JP2012142094A - Lighting device, manufacturing method thereof and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device with high heat dissipation efficiency.SOLUTION: The light-emitting part 10 comprises: a first substrate 11; a plurality of first electrodes 21 formed on the first substrate 11; a first partition 31 formed on the first substrate 11 to separate each of the plurality of the first electrodes 21; a second partition 32 with insulation quality having a groove 322 formed on the first partition 31; a plurality of light-emitting function layers 22 formed on the first electrode 21 so as to contact with the lateral face 323 of the second partition 32; a heat conductive part 40 comprised of a material with larger heat conductivity than that of the second partition 32 formed in the groove 322 of the second partition 32; a second electrode 23 formed on the plurality of light-emitting function layers 22, the second partition 32 and the heat conductive part 40; a second substrate 12; and a packed bed 13 provided between the second substrate 12 and the second electrode 23.

Description

  The present invention relates to a lighting device including a light emitting element such as an organic EL (Electroluminescence) element, a manufacturing method thereof, and an electronic apparatus including the same.

In recent years, lighting devices including organic EL elements have been developed. Since the organic EL element which is a self-luminous element has a very thin light emitting layer, when applied to a lighting device, the lighting device can be reduced in weight and thickness. In addition, since the organic EL element can emit light with high luminance even at a low voltage, the power consumption of the lighting device can be reduced.
As described above, since a lighting device using an organic EL element can be reduced in weight and power consumption, in addition to a lighting device such as a lighting stand, a liquid crystal display or a portable device that needs to be thin and light. It is also installed in equipment.

The organic EL element is composed of a light emitting functional layer and both anode and cathode electrodes sandwiching the light emitting functional layer from both sides. When an organic EL element is applied to a lighting device, a flat single light emitting function layer is provided between a flat anode and a cathode. Then, by supplying a voltage that is equal to or higher than the light emission threshold voltage of the light emitting functional layer to the anode and the cathode, the light emitting functional layer is caused to emit light as a surface light source.
However, since the anode and the cathode have resistance, a voltage drop occurs at the anode and the cathode. As a result, there is a problem that luminance unevenness occurs such that the luminance of the light emitting functional layer decreases as the distance from the power receiving unit that supplies voltage to the anode and the cathode increases.
Therefore, in Patent Document 1, a voltage is supplied from one power receiving unit to the anode by supplying voltage from two power receiving units to the anode through an auxiliary wiring having a small resistance value. In comparison, the voltage drop inside the anode was reduced, and the occurrence of uneven brightness in the light-emitting panel (illumination device) was suppressed.

JP 2007-026932 A

However, even in the invention disclosed in Patent Document 1, as the distance from the power receiving unit to which the anode and the auxiliary wiring are connected increases, a voltage effect occurs in the anode, so that compared to the case where the power receiving unit is one place. Although the degree of brightness unevenness is reduced, the occurrence of brightness unevenness cannot be prevented. For example, in the central part of the lighting device where the distance from both of the two power receiving units is far, the width of the voltage drop becomes the maximum, and as a result, the luminance decreases.
Moreover, the surface light source comprised from a single organic EL element is used like the illuminating device disclosed by patent document 1. FIG. In this case, even if a defect occurs in a part of the organic EL element due to deterioration with time or contamination with foreign matter during manufacturing, the defect is eventually expanded to the surroundings as a result. There is a problem that the entire EL element cannot emit light. In particular, the lighting device is often used while being constantly lit, and the organic EL element maintains a light emitting state for a long time, so that the degree of deterioration of the organic EL element with time is large and it is difficult to extend the life of the lighting device. There is a problem of being.
Therefore, in the present invention, in view of the circumstances described above, it is an object of the present invention to provide a lighting device that can emit light stably over a long period of time.

  In order to solve the above-described problem, an illumination device according to the present invention includes a first substrate, a plurality of first electrodes formed on the first substrate, and the first electrodes so as to separate the plurality of first electrodes. An insulating partition having a groove formed on one substrate; a plurality of light emitting functional layers formed on the first electrode so as to be in contact with a side surface of the partition; and formed in a groove of the partition. A heat conductive portion made of a material having a larger thermal conductivity than a material forming the partition; a second electrode formed on the plurality of light emitting functional layers, the partition, and the heat conductive portion; It is provided with the board | substrate and the filling layer provided between the said 2nd board | substrate and the said 2nd electrode, It is characterized by the above-mentioned.

According to this invention, an illuminating device is provided with the several light emission functional layer divided by the partition.
If the illumination unit is formed of a single light emitting element, the entire lighting device as a result of the minute defects caused by the deterioration of the light emitting element over time or the incorporation of foreign matters during the production of the light emitting element expand over time. There was a possibility that could not emit light. In contrast, since a plurality of light emitting functional layers are formed separately, even if a defect occurs in one light emitting functional layer and expands, the defect remains inside the light emitting functional layer, and the other plurality of light emitting functional layers are formed. The light emitting functional layer can maintain the function of emitting light. That is, even if a defect occurs in one light emitting functional layer, the function as a surface light source of the lighting device can be stably maintained without being impaired. As described above, the lighting device according to the present invention has an advantage that the lifetime can be extended.

In addition, the lighting device according to the present invention needs to efficiently dissipate heat generated from the light emitting functional layer to the outside. In particular, when the lighting device is applied to a device such as an indoor lighting device that is expected to emit light at all times, unless the heat generated from the light emitting functional layer is efficiently dissipated, the light emitting functional layer is constantly formed. Since it becomes a high temperature state and the light emitting functional layer deteriorates in a short period, the service life of the lighting device is short.
In this regard, the illuminating device according to the present invention includes a partition wall that divides a plurality of light emitting functional layers, so that the distance between the second electrode of the partition wall portion and the second substrate is shortened. As a result, the heat dissipation path of the light emitting functional layer is conducted from the light emitting functional layer to the top of the partition via the second electrode, in addition to the path from the light emitting functional layer to the second substrate through the filling layer. There is a path to reach the second substrate later through the filling layer. In general, a conductive material has a higher thermal conductivity than an insulating material. Therefore, the conductive second electrode has a higher thermal conductivity than the insulating filling layer. For this reason, the lighting device according to the present invention has an advantage that heat generated from the light emitting functional layer can be radiated to the outside more efficiently.
Furthermore, the illuminating device according to the present invention has a heat conducting portion formed in the groove portion of the partition wall. Since the material constituting the heat conducting portion has a larger thermal conductivity than the material constituting the partition wall, there is an advantage that heat from the light emitting functional layer can be effectively conducted to the outside.

In the above-described lighting device, it is preferable that the heat conducting portion is formed of a conductive metal material.
In this case, in addition to the function of increasing the heat dissipation efficiency of the lighting device, the heat conduction part also serves as an auxiliary electrode for the second electrode, and thus the power consumption of the lighting device can be reduced. Have

In the lighting device described above, it is preferable that the first substrate and the plurality of first electrodes are made of a transparent material, and the second electrode is made of a reflective metal.
In this case, the illumination device is a bottom emission type, and it is not necessary to reduce the thickness of the second electrode to such an extent that light can be transmitted. Therefore, the electrical resistance of the second electrode is reduced, and the power consumption of the illumination device is reduced. It has the advantage that it can be reduced.

  Next, an electronic apparatus according to the present invention includes any one of the above illumination devices. Examples of such an electronic apparatus include a device such as a lighting stand and a device including the above-described lighting device such as a personal computer and a mobile phone as a backlight. According to this electronic device, the lighting device can be reduced in thickness and weight, so that the electronic device can be reduced in size and weight.

Next, in the manufacturing method of the lighting device according to the present invention, a plurality of transparent first electrodes are formed on a transparent first substrate, and each of the plurality of first electrodes is divided. An insulating partition having a groove is formed on the substrate, and a solution containing metal particles is discharged into the groove to form a heat conduction portion made of a material having a thermal conductivity larger than that of the partition. A plurality of light emitting functional layers are formed in a region partitioned by the partition on the first electrode, and a second electrode made of a reflective metal is formed on the plurality of light emitting functional layers, the partition, and the heat conducting unit. Forming a filling layer on the second electrode, and bonding the filling layer and the second substrate together.
In this case, since the heat conduction part can be formed by discharging the solution to the groove part formed in the partition wall, there is an advantage that the manufacturing process can be simplified.

Further, in the method for manufacturing the lighting device described above, the step of forming an insulating partition having a groove on the first substrate so as to partition each of the plurality of first electrodes includes the plurality of first electrodes. Preferably, an insulating partition is formed on the first substrate so as to separate each of the electrodes, and a groove is formed by scraping the top of the partition.
In this case, since the partition walls and the groove portions can be formed by simple methods, there is an advantage that the manufacturing cost can be reduced.

It is an equivalent circuit schematic of the illuminating device which concerns on embodiment of this invention. It is a schematic diagram which shows the correspondence of arrangement | positioning of the 1st electrode, light emission functional layer, and 2nd electrode which comprise the light emitting element which concerns on embodiment of this invention. It is a top view which shows the light emission part which concerns on embodiment of this invention. It is sectional drawing which shows the light emission part which concerns on embodiment of this invention. It is a figure which shows the thermal radiation path | route in the light emission part which concerns on embodiment of this invention. It is a figure which shows the first process among the procedures which manufacture the illuminating device which concerns on embodiment of this invention. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. FIG. 10 is a diagram showing a step subsequent to that in FIG. 9. FIG. 11 is a diagram showing a step subsequent to FIG. 10. FIG. 12 is a diagram showing a step subsequent to FIG. 11. FIG. 13 is a diagram showing a step subsequent to FIG. 12. It is a figure which shows the next process of FIG. It is a figure which shows the procedure which manufactures the illuminating device which concerns on the modification of this invention. FIG. 16 is a diagram showing a step subsequent to that in FIG. 15. It is a perspective view which shows the external appearance of the illumination stand which has an illuminating device which concerns on this invention. It is a perspective view which shows the external appearance of the personal computer which has the illuminating device which concerns on this invention. It is a perspective view which shows the external appearance of the mobile telephone which has an illuminating device based on this invention.

<A: Embodiment>
Hereinafter, various embodiments according to the present invention will be described with reference to the accompanying drawings. In the drawings, the ratio of dimensions of each part is appropriately changed from the actual one.

FIG. 1 is an equivalent circuit diagram of a lighting apparatus 1 according to an embodiment of the present invention.
As illustrated in FIG. 1, the lighting device 1 includes a light emitting unit 10 and a power supply unit 50.
In the light emitting unit 10, light emitting elements E are formed in a matrix of M columns × N rows (M and N are natural numbers of 1 or more). Each of the plurality of light emitting elements E includes a first electrode 21, a light emitting functional layer 22, and a second electrode 23 connected in series. A bleeder resistor R is connected to each light emitting element E.
The power supply unit 50 supplies the high potential VH to the first electrode 21 through the first power supply line 210 and supplies the low potential VL to the second electrode 23 through the second power supply line 230. That is, the first electrode 21 functions as an anode, and the second electrode 23 functions as a cathode.

  FIG. 2 shows the correspondence of the arrangement of the first electrode 21, the light emitting functional layer 22, and the second electrode 23 that form each of the plurality of light emitting elements E formed in the light emitting unit 10 shown in FIG. 1. It is the perspective view shown typically. As shown in FIG. 2, the first electrode 21 and the light emitting functional layer 22 are formed to correspond to each of the plurality of light emitting elements E on a one-to-one basis. The second electrode 23 is formed so as to be common to all M × N light emitting elements E.

3 is an enlarged plan view of a part of the light emitting unit 10 shown in FIG. 1, and FIG. 4 is a cross-sectional view of a part of the light emitting unit 10 shown in FIG. . The structure of the light emitting unit 10 will be described with reference to FIGS. 3 and 4.
As shown in FIG. 4, the light emitting unit 10 includes a first substrate 11 on which a light emitting element E including the first electrode 21, the light emitting functional layer 22, and the second electrode 23 is formed, and these light emitting elements E and the like. And a second substrate 12 to be sealed. The light emitting unit 10 is a bottom emission type surface light source in which a plurality of light emitting elements E emit light in a direction L toward the first substrate 11.

The first substrate 11 is formed of a light transmissive material such as glass such as non-alkali glass, quartz, or plastic.
A plurality of first electrodes 21 are formed on the first substrate 11. The first electrode 21 is made of a transparent oxide conductive material such as ITO (indium tin oxide), IZO (indium zinc oxide), or ZnO ₂ .
Although not shown, an auxiliary wiring and a transparent interlayer insulating film that shields the auxiliary wiring and the first electrode 21 are formed on the first substrate 11, and a plurality of second insulating films are formed on the interlayer insulating film. A plurality of bleeder resistors R electrically connected to each of the one electrodes 21 are formed. The auxiliary wiring is electrically connected to each bleeder resistor R through a contact hole formed in the interlayer insulating film and is also electrically connected to the first power supply line 210. As a result, the first electrode 21 is supplied with the high potential VH from the power supply unit 50 via the bleeder resistance, the auxiliary wiring, and the first power supply line 210. The auxiliary wiring may be formed under the first partition wall 31 described later.
In the present embodiment, the bleeder resistor R is formed on the interlayer insulating film, but the present invention is not limited to such a structure. For example, the bleeder resistance R may be formed on the first substrate 11. In this case, the interlayer insulating film is formed on the bleeder resistor R. The bleeder resistance is made of, for example, polysilicon.

On the first substrate 11 and the first electrode 21, a first partition wall 31 made of a transparent inorganic insulating material such as silicon dioxide (SiO ₂ ) is formed. The first partition wall 31 is formed in a lattice shape when each of the plurality of first electrodes 21 is divided and viewed in plan. The first partition wall 31 is made of silicon nitride (SiO ₂ ), silicon nitride, silicon oxynitride, silicon carbide, DLC (diamond-like carbon), metal oxide such as aluminum oxide, or a mixture thereof. You may do it.
A second partition wall 32 made of an insulating organic material such as acrylic or polyamide is formed on the first partition wall 31. The second barrier ribs divide each of the plurality of light emitting functional layers 22 and are formed in a lattice shape when viewed in plan as shown in FIG. Moreover, the 2nd partition 32 is formed in the shape which has the top part 321, the groove part 322, and the side part 323, as shown to Fig.4 (a). The height H2 of the second partition wall 32 is formed to be sufficiently larger than the distance H1 from the top 321 of the second partition wall 32 to the second substrate.

A heat conducting unit 40 is formed in the groove 322 of the second partition wall 32. The heat conducting unit 40 is formed of a conductive material having a higher thermal conductivity than the material constituting the second partition wall 32. Specifically, the heat conducting unit 40 is formed of a metal material such as Al, Ag, Cu, or Au. In addition, the heat conduction unit 40 may select a material having a higher thermal conductivity than a material constituting the second electrode 23 described later and a material constituting the filling layer 13.
As shown in FIG. 4A, the heat conducting part 40 is formed in a V-shaped groove part 322 formed in the second partition wall 32. In the present invention, the shape of the heat conducting part 40 is V-shaped. For example, as shown in FIG. 4B, a concave groove 322a is formed in the second partition wall 32, and a heat conducting portion 41 having a rectangular cross-sectional shape is formed therein. Also good.

  The light emitting functional layer 22 is formed on the first electrode 21 and the first partition 31 so as to be in contact with the side surface portion 323 of the second partition. The light emitting functional layer 22 includes at least a light emitting layer, and the light emitting layer is made of an organic EL substance that emits light by combining holes and electrons. In the present embodiment, the organic EL substance is a low molecular material or a high molecular material. As another layer constituting the light emitting functional layer 22, part or all of an electron block layer, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and a hole block layer may be provided.

A second electrode 23 is formed on the light emitting functional layer 22, the second partition 32, and the heat conducting unit 40 so as to be common to the plurality of light emitting elements E. The second electrode 23 is supplied with the low potential VL from the power supply unit 50 via the second power supply line 230, and functions as a cathode of the light emitting element E. Moreover, it also has a function as a reflecting plate that reflects light emitted from the light emitting functional layer 22 in the direction opposite to the first substrate 11 side toward the first substrate 11 side (direction L in FIG. 4). .
The material constituting the second electrode 23 is made of a reflective metal material having a small work function, such as Al, Mg or the like. Note that a highly conductive metal such as Al, Ag, Au, or Cu may be stacked on a metal having a small work function value such as Mg, Li, or Ca.
In the present embodiment, the plurality of light emitting elements E emit white light. However, the plurality of light emitting elements E may be configured by any one of R color, G color, and B color, or a combination thereof. When the plurality of light emitting elements E are configured by a combination of the R color, the G color, and the B color, any one of the R color, the G color, and the B color along the direction extending in the Y axis in FIG. Alternatively, N light emitting elements E that emit light of one color may be arranged in a line, and the row of light emitting elements E that emit light of one color may be arranged in stripes along the direction extending in the X axis.

The second substrate 12 is formed of plastic, glass or the like. The second substrate 12 is bonded to the second electrode 23 formed on the first substrate 11 by the filling layer 13. The filling layer 13 is formed of a resin such as a thermosetting resin or an ultraviolet curable resin. The light emitting element E and the like formed on the first substrate 11 are sealed by the second substrate 12 and the filling layer 13, and the light emitting element E is protected from moisture, oxygen, and the like. Further, a part of the filling layer may be replaced with a laminate of an inorganic oxide layer such as SiON and an organic material layer such as resin. By forming a laminated structure, water and oxygen blocking properties can be further enhanced.
In addition, since this embodiment is a bottom emission type which emits light in the direction L as described above, it is not necessary to form the second substrate 12 and the filling layer 13 with a light transmissive material. Moreover, since the light emitted from the light emitting element E is reflected by the second electrode 23, the second substrate 12 and the filling layer 13 do not need to be formed of a light reflective material. However, when it is necessary to prevent the light from being emitted in the direction opposite to the direction L, the surface of the second substrate 12 that is bonded to the filling layer 13 out of the two surfaces of the second substrate 12 is made of chromium oxide or the like. A low reflection material may be formed.

Thus, the illuminating device 1 according to the present embodiment includes a plurality of light emitting elements E in the light emitting unit 10, and each light emitting element E is divided by the insulating first partition wall 31 and the second partition wall 32.
If the illumination unit is formed of a single light emitting element, the entire lighting device as a result of the minute defects caused by the deterioration of the light emitting element over time or the incorporation of foreign matters during the production of the light emitting element expand over time. There was a possibility that could not emit light. In contrast, since the light emitting unit 10 according to the present embodiment is formed by dividing a plurality of light emitting elements E, even if a defect occurs in one light emitting element E and the defect expands, the defect remains in the light emitting element 10 A plurality of other light-emitting elements E can remain lit. That is, even if a defect occurs in one light emitting element E, the function as the surface light source of the light emitting unit 10 is not impaired, and light emission can be stably maintained. Thus, the illuminating device 1 of this embodiment has the advantage that lifetime extension is possible.
As shown in FIG. 1, a bleeder resistor R is connected to each light emitting element E. Thereby, even if a short circuit occurs between the first electrode 21 and the second electrode 23, current can be prevented from concentrating on the light emitting element E in which the short circuit has occurred, and the light emitting unit 10 as a whole. It has the advantage that it can emit light stably.

Moreover, the illuminating device 1 which concerns on this embodiment needs to thermally radiate the heat | fever at the time of the light emitting element E light-emitting efficiently. In particular, when the lighting device 1 is applied to a device such as an indoor lighting device that is supposed to be used for light emission at all times, the light emitting element E is constant unless the heat generated from the light emitting element E is efficiently dissipated. Since the light emitting element E deteriorates in a short period of time due to the high temperature state, the service life of the lighting device 1 becomes short.
In this regard, the lighting device 1 according to the present embodiment includes the second partition wall 32 having a height corresponding to the distance H2, so that in addition to the heat dissipation paths X0 and X1 as illustrated in FIG. Heat can be efficiently radiated from X2. The heat dissipation path X1 is a path where heat is conducted through the filling layer 13 for a distance corresponding to H1 + H2 and then radiated to the outside from the plane 12a through the second substrate 12, whereas the heat dissipation path X2 is This is a path that conducts through the second electrode 23 by a distance corresponding to the distance H2, conducts through the filling layer 13 by the distance H1, and radiates heat from the plane 12a through the second substrate 12 to the outside.
The material forming the second electrode 23 is a metal as described above, and has a higher thermal conductivity than the resin forming the filling layer 13. Further, since the distance H2 occupied by the second electrode 23 in the heat dissipation path X2 is sufficiently larger than the distance H1 occupied by the filling layer 13, the heat resistivity of the heat dissipation path X2 as a whole is the material of the second electrode 23. It approaches the thermal resistivity of Therefore, the heat dissipation efficiency per unit cross-sectional area of the heat dissipation path X2 is higher than the heat dissipation efficiency per unit cross-sectional area of the heat dissipation path X1. The lighting device 1 having such a heat radiation path X2 has a low thermal resistance as a whole device and a high heat radiation efficiency, and therefore has an advantage that heat generated from the light emitting element E can be efficiently radiated to the outside. Have.

In addition, the lighting device 1 includes a heat conducting unit 40 formed in the groove 322 of the second partition wall 32. Since the material constituting the heat conduction part 40 has a larger thermal conductivity than the material constituting the second partition wall 32, the light emitting element E, the second partition wall 32, the heat conduction part 40, the second electrode 23, the filling layer. 13 and the heat dissipation path X3 connected to the outside via the second substrate 12 can also effectively conduct the heat from the light emitting element E to the outside. The lighting device 1 including such a heat dissipation path X3 has an advantage that the heat dissipation efficiency is further increased.
In addition, when the heat conductive part 41 which has the rectangular cross-sectional shape shown in FIG.4 (b) is formed instead of the V-shaped heat conductive part 40 shown to Fig.4 (a), heat conduction from the light emitting element E is carried out. Since the linear distance to the portion 40 is shortened and the proportion of the second partition 32 in the heat dissipation path X3 is reduced, there is an advantage that the heat dissipation efficiency of the heat dissipation path X3 can be further increased.
Further, when the heat conducting portions 40 to 41 are formed of a material having a higher thermal conductivity than the material forming the second electrode 23 and the material forming the filling layer 13, the heat conducting portions 40 to 41 per unit cross-sectional area of the heat radiation path X <b> 3. The heat dissipation efficiency can be higher than that of the heat dissipation paths X1 and X2, and the heat dissipation efficiency of the entire lighting device 1 can be further increased.
In addition, the heat resistance value which the heat radiation path | route X1-X3 from the light emitting element E to the 2nd board | substrate 12 side has as a whole becomes the value which connected each heat resistance value which the heat radiation path | route X1-X3 has in parallel.

Moreover, the illuminating device 1 which concerns on this embodiment formed the 1st electrode 21 so that it might respond | correspond 1 to 1 to each of the several light emitting element E. As shown in FIG. A transparent conductive material such as ITO forming the first electrode 21 has a larger electric resistance than a metal. However, the first electrode 21 is individually formed so as to correspond to each of the plurality of light emitting elements E on a one-to-one basis, and voltage is applied to each of the first electrodes 21 via an auxiliary wiring having a small electric resistance. Therefore, the occurrence of a voltage drop depending on the distance from the power supply unit 50 can be prevented, and the voltage supplied to each light emitting element E can be made equal. Accordingly, each of the plurality of light emitting elements E can emit light with the same luminance, and there is an advantage that the occurrence of luminance unevenness in the light emitting unit 10 can be prevented.
The second electrode 23 is formed on the entire surface of the light emitting unit 10 so as to be common to the plurality of light emitting elements E. However, the second electrode 23 is formed of a highly conductive metal material and has a low electric resistance. In addition, problems such as uneven brightness are unlikely to occur.
Thus, the illuminating device 1 has the advantage that the occurrence of a voltage drop in the light emitting unit 10 can be suppressed and the occurrence of uneven brightness can be prevented.

Next, the manufacturing method of the illuminating device 1 which concerns on this embodiment is demonstrated.
First, a first substrate 11 made of glass or plastic is prepared, and auxiliary wiring (not shown) is formed on the first substrate 11. Then, an interlayer insulating film (not shown) that shields the auxiliary wiring and the light emitting element E is formed of SiO ₂ or the like. A bleeder resistance R is formed on the interlayer insulating film. The bleeder resistor R is formed so as to be electrically connected to the light emitting element E and to be electrically connected to the auxiliary wiring through a contact hole formed in the interlayer insulating film.

  Subsequently, as shown in FIG. 6, a plurality of first electrodes 21 are formed on the first substrate 11 in an M × N matrix. For example, an ITO film having a uniform thickness of 50 nm is formed on the entire surface of the first substrate 11 by sputtering and then sintered in an oven. Then, a resist is formed on the ITO film by exposure using a photolithography technique, and etching is performed with an ITO etchant such as BHF (hydrofluoric acid / ammonium fluoride aqueous solution). Patterning is performed to remove the resist.

Further, as shown in FIG. 7, the first partition wall 31 is formed on the first substrate 11 so as to overlap the peripheral edge portion of the first electrode 21. A portion of the first partition 31 that does not overlap the first electrode 21 is attached to the interlayer insulating film. For example, SiO ₂ is deposited on the entire surface of the first substrate 11 and the first electrode 21 by vapor deposition such as CVD (chemical vapor deposition) or PVD (physical vapor deposition), sputtering, or ion plating. . Then, a resist is formed on a required portion by exposure using a photolithography technique on the SiO ₂ film, and the first partition wall 31 is patterned by, for example, dry etching, and the resist is peeled off.

Next, as shown in FIG. 8, a material layer 32 a of the second partition 32 is formed on the entire surface on the first electrode 21 and the first partition 31.
Then, as shown in FIGS. 9 and 10, the second partition walls 32 are patterned by exposure using a photolithography technique, and are further baked. Specifically, in order to pattern the second partition wall 32 into a shape having the groove part 322, a mask 60 including a transmission part 61, a semi-transmission part 62, and a shielding part 63 is used. The region corresponding to the transmissive portion 61 in the material layer 32 a is completely exposed by the mask 60, but the region corresponding to the semi-transmissive portion 62 is half-exposed with a light beam having a low intensity, and the shielding portion 63 is also exposed. The corresponding area is not exposed. The shielding part 63 of the mask 60 is made to correspond to the area corresponding to the top part 321 of the second partition wall 32, the semi-transmissive part 62 is made to correspond to the area corresponding to the groove part 322, and the transmissive part 61 is made to correspond to the second partition wall 32. The second partition wall 32 shown in FIG. 10 is formed by patterning the second partition wall 32 in correspondence with the region that is not formed and peeling the resist.

Subsequently, as shown in FIGS. 11 and 12, the heat conducting portion 40 is formed by a droplet discharge method. Specifically, as shown in FIG. 11, using a droplet discharge head 70, a solution 40 a containing metal particles, which is a material of the heat conduction unit 40, is applied to the groove 322 and further baked for dehydration. Thereby, the heat conduction part 40 shown in FIG. 12 is formed.
Next, as shown in FIG. 13, the light emitting functional layer 22 is formed. Specifically, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are formed on the first electrode 21 so as to be in contact with the side surface portion 323 of the first partition wall 31 or the second partition wall 32. Form in order. These layers may be formed by a droplet discharge method such as an inkjet method using the droplet discharge head 70.
After all the light emitting functional layers 22 are formed in this way, the second electrode 23 is formed as shown in FIG. For example, Al, MgAg, or the like is formed on the entire surface of the light emitting functional layer 22, the second partition wall 32, and the heat conducting unit 40 to a uniform thickness of, for example, 10 nm by vapor deposition.
Further, the second electrode 23 and the second substrate 12 are bonded by the filling layer 13. Thereby, the light emitting part 10 shown in FIG. 4 is formed.

<B: Modification>
In the present embodiment, the second partition wall 32 and the groove 322 are formed in the same process by using the mask 60, but the present invention is not limited to such a manufacturing method.
For example, as shown in FIGS. 15 and 16, first, a shielding portion 63a corresponding to a region where the crown portion 321 and the groove portion 322 are formed and a transmission portion 61a corresponding to a region where the second partition wall 32 is not formed are provided. By using the mask 60a, the groove 322 forms the second partition wall 32b in which the groove 322 is not formed, and then the transmission part 61b corresponding to the region where the groove 322 is formed, and the shielding part 63b corresponding to the other region, The groove portion 322 may be formed by using the mask 60b having the above. In this case, the 2nd partition 32 is formed by adjusting the intensity | strength of the light beam irradiated through the mask 60a, and the light beam irradiated through the mask 60b, respectively.

In the illuminating device 1 of this embodiment, although the heat conductive part 40 was formed from the material whose heat conductivity is larger than the material which forms the 2nd electrode 23, this invention is not limited to this.
For example, the heat conducting unit 40 and the second electrode 23 may be formed of the same metal material. In this case, since both the heat conducting unit 40 and the second electrode 23 are made of metal, the heat conducting unit 40 has a high heat dissipation efficiency and also serves as an auxiliary electrode for the second electrode 23. In this case, the lighting device 1 has the advantage of extending the life due to having high heat dissipation efficiency, and also has the advantage of reducing power consumption by suppressing electric resistance.

Moreover, the heat conduction part 40 which concerns on the illuminating device 1 of this embodiment is a material which forms a positive hole injection layer among the light emission functional layers 22, For example, the polyethylenedioxythiophene shown by following Chemical formula 1, and polystyrene sulfonic acid ( (Hereinafter referred to as “PEDOT / PSS”). In this case, since the hole injection layer and the heat conduction part 40 can be simultaneously formed by the droplet discharge method, there is an advantage that the manufacturing cost is reduced. In addition, since PEDOT / PSS has a small electric resistance, the heat conducting unit 40 functions as an auxiliary electrode of the second electrode 23 and has an advantage that the power consumption of the lighting device 1 can be reduced.
In addition, when PEDOT / PSS which forms the heat conduction part 40 has thermal conductivity larger than the material which comprises the 2nd partition 32 and the filling layer 13, the thermal radiation efficiency which the thermal radiation path X3 has is the thermal radiation path X1. The heat radiation efficiency of the light emitting unit 10 as a whole can be increased by having the heat conducting portion 40.

<C: Application example>
Next, an electronic apparatus using the lighting device 1 according to each aspect described above will be described. FIGS. 17 to 19 show forms of electronic devices that employ the lighting device 1.
FIG. 17 is a perspective view of a lighting stand that employs the lighting device 1. The illumination stand 1000 includes a pedestal 1001, a connection unit 1002, and the illumination device 1.
FIG. 18 is a perspective view showing the configuration of a mobile personal computer that employs the lighting device 1. The personal computer 2000 includes a display unit 2003 that displays various images, and a main body unit 2010 on which a power switch 2001 and a keyboard 2002 are installed. The display unit 2003 includes a liquid crystal device, and the planar illumination device 1 is used as a backlight of the liquid crystal device.
FIG. 19 is a perspective view illustrating a configuration of a mobile phone to which the illumination device 1 is applied. The cellular phone 3000 includes a plurality of operation buttons 3001 and scroll buttons 3002, and a display unit 3003 that displays various images. The display unit 3003 includes a liquid crystal device, and the planar illumination device 1 is used as a backlight of the liquid crystal device. By operating the scroll button 3002, the screen displayed on the display portion 3003 is scrolled.

  Electronic devices to which the lighting device according to the present invention is applied include, in addition to the devices illustrated in FIGS. 17 to 19, digital still cameras, televisions, video cameras, car navigation devices, pagers, electronic notebooks, electronic papers, Examples include calculators, word processors, workstations, videophones, POS terminals, printers, scanners, copiers, video players, devices equipped with touch panels, and the like.

  DESCRIPTION OF SYMBOLS 10 ... Light emission part, 11 ... 1st board | substrate, 12 ... 2nd board | substrate, 13 ... Filling layer, 21 ... 1st electrode, 22 ... Light emission functional layer, 23 ... 2nd electrode, 31 ... 1st partition, 32 ... 2nd Partition walls, 322... Groove portions, 40... Heat conduction portions, E.

Claims (6)

A first substrate;
A plurality of first electrodes formed on the first substrate;
An insulating partition having a groove formed on the first substrate so as to separate the plurality of first electrodes;
A plurality of light emitting functional layers formed on the first electrode so as to be in contact with a side surface of the partition;
A heat conduction part made of a material having a thermal conductivity larger than that of the material forming the partition, formed in the groove of the partition;
A second electrode formed on the plurality of light emitting functional layers, the partition walls, and the heat conducting unit;
A second substrate;
An illumination device comprising: a filling layer provided between the second substrate and the second electrode. The heat conducting part is formed of a conductive metal material,
The lighting device according to claim 1. The first substrate and the plurality of first electrodes are formed of a transparent material,
The second electrode is made of a reflective metal,
The illumination device according to claim 1 or 2. An electronic apparatus comprising the lighting device according to any one of claims 1 to 3. A method of manufacturing a lighting device, comprising:
Forming a plurality of transparent first electrodes on a transparent first substrate;
Forming an insulating partition having a groove on the first substrate so as to partition each of the plurality of first electrodes;
By discharging a solution containing metal particles into the groove portion, a heat conduction portion made of a material having a thermal conductivity larger than that of the partition wall is formed,
Forming a plurality of light emitting functional layers in a region partitioned by the partition on the first electrode;
Forming a second electrode made of a reflective metal on the plurality of light emitting functional layers, the partition walls, and the heat conducting portion;
Forming a filling layer on the second electrode;
The method for manufacturing a lighting device, wherein the filling layer and the second substrate are bonded together. Forming an insulating partition having a groove on the first substrate so as to divide each of the plurality of first electrodes;
Forming an insulating partition on the first substrate so as to separate each of the plurality of first electrodes;
The method for manufacturing a lighting device according to claim 5, wherein the groove is formed by cutting the top of the partition wall.

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