KR20120059681A - Method of manufacturing a common mode filter for HDMI - Google Patents

Abstract

PURPOSE: A method for manufacturing a common mode filter using printing of dielectrics for an HDMI is provided to form insulation layers for magnetic sheets and electrode patterns by printing dielectrics only on electrode pattern formed portions. CONSTITUTION: A common mode filter for an HDMI is manufactured by printing a base layer(120), a first pattern layer(140), a second pattern layer(160), and a protective layer(180) in sequence. Dielectrics(125,185) are formed on the base layer and the protective layer for insulating magnetic sheets(126,186) and electrode patterns(122,182). The dielectrics can be printed larger than the electrode patterns in a set range.

Description

Method of manufacturing a common mode filter for HDMD {Method of manufacturing a common mode filter for HDMI}

The present invention relates to a method of manufacturing a common mode filter, and more particularly, to a method of manufacturing a common mode filter for HDMI that minimizes the reduction of the effect of the magnetic material while ensuring insulation.

As technology advances, electronic devices such as mobile phones, home appliances, PCs, PDAs, LCDs, etc. are changing from analog to digital, and the speed of data is increasing due to an increase in the amount of data processed.

However, digitized and accelerated electronics are sensitive to external stimuli. That is, when a small abnormal voltage and high frequency noise from outside enters the internal circuit of the electronic device, the circuit may be broken or the signal may be distorted. At this time, the circuit of the electronic device, the abnormal voltage and noise causing the signal distortion, such as lightning strike, electrostatic discharge charged to the human body, switching voltage generated in the circuit, power supply noise included in the power supply voltage, unnecessary electromagnetic signals or Electromagnetic noise.

In order to prevent circuit breakage and signal distortion of the electronic device, a filter is provided to prevent abnormal voltage and high frequency noise from flowing into the circuit. In general, a common mode filter is used for high speed differential signal lines to remove common mode noise.

Common-mode noise is noise that occurs on differential signal lines, and common-mode filters remove noise that cannot be eliminated with conventional EMI filters. The common mode filter contributes to the improvement of EMC characteristics of home appliances or antenna characteristics of mobile phones.

Such common mode filters can be applied to USB, MDDI / MIPI, and HDMI. In particular, the market expansion of HDMI makes common mode filters the best solution in this market.

Currently, there are three main requirements for common mode filters in the HDMI market. The first requirement is miniaturization and slimness, for example 2.0 mm x 1.0 mm (2 pole), 1.2 mm x 1.0 mm (1 pole). The second requirement requires that the common mode impedance in the low frequency band of 100 MHz should be around 65-115, and the differential mode impedance should be up to 15 Ω. The third requirement is that the IR characteristic should be kept above 10 Hz and the cut-off frequency band should be above 3 Hz.

In order to satisfy these requirements, researches on common mode filters for multilayer and thin film HDMI have been conducted.

In the case of a multi-layered common mode filter, as illustrated in FIG. 1, the insulating layer 10 is formed on and under the pattern (that is, the in-pattern 20 and the spiral pattern 30). Ensure insulation properties. In this case, in order to increase the common mode impedance, a structure for forming the insulating layer 10 using a magnetic material has been studied.

However, in the case of forming the insulating layer using a magnetic material, there are problems that it is difficult to realize the characteristics of insulation resistance of 10 MΩ or more, which is required in the HDMI market, since several insulation resistances are formed.

In addition, in the case of a thin film type common mode filter, as illustrated in FIG. 2, a common mode filter having a high frequency characteristic by configuring a three-layer structure having the pattern 40 at the center has been studied. In this case, a plurality of magnetic bodies 50 are formed outside the pattern.

However, in the case of the thin film common mode filter, expensive manufacturing equipment and manufacturing cost are generated, and heat deformation during the SMT process and rework may occur.

The present invention has been proposed in view of the above-described conventional problems, and an object thereof is to provide a method of manufacturing a common mode filter for HDMI, which forms a magnetic sheet and an insulating layer of an electrode pattern by printing a dielectric only on a portion where an electrode pattern is formed. Is in.

In order to achieve the above object, a method of manufacturing a common mode filter for HDMI according to an embodiment of the present invention includes: printing an electrode pattern on an upper surface of a magnetic sheet; And forming a base layer by printing a dielectric between the magnetic sheet and the electrode pattern. In the forming of the base layer, the dielectric is printed only on a portion where the electrode pattern is formed on the upper surface of the magnetic sheet.

Printing an electrode pattern on the dielectric sheet to form a first pattern layer; And laminating the first pattern layer on the base layer.

Printing an electrode pattern on the dielectric sheet to form a second pattern layer; And stacking a second pattern layer on top of the first pattern layer.

Printing an electrode pattern on an upper surface of the dielectric sheet; Printing a dielectric on an upper surface of the electrode pattern; Printing a magnetic sheet on top of the dielectric to form a protective layer; And laminating a protective layer on top of the second pattern layer. In the printing of the dielectric, the dielectric is printed only on a portion where the electrode pattern is formed on the lower surface of the magnetic sheet.

Printing a dielectric sheet on the electrode pattern of the base layer; And

The method may further include forming an first pattern layer by printing an electrode pattern on the dielectric sheet.

Printing a dielectric sheet on the electrode pattern of the first pattern layer; And

The method may further include forming a second pattern layer by printing an electrode pattern on the dielectric sheet.

Printing a dielectric sheet on the electrode pattern of the second pattern layer; Printing an electrode pattern on an upper surface of the dielectric sheet; Printing a dielectric on an upper surface of the electrode pattern; And forming a protective layer by printing a magnetic sheet on top of the dielectric. In the printing of the dielectric, the dielectric is printed only on a portion where an electrode pattern is formed on the bottom surface of the magnetic sheet.

In the printing of the dielectric, the dielectric is printed in the same size and shape as the electrode pattern.

In the printing of the dielectric, the dielectric is printed larger than the electrode pattern within the set range.

In order to achieve the above object, a method of manufacturing a common mode filter for HDMI according to another embodiment of the present invention includes: printing a dielectric on an upper surface of a magnetic sheet; Printing an electrode pattern on an upper surface of the dielectric; Printing a dielectric sheet on top of the electrode pattern; And forming a base layer by printing the magnetic material on the upper outer side and the center of the magnetic sheet to be spaced apart from the electrode pattern, wherein the dielectric is formed only in the portion where the electrode pattern is formed.

Printing a dielectric on top of the magnetic sheet; Printing an electrode pattern on top of the dielectric; Printing a dielectric sheet on top of the electrode pattern; Forming a first pattern layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern; And laminating the first pattern layer on the upper portion of the protective layer. In the printing of the dielectric, the dielectric is printed only on a portion where the electrode pattern is formed.

Printing a dielectric on top of the magnetic sheet; Printing an electrode pattern on top of the dielectric; Printing a dielectric sheet on top of the electrode pattern; Forming a second pattern layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern; And laminating a second pattern layer on top of the first pattern layer. In the printing of the dielectric, the dielectric is printed only on a portion where the electrode pattern is formed.

Printing a dielectric on top of the electrode pattern; Printing a magnetic sheet on top of the dielectric; Forming a protective layer by printing the magnetic material on the outer side and the center of the lower surface of the magnetic sheet to be spaced apart from the electrode pattern; And laminating a protective layer on top of the second pattern layer. In the printing of the dielectric, the dielectric is printed only on a portion where the electrode pattern is formed.

Printing a magnetic sheet on top of the dielectric sheet of the base layer; Printing a dielectric on top of the magnetic sheet; Printing an electrode pattern on top of the dielectric; Printing a dielectric sheet on top of the electrode pattern; And forming a first pattern layer by printing a magnetic material on an outer side and a center of the upper surface of the magnetic sheet to be spaced apart from the electrode pattern. In the printing of the dielectric, the dielectric is formed only at a portion where the electrode pattern is formed.

Printing a magnetic sheet on the dielectric sheet of the first pattern layer; Printing a dielectric on top of the magnetic sheet; Printing an electrode pattern on top of the dielectric; Printing a dielectric sheet on top of the electrode pattern; The method may further include forming a second pattern layer by printing the magnetic material on the outer side and the center of the magnetic sheet to be spaced apart from the electrode pattern. In the printing of the dielectric, the dielectric is printed only on the portion where the electrode pattern is formed.

Printing an electrode pattern on the dielectric sheet of the second pattern layer; Printing a dielectric on top of the electrode pattern; Forming a magnetic body on the outer side and the center of the lower surface of the magnetic sheet to be spaced apart from the electrode pattern; And printing a magnetic sheet on top of the dielectric to form a protective layer. In the printing of the dielectric, the dielectric is printed only on a portion where the electrode pattern is formed.

In the printing of the dielectric, the dielectric is printed in the same size and shape as the electrode pattern.

In the printing of the dielectric, the dielectric is printed larger than the electrode pattern within the set range.

In the method of manufacturing a common mode filter for HDMI according to the present invention, the dielectric sheet constituting the insulating layer is formed by printing on the electrode part, thereby achieving an insulating layer which minimizes the effect reduction of the magnetic material while ensuring insulation.

Incidentally, the method of manufacturing a common mode filter for HDMI increases the common mode impedance, thereby minimizing and reducing the size of the common mode filter by minimizing the length of the pattern, and improving the high frequency characteristics.

In addition, the method of manufacturing a common mode filter for HDMI is formed by printing a dielectric sheet constituting an insulating layer on the electrode part, so that the firing temperature can be increased as compared with a conventional common mode filter, so that the common mode impedance and the differential mode SRF impedance are used. Is increased, and the magnetic permeability of the magnetic material increases to increase the impedance of the common mode and the SRF impedance of the differential mode.

In addition, in the method of manufacturing a common mode filter for HDMI, a magnetic material is printed on the outer surface and the core of the magnetic sheet so that the magnetic material effect is affected at all of the upper, lower, left, right, and center portions of the electrode pattern. And the common mode impedance is increased compared to the conventional only given in the lower direction, punching and casting process is omitted, there is an effect that can reduce the equipment investment cost.

1 and 2 are diagrams for explaining a conventional common mode filter for HDMI.
3 is a view for explaining a method for manufacturing a common mode filter for HDMI according to a first embodiment of the present invention.
4 and 5 are views for explaining the base layer manufacturing method of FIG.
FIG. 6 is a diagram for describing a method for manufacturing a first pattern layer of FIG. 3. FIG.
FIG. 7 is a diagram for describing a method for manufacturing a second pattern layer of FIG. 3. FIG.
8 and 9 are views for explaining the protective layer manufacturing method of FIG.
10 is a view for explaining the characteristics of the common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention.
11 and 12 are views for comparing and explaining the characteristics of the common mode filter for HDMI and the conventional common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention.
13 to 14 are diagrams for explaining characteristics according to firing temperature of a common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention.
15 is a view for explaining the cutoff frequency characteristics of the common mode filter for HDMI formed by the method for manufacturing the common mode filter for HDMI according to the first embodiment of the present invention.
16 is a view for explaining a method for manufacturing a common mode filter for HDMI according to a second embodiment of the present invention.
17 is a view for explaining the base layer manufacturing method of FIG.
FIG. 18 is a view for explaining a method for manufacturing a first pattern layer of FIG. 16. FIG.
FIG. 19 is a diagram for describing a method of manufacturing the second pattern layer of FIG. 16. FIG.
20 is a view for explaining a method for manufacturing a protective layer of FIG.

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. . First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity.

First, before describing an embodiment of the present invention, the features of the common mode filter for HDMI of the present invention will be described.

Conventionally, in order to form a base layer located at the lowermost part of the common mode filter for HDMI, LTCC interlayer is laminated on the upper surface of the magnetic sheet (for example, ferrite sheet), and an electrode pattern is laminated on the LTCC interlayer. In the case of the protective layer, the electrode pattern is laminated on the upper surface of the LTCC sheet, the LTCC interleaf paper is laminated on the upper electrode pattern, and the magnetic sheet (eg, ferrite sheet) is laminated on the upper surface of the LTCC interleaf paper.

At this time, an LTCC interlayer, which is a dielectric, is laminated between the magnetic sheet and the electrode pattern to form an insulating layer. Here, the LTCC interlayer formed between the magnetic sheet and the electrode pattern is formed to have a size covering all of the upper surface (or lower surface) of the magnetic sheet. That is, regardless of the size of the electrode pattern is formed to have the same area as the upper surface of the magnetic sheet to cover all the magnetic sheet.

However, when a dielectric sheet having the same area as the magnetic sheet (that is, LTCC interlayer) is used, the influence of the magnetic properties of the magnetic sheet on the electrode pattern by the dielectric sheet is reduced. That is, the dielectric sheet blocks the transfer of the magnetic properties of the magnetic sheet to the electrode pattern.

The common mode filter for HDMI according to the present invention is formed by printing the area of the dielectric formed between the magnetic sheet and the electrode pattern in the same manner as the electrode pattern in order to minimize the blocking of the transfer of the magnetic property to the electrode pattern. That is, by forming a dielectric having the same size as the electrode pattern between the magnetic sheet and the electrode pattern, it is characterized in that the transmission of the magnetic properties to the electrode pattern is minimized.

Of course, the dielectric printed between the magnetic sheet and the electrode pattern may be formed by printing larger within the set range than the electrode pattern. Here, since the setting range may be set differently according to the size and shape of the electrode pattern, the setting range is not limited.

(Embodiment 1)

Hereinafter, a method for manufacturing a common mode filter for HDMI according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. 3 is a view for explaining a method for manufacturing a common mode filter for HDMI according to a first embodiment of the present invention. 4 and 5 are views for explaining the base layer manufacturing method of FIG. 3, FIG. 6 is a view for explaining the first pattern layer manufacturing method of FIG. 3, FIG. 7 is a second pattern layer manufacturing of FIG. 8 and 9 are views for explaining the protective layer manufacturing method of FIG.

As shown in FIG. 3, in the method of manufacturing a common mode filter for HDMI, the base layer 120, the first pattern layer 140, the second pattern layer 160, and the protective layer 180 are formed by printing. Lamination is then performed to fabricate the common mode filter 100 for HDMI. In other words, after forming each layer constituting the common mode filter 100 for HDMI by a multilayer printing method, the respective layers are laminated to manufacture the common mode filter 100 for HDMI.

Of course, the method of manufacturing a common mode filter for HDMI may be manufactured by stacking each layer to produce the common mode filter 100 for HDMI. That is, the base layer 120 is formed by a lamination printing method, and the first pattern layer 140, the second pattern layer 160, and the protective layer 180 are sequentially laminated on the base layer to be printed in common for HDMI. The mode filter 100 is manufactured.

Here, the method of manufacturing a common mode filter for HDMI may include dielectrics 125 and 185 formed on the base layer 120 and the protective layer 180 to insulate the magnetic sheets 126 and 186 and the electrode patterns 122 and 182. It is characterized in that formed in the same size and shape as the electrode patterns (122, 182). Of course, the dielectrics 125 and 185 may be printed larger than the electrode patterns 122 and 182 within a set range. Here, since the setting range may be set differently according to the size and shape of the electrode patterns 122 and 182, the setting range is not limited.

First, as shown in FIG. 4, in order to form the base layer 120, the electrode pattern 122 and the dielectric 125 are laminated and printed on the upper surface of the magnetic sheet 126. That is, the dielectric 125 is printed on the upper surface of the magnetic sheet 126, and the electrode pattern 122 having the extraction electrodes 123 and 124 formed on both ends thereof is printed on the upper surface of the dielectric 125.

In the forming of the base layer 120, the core 127 may be further printed on the center portion of the magnetic sheet 126.

In the forming of the base layer 120, the dielectric 125 is printed only on a portion where the electrode pattern 122 is formed on the upper surface of the magnetic sheet 126. That is, the dielectric 125 is printed in the same size and shape as the electrode pattern 122. Of course, the dielectric 125 may be printed larger than the electrode pattern 122 within the set range.

Accordingly, as shown in FIG. 5, the base layer 120 having the same area as that of the electrode pattern 122 having the area of the dielectric 125 formed between the magnetic sheet 126 and the electrode pattern 122 is formed. .

Next, as shown in FIG. 6, the electrode pattern 142 is printed on the dielectric sheet 141 to form a first pattern layer 140 and stacked on the base layer 120. Here, the dielectric sheet 141 may be printed on the base layer 120, and the electrode pattern 142 may be printed on the dielectric sheet 141 to form the first pattern layer 140. That is, the first pattern layer 140 is formed by printing the dielectric sheet 141 on the electrode pattern 122 of the base layer 120 and printing the electrode pattern 122 on the dielectric sheet 141. . Accordingly, the process of stacking the first pattern layer 140 on the base layer 120 may be omitted.

Next, as shown in FIG. 7, the electrode pattern 162 is printed on the dielectric sheet 161 to form the second pattern layer 160 and stacked on the first pattern layer 140. Here, the dielectric pattern 161 may be printed on the first pattern layer 140, and the second pattern layer 160 may be formed by printing the electrode pattern 162 on the dielectric sheet 161. That is, the dielectric pattern 161 is printed on the electrode pattern 142 of the first pattern layer 140, and the electrode pattern 162 is printed on the dielectric pattern 161 to form the second pattern layer 160. Form. Accordingly, the process of stacking the second pattern layer 160 on the first pattern layer 140 may be omitted.

Finally, as shown in FIG. 8, in order to form the protective layer 180, the electrode pattern 182, the dielectric 185, and the magnetic sheet 186 are laminated and printed on the top surface of the dielectric sheet 181. That is, the electrode patterns having the lead electrodes 183 and 184 formed at both ends are printed on the top surface of the dielectric sheet 181, the dielectric 185 is printed on the top surface of the electrode pattern 182, and the top surface of the dielectric 185 is printed. The magnetic sheet 186 is printed to form the protective layer 180.

In the forming of the passivation layer 180, the dielectric sheet 181, the electrode pattern 182, the dielectric 185, and the magnetic sheet 186 are stacked on the electrode pattern 142 of the second pattern layer 160. The protective layer 180 may be formed by printing. That is, the dielectric sheet 181 is printed on the electrode pattern 162 of the second pattern layer 160, and the electrode pattern 182 is printed on the upper surface of the dielectric sheet 181. The dielectric layer 185 is printed on the upper surface of the electrode pattern 182, and the protective sheet 180 is formed by printing the magnetic sheet 186 on the dielectric layer 185. Accordingly, the process of laminating the protective layer 180 on the second pattern layer 160 may be omitted.

In this case, in the forming of the protective layer 180, the dielectric 185 is printed only on a portion where the electrode pattern 182 is formed on the bottom surface of the magnetic sheet 186. Here, the dielectric 185 is printed in the same size and shape as the electrode pattern 182. Of course, the dielectric 185 may be printed larger than the electrode pattern 182 within the set range. Accordingly, as shown in FIG. 9, the protective layer 180 having the same area as the electrode pattern 182 having the area of the dielectric 185 formed between the magnetic sheet 186 and the electrode pattern 182 is formed. .

As described above, the method of manufacturing a common mode filter for HDMI may be formed by printing a dielectric sheet constituting the insulating layer on the electrode portion, thereby achieving an insulating layer that ensures insulation and minimizes the reduction of the effect of the magnetic material. .

Incidentally, the method of manufacturing a common mode filter for HDMI increases the common mode impedance, thereby minimizing and reducing the size of the common mode filter by minimizing the length of the pattern, and improving the high frequency characteristics.

In addition, the method of manufacturing a common mode filter for HDMI is formed by printing a dielectric sheet constituting an insulating layer on the electrode part, so that the firing temperature can be increased as compared with a conventional common mode filter, so that the common mode impedance and the differential mode SRF impedance are used. Is increased, and the magnetic permeability of the magnetic material increases to increase the impedance of the common mode and the SRF impedance of the differential mode.

Hereinafter, the structure of the HDMI common mode filter formed by the HDMI common mode filter manufacturing method according to the first embodiment of the present invention will be described.

The common mode filter 100 for HDMI includes a base layer 120, a first pattern layer 140, a second pattern layer 160, and a protective layer 180. Here, the common mode filter 100 for HDMI is divided into a base layer 120, a first pattern layer 140, a second pattern layer 160, and a protective layer 180 for convenience of description. The mode filter 100 is manufactured by printing the components included in each layer. In particular, the dielectric layers 125 and 185 formed on the base layer 120 and the protective layer 180 to insulate the magnetic sheets 126 and 186 and the electrode patterns 122 and 182 may be formed of the electrode patterns 122 and 182. Characterized in that the same size and shape. Of course, the dielectrics 125 and 185 may be printed larger than the electrode patterns 122 and 182 within a set range. Here, since the setting range may be set differently according to the size and shape of the electrode patterns 122 and 182, the setting range is not limited.

The base layer 120 is located at the bottom. The base layer 120 is formed by printing a dielectric 125 and an electrode pattern 122 on an upper surface of a sheet made of a magnetic material (eg, ferrite). That is, the magnetic sheet 126 is disposed at the bottom of the base layer 120. The dielectric 125 is printed on the upper surface of the magnetic sheet 126. In this case, the dielectric 125 is mainly used of glass, and is printed in the same size and shape as the electrode pattern 122 printed on the dielectric 125. Of course, the dielectric 125 formed between the magnetic sheet 126 and the electrode pattern 122 may be printed larger than the electrode pattern 122 within the set range. Here, since the setting range may be set differently according to the size and shape of the electrode pattern 122, the range is not limited. The electrode pattern 122 is printed on the top surface of the dielectric 125. In this case, the lead electrode 123 exposed to the outside is formed at one end of the electrode pattern 122, and the electrode pattern 142 of the first pattern layer 140 is formed at the other end of the electrode pattern 122. A lead electrode 124 connected to the lead electrode 146 is formed.

The base layer 120 may have a core 127 made of a magnetic material at a central portion thereof. Here, a dielectric 121 (for example, LTCC) may be printed on the base layer 120 to facilitate printing of the first pattern layer 140 on the top surface on which the dielectric 125 and the electrode pattern 122 are formed. That is, the dielectric 121 is additionally printed on the upper surface of the magnetic sheet 126 on which the dielectric 125 and the electrode pattern 122 are formed to facilitate printing of the first pattern layer 140.

The first pattern layer 140 is positioned on the base layer 120. The first pattern layer 140 is formed by printing an electrode pattern 142 on the top surface of the sheet 141 made of a dielectric (eg, LTCC). That is, the first pattern layer 140 is formed by printing a spiral electrode pattern 142 on the upper surface of the dielectric sheet 141. In this case, the lead electrode 144 exposed to the outside is formed at one end of the electrode pattern 142, and the electrode pattern 122 of the base layer 120 (that is, the lead electrode 124 of the base layer 120) is formed at the other end thereof. A lead electrode 146 connected to the)) is formed. Here, the core 147 of the magnetic material may be formed in the center of the dielectric sheet 141 (that is, inside the electrode pattern 142). A dielectric (eg, LTCC) (not shown) may be printed on the first pattern layer 140 on the electrode pattern 142.

The first pattern layer 140 may be formed by printing a spiral electrode pattern 142 on the upper surface of the base layer 120 without using a separate dielectric sheet 141. That is, when a dielectric (eg, LTCC) is printed on the top surface of the base layer 120, the first pattern layer 140 may be formed by printing a spiral electrode pattern 142 on the top surface of the base layer 120. It may be.

The second pattern layer 160 is positioned on the first pattern layer 140. The second pattern layer 160 is formed by printing an electrode pattern 162 on the top surface of the sheet 161 made of a dielectric (eg, LTCC). That is, the second pattern layer 160 is formed by printing a spiral electrode pattern 162 on the upper surface of the dielectric sheet 161. At this time, the lead electrode 164 exposed to the outside is formed at one end of the electrode pattern 162, and the electrode pattern 182 of the protective layer 180 (ie, the lead electrode 184 of the protective layer 180) is formed at the other end. A lead electrode 166 connected to the)) is formed. Here, the core 167 of the magnetic material may be formed in the center of the dielectric sheet 161 (that is, inside of the electrode pattern 162). A dielectric (eg, LTCC) may be printed on the second pattern layer 160 on the electrode pattern 162.

The second pattern layer 160 may be formed by printing an electrode pattern 162 on an upper surface of the first pattern layer 140. That is, the second pattern layer 160 may be formed by printing a spiral electrode pattern 162 on the top surface of the first pattern layer 140 on which the dielectric (eg, LTCC) is printed.

The passivation layer 180 is positioned on the second pattern layer 160. The protective layer 180 is formed by printing an electrode pattern 182, a dielectric 185, and a magnetic sheet (eg, ferrite) material 186 on a top surface of the sheet 181 formed of a dielectric (eg, LTCC). That is, the protective layer 180 forms the electrode pattern 182 on the top surface of the dielectric sheet 181. At this time, one end of the electrode pattern 182 is formed with the extraction electrode 184 exposed to the outside, the other end of the electrode pattern 162 of the second pattern layer 160 (that is, of the second pattern layer 160) A lead electrode 183 connected to the lead electrode 166 is formed. The dielectric 185 is printed on the top surface of the electrode pattern 182. In this case, the dielectric 185 is mainly glass, and is printed in the same size and shape as the electrode pattern 182 printed on the dielectric sheet 181. Of course, the dielectric 185 formed between the magnetic sheet 186 and the electrode pattern 182 may be printed larger than the electrode pattern 182 within the set range. Here, since the setting range may be set differently according to the size and shape of the electrode pattern 182, the setting range is not limited. The magnetic sheet 186 is printed on the top surface of the dielectric sheet 181 to cover the electrode pattern 182 and the dielectric 185. The core 187 may be printed on the bottom surface of the magnetic sheet 186.

The protective layer 180 may be formed by printing the electrode pattern 182, the dielectric 185, and the magnetic sheet 186 on the upper surface of the second pattern layer 160 without using a separate dielectric sheet 181. . That is, when the dielectric layer (eg, LTCC) is printed on the upper surface of the second pattern layer 160, the protective layer 180 may include the electrode pattern 182, the dielectric 185, and the upper surface of the second pattern layer 160. The magnetic sheet 186 may be printed and formed.

Hereinafter, the characteristics of the common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

10 is a view for explaining the characteristics of the common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention.

The common mode filter 100 for HDMI may include a dielectric 125 formed between the magnetic sheets 126 and 186 and the electrode patterns 122 and 182 in order to minimize blockage of transmission of magnetic properties to the electrode patterns 122 and 182. , 185 is formed in the same manner as the electrode patterns 122 and 182. That is, by forming the dielectrics 125 and 185 having the same size as the electrode patterns 122 and 182 between the magnetic sheets 126 and 186 and the electrode patterns 122 and 182, the electrode sheets 122 and 182 are formed into the electrode patterns 122 and 182. It is characterized by minimizing the blocking of the transfer of magnetic properties. Of course, the dielectrics 125 and 185 formed between the magnetic sheets 126 and 186 and the electrode patterns 122 and 182 may be printed larger than the electrode patterns 122 and 182 within a setting range. Here, the setting range may be set differently according to the size and shape of the electrode patterns 122 and 182, and thus the setting range is not limited. For example, as shown in FIG. 10, when the electrode patterns 122 and 182 having a line width of about 50 μm are printed, the dielectrics 125 and 185 may be printed to have a line width of about 150 μm or less. Can be.

11 and 12 are views for comparing and explaining the characteristics of the common mode filter for HDMI and the conventional common mode filter for HDMI formed by the method for manufacturing a common mode filter for HDMI according to the first embodiment of the present invention.

 In FIG. 11, curve A shows a change in common mode impedance of the common mode filter 100 for HDMI according to the first embodiment of the present invention, and curve B shows a conventional common mode filter 100 for HDMI using LTCC interleave. ) Shows the change in common mode impedance. Curve C shows the differential mode impedance change of the common mode filter 100 for HDMI according to the first embodiment of the present invention, curve D is a differential mode of the conventional common mode filter 100 for HDMI using LTCC interleaver The impedance change is shown.

As can be seen in FIG. 11, the base layer is printed between the magnetic sheets 126 and 186 and the electrode patterns 122 and 182 by printing the dielectrics 125 and 185 which are the same as or larger than the electrode patterns 122 and 182 or within a set range. As the 120 and the protective layer 180 are formed, the common mode impedance in the low frequency band of about 100 MHz is increased (raised) by 20% or more.

On the other hand, as shown in Figure 12, the common mode filter 100 for HDMI and the conventional common mode filter 100 for HDMI according to the first embodiment of the present invention in a low frequency band of about 100 MHz (Ω) It can be seen that the differential mode impedance has almost the same characteristics in the common mode SRF and the differential mode SRF. That is, the common mode filter 100 for HDMI according to the first embodiment of the present invention which partially prints the dielectrics 125 and 185 has the same effect as that formed on the magnetic body, and has the same insulation characteristics as those of the dielectrics. It means to have.

As described above, the partial mode printing common mode filter 100 for HDMI is a conventional common mode for HDMI, which is a dielectric sheet stacking method covering the entire surface of the magnetic sheet in the characteristics of differential mode impedance, common mode SRF, and differential mode SRF. While maintaining the same characteristics as the filter 100, it can be seen that there is an effect that the common mode impedance is increased by 20% or more compared with the conventional common mode filter 100 for HDMI.

13 to 14 are diagrams for explaining characteristics according to firing temperature of an HDMI common mode filter formed by a method for manufacturing a common mode filter for HDMI according to a first embodiment of the present invention.

In general, the conventional common mode filter 100 for HDMI prints an electrode pattern made of silver (Ag) on a dielectric sheet (that is, LTCC interlayer) for low dielectric constant (that is, to improve common mode impedance characteristics). Was used. At this time, since a low reactivity dielectric material (for example, CaO-BaO-SiO ₂ , Tg: 700 ° C. or more) is used as the dielectric sheet, a problem arises in the bonding property with the magnetic sheet. Accordingly, the conventional common mode filter 100 for HDMI cannot be fired at a high temperature.

On the other hand, the common mode filter 100 for HDMI according to the first embodiment of the present invention partially prints the dielectrics 125 and 185 of the glass material between the magnetic sheets 126 and 186 and the electrode patterns 122 and 182. Use the method. When the dielectrics 125 and 185 are printed, there is no problem in bonding with the magnetic sheets 126 and 186. Accordingly, the common mode filter 100 for HDMI according to the first embodiment of the present invention can be fired at a high temperature, thereby increasing the magnetic permeability.

In Fig. 13, curve E shows the change in the common mode impedance of the common mode filter 100 for HDMI fired at about 890 ° C, and curve F shows the change in the common mode filter 100 for HDMI fired at about 830 ° C. Common mode impedance change is shown. Curve G shows the differential mode impedance change of the common mode filter 100 for HDMI fired at about 890 ° C., and curve H shows the differential mode impedance change of the common mode filter 100 for HDMI fired at about 830 ° C. It is shown.

As can be seen from Fig. 13, since the common mode filter 100 for HDMI is fired at a firing temperature of about 890 ° C, the firing temperature of the common mode impedance in the low frequency band of about 100 MHz is about 830 ° C. Is increased by more than 10% compared to the common mode filter 100 for HDMI.

Meanwhile, as shown in FIG. 14, the common mode filter 100 for the HDMI fired at about 890 ° C. has a common mode impedance and the differential mode SRF compared to the common mode filter 100 for the HDMI fired at about 830 ° C. It can be seen that the impedance increases (raises). That is, since the common mode filter 100 for HDMI according to the first embodiment of the present invention can be baked at a high temperature by partially printing a dielectric for insulating the magnetic material and the electrode pattern, the magnetic permeability of the magnetic material is increased to increase the common mode impedance. And the differential mode SRF impedance is increased.

15 is a view for explaining the cutoff frequency characteristics of the common mode filter for HDMI formed by the method for manufacturing the common mode filter for HDMI according to the first embodiment of the present invention.

As shown in FIG. 15, the common mode filter 100 for HDMI according to the first embodiment of the present invention has a cutoff frequency at about 3.5 kHz. Through this, it can be seen that the HDMI common mode filter 100 according to the first embodiment of the present invention satisfies a cutoff frequency characteristic of 3 kHz or more that is required in the HDMI common mode filter 100 market. That is, the HDMI common mode filter 100 according to the first embodiment of the present invention may be miniaturized and slimmed, differential mode impedance characteristics, IR characteristics, cutoff frequency characteristics, and the like, which are required in the HDMI common mode filter 100 market. And improved common-mode impedance characteristics.

(Second Embodiment)

Hereinafter, the common mode filter for HDMI according to the second embodiment of the present invention will be described in detail with reference to the accompanying drawings. 16 is a view for explaining a method for manufacturing a common mode filter for HDMI according to a second embodiment of the present invention. FIG. 17 is a view for explaining the method of manufacturing the base layer of FIG. 16, FIG. 18 is a view for explaining the first pattern layer manufacturing method of FIG. 16, and FIG. 19 is a view for explaining the second pattern layer manufacturing method of FIG. 16. 20 is a diagram for describing the protective layer manufacturing method of FIG. 16.

As shown in FIG. 16, in the method of manufacturing a common mode filter for HDMI, the base layer 220, the first pattern layer 240, the second pattern layer 260, and the protective layer 280 are formed by printing. Lamination is carried out to produce a common mode filter 200 for HDMI. That is, after forming each layer constituting the common mode filter 200 for HDMI by a multilayer printing method, the respective layers are laminated to manufacture the common mode filter 200 for HDMI.

Of course, the method of manufacturing a common mode filter for HDMI may be manufactured by stacking each layer to produce the common mode filter 200 for HDMI. That is, the base layer 220 is formed by a lamination printing method, and the first pattern layer 240, the second pattern layer 260, and the protective layer 280 are sequentially laminated on the base layer 220 by printing. The common mode filter 200 for HDMI is manufactured.

Here, the method of manufacturing a common mode filter for HDMI may include dielectrics 222 and 281 formed on the base layer 220 and the protective layer 280 to insulate the magnetic sheets 221 and 283 and the electrode patterns 223 and 282. It is characterized in that formed in the same size and shape as the electrode patterns (223, 282). Of course, the dielectrics 222 and 281 may be printed larger than the electrode patterns 223 and 282 within a setting range. Here, the setting range may be set differently according to the size and shape of the electrode patterns 223 and 282, and thus the range is not limited.

First, as shown in FIG. 17, in order to form the base layer 220, a dielectric 222, an electrode pattern 223, a dielectric sheet 224, and a magnetic body 225 are laminated and printed on the magnetic sheet 221. do. That is, the dielectric 222 is printed on the upper surface of the magnetic sheet 221, the electrode pattern 223 is printed on the upper surface of the dielectric 222, and the dielectric sheet 224 is printed on the electrode pattern 223. . The base layer 220 is formed by printing the magnetic material 225 on the outer side and the center of the magnetic sheet 221 so as to be spaced apart from the electrode pattern 223.

In the forming of the base layer 220, a via electrode 226 is formed to electrically connect the electrode pattern 223 to the electrode pattern 243 of the first pattern layer 240.

Here, it is to be understood that the via electrode 226 is formed by filling a hole with a magnetic material after the hole is punched in the sheet by laser punching or mechanical punching.

In the forming of the base layer 220, the dielectric 222 is printed only on a portion where the electrode pattern 223 is formed. That is, in the printing of the dielectric 222, the dielectric 222 is printed in the same size and shape as the electrode pattern 223. Of course, in the printing of the dielectric 222, the dielectric 222 may be printed larger than the electrode pattern 223 within a setting range.

Next, as shown in FIG. 18, in order to form the first pattern layer 240, a dielectric 242, an electrode pattern 243, a dielectric sheet 244, and a magnetic body 245 are formed on the magnetic sheet 241. Print laminated. That is, the dielectric 242 is printed on the upper surface of the magnetic sheet 241, the electrode pattern 243 is printed on the upper surface of the dielectric 242, and the dielectric sheet 244 is printed on the electrode pattern 243. The first pattern layer 240 is formed. At this time, the magnetic body 245 is printed on the outer side and the center of the magnetic sheet 241 so as to be spaced apart from the electrode pattern 243. Thereafter, the formed first pattern layer 240 is laminated on the base layer 220.

Of course, in the forming of the first pattern layer 240, the magnetic sheet 241, the dielectric 242, the electrode pattern 243, the dielectric sheet 244, and the magnetic body 245 on the base layer 220. The first pattern layer 240 may be formed by laminating printing. That is, the magnetic sheet 241 is printed on the dielectric sheet 224 of the base layer 220, and the dielectric 242 is printed on the magnetic sheet 241. The electrode pattern 243 is printed on the dielectric 242, and the dielectric sheet 244 is printed on the electrode pattern 243. The first pattern layer 240 is formed by printing the magnetic material 245 on the outer side and the center of the magnetic sheet 241 to be spaced apart from the electrode pattern 243. Accordingly, the process of stacking the first pattern layer 240 on the base layer 220 may be omitted.

In the forming of the first pattern layer 240, the dielectric 242 is printed only on a portion where the electrode pattern 243 is formed. That is, in the printing of the dielectric 242, the dielectric 242 is printed in the same size and shape as the electrode pattern 243. Of course, in the printing of the dielectric 242, the dielectric 242 may be printed larger than the electrode pattern 243 within a setting range.

Next, as shown in FIG. 19, in order to form the second pattern layer 260, the dielectric sheet 262, the electrode pattern 263, the dielectric sheet 264, and the magnetic body 265 are formed on the magnetic sheet 261. Print laminated. That is, the dielectric 262 is printed on the upper surface of the magnetic sheet 261, the electrode pattern 263 is printed on the upper surface of the dielectric 262, and the dielectric sheet 264 is printed on the electrode pattern 263. The second pattern layer 260 is formed. At this time, the magnetic body 265 is printed on the outer side and the central portion of the magnetic sheet 261 to be spaced apart from the electrode pattern 263. Thereafter, the formed second pattern layer 260 is stacked on the first pattern layer 240.

Of course, in the step of forming the second pattern layer 260, the magnetic sheet 261, the dielectric 262, the electrode pattern 263, the dielectric sheet 264, and the magnetic material are formed on the first pattern layer 240. The second pattern layer 260 may be formed by stack printing 265. That is, the magnetic sheet 261 is printed on the dielectric sheet 244 of the first pattern layer 240, and the dielectric 262 is printed on the magnetic sheet 261. The electrode pattern 263 is printed on the dielectric 262, and the dielectric sheet 264 is printed on the electrode pattern 263. The second pattern layer 260 is formed by printing the magnetic material 265 on the outer side and the center of the magnetic sheet 261 to be spaced apart from the electrode pattern 263. Accordingly, the process of stacking the second pattern layer 260 on the first pattern layer 240 may be omitted.

In the forming of the second pattern layer 260, a via electrode 266 is formed to electrically connect the electrode pattern 263 to the electrode pattern 282 of the protective layer 280.

Here, it is to be understood that the via electrode 266 is formed by filling a hole with a magnetic material after the hole is punched in the sheet by laser punching or mechanical punching.

In the forming of the second pattern layer 260, the dielectric 262 is printed only on a portion where the electrode pattern 263 is formed. That is, in the printing of the dielectric 262, the dielectric 262 is printed in the same size and shape as the electrode pattern 263. Of course, in the printing of the dielectric 262, the dielectric 262 may be printed larger than the electrode pattern 263 within a setting range.

Finally, as shown in FIG. 20, in order to form the protective layer 280, the dielectric 281 and the magnetic sheet 283 are laminated and printed on the electrode pattern 282. That is, the protective layer 280 is formed by printing the dielectric material 281 on the electrode pattern 282 and the magnetic sheet 283 on the dielectric material 281. In this case, the magnetic body 285 is printed on the outer side and the center of the lower surface of the magnetic sheet 283 so as to be spaced apart from the electrode pattern 282. Thereafter, the protective layer 280 is stacked on the second pattern layer 260.

Of course, in the forming of the protective layer 280, the protective layer 280 is formed by laminating and printing the electrode pattern 282, the dielectric 281, and the magnetic sheet 283 on the second pattern layer 260. You may. That is, the electrode pattern 282 is printed on the dielectric sheet 264 of the second pattern layer 260, and the dielectric 281 is printed on the electrode pattern 282. The magnetic body 285 is formed on the outer side and the center of the lower surface of the magnetic sheet 283 so as to be spaced apart from the electrode pattern 282, and the protective layer 280 is formed by printing the magnetic sheet 283 on the dielectric 281. . Accordingly, the process of stacking the protective layer 280 on the second pattern layer 260 may be omitted.

In the printing of the dielectric 281, the dielectric 281 is printed only on a portion where the electrode pattern 282 is formed. That is, in the step of printing the dielectric material 281, the dielectric material 281 is printed in the same size and shape as the electrode pattern 282. Of course, in the step of printing the dielectric material 281, the dielectric material 281 may be printed larger than the electrode pattern 282 within the set range.

As described above, in the method for manufacturing a common mode filter for HDMI according to the second embodiment of the present invention, a dielectric paste is partially printed on a magnetic sheet, an electrode is printed on the dielectric paste, and a via electrode is formed. . The magnetic paste is applied to the core and the side of the magnetic sheet, and the dielectric paste is printed to form each layer. Thereafter, each formed layer is laminated to manufacture a common mode filter for HDMI.

In the method of manufacturing a common mode filter for HDMI according to the second embodiment of the present invention, a dielectric paste is partially printed on a magnetic sheet until all necessary layers are formed, an electrode is printed on the dielectric paste, and a via electrode After the step of repeating the steps of applying the magnetic paste to the core and the side of the magnetic sheet and printing the dielectric paste, the magnetic sheet may be printed on the top to produce a common mode filter for HDMI.

Hereinafter, the structure of the HDMI common mode filter formed by the HDMI common mode filter manufacturing method according to the second embodiment of the present invention will be described.

The common mode filter 200 for HDMI includes a base layer 220, a first pattern layer 240, a second pattern layer 260, and a protective layer 280. Here, the common mode filter 200 for HDMI is divided into a base layer 220, a first pattern layer 240, a second pattern layer 260, and a protective layer 280 for convenience of description. The mode filter 200 is manufactured by stacking the components included in each layer. In particular, the dielectric layers 222 and 281 formed on the base layer 220 and the protective layer 280 to insulate the magnetic sheets 221 and 283 and the electrode patterns 223 and 282 may be formed of the electrode patterns 223 and 282. Characterized in that the same size and shape. Of course, the dielectrics 222 and 281 may be printed larger than the electrode patterns 223 and 282 within a setting range. Here, the setting range may be set differently according to the size and shape of the electrode patterns 223 and 282, and thus the range is not limited.

At this time, in the second embodiment of the present invention, the base layer 220, the first pattern layer 240, and the second pattern layer 260 are formed by laminating and printing a magnetic sheet, a dielectric, an electrode pattern, and a dielectric. do. That is, the dielectrics 222, 242, 262, and 281 are partially printed on the ferrite magnetic sheets 221, 241, 261, and 283 in the same size and shape as the electrode patterns 223,, 243, 263, and 282. The electrode patterns 223, 243, 263, and 282 are printed on the dielectrics 222, 242, 262, and 281. The via electrodes 226 and 266 are printed on the magnetic sheets 241 and 261, and the magnetic bodies 225, 245, 265 and 285 on the upper outer side and the core (center) of the magnetic sheets 221, 241, 261 and 283. ). On top of the magnetic sheets 221, 241, 261, 283 printed with dielectrics 222, 242, 262, 281, electrode patterns 223, 243, 263, 282 and magnetic bodies 225, 245, 265, 285. Printing the dielectrics 222, 242, 262, and 281 to generate a magnetic sheet (that is, a base layer 120, a first pattern layer 140, a second pattern layer 160, and a protective layer 180), The magnetic sheet is laminated to form a common mode filter 200 for HDMI.

The base layer 220 is located at the bottom. The base layer 220 is formed by printing a dielectric 222, an electrode pattern 223, a magnetic body 225, and a dielectric sheet 224 on an upper surface of a sheet 221 formed of a magnetic material (eg, ferrite). That is, the magnetic sheet 221 is disposed at the bottom of the base layer 220. The dielectric 222 for insulating the magnetic sheet 221 and the electrode pattern 223 is printed on the upper surface of the magnetic sheet 221. In this case, the dielectric 222 is mainly glass, and is printed in the same size and shape as the electrode pattern 223 printed on the dielectric 222. Of course, the dielectric 222 formed between the magnetic sheet 221 and the electrode pattern 223 may be printed larger than the electrode pattern 223 within the setting range. Here, since the setting range may be set differently according to the size and shape of the electrode pattern 223, the range is not limited. The electrode pattern 223 is printed on the top surface of the dielectric 222. At this time, the lead electrode (not shown) exposed to the outside is formed at one end of the electrode pattern 223, and the electrode pattern 243 of the first pattern layer 240 is formed at the other end thereof, that is, the first pattern layer 240. A lead electrode (not shown) connected to the lead electrode (not shown) is formed. The magnetic body 225 is printed on the upper surface outer side and the core (center) of the magnetic body sheet 221. The dielectric sheet 224 having the via electrode 226 formed on the magnetic material 225 is printed.

The first pattern layer 240 is positioned on the base layer 220. The first pattern layer 240 is formed by printing a dielectric 242, an electrode pattern 243, a magnetic body 245, and a dielectric sheet 244 on an upper surface of a sheet 241 formed of a magnetic material (eg, ferrite). That is, a magnetic sheet 241 (eg, a ferrite sheet) is disposed at the bottom of the first pattern layer 240. On the upper surface of the magnetic sheet 241, a dielectric 242 for insulating the magnetic sheet 241 and the electrode pattern 243 is printed. In this case, the dielectric 242 is mainly glass, and is printed in the same size and shape as the spiral-shaped electrode pattern 243 printed on the dielectric 242. Of course, the dielectric 242 formed between the magnetic sheet 241 and the electrode pattern 243 may be printed larger than the spiral electrode pattern 243 within the setting range. Here, the setting range may be set differently according to the size and shape of the spiral-shaped electrode pattern 243, and thus the range is not limited. The electrode pattern 243 is printed on the top surface of the dielectric 242. In this case, an extraction electrode (not shown) that is exposed to the outside is formed at one end of the electrode pattern 243, and an electrode pattern 223 of the base layer 220 is formed at the other end of the electrode pattern 243 (that is, the extraction electrode of the base layer 220). And an extraction electrode (not shown) connected thereto) is formed. The magnetic body 245 is printed on the upper surface outer side part and the core (center part) of the magnetic body sheet 241. The dielectric sheet 244 is printed on the magnetic material 245.

The second pattern layer 260 is positioned on the first pattern layer 240. The second pattern layer 260 is formed by printing a dielectric 262, an electrode pattern 263, a magnetic body 265, and a dielectric sheet 264 on an upper surface of a sheet 621 formed of a magnetic material (eg, ferrite). In other words, a magnetic sheet 261 (eg, a ferrite sheet) is disposed at the bottom of the second pattern layer 260. The dielectric 262 for insulating the magnetic sheet 261 and the electrode pattern 263 is printed on the top surface of the magnetic sheet 261. In this case, the dielectric 262 is mainly glass, and is printed in the same size and shape as the spiral electrode pattern 263 printed on the dielectric 262. Of course, the dielectric 262 formed between the magnetic sheet 261 and the electrode pattern 263 may be printed larger than the spiral electrode pattern 263 within a setting range. Here, the setting range may be set differently according to the size and shape of the spiral-shaped electrode pattern 263, and thus the range is not limited. The electrode pattern is printed on the upper surface of the dielectric. At this time, one end of the electrode pattern 263 is formed with a drawing electrode (not shown) that is exposed to the outside, the other end of the electrode pattern 282 of the protective layer 280 (that is, the drawing electrode of the protective layer 280) And an extraction electrode (not shown) connected thereto) is formed. The magnetic body 265 is printed on the upper surface outer side part and the core (center part) of the magnetic body sheet 261. The dielectric sheet 264 having the via electrode 266 formed on the magnetic material 265 is printed.

The protective layer 280 is positioned on the second pattern layer 260. The protective layer 280 is formed by printing a magnetic body 285, an electrode pattern 282, a dielectric 281, and a magnetic sheet 283 on the upper surface of the second pattern layer 260. That is, the magnetic layer 285 is printed on the upper surface core (center) of the second sheet layer 260 in the protective layer 280. The electrode pattern 282 is printed on the upper surface of the second sheet layer 260 by a predetermined distance from the magnetic body 285. At this time, the lead electrode (not shown) exposed to the outside is formed at one end of the electrode pattern 282, the electrode pattern 263 of the second pattern layer 260 (that is, the second pattern layer 260) at the other end A lead electrode (not shown) connected to the lead electrode (not shown) is formed.

The dielectric 281 is printed on the upper surface of the electrode pattern 282. In this case, the dielectric material 281 is mainly glass, and is printed in the same size and shape as the electrode pattern 282. Of course, the dielectric 281 formed between the magnetic sheet 283 and the electrode pattern 282 may be printed larger than the electrode pattern 282 within the setting range. Here, since the setting range may be set differently according to the size and shape of the electrode pattern 282, the setting range is not limited. The magnetic sheet 283 is printed on the upper surface of the dielectric 281 so as to cover the electrode pattern 282 and the dielectric 281.

As described above, the common mode filter for HDMI 200 according to the second embodiment of the present invention prints a magnetic material on the outer surface and the core of the magnetic sheet to influence the upper, lower, left, right, and center portions of the electrode pattern. By forming so as to receive, the common mode impedance is increased compared to the conventional magnetic effect is given only in the upper and lower direction of the electrode pattern, and the punching and casting process is omitted, there is an effect that can reduce the equipment investment cost.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but many variations and modifications may be made without departing from the scope of the present invention. It will be understood that the invention may be practiced.

100: common mode filter for HDMI 120: base layer
121: dielectric sheet 122: electrode pattern
123 and 124: lead-out electrode 125: dielectric
126: magnetic sheet 127: core
140: first pattern layer 141: dielectric sheet
142: electrode patterns 144, 146: lead-out electrode
147: core 160: second pattern layer
161: dielectric sheet 162: electrode pattern
164 and 166: lead-out electrode 167: core
180: protective layer 181: dielectric sheet
182: electrode patterns 183, 184: lead-out electrode
185: dielectric
186: magnetic sheet 187: core
200: common mode filter for HDMI 220: base layer
221: magnetic sheet 222: dielectric
223: electrode pattern 224: dielectric sheet
225: magnetic material 226: via electrode
240: first pattern layer 241: magnetic sheet
242: dielectric 243: electrode pattern
244: dielectric sheet 245: magnetic material
260: second pattern layer 261: magnetic sheet
262: dielectric 263: electrode pattern
264: dielectric sheet 265: magnetic material
266: via electrode 280: protective layer
281 Dielectric 282 Electrode Pattern
283: magnetic sheet 285: magnetic sheet

Claims (18)

Printing an electrode pattern on an upper surface of the magnetic sheet; And
Forming a base layer by printing a dielectric between the magnetic sheet and the electrode pattern;
In the forming of the base layer, the common mode filter for HDMI, characterized in that for printing the dielectric only on the portion where the electrode pattern is formed on the upper surface of the magnetic sheet. The method according to claim 1,
Printing an electrode pattern on the dielectric sheet to form a first pattern layer; And
And stacking the first pattern layer on an upper portion of the base layer. The method according to claim 2,
Printing an electrode pattern on the dielectric sheet to form a second pattern layer; And
And stacking the second pattern layer on top of the first pattern layer. The method according to claim 3,
Printing an electrode pattern on an upper surface of the dielectric sheet;
Printing a dielectric on an upper surface of the electrode pattern;
Printing a magnetic sheet on top of the dielectric to form a protective layer; And
Stacking the protective layer on top of the second pattern layer;
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, characterized in that the dielectric is printed only on a portion where the electrode pattern is formed on the lower surface of the magnetic sheet. The method according to claim 1,
Printing a dielectric sheet on the electrode pattern of the base layer; And
And forming a first pattern layer by printing an electrode pattern on the dielectric sheet. The method according to claim 5,
Printing a dielectric sheet on the electrode pattern of the first pattern layer; And
And forming a second pattern layer by printing an electrode pattern on the dielectric sheet. The method of claim 6,
Printing a dielectric sheet on the electrode pattern of the second pattern layer;
Printing an electrode pattern on an upper surface of the dielectric sheet;
Printing a dielectric on an upper surface of the electrode pattern; And
Forming a protective layer by printing a magnetic sheet on top of the dielectric,
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, characterized in that the dielectric is printed only on a portion where the electrode pattern is formed on the lower surface of the magnetic sheet. The method according to any one of claims 1, 4, and 7,
And printing the dielectric in the same size and shape as the electrode pattern. The method according to any one of claims 1, 4, and 7,
The method of manufacturing a common mode filter for HDMI, characterized in that for printing the dielectric, the dielectric is printed larger than the electrode pattern within a set range. Printing a dielectric on an upper surface of the magnetic sheet;
Printing an electrode pattern on an upper surface of the dielectric;
Printing a dielectric sheet on top of the electrode pattern; And
The method may further include forming a base layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern.
And the dielectric is formed only in a portion where the electrode pattern is formed. The method according to claim 10,
Printing a dielectric on top of the magnetic sheet;
Printing an electrode pattern on the dielectric;
Printing a dielectric sheet on top of the electrode pattern;
Forming a first pattern layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern; And
Stacking the first pattern layer on top of the protective layer;
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is printed only on a portion where the electrode pattern is formed. The method of claim 11,
Printing a dielectric on top of the magnetic sheet;
Printing an electrode pattern on the dielectric;
Printing a dielectric sheet on top of the electrode pattern;
Forming a second pattern layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern; And
Stacking the second pattern layer on top of the first pattern layer;
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is printed only on a portion where the electrode pattern is formed. The method of claim 12,
Printing a dielectric on top of the electrode pattern;
Printing a magnetic sheet on top of the dielectric;
Forming a protective layer by printing a magnetic material on an outer side and a center of a lower surface of the magnetic sheet to be spaced apart from the electrode pattern; And
Stacking the protective layer on top of the second pattern layer;
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is printed only on a portion where the electrode pattern is formed. The method according to claim 10,
Printing a magnetic sheet on top of the dielectric sheet of the base layer;
Printing a dielectric on top of the magnetic sheet;
Printing an electrode pattern on the dielectric;
Printing a dielectric sheet on top of the electrode pattern; And
The method may further include forming a first pattern layer by printing a magnetic material on an outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern.
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is formed only on a portion where the electrode pattern is formed. The method according to claim 14,
Printing a magnetic sheet on the dielectric sheet of the first pattern layer;
Printing a dielectric on top of the magnetic sheet;
Printing an electrode pattern on the dielectric;
Printing a dielectric sheet on top of the electrode pattern;
The method may further include forming a second pattern layer by printing a magnetic material on the outer surface and a central portion of the magnetic sheet to be spaced apart from the electrode pattern.
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is printed only on a portion where the electrode pattern is formed. The method according to claim 15,
Printing an electrode pattern on the dielectric sheet of the second pattern layer;
Printing a dielectric on top of the electrode pattern;
Forming a magnetic body on an outer side and a center of a lower surface of the magnetic sheet to be spaced apart from the electrode pattern; And
The method may further include forming a protective layer by printing the magnetic sheet on top of the dielectric.
In the printing of the dielectric, a method of manufacturing a common mode filter for HDMI, wherein the dielectric is printed only on a portion where the electrode pattern is formed. The method according to any one of claims 10 to 16,
And printing the dielectric in the same size and shape as the electrode pattern. The method according to any one of claims 10 to 16,
The method of manufacturing a common mode filter for HDMI, characterized in that for printing the dielectric, the dielectric is printed larger than the electrode pattern within a set range.

Images