CN101834050B - Coil electric conductor device and manufacture method thereof - Google Patents
Coil electric conductor device and manufacture method thereof Download PDFInfo
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- CN101834050B CN101834050B CN2010101663390A CN201010166339A CN101834050B CN 101834050 B CN101834050 B CN 101834050B CN 2010101663390 A CN2010101663390 A CN 2010101663390A CN 201010166339 A CN201010166339 A CN 201010166339A CN 101834050 B CN101834050 B CN 101834050B
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Abstract
The invention provides a coil electric conductor device and a manufacture method thereof. The method comprises the following steps of: a lower leading-out end step, a coil conductor step, a casting step and an upper leading-out end step, wherein the coil conductor step comprises a connection point step: printing a coil conductor, wherein cavities can be generated at the tip position of a lower leading-out end and the middle position of the tip position of the coil conductor if the thickness of the tip position of the coil conductor is less than that of the middle part of the coil conductor; drying again; printing first connection points at the positions of the cavities; then casting a layer of ferrite pulp film; and printing second connection points the area of which is larger than that of the first connection points on the first connection points after the ferrite pulp film is dried; in the casting step, casting a layer of ferrite pulp film, and exposing the second connection points out of the ferrite pulp film; drying, and then repeating the coil conductor step, the connection point step and the casting step on the ferrite pulp film for several times so as to form the coil conductor.
Description
Technical field
The present invention relates to a kind of manufacture method and coil electric conductor device of coil electric conductor device.
Background technology
In the past, the laminated coil component of chip inductor device etc., the coil-conductor that comprises the laminated ceramic layer and have definite shape, and realize that by tie point the interlayer of the termination portion of coil-conductor connects, thus form spiral helicine coil-conductor.
In recent years, along with the extensive use of electronic devices and components, when paying attention to element function, to the miniaturization of element, the requirement of low thicknessization also is more and more stronger, these live widths that require coil-conductor will attenuate in order to satisfy, thickness will become greatly, and on the other hand, it is thinner that ceramic layer will become.Yet, big if the thickness of coil-conductor becomes, the ceramic layer attenuation, in the duplexer, the position thickness overlapping at tie point is bigger, the problem that the conductor of interlayer is short-circuited can occur.
Fig. 4 is the center section plan of traditional multilayer coil, in order to improve the anti-current characteristics of element, and the thicker resistance that reduces coil-conductor of coil-conductor printing.But at the position of tie point because the height stack of the height of conductor and tie point causes big than other position of herein total height, the bilevel coil-conductor short circuit of initiation easily thus.But also can cause lamination device to form protuberance at the tie point place, this use to device can produce trouble.Fig. 5 represents the schematic diagram behind the coupling part between amplification layer.
Summary of the invention
Technical problem to be solved by this invention provides a kind of manufacture method and coil electric conductor device of coil electric conductor device, and under the prerequisite of the validity that is electrically connected between reinforced layer, when can effectively solve the ceramic layer attenuation, problem of short-circuit appears in interlayer.
The objective of the invention is to be achieved through the following technical solutions:
A kind of manufacture method of coil electric conductor device comprises the steps:
Following exit step: curtain coating goes out certain thickness ferrite slurry film on substrate, prints out exit down on this substrate, and prints out tie point at the position, termination of this time exit;
Coil electric conductor step, comprise: the coil-conductor step: adopt the mode of silk screen printing, print out coil-conductor, the thickness of this coil-conductor is less than the described thickness at the position, termination of exit down, the cavity will appear in the then described centre at the position, termination of exit down, oven dry again; The tie point step: the position in described cavity, print last first tie point, then, curtain coating goes out one deck ferrite slurry film, after the oven dry, prints out second tie point bigger than this first tie point area on described first tie point; And, the curtain coating step: curtain coating one deck ferrite slurry film, described second tie point exposes this ferrite slurry film; Oven dry, and then on this ferrite slurry film, repeat described coil-conductor step, tie point step and curtain coating step several times, to form the spiral coil conductor; And,
Last exit step: on the ferrite slurry film of described top, print out exit, more certain thickness ferrite slurry film on the curtain coating with the corresponding position of described second tie point.
Adopt technique scheme, wherein adopt the mode of silk screen printing, print out coil-conductor, can be easily in the film termination portion of coil-conductor design some patterns, make silk screen with it the aperture opening ratio of corresponding position descend, thereby the thickness of termination portion is littler than the thickness of coil-conductor middle part when making the printing conductive slurry.For example, in silk-screen, the long or wide aperture than silk screen of the pattern of termination portion design is big, and is littler than tie point.Then, ceramic layer and coil-conductor, and make the termination portion that is formed at described coil-conductor realize that interlayer connects by tie point, thereby form spiral helicine coil and obtain laminated coil component, in this laminated coil component, described coil-conductor termination portion is thinner than the thickness of the middle part of described coil-conductor.
Wherein, because adopt twice printing to realize first tie point and second tie point, the tie point of the first impression is less, can play getting final product stable the connection, the tie point of the second impression will tie point be big for the first time, the connection reliability of the coil-conductor of raising and last layer.
Compared with prior art, because the silk screen of design descends at the aperture opening ratio of coil end portion, so little than other position of coil-conductor of China ink amount under the electrocondution slurry of coil-conductor termination portion when coil prints, the thickness of termination portion is thinner than the thickness at other position of coil-conductor, so coil end portion is that the height of the position of tie point is effectively controlled in duplexer, has reduced the possibility of short circuit between coil-conductor.In addition, every layer tie point is taked twice printing, and top tie point is bigger, and it increases with the area that is connected of the coil-conductor on upper strata, has improved the connection reliability of coil-conductor.
Preferably, described ferrite slurry is made in the following manner, comprising: ferrite powder, adhesive, plasticizer, dispersant and solvent, mix, and deaeration obtains this ferrite slurry again.
Further, described ferrite powder, adhesive, plasticizer, dispersant and solvent mix a special time in ball mill.
Preferably, described coil-conductor step, adjacent coil-conductor complements each other to form spiral coil by tie point.
Preferably, the diameter of described second tie point is 1.3 to 2.0 times of length of first tie point.
If circular regarding as of the shape approximation of tie point, then to can be said to be its diameter to its length.
Preferably, in the described coil-conductor step, the termination portion thickness of this coil-conductor is 0.4 to 0.7 times of thickness of the middle part of described coil-conductor.。
The coil electric conductor device that the present invention also provides the manufacture method of a kind of employing coil electric conductor device as described to make.
Specific corresponding techniques feature for this device and its manufacture method are had will further specify in specific embodiment.
Description of drawings
Fig. 1 is the exploded perspective view of a kind of example of coil electric conductor device of the present invention;
Fig. 2 is the centre section key diagram of embodiment shown in Figure 1;
Fig. 3 is the partial enlarged drawing of embodiment termination face shown in Figure 1;
Fig. 4 is the centre section key diagram of coil electric conductor device in the prior art;
Fig. 5 is the partial enlarged drawing of device shown in Figure 4 termination face;
Fig. 6 is used among a kind of embodiment of manufacture method of a coil electric conductor device of the present invention film pattern;
Fig. 7 is used among a kind of embodiment of manufacture method of a coil electric conductor device of the present invention silk screen figure;
Fig. 8 is the vertical view of the coil-conductor that electrocondution slurry prints among a kind of embodiment of manufacture method of coil electric conductor device of the present invention;
Fig. 9 is the vertical view of a kind of example of coil electric conductor device of the present invention.
Embodiment
The invention will be further described below in conjunction with accompanying drawing and preferred embodiment.
The embodiment of a coil electric conductor device of the present invention such as Fig. 1, Fig. 2 and shown in Figure 3.
As shown in Figure 1, be stacked with coil-conductor 12, exit 13, tie point 14, tie point 15, casting slurry layer 11, the coil component of formation helix round.As shown in Figure 8, can form little emptyly 82 in coil-conductor 81 termination portions, tie point 15 is exactly to be printed in the termination portion 82.
As shown in Figure 9, be vertical view above this embodiment.Wherein, the resulting state of overlapping situation of ceramic layer 94, exit 92, tie point 93 and coil-conductor 91.Represent that with Fig. 4 the profile at coil electric conductor device center compares, form external electrodes in two terminations of element.Then, the coil-conductor of Fig. 4 is overlooked under the state, and in the vertical direction overlaps each other, and tie point and conductor termination concentrate on two positions, and coil-conductor very easily is short-circuited like this.
Fig. 3 is a tie point embodiment illustrated in fig. 1, i.e. the enlarged drawing of the lap of first tie point and second tie point.The thickness of relative conductor 33, it is thinner that termination portion 34 forms.Coil electric conductor device is reduced in the termination of conductor portion and the overlapping gross thickness of tie point, can prevent the uneven of element surface, and can reduce the risk that element is short-circuited.
As shown in Figure 1, a chip electronic component exploded view of the present invention has a ferrite main body 11 to form by curtain coating lamination sintering, interior electrode coil 13, exit 12, and tie point 14,15 is formed by printing, sintering.Producing this electronic devices and components concrete grammar will describe in following step.
Step 1: draw the bracing cable circle conductive pattern film as shown in Figure 6, the pattern 61 of termination portion is not limited thereto certainly, makes a silk screen as shown in Figure 7 with this film again, for the back printing is got ready.
Step 2: with ferrite powder, adhesive, plasticizer, dispersant, solvent etc. mix the specific time in ball mill, again by deaeration, obtain qualified casting slurry.
Step 3: the casting slurry of step 2 is added casting machine, adjust slurry viscosity, make it to be fit to curtain coating by adding proper amount of solvent.Adjust the curtain coating parameter, beginning curtain coating infrabasal plate.
Step 4: for printing exit down, exit 12 is printed in position suitable on the infrabasal plate that step 3 is produced, and oven dry.Then, first tie point 15 prints in 12 termination portions at exit, then prints second tie point 14 again.
Step 5: be printed coil conductor operation.On step 4, republish coil-conductor, with silk screen printing as Fig. 7, make the thickness of termination portion of coil-conductor littler than the middle part of conductor, the pattern that prints as shown in Figure 8, can form little by empty 82 at the conductor end head, after the oven dry, then on this empty position, print tie point, as shown in Figure 3, print first tie point 32 earlier, follow curtain coating one deck ferrite slurry, then print second tie point 31 after the oven dry, this point is bigger than tie point 32, mainly is in order to improve the connection reliability of tie point, curtain coating last layer ferrite slurry then, because the solvent of the electrocondution slurry of tie point and the solvent of ferrite slurry are immiscible, thus tie point reveal and do not covered by the ferrite slurry, after the oven dry, republish the coil-conductor of last layer, so repeatedly until the number of turns that reaches setting.
Step 6: be last exit printing process, exit was the same under last exit was followed, and all was the bridge that coil-conductor is connected with external electrode.
Step 7: be curtain coating upper substrate operation, equivalent steps 3 is till the gross thickness of setting.
By above step, can realize improving the anti-current characteristics of coil electric conductor device, the possibility that is short-circuited in the time of simultaneously can not raising production again, and improved the smooth problem of element surface can not installed to the client and be made troubles.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, conceive under the prerequisite not breaking away from the present invention, can also make some simple deduction or replace, all should be considered as protection range of the present invention.
Claims (5)
1. the manufacture method of a coil electric conductor device is characterized in that, comprises the steps:
Following exit step: curtain coating goes out certain thickness ferrite slurry film on substrate, and oven dry prints out exit down on this ferrite slurry film, and prints out tie point at the position, termination of this time exit;
The coil-conductor step, comprise: the coil-conductor step, adopt the mode of silk screen printing, the termination portion design of the coil-conductor when this silk screen is made in the used film has pattern, print out coil-conductor, the termination portion thickness of this coil-conductor is less than the thickness of the middle part of described coil-conductor, and oven dry again the cavity will appear, in the centre at the position, termination of described coil-conductor; The tie point step, position in described cavity, print last first tie point, then, curtain coating last layer ferrite slurry film, after the oven dry, print out second tie point bigger than this first tie point area on described first tie point, the length of described second tie point is 1.3 to 2.0 times of diameter of first tie point; And, the curtain coating step, curtain coating one deck ferrite slurry film, described second tie point exposes this ferrite slurry film; Oven dry, and then on this ferrite slurry film, repeat described coil-conductor step, tie point step and curtain coating step several times, to form coil-conductor; And,
Last exit step: on the ferrite slurry film of described top, print out exit, more certain thickness ferrite slurry film on the curtain coating with the corresponding position of described second tie point.
2. the manufacture method of coil electric conductor device as claimed in claim 1, it is characterized in that described ferrite slurry is made in the following manner, comprising: ferrite powder, adhesive, plasticizer, dispersant and solvent, mix, deaeration obtains this ferrite slurry again.
3. the manufacture method of coil electric conductor device as claimed in claim 1 is characterized in that, in the described coil-conductor step, complements each other to form the spiral coil conductor by adjacent coil-conductor and tie point.
4. the manufacture method of coil electric conductor device as claimed in claim 1 is characterized in that, in the described coil-conductor step, the termination portion thickness of this coil-conductor is 0.4 to 0.7 times of thickness of the middle part of described coil-conductor.
5. the coil electric conductor device made of the manufacture method of employing such as claim 1,2,3 or 4 described coil electric conductor devices is characterized in that: comprise coil-conductor, go up exit, the folded layer by layer helix round that forms of exit, first tie point, second tie point and casting slurry down; Described upward exit, following exit, coil-conductor, first tie point, second tie point are arranged on the described casting slurry layer, the termination portion thickness of described coil-conductor is less than the thickness of the middle part of described coil-conductor, and there is the cavity centre of the termination portion of described coil-conductor, described first tie point is arranged on the position in described cavity, described second tie point is arranged on described first tie point, the area of described second tie point is big greater than the area of described first tie point, and the length of described second tie point is 1.3 to 2.0 times of diameter of first tie point.
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| CN2010101663390A CN101834050B (en) | 2010-04-27 | 2010-04-27 | Coil electric conductor device and manufacture method thereof |
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| CN101834050B true CN101834050B (en) | 2011-12-28 |
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| US9824811B2 (en) * | 2014-12-19 | 2017-11-21 | Texas Instruments Incorporated | Embedded coil assembly and method of making |
| CN209517682U (en) * | 2016-05-19 | 2019-10-18 | 株式会社村田制作所 | Multilager base plate |
| CN106735922B (en) * | 2017-01-16 | 2018-10-09 | 深圳顺络电子股份有限公司 | A kind of laminate electronic components and preparation method thereof |
| CN110650579B (en) * | 2018-06-26 | 2020-11-10 | 深圳市璞瑞达薄膜开关技术有限公司 | Radio frequency circuit layer structure and circuit printing method thereof |
| CN113936876A (en) * | 2021-11-08 | 2022-01-14 | 深圳顺络电子股份有限公司 | Laminated electrical element and electronic equipment |
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| CN101354948A (en) * | 2008-05-28 | 2009-01-28 | 广东风华高新科技股份有限公司 | Method for manufacturing chip inductor and inductor thereof |
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| CN1335629A (en) * | 2000-07-24 | 2002-02-13 | 清华同方股份有限公司 | Interlamellar passage making method and structure for laminated inductor |
| EP1710814B1 (en) * | 2005-01-07 | 2008-05-14 | Murata Manufacturing Co., Ltd. | Laminated coil |
| WO2007072612A1 (en) * | 2005-12-23 | 2007-06-28 | Murata Manufacturing Co., Ltd. | Multilayer coil component and method for fabricating same |
| CN101361146B (en) * | 2006-01-16 | 2011-09-07 | 株式会社村田制作所 | Method for manufacturing inductor |
| JP4404088B2 (en) * | 2006-11-30 | 2010-01-27 | Ｔｄｋ株式会社 | Coil parts |
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| CN101354948A (en) * | 2008-05-28 | 2009-01-28 | 广东风华高新科技股份有限公司 | Method for manufacturing chip inductor and inductor thereof |
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