CN209627808U - Free ground film and wiring board - Google Patents
Free ground film and wiring board Download PDFInfo
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- CN209627808U CN209627808U CN201821963114.6U CN201821963114U CN209627808U CN 209627808 U CN209627808 U CN 209627808U CN 201821963114 U CN201821963114 U CN 201821963114U CN 209627808 U CN209627808 U CN 209627808U
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Abstract
The utility model relates to electronic field, a kind of free ground film and wiring board are disclosed, wherein free ground film includes conductor layer and adhesive film, and adhesive film is set in conductor layer；Conductor layer is flat surface close to the one side of adhesive film, conductor layer is equipped with the first conductive particles of convex close to the one side of adhesive film, by being equipped with through-hole in conductor layer, the volatile matter be conducive in adhesive film at high temperature is exhausted by through-hole, it is difficult to be discharged to avoid the volatile matter in adhesive film when high temperature, so that free ground film blistering layering be avoided to cause to remove between free ground film and electromagnetic shielding film；Furthermore, when free ground film is used for the ground connection of printed wiring board, it is equipped with electromagnetic shielding film on a printed-wiring board, free ground film is mutually pressed by adhesive film with electromagnetic shielding film, first conductive particles pierce through the insulating layer of adhesive film and electromagnetic shielding film and are electrically connected with the shielded layer of electromagnetic shielding film, so that interference charge is exported by free ground film.
Description
Technical field
The utility model relates to electronic fields, more particularly to a kind of free ground film and wiring board.
Background technique
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding (Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency
High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, wiring board generally reduces electromagnetic interference by setting electromagnetic shielding film, and electromagnetic shielding film is in shielding electricity
During magnetic wave, the interference charge buildup that the external world generates is on the shielded layer of electromagnetic shielding film, to influence the letter of wiring board
Number transmission, in order to will interfere charge export, can be by the way that free ground film be arranged on an electro-magnetic shielding film.Existing line plate is common
Free ground film generally comprise conductor layer and conductive adhesive layer, conductor layer is connect by the shielded layer of conductive adhesive layer and electromagnetic shielding film
Touching conducting, so that the interference charge gathered on the shielded layer of electromagnetic shielding film be exported.But in implementing process of the present invention,
At least there are the following problems in the prior art for inventor's discovery: there is volatile matter in conductive adhesive layer under the high temperature conditions, but due to
Conductor layer is finer and close, therefore volatile matter is difficult to be discharged, so cause the blistering layering of free ground film cause free ground film with
It is removed between electromagnetic shielding film, and then leads to electromagnetic shielding film earthing failure, it can not be by interference charge export.
Utility model content
The purpose of the utility model is to provide a kind of free ground film and wiring board, can be effectively prevented from it is existing from
By the conductive adhesive layer in ground film, volatile matter can not be discharged by fine and close conductor layer at high temperature, so as to avoid free ground connection
Film blistering layering causes to remove between free ground film and electromagnetic shielding film, to ensure to interfere charge to export.
In order to solve the above-mentioned technical problem, the utility model provides a kind of free ground film, including conductor layer and adhesive film,
The adhesive film is set in the conductor layer；The conductor layer is equipped with the through-hole through its upper and lower surface, and the conductor layer is leaned on
The one side of the nearly adhesive film is flat surface, and the conductor layer is equipped with the first of convex close to the one side of the adhesive film and leads
Body particle；When the free ground film is used for the ground connection of printed wiring board, it is equipped with electromagnetic shielding film on a printed-wiring board, it is described
Electromagnetic shielding film includes shielded layer and insulating layer, and the insulating layer is set on the shielded layer, and the free ground film passes through institute
Adhesive film is stated mutually to press with the electromagnetic shielding film, first conductive particles pierce through the adhesive film and the insulating layer and with
The shielded layer electrical connection.
Preferably, the height of first conductive particles is 35 μm -100 μm.
Preferably, the conductor layer with a thickness of 0.01 μm -45 μm, the adhesive film with a thickness of 0.1 μm -80
μm。
Preferably, the adhesive film includes the adhesion layer containing conducting particles；Or, the adhesive film includes being free of
The adhesion layer of conducting particles.
Preferably, the free ground film further includes antioxidation coating, and the antioxidation coating is set to the conductor layer
In one side far from the adhesive film.
Preferably, the free ground film further includes peelable protective film layer, and the peelable protective film layer is set
In in one side of the adhesive film far from the conductor layer.
Preferably, the area of the through-hole is 0.01 μm2-1mm2。
Preferably, the number of the through-hole in the conductor layer every square centimeter is 5-106It is a.
In order to solve identical technical problem, the utility model also provides a kind of wiring board, including the electromagnetic shielding film,
The printed wiring board and the free ground film, the electromagnetic shielding film are set in the printed wiring board, the electromagnetism
Screened film includes shielded layer and insulating layer, and the insulating layer is set on the shielded layer, and the free ground film passes through the glue
Film layer is mutually pressed with the electromagnetic shielding film, first conductive particles pierce through the adhesive film and the insulating layer and with it is described
Shielded layer electrical connection.
Preferably, the electromagnetic shielding film further includes glue-line, and the glue-line is set to the shielded layer far from described
In the one side of insulating layer, the shielded layer is equipped with the second conductive particles, second conductor close to the one side of the glue-line
Grain pierces through the glue-line and is electrically connected with the stratum of the printed wiring board.
The utility model provides a kind of free ground film and wiring board, wherein free ground film includes conductor layer and glue film
Layer, adhesive film are set in conductor layer, and conductor layer is flat surface, one side of the conductor layer close to adhesive film close to the one side of adhesive film
The first conductive particles of convex are equipped with, conductor layer is equipped with the through-hole through its upper and lower surface；By being equipped in conductor layer
Through the through-hole of its upper and lower surface, the volatile matter be conducive in adhesive film at high temperature is exhausted by the through-hole of conductor layer,
It is difficult to be discharged to avoid adhesive film volatile matter at high temperature, causes free ground film so as to avoid the blistering layering of free ground film
It is removed between electromagnetic shielding film, and then ensures electromagnetic shielding film ground connection and export interference charge；In addition, free ground film
When ground connection for printed wiring board, it is equipped with electromagnetic shielding film on a printed-wiring board, electromagnetic shielding film includes shielded layer and absolutely
Edge layer, insulating layer are set on shielded layer, and free ground film is mutually pressed by adhesive film with electromagnetic shielding film, the first conductive particles thorn
It wears adhesive film and insulating layer and is electrically connected with shielded layer, so that the interference charge gathered on electromagnetic shielding film be exported, avoided
Interfere charge accumulation and formed interference source influence printed wiring board normal work.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the free ground film in the utility model embodiment；
Fig. 2 is the structural schematic diagram of another angle of the free ground film in the utility model embodiment；
Fig. 3 is the structural schematic diagram of another embodiment of the free ground film in the utility model embodiment；
Fig. 4 is the structural schematic diagram of the wiring board in the utility model embodiment；
Fig. 5 is the structural schematic diagram of another embodiment of the wiring board in the utility model embodiment；
Fig. 6 is the flow diagram of the preparation method of the free ground film in the utility model embodiment；
Wherein, 1, conductor layer；11, through-hole；2, adhesive film；3, the first conductive particles；4, antioxidation coating；5, it is electromagnetically shielded
Film；51, insulating layer；52, shielded layer；53, glue-line；6, printed wiring board；7, the second conductive particles.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
In conjunction with shown in Fig. 1 to Fig. 5, a kind of free ground film of the preferred embodiment in the utility model, including conductor layer 1 and glue
Film layer 2, the adhesive film 2 are set in the conductor layer 1；The conductor layer 1 is equipped with the through-hole 11 through its upper and lower surface, institute
The one side that conductor layer 1 is stated close to the adhesive film 2 is flat surface, and the conductor layer 1 is set in the one side of the adhesive film 2
There are the first conductive particles 3 of convex；When the free ground film is used for the ground connection of printed wiring board 6, set in printed wiring board 6
There is electromagnetic shielding film 5, the electromagnetic shielding film 5 includes shielded layer 52 and insulating layer 51, and the insulating layer 51 is set to the shielding
On layer 52, the free ground film is pressed by the adhesive film 2 and 5 phase of electromagnetic shielding film, first conductive particles 3
It pierces through the adhesive film 2 and the insulating layer 51 and is electrically connected with the shielded layer 52.
In the utility model implementation, by being equipped with the through-hole 11 through its upper and lower surface in conductor layer 1, be conducive to
Volatile matter when high temperature in adhesive film 2 is exhausted by the through-hole 11 of conductor layer 1, to avoid the volatilization of adhesive film 2 at high temperature
Object is difficult to be discharged, and causes to remove between free ground film and electromagnetic shielding film 5 so as to avoid the blistering layering of free ground film, into
And it ensures the ground connection of electromagnetic shielding film 5 and exports interference charge；In addition, when printed wiring board 6 is applied in electronic equipment, it can
To be electrically connected by free ground film with the shell of electronic equipment, so that the interference charge energy gathered on electromagnetic shielding film 5
It is enough to be exported by free ground film, in order to export interference charge via the shell of electronic equipment, and then further ensure electricity
Magnetic shield film 5 be grounded, thus by the interference charge gathered on electromagnetic shielding film 5 export, avoid interference charge accumulation and shape
The normal work of printed wiring board 6 is influenced at interference source.
In the utility model embodiment, the area of the through-hole 11 is preferably 0.01 μm2-1mm2.By by the through-hole
11 area is preferably 0.01 μm2-1mm2, to ensure the adhesive film 2, volatile matter can be by described in sufficiently large at high temperature
Through-hole 11 is vented, and is difficult to be discharged so as to avoid volatile matter in adhesive film 2 at high temperature, and then avoids free ground film blistering
Layering causes to remove between free ground film and electromagnetic shielding film 5, to ensure the ground connection of electromagnetic shielding film 5 and lead interference charge
Out.In addition, if the quantity of the through-hole 11 is too many, it is easy to cause the conductor layer 1 is discontinuous even to rupture, to influence dry
The flowing of charge is disturbed, it is therefore preferred that the number of the through-hole 11 in the conductor layer 1 every square centimeter is 5-106It is a.
5-10 is set as by the number of the through-hole 11 in the conductor layer 1 every square centimeter6It is a, to ensure the adhesive film
2 at high temperature volatile matter can be vented by enough through-holes 11, it is difficult to avoid volatile matter in adhesive film 2 at high temperature
It with discharge, causes to remove between free ground film and electromagnetic shielding film 5 so as to avoid the blistering layering of free ground film, and then really
It has protected the ground connection of electromagnetic shielding film 5 and has exported interference charge, meanwhile, the quantity of the through-hole 11 will not influence interference charge in institute
It states and is continuously flowed in conductor layer 1.Certainly, the area of the through-hole 11 and number are not limited to above-mentioned preferred scope, need to only meet institute
Stating the volatile matter that adhesive film 2 generates at high temperature can be vented by the through-hole 11, and the quantity of the through-hole 11 will not
It influences interference charge continuously to flow and export in the conductor layer 1, not will cause the conductor layer 1 more and rupture, In
This, which does not do, more repeats.
In the utility model embodiment, the through-hole 11 can be regularly or irregularly distributed in the conductor layer 1；
Wherein, the through-hole 11, which is regularly distributed in the conductor layer 1, refers to that each 11 shape of through-hole is identical and is evenly distributed in
In the conductor layer 1；The through-hole 11 be irregularly distributed in the conductor layer 1 refer to the different of each through-hole 11 and
It is disorderly distributed in the conductor layer 1.Preferably, the shape of each through-hole 11 is identical, and each through-hole 11 is evenly distributed on institute
It states in conductor layer 1.In addition, the through-hole 11 can be circular through hole 11, the through-hole 11 of other arbitrary shapes, this reality can also be
It is only that circular through hole 11 is illustrated, but the through-hole 11 of other any shapes is all with the through-hole 11 with novel attached drawing
It is within the protection scope of the utility model.
Preferably, first conductive particles 3 can be with the outer surface of the adhesive film 2 there are a certain distance, can also be with
The outer surface of the adhesive film 2 is in contact or extends the outer surface of the adhesive film 2.In addition, the outer surface of the adhesive film 2
It can be the flat surface without fluctuating, be also possible to the out-of-flatness surface gently to rise and fall.
In the utility model embodiment, first conductive particles 3 may include multiple, multiple first conductors
Grain 3 can regularly or irregularly be distributed in the conductor layer 1 in the one side of the adhesive film 2；Wherein, multiple described
One conductive particles 3 are regularly distributed over the conductor layer 1 and refer to multiple first conductors in the one side of the adhesive film 2
The shape of particle 3 is identical and is evenly distributed in the conductor layer 1 in the one side of the adhesive film 2；Multiple described first
Conductive particles 3 are irregularly distributed in the conductor layer 1 and refer to multiple first conductors in the one side of the adhesive film 2
Particle 3 different and the conductor layer 1 is disorderly distributed in the one side of the adhesive film 2.Preferably, Duo Gesuo
The shape for stating the first conductive particles 3 is identical, and multiple first conductive particles 3 are evenly distributed on the conductor layer 1 close to described
In the one side of adhesive film 2.
In specific implementation, it can be initially formed the conductor layer 1, then again by other techniques in the conductor layer 1
Form the first conductive particles 3.Certainly, the conductor layer 1 and first conductive particles 3 can also be through one-shot forming technique shape
At overall structure.In addition, the surface that on one side can be any shape of the conductor layer 1 far from the adhesive film 2, for example,
It can be flat surface, be also possible to contoured non-smooth surface or other rough surfaces.The utility model attached drawing is only with institute
It states conductor layer 1 to be illustrated far from the one side of the adhesive film 2 for flat surface, but other any shapes are all practical at this
Within novel protection scope.
It should be noted that the shape of first conductive particles 3 in Fig. 1, Fig. 3, Fig. 4 and Fig. 5 is only exemplary
, due to the difference on process means and parameter, first conductive particles 3 can also be cluster-shaped, extension ice-like, stalactite
The other shapes such as shape, dendroid.In addition, the first conductive particles 3 in the utility model are not illustrated and the limit of above-mentioned shape
System both is within the protection scope of the present invention as long as having the first conductive particles 3 of puncture and conducting function.
In the utility model embodiment, the highly preferred of first conductive particles 3 is 35 μm -100 μm, the glue film
The thickness of layer 22 is preferably 0.1 μm -80 μm, and the thickness of the insulating layer 51 is preferably 1 μm -20 μm.Pass through setting described first
The highly preferred of conductive particles 3 is 35 μm -100 μm, and the thickness of the adhesive film 22 is preferably 0.1 μm -80 μm, described to ensure
First conductive particles 3 can pierce through the insulating layer 51 of the adhesive film 22 and the electromagnetic shielding film 5, ensure that it is described from
The interference charge gathered on the electromagnetic shielding film 5 can be exported by ground film.In addition, the thickness of the conductor layer 1 is preferred
Be 0.01 μm -45 μm, with ensure the conductor layer 1 do not allow it is easily rupturable and have good flexibility.
2 material therefor of adhesive film is selected from following several: modified epoxy class, modified rubber class, changes acrylic compounds
Property thermoplastic polyimide class.It should be understood that in order to guarantee that the conductor layer 1 has good electric conductivity, the conductor layer 1
One of conductor layer, ferrite conductor layer and graphene conductor layer or a variety of are received including metal conductor layer, carbon.Wherein, described
Metal conductor layer includes monometallic conductor layer and/or alloy conductor layer；Wherein, the monometallic conductor layer by aluminium, titanium, zinc, iron,
Any one material in nickel, chromium, cobalt, copper, silver and gold is made, the alloy conductor layer by aluminium, titanium, zinc, iron, nickel, chromium, cobalt,
Two or more any material in copper, silver and gold is made.
It should be noted that the conductor layer 1 in the present embodiment can be single layer structure, or multilayered structure；The glue
Film layer 2 can be single layer structure, be also possible to multilayered structure；The conductor layer 1 and adhesive film 2 can be set to multiple.It is preferred that
Ground, when the conductor layer 1 and respectively multiple adhesive film 2, the conductor layer 1 and adhesive film 2 are successively spaced setting, for example,
When the conductor layer 1 and adhesive film 2 are respectively 2, putting in order can be with are as follows: 1, glue of a conductor layer
Film layer 2, another described conductor layer 1, another described adhesive film 2, and so on, it does not do more repeat herein；When described
When conductor layer 1 is multilayer, each layer conductor layer 1 can be equipped with the first of convex in the one side of the adhesive film 2 and lead
Body particle 3.In addition, the embodiment of the present invention conductor layer 1 may be configured as foaming shape etc. according to the needs of actual production and application,
It does not do and more repeats herein.
In the utility model embodiment, first conductive particles 3 include metallic particles, carbon nanotube particulate and iron oxygen
One of body particle is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the list
Metallic particles is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by
Two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.It should be noted that
First conductive particles 3 can be identical as the material of the conductor layer 1, can not also be identical.
In the utility model embodiment, in order to further ensure that the free ground film and the electromagnetic shielding film 5
The shielded layer 52 is electrically connected, and the adhesive film 2 in the present embodiment includes the adhesion layer containing conducting particles.Pass through the glue
Film layer 2 includes the adhesion layer containing conducting particles, to improve the conductive capability of the adhesive film 2, has thereby further ensured that institute
Free ground film is stated to be electrically connected with the shielded layer 52 of the electromagnetic shielding film 5.Certainly, the adhesive film 2 may include not
Adhesion layer containing conducting particles, to reduce the eddy-current loss of the wiring board with the free ground film, to ensure that transmission
Integrality, and the bending of wiring board can be improved while improving shield effectiveness.
It should be noted that the conducting particles can be the conducting particles being separated from each other, or made of reunion
Bulky grain conducting particles；When the conducting particles is the conducting particles being separated from each other, the adhesive film 2 can further improve
Earth-continuity；And when the bulky grain conducting particles made of the conducting particles is to reunite, puncture intensity can be increased.
In the utility model embodiment, the free ground film further includes antioxidation coating 4, and the antioxidation coating 4 is set to
In one side of the conductor layer 1 far from the adhesive film 2.The thickness range of the antioxidation coating 4, material, generation type can be with
It is any one following situation:
1. the antioxidation coating 4 with a thickness of 0.01-5 μm, preferably 0.1-1 μm；The antioxidation coating 4 is by metal material
Material, ferrite, graphite, carbon nanotube, graphene, any one material in silver paste are made, the metal material be aluminium,
Titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, gold, any one material in molybdenum are made, alternatively, the metal material be aluminium, titanium,
Zinc, iron, nickel, chromium, cobalt, copper, silver, gold, alloy made of two or more any material in molybdenum；The antioxidation coating
4 can be formed by one of chemical plating, PVD, CVD, evaporation plating, sputtering plating, plating or a variety of combination process；
2. the antioxidation coating 4 with a thickness of 0.1-5 μm, the antioxidation coating 4 by glue and conducting particles mixture system
At, and the volume ratio of conducting particles and glue is 5% to 80%；The antioxidation coating 4 can by coating after cured technique come
It is formed.
In the utility model embodiment, the antioxidation coating 4 can be saturating after pressing or printing with the adhesive film 2
The through-hole 11 is crossed to be in close contact, it is strong so as to effectively improve the removing between the antioxidation coating 4 and the conductor layer 1
Degree, i.e., be susceptible to remove between the described antioxidation coating 4 and the conductor layer 1.
In the utility model embodiment, in order to protect the free ground film, described in the present embodiment is freely grounded
Film further includes peelable protective film layer, and the peelable protective film layer is set to one side of the adhesive film 2 far from the conductor layer 1
On.By the way that the peelable protective film layer to be set in one side of the adhesive film 2 far from the conductor layer 1, described in protection
Free ground film can remove the peelable protective film layer when in use.
Referring to Fig. 4, the utility model embodiment also provides a kind of wiring board in order to solve identical technical problem, packet
The electromagnetic shielding film 5, the printed wiring board 6 and the free ground film are included, the electromagnetic shielding film 5 is set to the print
On brush wiring board 6, the electromagnetic shielding film 5 includes shielded layer 52 and insulating layer 51, and the insulating layer 51 is set to the shielded layer
On 52, the free ground film is pressed by the adhesive film 2 and 5 phase of electromagnetic shielding film, and first conductive particles 3 are pierced
It wears the adhesive film 2 and the insulating layer 51 and is electrically connected with the shielded layer 52.
In the utility model embodiment, the free ground film passes through the adhesive film 2 and 5 phase of electromagnetic shielding film
Pressing, first conductive particles 3 pierce through the adhesive film 2 and the insulating layer 51 and are electrically connected with shielded layer 52；When described
Wiring board is applied in electronic equipment, can be electrically connected by the free ground film with the shell of electronic equipment, so that
The interference charge of the electromagnetic shielding film 5 can be exported by the free ground film, in order to via the shell of electronic equipment
Export interference charge, the interference charge in the shielded layer 52 of the electromagnetic shielding film 5 is imported in ground, avoid to realize
The accumulation of interference charge and to form interference source influence the normal work of the wiring board.
Preferably, the printed wiring board 6 is flexible single-side plate, in flexibility double face plate, flexible multi-layer plate, rigid-flex combined board
One kind.
Referring to Fig. 4, the electromagnetic shielding film 5 is set to the printing in order to realize in the utility model embodiment
On wiring board 6, the electromagnetic shielding film 5 in the present embodiment can also include glue-line 53, and the glue-line 53 is set to the shielding
In 52 one side far from the insulating layer 51 of layer.Preferably, the glue-line 53 be conductive adhesive layer, and the conductive adhesive layer with it is described
The stratum of printed wiring board 6 is electrically connected.By the way that the conductive adhesive layer is electrically connected with the stratum of the printed wiring board 6, thus
It ensures that the shielded layer 52 and the stratum of the printed wiring board 6 are connect, and then further ensures that electromagnetic shielding film 5 is grounded
And it will interference charge export.
Referring to Fig. 5, in order to realize that the shielded layer 52 and the stratum of the printed wiring board 6 are electrically connected, the present embodiment
In the shielded layer 52 be equipped with the second conductive particles 7 close to the one side of the glue-line 53, second conductive particles 7 pierce through
The glue-line 53 is simultaneously electrically connected with the stratum of the printed wiring board 6.By in the shielded layer 52 close to the glue-line 53
It is equipped with the second conductive particles 7 on one side, so that the electromagnetic shielding film 5 and the printed wiring board 6 be in pressing, described the
Two conductive particles 7 can pierce through the glue-line 53, be grounded so that the shielded layer 52 be furthermore achieved, wherein described second
Conductive particles 7 may be the same or different with first conductive particles 3；In addition, the shielded layer 52 is close to the glue-line
53 one side can be flat surface or non-smooth surface, it is preferable that the shielded layer 52 is close to the one side of the glue-line 53
Non-smooth surface, to realize that the shielded layer 52 is grounded, only needs so that the shielded layer 52 can pierce through the glue-line 53
Meeting the shielded layer 52 can be electrically connected with the stratum of the printed circuit board, do not do more repeat herein.
Referring to Fig. 6, in order to solve identical technical problem, the utility model embodiment also provides a kind of free ground film
Preparation method, comprising the following steps:
S11 forms conductor layer 1；Wherein, the through-hole 11 of its upper and lower surface is formed through in the conductor layer 1, it is described to lead
The one side of body layer 1 is flat surface；
S12 forms the first conductive particles 3 of convex on the flat surface of the conductor layer 1；
S13 forms adhesive film 2 in the one side that the conductor layer 1 is formed with the first conductive particles 3；
When the free ground film is used for the ground connection of printed wiring board 6, electromagnetic shielding film 5 is equipped in printed wiring board 6,
The electromagnetic shielding film 5 includes shielded layer 52 and insulating layer 51, and the insulating layer 51 is set on the shielded layer 52, the freedom
Ground film is pressed by the adhesive film 2 and 5 phase of electromagnetic shielding film, and first conductive particles 3 pierce through the adhesive film 2
It is electrically connected with the insulating layer 51 and with the shielded layer 52.
In the utility model embodiment, the area of the through-hole 11 is preferably 0.01 μm2-1mm2.By by the through-hole
11 area is preferably 0.01 μm2-1mm2, to ensure the adhesive film 2, volatile matter can be by described in sufficiently large at high temperature
Through-hole 11 is vented, and is difficult to be discharged so as to avoid volatile matter in adhesive film 2 at high temperature, and then avoids free ground film blistering
Layering causes to remove between free ground film and electromagnetic shielding film 5, to ensure the ground connection of electromagnetic shielding film 5 and lead interference charge
Out.In addition, if the quantity of the through-hole 11 is too many, it is easy to cause the conductor layer 1 is discontinuous even to rupture, to influence dry
The flowing of charge is disturbed, it is therefore preferred that the number of the through-hole 11 in the conductor layer 1 every square centimeter is 5-106It is a.
5-10 is set as by the number of the through-hole 11 in the conductor layer 1 every square centimeter6It is a, to ensure the adhesive film
2 at high temperature volatile matter can be vented by enough through-holes 11, it is difficult to avoid volatile matter in adhesive film 2 at high temperature
It with discharge, causes to remove between free ground film and electromagnetic shielding film 5 so as to avoid the blistering layering of free ground film, and then really
It has protected the ground connection of electromagnetic shielding film 5 and has exported interference charge, meanwhile, the quantity of the through-hole 11 will not influence interference charge in institute
It states and is continuously flowed in conductor layer 1.Certainly, the area of the through-hole 11 and number are not limited to above-mentioned preferred scope, need to only meet institute
Stating the volatile matter that adhesive film 2 generates at high temperature can be vented by the through-hole 11, and the quantity of the through-hole 11 will not
It influences interference charge continuously to flow and export in the conductor layer 1, not will cause the conductor layer 1 more and rupture, In
This, which does not do, more repeats.
In the utility model embodiment, the through-hole 11 can be regularly or irregularly distributed in the conductor layer 1；
Wherein, the through-hole 11, which is regularly distributed in the conductor layer 1, refers to that each 11 shape of through-hole is identical and is evenly distributed in
In the conductor layer 1；The through-hole 11 be irregularly distributed in the conductor layer 1 refer to the different of each through-hole 11 and
It is disorderly distributed in the conductor layer 1.Preferably, the shape of each through-hole 11 is identical, and each through-hole 11 is evenly distributed on institute
It states in conductor layer 1.In addition, the through-hole 11 can be circular through hole 11, the through-hole 11 of other arbitrary shapes, this reality can also be
It is only that circular through hole 11 is illustrated, but the through-hole 11 of other any shapes is all with the through-hole 11 with novel attached drawing
It is within the protection scope of the utility model.
In the utility model embodiment, the step S11 is specifically included:
S21 forms antioxidation coating 4 on a carrier film；
S22 forms conductor layer 1 on the antioxidation coating 4；Wherein, the conductor layer 1 is far from the antioxidation coating 4
It is on one side flat surface；Physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation plating, sputtering can be passed through
One of plating, plating and mixing plating or kinds of processes form conductor layer 1 on the antioxidation coating 4；Or,
S31 forms conductor layer 1 on the strippable coating surface with carrier；Wherein, the conductor layer 1 is close to the band carrier
Strippable coating one side be flat surface；Can by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition,
One of evaporation plating, sputtering plating, plating and mixing plating or kinds of processes are formed on the strippable coating surface with carrier
Conductor layer 1；
S32 forms antioxidation coating 4 in the conductor layer 1；
S33 removes the strippable coating with carrier.
Specifically, the thickness range of the antioxidation coating 4, material, generation type can be any one following situation:
1. the antioxidation coating 4 with a thickness of 0.01-5 μm, preferably 0.1-1 μm；The antioxidation coating 4 is by metal material
Material, ferrite, graphite, carbon nanotube, graphene, any one material in silver paste are made, the metal material be aluminium,
Titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, gold, any one material in molybdenum are made, alternatively, the metal material be aluminium, titanium,
Zinc, iron, nickel, chromium, cobalt, copper, silver, gold, alloy made of two or more any material in molybdenum；The antioxidation coating
4 can be formed by one of chemical plating, PVD, CVD, evaporation plating, sputtering plating, plating or a variety of combination process；
2. the antioxidation coating 4 with a thickness of 0.1-5 μm, the antioxidation coating 4 by glue and conducting particles mixture system
At, and the volume ratio of conducting particles and glue is 5% to 80%；The antioxidation coating 4 can by coating after cured technique come
It is formed.
In the utility model embodiment, the antioxidation coating 4 can be saturating after pressing or printing with the adhesive film 2
The through-hole 11 is crossed to be in close contact, it is strong so as to effectively improve the removing between the antioxidation coating 4 and the conductor layer 1
Degree, i.e., be susceptible to remove between the described antioxidation coating 4 and the conductor layer 1.
In the utility model embodiment, the step S12 is specifically included:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
It closes one of plating or kinds of processes forms the first conductive particles 3 on the flat surface of the conductor layer 1.
In the step S13, adhesive film 2 is formed in the one side that the conductor layer 1 is formed with the first conductive particles 3,
Specifically:
S41 is coated with adhesive film 2 on release film；
The adhesive film 2 pressing is transferred to the conductor layer 1 and is formed in the one side of the first conductive particles 3 by S42；Or,
S51 is coated with adhesive film 2 in the one side that the conductor layer 1 is formed with the first conductive particles 3.
It can also include: the formation peelable protective film layer on the adhesive film 2 after the step S13.
To sum up, the utility model embodiment provides the preparation method of a kind of free ground film, wiring board and free ground film,
Wherein, free ground film includes conductor layer 1 and adhesive film 2, and adhesive film 2 is set in conductor layer 1；Conductor layer 1 is close to adhesive film 2
It is on one side flat surface, conductor layer 1 is equipped with the first conductive particles 3 of convex close to the one side of adhesive film 2, sets in conductor layer 1
There is the through-hole 11 through its upper and lower surface；By being equipped with the through-hole 11 through its upper and lower surface in conductor layer 1, be conducive in height
Volatile matter when warm in adhesive film 2 is exhausted by the through-hole 11 of conductor layer 1, to avoid 2 volatile matter of adhesive film at high temperature
It is difficult to be discharged, causes to remove between free ground film and electromagnetic shielding film 5 so as to avoid the blistering layering of free ground film, in turn
It ensures the ground connection of electromagnetic shielding film 5 and exports interference charge；In addition, when free ground film is used for the ground connection of printed wiring board 6,
Electromagnetic shielding film 5 is equipped in printed wiring board 6, electromagnetic shielding film 5 includes shielded layer 52 and insulating layer 51, and insulating layer 51 is set to
On shielded layer 52, free ground film is pressed by adhesive film 2 and 5 phase of electromagnetic shielding film, and the first conductive particles 3 pierce through adhesive film 2
It is electrically connected with insulating layer 51 and with shielded layer 52；When printed wiring board 6 is applied in electronic equipment, free ground film can be passed through
It is electrically connected with the shell of electronic equipment, so that the interference charge gathered on electromagnetic shielding film 5 can be by free ground film
Export in order to export interference charge via the shell of electronic equipment, and then further ensures that electromagnetic shielding film 5 is grounded, from
And export the interference charge gathered on electromagnetic shielding film 5, it avoids the accumulation of interference charge and forms interference source influence printing
The normal work of wiring board 6.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvement and replacement can also be made, these change
It also should be regarded as the protection scope of the utility model into replacement.
Claims (10)
1. a kind of free ground film, which is characterized in that including conductor layer and adhesive film, the adhesive film is set to the conductor layer
On；The conductor layer is equipped with the through-hole through its upper and lower surface, and the conductor layer is smooth close to the one side of the adhesive film
Surface, the conductor layer are equipped with the first conductive particles of convex close to the one side of the adhesive film；The free ground film is used
When the ground connection of printed wiring board, on a printed-wiring board be equipped with electromagnetic shielding film, the electromagnetic shielding film include shielded layer and
Insulating layer, the insulating layer are set on the shielded layer, and the free ground film passes through the adhesive film and the electromagnetic shielding
Film mutually presses, and first conductive particles pierce through the adhesive film and the insulating layer and are electrically connected with the shielded layer.
2. free ground film as described in claim 1, which is characterized in that the height of first conductive particles is 35 μm -100
μm。
3. free ground film as described in claim 1, which is characterized in that the conductor layer with a thickness of 0.01 μm -45 μm, institute
State adhesive film with a thickness of 0.1 μm -80 μm.
4. free ground film as described in any one of claims 1-3, which is characterized in that the adhesive film includes containing conductive particle
The adhesion layer of son；Or, the adhesive film includes the adhesion layer without conducting particles.
5. free ground film as described in any one of claims 1-3, which is characterized in that the free ground film further includes oxygen
Change layer, the antioxidation coating is set in one side of the conductor layer far from the adhesive film.
6. free ground film as described in any one of claims 1-3, the free ground film further includes peelable protective film layer,
The peelable protective film layer is set in one side of the adhesive film far from the conductor layer.
7. free ground film as described in any one of claims 1-3, which is characterized in that the area of the through-hole is 0.01 μm2-
1mm2。
8. free ground film as described in any one of claims 1-3, which is characterized in that in the conductor layer every square centimeter
The number of the through-hole is 5-106It is a.
9. a kind of wiring board, which is characterized in that including electromagnetic shielding film, printed wiring board and such as any one of claim 1-8
The free ground film, the electromagnetic shielding film are set in the printed wiring board, and the electromagnetic shielding film includes shielded layer
And insulating layer, the insulating layer are set on the shielded layer, the free ground film passes through the adhesive film and the electromagnetic screen
It covers film mutually to press, first conductive particles pierce through the adhesive film and the insulating layer and are electrically connected with the shielded layer.
10. wiring board as claimed in claim 9, which is characterized in that the electromagnetic shielding film further includes glue-line, and the glue-line is set
In in one side of the shielded layer far from the insulating layer, the shielded layer is equipped with the second conductor close to the one side of the glue-line
Particle, second conductive particles pierce through the glue-line and are electrically connected with the stratum of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821963114.6U CN209627808U (en) | 2018-11-26 | 2018-11-26 | Free ground film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821963114.6U CN209627808U (en) | 2018-11-26 | 2018-11-26 | Free ground film and wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209627808U true CN209627808U (en) | 2019-11-12 |
Family
ID=68444452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821963114.6U Active CN209627808U (en) | 2018-11-26 | 2018-11-26 | Free ground film and wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209627808U (en) |
-
2018
- 2018-11-26 CN CN201821963114.6U patent/CN209627808U/en active Active
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