperture opening ratio is 0.05~3.6%.
The method of printing silver paste 133 can enumerate the letterpress such as the intaglio printings such as rotogravure printing, flexographic printing
Method, the method for wire mark form the method for the hectographic printing transferred after figure by intaglio plate, relief printing plate, wire mark etc., do not need
The method etc. of the ink jet printing of version.
The method that silver paste 133 is printed by rotogravure printing is illustrated below.
Fig. 7~Fig. 9 is that the process of an example of silver paste printing process in the manufacturing method of electromagnetic shielding film of the invention is shown
It is intended to；
Firstly, as shown in fig. 7, preparing to be formed with the roller 70 of the roll of several columnar protrusions 72 on surface.At this point, making
The area of the upper side 73 of each protrusion 72 is 70~71000 μm2.And the several protrusions 72 of setting, so that several protrusions 72
Upper side 73 the gross area relative to roller 70 surface area ratio be 0.05~3.6%.
In addition, the surface of the roller of not formed protrusion 72 is non-protrusion forming region 71.
In addition, the surface area of roller 70 means non-protruding portion's forming region 71 of the roller 70 of not formed protrusion 72
Area and several protrusions 72 upper side 73 the gross area aggregate value.
Next, as shown in figure 8, silver paste 133 is made to enter non-protruding portion's forming region 71.At this point, not in protrusion 72
Upper side 73 is coated with silver paste 133.
Then, as shown in figure 9, passing through insulating layer 140 between pressure roller 75 and the roller 70 for having silver paste 133, thus exhausted
The interarea of the side of edge layer 140 prints silver paste 133.
In the printing, the part for the insulating layer 140 that protrusion 72 touches does not print silver paste 133, can be used as opening portion
150。
The silver paste 133 for being printed on insulating layer 140 becomes silver layer 131.
As long as silver paste 133 includes silver particles, dispersing agent, tackifier, leveling agent, defoaming agent etc. in addition also may include
Various additives.
The shape of silver particles is not particularly limited, and can use the arbitrary shapes such as spherical, laminar, dendroid, needle-shaped, fibrous
Material.
If the silver particles are particle shape, preferably nano-scale.Specifically, preferably average grain diameter is in 1~100nm
Range silver particles, the silver particles of the range of more preferable 1~50nm.
In addition, " average grain diameter " instigates silver particles to be diluted in dispersion in solvent in this specification, and dissipated by dynamic optical
Penetrate the bulk averaged value of method measurement.
" the Nanotrac UPA-150 " of Microtrac corporation can be used in the measurement.
Additionally, it is preferred that by the silver layer that is formed of silver paste that prints with a thickness of 5~200nm.
(3) copper process is plated
Figure 10 (a) and (b) are the process schematic diagrames that an example of copper process is plated in the manufacturing method of electromagnetic shielding film of the invention.
Next, plated copper is on silver layer 131 to form layers of copper on silver layer 131 as shown in Figure 10 (a) and (b)
132。
The coating method of copper is not particularly limited, and can use electroless plating all the time, plating.
When by electroless plating come plated copper, preferably plating solution uses containing copper sulphate, reducing agent and aqueous medium, has
The plating solution of solvent equal solvent.
When by galvanoplastic copper facing, preferably plating solution use containing copper sulphate, sulfuric acid, aqueous medium plating solution, pass through control plating
Processing time, current density, usage amount of plating additive etc. are covered to be adjusted the thickness to realize desired copper.
It is preferred that the copper of plating with a thickness of 0.1~10 μm.
By the above process, the shielded layer 130 comprising silver layer 131 and layers of copper 132 can be formed.
(4) electrically conductive adhesive layer formation process
Figure 11 (a) and (b) are one of electrically conductive adhesive layer formation process in the manufacturing method of electromagnetic shielding film of the invention
The process schematic diagram of example.
In addition, Figure 10 (b) is spun upside down and illustrates subsequent process in Figure 11 (a) and (b).
Next, coating electrically conductive adhesive layer 125 shape of composition in layers of copper 132 as shown in Figure 11 (a) and (b)
At electrically conductive adhesive layer 120.
The method of coating electrically conductive adhesive layer composition 125 can enumerate well-known coating side all the time
Method, such as plate gravure coating method, kiss-coating mode, slit coating mode, lip type coating method, comma coating method, scrape
Cutter painting mode for cloth, print roll coating mode, blade coating method, spray coating mode, scraper coating method, rotary coating mode,
Dip coated mode etc..
By the above process, an example of electromagnetic shielding film of the invention can be manufactured --- electromagnetic shielding film 110.
The following are the embodiments that further present invention is specifically described, but the present invention is not these embodiment institutes
Limit.
(modulation example 1: the modulation example of silver paste)
In the in the mixed solvent of 65 mass parts of 35 mass parts of ethyl alcohol and ion exchange water, use PEI compounds as point
Powder disperses the silver particles of average grain diameter 30nm, to obtain the silver paste that silver concentration is 15 mass %.
(embodiment 1)
(1) insulating layer preparatory process
The insulating layer made of 5 μm of thickness of epoxy resin is prepared.
(2) silver paste printing process
Next, printing silver paste and shape in the side interarea of insulating layer using the roller of roll with Fig. 7~method shown in Fig. 9
It is 79 μm at opening area2, aperture opening ratio 0.15%, opening spacing be 250 μm several opening portions, form silver layer.
In addition, the thickness of silver layer is 50nm.
Silver paste uses the silver paste obtained in modulation example 1.
In addition, the shape of opening portion is circle, the spread geometry of opening portion is vertical and horizontal continuously arranged flat in equilateral triangle
The center of the face opening portion Zhong Ge is located at the spread geometry on the vertex of equilateral triangle.
(3) copper process is plated
Next, electroless plating copper liquid (Ao Ye Pharmaceutical Co., Ltd system of the insulating layer after silver paste is printed under the conditions of 55 DEG C
" ARG copper ", pH12.5) middle dipping 20 minutes, electroless plating copper film (0.5 μm of thickness) is formd on silver layer.
Next, anode is set by phosphorous copper by cathode is set as on the surface of electroless plating copper film obtained above,
Using the electroplate liquid comprising copper sulphate in current density 2.5A/dm2It is electroplated 30 minutes under the conditions of this, to be laminated on silver layer
Amount to the copper plate with a thickness of 1 μm.The electroplate liquid using copper sulphate 70g/ liter, sulfuric acid 200g/ liter, chloride ion 50mg/ liter,
The brightener of TOP LUCINA SF(Okuno Chemical Industries Co., Ltd.) 5g/ rise solution.
(4) electrically conductive adhesive layer formation process
It is coated in layers of copper to phosphorous epoxy resin and adds the Ag packet Cu powder of 20 mass % and obtain electrically conductive adhesive layer, make its thickness
Degree is 15 μm.
Coating method uses lip type coating method.
By the above process, the electromagnetic shielding film of embodiment 1 has been manufactured.
(embodiment 2)~(embodiment 36) and (comparative example 1)~(comparative example 30)
The thickness that the opening area of opening portion, aperture opening ratio and opening spacing and layers of copper are changed as shown in table 1 and 2, except this with
The electromagnetic shielding film of 2~embodiment of embodiment 36 and 1~comparative example of comparative example 30 is manufactured similarly to Example 1 outside.
[table 1]
[table 2]
(evaluation of electromagnetic wave shielding characteristic)
The electromagnetic wave shielding characteristic of the electromagnetic shielding film involved in each Examples and Comparative Examples, by using general corporations
The KEC method of the electromagnetic shielding effect measurement device 80 of the Northwest legal person KEC electronics industry development center exploitation is evaluated.
Figure 12 is the schematic diagram of the structure of the system used in KEC method.
The system used in KEC method includes electromagnetic shielding effect measurement device 80, spectrum analyzer 91, carries out 10dB
Decaying attenuator 92, carry out 3dB decaying attenuator 93, preamplifier 94.
As shown in figure 12, in electromagnetic shielding effect measurement device 80,2 measurement fixtures 83 are opposite and set.It is configured
Make to clamp electromagnetic shielding film involved in each Examples and Comparative Examples (in Figure 12, with 110 table of symbol between measurement fixture 83
Show).The size distribution of the room TEM (Transverse Electro Magnetic Cell) is imported in measurement fixture 83, is formd
With its transmit the vertical face of axis direction in be divided into symmetrical structure.But, to prevent due to electromagnetic shielding film 110
Insertion and form short circuit, there are configure with gap for each measurement fixture 83 for flat center conductor 84.
In KEC method, firstly, the signal exported from spectrum analyzer 91 to be input to the survey of sending side via attenuator 92
Clamp tool 83, then, the measurement fixture 83 of receiving side is received, and will pass through the signal of attenuator 93 with preamplifier 94
After amplification, signal level is measured by spectrum analyzer 91.In addition, spectrum analyzer 91 is not to set electromagnetic shielding film 110
It is placed on the basis of the state of electromagnetic shielding effect measurement device 80, electromagnetic shielding film 110 is arranged in electromagnetism wave screen for output
Cover the attenuation in the case where effect measuring device 80.
Using described device under conditions of 25 DEG C of temperature, relative humidity 30~50%, by each Examples and Comparative Examples institute
The electromagnetic shielding film being related to is cut into the square of 15cm, carries out the measurement of the electromagnetic wave shielding characteristic of 200MHz and carries out
Evaluation.
Evaluation criteria is as described below.As a result shown in table 1 and table 2.
Zero: for 85dB or more.
×: for less than 85dB.
(evaluation of splitting)
Electromagnetic shielding film involved in each Examples and Comparative Examples is had rated using the following method.
Firstly, each electromagnetic shielding film is affixed on printed wiring board by hot pressing.
Next, being exposed to and flowing again after the shielding printed wiring board is placed 7 days in 23 DEG C, the toilet of 63%RH
Temperature condition when weldering has rated the presence or absence of splitting.In addition, temperature condition when reflow welding is set as lead-free solder and sets
Determine 265 DEG C of highest of temperature curve.In addition, making shielding printed wiring board pass through atmospheric reflux weldering 5 about the presence or absence of splitting
It is secondary, and observe by the naked eye to whether there is or not bulging to be evaluated.
Evaluation criteria is as described below.As a result shown in table 1 and table 2.
Zero: screened film absolutely not generates bulging.
×: screened film produces bulging.
(evaluation of folding resistance)
Electromagnetic shielding film involved in each Examples and Comparative Examples is had rated using the following method.
By each electromagnetic shielding film by hot pressing be affixed on 50 μm of thickness polyimide film it is two-sided, be cut into it is vertical × horizontal=
130mm × 15mm size is as testing piece, and to the folding resistance of each testing piece, using MIT folding fatigue tester, (Co., Ltd. is pacified
Field essence mechanism makees made, No.307 MIT fold tester), folding is determined based on method as defined in JIS P8115:2001
Property.
Experimental condition is as described below.
Bend clamp front end R:0.38mm
Bending angle: ± 135 °
Bend speed: 175cpm
Loading: 500gf
Detection method: pass through the broken string of built-in electrical communication device induction shield film.
Folding resistance evaluation criteria is as described below.As a result shown in table 1 and table 2.
◎: bending number 2000 times or more produce broken string.
Zero: bending number 600 times or more, broken string is produced less than 2000 times.
×: bending number produces broken string less than 600 times.
As shown in table 1 and 2, as the electromagnetic shielding film of each embodiment, the opening area of opening portion is 70~71000
μm2, if the aperture opening ratio of opening portion is 0.05~3.6%, the evaluation of electromagnetic wave shielding characteristic, the evaluation of splitting and resistance to
The evaluation of folding endurance is all good.
[number explanation]
10,110 electromagnetic shielding film
20,120 electrically conductive adhesive layer
25,125 electrically conductive adhesive layer composition
30,130 shielded layer
40,140 insulating layer
45 resin compositions for insulating layer
50,150 opening portion
70 rollers
71 non-protruding portion's forming regions
72 protrusions
The upper side of 73 protrusions
75 pressure rollers
80 electromagnetic shielding effect measurement devices
83 measurement fixtures
84 center conductors
91 spectrum analyzers
92,93 attenuator
94 preamplifiers
131 silver layers
132 layers of copper
133 silver paste
Claims (9)
1. a kind of electromagnetic shielding film, the electromagnetic shielding film includes electrically conductive adhesive layer, is laminated to the conductive paste
Shielded layer on adhesive layer, the insulating layer being laminated on the shielded layer, it is characterised in that:
The shielded layer is formed with several opening portions,
The opening area of the opening portion is 70~71000 μm2,
The aperture opening ratio of the opening portion is 0.05~3.6%.
2. electromagnetic shielding film according to claim 1, it is characterised in that:
The opening spacing of the opening portion is 10~10000 μm.
3. electromagnetic shielding film according to claim 1 or 2, it is characterised in that:
The shielded layer with a thickness of 0.5 μm or more.
4. electromagnetic shielding film described in any one according to claim 1~3, it is characterised in that:
The shielded layer includes layers of copper.
5. electromagnetic shielding film according to claim 4, it is characterised in that:
The shielded layer also includes silver layer,
The silver layer is configured at the insulating layer side,
The layers of copper is configured at electrically conductive adhesive layer side.
6. electromagnetic shielding film described in any one according to claim 1~5, it is characterised in that:
The electromagnetic shielding film is used for flexible printed wiring board.
7. a kind of shielding printed wiring board, the shielding printed wiring board include:
Printed wiring board, the printed wiring board, which contains, to be formed with the basic component of printed circuit, is set to the basic component
Insulating film that is upper and covering the printed circuit,
Electromagnetic shielding film, the electromagnetic shielding film are set on the printed wiring board,
It is characterized by: the electromagnetic shielding film is electromagnetic shielding film described in any one of claim 1~6.
8. shielding printed wiring board according to claim 7, it is characterised in that:
The printed wiring board is flexible printed wiring board.
9. a kind of electronic equipment, it is characterised in that: the electronic equipment is assembled with shielding track described in claim 7 or 8
Road plate, and the shielding printed wiring board is assembled with bending state.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-021648 | 2017-02-08 | ||
| JP2017021648 | 2017-02-08 | ||
| PCT/JP2018/004107 WO2018147298A1 (en) | 2017-02-08 | 2018-02-07 | Electromagnetic wave shielding film, shielded printed wiring board, and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110226366A true CN110226366A (en) | 2019-09-10 |
| CN110226366B CN110226366B (en) | 2021-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880010126.3A Active CN110226366B (en) | 2017-02-08 | 2018-02-07 | Electromagnetic wave shielding film, shielded printed wiring board, and electronic device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6564534B2 (en) |
| KR (1) | KR102267570B1 (en) |
| CN (1) | CN110226366B (en) |
| TW (1) | TWI760431B (en) |
| WO (1) | WO2018147298A1 (en) |
Cited By (1)
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|---|---|---|---|---|
| CN112384053A (en) * | 2019-12-18 | 2021-02-19 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
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| CN113170603A (en) | 2018-12-03 | 2021-07-23 | 拓自达电线株式会社 | Grounding component and shielding printed circuit board |
| JP7363103B2 (en) | 2019-05-30 | 2023-10-18 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic shielding sheets and printed wiring boards |
| JP6597927B1 (en) * | 2019-06-18 | 2019-10-30 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic shielding sheet and electromagnetic shielding wiring circuit board |
| JP6624331B1 (en) * | 2019-08-01 | 2019-12-25 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
| JP6645610B1 (en) * | 2019-08-01 | 2020-02-14 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
| KR102472342B1 (en) * | 2020-02-10 | 2022-11-30 | 진테크 주식회사 | Carrier metal foil for EMI shielding and manufacturing method of the same |
| TWI812913B (en) * | 2020-03-02 | 2023-08-21 | 日商拓自達電線股份有限公司 | Metal foil and electromagnetic wave shielding film |
| TW202202337A (en) * | 2020-03-02 | 2022-01-16 | 日商拓自達電線股份有限公司 | Ground connection withdrawing film |
| KR102433774B1 (en) * | 2020-11-18 | 2022-08-19 | 율촌화학 주식회사 | High frequency electromagnetic interference film with improved thermal stability and the method for producing the same |
| KR102437292B1 (en) * | 2020-12-28 | 2022-08-29 | 와이엠티 주식회사 | EMI shielding material and manufacturing method of the same |
| JP7001187B1 (en) | 2021-03-19 | 2022-01-19 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and its manufacturing method, shielded wiring board, and electronic equipment |
| KR20230163445A (en) | 2021-03-29 | 2023-11-30 | 타츠타 전선 주식회사 | Electromagnetic wave shielding film and shielding printed wiring board |
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- 2018-02-07 JP JP2018535438A patent/JP6564534B2/en active Active
- 2018-02-07 WO PCT/JP2018/004107 patent/WO2018147298A1/en active Application Filing
- 2018-02-07 CN CN201880010126.3A patent/CN110226366B/en active Active
- 2018-02-08 TW TW107104521A patent/TWI760431B/en active
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| CN112384053B (en) * | 2019-12-18 | 2021-11-30 | 东洋油墨Sc控股株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201836464A (en) | 2018-10-01 |
| JP6564534B2 (en) | 2019-08-21 |
| CN110226366B (en) | 2021-02-12 |
| KR20190117494A (en) | 2019-10-16 |
| WO2018147298A1 (en) | 2018-08-16 |
| KR102267570B1 (en) | 2021-06-18 |
| TWI760431B (en) | 2022-04-11 |
| JPWO2018147298A1 (en) | 2019-02-14 |
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