JP2015003410A - Method for manufacturing molded board product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a molded board product which can stabilize accuracy at the time of polishing an end part of the molded board product.SOLUTION: A method for manufacturing a molded board product includes: a molding step of molding a package tray 20 by pressing a pre-board P1 comprising a thermoplastic resin by a pair of molding dies 31, 32 and cutting a peripheral end part P2 of the pre-board P1 by cutting blades 31B, 33A; and a polishing step of polishing an extension part 22 in the package tray 20 by a polishing member 41 after the molding step to chamfer the extension part 22. In the polishing step, the extension part 22 is engaged with a groove part 42 formed in the polishing member 41, and the polishing member 41 is energized to the extension part 22 side by a coil spring 47 compressed from a natural state, thereby forming a pressing state where a polishing surface 42A formed on an inner surface of the groove part 42 presses the extension part 22. The extension part 22 is polished by sliding the polishing surface 42A in the pressing state with respect to the extension part 22.

Description

  The present invention relates to a method for manufacturing a board molded product.

  Conventionally, for example, the following Patent Document 1 is known as a method for producing a board molded product containing a thermoplastic resin. In the following Patent Document 1, a preboard (board member before being formed into a board molded product) is softened by heating, and the softened preboard is press-molded by a pair of molds (molds). A method for producing a molded article is described. Moreover, when pressing a preboard with a pair of shaping | molding die, the unnecessary part of a preboard is cut | disconnected by the shear of a pair of shaping | molding die.

JP 2010-274636 A

  As described above, the unnecessary portion of the preboard is cut by the pair of molds, and the cut portion becomes the terminal portion of the board molded product. Here, when the preboard is sheared by the pair of molding dies, the molding surface of the molding slid relative to the surface of the terminal portion. Thereby, as shown in FIG. 12, the situation where the burr | flash 3 arises in the design surface 1A side in the terminal part 2 of the board molded product 1 is anxious. In addition, in FIG. 12, the sliding direction of the shaping | molding die with respect to the design surface 1A of the terminal part 2 is shown by the arrow line D1.

  Such a burr 3 becomes an obstacle when a board molded product is handled. For this reason, conventionally, the operator removes the burrs 3 by polishing the terminal portion 2 using a paper file and performing chamfering. In FIG. 12, the chamfered portion (two-dot chain line) chamfered by the polishing operation is denoted by reference numeral 2A.

  However, when the terminal portion of the board molded product is polished using a paper file, there is a problem that the accuracy of the polishing operation differs for each operation (or for each operator). For example, it is necessary to press the paper file against the terminal during the polishing operation, but it is difficult for the operator to keep the pressing force of the paper file constant. For this reason, the accuracy of the polishing operation is not stable, which is an obstacle to improving the quality of the board molded product.

  The present invention has been completed based on the above-described circumstances, and an object of the present invention is to provide a method for manufacturing a board molded product capable of stabilizing the accuracy in polishing the terminal portion of the board molded product. And

  In order to solve the above-described problems, the present invention presses a preboard containing a thermoplastic resin with a pair of molds and cuts unnecessary portions of the preboard with a cutting blade provided on the pair of molds. A molding step for molding a board molded product, and polishing performed after the molding step, and chamfering the terminal portion formed by cutting the unnecessary portion in the board molded product with a polishing member And, in the polishing step, the terminal portion is fitted into a groove formed in the polishing member, and the polishing member is biased toward the terminal portion by an elastic member compressed from a natural state. By doing so, the polishing surface provided on the inner surface of the groove portion is pressed against the terminal portion, and the polishing surface in the pressed state is slid with respect to the terminal portion. By causing, characterized in that polishing the terminal portion.

  In the present invention, the polishing surface is pressed against the terminal portion by urging the polishing member against the terminal portion by the compressed elastic member. In this way, the pressing force of the polishing surface that presses the terminal portion is proportional to the compression amount of the elastic member. For this reason, if the compression amount of the elastic member is made constant, the polishing surface can be pressed against the terminal portion with a constant pressing force.

  Moreover, in this invention, it is set as the state which fitted the terminal part to the groove part, and the terminal part is grind | polished with the grinding | polishing surface provided in the groove part. Thereby, the situation where the position of the grinding | polishing surface with respect to a terminal part shifts can be suppressed.

  From the above, in the present invention, the pressing force of the polishing surface with respect to the terminal portion and the position of the polishing surface with respect to the terminal portion can be further stabilized, and the accuracy of the polishing operation can be stabilized.

  The said structure WHEREIN: The said elastic member is interposed between the said grinding | polishing member and the holding member hold | gripped by an operator, In the said grinding | polishing process, the said holding member is brought close to the said polishing member, and the said elastic member is inserted. The member can be compressed more than the natural state, and the opposing distance between the gripping member and the polishing member in the compression direction of the elastic member can be held constant by the holding member.

  By holding the facing distance between the polishing member and the gripping member constant by the holding member, the compression amount of the elastic member interposed between the polishing member and the gripping member can be made constant. Thereby, the pressing force with respect to the terminal part of the grinding | polishing surface in a press state can be made constant.

  The preboard may contain fibers.

  In the case of forming a preboard containing fibers, it is dragged to the cutting blade in a state where fibers and thermoplastic resin are mixed. For this reason, compared with the structure which does not contain a fiber, a burr | flash is easy to produce more by a terminal part and the necessity of performing the grinding | polishing operation | work of a terminal part becomes high. For this reason, when using the pre board containing a fiber, it is suitable to apply this invention.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the board molded product which can stabilize the precision at the time of grind | polishing the terminal part of a board molded product can be provided.

The perspective view which shows the luggage compartment of the vehicle provided with the package tray which concerns on Embodiment 1 of this invention Sectional drawing which shows a pair of shaping | molding die of an open state in a shaping | molding process Sectional drawing which shows a pair of shaping | molding die of a closed state in a shaping | molding process (corresponding to the figure cut | disconnected by the AA line of FIG. 1) Side view showing the polishing tool used in the polishing process Sectional view showing the polishing process The figure which expands and shows the edge part of the extension part of a package tray in FIG. Plan view showing the polishing process Sectional drawing which shows the grinding | polishing process which concerns on Embodiment 2 of this invention. The top view which shows the grinding | polishing process which concerns on Embodiment 2 of this invention. Sectional drawing which shows the grinding | polishing process which concerns on Embodiment 3 of this invention. Sectional drawing which shows the formation process which concerns on Embodiment 3 of this invention. Sectional view showing the state where burrs have occurred at the end of the board molded product

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the package tray 20 of the vehicle shown in FIG. 1 is illustrated as a board molded product. As shown in FIG. 1, the package tray 20 is provided in the luggage compartment 10 of the vehicle.

  The package tray 20 is disposed behind the rear seat 12 in the vehicle and is used for the purpose of shielding the luggage in the luggage compartment 10 from the outside. Further, the package tray 20 is supported so as to be rotatable with respect to the vehicle body with the front end portion as a rotation center.

  The package tray 20 is configured by molding a mixture of a thermoplastic resin (for example, polypropylene or the like) and fibers (for example, vegetable fibers such as kenaf) into a board shape. As shown in FIG. 1, the package tray 20 has, for example, a plan view shape.

  Further, as shown in FIG. 3, the package tray 20 includes a flat portion 21 arranged along the horizontal direction and an extending portion 22 that extends downward from the outer peripheral edge of the flat portion 21. For example, the extended portion 22 is provided over the entire outer periphery of the flat portion 21. That is, the end portion 22 </ b> A of the extending portion 22 is a terminal portion of the package tray 20.

  The package tray 20 of the present embodiment is manufactured using a pair of molds 31 and 32 shown in FIG. 2 and a polishing tool 40 shown in FIGS. 4 and 5. Specifically, the preboard P1 is formed by the pair of forming dies 31 and 32 to form the package tray 20, and then the end portion 22A of the extending portion 22 is polished by the polishing tool 40, whereby the package tray 20 is formed. Complete.

  The pair of molds 31 and 32 can be closed and opened by a drive device (not shown) (for example, an electric motor, an air cylinder, a hydraulic cylinder, etc.). In the following description, the state where the mold 31 and the mold 32 are closed is the closed state (the state shown in FIG. 3), and the state where the mold 31 and the mold 32 are opened is the open state (the state shown in FIG. 2). Shall be called.

  As shown in FIG. 3, the mold 31 (first mold) has a recess 31 </ b> A that follows the shape of the front surface 20 </ b> A (surface facing upward) of the package tray 20. Further, the mold 32 (second mold) has a protrusion 32A that follows the shape of the back surface 20B (surface facing upward) of the package tray 20.

  The protrusion 32A has a shape that can be fitted into the recess 31A. As shown in FIG. 3, in the closed state, the surface of the protrusion 32 </ b> A and the surface of the recess 31 </ b> A are opposed to each other with a distance equal to the plate thickness of the package tray 20. That is, in the closed state, a base material forming space S <b> 1 for forming the package tray 20 is formed between the forming die 31 and the forming die 32.

  A cutting blade 31B (shear blade) is provided at the opening end of the recess 31A in the molding die 31. Further, a cutting blade 33 </ b> A is provided in the stepped portion 33 of the mold 32. An unnecessary portion of the pre-board P1 is cut by shearing the cutting blade 31B and the cutting blade 33A.

  Next, the configuration of the polishing tool 40 will be described. The polishing tool 40 is made of, for example, a metal material such as iron, and includes a polishing member 41 having a polishing surface 42A and a holding member 51 for an operator to hold, as shown in FIG. Yes.

  The polishing member 41 has, for example, a round bar shape. A groove portion 42 is formed in the central portion of the polishing member 41 in the longitudinal direction. As shown in FIG. 5, the groove portion 42 can fit the end portion 22 </ b> A (the terminal portion of the package tray 20) of the extending portion 22.

  The groove portion 42 is formed by making the central portion of the polishing member 41 smaller in diameter than the periphery, and extends over the entire circumference of the polishing member 41 in the circumferential direction. The groove portion 42 has a substantially V shape in sectional view opened toward the outside of the polishing member 41.

  Of the two inner surfaces 42A and 42B constituting the groove 42, one surface has fine irregularities. As a result, the one surface 42A is a polished surface 42A. Such a polished surface can be formed, for example, by performing knurling on one surface 42A.

  As shown in FIG. 4, the grip member 51 has, for example, a round bar shape, and is arranged in parallel with the polishing member 41. The holding member 51 and the polishing member 41 are connected by two pin members 45 and 45.

  One end of the pin member 45 is connected to the polishing member 41. The two pin members 45, 45 are arranged on one end side and the other end side of the polishing member 41 with the groove portion 42 as a reference.

  The other end of the pin member 45 is inserted into the through hole 52 formed in the gripping member 51 from the polishing member 41 side (lower side in FIG. 4). Thereby, the holding member 51 can be displaced along the longitudinal direction of the pin member 45 (the vertical direction in FIG. 4). That is, the grip member 51 is configured to be close to or away from the polishing member 41.

  Further, the other end portion of the pin member 45 is provided with a locking portion 46 that locks the hole edge portion of the through hole 52 from the side opposite to the polishing member 41 (upper side in FIG. 4). This prevents the pin member 45 from coming out of the through hole 52.

  A coil spring 47 is wound around the pin member 45. The coil spring 47 is interposed between the gripping member 51 and the polishing member 41, and is arranged in a natural state, for example. The coil spring 47 may be arranged in a compressed state as compared with the natural state.

  A spacer member 48 is provided between one end of the coil spring 47 and the gripping member 51, and a spacer member 49 is provided between the other end of the coil spring 47 and the polishing member 41.

  The spacer members 48 and 49 may not be provided. That is, one end of the coil spring 47 may be in direct contact with the gripping member 51 and the other end of the coil spring 47 may be in direct contact with the polishing member 41.

  Further, when the terminal portion of the package tray 20 is polished by the polishing tool 40, the package tray 20 is placed on the work table 60 and the polishing operation is performed as shown in FIG. The work table 60 is provided with a holding member 61.

  The holding member 61 includes a base end portion 62 erected upward from the upper surface of the work table 60 and a front end portion 63 extending from the base end portion 62. The distal end portion 63 extends in a direction orthogonal to the proximal end portion 62. Further, as shown in FIG. 7, for example, the holding member 61 is provided over the entire outer periphery of the package tray 20.

  As shown in FIG. 5, the distal end portion 63 is configured to contact the gripping member 51 from above. As a result, the polishing tool 40 is disposed between the extended portion 22 and the distal end portion 63 of the package tray 20 so that the coil spring 47 is held in a compressed state.

  Next, a method for manufacturing the package tray 20 will be described. The manufacturing method of the package tray 20 of the present embodiment is performed after the molding step of molding the package tray 20 by pressing the preboard P1 with a pair of molding dies 31 and 32, and the terminal portion of the package tray 20. A polishing step of polishing the end portion 22A of the extended portion 22 with the polishing tool 40.

(Molding process)
In the molding step, as shown in FIG. 2, a preheated preboard P <b> 1 heated in advance is set between the molding die 31 and the molding die 32 in an open state. Examples of the means for heating the preboard P1 include hot air blowing and infrared irradiation.

  Next, as shown in FIG. 3, the pre-board P <b> 1 is press-molded by the mold 31 and the mold 32 by closing the mold 31 and the mold 32. Further, the peripheral end portion P2 (unnecessary portion of the preboard) of the preboard P1 is cut off by shearing of the cutting blade 31B and the cutting blade 33A.

  Thereby, the pre-board P1 is formed into a predetermined shape (product shape) by the forming die 31 and the forming die 32, and is formed as the package tray 20. The extended portion 22 of the package tray 20 is formed by cutting the peripheral end portion P2 of the preboard P1.

(Polishing process)
In the polishing process, the operator places the package tray 20 on the work table 60 as shown in FIG. At this time, the back surface 20B of the package tray 20 is set to face upward (the polishing tool 40 side).

  Next, for example, the operator grips one end 51 </ b> A (the end opposite to the holding member 61) of the gripping member 51 of the polishing tool 40, and the groove 42 of the polishing member 41 on the end 22 </ b> A of the extending portion 22. Mate. At this time, the polished surface 42 </ b> A of the groove 42 is brought into contact with the front surface 20 </ b> A (design surface) side of the extended portion 22.

  Next, the operator compresses the coil spring 47 from the natural state by bringing the gripping member 51 closer to the polishing member 41. Then, the operator moves the gripping member 51 downward from the distal end portion 63 of the holding member 61 and brings the other end portion 51B of the gripping member 51 into contact with the lower surface 63A of the distal end portion 63.

  As a result, the polishing tool 40 is sandwiched between the extended portion 22 and the distal end portion 63. In this state, the other end 51 </ b> B of the gripping member 51 is pressed against the lower surface of the tip 63 by the repulsive force of the compressed coil spring 47. Thereby, the upward displacement of the gripping member 51 is restricted by the distal end portion 63. In other words, the holding member 61 (holding member) holds a constant spacing S2 between the gripping member 51 and the polishing member 41 in the compression direction of the coil spring 47 (vertical direction in FIG. 5).

  Further, the polishing member 41 is biased toward the extended portion 22 by the repulsive force of the compressed coil spring 47. Thereby, the polishing surface 42 </ b> A of the polishing member 41 is pressed against the end surface of the extending portion 22 (the state shown in FIG. 5). In this embodiment, the coil spring 47 is completely compressed in the pressed state.

  Further, in the pressed state, the operator holds the grip member 51 so that the one end 51A is at the same height as the other end 51B. That is, in the pressed state, the gripping member 51 is held so as to be in a horizontal posture.

  The operator holds the one end 51A of the holding member 51 and moves the polishing tool 40 along the outer peripheral end of the package tray 20 while maintaining the pressed state (see FIG. 7). Thereby, the polishing surface 42 </ b> A is slid with respect to the end 22 </ b> A of the extended portion 22.

  As a result, the end 22A of the extended portion 22 is polished by the polishing surface 42A and chamfered. Thereby, as shown in FIG. 6, the corner | angular part by the side of the design surface in end part 22A of the extension part 22 turns into the chamfered chamfer part 23 (chamfering surface). Thereby, the manufacture of the package tray 20 is completed. In FIG. 6, the end 22 </ b> B of the extended portion 22 before chamfering is illustrated by a two-dot chain line.

  In FIG. 7, the moving direction of the polishing tool 40 is indicated by an arrow line R1. In FIG. 7, the polishing tool 40 is moved counterclockwise along the peripheral edge of the package tray 20, but is not limited thereto. The polishing tool 40 may be moved clockwise along the peripheral edge of the package tray 20. Further, in the polishing step, the entire outer periphery of the package tray 20 may be polished, or only a part of the outer periphery of the package tray 20 may be polished.

  Next, the effect of this embodiment will be described. In the present embodiment, the polishing member 41 is urged against the extended portion 22 by the compressed coil spring 47, thereby pressing the polishing surface 42 </ b> A against the extended portion 22.

  In this way, the pressing force of the polishing surface 42 </ b> A that presses the extended portion 22 is proportional to the compression amount of the coil spring 47. For this reason, if the compression amount of the coil spring 47 is made constant, the polishing surface 42A can be pressed against the extending portion 22 with a constant pressing force.

  Further, in the present embodiment, the extended portion 22 is polished by the polishing surface 42 </ b> A provided in the groove portion 42 with the extended portion 22 fitted in the groove portion 42. Thereby, the situation where the position of 42 A of polishing surfaces with respect to the extension part 22 shifts | deviates can be suppressed.

  From the above, in this embodiment, the pressing force of the polishing surface 42A with respect to the extending portion 22 and the position of the polishing surface 42A with respect to the extending portion 22 can be further stabilized, and the accuracy of the polishing operation can be stabilized. it can.

  The coil spring 47 is interposed between the gripping member 51 and the polishing member 41. In the polishing process, the coil spring 47 is compressed more than the natural state by bringing the gripping member 51 closer to the polishing member 41. The opposing distance S2 between the gripping member 51 and the polishing member 41 in the compression direction of the coil spring 47 is held constant by the holding member 61.

  By holding the facing distance S <b> 2 between the polishing member 41 and the gripping member 51 constant by the holding member 61, the compression amount of the coil spring 47 interposed between the polishing member 41 and the gripping member 51 can be made constant. Thereby, the pressing force with respect to the extending part 22 of the polishing surface 42 </ b> A in the pressed state can be made constant.

  Further, when the polishing tool 40 is moved along the peripheral end portion of the package tray 20 by bringing the other end portion 51B of the gripping member 51 into contact with the tip portion 63 of the holding member 61, the tip portion 63 performs polishing. Tool 40 is guided. Thereby, the operator can perform the polishing operation of the extended portion 22 more accurately.

  Further, the preboard P1 contains fibers. When the preboard P1 including fibers is molded, the preboard P1 is dragged to the cutting blade 31B in a state where the fibers and the thermoplastic resin are mixed. For this reason, compared with the structure which does not contain a fiber, a burr | flash becomes easier to produce by the extended part 22, and the necessity of performing the grinding | polishing operation | work of a terminal part becomes high. For this reason, when using the preboard P1 containing a fiber, it is suitable to apply the manufacturing method of this embodiment.

  In the present embodiment, as shown in FIG. 5, the other end 51 </ b> B of the gripping member 51 is positioned by the tip 63 of the holding member 61 in the polishing process. Thereby, the operator can press the polishing surface 42 </ b> A against the end portion 22 </ b> A of the extension portion 22 by pressing the one end portion 51 </ b> A of the gripping member 51 toward the extension portion 22.

  For this reason, the other end 51B of the grip member 51 (the contact portion with the tip 63) serves as a fulcrum, and the one end 51A serves as a power point. As a result, the distance from the fulcrum to the force point becomes longer than the distance from the fulcrum to the polishing surface 42A (action point). As a result, the operator can maintain the pressed state with a smaller force by the lever principle.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the present embodiment, as shown in FIGS. 8 and 9, the holding member 61 of the above embodiment is not provided.

  In the polishing process of the present embodiment, the operator holds the holding surface 61 such that the facing distance S2 between the gripping member 51 and the polishing member 41 is constant without using the holding member 61, and extends the polishing surface 42A in this state. Slide on the end 22 </ b> A of the installation 22.

<Embodiment 3>
Next, a third embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. As shown in FIG. 10, the package tray 220 of this embodiment includes a base material 222, a skin material 223, and a back base fabric 224.

  The base material 222 is configured by molding a mixture of a thermoplastic resin (for example, polypropylene) and a fiber (for example, vegetable fiber such as kenaf) into a board shape.

  The skin material 223 is, for example, a non-woven fabric made of polyethylene terephthalate and is attached to the surface (design surface) of the base material 222. For example, as shown in FIG. 11, such a skin material 223 is held in the recess 31 </ b> A of the mold 31 by vacuuming or the like in the molding process. The skin material 223 held by the mold 31 is attached to the surface of the preboard P1 at the same time as the preboard P1 is pressed by the molds 31 and 32.

  For example, the back base fabric 224 is a non-woven fabric made of polyethylene terephthalate and is attached to the back surface of the base material 222. Such a back base fabric 224 is formed by, for example, a spunbond method.

  Further, in the polishing process of the present embodiment, as shown in FIG. 10, both the end portion of the base material 222 and the end portion of the skin material 223 are polished by the polishing surface 42A. If the operator polishes the end of the skin material 223 with a paper file or the like, the accuracy of the polishing is not stable, and there is a concern that the surface of the skin material 223 may become fluffy due to the polishing work. In this respect, in this embodiment, since the polishing operation can be performed with high accuracy using the polishing tool 40, it is possible to suppress a situation in which the design of the skin material 223 is deteriorated.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the said embodiment, although the package tray 20 was illustrated as a board molded product, it is not limited to this. For example, examples of the molded board include vehicle deck boards, door trims, quarter trims, pillar garnishes, deck side trims, side garnishes, and seat back boards.

  (2) In the above embodiment, the coil spring 47 is exemplified as the elastic member, but is not limited thereto. The elastic member only needs to have a function of biasing the polishing member 41 toward the package tray 20 by being compressed more than the natural state. Examples of the elastic member include a leaf spring, an airbag, and a damper.

  (3) In the above embodiment, the case where the coil spring 47 is completely compressed in the polishing step is illustrated, but the present invention is not limited to this. The compression amount of the coil spring 47 only needs to be maintained at a constant value in the polishing process, and can be changed as appropriate.

  In the first embodiment, as shown in FIG. 5, the holding member 61 is used to keep the spacing S <b> 2 between the gripping member 51 and the polishing member 41 constant. For this reason, by changing the distance Y1 between the front end portion 63 of the holding member 61 and the end portion 22A of the extending portion 22, the facing interval S2 can be changed, and the amount of compression of the coil spring 47 (and hence polishing) The pressing force of the surface 42A can be easily changed.

  (4) The material of the package tray 20 can be changed as appropriate. The package tray 20 only needs to contain at least a thermoplastic resin.

  (5) The shapes of the polishing member 41 and the gripping member 51 are not limited to those illustrated in the above embodiment, and can be changed as appropriate. For example, the polishing member 41 and the gripping member 51 may each have a prismatic shape or a flat plate shape.

DESCRIPTION OF SYMBOLS 20 ... Package tray (board molded product), 22A ... End part (terminal part) of extension part 31, 32 ... A pair of shaping | molding die, 31B ... Cutting blade, 33A ... Cutting blade, 41 ... Polishing member, 42 ... Groove part 42A ... polishing surface, 47 ... coil spring (elastic member), 51 ... gripping member, 61 ... holding member, P1 ... preboard, P2 ... peripheral edge of the preboard (unnecessary part of the preboard), S2 ... gripping member and polishing member Opposite spacing

Claims (3)

A molding step of molding a board molded product by pressing a preboard containing a thermoplastic resin with a pair of molds, and cutting unnecessary portions of the preboard with a cutting blade provided in the pair of molds, and
A polishing step that is performed after the molding step, and chamfered by polishing the terminal portion formed by cutting the unnecessary portion with a polishing member in the board molded product,
In the polishing step,
The end portion is fitted into the groove portion formed in the polishing member, and the polishing member is provided on the inner surface of the groove portion by urging the polishing member toward the end portion by an elastic member compressed from a natural state. The pressed surface pressed against the terminal portion,
A method for manufacturing a board molded product, wherein the terminal portion is polished by sliding the polished surface in the pressed state with respect to the terminal portion. The elastic member is interposed between the polishing member and a gripping member gripped by an operator,
In the polishing step,
By bringing the gripping member closer to the polishing member, the elastic member is compressed more than a natural state,
The manufacturing method of the board molded article of Claim 1 which hold | maintains the opposing space | interval of the said holding member and the said polishing member in the compression direction of the said elastic member uniformly with a holding member.   The manufacturing method of the board molded article of Claim 1 or Claim 2 with which the said pre board contains the fiber.

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