JP2015002041A - Internal illumination type illumination device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an internal illumination type illumination device capable of reducing thickness of the device while suppressing generation of luminance unevenness, in the internal illumination type illumination device using a plurality of planar light-emitting modules.SOLUTION: An internal illumination type illumination device includes: a plurality of planar light-emitting panels 10 arranged so as to have a gap region 54S between each other; a drive circuit board 320 for controlling power supply to the plurality of planar light-emitting panels 10; an illumination panel arranged at a position facing the plurality of planar light-emitting panels 10 and receiving light radiated from the planar light-emitting panels 10; and an optical member 200 arranged in the gap region 54S and reflecting the light radiated from the planar light-emitting panels 10 to the illumination panel side. The drive circuit board 320 is arranged in the gap region 54S so as to be covered by the optical member 200.

Description

  The present invention relates to a structure of an internally illuminated lighting device using a plurality of planar light emitting panels.

  2. Description of the Related Art In recent years, a planar light emitting lighting device using organic EL (Organic Electroluminescence) has been proposed. When it is going to enlarge this illuminating device, it can respond by enlarging the board | substrate which comprises a planar light emission panel (planar light emitting element).

  However, problems such as an increase in the size of the manufacturing apparatus and deterioration in manufacturing yield occur. Japanese Laid-Open Patent Publication No. 2005-266285 (Patent Document 1) and Japanese Patent Laid-Open No. 2006-224697 disclose a technique for obtaining a large-sized lighting device by arranging a plurality of planar light emitting panels that can be easily manufactured in a plane. (Patent Document 2).

  In the case of a lighting device or the like in which a plurality of planar light emitting panels are arranged (tiled), a configuration in which the planar light emitting panel can be attached from the front surface of the lighting device is desirable because of restrictions on installation location and ease of maintenance. It is.

  Furthermore, there is a case where it is desired to suppress the thickness of the lighting device for design and architectural reasons, and a lighting device capable of suppressing the thickness is proposed in Japanese Patent Laid-Open No. 2012-124159 (Patent Document 4). .

  However, in the lighting device disclosed in Patent Document 1, a luminance difference is generated between a non-light-emitting region and a light-emitting region of the planar light-emitting panel that are generated in a gap region between the plurality of planar light-emitting panels and the planar light-emitting panel. (Brightness unevenness) occurs. As a result, it is difficult to provide a lighting device having uniform planar light emission.

  A configuration in which a reflective material is disposed in a non-light emitting area in a gap area between the planar light emitting panel and the planar light emitting panel to eliminate a luminance difference (brightness unevenness) between the light emitting area and the non-light emitting area. This is proposed in Japanese Unexamined Patent Application Publication No. 2010-033818 (Patent Document 3).

JP 2005-266285 A JP 2006-224697 A JP 2010-033818 A JP2012-124159A

  However, the configuration disclosed in Patent Document 3 can be expected to suppress the occurrence of a luminance difference (luminance unevenness) on the light emitting surface side. However, no consideration has been given to the arrangement of drive circuit boards, power supplies, connectors, and the like for use in light emission of the light-emitting panel. In patent document 2, the drive circuit board used for a light emission panel is arrange | positioned on the back surface side opposite to the light emission surface of a light emission panel. As a result, the thickness of the lighting device increases.

  The present invention has been made in view of the above problems, and in an internally-illuminated illumination device using a plurality of planar light emitting modules, it is possible to reduce the thickness of the device while suppressing the occurrence of uneven brightness. An object is to provide an illumination lighting device.

  In the lighting device according to the present invention, a plurality of planar light emitting panels arranged so as to have a gap region between each other, a drive circuit board that controls power supply to the plurality of planar light emitting panels, An illumination panel that is disposed at a position facing a plurality of the planar light emitting panels and receives light emitted from the planar light emitting panel; and a light that is disposed in the gap area and is irradiated from the planar light emitting panel. An optical member that reflects toward the illumination panel.

  The drive circuit board is disposed in the gap region so as to be covered with the optical member.

  In another embodiment, the plurality of planar light emitting panels, the optical member, and the drive circuit board are attached to the same support member.

  In another embodiment, the optical member is detachably attached to the gap region from the lighting panel side.

  According to the present invention, in an internal illumination device using a plurality of planar light emitting modules, an internal illumination device that can reduce the thickness of the device while suppressing occurrence of uneven brightness is provided. Is possible.

It is a front view which shows the inside of the internal illumination type illuminating device in embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. It is a top view which shows the planar light emission panel used for the internal illumination type illuminating device in embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. It is a whole perspective view of the planar light emitting module of the internal illumination type illuminating device in an embodiment. It is a front view of the planar light emitting module except the optical member of the internal illumination type illuminating device in embodiment. It is a whole perspective view which shows the structure of the optical member with which the planar light emission unit of the internal illumination type illuminating device in embodiment is mounted | worn. It is a top view which shows the state which removed the reflection member of the optical member with which the planar light emission unit of the internal illumination type illuminating device in embodiment is mounted | worn. It is the IX-IX line arrow directional view in FIG. It is a perspective view which shows the other structure of the optical member with which the planar light emission unit of the internal illumination type illuminating device in embodiment is mounted | worn. It is a perspective view which shows other structure of the optical member with which the planar light emission unit of the internal illumination type illuminating device in embodiment is mounted | worn. It is a figure which shows the shape of a daruma hole. It is a perspective view which shows other structure of the optical member with which the planar light emission unit of the internal illumination type illuminating device in embodiment is mounted | worn.

  The internal illumination type illumination device in each embodiment based on the present invention will be described below with reference to the drawings. In the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. The same parts and corresponding parts are denoted by the same reference numerals, and redundant description may not be repeated. It is planned from the beginning to use a combination of the configurations in each embodiment as appropriate.

(Interior illumination device 1)
With reference to FIG. 1 and FIG. 2, the internal illumination type illumination device 1 in this Embodiment is demonstrated. FIG. 1 is a front view showing the inside of the internally illuminated lighting device 1, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

  The internally illuminated lighting device 1 in the present embodiment has an illumination panel 60 on the light emitting surface side, and light emitted from the planar light emitting unit 130 is emitted from the inner surface of the illumination panel 60 toward the outer surface. In FIG. 1, only a front view of the four planar light emitting units 130 housed in the interior illumination device 1 is illustrated.

  One planar light emitting unit 130 is composed of an area partitioned by AA in FIG. 1, and in the present embodiment, four planar light emitting units 130 are combined in a state of 2 rows × 2 columns. An internally illuminated illumination device 1 is configured.

  Between the adjacent planar light emitting units 130 (gap region), there are provided third optical members 500 (a total of four locations) that reflect the light emitted from the planar light emitting module 100 toward the illumination panel 60 side. .

  With reference to FIG. 2, the outline of the internal structure of the internal illumination type illuminating device 1 is demonstrated. As described above, the internally illuminated lighting device 1 of the present embodiment is configured by combining four planar light emitting units 130. Furthermore, one planar light emitting unit 130 is configured by combining four planar light emitting modules 100 in a state of 2 rows × 2 columns. Further, one planar light emitting module 100 is configured by combining four planar light emitting panels 10 in a state of 2 rows × 2 columns.

  The illumination panel 60 is located on the most surface side of the internally illuminated illumination device 1. The illumination panel 60 is supported by a housing (not shown) as an example of a support member. The housing is fixed to a wall surface not shown. The lighting panel 60 is made of a light-transmitting material, and generally an acrylic resin or the like is used. For the lighting panel 60, a member having a light scattering effect may be used in order to suppress the occurrence of luminance unevenness.

  The planar light emitting panel 10 is fixed to a module panel 54 as a supporting member constituting the light emitting module 100 using a double-sided tape 120 or the like. The light emitting module 100 is detachably supported with respect to the unit panel 70 constituting the planar light emitting unit 130.

  The first optical member 200 is detachably attached to the module panel 54 in a gap region 54S generated between the planar light emitting panel 10 and the adjacent planar light emitting panel 10. A second optical member 400 is detachably attached to the unit panel 70 in a gap area 70 </ b> S of the unit panel 70 generated between the light emitting module 100 and the adjacent light emitting module 100.

  Each of the first optical member 200 and the second optical member 400 has a substantially trapezoidal shape in which the cross-sectional shape is located on the illumination panel 60 side, and the light emitted from the planar light emitting panel 10 is directed to the illumination panel 60 side. reflect. Thereby, generation | occurrence | production of the brightness nonuniformity at the time of observing the illumination panel 60 from the surface side is suppressed.

(Surface emitting panel 10)
With reference to FIG. 3 and FIG. 4, the structure of the planar light emission panel 10 in this Embodiment is demonstrated. The planar light emitting panel 10 in the present embodiment is composed of an organic EL. The planar light emitting panel 10 may be configured as a planar planar light emitting panel from a plurality of light emitting diodes (LEDs) and a diffusion plate, or as a planar planar light emitting panel using a cold cathode tube or the like. It may be configured.

  FIG. 3 is a plan view showing the planar light emitting panel 10. FIG. 3 shows a state when the planar light emitting panel 10 is viewed from the back surface 19 side of the planar light emitting panel 10. 4 is a cross-sectional view taken along line IV-IV in FIG.

  3 and 4, the planar light emitting panel 10 includes a transparent substrate 11 (cover layer), an anode 14, an organic layer 15, a cathode 16, a sealing member 17, and an insulating layer 18. The transparent substrate 11 forms the surface 12 (light emitting surface) of the planar light emitting panel 10, and the outer peripheral end surface of the transparent substrate 11 forms the outer periphery 10E of the planar light emitting panel 10. The anode 14, the organic layer 15, and the cathode 16 are sequentially stacked on the back surface 13 of the transparent substrate 11. The sealing member 17 forms the back surface 19 of the planar light emitting panel 10.

  The transparent substrate 11 is composed of various glass substrates, for example. As a member constituting the transparent substrate 11, a film substrate such as PET (Polyethylene Terephthalate) or polycarbonate may be used. The anode 14 is a conductive film having transparency. In order to form the anode 14, ITO (Indium Tin Oxide) or the like is formed on the transparent substrate 11 by sputtering or the like. The anode 14 is formed by patterning the ITO film into a predetermined shape by photolithography or the like. The anode 14 is divided into two regions by patterning to form an electrode extraction portion 21 (for anode) and an electrode extraction portion 22 (for cathode).

  The organic layer 15 (light emitting unit) can generate light (visible light) by being supplied with electric power. The organic layer 15 may be composed of a single light emitting layer, or may be composed of a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like that are sequentially laminated. The cathode 16 is, for example, aluminum (AL). The cathode 16 is formed so as to cover the organic layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition.

An insulating layer 18 is provided between the cathode 16 and the anode 14 on the electrode extraction part 21 side so that the cathode 16 and the anode 14 are not short-circuited. The part of the cathode 16 opposite to the side on which the insulating layer 18 is provided is connected to the anode 14 on the electrode extraction part 22 side. The insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO ₂ film is formed using a sputtering method. .

  The sealing member 17 is made of an insulating resin or glass substrate. The sealing member 17 is formed to protect the organic layer 15 from moisture and the like. The sealing member 17 seals substantially the whole of the anode 14, the organic layer 15, and the cathode 16 (member provided inside the planar light emitting panel 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.

  The portion of the anode 14 exposed from the sealing member 17 (on the left side in FIG. 4) constitutes an electrode extraction portion 21 (for anode). The electrode extraction part 21 and the anode 14 are made of the same material. The electrode extraction portion 21 is located on the outer periphery of the planar light emitting panel 10. The portion of the anode 14 exposed from the sealing member 17 (on the right side in FIG. 4) constitutes an electrode extraction portion 22 (for the cathode). The electrode extraction part 22 and the anode 14 are made of the same material. The electrode extraction portion 22 is also located on the outer periphery of the planar light emitting panel 10.

  The electrode extraction portion 21 and the electrode extraction portion 22 are located on opposite sides of the organic layer 15. A divided region 20 (see FIG. 3) is formed between adjacent electrode extraction portions 21 and electrode extraction portions 22. A wiring pattern (not shown) is attached to the electrode extraction portion 21 and the electrode extraction portion 22 using soldering (silver paste) or the like.

  The surface 12 of the planar light emitting panel 10 configured as described above serves as a light emitting region. Electric power is supplied to the organic layer 15 of the planar light emitting panel 10 from an external power supply device through a wiring pattern (not shown), the electrode extraction parts 21 and 22, the anode 14 and the cathode 16. The light generated in the organic layer 15 is extracted from the surface 12 (light emitting surface) to the outside through the anode 14 and the transparent substrate 11.

  In addition to transparent glass, the transparent substrate 11 is a transparent film such as polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polystyrene (PS), polyethersulfone (PES), polycarbonate (PC ), Polypropylene (PP) or the like.

  The anode (anode) 14 is made of a light transmissive material, for example, indium titanium oxide (ITO) or polyethylenedioxythiophene (PEDOT). For the cathode 16, for example, aluminum (Al), lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, or the like is used.

The sealing member 17 is formed by laminating a plurality of layers such as inorganic thin films such as SiO ₂ , AL ₂ O ₃ , SiNx, and flexible acrylic resin thin films on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used. Gold, silver, copper, or the like may be further laminated on the electrode extraction portion 21 and the electrode extraction portion 22.

(Surface emitting module 100)
The planar light emitting module 100 will be described with reference to FIGS. FIG. 5 is an overall perspective view of the planar light emitting module 100, FIG. 6 is a front view of the planar light emitting module 100 excluding the first optical member 200 of the internal illumination device 1, and FIG. 7 is the first optical member 200. It is a whole perspective view which shows the structure.

  Referring to FIGS. 5 and 6, in planar light emitting module 100, a total of four planar light emitting panels 10 are fixed on module panel 54 in 2 rows × 2 columns using double-sided tape 120. . In the present embodiment, the planar light emitting module 100 has a square size of 100 mm × 100 mm.

  The interval between the planar light emitting module 100 adjacent to the top, bottom, left, and right and the gap region 54S is 15 mm. Arbitrary dimensions are selected for the size of the planar light emitting module 100 and the gap 54S according to the specifications of the interior illumination type illumination device 1.

  The cross-shaped first optical member 200 is attached to the gap region 54S of the module panel 54 in a plan view.

  Referring to FIG. 6, a fixing hole 54 a that is used when fixing the planar light emitting module 100 to a planar light emitting unit (not shown) is provided in the gap region 54 </ b> S of the module panel 54.

  Further, in the gap region 54S of the module panel 54, a positioning pin 54p used for attaching the first optical member 200 is erected and a fixing hole 54b is provided. A female screw is formed in the fixing hole 54b. Accordingly, the first optical member 200 can be attached from the light emitting surface side.

(First optical member 200)
The first optical member 200 will be described with reference to FIG. FIG. 7 is an overall perspective view showing the structure of the first optical member 200. The first optical member 200 has a cross-shaped base member 201 in plan view. The base member 201 has a positioning hole 201a at a position corresponding to the positioning pin 54p provided on the module panel 54 and a fixing hole 201b at a position corresponding to the fixing hole 54b.

  Positioning pins 54p provided on the module panel 54 are fitted into the positioning holes 201a, so that the first optical member 200 can be positioned. The base member 201 can be fixed to the gap region 54 </ b> S of the module panel 54 by inserting a bolt into the fixing hole 201 b from the light emitting surface side.

  As will be described later, the base member 201 is provided with holes for fixing an AC / DC power source, a drive circuit board, a cable, and the like, but are not shown in FIG.

  The first optical member 200 includes a reflecting member 210 having a substantially trapezoidal shape whose cross-sectional shape is located on the lighting panel 60 side. The reflection member 210 is provided with a screw hole 210a. The base member 201 is provided with a standing wall portion 202 that supports the reflecting member 210, and the standing wall portion 202 is provided with a fixing female screw hole 202 a at a position corresponding to the screw hole 210 a of the reflecting member 210. After fixing the base member 201 to the module panel 54, the reflection member 210 can be fixed to the base member 201 using the screws 230.

  The inclination angle of the slope of the first optical member 200 (inner angle formed between the reflecting surfaces) is, for example, 45 °. The value of the apex angle may be appropriately changed between 30 ° and 90 °.

  By using the first optical member 200, uniform light emission is realized while suppressing a decrease in luminance of the non-light emitting portion (gap region 54S). Furthermore, by disposing the first optical member 200 in the gap region 54S, even light emission can be performed even if the gap region of the planar light emitting panel 10 is widely arranged. Therefore, the planar light emitting panel 10 used in the lighting device. The number of sheets can be suppressed. As a result, the cost of the lighting device can be suppressed.

  With reference to FIGS. 8 and 9, the arrangement of the AC / DC power supply, the drive circuit board, the cable, and the like will be described. 8 is a plan view showing a state in which the reflecting member 210 of the first optical member 200 is removed, and FIG. 9 is a view taken along the line IX-IX in FIG. A region sandwiched between the planar light emitting panels 10 on the base member 201 is also referred to as a gap region 54S.

  A base member 201 is attached to the gap region 54S. A drive circuit board 320 that controls power supply to the AC / DC power supply 310 and the planar light emitting panel 10 is disposed in the gap on the base member 201.

  An external AC power supply is connected to the AC / DC power supply 310 through a cable 300. A part of the cable 300 is wired so as to pass through the gap region 54S. The electric power converted from AC to DC by the AC / DC power supply 310 is supplied to the drive circuit board 320 through the cable 315. The cable 315 is disposed in the gap region 54S.

  In the drive circuit board 320, for example, light emission or non-light emission of the planar light emitting panel 10 is controlled. A connector 330 is provided on the drive circuit board 320, and cables 340 and 380 for supplying power to the planar light emitting panel 10 are connected. In the present embodiment, cables 350, 360, and 370 are wired between the planar light emitting panels 10. The cables 340, 350, 360, 370, 380 are arranged in the gap region 54S.

  Supply of power to the planar light emitting panel 10 may be either supply by series connection or supply by parallel connection, but FIG. 8 shows the case of series connection. Electric power may be supplied to the planar light emitting panel 10 of another adjacent planar light emitting module 100 using the connector 330. Thereby, it becomes possible to control a plurality of planar light emitting panels 10 and a plurality of planar light emitting modules 100 simultaneously.

  The above-described AC / DC power supply 310, drive circuit board 320, connector 330, and cables 340, 350, 360, 370, 380 are all arranged in the gap region 54S. The first optical member 200 is attached to the gap region 54S. As a result, the AC / DC power supply 310, the drive circuit board 320, the connector 330, and the cables 340, 350, 360, 370, and 380 are covered with the first optical member 200.

  Accordingly, the AC / DC power supply 310, the drive circuit board 320, the connector 330, and the cables 340, 350, and 360 are placed in the space between the first optical member 200 and the base member 201 (module panel 54) in the gap region 54S. , 370, 380 and the like are housed, it is possible to reduce the thickness of the planar light emitting module 100 while suppressing the occurrence of luminance unevenness using the first optical member 200. Furthermore, it is possible to reduce the thickness of the internally illuminated lighting device 1 using the planar light emitting module 100.

  The internally illuminated lighting device 1 shown in FIG. 1 uses four sets of planar light emitting units 130, the planar light emitting unit 130 uses four sets of planar light emitting modules 100, and the planar light emitting module 100 includes As shown in FIG. 5, four planar light emitting panels 10 and one first optical member 200 are used.

  Accordingly, a gap region 70S (see FIG. 2) is also generated between the adjacent planar light emitting modules 100, and the second optical member 400 having the same structure as the first optical member 200 is disposed in the gap region 70S. ing. Also in the gap area 70S, the AC / DC power supply 310, the drive circuit board 320, the connector 330, and the cables 340, 350, 360, 370, and 380 are arranged in the same manner as the gap area 54S between the planar light emitting panels 10. You may do it.

  Further, a gap area is also formed between adjacent planar light emitting units 130, and a third optical member 500 having the same structure as the first optical member 200 is disposed in this gap area. Also in the gap area 70S, the AC / DC power supply 310, the drive circuit board 320, the connector 330, and the cables 340, 350, 360, 370, and 380 are arranged in the same manner as the gap area 54S between the planar light emitting panels 10. You may do it.

(Other forms of optical member)
Other forms of the optical member will be described with reference to FIGS. 10 to 13 are perspective views showing structures of first optical members 200A, 200B, and 200C that are other forms. Similarly to the first optical member 200, the first optical members 200A, 200B, and 200C shown in FIGS. 10 to 13 have a cross shape, but a part of the description is omitted.

  In the first optical member 200 described above, the base member 201 is provided with the positioning hole 201a and the fixing hole 201b. In this case, the reflection member 210 is attached to the base member 201 after the base member 201 is fixed to the gap region 54s in advance.

  The first optical member 200A shown in FIG. 10 is provided with an L-shaped bracket 205 on the lower surface of the base member 201, and the bracket 205 is provided with a positioning hole 205a and a fixing hole 205b. Thereby, after fixing the reflecting member 210 to the base member 201, the first optical member 200A can be attached to the gap region 54S of the module panel 54 from the light emitting surface side.

  A first optical member 200 </ b> B shown in FIG. 11 is provided with a grooved pin 251 on the lower surface of the base member 201. A slot hole 201C shown in FIG. 12 is formed in the gap area 54S of the module panel 54, so that the grooved pin 251 is inserted into the slot hole 201C, and the first optical member 200B is slid along the slot hole 201C. By doing so, the first optical member 200B can be easily attached to the gap region 54S of the module panel 54 from the light emitting surface side.

  In the first optical member 200 </ b> C shown in FIG. 13, a magnet 261 is provided on the lower surface of the base member 201. By providing a magnet in the gap region 54S of the module panel 54, the first optical member 200C can be easily attached to the gap region 54S of the module panel 54 from the light emitting surface side by using the magnetizing force of the magnet. .

  In the above embodiment, a configuration in which four planar light emitting modules 100 are combined is referred to as a planar light emitting unit 130, and a configuration in which the planar light emitting unit 130 is supported by a housing 600 as a support member is employed. It is not limited to. It is also possible to adopt a configuration in which a plurality of planar light emitting modules 100 are directly supported by a housing 600 as a supporting member without using the unit panel 70. It is also possible to employ a configuration in which the unit panel 70 is used as a support member and the housing 600 is not used.

  The light source is not limited to an organic EL panel, and a planar planar light-emitting panel (light source) can also be used. Generally, a large number of planar rigid panels, flexible panels, and a plurality of planar shapes. The present invention can also be applied to a light-emitting panel obtained by modularizing a light-emitting panel, or a general flexible panel, and a light source having high availability can be selected and used according to the application.

  As mentioned above, although the internal illumination type illuminating device in each embodiment of this invention was demonstrated, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. Therefore, the scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Internal illumination type illuminating device, 10 Planar light emission panel, 11 Transparent substrate, 13 Back surface, 14 Anode, 15 Organic layer, 16 Cathode, 17 Sealing member, 18 Insulating layer, 19 Back surface, 20 Divided region 21, 22 Electrode Extraction part, 54 module panel, 54S, 70S clearance area, 54a, 54b fixing hole, 54p positioning pin, 60 lighting panel, 70 unit panel, 100 planar light emitting module, 120 double sided tape, 130 planar light emitting unit, 200 , 200A, 200B, 200C First optical member, 201 Base member, 201C Daruma hole, 201a, 205a Positioning hole, 201b, 205b Fixing hole, 202 Standing wall portion, 202a Fixing female screw hole, 210 Reflecting member, 210a Screw hole 230 screws, 251 grooved pins, 261 magnets, 3 0 Cable, 310 AC / DC power, 315 cable, 320 a driving circuit board, 330 connector, 340,350,360,370,380 cable, 400 second optical member, 500 the third optical member.

Claims (3)

A plurality of planar light emitting panels arranged to have a gap region between each other;
A drive circuit board for controlling power supply to the plurality of planar light emitting panels;
A lighting panel that is disposed at a position facing the plurality of planar light emitting panels and receives light emitted from the planar light emitting panel;
An optical member that is disposed in the gap region and reflects light emitted from the planar light emitting panel to the illumination panel side;
The internal illumination type illumination device, wherein the drive circuit board is disposed in the gap region so as to be covered with the optical member.   The internally illuminated lighting device according to claim 1, wherein the plurality of planar light emitting panels, the optical member, and the drive circuit board are attached to the same support member.   The internally illuminated illumination device according to claim 1 or 2, wherein the optical member is detachably attached to the gap region from the illumination panel side.

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