JP2014523103A - 改善されたled照明システム及び/又はその製造方法 - Google Patents
改善されたled照明システム及び/又はその製造方法 Download PDFInfo
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- JP2014523103A JP2014523103A JP2014521615A JP2014521615A JP2014523103A JP 2014523103 A JP2014523103 A JP 2014523103A JP 2014521615 A JP2014521615 A JP 2014521615A JP 2014521615 A JP2014521615 A JP 2014521615A JP 2014523103 A JP2014523103 A JP 2014523103A
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- led
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- certain example
- light
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- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】照明システムは、1つ以上のアパーチャ110を有するガラス基板114を含む。LED104又はその他の光源がアパーチャの一端に配置されて光がLEDからガラス基板のアパーチャを介してアパーチャに対向する端部に出る。アパーチャの内面108は、LEDから放射される光を反射するための銀のようなミラーコーティング物質を含む。特定の実施形態例において、リモート蛍光体製品又は層はアパーチャの他の端部でLEDを対向するように配置される。特定の実施形態例において、レンズはリモート蛍光体製品とLEDとの間のアパーチャに配置される。
【選択図】図1A
Description
例示的な基本ガラス
ガラスで例示的な追加物質
実施形態例のガラス特徴
Claims (26)
- 深さに沿ってテーパし、第1端部から第2端部へ直径又は距離が増加する少なくとも1つのキャビティ(cavity)をガラス基板内に形成するステップと、
前記少なくとも1つのキャビティの表面に反射素子を配置するステップと、
配置された前記反射素子が各々の発光ダイオード(LED)から放射される光の少なくとも一部を反射して実質的に各々の前記LEDからの光のエタンデュ(etendue)を保存できるように各々の前記キャビティの前記第1端部又はその近辺に前記LEDを配置するステップと、
を含む照明フィクスチャの製造方法。 - 前記第1基板に複数のキャビティが形成される、
請求項1に記載の照明フィクスチャの製造方法。 - 各々の前記キャビティは、断面から見れば放物線型側壁を有する、
請求項1又は請求項2に記載の照明フィクスチャの製造方法。 - 前記反射素子を配置するステップは、各々の前記キャビティの表面に薄膜物質を配置するステップを含む、
請求項1から請求項3のいずれか一項に記載の方法。 - 前記薄膜物質は、銀からなる、又は銀を含む
請求項4に記載の照明フィクスチャの製造方法。 - 前記薄膜物質の上に保護物質を配置するステップをさらに含む、
請求項4又は請求項5に記載の照明フィクスチャの製造方法。 - 前記保護物質は、ポリマー、エポキシ、樹脂又は原子層蒸着によって蒸着された層である、
請求項6に記載の照明フィクスチャの製造方法。 - 各々の前記キャビティは、貫通孔である、
請求項1から請求項7のいずれか一項に記載の照明フィクスチャの製造方法。 - 各々の前記キャビティは、前記基板の深さより小さく形成される、
請求項1から請求項8のいずれか一項に記載の照明フィクスチャの製造方法。 - 各々の前記LEDが印刷回路板に位置する、
請求項1から請求項9のいずれか一項に記載の照明フィクスチャの製造方法。 - 各々の前記LEDは、チップオンガラスに形成されたLEDである、
請求項1から請求項10のいずれか一項に記載の照明フィクスチャの製造方法。 - 各々の前記キャビティの第2端部を出る反射光は、10度〜30度の分布を有するように実質的にコリメートされる、
請求項1から請求項11のいずれか一項に記載の照明フィクスチャの製造方法。 - 深さに沿ってテーパし、第1端部から第2端部へ直径又は距離が増加する少なくとも1つのキャビティをガラス基板内に形成するステップと、
実質的に光源から光のエタンデュ(etendue)を保存するために各々の前記キャビティの前記第1端部又はその近辺に配置可能な光源から光の少なくとも一部を反射するように配置された反射素子を前記少なくとも1つのキャビティの表面に配置するステップと、
を含む照明フィクスチャの製造方法。 - (a)深さに沿ってテーパし、第1端部から第2端部へ直径又は距離が増加し、(b)その表面に反射素子が配置される少なくとも1つのキャビティを有するガラス基板を提供するステップと、
配置された前記反射素子が各々の発光ダイオード(LED)から放射される光の少なくとも一部を反射して実質的に各々の前記LEDからの光のエタンデュ(etendue)を保存できるように各々の前記キャビティの前記第1端部又はその近辺にLEDを配置するステップと、
を含む照明フィクスチャの製造方法。 - (a)深さに沿ってテーパし、第1端部から第2端部へ直径又は距離が増加し、(b)その表面に反射素子が配置される複数のキャビティを有するガラス基板と、
複数の発光ダイオード(LED)であって、配置された前記キャビティの反射素子が各々の前記LEDから放射される光の少なくとも一部を反射して実質的に各々の前記LEDからの光のエタンデュ(etendue)を保存できるように各々の前記キャビティの前記第1端部又はその近辺にある複数のLEDと、
を含む装置。 - 各々の前記キャビティは、断面で見ると放物線型側壁がある、
請求項15に記載の装置。 - 各々の前記キャビティの反射素子は、薄膜層を含む、
請求項15又は請求項16に記載の装置。 - 前記薄膜層上に保護物質をさらに含む、
請求項17に記載の装置。 - 前記保護物質は、ポリマー、エポキシ、樹脂、又は、原子層蒸着によって蒸着された層である、
請求項18に記載の装置。 - 各々の前記キャビティは貫通孔である、
請求項15から請求項19のいずれか一項に記載の装置。 - 各々の前記キャビティは、前記第1基板の深さより小さく形成される、
請求項15から請求項20のいずれか一項に記載の装置。 - 前記複数のLEDを支持する印刷回路板をさらに含む、
請求項15から請求項21のいずれか一項に記載の装置。 - 各々の前記LEDは、チップオンガラスで形成されたLEDである、
請求項15から請求項22のいずれか一項に記載の装置。 - 各々の前記キャビティの前記第2端部を出る反射光は10度〜30度分布を有するように実質的にコリメートされる、
請求項15から請求項23のいずれか一項に記載の装置。 - 請求項15から請求項24のうちいずれか一項による装置を含む
照明システム。 - 複数の相互接続された装置を含み、各々の前記装置は、第15項から第25項のうちいずれか一項による装置である、
照明システム。
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US13/188,916 US8992045B2 (en) | 2011-07-22 | 2011-07-22 | LED lighting systems and/or methods of making the same |
US13/188,916 | 2011-07-22 | ||
PCT/US2012/037727 WO2013015862A1 (en) | 2011-07-22 | 2012-05-14 | Improved led lighting systems and/or methods of making the same |
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US20130021799A1 (en) | 2013-01-24 |
TW201305498A (zh) | 2013-02-01 |
US8992045B2 (en) | 2015-03-31 |
KR20140054060A (ko) | 2014-05-08 |
EP2735024A1 (en) | 2014-05-28 |
KR101911984B1 (ko) | 2019-01-03 |
WO2013015862A1 (en) | 2013-01-31 |
CN103782384A (zh) | 2014-05-07 |
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BR112014001476A2 (pt) | 2017-02-21 |
MX2014000864A (es) | 2014-02-20 |
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