JP2014533211A - 間隙を残して底部充填し、スタンプを脈動刷ることを含む、スタンプを用いた基板上の軟質材料のインプリントを向上させる技術 - Google Patents

間隙を残して底部充填し、スタンプを脈動刷ることを含む、スタンプを用いた基板上の軟質材料のインプリントを向上させる技術 Download PDF

Info

Publication number
JP2014533211A
JP2014533211A JP2014532052A JP2014532052A JP2014533211A JP 2014533211 A JP2014533211 A JP 2014533211A JP 2014532052 A JP2014532052 A JP 2014532052A JP 2014532052 A JP2014532052 A JP 2014532052A JP 2014533211 A JP2014533211 A JP 2014533211A
Authority
JP
Japan
Prior art keywords
stamp
resist
substrate
pressure
flowable material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014532052A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014533211A5 (enExample
Inventor
サチス，エマヌエル，エム．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
1366
Original Assignee
1366
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 1366 filed Critical 1366
Publication of JP2014533211A publication Critical patent/JP2014533211A/ja
Publication of JP2014533211A5 publication Critical patent/JP2014533211A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B29C2033/426—Stampers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/40—Plastics, e.g. foam or rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/015—Imprinting
    • B81C2201/0153—Imprinting techniques not provided for in B81C2201/0152

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2014532052A 2011-09-23 2012-09-22 間隙を残して底部充填し、スタンプを脈動刷ることを含む、スタンプを用いた基板上の軟質材料のインプリントを向上させる技術 Pending JP2014533211A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161538489P 2011-09-23 2011-09-23
US61/538,489 2011-09-23
PCT/US2012/056769 WO2013044180A1 (en) 2011-09-23 2012-09-22 Techniques for improved imprinting of soft material on substrate using stamp including underfilling to leave a gap and pulsing stamp

Publications (2)

Publication Number Publication Date
JP2014533211A true JP2014533211A (ja) 2014-12-11
JP2014533211A5 JP2014533211A5 (enExample) 2015-11-12

Family

ID=47914939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014532052A Pending JP2014533211A (ja) 2011-09-23 2012-09-22 間隙を残して底部充填し、スタンプを脈動刷ることを含む、スタンプを用いた基板上の軟質材料のインプリントを向上させる技術

Country Status (8)

Country Link
US (1) US20150037922A1 (enExample)
EP (1) EP2758999A4 (enExample)
JP (1) JP2014533211A (enExample)
KR (1) KR20140064981A (enExample)
CN (1) CN103959485A (enExample)
SG (1) SG11201400622SA (enExample)
TW (1) TW201321167A (enExample)
WO (1) WO2013044180A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019527938A (ja) * 2016-08-05 2019-10-03 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 導電性材料のインプリントリソグラフィの方法、インプリントリソグラフィのためのスタンプ、及びインプリントリソグラフィのための装置
JPWO2021107008A1 (enExample) * 2019-11-29 2021-06-03

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2280813B1 (en) * 2008-04-18 2017-06-07 Massachusetts Institute Of Technology Imprint patterning of irregular surface
US10328635B1 (en) * 2017-12-06 2019-06-25 Massivit 3D Printing Technologies Ltd. Complex shaped 3D objects fabrication
US11485052B2 (en) * 2018-07-30 2022-11-01 Canon Kabushiki Kaisha Resin product, method of making resin product, interchangeable lens, and optical device
EP4468079A1 (en) * 2023-05-22 2024-11-27 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO A stamp for use in imprint lithography, a method of manufacturing thereof, and a method for imprint lithography

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011518060A (ja) * 2008-04-18 2011-06-23 マサチューセッツ インスティテュート オブ テクノロジー 不規則表面のウェッジインプリントパターニング

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099940A (en) * 1997-07-16 2000-08-08 The Procter & Gamble Company Selectively-activatible three-dimensional sheet material having multi-stage progressive activation to deliver a substance to a target surface
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US7635262B2 (en) * 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
EP2386118A4 (en) * 2009-01-06 2013-09-04 1366 Tech Inc APPLICATION OF A LIQUID-RELATED MATERIAL TO STRUCTURED SURFACES USING AN OUTLET TUBE

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011518060A (ja) * 2008-04-18 2011-06-23 マサチューセッツ インスティテュート オブ テクノロジー 不規則表面のウェッジインプリントパターニング

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019527938A (ja) * 2016-08-05 2019-10-03 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 導電性材料のインプリントリソグラフィの方法、インプリントリソグラフィのためのスタンプ、及びインプリントリソグラフィのための装置
JPWO2021107008A1 (enExample) * 2019-11-29 2021-06-03
JP7708424B2 (ja) 2019-11-29 2025-07-15 学校法人聖路加国際大学 薄肉成形品の製造方法及びウェルプレート

Also Published As

Publication number Publication date
EP2758999A4 (en) 2016-01-27
CN103959485A (zh) 2014-07-30
TW201321167A (zh) 2013-06-01
US20150037922A1 (en) 2015-02-05
WO2013044180A1 (en) 2013-03-28
SG11201400622SA (en) 2014-04-28
EP2758999A1 (en) 2014-07-30
KR20140064981A (ko) 2014-05-28

Similar Documents

Publication Publication Date Title
US8633052B2 (en) Wedge imprint patterning of irregular surface
JP2014533211A (ja) 間隙を残して底部充填し、スタンプを脈動刷ることを含む、スタンプを用いた基板上の軟質材料のインプリントを向上させる技術
TWI380895B (zh) 控制殘餘層厚度之技術
CN107110185B (zh) 具有可逐步切换的粘附性的结构化表面
Bartolo et al. Bouncing or sticky droplets: Impalement transitions on superhydrophobic micropatterned surfaces
KR101800367B1 (ko) 마이크로 소자 전사방법 및 마이크로 소자 전사방법으로 제조된 마이크로 소자 기판
Northen et al. A batch fabricated biomimetic dry adhesive
Scheer et al. A contribution to the flow behaviour of thin polymer films during hot embossing lithography
WO2008076390A2 (en) Dry adhesives and methods for making dry adhesives
US20170367418A1 (en) Polymer microwedges and methods of manufacturing same
WO2009053714A1 (en) Adhesive microstructures
KR100293454B1 (ko) 압축성형방법
JP5258973B2 (ja) インプリント・リソグラフィ工程における剥離
Overton et al. High precision self-alignment using liquid surface tension for additively manufactured micro components
US8530251B2 (en) Manufacturing method of high-efficiency LED
TW201024071A (en) Wedge imprint patterning of irregular surface
US6620331B1 (en) Method of etching an opening
Ferguson Improved gecko inspired dry adhesives applied to the packaging of MEMS
JP7507641B2 (ja) 成形装置及び物品の製造方法
Ren Synthetic Gecko Inspired Dry Adhesive Through Two-Photon Polymerization for Space Applications
Tang et al. Stencil printing on bumped wafer for pre-applied underfill application
JP2005127778A (ja) ニードル用コーティング方法及びニードル用コーティング装置
Chudak Dynamics of wet adhesion at soft interfaces
Bliznyuk Directional wetting on patterned surfaces
Kay Novel micro-engineered stencils for flip-chip bonding and wafer level packaging

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150917

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150917

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160802

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170228