CN209517682U - Multilager base plate - Google Patents
Multilager base plate Download PDFInfo
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- CN209517682U CN209517682U CN201790000881.4U CN201790000881U CN209517682U CN 209517682 U CN209517682 U CN 209517682U CN 201790000881 U CN201790000881 U CN 201790000881U CN 209517682 U CN209517682 U CN 209517682U
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- layer
- insulator layer
- base plate
- multilager base
- connecting portion
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- 239000010410 layer Substances 0.000 claims abstract description 338
- 239000012212 insulator Substances 0.000 claims abstract description 173
- 239000004020 conductor Substances 0.000 claims abstract description 170
- 239000011247 coating layer Substances 0.000 claims abstract description 35
- 238000010276 construction Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 33
- 230000005540 biological transmission Effects 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 32
- 238000004519 manufacturing process Methods 0.000 description 23
- 238000007747 plating Methods 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
A kind of multilager base plate is able to suppress and short circuit occurs in conductor interlayer.Multilager base plate is characterized in that having: having the green body for the construction for being laminated second insulator layer and first insulator layer towards another party side from a side side of stacking direction；It is arranged on the interarea of a side side of the stacking direction of first insulator layer and the first conductor layer comprising coating layer；And be arranged in the stacking direction of second insulator layer a side side interarea on the second conductor layer, first conductor layer includes first connecting portion and the first circuit portion, second conductor layer includes second connecting portion and second circuit portion, first connecting portion and second connecting portion are connected with each other, first circuit portion has repeat region Chong Die with second circuit portion when from stacking direction, the maximum gauge for the part connecting in first connecting portion with second connecting portion is greater than the maximum gauge of repeat region, the maximum gauge of the coating layer for the part connecting in first connecting portion with second connecting portion is greater than the maximum gauge of the coating layer of repeat region.
Description
Technical field
The utility model relates to multilager base plates, more particularly, to the multilayer base for having the conductor layer formed by plating
Plate.
Background technique
As previous invention relevant to multilager base plate, such as it has been known that there is planar coils documented by patent document 1.?
Have two layers of resin layer and two wirings in the planar coil.Two layers of resin layer is laminated along the vertical direction.Two wiring settings exist
In two layers of resin layer, and formed by plating.In addition, two are in swirl shape when being routed in from upside, and it is arranged and exists
In the region to overlap.Moreover, the center of two wirings is connected with each other.
Citation
Patent document
Patent document 1: Japanese Patent Publication No. 5839535
Utility model content
The utility model project to be solved
However, being routed through plating in the planar coil documented by patent document 1 and being formed.It is formed by plating
Wiring have biggish thickness.In addition, two are arranged in the region of coincidence when being routed in from upside.Therefore, two
The interval of the up and down direction of wiring becomes smaller, and may cause two wirings and short circuit occurs.
In this regard, the purpose of the utility model is to provide a kind of multilayers of the generation of short circuit for being able to suppress conductor interlayer
Substrate.
Means for solving the problems
The multilager base plate of the first method of the utility model is characterized in that the multilager base plate has: green body, is packet
The laminated body of multiple insulator layers including layer containing first insulator and second insulator layer has according to the second insulator layer
And the sequence of the first insulator layer by the second insulator layer and the first insulator layer from a side side direction of stacking direction
The construction that another party side is laminated；The one of the stacking direction of the first insulator layer is arranged in first conductor layer
It on the interarea of square side, and include coating layer；And second conductor layer, the stacking of the second insulator layer is set
On the interarea of the one side side in direction, first conductor layer includes the first of first connecting portion and the transmission path as signal
Circuit portion, second conductor layer include the second circuit portion of second connecting portion and the transmission path as signal, and described the
One interconnecting piece and the second connecting portion are connected with each other, and first circuit portion has when from the stacking direction and institute
The repeat region of second circuit portion overlapping is stated, the maximum for the part connecting in the first connecting portion with the second connecting portion is thick
Degree is greater than the maximum gauge of the repeat region, the plating for the part connecting in the first connecting portion with the second connecting portion
The maximum gauge of layer is greater than the maximum gauge of the coating layer of the repeat region.
The multilager base plate of the second method of the utility model is characterized in that the multilager base plate has: green body, is packet
The laminated body of multiple insulator layers including layer containing first insulator, second insulator layer and third insulator layer, have according to
The sequence of the second insulator layer, the third insulator layer and the first insulator layer is exhausted by the second insulator layer, the third
The construction that edge body layer and the first insulator layer are laminated from a side side of stacking direction towards another party side；First conductor
Layer, is arranged on the interarea of a side side of the stacking direction of the first insulator layer, and include coating layer；And
Second conductor layer is arranged on the interarea of another party side of the stacking direction of the second insulator layer, described first
Conductor layer includes the first circuit portion of first connecting portion and the transmission path as signal, and second conductor layer includes second
The second circuit portion of interconnecting piece and the transmission path as signal, the first connecting portion are mutually interconnected with the second connecting portion
It connects, first circuit portion has repeat region Chong Die with the second circuit portion when from the stacking direction, institute
The maximum gauge for stating the part connecting in first connecting portion with the second connecting portion is greater than the maximum gauge of the repeat region,
The maximum gauge of the coating layer for the part connecting in the first connecting portion with the second connecting portion is greater than the repeat region
Coating layer maximum gauge.
The effect of utility model
According to the utility model, it is able to suppress the generation of the short circuit of conductor interlayer.
Detailed description of the invention
Fig. 1 is the stereoscopic figure of multilager base plate 10,10a.
Fig. 2A is the exploded perspective view of multilager base plate 10.
Fig. 2 B be by multilager base plate 10 decompose after in the state of sectional structural map.
Fig. 3 is the figure from upside perspective multilager base plate 10.
Fig. 4 is the figure of the insulator layer 16 from upside.
Process cross-sectional view when Fig. 5 is the manufacture of multilager base plate 10.
Process cross-sectional view when Fig. 6 is the manufacture of multilager base plate 10.
Process cross-sectional view when Fig. 7 is the manufacture of multilager base plate 10.
Process cross-sectional view when Fig. 8 A is the manufacture of multilager base plate 10.
Process cross-sectional view when Fig. 8 B is the manufacture of multilager base plate 10.
Process cross-sectional view when Fig. 8 C is the manufacture of multilager base plate 10.
Fig. 9 is the figure of female insulator layer 116 from upside.
Figure 10 is the figure of female insulator layer 118 from upside.
Process cross-sectional view when Figure 11 is the manufacture of multilager base plate 10.
Figure 12 is the exploded perspective view of multilager base plate 10a.
Figure 13 be by multilager base plate 10a decompose after in the state of sectional structural map.
Process cross-sectional view when Figure 14 is the manufacture of multilager base plate 10a.
Process cross-sectional view when Figure 15 is the manufacture of multilager base plate 10a.
Figure 16 be by multilager base plate 10b decompose after in the state of sectional structural map.
Specific embodiment
Hereinafter, being carried out referring to attached drawing to the multilager base plate of the embodiments of the present invention and the manufacturing method of multilager base plate
Explanation.
(structure of multilager base plate)
Hereinafter, being illustrated referring to structure of the attached drawing to the multilager base plate of an embodiment.Fig. 1 is multilager base plate 10,10a
Stereoscopic figure.Fig. 2A is the exploded perspective view of multilager base plate 10.Fig. 2 B be by multilager base plate 10 decompose after in the state of
Sectional structural map.Fig. 3 is the figure from upside perspective multilager base plate 10.Conductor layer 50,52 is shown in Fig. 3.Fig. 4 is from upside
The figure of insulator layer 16.Hereinafter, the stacking direction of multilager base plate 10 is defined as up and down direction.In addition, will be more from upside
The direction definition that long side extends when laminar substrate 10 is left and right directions, by the direction that short side extends when multilager base plate 10 from upside
It is defined as front-rear direction.Up and down direction, left and right directions and front-rear direction are mutually orthogonal.In addition, up and down direction here, right and left
To and front-rear direction be an example, without consistent with the up and down direction when in use of multilager base plate 10, left and right directions and front-rear direction.
Multilager base plate 10 is in for electronic equipment portable phone.As shown in Figures 1 to 4, multilager base plate 10 has
Standby green body 12, external electrode 40,42, conductor layer 50,52 and via conductors v1~v6.
The tabular component in rectangular shape when being from upside of green body 12, and there is flexibility.The long side of green body 12 from
Upside extends in left-right direction when observing.The short side of green body 12 extends along the longitudinal direction when from upside.But green body 12
Shape as an example of, be not limited to illustrated by shape.
In addition, green body 12 includes that (insulator layer 16 is an example of first insulator layer to insulator layer 14,16,18,19, absolutely
Edge body layer 18 is an example of second insulator layer).Green body 12 have by insulator layer 19,18,16,14 from the upper side to the lower side (from
An example of the lateral another party side of one side of stacking direction) stack gradually made of laminated body construction.Insulator layer 14,16,18
Material be thermoplastic resin, e.g. liquid crystal polymer.The material of insulator layer 19 is, for example, epoxy resin (resist).But
It is as an example of the material of insulator layer 14,16,18,19, to be not limited to the material illustrated.
(side side of stacking direction is arranged on the upper surface of insulator layer 16 in conductor layer 50 (an example of the first conductor layer)
Interarea an example), as shown in Figure 2 B, include basal layer 50a and coating layer 50b.Basal layer 50a is directly formed at insulation
Conductor layer on the upper surface of body layer 16.In addition, the thickness of basal layer 50a is substantially uniform.Hereinafter, thickness refers to conductor
The thickness of the up and down direction of layer, insulator layer.The material of basal layer 50a is, for example, Cu.Coating layer 50b is arranged in basal layer
Conductor layer on 50a.Coating layer 50b is the conductor layer using basal layer 50a as basal electrode by plating growth.Coating layer
The material of 50b is, for example, Cu.But as an example of the material of basal layer 50a and coating layer 50b, it is not limited to the material illustrated.
In addition, as shown in Figure 2 A, conductor layer 50 includes circuit portion 20, interconnecting piece 24,26,28 and leading part 34,36,38.
Interconnecting piece 24,26,28 (an example of first connecting portion) has oblong-shaped when from upside, and along insulator layer 16
The short side in the left side of upper surface from front side towards rear side successively side by side.Leading part 34,36,38 connects with interconnecting piece 24,26,28 respectively
It connects, and when from upside, is drawn to the short side (an example of outer rim) in the left side of insulator layer 16.Leading part 34,36,38
It connect in the right end of leading part 34,36,38 with interconnecting piece 24,26,28, but is not led with other at position in addition to this respectively
Body connection.Therefore, leading part 34,36,38 is not the transmission path of signal.
Circuit portion 20 (an example of the first circuit portion) is the transmission path of signal, is one of the coil-conductor of composition coil
Point.But the structure (such as wiring) other than circuit portion 20 or coil.In addition, circuit portion 20 is conductor layer 50 and lead
Body layer 52 does not pass through the position of the interlayer connection conductors such as via conductors connection.Here, interconnecting piece 24,26,28 is also the biography of signal
Defeated path.In this regard, the difference of circuit portion 20 and interconnecting piece 24,26,28 is by whether to connect conductor layer 50 and conductor layer 52
The position that connects judges.
Circuit portion 20 is when from upside with shape made of cutting away a part of the ring of oblong-shaped.In more detail
For, conductor layer 50 is when from upside with the four edges parallel with the four edges of the upper surface of insulator layer 16.But
The first half of the short side in the left side of conductor layer 50 is cut off.Hereinafter, by the upstream side around direction counterclockwise of conductor layer 50
End be known as upstream end, the end in the downstream side around direction counterclockwise of conductor layer 50 is known as downstream.Conductor layer 50
Upstream end connect with interconnecting piece 24.The downstream of conductor layer 50 is connect with interconnecting piece 26.
Hereinafter, as shown in Figure 2 B, the part that circuit portion 20 is belonged in basal layer 50a is known as basal part 20a, by coating layer
The part for belonging to circuit portion 20 in 50b is known as plating portion 20b.The part point of interconnecting piece 24,26,28 will be belonged in basal layer 50a
Also known as be basal part 24a, 26a, 28a, by the part for belonging to interconnecting piece 24,26,28 in coating layer 50b be known as plating portion 24b,
26b,28b.The part for belonging to leading part 34,36,38 in basal layer 50a is known as basal part 34a, 36a, 38a, by coating layer
The part for belonging to leading part 34,36,38 in 50b is known as plating portion 34b, 36b, 38b.But in fig. 2b, basal part 34a,
38a and plating portion 34b, 38b are not shown.
(side side of stacking direction is arranged on the upper surface of insulator layer 18 in conductor layer 52 (an example of the second conductor layer)
Interarea an example), it is different from conductor layer 50, have monolayer constructions.Therefore, conductor layer 52 is directly formed at insulator layer 16
Upper surface on conductor layer.Therefore, the thickness of conductor layer 52 is less than the thickness of conductor layer 50, more precisely, is less than conductor
The minimum thickness of layer 50.In addition, the thickness of conductor layer 52 is substantially uniform.The material of conductor layer 52 is, for example, Cu.But
Conductor layer 52 can also have double-layer structural in the same manner as conductor layer 50.In addition, not limiting to as an example of the material of conductor layer 52
In the material of illustration.
In addition, conductor layer 52 includes circuit portion 22 and interconnecting piece 30,32.Interconnecting piece 30,32 (an example of second connecting portion)
There is oblong-shaped when from upside, and along the short side in the left side of the upper surface of insulator layer 18 from front side towards rear side
Successively side by side.In addition, interconnecting piece 30,32 is respectively in Shi Yiyu interconnecting piece 26,28 consistent state overlappings from upside.
Circuit portion 22 (an example in second circuit portion) is the transmission path of signal, is one of the coil-conductor of composition coil
Point.But circuit portion 22 is also possible to the structure (such as wiring) other than coil.In addition, circuit portion 22 is conductor layer 50 and lead
Body layer 52 does not pass through the position of the interlayer connection conductors such as via conductors connection.Here, interconnecting piece 30,32 is also the transmission road of signal
Diameter.In this regard, circuit portion 22 is the position by whether for conductor layer 50 to be connect with conductor layer 52 with the difference of interconnecting piece 30,32
And judge.
Circuit portion 22 is when from upside with shape made of cutting away a part of the ring of oblong-shaped.In more detail
For, conductor layer 52 is when from upside with the four edges parallel with the four edges of the upper surface of insulator layer 18.But
The latter half of the short side in the left side of conductor layer 52 is cut off.Hereinafter, by the upstream side around direction counterclockwise of conductor layer 52
End be known as upstream end, the end in the downstream side around direction counterclockwise of conductor layer 52 is known as downstream.Conductor layer 52
Upstream end connect with interconnecting piece 30.The downstream of conductor layer 52 is connect with interconnecting piece 32.
External electrode 40,42 is arranged on the lower surface of insulator layer 14, has oblong-shaped when from downside.Outside
The corner of the left front of the lower surface of insulator layer 14 is arranged in portion's electrode 40 when from downside.External electrode 42 is under
The corner of the left back of the lower surface of insulator layer 14 is arranged in side when observing.External electrode 40 when from upside with connect
Portion 24 is overlapped.External electrode 42 is Chong Die with interconnecting piece 28,32 when from upside.The material of external electrode 40,42 is, for example,
Cu.Alternatively, it is also possible to implement Ni plating, Sn plating on the surface of external electrode 40,42.But the material of external electrode 40,42
As an example of, it is not limited to the material illustrated.
Via conductors v1 runs through insulator layer 16 along the vertical direction.Via conductors v5 runs through insulator layer along the vertical direction
14.Interconnecting piece 24 is connect by via conductors v1, v5 and being continuously connected with external electrode 40.Via conductors v2 is vertically square
To insulator layer 18 is run through, interconnecting piece 26 is connect with interconnecting piece 30.Via conductors v3 runs through insulator layer 18 along the vertical direction,
Interconnecting piece 28 is connect with interconnecting piece 32.Via conductors v4 runs through insulator layer 16 along the vertical direction.Via conductors v6 is vertically
Insulator layer 14 is run through in direction.Interconnecting piece 28 is connect by via conductors v4, v6 and being continuously connected with external electrode 42.Such as
Above such, conductor layer 50 is connected with each other in interconnecting piece 26,30 via via conductors v2 with conductor layer 52, and is being connected
Portion 28,32 is connected with each other via via conductors v3.In addition, interconnecting piece 26 is connect with interconnecting piece 30 by via conductors v2,
To which circuit portion 20 be connect in an electrically connected manner with circuit portion 22.Circuit portion 20,22 as a result, interconnecting piece 26,30 and through-hole
Conductor v2 constitutes spiral helicine coil.The material of via conductors v1~v6 is, for example, Cu, Sn, Ag etc..Via conductors v1~v6's
As an example of material, it is not limited to the material illustrated.
Here, referring to Fig. 3 and Fig. 4, circuit portion 20 and the positional relationship of circuit portion 22 are further described in detail.?
When from upside, circuit portion 20 is overlapped at the part for being applied with cross-hauling of Fig. 3 with circuit portion 22.Specifically,
When from upside, long side of the circuit portion 20 with circuit portion 22 in the long side of front side, the short side on right side and rear side is overlapped.This
Outside, when from upside, circuit portion 20 and circuit portion 22 are near the downstream of circuit portion 20 and the upstream end of circuit portion 22
Nearby also it is overlapped.Hereinafter, part be overlapped with circuit portion 22 in circuit portion 20 when from from upside is referred to as repeat region 80.
Therefore, circuit portion 20 has repeat region 80.
In addition, as shown in Figure 2 B, the part connecting in interconnecting piece 26,28 with interconnecting piece 30,32 is (that is, interconnecting piece 26,28
In the part that is connect with via conductors v2, v3) and the maximum gauge of leading part 36,38 be greater than the maximum gauge of repeat region 80.
In the present embodiment, as shown in Figure 2 B, the part that is connect in interconnecting piece 26,28 with interconnecting piece 30,32 and leading part 36,38
Maximum gauge is greater than the maximum gauge of circuit portion 20.Via conductors v2, v3 are connected separately in interconnecting piece 26,28.But it is logical
Hole conductor v2, v3 are the structures different from interconnecting piece 26,28.Therefore, the portion being connect in interconnecting piece 26,28 with interconnecting piece 30,32
The thickness divided refers in the lower surface of the upper surface from insulator layer 16 to insulator layer 18 (that is, under via conductors v2, v3
End) between existing conductor layer thickness, maximum gauge refers to the maximum thickness in the thickness.
In addition, the maximum gauge of interconnecting piece 26,28 is greater than maximum gauge (the especially thickness of repeat region 80 of circuit portion 20
Degree).That is, thickness of the thickness of the part other than the part being connect in interconnecting piece 26,28 with interconnecting piece 30,32 also greater than circuit portion 20
It spends (the especially thickness of repeat region 80).In addition, the thickness of leading part 36,38 is greater than the thickness of interconnecting piece 26,28.In this way,
In multilager base plate 10, the thickness of conductor layer 50 is reduced with from left side towards right side.
In addition, as shown in Figure 2 B, the maximum gauge of interconnecting piece 24 and leading part 34 is greater than the maximum gauge of circuit portion 20
(the especially thickness of repeat region 80).In addition, the maximum gauge of leading part 34 is greater than the maximum gauge of interconnecting piece 24.
(manufacturing method of multilager base plate)
Hereinafter, being illustrated referring to manufacturing method of the attached drawing to multilager base plate 10.Fig. 5 to Fig. 8 C and Figure 11 is multilager base plate
Process cross-sectional view when 10 manufacture.Fig. 9 is the figure of female insulator layer 116 from upside.Figure 10 is female exhausted from upside
The figure of edge body layer 118.
Firstly, as shown in figure 5, preparing to be made of the liquid crystal polymer of the Cu foil 152 for the entire surface for having covering upper surface
Female insulator layer 118 an example of insulator layer (second female).Hereinafter, female insulator layer refers to, arrangement when from upside
Large-sized insulator layer made of multiple insulator layers.Cu foil 152 for example can be by the way that the metal foil of relatively thin Cu to be pasted on
The upper surface of female insulator layer 118 and formed, can also be by being formed on the upper surface of female insulator layer 118 by plating etc.
The metal film of Cu and formed.It should be noted that the metal other than Cu can also be formed on the upper surface of female insulator layer 118
Film, metal foil.
Then, as shown in Fig. 6 and Figure 10, multiple lead is formed on the upper surface of female insulator layer 118 by photo-mask process
Body layer 52 (an examples of multiple second conductor layers).Specifically, printing shape identical with conductor layer 52 on Cu foil 152
Resist.Then, etching process is implemented to Cu foil 152, removes the Cu foil 152 for the part not being covered by resist as a result,.It
Afterwards, resist is removed.As a result, as shown in Figure 10, ten conductor layers 52 are formed on the upper surface of female insulator layer 118.Three
Conductor layer 52 be arranged as along the rear side of female insulator layer 118 short side in the lateral direction side by side.In addition, three conductor layers 52
Be arranged as along the front side of female insulator layer 118 short side in the lateral direction side by side.In addition, two conductor layers 52 are arranged as edge
The right side of female insulator layer 118 long side in the longitudinal direction side by side.In addition, two conductor layers 52 are arranged as insulating along mother
The long side in the left side of body layer 118 is in the longitudinal direction side by side.At this point, ten conductor layers 52 are arranged as, interconnecting piece 30,32 is (multiple
An example of second connecting portion) it is located near the outer rim of female insulator layer 118 compared with circuit portion 22.
Then, as shown in fig. 7, forming via conductors v2, v3 in female insulator layer 118, (via conductors v3 does not scheme in Fig. 7
Show, be an example of multiple interlayer interconnecting pieces).Specifically, to the lower surface of female insulator layer 118 formed via conductors v2,
Laser beam is irradiated in the position of v3, forms through-hole.Later, it fills to through-hole using Cu as the conductive paste of principal component.
Then, as shown in Figure 8 A, prepare the liquid crystal polymer structure of the Cu foil 150 of the entire surface by having covering upper surface
At female insulator layer 116 an example of insulator layer (first female).Cu foil 150 for example can be by by the metal of relatively thin Cu
Foil is pasted on the upper surface of female insulator layer 116 and is formed, can also by by plating etc. in the upper surface of female insulator layer 116
It is upper formed Cu metal film and formed.It should be noted that can also be formed other than Cu on the upper surface of female insulator layer 118
Metal film, metal foil.
Then, as shown in Fig. 8 B and Fig. 9, multiple bases are formed on the upper surface of female insulator layer 116 by photo-mask process
Bottom 50a.Specifically, printing the resist of shape identical with basal layer 50a on Cu foil 150.Then, to Cu foil 150
Implement etching process, removes the Cu foil 150 for the part not being covered by resist as a result,.Later, resist is removed.As a result, as schemed
Shown in 9, ten basal layer 50a are formed on the upper surface of female insulator layer 116.Three basal layer 50a are arranged as along female exhausted
The short side of the rear side of edge body layer 116 is in the lateral direction side by side.In addition, three basal layer 50a are arranged as along female insulator layer
The short side of 116 front side is in the lateral direction side by side.In addition, two basal layer 50a are arranged as the right side along female insulator layer 116
The long side of side is in the longitudinal direction side by side.In addition, two basal layer 50a are arranged as the length in the left side along female insulator layer 116
Side is in the longitudinal direction side by side.At this point, ten conductor layers are arranged as, interconnecting piece 24,26,28 (an examples of multiple first connecting portions)
Basal part 24a, 26a, 28a be located near the outer rim of female insulator layer 116 compared with the basal part 20a of circuit portion 20.This
Outside, as shown in figure 9, multiple basal layer 50a include leading part 160a.Leading part 160a is arranged in multiple interconnecting pieces 24,26,28
Basal part 24a, 26a, 28a and female insulator layer 116 outer rim between, there is the length of the outer rim along female insulator layer 116
Square shape.
Then, via conductors v1, v4 are formed in female insulator layer 116.Specifically, under female insulator layer 116
Laser beam is irradiated in the position that surface forms via conductors v1, v4, forms through-hole.Later, it fills to through-hole using Cu as principal component
Conductive paste.
Then, as shown in Figure 8 C, using basal layer 50a as basal electrode, pass through plating (that is, implementing plating) shape
At using Cu as the coating layer 50b of material.At this point, being powered via leading part 160a (in Fig. 8 C not shown).As a result, in mother
Multiple conductor layers 50 (an examples of multiple first conductor layers) comprising coating layer 50b are formed on the upper surface of insulator layer 116.Separately
Outside, form relatively thick coating layer 50b with the relatively near part leading part 160a in conductor layer 50, in conductor layer 50 with draw
Line portion 160a relatively remote part forms relatively thin coating layer 50b.The thickness of leading part 34,36,38 is maximum as a result, circuit
The thickness in portion 20 is minimum.
It should be noted that in order to make interconnecting piece 24,26,28 thickness and leading part 34,36,38 thickness be greater than electricity
The thickness in road portion 20 can also carry out plating in the state of being applied with mask on the basal part 20a to circuit portion 20.It
Afterwards, mask is removed, carries out plating again.The thickness of plating portion 24b, 26b, 28b, 34b, 36b, 38b is greater than plating as a result,
The thickness of portion 20b.
Then, external electrode 40,42 and via conductors v5, v6 are formed in female insulator layer 114.But external electrode 40,
42 and via conductors v5, v6 formation process it is identical as conductor layer 52 and via conductors v2, v3, therefore, omit further
It is bright.
Then, as shown in figure 11, female insulator layer 118,116,114 is stacked gradually from the upper side to the lower side, implements heating
Processing and pressurized treatments and they are crimped.Female insulator layer 114,116,118 is softened by heat treatment as a result,.It
Afterwards, female insulator layer 114,116,118 is solidified by cooling, is thus interconnected.In addition, the conductive paste in through-hole is logical
It crosses heating and solidifies, form via conductors v1~v6.
Then, it applies epoxy resin and forms insulator layer 19, so that the upper table of covering conductor layer 52 and insulator layer 18
Face.Female green body 112 is formed as a result,.
Finally, being cut to female green body 112 and forming multiple green bodies 12.At this point, when from upside, by mother
The outer rim of green body 112 is nearby cut and is cut away the leading part of oblong-shaped.Process more than, multilager base plate 10 are complete
At.
(effect)
According to the multilager base plate 10 constituted as described above, the short circuit being able to suppress between conductor layer 50 and conductor layer 52
Generation.The part more specifically, as shown in Figure 2 B, being connect in interconnecting piece 26,28 with interconnecting piece 30,32 and leading part 36,
38 maximum gauge is greater than the maximum gauge of repeat region 80.In other words, repeat region 80 forms relatively thin.Thus, it is suppressed that
The interval too small of circuit portion 20 and circuit portion 22, it is suppressed that short circuit occurs between circuit portion 20 and circuit portion 22.
In addition, the connection reliability of conductor layer 50 and conductor layer 52 improves according to multilager base plate 10.More specifically, such as
Shown in Fig. 2 B, the maximum gauge of the part and leading part 36,38 that connect in interconnecting piece 26,28 with interconnecting piece 30,32, which is greater than, to be repeated
The maximum gauge in region 80.In other words, the part connecting in interconnecting piece 26,28 with interconnecting piece 30,32 forms thicker.As a result,
In the crimping process shown in Figure 11, before circuit portion 20 and the following table face contact of insulator layer 18, via conductors v2, v3
Lower end can be contacted with interconnecting piece 26,28.Therefore, via conductors v2, v3 and interconnecting piece 26,28 are applied for a long time larger
Pressure.As a result, connecting via conductors v2, v3 and interconnecting piece 26,28 more reliably respectively.By the above, according to
The connection reliability of multilager base plate 10, conductor layer 50 and conductor layer 52 improves.
In addition, according to the manufacturing method of multilager base plate 10, the thickness and leading part 36,38 of interconnecting piece 26,28 can be made
Thickness is greater than the thickness of circuit portion 20.More specifically, using basal layer 50a as basal electrode, by plating (that is, implementing to plate
Cover processing) and formed using Cu as the coating layer 50b of material.At this point, being powered via leading part 160a.In conductor layer 50 with
The relatively near part leading part 160a forms relatively thick coating layer 50b, opposite with leading part 160a remote in conductor layer 50
Part forms relatively thin coating layer 50b.The thickness of leading part 36,38 is maximum as a result, and the thickness of circuit portion 20 is minimum.It is tied
Fruit is, according to the manufacturing method of multilager base plate 10, can to make the maximum gauge of interconnecting piece 26,28 and the maximum of leading part 36,38
Thickness is greater than the maximum gauge of circuit portion 20.
(first variation)
Hereinafter, being said referring to manufacturing method of the attached drawing to the multilager base plate 10a and multilager base plate 10a of first variation
It is bright.Figure 12 is the exploded perspective view of multilager base plate 10a.Figure 13 be by multilager base plate 10a decompose after in the state of profile construction
Figure.
Multilager base plate 10a be also equipped with 200,202,204 this point of insulator layer and conductor layer 52 setting insulating
This point is different from multilager base plate 10 on the lower surface of body layer 18.Hereinafter, centered on this difference to multilager base plate 10a into
Row explanation.
The conductor layer 52 of multilager base plate 10a is arranged on the lower surface of insulator layer 18, and has and multilager base plate 10
The identical shape of conductor layer 52.But the conductor layer 52 of multilager base plate 10a have include basal layer 52a's and coating layer 52b
Double-layer structural.In addition, conductor layer 52 also includes leading part 336,338.Leading part 336,338 is connect with interconnecting piece 30,32 respectively,
And it is drawn to the short side in the left side of the lower surface of insulator layer 18.In addition, hereinafter, will be when from from upside in circuit portion 22
The part Chong Die with circuit portion 20 is known as repeat region 380.Therefore, circuit portion 22 has repeat region 380.Repeat region 80
With shape identical with repeat region 80.
In addition, as shown in figure 13, the part connecting in interconnecting piece 30,32 with interconnecting piece 26,28 is (that is, interconnecting piece 30,32
In the part that is connect with conductive adhesive material 206,208) and the maximum gauge of leading part 336,338 be greater than repeat region 380
Maximum gauge.In the present embodiment, as shown in figure 13, the part that is connect in interconnecting piece 30,32 with interconnecting piece 26,28 and draw
The maximum gauge in line portion 336,338 is greater than the maximum gauge of circuit portion 22.
In addition, the maximum gauge of interconnecting piece 30,32 is greater than maximum gauge (the especially repeat region 380 of circuit portion 22
Thickness).That is, the thickness of the part other than the part connecting in interconnecting piece 30,32 with interconnecting piece 26,28 is also greater than circuit portion 22
Thickness (the especially thickness of repeat region 380).In addition, the thickness of leading part 336,338 is greater than the thickness of interconnecting piece 30,32.
In this way, the thickness of conductor layer 52 is reduced with from left side towards right side in multilager base plate 10a.
The green body 12 of multilager base plate 10a includes that (insulator layer 200 is third to insulator layer 14,16,18,200,202,204
An example of insulator layer).Green body 12 has insulator layer 18,202,204,200,16,14 from upside towards downside successively layer
It is constructed made of folded.
Insulator layer 202 is set as upper surface and the conductor layer 52 of covering insulator layer 18.But as shown in figure 13, even
Socket part 30,32 is exposed from the lower surface of insulator layer 202.
Insulator layer 200 is set as lower surface and the conductor layer 50 of covering insulator layer 16.But as shown in figure 13, even
Socket part 24,26,28 is exposed from the upper surface of insulator layer 200.The material of insulator layer 200,202 is, for example, epoxy resin.
Insulator layer 204 is for will be provided with the insulator layer 16 of insulator layer 200 and be provided with insulator layer 202
The adhesive layer that insulator layer 18 bonds.The material of insulator layer 204 is, for example, epoxy resin.
In addition, multilager base plate 10a is also equipped with conductive adhesive material 206,208.Conductive adhesive material 206 is vertically square
To run through insulator layer 204, it is Chong Die with interconnecting piece 26,30 when from upside.Conductive adhesive material 206 will be even as a result,
Socket part 26 is connect with interconnecting piece 30.Conductive adhesive material 208 runs through insulator layer 204 along the vertical direction, from upside
When it is Chong Die with interconnecting piece 28,32.Interconnecting piece 28 is connect by conductive adhesive material 208 with interconnecting piece 32 as a result,.Electric conductivity is viscous
Condensation material 206,208 is for example with the construction for having dispersed metallic particles in resin.As conductive adhesive material 206,208,
Such as be able to use anisotropic conductive film etc..The other structures of multilager base plate 10a are identical as multilager base plate 10, therefore omit
Explanation.
Then, it is illustrated referring to manufacturing method of the attached drawing to multilager base plate 10a.Figure 14 and Figure 15 is multilager base plate 10a
Manufacture when process cross-sectional view.
About the process for forming conductor layer 50 on the upper surface of female insulator layer 116, with the manufacture in multilager base plate 10
The process carried out in method using Fig. 8 A to Fig. 8 C is identical, and and the description is omitted.
Then, as shown in figure 14, epoxy resin is applied on the surface of female insulator layer 116, forms female insulator layer
200'.At this point, applying epoxy resin thick and solidly, it is embedded in conductor layer 50 in female insulator layer 200 '.That is, the thickness of epoxy resin
Degree is greater than the thickness of conductor layer 50.
Then, as shown in figure 15, by CMP (Chemical Mechanical Polishing, chemically mechanical polishing),
A part of female insulator layer 200 ' is removed, interconnecting piece 24,26,28 and leading part 34,36,38 is made to insulate from mother by ashing etc.
Expose the upper surface of body layer 200 '.
Then, by process identical with Fig. 8 A to Fig. 8 C repeatedly, conductor is formed on the lower surface of female insulator layer 118
Layer 52.In addition, female insulator layer 202 ' is formed in female insulator layer 118 by process identical with Figure 14 and Figure 15 repeatedly
Lower surface on.
Then, external electrode 40,42 and via conductors v5, v6 are formed in female insulator layer 114.In multilager base plate 10a
The formation process of external electrode 40,42 and via conductors v5, v6 are identical as these formation process of multilager base plate 10, therefore omit
Explanation.
Then, female insulator layer 114 and female insulator layer 116 are laminated, implement heat treatment and pressurized treatments and by it
Crimp.Female insulator layer 114 is integrated with female insulator layer 116 as a result,.
Then, as shown in figure 13, by female insulator layer 118,202 ', 204 ', 200 ', 116,114 from upside towards downside
It stacks gradually, implements heat treatment and pressurized treatments.Female green body 112 is formed as a result,.It should be noted that one can also be passed through
Secondary crimping process makes female 118,202 ', 204 ', 200 ', 116,114 integration of insulator layer.
Finally, being cut to female green body 112 and forming multiple green bodies 12.At this point, when from upside, by mother
The outer rim of green body 112 is nearby cut and is cut away the leading part of oblong-shaped.Process more than, multilager base plate 10a
It completes.
(effect)
According to the multilager base plate 10a constituted as described above, inhibited in the same manner as multilager base plate 10 circuit portion 20 with
Short circuit occurs between circuit portion 22.In addition, according to multilager base plate 10a, in the same manner as multilager base plate 10, conductor layer 50 and conductor layer
52 connection reliability improves.
In addition, interconnecting piece 26,28 can be made in the same manner as multilager base plate 10 according to the manufacturing method of multilager base plate 10a
The maximum gauge of maximum gauge and leading part 36,38 is greater than the maximum gauge of circuit portion 20.In addition, according to the system of multilager base plate 10
Method is made, the thickness of the thickness and leading part 336,338 that can make interconnecting piece 30,32 is greater than the thickness of circuit portion 22.
It should be noted that may be not wrap either in conductor layer 50 or conductor layer 52 in multilager base plate 10a
Containing coating layer and with the conductor layer of uniform thickness.
In addition, insulator layer 204 can utilized to fully ensure circuit portion 20 and circuit portion in multilager base plate 10a
In the case where 22 insulation, either in no setting is required insulator layer 200,202 or both sides.
In addition, in the feelings that insulator layer 200,202 can be utilized to fully ensure circuit portion 20 with the insulation of circuit portion 22
Under condition, no setting is required insulator layer 204.In this case, interconnecting piece 26,28 is directly engaged with interconnecting piece 30,32.
(the second variation)
Hereinafter, being illustrated referring to multilager base plate 10b of the attached drawing to the second variation.Figure 16 is by multilager base plate 10b points
Sectional structural map in the state of after solution.
Multilager base plate 10b is being also equipped with insulator layer 402 and 450 this point of conductor layer is different from multilager base plate 10.With
Under, multilager base plate 10b is illustrated centered on this difference.
Insulator layer 402 is layered between insulator layer 14 and insulator layer 16.The material of insulator layer 402 is thermoplastic
Property resin, e.g. liquid crystal polymer.
Conductor layer 450 is arranged on the surface of insulator layer 402, has double comprising basal layer 450a and coating layer 450b
Layer construction.In addition, conductor layer 450 includes circuit portion 420, interconnecting piece 426 and leading part 436.
Circuit portion 420 is the transmission path of signal, is coil.In addition, interconnecting piece 426 via via conductors v100 and with lead
The interconnecting piece 26 ' of body layer 50 connects.Leading part 436 is connect with interconnecting piece 426, and to the right side of the lower surface of insulator layer 402
The short side of side is drawn.In addition, hereinafter, part be overlapped with circuit portion 22 in circuit portion 420 when from from upside is known as weight
Multiple region 480.Therefore, circuit portion 420 has repeat region 480.
In addition, as shown in figure 16, the part that is connect in interconnecting piece 426 with interconnecting piece 26 ' (that is, in interconnecting piece 426 with through-hole
The part of conductor v100 connection) and leading part 436 maximum gauge be greater than repeat region 480 maximum gauge.In this embodiment party
In formula, as shown in figure 16, the maximum gauge of the part and leading part 436 that connect in interconnecting piece 426 with interconnecting piece 26 ' is greater than electricity
The maximum gauge in road portion 420.
According to the multilager base plate 10b constituted as described above, inhibited in the same manner as multilager base plate 10 circuit portion 20 with
Short circuit occurs between circuit portion 22, and inhibits and short circuit occurs between circuit portion 22 and circuit portion 420.In addition, according to more
Laminar substrate 10b, in the same manner as multilager base plate 10, the connection reliability of conductor layer 50 and conductor layer 52 is improved, and conductor layer 50
It is improved with the connection reliability of conductor layer 450.
(other embodiments)
The multilager base plate of the utility model and the manufacturing method of multilager base plate be not limited to multilager base plate 10,10a, 10b and
The manufacturing method of multilager base plate 10,10a, 10b is able to carry out change within the scope of its subject matter.
It should be noted that multilager base plate 10,10a, 10b and multilager base plate 10,10a, 10b can also be combined arbitrarily
Manufacturing method structure.
It should be noted that conductor layer 50,52 also can have the swirl shape around multi-turn when from upside.At this
In specification, spiral-shaped is the concept comprising three-dimensional spiral-shaped and two-dimensional swirl shape.
It should be noted that also can replace via conductors v1~v6, v100 and use and implement plating in through hole
Via hole.
It should be noted that female insulator layer 116 shown in Fig. 9 can also be not provided with leading part 160a.In the situation
Under, basal part 24a, 26a, 28a are subjected to electroplating processes as starting point.
Industrial availability
As described above, the utility model is useful in multilager base plate, is especially inhibiting the generation of conductor interlayer short
Road this point is excellent.
Description of symbols:
10,10a, 10b: multilager base plate；
12: green body；
14,16,18,19,200,202,204,402: insulator layer；
20,22,420: circuit portion；
24,26,26 ', 28,30,32,426: interconnecting piece；
34,36,38,160a, 336,338,436: leading part；
40,42: external electrode；
50,52,450: conductor layer；
50a, 52a, 450a: basal layer；
50b, 52b, 450b: coating layer；
80,380,480: repeat region；
112: female green body；
114,116,118,200 ', 202 ', 204 ': female insulator layer；
206,208: conductive adhesive material；
V1~v6, v100: via conductors.
Claims (10)
1. a kind of multilager base plate, which is characterized in that
The multilager base plate has:
Green body is the laminated body comprising multiple insulator layers including first insulator layer and second insulator layer, has and press
According to the sequence of the second insulator layer and the first insulator layer by the second insulator layer and the first insulator layer from stacking
The construction that the one side side in direction is laminated towards another party side；
First conductor layer is arranged on the interarea of a side side of the stacking direction of the first insulator layer, and wraps
Containing coating layer；And
Second conductor layer is arranged on the interarea of a side side of the stacking direction of the second insulator layer,
First conductor layer includes the first circuit portion of first connecting portion and the transmission path as signal,
Second conductor layer includes the second circuit portion of second connecting portion and the transmission path as signal,
The first connecting portion and the second connecting portion are connected with each other,
First circuit portion has repeat region Chong Die with the second circuit portion when from the stacking direction,
The maximum gauge for the part connecting in the first connecting portion with the second connecting portion is greater than the repeat region most
Big thickness,
The maximum gauge of the coating layer for the part connecting in the first connecting portion with the second connecting portion is greater than the repetition
The maximum gauge of the coating layer in region.
2. multilager base plate according to claim 1, which is characterized in that
First conductor layer also includes leading part, which connect with the first connecting portion, and from the stacking
It is drawn when direction is observed to the outer rim of the first insulator layer,
The thickness of the leading part is greater than the thickness of the repeat region.
3. multilager base plate according to claim 1, which is characterized in that
First conductor layer also includes base conductor, which is arranged in the stacking side of the first insulator layer
To a side side interarea on,
The coating layer is arranged on the base conductor.
4. multilager base plate according to claim 1, which is characterized in that
First circuit portion and the second circuit portion are a part of coil respectively.
5. multilager base plate according to any one of claim 1 to 4, which is characterized in that
The material of the second insulator layer is thermoplastic resin.
6. a kind of multilager base plate, which is characterized in that
The multilager base plate has:
Green body is comprising multiple insulator layers including first insulator layer, second insulator layer and third insulator layer
Laminated body, have according to the second insulator layer, the third insulator layer and the first insulator layer sequence by this second absolutely
Edge body layer, the third insulator layer and the first insulator layer are laminated from a side side of stacking direction towards another party side
Construction；
First conductor layer is arranged on the interarea of a side side of the stacking direction of the first insulator layer, and wraps
Containing coating layer；And
Second conductor layer is arranged on the interarea of another party side of the stacking direction of the second insulator layer,
First conductor layer includes the first circuit portion of first connecting portion and the transmission path as signal,
Second conductor layer includes the second circuit portion of second connecting portion and the transmission path as signal,
The first connecting portion and the second connecting portion are connected with each other,
First circuit portion has repeat region Chong Die with the second circuit portion when from the stacking direction,
The maximum gauge for the part connecting in the first connecting portion with the second connecting portion is greater than the repeat region most
Big thickness,
The maximum gauge of the coating layer for the part connecting in the first connecting portion with the second connecting portion is greater than the repetition
The maximum gauge of the coating layer in region.
7. multilager base plate according to claim 6, which is characterized in that
First conductor layer also includes leading part, which connect with the first connecting portion, and from the stacking
It is drawn when direction is observed to the outer rim of the first insulator layer,
The thickness of the leading part is greater than the thickness of the repeat region.
8. multilager base plate according to claim 6, which is characterized in that
First conductor layer also includes base conductor, which is arranged in the stacking side of the first insulator layer
To a side side interarea on,
The coating layer is arranged on the base conductor.
9. multilager base plate according to claim 6, which is characterized in that
First circuit portion and the second circuit portion are a part of coil respectively.
10. multilager base plate according to any one of claims 6 to 9, which is characterized in that
The material of the second insulator layer is thermoplastic resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-100034 | 2016-05-19 | ||
| JP2016100034 | 2016-05-19 | ||
| PCT/JP2017/017126 WO2017199747A1 (en) | 2016-05-19 | 2017-05-01 | Multilayer substrate, and manufacturing method for multilayer substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517682U true CN209517682U (en) | 2019-10-18 |
Family
ID=60325209
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201790000881.4U Active CN209517682U (en) | 2016-05-19 | 2017-05-01 | Multilager base plate |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11810703B2 (en) |
| JP (1) | JP6555417B2 (en) |
| CN (1) | CN209517682U (en) |
| WO (1) | WO2017199747A1 (en) |
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|---|---|---|---|---|
| CN116548070A (en) * | 2021-06-28 | 2023-08-04 | 住友电气工业株式会社 | Printed wiring board |
| US20230422407A1 (en) * | 2021-06-28 | 2023-12-28 | Sumitomo Electric Industries, Ltd. | Printed wiring board |
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| JPS628607U (en) * | 1985-06-28 | 1987-01-19 | ||
| US4873757A (en) * | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
| US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
| JPH07142256A (en) * | 1993-11-19 | 1995-06-02 | Yokogawa Electric Corp | Stacked printed coil and its manufacture |
| JPH08125341A (en) * | 1994-10-25 | 1996-05-17 | Hitachi Ltd | Electronic circuit device |
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2017
- 2017-05-01 CN CN201790000881.4U patent/CN209517682U/en active Active
- 2017-05-01 WO PCT/JP2017/017126 patent/WO2017199747A1/en active Application Filing
- 2017-05-01 JP JP2018518208A patent/JP6555417B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| US20190057800A1 (en) | 2019-02-21 |
| JPWO2017199747A1 (en) | 2019-03-22 |
| WO2017199747A1 (en) | 2017-11-23 |
| JP6555417B2 (en) | 2019-08-07 |
| US11810703B2 (en) | 2023-11-07 |
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