WO2014192543A1 - Planar light-emitting panel and electronic device - Google Patents

Planar light-emitting panel and electronic device Download PDF

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Publication number
WO2014192543A1
WO2014192543A1 PCT/JP2014/062810 JP2014062810W WO2014192543A1 WO 2014192543 A1 WO2014192543 A1 WO 2014192543A1 JP 2014062810 W JP2014062810 W JP 2014062810W WO 2014192543 A1 WO2014192543 A1 WO 2014192543A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
planar light
electrode layer
layer
panel
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Application number
PCT/JP2014/062810
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French (fr)
Japanese (ja)
Inventor
山東　康博
淳弥 若原
伸哉 三木
充良 内藤
Original Assignee
コニカミノルタ株式会社
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Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2015519776A priority Critical patent/JPWO2014192543A1/en
Publication of WO2014192543A1 publication Critical patent/WO2014192543A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to a planar light emitting panel and an electronic device.
  • Patent Document 1 discloses a technique for illuminating light from a light source in a pattern drawn by an optical fiber by bonding an optical fiber member to a casing of a mobile phone and integrating the casing and the optical fiber member.
  • Patent Document 2 includes an EL light emitting element (EL sheet), a light diffusing member, and a reflecting member.
  • the light diffusing member emits light to the outside of the apparatus housing, and the light diffused inside the apparatus is used as a reflecting member. Again, a technique for outputting light to the outside of the housing by the light diffusing member is disclosed.
  • Patent Document 3 discloses a technique that allows a plurality of EL light emitting elements to be connected in parallel, cut between the EL light emitting elements, and processed into a desired size (length).
  • Patent Document 1 is not suitable for illuminating a wide area because it is limited to illuminating only the portion where the optical fiber member is bonded. Furthermore, since it is necessary to input light from the edge part of an optical fiber member, the subject that the design and mounting restrictions by the position of a light source and an optical fiber member are large occurs.
  • Patent Document 2 it is possible to irradiate light uniformly over a wide area.
  • every time there is a design change such as the size and shape of the exterior member, it is necessary to change the size of the planar light emitting element, which increases the manufacturing cost.
  • time required for designing and manufacturing is required, and it is difficult to make a product quickly.
  • the present invention has been made in view of the above-described problems, and can suppress the occurrence of uneven luminance among a plurality of planar light emitting elements and can easily change the size of the planar light emitting panel. It aims at providing a planar light emission panel and an electronic device provided with these.
  • a planar light emitting element having a light emitting layer sandwiched between a first electrode layer and a second electrode layer on the same transparent substrate is spaced apart from a predetermined gap.
  • a plurality of the planar light emitting elements are arranged in a straight line, and the plurality of planar light emitting elements are connected to one first electrode layer and the other second electrode layer of the adjacent planar light emitting elements.
  • each of the planar light emitting elements is electrically connected in series, and the plurality of planar light emitting elements are covered with a sealing member on the transparent substrate, and a non-light emitting region between the adjacent planar light emitting elements.
  • the first electrode portion and a second electrode portion formed by the is provided so as to sandwich the disconnecting scheduled line.
  • FIG. 3 is a cross-sectional view taken along line II-II in FIG. 3 is a plan view showing a configuration of a planar light emitting panel in Embodiment 1.
  • FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3.
  • 2A and 2B are diagrams illustrating division of the planar light-emitting panel in Embodiment 1, where FIG. 3A is a plan view before cutting, FIG. 3B is a cross-sectional view taken along line VB-VB in FIG. A plan view after cutting, (D) is a cross-sectional view taken along line VD-VD in (C).
  • FIG. 3 is a cross-sectional view illustrating an example of a state in which the planar light-emitting panel in Embodiment 1 is fixed to a housing of an electronic device. It is a perspective view which shows the other state which mounted
  • FIG. 10 is a plan view showing a configuration of a planar light emitting panel in a second embodiment.
  • FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.
  • FIG. 1 is a front view showing the planar light emitting panel 10 and shows a state when the planar light emitting panel 10 is viewed from the back surface 19 side of the planar light emitting panel 10.
  • 2 is a cross-sectional view taken along line II-II in FIG.
  • the planar light emitting panel 10 in the present embodiment is composed of an organic EL.
  • the planar light emitting panel 10 may be configured as a planar light emitting panel from a plurality of light emitting diodes (LEDs) and a diffusion plate, or may be configured as a planar light emitting panel using a cold cathode tube or the like. .
  • a planar light emitting panel 10 includes a transparent substrate 11 (cover layer), an anode (anode) 14, an organic layer 15, a cathode (cathode) 16, a sealing member 17 and an insulating layer 18. Including.
  • the planar light emitting device 1 is constituted by the anode 14, the organic layer 15, and the cathode 16.
  • the transparent substrate 11 forms the surface 12 (light emitting surface) of the planar light emitting panel 10, and the outer peripheral end surface of the transparent substrate 11 forms the outer periphery 10E of the planar light emitting panel 10.
  • the anode 14, the organic layer 15, and the cathode 16 are sequentially stacked on the back surface 13 of the transparent substrate 11.
  • the sealing member 17 forms the back surface 19 of the planar light emitting panel 10.
  • the planar light emitting panel 40 of the present embodiment is intended to be divided, so that light such as polyethylene terephthalate (PET) or polycarbonate (PC) is used.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • a permeable film substrate is used. If there is no problem in dividing the planar light emitting panel 40, various glass substrates may be used.
  • polyimide polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP), etc. are used as the light transmissive film substrate.
  • PEN polyethylene naphthalate
  • PS polystyrene
  • PS polyethersulfone
  • PP polypropylene
  • the anode 14 is a conductive film having transparency.
  • ITO Indium Tin Oxide
  • PEDOT polyethylenedioxythiophene
  • the anode 14 is formed by patterning the ITO film into a predetermined shape by a photolithography method or the like.
  • the anode 14 is divided into two regions by patterning to form an electrode portion 41 (for anode) and an electrode portion 42 (for cathode).
  • the organic layer 15 (light emitting unit) can generate light (visible light) by being supplied with electric power.
  • the organic layer 15 may be composed of a single light emitting layer, or may be composed of a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like that are sequentially laminated.
  • the cathode 16 is, for example, aluminum (AL).
  • the cathode 16 is formed so as to cover the organic layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition.
  • Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
  • An insulating layer 18 is provided between the cathode 16 and the anode 14 on the electrode part 41 side so that the cathode 16 and the anode 14 are not short-circuited.
  • the part of the cathode 16 opposite to the side on which the insulating layer 18 is provided is connected to the anode 14 on the electrode part 42 side.
  • the insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method. .
  • the sealing member 17 is made of an insulating resin or a glass substrate.
  • the sealing member 17 is formed to protect the organic layer 15 from moisture and the like.
  • the sealing member 17 seals substantially the whole of the anode 14, the organic layer 15, and the cathode 16 (member provided inside the planar light emitting panel 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.
  • the sealing member 17 is formed by laminating a plurality of layers of an inorganic thin film such as SiO 2 , AL 2 O 3 , SiNx, and a flexible acrylic resin thin film on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used.
  • the electrode part 41 and the electrode part 42 may be further laminated with gold, silver, copper or the like.
  • the portion exposed from the sealing member 17 of the anode 14 constitutes an electrode portion 41 (for anode).
  • the electrode part 41 and the anode 14 are made of the same material.
  • the electrode part 41 is located on the outer periphery of the planar light emitting panel 10.
  • the portion of the anode 14 exposed from the sealing member 17 (on the right side in FIG. 4) constitutes an electrode portion 42 (for the cathode).
  • the electrode part 42 and the anode 14 are made of the same material.
  • the electrode part 42 is also located on the outer periphery of the planar light emitting panel 10.
  • the electrode part 41 and the electrode part 42 are located on opposite sides of the organic layer 15.
  • a divided region 20 (see FIG. 1) is formed between the adjacent electrode portions 41 and 42.
  • a wiring pattern (not shown) is attached to the electrode part 41 and the electrode part 42 using soldering (silver paste) or the like.
  • the surface 12 corresponding to the organic layer 15 of the planar light emitting panel 10 configured as described above is a light emitting region. Electric power is supplied to the organic layer 15 of the planar light emitting panel 10 from an external power supply device through a wiring pattern (not shown), the electrode portions 41 and 42, the anode 14 and the cathode 16. The light generated in the organic layer 15 is extracted from the surface 12 (light emitting surface) to the outside through the anode 14 and the transparent substrate 11.
  • FIG. 3 is a plan view showing the configuration of the planar light emitting panel 40 in the present embodiment
  • FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
  • the planar light emitting panel 40 in the present embodiment is provided with a first light emitting area LA1, a second light emitting area LA2, and a third light emitting area LA3 on the same transparent substrate 11.
  • the number of the light emitting regions is not limited to three, and if there are two or more, the number is appropriately changed according to required specifications.
  • 3 shows a plan view from the side where the sealing member 17 is provided, but the light emitting regions LA1 to LA3 are also shown in order to clarify the positional relationship.
  • the first light emitting region LA1 is provided on the transparent substrate 11 as a first electrode layer (anode) 14A as a first electrode layer, and a first light emitting layer provided so as to cover the first substrate side electrode layer 14A.
  • the first planar light-emitting element 1A is constituted by the first substrate-side electrode layer 14A, the first light-emitting layer 15A, and the first sealing member-side electrode layer 16A.
  • the second light emitting region LA2 includes a second substrate side electrode layer (anode) 14B as a first electrode layer provided on the transparent substrate 11, and a second light emitting layer provided so as to cover the second substrate side electrode layer 14B.
  • 15B and the 2nd sealing member side electrode layer (cathode) 16B as a 2nd electrode layer provided so that the 2nd light emitting layer 15B may be covered.
  • the second substrate-side electrode layer 14B, the second light-emitting layer 15B, and the second sealing member-side electrode layer 16B constitute the second planar light-emitting element 1B.
  • the third light emitting region LA3 is provided on the transparent substrate 11 as a first electrode layer, the third substrate side electrode layer (anode) 14C, and the third light emitting layer provided to cover the third substrate side electrode layer 14C.
  • 15C and the 3rd sealing member side electrode layer (cathode) 16C as a 2nd electrode layer provided so that the 3rd light emitting layer 15C may be covered.
  • the third planar light emitting element 1C is constituted by the third substrate side electrode layer 14C, the third light emitting layer 15C, and the third sealing member side electrode layer 16C.
  • the first substrate side electrode layer 14A and the second substrate side electrode layer 14B are provided in a straight line at a predetermined interval, and a concave step portion 14d is formed therebetween.
  • a part of the first light emitting layer 15A covering the first substrate side electrode layer 14A and the first sealing member side electrode layer 16A covering the first light emitting layer 15A fall into the stepped portion 14d to form a recess.
  • the first sealing member side electrode layer 16A partially overlaps the upper surface of the second substrate side electrode layer 14B located in the adjacent second light emitting region LA2, and the first sealing member side electrode layer 16A and the second substrate side electrode layer 14B are electrically connected.
  • the second substrate side electrode layer 14B and the third substrate side electrode layer 14C are provided linearly at a predetermined interval, and a concave step portion 14d is formed therebetween.
  • a part of the second light emitting layer 15B covering the second substrate side electrode layer 14B and the second sealing member side electrode layer 16B covering the second light emitting layer 15B fall into the step portion 14d to form a recess.
  • the second sealing member side electrode layer 16B partially overlaps the upper surface of the third substrate side electrode layer 14C located in the adjacent third light emitting region LA3, and the second sealing member side electrode layer 16B and the third substrate side electrode layer 14C are electrically connected.
  • first planar light emitting element 1A, the second planar light emitting element 1B, and the third planar light emitting element 1C are electrically connected in series in a linearly arranged state. Become.
  • the side electrode layer 16 ⁇ / b> C is covered with a single sealing member 17.
  • the first light emitting region LA1 is a region where the first light emitting layer 15A is located in a plan view, and a region where the first light emitting layer 15A surrounding the first light emitting layer 15A is not provided is a non-light emitting region NA.
  • the second light emitting region LA2 is a region where the second light emitting layer 15B is located in a plan view, and a region where the second light emitting layer 15B surrounding the second light emitting layer 15B is not provided is a non-light emitting region NA.
  • the third light emitting region LA3 is a region where the third light emitting layer 15C is located in a plan view, and a region where the third light emitting layer 15C surrounding the third light emitting layer 15C is not provided is a non-light emitting region NA.
  • a scheduled separation line CL when cutting the planar light emitting panel 40 is defined in the non-light emitting area NA located between the first light emitting area LA1 and the second light emitting area LA2.
  • a circular through-opening hole 11H is formed on the planned separation line CL.
  • the 1st electrode part 41 is the 2nd board
  • a cut recess 44 is provided on both sides of the first electrode part 41, and the first electrode part 41 is provided on the protrusion 43.
  • the first electrode portion 41 and the convex portion 43 constitute a terminal T.
  • Cut notches 44 are also provided on both sides of the second electrode portion 42, and the second electrode portion 42 is provided on the convex portion 43.
  • the second electrode part 42 and the convex part 43 constitute a terminal T.
  • a notch recess 44 located between the first electrode part 41 and the second electrode part 42 becomes a notch recess 44 common to both exposed electrodes, and a line CL to be cut off passes through substantially the center of the notch recess 44. To do.
  • a scheduled separation line CL that is cut when the planar light emitting panel 40 is divided is defined.
  • a circular through-opening hole 11H is formed on the planned separation line CL.
  • the first electrode portion 41 is the third substrate-side electrode layer 14C of the third planar light emitting element 1C arranged so as to sandwich the planned separation line CL
  • the second electrode portion 42 is the planned separation line.
  • This is the second sealing member-side electrode layer 16B of the other second planar light emitting element 1B arranged so as to sandwich CL.
  • Cut notches 44 are provided on both sides of the first electrode part 41, and the first electrode part 41 is provided on the convex part 43.
  • the first electrode portion 41 and the convex portion 43 constitute a terminal T.
  • Cut notches 44 are also provided on both sides of the second electrode portion 42, and the second electrode portion 42 is provided on the convex portion 43.
  • the second electrode part 42 and the convex part 43 constitute a terminal T.
  • a notch recess 44 located between the first electrode part 41 and the second electrode part 42 becomes a notch recess 44 common to both exposed electrodes, and a line CL to be cut off passes through substantially the center of the notch recess 44. To do.
  • the left end face of the planar light emitting panel 40 shows a shape after being divided by the line to be separated CL, and is provided in the semicircular through semicircular hole 11 h and the convex portion 43.
  • a first electrode portion 41 is formed.
  • the first electrode portion 41 and the convex portion 43 constitute a terminal T.
  • the right end surface of the planar light emitting panel 40 shows the shape after being divided by the line to be separated CL, and the second electrode portion provided in the semicircular through semicircular hole 11h and the convex portion 43. 42 is formed.
  • the second electrode part 42 and the convex part 43 constitute a terminal T.
  • the method for manufacturing the planar light emitting panel 40 having the above-described configuration is the same as that of the planar light emitting panel 10 shown in FIGS. 1 and 2, and the first planar light emitting element 1A, the second planar light emitting element 1B, and The layers having the same function in the third planar light emitting element 1C are manufactured in the same process.
  • the 1st electrode part 41 and the 2nd electrode part 42 are each formed so that it may be exposed from the sealing member 17, you may form so that it may expose from the reverse surface, ie, the transparent substrate 11, side. It does not ask from which surface to expose.
  • the first electrode portion 41 and the second electrode portion 42 are formed by exposing any portion of the substrate-side electrode layer and the sealing member-side electrode layer that are connected to each other between adjacent planar light emitting elements. Each of them functions as a substrate side electrode layer of one surface light emitting element and a sealing member side electrode layer of the other surface light emitting element after being separated by the line to be separated CL.
  • the sealing in which any part of the substrate-side electrode layer and the sealing member-side electrode layer that are connected to each other in the adjacent planar light emitting element is configured by the transparent substrate 11 and the sealing member 17.
  • the first electrode part 41 and the second electrode part 42 are formed by being exposed from the structure.
  • FIGS. 5A to 5D a description will be given of a case where the planar light emitting panel 40 having the above configuration is cut along a planned line CL.
  • 5A is a plan view before cutting
  • FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A
  • FIG. 5C is a plan view after cutting
  • FIG. 5D is a cross-sectional view taken along line VD-VD in FIG.
  • FIGS. 5C and 5D show a case where the first light emitting area LA1 and the second light emitting area LA2 are separated and divided along the planned line CL.
  • the planned separation line CL is located between the first planar light emitting element 1A and the second planar light emitting element 1B, the first planar light emitting element 1A and the second planar light emitting element 1B are connected in series. Only the connection is cut, and the light emitting element is not cut. Since the sealing member 17 is located on the cut surface, the planar light emitting panel 40 can be cut without causing any electrical problems.
  • both the first electrode portion 41 and the second electrode portion 42 are formed in the protrusion 43, and constitute the terminal T. To do.
  • the planar light emitting panel 40 can be easily inserted by inserting the terminal T into the connector of the electronic device. 40 can be supplied with electric power.
  • FIG. 6 is a perspective view illustrating a state before the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device
  • FIG. 7 illustrates another state in which the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device.
  • FIG. 8 is a cross-sectional view showing another state in which the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device
  • FIG. 9 is an illustration of fixing the planar light emitting panel 40 to the casing 310 of the electronic device. It is sectional drawing which shows an example of a state.
  • the circuit board 100 is provided with a connector 200 provided with pin insertion ports 201 at two locations along the longitudinal direction. Terminals T provided at both ends of the planar light emitting panel 40 can be inserted into the connector 200 from the pin insertion port 201. As a result, power can be easily supplied from the circuit board 100 to the planar light emitting panel 40.
  • the shape of the terminal T is a rectangular shape, but is not limited to this shape, and may be any shape as long as it can be inserted in accordance with the shape of the wiring terminal.
  • the planar light emitting panel 40 can be fixed in a state where it stands vertically with respect to the circuit board 100.
  • the circuit board 100 and two planar light emitting panels 40 along the longitudinal direction of the circuit board 100 are accommodated in the casing 310 of the mobile phone 300 as an electronic device, for example, on the operation surface 330 side.
  • the light generated by the planar light emitting panel 40 can be emitted to the outside from the light transmission window 320 side as a light transmission region provided on both side surfaces of the housing 310.
  • a special positioning mechanism and holding mechanism are not provided by simply inserting the terminal T of the planar light emitting panel 40 into the connector 200.
  • the positional relationship between the light transmission window 320 and the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 can be easily realized.
  • the space for accommodating the planar light emitting panel 40 and the circuit board 100 is limited, so that the planar light emitting panel shown in FIGS. 7 and 8 is used.
  • the configuration in which the 40 is fixed in a state where it stands vertically with respect to the circuit board 100 can effectively use the accommodation space.
  • the planar light emitting panel 40 adjusts the length by cutting the planar light emitting panel 40 even when the size of the housing 310, the size of the light transmission window 320, or the like is changed. Thus, it is possible to easily cope with the planar light emitting panel 40 side. Even if the length of the planar light emitting panel 40 is changed, since the plurality of surface light emitting elements are connected in series, each surface light emitting element can emit light with the same brightness.
  • planar light emitting panel 40 is provided with a through-opening hole 11H. As shown in FIG. 9, the planar light emitting panel 40 can be fixed to the housing 310 using the fixing pin 340 provided in the housing 310 using the through-opening hole 11 ⁇ / b> H.
  • FIG. 10 shows another method of fixing the planar light emitting panel 40A to the circuit board 100.
  • the non-light emitting area NA of the planar light emitting panel 40A is bent (corner indicated by an arrow A in FIG. 10) and arranged along the outer periphery of the electronic device. You can also In this case, the planar light emitting panel 40A is provided with the first light emitting area LA1 to the seventh light emitting area LA7. Electrical connection by the terminal T is performed only at both ends in the longitudinal direction of the planar light emitting panel 40A, and the other terminals T can be used for fixing the planar light emitting panel 40A.
  • FIG. 11 is a plan view showing the configuration of the planar light emitting panel 40B
  • FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.
  • the planar light emitting panel 40B of the present embodiment employs a structure in which the region near the line to be separated CL is not covered with the sealing member 17 in the non-light emitting region NA. Therefore, a part of the first substrate side electrode layer 14A, a part of the first sealing member side electrode layer 16A, a part of the second substrate side electrode layer 14B, a part of the second sealing member side electrode layer 16B, A part of the third substrate side electrode layer 14 ⁇ / b> C and a part of the third sealing member side electrode layer 16 ⁇ / b> C are not covered with the sealing member 17 and are exposed from the sealing member 17.
  • the positions corresponding to the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 are covered with the sealing member 17.
  • the portion exposed from the sealing member 17 of each electrode layer becomes an electrode portion and functions as a terminal T.
  • planar light emitting panel and the electronic apparatus in the present embodiment since a plurality of planar light emitting elements are arranged in series in a straight line with a predetermined gap, luminance variation between the planar light emitting elements. It is suppressed, and even when mounted on an electronic device, uniform light emission is possible, resulting in excellent design and functionality.
  • An electronic device equipped with a planar light-emitting panel can be obtained easily by providing a region in which the planar light-emitting panel can be cut between the planar light-emitting elements.
  • a planar light-emitting panel corresponding to the size of can be quickly created. As a result, an increase in cost associated with a design change can be suppressed.
  • planar light emission panel since the shape which can position and / or fix a planar light emission panel to the circuit board and / or housing
  • a planar light-emitting element in which a light-emitting layer is sandwiched between a first electrode layer and a second electrode layer on the same transparent substrate is linear with a predetermined gap.
  • Each of the planar light emitting elements is electrically connected in series, and the plurality of planar light emitting elements are covered with a sealing member on the transparent substrate, and in a non-light emitting region between the adjacent planar light emitting elements,
  • a line to be separated when the planar light emitting panel is cut is defined, and in the non-light emitting region, at least one of the connected first electrode layer and the second electrode layer is the transparent substrate or the above
  • a first planar light emitting element and a second planar light emitting element are arranged on the transparent substrate with a predetermined gap therebetween, and the first planar light emitting element is provided on the transparent substrate.
  • the first planar light emitting element is provided on the transparent substrate.
  • the second planar light emitting element includes a second substrate side electrode layer provided on the transparent substrate and a second light emitting layer provided to cover the second substrate side electrode layer.
  • a second sealing member side electrode layer provided so as to cover the second light emitting layer, thereby forming a second light emitting region, and between the first light emitting region and the second light emitting region.
  • the non-light emitting region is formed.
  • the non-light emitting area is provided with a fixing area for fixing the planar light emitting panel to an electronic device provided outside.
  • planar light emission panel in any one of the above-mentioned and said planar light emission panel are accommodated, and the light produced
  • the electrode portion is provided and has a terminal that can be inserted into the connector. When the terminal is inserted into the connector, electric power is supplied from the first electrode portion and the second electrode portion to the light emitting layer. .
  • a planar light emitting panel having a configuration capable of suppressing the occurrence of uneven brightness between the plurality of planar light emitting elements and easily changing the size of the planar light emitting panel. And electronic devices can be provided.

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Telephone Set Structure (AREA)

Abstract

A planar light-emitting panel (40) has a plurality of planar light-emitting elements linearly arranged on the same transparent substrate (11) at prescribed intervals, said planar light-emitting elements being configured so that a light-emitting layer is disposed between a first electrode layer and a second electrode layer. The planar light-emitting elements are electrically connected to each other in series. The plurality of planar light-emitting elements is covered by a sealing member on the transparent substrate (11). Imaginary cutting lines (CL) to be used when cutting the planar light-emitting panel (40) are defined by non-light-emitting regions (NA) between adjacent planar light-emitting elements. First electrodes (41) and second electrodes (42), which are formed by exposing the connected first electrode layer and/or the second electrode layer via the transparent substrate (11) or the sealing member, are disposed in the non-light-emitting regions (NA) in such a manner as to sandwich the imaginary cutting lines (CL).

Description

面状発光パネルおよび電子機器Planar light emitting panel and electronic device
　本発明は、面状発光パネルおよび電子機器に関する。 The present invention relates to a planar light emitting panel and an electronic device.
　従来、電子機器、携帯機器（携帯電話、スマートフォン、タブレット端末、その他の小型のモバイル機器）において、光ファイバーを用いて筐体の一部を発光させることで、筐体の一部を照光さる技術、装飾模様を照光させる技術、または、光ファイバーに代わり、ＥＬ(Electro　Luminescence)発光素子を用いる技術が知られている（たとえば、特表２００５－５１８１０８号公報（特許文献1）、特開２００７－３１１０４４号公報（特許文献２）参照、特開２０１０－１８６６０９号公報（特許文献３））。 Conventionally, in electronic devices and mobile devices (cell phones, smartphones, tablet terminals, and other small mobile devices), a technology for illuminating a part of the casing by using an optical fiber to emit part of the casing, A technique for illuminating a decorative pattern or a technique using an EL (Electro Luminescence) light emitting element in place of an optical fiber is known (for example, Japanese Patent Publication No. 2005-518108 (Patent Document 1), Japanese Patent Application Laid-Open No. 2007-311044). (See Japanese Patent Laid-Open No. 2010-186609 (Patent Document 3)).
　特許文献１には、携帯電話の筐体に光ファイバー部材を接着して、筐体と光ファイバー部材とを一体化することで、光源からの光を光ファイバーが描く模様に照光させる技術が開示されている。 Patent Document 1 discloses a technique for illuminating light from a light source in a pattern drawn by an optical fiber by bonding an optical fiber member to a casing of a mobile phone and integrating the casing and the optical fiber member. .
　特許文献２には、ＥＬ発光素子（ＥＬシート）、光拡散部材および反射部材とを備え、光拡散部材により装置筐体外部に光を発光させると共に、装置内部に拡散した光を反射部材を用いて、再度、光拡散部材により光を筐体外部に出力する技術が開示されている。 Patent Document 2 includes an EL light emitting element (EL sheet), a light diffusing member, and a reflecting member. The light diffusing member emits light to the outside of the apparatus housing, and the light diffused inside the apparatus is used as a reflecting member. Again, a technique for outputting light to the outside of the housing by the light diffusing member is disclosed.
　特許文献３には、複数のＥＬ発光素子を並列接続してＥＬ発光素子間で切断し、所望の大きさ（長さ）に加工できる技術が開示されている。 Patent Document 3 discloses a technique that allows a plurality of EL light emitting elements to be connected in parallel, cut between the EL light emitting elements, and processed into a desired size (length).
特表２００５－５１８１０８号公報JP 2005-518108 特開２００７－３１１０４４号公報JP 2007-311044 A 特開２０１０－１８６６０９号公報JP 2010-186609 A
　しかし、特許文献１に開示される技術では、光ファイバー部材が接着している部分のみの照光に制限されるため、広領域を照光することには適さない。さらに、光ファイバー部材の端部から光を入力する必要があるため、光源と光ファイバー部材との位置による意匠および実装制約が大きいという課題がある。 However, the technique disclosed in Patent Document 1 is not suitable for illuminating a wide area because it is limited to illuminating only the portion where the optical fiber member is bonded. Furthermore, since it is necessary to input light from the edge part of an optical fiber member, the subject that the design and mounting restrictions by the position of a light source and an optical fiber member are large occurs.
　特許文献２に開示される技術では、広領域に均一に光を照射することは可能である。しかし、外装部材の大きさ、形状など設計変更がある度に、面状発光素子の大きさを変更することが必要となり製造コストアップとなる。さらに、設計・製造に要する時間が必要となり迅速な製品化が難しいという課題がある。 In the technique disclosed in Patent Document 2, it is possible to irradiate light uniformly over a wide area. However, every time there is a design change such as the size and shape of the exterior member, it is necessary to change the size of the planar light emitting element, which increases the manufacturing cost. Furthermore, there is a problem that time required for designing and manufacturing is required, and it is difficult to make a product quickly.
　特許文献３に開示される技術では、複数のＥＬ発光素子はそれぞれ並列接続されているため、素子間の輝度バラつきが発生し易いという課題がある。これは、ＥＬ発光素子の明るさは電流量により決まり、ＥＬ発光素子を並列に接続するとＥＬ発光素子間の抵抗値の不均一等により、ＥＬ発光素子ごとの電流量が不均一になるからである。 In the technique disclosed in Patent Document 3, since a plurality of EL light emitting elements are respectively connected in parallel, there is a problem that luminance variation is likely to occur between the elements. This is because the brightness of the EL light emitting element is determined by the amount of current, and when the EL light emitting elements are connected in parallel, the current amount of each EL light emitting element becomes non-uniform due to non-uniform resistance values between the EL light emitting elements. is there.
　この発明は上記課題に鑑みてなされたものであり、複数の面状発光素子間の輝度の不均一の発生を抑制するとともに、面状発光パネルの大きさを容易に変更することが可能な構成を備える、面状発光パネルおよび電子機器を提供することを目的とする。 The present invention has been made in view of the above-described problems, and can suppress the occurrence of uneven luminance among a plurality of planar light emitting elements and can easily change the size of the planar light emitting panel. It aims at providing a planar light emission panel and an electronic device provided with these.
　この発明の一側面に従う面状発光パネルにおいては、同一の透明基板上に、発光層が第１電極層および第２電極層に挟まれて構成される面状発光素子を、所定の間隙を隔てて直線状に複数配列した面状発光パネルであって、複数の上記面状発光素子は、互いに隣接する面状発光素子の一方の第１電極層と他方の第２電極層とが接続されることによって、それぞれ電気的に直列に接続されており、複数の上記面状発光素子は、上記透明基板上において封止部材に覆われており、隣接する上記面状発光素子の間の非発光領域には、当該面状発光パネルを切断する際の切離し予定ラインが規定され、上記非発光領域には、接続された上記第１電極層と上記第２電極層のうち少なくともいずれか一方が上記透明基板または上記封止部材から露出することによって形成された第１電極部および第２電極部が、上記切離し予定ラインを挟むように設けられている。 In the planar light emitting panel according to one aspect of the present invention, a planar light emitting element having a light emitting layer sandwiched between a first electrode layer and a second electrode layer on the same transparent substrate is spaced apart from a predetermined gap. A plurality of the planar light emitting elements are arranged in a straight line, and the plurality of planar light emitting elements are connected to one first electrode layer and the other second electrode layer of the adjacent planar light emitting elements. Thus, each of the planar light emitting elements is electrically connected in series, and the plurality of planar light emitting elements are covered with a sealing member on the transparent substrate, and a non-light emitting region between the adjacent planar light emitting elements. Defines a line to be separated when the planar light emitting panel is cut, and at least one of the first electrode layer and the second electrode layer connected to the non-light emitting region is transparent. Exposed from the substrate or the sealing member The first electrode portion and a second electrode portion formed by the is provided so as to sandwich the disconnecting scheduled line.
実施の形態における面状発光パネルの基本構成を示す平面図である。It is a top view which shows the basic composition of the planar light emission panel in embodiment. 図２中ＩＩ－ＩＩ線矢視断面図である。FIG. 3 is a cross-sectional view taken along line II-II in FIG. 実施の形態１における面状発光パネルの構成を示す平面図である。3 is a plan view showing a configuration of a planar light emitting panel in Embodiment 1. FIG. 図３中のＩＶ－ＩＶ線矢視断面図である。FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. 実施の形態１における面状発光パネルの分割を示す図であり、（Ａ）は切断前の平面図、（Ｂ）は、（Ａ）中のＶＢ－ＶＢ線矢視断面図、（Ｃ）は切断後の平面図、（Ｄ）は、（Ｃ）中のＶＤ－ＶＤ線矢視断面図である。2A and 2B are diagrams illustrating division of the planar light-emitting panel in Embodiment 1, where FIG. 3A is a plan view before cutting, FIG. 3B is a cross-sectional view taken along line VB-VB in FIG. A plan view after cutting, (D) is a cross-sectional view taken along line VD-VD in (C). 実施の形態１における面状発光パネルを電子機器の回路基板に装着する前の状態を示す斜視図である。It is a perspective view which shows the state before mounting the planar light emission panel in Embodiment 1 on the circuit board of an electronic device. 実施の形態１における面状発光パネルを電子機器の回路基板に装着した他の状態を示す斜視図である。It is a perspective view which shows the other state with which the planar light emission panel in Embodiment 1 was mounted | worn with the circuit board of the electronic device. 実施の形態１における面状発光パネルを電子機器の回路基板に装着した他の状態を示す断面図である。It is sectional drawing which shows the other state which mounted | wore the circuit board of the electronic device with the planar light emission panel in Embodiment 1. FIG. 実施の形態１における面状発光パネルの電子機器の筐体への固定状態の一例を示す断面図である。FIG. 3 is a cross-sectional view illustrating an example of a state in which the planar light-emitting panel in Embodiment 1 is fixed to a housing of an electronic device. 実施の形態１における面状発光パネルを電子機器の回路基板に装着したさらに他の状態を示す斜視図である。It is a perspective view which shows the other state which mounted | wore the circuit board of the electronic device with the planar light emission panel in Embodiment 1. FIG. 実施の形態２における面状発光パネルの構成を示す平面図である。FIG. 10 is a plan view showing a configuration of a planar light emitting panel in a second embodiment. 図１１中のＸＩＩ－ＸＩＩ線矢視断面図である。FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.
　本発明に基づいた各実施の形態における面状発光パネルおよびこの面状発光パネルを用いた電子機器について、以下、図を参照しながら説明する。以下に説明する実施の形態において、個数、量などに言及する場合、特に記載がある場合を除き、本発明の範囲は必ずしもその個数、量などに限定されない。同一の部品、相当部品に対しては、同一の参照番号を付し、重複する説明は繰り返さない場合がある。各実施の形態における構成を適宜組み合わせて用いることは当初から予定されていることである。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a planar light emitting panel and electronic equipment using the planar light emitting panel in each embodiment based on the present invention will be described with reference to the drawings. In the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. The same parts and corresponding parts are denoted by the same reference numerals, and redundant description may not be repeated. It is planned from the beginning to use a combination of the configurations in each embodiment as appropriate.
　（面状発光パネル１０）
　図１および図２を参照して、本実施の形態における面状発光パネル１０の基本構成について説明する。図１は、面状発光パネル１０を示す正面図であり、面状発光パネル１０の背面１９の側から面状発光パネル１０を見たときの様子を示している。図２は、図１中ＩＩ－ＩＩ線矢視断面図である。 (Surface emitting panel 10)
With reference to FIG. 1 and FIG. 2, the basic structure of the planar light-emitting panel 10 in the present embodiment will be described. FIG. 1 is a front view showing the planar light emitting panel 10 and shows a state when the planar light emitting panel 10 is viewed from the back surface 19 side of the planar light emitting panel 10. 2 is a cross-sectional view taken along line II-II in FIG.
　本実施の形態における面状発光パネル１０は、有機ＥＬから構成される。面状発光パネル１０は、複数の発光ダイオード（ＬＥＤ）と拡散板とから面状発光パネルとして構成されていてもよいし、冷陰極管等を用いて面状発光パネルとして構成されていてもよい。 The planar light emitting panel 10 in the present embodiment is composed of an organic EL. The planar light emitting panel 10 may be configured as a planar light emitting panel from a plurality of light emitting diodes (LEDs) and a diffusion plate, or may be configured as a planar light emitting panel using a cold cathode tube or the like. .
　図１および図２を参照して、面状発光パネル１０は、透明基板１１（カバー層）、陽極（アノード）１４、有機層１５、陰極（カソード）１６、封止部材１７および絶縁層１８を含む。陽極１４、有機層１５、および陰極１６により面状発光素子１を構成する。 1 and 2, a planar light emitting panel 10 includes a transparent substrate 11 (cover layer), an anode (anode) 14, an organic layer 15, a cathode (cathode) 16, a sealing member 17 and an insulating layer 18. Including. The planar light emitting device 1 is constituted by the anode 14, the organic layer 15, and the cathode 16.
　透明基板１１は、面状発光パネル１０の表面１２（発光面）を形成し、透明基板１１の外周端面は、面状発光パネル１０の外周１０Ｅを形成している。陽極１４、有機層１５および陰極１６は、透明基板１１の裏面１３上に順次積層される。封止部材１７は、面状発光パネル１０の背面１９を形成している。 The transparent substrate 11 forms the surface 12 (light emitting surface) of the planar light emitting panel 10, and the outer peripheral end surface of the transparent substrate 11 forms the outer periphery 10E of the planar light emitting panel 10. The anode 14, the organic layer 15, and the cathode 16 are sequentially stacked on the back surface 13 of the transparent substrate 11. The sealing member 17 forms the back surface 19 of the planar light emitting panel 10.
　透明基板１１を構成する部材としては、後述するように、本実施の形態の面状発光パネル４０は、分割することを目的としていることから、ポリエチレンテレフタレート（ＰＥＴ）またはポリカーボネイト（ＰＣ）等の光透過性のフィルム基板が用いられる。面状発光パネル４０を分割することに支障がない場合には、各種ガラス基板を用いてもよい。 As a member constituting the transparent substrate 11, as will be described later, the planar light emitting panel 40 of the present embodiment is intended to be divided, so that light such as polyethylene terephthalate (PET) or polycarbonate (PC) is used. A permeable film substrate is used. If there is no problem in dividing the planar light emitting panel 40, various glass substrates may be used.
　光透過性のフィルム基板としては、他にポリイミド、ポリエチレンナフタレート（ＰＥＮ）、ポリスチレン（ＰＳ）、ポリエーテルサルフォン（ＰＥＳ）、ポリプロピレン（ＰＰ）等が用いられる。 In addition, polyimide, polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP), etc. are used as the light transmissive film substrate.
　陽極１４は、透明性を有する導電膜である。陽極１４を形成するためには、スパッタリング法等によって、ＩＴＯ（Indium　Tin　Oxide：インジウム錫酸化物）等が透明基板１１上に成膜される。陽極１４に用いられる他の材料としては、ポリエチレンジオキシチオフェン（ＰＥＤＯＴ）が用いられる。 The anode 14 is a conductive film having transparency. In order to form the anode 14, ITO (Indium Tin Oxide) or the like is formed on the transparent substrate 11 by sputtering or the like. As another material used for the anode 14, polyethylenedioxythiophene (PEDOT) is used.
　フォトリソグラフィ法等によりＩＴＯ膜が所定の形状にパターニングされることによって、陽極１４が形成される。陽極１４は、電極部４１（陽極用）および電極部４２（陰極用）を形成するために、パターニングによって２つの領域に分割されている。 The anode 14 is formed by patterning the ITO film into a predetermined shape by a photolithography method or the like. The anode 14 is divided into two regions by patterning to form an electrode portion 41 (for anode) and an electrode portion 42 (for cathode).
　有機層１５（発光部）は、電力を供給されることによって光（可視光）を生成することができる。有機層１５は、単層の発光層から構成されていてもよく、正孔輸送層、発光層、正孔阻止層、および電子輸送層などが順次積層されることによって構成されていてもよい。 The organic layer 15 (light emitting unit) can generate light (visible light) by being supplied with electric power. The organic layer 15 may be composed of a single light emitting layer, or may be composed of a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like that are sequentially laminated.
　陰極１６は、たとえばアルミニウム（ＡＬ）である。陰極１６は、真空蒸着法等によって有機層１５を覆うように形成される。陰極１６を所定の形状にパターニングするために、真空蒸着の際にはマスクが用いられるとよい。陰極１６の他の材料としては、フッ化リチウム（ＬｉＦ）、ＡｌとＣａとの積層、ＡｌとＬｉＦとの積層、および、ＡｌとＢａとの積層等が用いられる。 The cathode 16 is, for example, aluminum (AL). The cathode 16 is formed so as to cover the organic layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition. Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
　陰極１６と陽極１４とが短絡しないように、陰極１６と電極部４１側の陽極１４との間に絶縁層１８が設けられる。陰極１６の絶縁層１８が設けられる側とは反対側の部分は、電極部４２側の陽極１４に接続される。絶縁層１８は、たとえばスパッタリング法を用いてＳｉＯ２などが成膜された後、フォトリソグラフィ法等を用いて陽極１４と陰極１６とを互いに絶縁する箇所を覆うように所望のパターンに形成される。 An insulating layer 18 is provided between the cathode 16 and the anode 14 on the electrode part 41 side so that the cathode 16 and the anode 14 are not short-circuited. The part of the cathode 16 opposite to the side on which the insulating layer 18 is provided is connected to the anode 14 on the electrode part 42 side. The insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method. .
　封止部材１７は、絶縁性を有する樹脂またはガラス基板などから構成される。封止部材１７は、有機層１５を水分等から保護するために形成される。封止部材１７は、陽極１４、有機層１５、および陰極１６（面状発光パネル１０の内部に設けられる部材）の略全体を透明基板１１上に封止する。陽極１４の一部は、電気的な接続のために、封止部材１７から露出している。 The sealing member 17 is made of an insulating resin or a glass substrate. The sealing member 17 is formed to protect the organic layer 15 from moisture and the like. The sealing member 17 seals substantially the whole of the anode 14, the organic layer 15, and the cathode 16 (member provided inside the planar light emitting panel 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.
　封止部材１７には、ＰＥＴ、ＰＥＮ、ＰＳ、ＰＥＳ、ポリイミド等のフィルムに、ＳｉＯ２、ＡＬ２Ｏ３、ＳｉＮｘ等の無機薄膜と柔軟性のあるアクリル樹脂薄膜などを層状に複数層重ね合わせることでガスバリア性を備えたものが用いられる。電極部４１および電極部４２には、さらに金、銀、銅などを積層してもよい。 The sealing member 17 is formed by laminating a plurality of layers of an inorganic thin film such as SiO 2 , AL 2 O 3 , SiNx, and a flexible acrylic resin thin film on a film such as PET, PEN, PS, PES, and polyimide. Thus, those having gas barrier properties are used. The electrode part 41 and the electrode part 42 may be further laminated with gold, silver, copper or the like.
　陽極１４の封止部材１７から露出している部分（図２左側）は、電極部４１（陽極用）を構成する。電極部４１と陽極１４とは互いに同じ材料で構成される。電極部４１は、面状発光パネル１０の外周に位置する。陽極１４の封止部材１７から露出している（図４右側の）部分は、電極部４２（陰極用）を構成する。電極部４２と陽極１４とは互いに同じ材料で構成される。電極部４２も、面状発光パネル１０の外周に位置する。 The portion exposed from the sealing member 17 of the anode 14 (left side in FIG. 2) constitutes an electrode portion 41 (for anode). The electrode part 41 and the anode 14 are made of the same material. The electrode part 41 is located on the outer periphery of the planar light emitting panel 10. The portion of the anode 14 exposed from the sealing member 17 (on the right side in FIG. 4) constitutes an electrode portion 42 (for the cathode). The electrode part 42 and the anode 14 are made of the same material. The electrode part 42 is also located on the outer periphery of the planar light emitting panel 10.
　電極部４１および電極部４２は、有機層１５を挟んで相互に反対側に位置している。隣り合う電極部４１および電極部４２同士の間には、分割領域２０（図１参照）が形成されている。電極部４１および電極部４２には、はんだ付け（銀ペースト）等を用いて配線パターン（図示せず）が取り付けられる。 The electrode part 41 and the electrode part 42 are located on opposite sides of the organic layer 15. A divided region 20 (see FIG. 1) is formed between the adjacent electrode portions 41 and 42. A wiring pattern (not shown) is attached to the electrode part 41 and the electrode part 42 using soldering (silver paste) or the like.
　以上のように構成される面状発光パネル１０の有機層１５に対応する表面１２が発光領域となる。面状発光パネル１０の有機層１５には、外部の電源装置から、図示しない配線パターン、電極部４１，４２、陽極１４および陰極１６を通して電力が供給される。有機層１５で生成された光は、陽極１４および透明基板１１を通して、表面１２（発光面）から外部に取り出される。 The surface 12 corresponding to the organic layer 15 of the planar light emitting panel 10 configured as described above is a light emitting region. Electric power is supplied to the organic layer 15 of the planar light emitting panel 10 from an external power supply device through a wiring pattern (not shown), the electrode portions 41 and 42, the anode 14 and the cathode 16. The light generated in the organic layer 15 is extracted from the surface 12 (light emitting surface) to the outside through the anode 14 and the transparent substrate 11.
　（実施の形態１：面状発光パネル４０）
　次に、図３および図４を参照して、上記面状発光パネル１０の基本構成を備える、本実施の形態における面状発光パネル４０の構成について説明する。図３は、本実施の形態における面状発光パネル４０の構成を示す平面図、図４は、図３中のＩＶ－ＩＶ線矢視断面図である。 (Embodiment 1: Planar light emitting panel 40)
Next, with reference to FIG. 3 and FIG. 4, the structure of the planar light emission panel 40 in this Embodiment provided with the basic composition of the said planar light emission panel 10 is demonstrated. 3 is a plan view showing the configuration of the planar light emitting panel 40 in the present embodiment, and FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
　本実施の形態における面状発光パネル４０は、同一の透明基板１１上に、第１発光領域ＬＡ１、第２発光領域ＬＡ２、および第３発光領域ＬＡ３が設けられている。この発光領域の数量は、３ヶ所に限定されず、２以上あれば、適宜要求される仕様に応じて変更される。なお、図３は封止部材１７が設けられている側からの平面視を示しているが、位置の関係を明瞭にするため、発光領域ＬＡ１－ＬＡ３も示されている。 The planar light emitting panel 40 in the present embodiment is provided with a first light emitting area LA1, a second light emitting area LA2, and a third light emitting area LA3 on the same transparent substrate 11. The number of the light emitting regions is not limited to three, and if there are two or more, the number is appropriately changed according to required specifications. 3 shows a plan view from the side where the sealing member 17 is provided, but the light emitting regions LA1 to LA3 are also shown in order to clarify the positional relationship.
　第１発光領域ＬＡ１は、透明基板１１の上に設けられる第１電極層としての第１基板側電極層（アノード）１４Ａと、第１基板側電極層１４Ａを覆うように設けられる第１発光層１５Ａと、第１発光層１５Ａを覆うように設けられる第２電極層としての第１封止部材側電極層（カソード）１６Ａとを含む。第１基板側電極層１４Ａ、第１発光層１５Ａ、および第１封止部材側電極層１６Ａにより、第１面状発光素子１Ａを構成する。 The first light emitting region LA1 is provided on the transparent substrate 11 as a first electrode layer (anode) 14A as a first electrode layer, and a first light emitting layer provided so as to cover the first substrate side electrode layer 14A. 15A and a first sealing member side electrode layer (cathode) 16A as a second electrode layer provided so as to cover the first light emitting layer 15A. The first planar light-emitting element 1A is constituted by the first substrate-side electrode layer 14A, the first light-emitting layer 15A, and the first sealing member-side electrode layer 16A.
　第２発光領域ＬＡ２は、透明基板１１の上に設けられる第１電極層としての第２基板側電極層（アノード）１４Ｂと、第２基板側電極層１４Ｂを覆うように設けられる第２発光層１５Ｂと、第２発光層１５Ｂを覆うように設けられる第２電極層としての第２封止部材側電極層（カソード）１６Ｂとを含む。第２基板側電極層１４Ｂ、第２発光層１５Ｂ、および第２封止部材側電極層１６Ｂにより、第２面状発光素子１Ｂを構成する。 The second light emitting region LA2 includes a second substrate side electrode layer (anode) 14B as a first electrode layer provided on the transparent substrate 11, and a second light emitting layer provided so as to cover the second substrate side electrode layer 14B. 15B and the 2nd sealing member side electrode layer (cathode) 16B as a 2nd electrode layer provided so that the 2nd light emitting layer 15B may be covered. The second substrate-side electrode layer 14B, the second light-emitting layer 15B, and the second sealing member-side electrode layer 16B constitute the second planar light-emitting element 1B.
　第３発光領域ＬＡ３は、透明基板１１の上に設けられる第１電極層としての第３基板側電極層（アノード）１４Ｃと、第３基板側電極層１４Ｃを覆うように設けられる第３発光層１５Ｃと、第３発光層１５Ｃを覆うように設けられる第２電極層としての第３封止部材側電極層（カソード）１６Ｃとを含む。第３基板側電極層１４Ｃ、第３発光層１５Ｃ、および第３封止部材側電極層１６Ｃにより、第３面状発光素子１Ｃを構成する。 The third light emitting region LA3 is provided on the transparent substrate 11 as a first electrode layer, the third substrate side electrode layer (anode) 14C, and the third light emitting layer provided to cover the third substrate side electrode layer 14C. 15C and the 3rd sealing member side electrode layer (cathode) 16C as a 2nd electrode layer provided so that the 3rd light emitting layer 15C may be covered. The third planar light emitting element 1C is constituted by the third substrate side electrode layer 14C, the third light emitting layer 15C, and the third sealing member side electrode layer 16C.
　第１基板側電極層１４Ａと第２基板側電極層１４Ｂとは、所定の間隔を隔てて直線状に設けられ、この間に凹状の段部１４ｄが形成される。第１基板側電極層１４Ａを覆う第１発光層１５Ａの一部、および、第１発光層１５Ａを覆う第１封止部材側電極層１６Ａは、この段部１４ｄに落ち込み、凹部を形成する。この段部１４ｄにおいて、第１封止部材側電極層１６Ａは、隣接する第２発光領域ＬＡ２に位置する第２基板側電極層１４Ｂの上面に一部が重なり、第１封止部材側電極層１６Ａと第２基板側電極層１４Ｂとが電気的に接続される。 The first substrate side electrode layer 14A and the second substrate side electrode layer 14B are provided in a straight line at a predetermined interval, and a concave step portion 14d is formed therebetween. A part of the first light emitting layer 15A covering the first substrate side electrode layer 14A and the first sealing member side electrode layer 16A covering the first light emitting layer 15A fall into the stepped portion 14d to form a recess. In this step 14d, the first sealing member side electrode layer 16A partially overlaps the upper surface of the second substrate side electrode layer 14B located in the adjacent second light emitting region LA2, and the first sealing member side electrode layer 16A and the second substrate side electrode layer 14B are electrically connected.
　同様に、第２基板側電極層１４Ｂと第３基板側電極層１４Ｃとは、所定の間隔を隔てて直線的に設けられ、この間に凹状の段部１４ｄが形成される。第２基板側電極層１４Ｂを覆う第２発光層１５Ｂの一部、および、第２発光層１５Ｂを覆う第２封止部材側電極層１６Ｂは、この段部１４ｄに落ち込み、凹部を形成する。この段部１４ｄにおいて、第２封止部材側電極層１６Ｂは、隣接する第３発光領域ＬＡ３に位置する第３基板側電極層１４Ｃの上面に一部が重なり、第２封止部材側電極層１６Ｂと第３基板側電極層１４Ｃとが電気的に接続される。 Similarly, the second substrate side electrode layer 14B and the third substrate side electrode layer 14C are provided linearly at a predetermined interval, and a concave step portion 14d is formed therebetween. A part of the second light emitting layer 15B covering the second substrate side electrode layer 14B and the second sealing member side electrode layer 16B covering the second light emitting layer 15B fall into the step portion 14d to form a recess. In this step portion 14d, the second sealing member side electrode layer 16B partially overlaps the upper surface of the third substrate side electrode layer 14C located in the adjacent third light emitting region LA3, and the second sealing member side electrode layer 16B and the third substrate side electrode layer 14C are electrically connected.
　このようにして、第１面状発光素子１Ａ、第２面状発光素子１Ｂ、および第３面状発光素子１Ｃは直線的に配列された状態で、それぞれ電気的に直列に接続されることとなる。 In this way, the first planar light emitting element 1A, the second planar light emitting element 1B, and the third planar light emitting element 1C are electrically connected in series in a linearly arranged state. Become.
　第１面状発光素子１Ａの第１封止部材側電極層１６Ａ、第２面状発光素子１Ｂの第２封止部材側電極層１６Ｂ、および第３面状発光素子１Ｃの第３封止部材側電極層１６Ｃは、単一の封止部材１７により覆われている。 The first sealing member-side electrode layer 16A of the first planar light emitting element 1A, the second sealing member side electrode layer 16B of the second planar light emitting element 1B, and the third sealing member of the third planar light emitting element 1C. The side electrode layer 16 </ b> C is covered with a single sealing member 17.
　第１発光領域ＬＡ１は、平面視において第１発光層１５Ａが位置する領域であり、第１発光層１５Ａを取り囲む第１発光層１５Ａが設けられてない領域は非発光領域ＮＡとなる。同様に、第２発光領域ＬＡ２は、平面視において第２発光層１５Ｂが位置する領域であり、第２発光層１５Ｂを取り囲む第２発光層１５Ｂが設けられてない領域は非発光領域ＮＡとなる。第３発光領域ＬＡ３は、平面視において第３発光層１５Ｃが位置する領域であり、第３発光層１５Ｃを取り囲む第３発光層１５Ｃが設けられてない領域は非発光領域ＮＡとなる。 The first light emitting region LA1 is a region where the first light emitting layer 15A is located in a plan view, and a region where the first light emitting layer 15A surrounding the first light emitting layer 15A is not provided is a non-light emitting region NA. Similarly, the second light emitting region LA2 is a region where the second light emitting layer 15B is located in a plan view, and a region where the second light emitting layer 15B surrounding the second light emitting layer 15B is not provided is a non-light emitting region NA. . The third light emitting region LA3 is a region where the third light emitting layer 15C is located in a plan view, and a region where the third light emitting layer 15C surrounding the third light emitting layer 15C is not provided is a non-light emitting region NA.
　図３を参照して、第１発光領域ＬＡ１と第２発光領域ＬＡ２との間に位置する非発光領域ＮＡには、面状発光パネル４０を切断する際の切離し予定ラインＣＬが規定されている。この切離し予定ラインＣＬ上には、円形の貫通開口孔１１Ｈが形成されている。 Referring to FIG. 3, in the non-light emitting area NA located between the first light emitting area LA1 and the second light emitting area LA2, a scheduled separation line CL when cutting the planar light emitting panel 40 is defined. . A circular through-opening hole 11H is formed on the planned separation line CL.
　非発光領域ＮＡには、切離し予定ラインＣＬを挟むように、封止部材１７から第２基板側電極層１４Ｂが露出する第１電極部４１、および、封止部材１７から第１封止部材側電極層１６Ａが露出する第２電極部４２が設けられている。 In the non-light emitting area NA, the first electrode portion 41 where the second substrate side electrode layer 14B is exposed from the sealing member 17 so as to sandwich the planned separation line CL, and the first sealing member side from the sealing member 17 A second electrode portion 42 from which the electrode layer 16A is exposed is provided.
　つまり、第１電極部４１は、切離し予定ラインＣＬを挟むように配置された一方の第２面状発光素子１Ｂの第２基板側電極層１４Ｂであり、第２電極部４２は、切離し予定ラインＣＬを挟むように配置された他方の第１面状発光素子１Ａの第１封止部材側電極層１６Ａである。 That is, the 1st electrode part 41 is the 2nd board | substrate side electrode layer 14B of one 2nd planar light emitting element 1B arrange | positioned so that the separation plan line CL may be pinched | interposed, and the 2nd electrode part 42 is a separation plan line. This is the first sealing member-side electrode layer 16A of the other first planar light emitting element 1A arranged so as to sandwich CL.
　第１電極部４１の両側には、切り込み凹部４４が設けられ、第１電極部４１は凸部４３に設けられている。第１電極部４１と凸部４３とにより端子Ｔを構成する。第２電極部４２の両側にも、切り込み凹部４４が設けられ、第２電極部４２は、凸部４３に設けられている。第２電極部４２と凸部４３とにより端子Ｔを構成する。 A cut recess 44 is provided on both sides of the first electrode part 41, and the first electrode part 41 is provided on the protrusion 43. The first electrode portion 41 and the convex portion 43 constitute a terminal T. Cut notches 44 are also provided on both sides of the second electrode portion 42, and the second electrode portion 42 is provided on the convex portion 43. The second electrode part 42 and the convex part 43 constitute a terminal T.
　第１電極部４１と第２電極部４２との間に位置する切り込み凹部４４は、両露出電極に対して共通の切り込み凹部４４となり、この切り込み凹部４４の略中心を、切離し予定ラインＣＬが通過する。 A notch recess 44 located between the first electrode part 41 and the second electrode part 42 becomes a notch recess 44 common to both exposed electrodes, and a line CL to be cut off passes through substantially the center of the notch recess 44. To do.
　第２発光領域ＬＡ２と第３発光領域ＬＡ３との間に位置する非発光領域ＮＡにも、面状発光パネル４０を分割する際に切断される切離し予定ラインＣＬが規定されている。この切離し予定ラインＣＬ上には、円形の貫通開口孔１１Ｈが形成されている。 Also in the non-light emitting area NA located between the second light emitting area LA2 and the third light emitting area LA3, a scheduled separation line CL that is cut when the planar light emitting panel 40 is divided is defined. A circular through-opening hole 11H is formed on the planned separation line CL.
　非発光領域ＮＡには、切離し予定ラインＣＬを挟むように、封止部材１７から第３基板側電極層１４Ｃが露出する第１電極部４１、および、封止部材１７から第２封止部材側電極層１６Ｂが露出する第２電極部４２が設けられている。 In the non-light emitting area NA, the first electrode portion 41 from which the third substrate side electrode layer 14C is exposed from the sealing member 17 so as to sandwich the planned separation line CL, and the second sealing member side from the sealing member 17 A second electrode portion 42 from which the electrode layer 16B is exposed is provided.
　つまり、第１電極部４１は、切離し予定ラインＣＬを挟むように配置された一方の第３面状発光素子１Ｃの第３基板側電極層１４Ｃであり、第２電極部４２は、切離し予定ラインＣＬを挟むように配置された他方の第２面状発光素子１Ｂの第２封止部材側電極層１６Ｂである。 That is, the first electrode portion 41 is the third substrate-side electrode layer 14C of the third planar light emitting element 1C arranged so as to sandwich the planned separation line CL, and the second electrode portion 42 is the planned separation line. This is the second sealing member-side electrode layer 16B of the other second planar light emitting element 1B arranged so as to sandwich CL.
　第１電極部４１の両側には、切り込み凹部４４が設けられ、第１電極部４１は、凸部４３に設けられている。第１電極部４１と凸部４３とにより端子Ｔを構成する。第２電極部４２の両側にも、切り込み凹部４４が設けられ、第２電極部４２は、凸部４３に設けられている。第２電極部４２と凸部４３とにより端子Ｔを構成する。第１電極部４１と第２電極部４２との間に位置する切り込み凹部４４は、両露出電極に対して共通の切り込み凹部４４となり、この切り込み凹部４４の略中心を、切離し予定ラインＣＬが通過する。 Cut notches 44 are provided on both sides of the first electrode part 41, and the first electrode part 41 is provided on the convex part 43. The first electrode portion 41 and the convex portion 43 constitute a terminal T. Cut notches 44 are also provided on both sides of the second electrode portion 42, and the second electrode portion 42 is provided on the convex portion 43. The second electrode part 42 and the convex part 43 constitute a terminal T. A notch recess 44 located between the first electrode part 41 and the second electrode part 42 becomes a notch recess 44 common to both exposed electrodes, and a line CL to be cut off passes through substantially the center of the notch recess 44. To do.
　図３において、面状発光パネル４０の左側の端面は、切離し予定ラインＣＬにより分割された後の形状が表れており、半円形状の貫通半円孔１１ｈ、および、凸部４３に設けられた第１電極部４１が形成されている。第１電極部４１と凸部４３とにより端子Ｔを構成する。 In FIG. 3, the left end face of the planar light emitting panel 40 shows a shape after being divided by the line to be separated CL, and is provided in the semicircular through semicircular hole 11 h and the convex portion 43. A first electrode portion 41 is formed. The first electrode portion 41 and the convex portion 43 constitute a terminal T.
　面状発光パネル４０の右側の端面は、切離し予定ラインＣＬにより分割された後の形状が表れており、半円形状の貫通半円孔１１ｈ、および、凸部４３に設けられた第２電極部４２が形成されている。第２電極部４２と凸部４３とにより端子Ｔを構成する。 The right end surface of the planar light emitting panel 40 shows the shape after being divided by the line to be separated CL, and the second electrode portion provided in the semicircular through semicircular hole 11h and the convex portion 43. 42 is formed. The second electrode part 42 and the convex part 43 constitute a terminal T.
　上記構成を有する面状発光パネル４０の製造方法は、図１および図２に示した、面状発光パネル１０と同様であり、第１面状発光素子１Ａ、第２面状発光素子１Ｂ、および、第３面状発光素子１Ｃのそれぞれ同一の機能を有する層は、同一の工程で製造される。 The method for manufacturing the planar light emitting panel 40 having the above-described configuration is the same as that of the planar light emitting panel 10 shown in FIGS. 1 and 2, and the first planar light emitting element 1A, the second planar light emitting element 1B, and The layers having the same function in the third planar light emitting element 1C are manufactured in the same process.
　なお、第１電極部４１、第２電極部４２はそれぞれ封止部材１７から露出するように形成されているが、逆の面、すなわち透明基板１１の側から露出するように形成されてもよく、何れの面から露出させるかを問うものではない。また、第１電極部４１および第２電極部４２は、それぞれ隣接する面状発光素子間において互いに接続されている基板側電極層と封止部材側電極層の何れかの箇所が露出して形成されていればよく、切離し予定ラインＣＬで分離された後にはそれぞれが一方の面発光素子の基板側電極層、他方の面発光素子の封止部材側電極層として機能するものである。 In addition, although the 1st electrode part 41 and the 2nd electrode part 42 are each formed so that it may be exposed from the sealing member 17, you may form so that it may expose from the reverse surface, ie, the transparent substrate 11, side. It does not ask from which surface to expose. The first electrode portion 41 and the second electrode portion 42 are formed by exposing any portion of the substrate-side electrode layer and the sealing member-side electrode layer that are connected to each other between adjacent planar light emitting elements. Each of them functions as a substrate side electrode layer of one surface light emitting element and a sealing member side electrode layer of the other surface light emitting element after being separated by the line to be separated CL.
　このように、隣接する面状発光素子において互いに接続されている基板側電極層と封止部材側電極層の何れかの箇所が、透明基板１１と封止部材１７とによって構成されている封止構造から露出されることにより、第１電極部４１、第２電極部４２が形成されるものである。 As described above, the sealing in which any part of the substrate-side electrode layer and the sealing member-side electrode layer that are connected to each other in the adjacent planar light emitting element is configured by the transparent substrate 11 and the sealing member 17. The first electrode part 41 and the second electrode part 42 are formed by being exposed from the structure.
　次に、図５（Ａ）～（Ｄ）を参照して、上記構成を有する面状発光パネル４０を切離し予定ラインＣＬに沿って切断する場合について説明する。図５（Ａ）は切断前の平面図、図５（Ｂ）は、図５（Ａ）中のＶＢ－ＶＢ線矢視断面図、図５（Ｃ）は切断後の平面図、図５（Ｄ）は、図５（Ｃ）中のＶＤ－ＶＤ線矢視断面図である。 Next, with reference to FIGS. 5A to 5D, a description will be given of a case where the planar light emitting panel 40 having the above configuration is cut along a planned line CL. 5A is a plan view before cutting, FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A, FIG. 5C is a plan view after cutting, and FIG. FIG. 5D is a cross-sectional view taken along line VD-VD in FIG.
　図５（Ａ）および（Ｂ）は、図３および図４と同じ状態を示している。第１発光領域ＬＡ１と第２発光領域ＬＡ２との間を切離し予定ラインＣＬに沿って分割した場合を、図５（Ｃ），（Ｄ）に示す。 5 (A) and 5 (B) show the same state as FIG. 3 and FIG. FIGS. 5C and 5D show a case where the first light emitting area LA1 and the second light emitting area LA2 are separated and divided along the planned line CL.
　切離し予定ラインＣＬは、第１面状発光素子１Ａと第２面状発光素子１Ｂとの間に位置していることから、第１面状発光素子１Ａと第２面状発光素子１Ｂとの直列接続が切断されるのみで、発光素子が切断されることはない。切断面には、封止部材１７が位置しているため、電気的に何ら問題を生じさせることなく、面状発光パネル４０を切断することができる。 Since the planned separation line CL is located between the first planar light emitting element 1A and the second planar light emitting element 1B, the first planar light emitting element 1A and the second planar light emitting element 1B are connected in series. Only the connection is cut, and the light emitting element is not cut. Since the sealing member 17 is located on the cut surface, the planar light emitting panel 40 can be cut without causing any electrical problems.
　さらに、切離し予定ラインＣＬは切り込み凹部４４の略中心を通過していることから、第１電極部４１および第２電極部４２はいずれも、凸部４３に形成された状態となり、端子Ｔを構成する。その結果、外部に設けられた電子機器に、面状発光パネル４０に電力を供給するコネクターが設けられている場合には、端子Ｔを電子機器のコネクターに差し込むことで、容易に面状発光パネル４０に電力を供給することが可能になる。 Further, since the line to be cut CL passes through the approximate center of the cut recess 44, both the first electrode portion 41 and the second electrode portion 42 are formed in the protrusion 43, and constitute the terminal T. To do. As a result, when the electronic device provided outside is provided with a connector for supplying power to the planar light emitting panel 40, the planar light emitting panel can be easily inserted by inserting the terminal T into the connector of the electronic device. 40 can be supplied with electric power.
　図６から図９を参照して、上記面状発光パネル４０を電子機器に装着する状態について説明する。図６は、面状発光パネル４０を電子機器の回路基板１００に装着する前の状態を示す斜視図、図７は、面状発光パネル４０を電子機器の回路基板１００に装着した他の状態を示す斜視図、図８は、面状発光パネル４０を電子機器の回路基板１００に装着した他の状態を示す断面図、図９は、面状発光パネル４０の電子機器の筐体３１０への固定状態の一例を示す断面図である。 A state in which the planar light emitting panel 40 is mounted on an electronic device will be described with reference to FIGS. FIG. 6 is a perspective view illustrating a state before the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device, and FIG. 7 illustrates another state in which the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device. FIG. 8 is a cross-sectional view showing another state in which the planar light emitting panel 40 is mounted on the circuit board 100 of the electronic device, and FIG. 9 is an illustration of fixing the planar light emitting panel 40 to the casing 310 of the electronic device. It is sectional drawing which shows an example of a state.
　図６に示すように、回路基板１００には、長手方向に沿って２か所にピン差込口２０１が設けられたコネクター２００が設けられている。面状発光パネル４０の両端部に設けられた端子Ｔを、ピン差込口２０１からコネクター２００に差し込み可能である。これにより、回路基板１００から面状発光パネル４０に対して容易に電力を供給することが可能となる。 As shown in FIG. 6, the circuit board 100 is provided with a connector 200 provided with pin insertion ports 201 at two locations along the longitudinal direction. Terminals T provided at both ends of the planar light emitting panel 40 can be inserted into the connector 200 from the pin insertion port 201. As a result, power can be easily supplied from the circuit board 100 to the planar light emitting panel 40.
　端子Ｔの形状は、矩形形状をしているが、この形状に限らず、配線端子の形状に合わせた挿し込み可能な形状であればどのような形状であってもよい。 The shape of the terminal T is a rectangular shape, but is not limited to this shape, and may be any shape as long as it can be inserted in accordance with the shape of the wiring terminal.
　図７および図８に示すように、面状発光パネル４０を、回路基板１００に対して垂直に立てた状態にして固定することがきる。これにより、電子機器としてたとえば携帯電話３００の筐体３１０の内部に回路基板１００、および、回路基板１００の長手方向に沿って２枚の面状発光パネル４０を収容した状態で、操作面３３０側にではなく、筐体３１０の両側面側に設けられた光透過領域としての光透過窓３２０側から、面状発光パネル４０によって生成された光を外部に向けて発光することが可能となる。 As shown in FIGS. 7 and 8, the planar light emitting panel 40 can be fixed in a state where it stands vertically with respect to the circuit board 100. Thus, for example, the circuit board 100 and two planar light emitting panels 40 along the longitudinal direction of the circuit board 100 are accommodated in the casing 310 of the mobile phone 300 as an electronic device, for example, on the operation surface 330 side. Instead, the light generated by the planar light emitting panel 40 can be emitted to the outside from the light transmission window 320 side as a light transmission region provided on both side surfaces of the housing 310.
　携帯電話３００に限らず、スマートフォン、タブレット等の携帯型の電子機器に組み込んだ場合には、コネクター２００に面状発光パネル４０の端子Ｔを挿し込むだけで特別な位置決め機構、保持機構を設けなくても、光透過窓３２０と、第１発光領域ＬＡ１、第２発光領域ＬＡ２および第３発光領域ＬＡ３との位置関係を容易に実現することができる。 When incorporated in a portable electronic device such as a smartphone or a tablet as well as the mobile phone 300, a special positioning mechanism and holding mechanism are not provided by simply inserting the terminal T of the planar light emitting panel 40 into the connector 200. However, the positional relationship between the light transmission window 320 and the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 can be easily realized.
　特に、携帯型の電子機器のように小型の電子機器の場合には、面状発光パネル４０および回路基板１００を収容するスペースの制約があるため、図７および図８に示す、面状発光パネル４０を、回路基板１００に対して垂直に立てた状態にして固定する構成は、収容スペースを有効利用することができる。 In particular, in the case of a small electronic device such as a portable electronic device, the space for accommodating the planar light emitting panel 40 and the circuit board 100 is limited, so that the planar light emitting panel shown in FIGS. 7 and 8 is used. The configuration in which the 40 is fixed in a state where it stands vertically with respect to the circuit board 100 can effectively use the accommodation space.
　本実施の形態の面状発光パネル４０は、筐体３１０の大きさ、光透過窓３２０の大きさ等に変更が生じた場合にも、面状発光パネル４０を切断して長さを調整することにより、面状発光パネル４０側での容易な対応が可能である。面状発光パネル４０は、長さを変更した場合であっても、複数の面発光素子は直列接続されているため、各面発光素子は、同じ明るさで発光させることができる。 The planar light emitting panel 40 according to the present embodiment adjusts the length by cutting the planar light emitting panel 40 even when the size of the housing 310, the size of the light transmission window 320, or the like is changed. Thus, it is possible to easily cope with the planar light emitting panel 40 side. Even if the length of the planar light emitting panel 40 is changed, since the plurality of surface light emitting elements are connected in series, each surface light emitting element can emit light with the same brightness.
　さらに、面状発光パネル４０には、貫通開口孔１１Ｈが設けられている。図９に示すように、貫通開口孔１１Ｈを利用し、筐体３１０に設けられた固定ピン３４０を用いて、面状発光パネル４０を筐体３１０に固定することができる。 Furthermore, the planar light emitting panel 40 is provided with a through-opening hole 11H. As shown in FIG. 9, the planar light emitting panel 40 can be fixed to the housing 310 using the fixing pin 340 provided in the housing 310 using the through-opening hole 11 </ b> H.
　図１０に、面状発光パネル４０Ａの回路基板１００への他の固定方法を示す。面状発光パネル４０Ａにフレキシブルな素材が用いられている場合には、面状発光パネル４０Ａの非発光領域ＮＡを折り曲げて（図１０中矢印Ａで示す角部）電子機器の外周に沿って配置することもできる。この場合、面状発光パネル４０Ａには、第１発光領域ＬＡ１から第７発光領域ＬＡ７が設けられる。端子Ｔによる電気的接続は、面状発光パネル４０Ａの長尺方向の両端部のみで行ない、その他の端子Ｔは面状発光パネル４０Ａの固定用として使用することができる。 FIG. 10 shows another method of fixing the planar light emitting panel 40A to the circuit board 100. When a flexible material is used for the planar light emitting panel 40A, the non-light emitting area NA of the planar light emitting panel 40A is bent (corner indicated by an arrow A in FIG. 10) and arranged along the outer periphery of the electronic device. You can also In this case, the planar light emitting panel 40A is provided with the first light emitting area LA1 to the seventh light emitting area LA7. Electrical connection by the terminal T is performed only at both ends in the longitudinal direction of the planar light emitting panel 40A, and the other terminals T can be used for fixing the planar light emitting panel 40A.
　（実施の形態２：面状発光パネル４０Ｂ）
　次に、図１１および図１２を参照して、上記面状発光パネル１０の基本構成を備える、本実施の形態における面状発光パネル４０Ｂの構成について説明する。図１１は、面状発光パネル４０Ｂの構成を示す平面図、図１２は、図１１中のＸＩＩ－ＸＩＩ線矢視断面図である。 (Embodiment 2: Planar light emitting panel 40B)
Next, with reference to FIG. 11 and FIG. 12, the structure of the planar light emission panel 40B in this Embodiment provided with the basic composition of the said planar light emission panel 10 is demonstrated. 11 is a plan view showing the configuration of the planar light emitting panel 40B, and FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.
　本実施の形態の面状発光パネル４０Ｂは、非発光領域ＮＡにおいて、切離し予定ラインＣＬの近傍領域が封止部材１７よって覆われていない構造を採用している。したがって、第１基板側電極層１４Ａの一部、第１封止部材側電極層１６Ａの一部、第２基板側電極層１４Ｂの一部、第２封止部材側電極層１６Ｂの一部、第３基板側電極層１４Ｃの一部、および、第３封止部材側電極層１６Ｃの一部が、封止部材１７により覆われずに、封止部材１７から露出した構造となっている。第１発光領域ＬＡ１、第２発光領域ＬＡ２、および第３発光領域ＬＡ３に対応する位置は、封止部材１７により覆われている。 The planar light emitting panel 40B of the present embodiment employs a structure in which the region near the line to be separated CL is not covered with the sealing member 17 in the non-light emitting region NA. Therefore, a part of the first substrate side electrode layer 14A, a part of the first sealing member side electrode layer 16A, a part of the second substrate side electrode layer 14B, a part of the second sealing member side electrode layer 16B, A part of the third substrate side electrode layer 14 </ b> C and a part of the third sealing member side electrode layer 16 </ b> C are not covered with the sealing member 17 and are exposed from the sealing member 17. The positions corresponding to the first light emitting area LA1, the second light emitting area LA2, and the third light emitting area LA3 are covered with the sealing member 17.
　その結果、各電極層の封止部材１７から露出した部分が、電極部となり端子Ｔとしての機能を有する。 As a result, the portion exposed from the sealing member 17 of each electrode layer becomes an electrode portion and functions as a terminal T.
　この面状発光パネル４０Ｂの構成であっても、上記実施の形態１の場合と同様の作用効果を得ることができる。 Even with the configuration of the planar light emitting panel 40B, the same effects as those of the first embodiment can be obtained.
　以上、本実施の形態における面状発光パネルおよび電子機器によれば、面状発光素子が所定の間隙を隔てて直線状に直列に複数配列されているので、面状発光素子間の輝度バラつきが抑制され、電子機器に搭載した際にも均一な発光が可能となり、デザイン性、機能性に優れたものとなる。 As described above, according to the planar light emitting panel and the electronic apparatus in the present embodiment, since a plurality of planar light emitting elements are arranged in series in a straight line with a predetermined gap, luminance variation between the planar light emitting elements. It is suppressed, and even when mounted on an electronic device, uniform light emission is possible, resulting in excellent design and functionality.
　面状発光素子間に当該面状発光パネルの切断が可能な領域を設けたことにより、簡単に所望の長さの面状発光パネルを得ることができるため、面状発光パネルを搭載する電子機器の大きさに応じた面状発光パネルを迅速に作成することができる。その結果、設計変更に伴うコストの上昇を抑制することができる。 An electronic device equipped with a planar light-emitting panel can be obtained easily by providing a region in which the planar light-emitting panel can be cut between the planar light-emitting elements. A planar light-emitting panel corresponding to the size of can be quickly created. As a result, an increase in cost associated with a design change can be suppressed.
　さらに、面状発光素子間に、面状発光パネルを電子機器側の回路基板および／または筐体に、位置決めおよび／または固定することが可能な形状が採用されていることから、面状発光パネルの電子機器への取り付けを容易に行なうことができる。 Furthermore, since the shape which can position and / or fix a planar light emission panel to the circuit board and / or housing | casing by the side of an electronic device is employ | adopted between planar light emitting elements, a planar light emission panel is adopted. Can be easily attached to an electronic device.
　以上説明した面状発光パネルにおいては、同一の透明基板上に、発光層が第１電極層および第２電極層に挟まれて構成される面状発光素子を、所定の間隙を隔てて直線状に複数配列した面状発光パネルであって、複数の上記面状発光素子は、互いに隣接する面状発光素子の一方の第１電極層と他方の第２電極層とが接続されることによって、それぞれ電気的に直列に接続されており、複数の上記面状発光素子は、上記透明基板上において封止部材に覆われており、隣接する上記面状発光素子の間の非発光領域には、当該面状発光パネルを切断する際の切離し予定ラインが規定され、上記非発光領域には、接続された上記第１電極層と上記第２電極層のうち少なくともいずれか一方が上記透明基板または上記封止部材から露出することによって形成された第１電極部および第２電極部が、上記切離し予定ラインを挟むように設けられている。 In the planar light-emitting panel described above, a planar light-emitting element in which a light-emitting layer is sandwiched between a first electrode layer and a second electrode layer on the same transparent substrate is linear with a predetermined gap. A plurality of the planar light emitting elements, wherein one of the first electrode layers and the other second electrode layer of the adjacent planar light emitting elements are connected to each other, Each of the planar light emitting elements is electrically connected in series, and the plurality of planar light emitting elements are covered with a sealing member on the transparent substrate, and in a non-light emitting region between the adjacent planar light emitting elements, A line to be separated when the planar light emitting panel is cut is defined, and in the non-light emitting region, at least one of the connected first electrode layer and the second electrode layer is the transparent substrate or the above By exposing from the sealing member First electrode portion is formed and the second electrode portion is provided so as to sandwich the disconnecting scheduled line.
　また、上記透明基板上に、第１面状発光素子および第２面状発光素子が所定の間隙を隔てて配列され、上記第１面状発光素子は、上記透明基板の上に設けられる第１基板側電極層と、上記第１基板側電極層を覆うように設けられる第１発光層と、上記第１発光層を覆うように設けられる第１封止部材側電極層と、を含むことにより第１発光領域を形成し、上記第２面状発光素子は、上記透明基板の上に設けられる第２基板側電極層と、上記第２基板側電極層を覆うように設けられる第２発光層と、上記第２発光層を覆うように設けられる第２封止部材側電極層と、を含むことにより第２発光領域を形成し、上記第１発光領域と上記第２発光領域との間に上記非発光領域が形成されている。 In addition, a first planar light emitting element and a second planar light emitting element are arranged on the transparent substrate with a predetermined gap therebetween, and the first planar light emitting element is provided on the transparent substrate. By including a substrate side electrode layer, a first light emitting layer provided so as to cover the first substrate side electrode layer, and a first sealing member side electrode layer provided so as to cover the first light emitting layer. A first light emitting region is formed, and the second planar light emitting element includes a second substrate side electrode layer provided on the transparent substrate and a second light emitting layer provided to cover the second substrate side electrode layer. And a second sealing member side electrode layer provided so as to cover the second light emitting layer, thereby forming a second light emitting region, and between the first light emitting region and the second light emitting region. The non-light emitting region is formed.
　あるいは、上記非発光領域には、当該面状発光パネルを外部に設けられた電子機器に固定する固定領域が設けられている。 Alternatively, the non-light emitting area is provided with a fixing area for fixing the planar light emitting panel to an electronic device provided outside.
　また、以上説明した電子機器においては、上述のいずれかに記載の面状発光パネルと、上記面状発光パネルを収納し、上記面状発光パネルによって生成された光を外部に向けて発光が可能な光透過領域とを備える電子機器であって、当該電子機器は、上記面状発光パネルに電力を供給するコネクターを有し、上記面状発光パネルには、上記第１電極部または上記第２電極部が設けられるとともに、上記コネクターに差し込み可能な端子を有し、上記端子が上記コネクターに差し込まれることにより、上記第１電極部および上記第２電極部から上記発光層に電力が供給される。 Moreover, in the electronic device demonstrated above, the planar light emission panel in any one of the above-mentioned and said planar light emission panel are accommodated, and the light produced | generated by the said planar light emission panel can be light-emitted outside. An electronic device including a light transmitting region, the electronic device having a connector for supplying power to the planar light emitting panel, wherein the planar light emitting panel includes the first electrode unit or the second electrode. The electrode portion is provided and has a terminal that can be inserted into the connector. When the terminal is inserted into the connector, electric power is supplied from the first electrode portion and the second electrode portion to the light emitting layer. .
　以上の構成によれば、複数の面状発光素子間の輝度の不均一の発生を抑制するとともに、面状発光パネルの大きさを容易に変更することが可能な構成を備える、面状発光パネルおよび電子機器を提供することを可能とする。 According to the above configuration, a planar light emitting panel having a configuration capable of suppressing the occurrence of uneven brightness between the plurality of planar light emitting elements and easily changing the size of the planar light emitting panel. And electronic devices can be provided.
　以上、本発明の各実施の形態における内照式照明装置について説明したが、今回開示された実施の形態は全ての点で例示であって制限的なものではないと考えられるべきである。したがって、本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内での全ての変更が含まれることが意図される。 As mentioned above, although the internal illumination type illuminating device in each embodiment of this invention was demonstrated, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. Therefore, the scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　１　面状発光素子、１Ａ　第１面状発光素子、１Ｂ　第２面状発光素子、１Ｃ　第３面状発光素子、１０，４０，４０Ａ，４０Ｂ　面状発光パネル、１０Ｅ　外周、１１　透明基板、１１Ｈ　貫通開口孔、１１ｈ　貫通半円孔、１２　表面、１３　裏面、１４　陽極、１４Ａ　第１基板側電極層、１４Ｂ　第２基板側電極層、１４Ｃ　第３基板側電極層、１４ｄ　段部、１５　有機層、１５Ａ　第１発光層、１５Ｂ　第２発光層、１５Ｃ　第３発光層、１６　陰極、１６Ａ　第１封止部材側電極層、１６Ｂ　第２封止部材側電極層、１６Ｃ　第３封止部材側電極層、１７　封止部材、１８　絶縁層、１９　背面、２０　分割領域、４１　第１電極部、４２　第２電極部、４３　凸部、４４　切り込み凹部、４４　凹部、１００　回路基板、２００　コネクター、２０１　ピン差込口、３００　携帯電話、３１０　筐体、３２０　光透過窓、３３０　操作面、３４０　固定ピン。 DESCRIPTION OF SYMBOLS 1 Planar light emitting element, 1A 1st planar light emitting element, 1B 2nd planar light emitting element, 1C 3rd planar light emitting element 10, 40, 40A, 40B planar light emitting panel, 10E outer periphery, 11 transparent substrate, 11H Through-hole, 11h through-semi-circular hole, 12 front surface, 13 back surface, 14 anode, 14A first substrate side electrode layer, 14B second substrate side electrode layer, 14C third substrate side electrode layer, 14d step, 15 organic layer , 15A first light emitting layer, 15B second light emitting layer, 15C third light emitting layer, 16 cathode, 16A first sealing member side electrode layer, 16B second sealing member side electrode layer, 16C third sealing member side electrode Layer, 17 sealing member, 18 insulating layer, 19 back surface, 20 divided area, 41 first electrode part, 42 second electrode part, 43 convex part, 44 cut concave part, 44 concave part, 100 circuit board, 00 connector 201 pin insertion port, 300 mobile phones, 310 housing, 320 light transmission window, 330 operating surface 340 fixing pin.

Claims (4)

  1. 　同一の透明基板上に、発光層が第１電極層および第２電極層に挟まれて構成される面状発光素子を、所定の間隙を隔てて直線状に複数配列した面状発光パネルであって、
    　複数の前記面状発光素子は、互いに隣接する面状発光素子の一方の第１電極層と他方の第２電極層とが接続されることによって、それぞれ電気的に直列に接続されており、
    　複数の前記面状発光素子は、前記透明基板上において封止部材に覆われており、
    　隣接する前記面状発光素子の間の非発光領域には、当該面状発光パネルを切断する際の切離し予定ラインが規定され、
    　前記非発光領域には、接続された前記第１電極層と前記第２電極層のうち少なくともいずれか一方が前記透明基板または前記封止部材から露出することによって形成された第１電極部および第２電極部が、前記切離し予定ラインを挟むように設けられている、面状発光パネル。     A planar light-emitting panel in which a plurality of planar light-emitting elements, each having a light-emitting layer sandwiched between a first electrode layer and a second electrode layer, are arranged in a straight line with a predetermined gap on the same transparent substrate. And
    The plurality of planar light emitting elements are electrically connected in series by connecting one first electrode layer and the other second electrode layer of the planar light emitting elements adjacent to each other,
    The plurality of planar light emitting elements are covered with a sealing member on the transparent substrate,
    In the non-light emitting region between the adjacent planar light emitting elements, a line to be separated when the planar light emitting panel is cut is defined,
    The non-light emitting region includes a first electrode portion formed by exposing at least one of the connected first electrode layer and the second electrode layer from the transparent substrate or the sealing member; A planar light-emitting panel in which two electrode portions are provided so as to sandwich the scheduled separation line.
  2. 　前記透明基板上に、第１面状発光素子および第２面状発光素子が所定の間隙を隔てて配列され、
    　前記第１面状発光素子は、
    　前記透明基板の上に設けられる第１基板側電極層と、
    　前記第１基板側電極層を覆うように設けられる第１発光層と、
    　前記第１発光層を覆うように設けられる第１封止部材側電極層と、を含むことにより第１発光領域を形成し、
    　前記第２面状発光素子は、
    　前記透明基板の上に設けられる第２基板側電極層と、
    　前記第２基板側電極層を覆うように設けられる第２発光層と、
    　前記第２発光層を覆うように設けられる第２封止部材側電極層と、を含むことにより第２発光領域を形成し、
    　前記第１発光領域と前記第２発光領域との間に前記非発光領域が形成されている、請求項１に記載の面状発光パネル。     A first planar light emitting element and a second planar light emitting element are arranged on the transparent substrate with a predetermined gap therebetween,
    The first planar light emitting element is:
    A first substrate-side electrode layer provided on the transparent substrate;
    A first light emitting layer provided to cover the first substrate side electrode layer;
    A first sealing member-side electrode layer provided so as to cover the first light emitting layer, thereby forming a first light emitting region,
    The second planar light emitting element is:
    A second substrate side electrode layer provided on the transparent substrate;
    A second light emitting layer provided to cover the second substrate side electrode layer;
    Forming a second light emitting region by including a second sealing member side electrode layer provided so as to cover the second light emitting layer,
    The planar light emitting panel according to claim 1, wherein the non-light emitting region is formed between the first light emitting region and the second light emitting region.
  3. 　前記非発光領域には、当該面状発光パネルを外部に設けられた電子機器に固定する固定領域が設けられている、請求項１または２に記載の面状発光パネル。 The planar light emitting panel according to claim 1 or 2, wherein a fixing region for fixing the planar light emitting panel to an electronic device provided outside is provided in the non-light emitting region.
  4. 　請求項１から３のいずれか１項に記載の面状発光パネルと、
    　前記面状発光パネルを収納し、前記面状発光パネルによって生成された光を外部に向けて発光が可能な光透過領域と、を備える電子機器であって、
    　当該電子機器は、前記面状発光パネルに電力を供給するコネクターを有し、
    　前記面状発光パネルには、前記第１電極部または前記第２電極部が設けられるとともに、前記コネクターに差し込み可能な端子を有し、
    　前記端子が前記コネクターに差し込まれることにより、前記第１電極部および前記第２電極部から前記発光層に電力が供給される、電子機器。     The planar light-emitting panel according to any one of claims 1 to 3,
    A light transmissive region that houses the planar light emitting panel and is capable of emitting light generated by the planar light emitting panel toward the outside, and an electronic device comprising:
    The electronic device has a connector for supplying power to the planar light emitting panel,
    The planar light emitting panel is provided with the first electrode portion or the second electrode portion, and has a terminal that can be inserted into the connector.
    An electronic device in which power is supplied to the light emitting layer from the first electrode portion and the second electrode portion by inserting the terminal into the connector.
PCT/JP2014/062810 2013-05-27 2014-05-14 Planar light-emitting panel and electronic device WO2014192543A1 (en)

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