JP2014236624A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of surely and quickly detecting electric leak while preventing short-circuit between main electrode terminals due to coolant leakage.SOLUTION: A power conversion device 1 comprises: a semiconductor unit 10; a conductive case 4 which houses the semiconductor unit 10; a base plate 42 arranged below the semiconductor unit 10 so as to face the semiconductor unit 10; and electric conduction detecting means for detecting electric conduction between the base plate 42 and a semiconductor module 2. The semiconductor unit 10 includes a semiconductor module 2 with a built-in switching element and a cooling device 3 including a cooling tube 31 for internally circulating a cooling medium and cooling the semiconductor module 2. Of three main electrode terminals 23 in the semiconductor module 2, a positive electrode terminal 24 includes a protrusion 241 protruding further than other main electrode terminals 23 toward the base plate 42.

Description

  The present invention relates to a power conversion device.

  An electric vehicle, a hybrid vehicle, or the like uses a power conversion device that includes a semiconductor unit that includes a semiconductor module that incorporates a switching element and a case that houses the semiconductor unit. The semiconductor unit includes a semiconductor module and a cooling device for cooling the semiconductor module. The cooling device includes a cooling water channel that circulates a refrigerant therein, and is configured to cool the semiconductor module by exchanging heat between the refrigerant that circulates the cooling water channel and the semiconductor module.

  In such a power converter, if the refrigerant leaks from the cooling water channel, a short circuit may occur in the main electrode terminal of the semiconductor module due to the refrigerant. Therefore, a fuse is provided between the power conversion device and the electric circuit to which the power conversion device is connected to prevent a current exceeding the rating from flowing.

Moreover, as a structure which prevents the short circuit of the main electrode terminal by a refrigerant | coolant, there exists a thing disclosed by patent document 1, for example. The power conversion device disclosed in Patent Document 1 includes a plurality of semiconductor modules, a case for housing the semiconductor modules, and a cooling water channel formed in the case.
The case has an upper stage accommodating part, a middle stage part, and a lower stage accommodating part for accommodating a plurality of semiconductor modules, respectively, and a partition is formed between the upper stage accommodating part and the middle stage part.

  The partition wall is formed so as to penetrate between the upper stage accommodating part, the middle stage part, and the lower stage accommodating part, and includes a communication hole through which an electric wire is inserted, a cooling water channel through which a refrigerant flows, and a communication hole and a cooling water channel. And a groove formed therebetween. That is, the partition also serves as a cooling device for cooling the plurality of semiconductor modules. Further, by providing the groove, when the refrigerant leaks from the cooling water channel toward the communication hole inside the partition wall, the refrigerant is circulated in the groove to discharge to the outside of the case. Thus, the refrigerant is prevented from leaking into the case through the communication hole, and leakage in the power conversion device is prevented.

JP 2011-19339 A

However, the above power converter has the following problems.
In the above power conversion device, all the refrigerant leaking from the cooling water channel may be discharged to the outside from the groove, but if the refrigerant leaks to other places in the case, the main electrode terminals may be short-circuited. It is done. In this case, since a current exceeding the rating tends to flow from the power conversion device to the connected electric circuit, the fuse disposed between the two fuses. Therefore, it is necessary to replace the fuse in addition to repair and replacement of the power converter.

  The present invention has been made in view of such a background, and can prevent a short circuit between main electrode terminals due to leakage of a refrigerant, and can detect a leakage reliably and at an early stage, thereby providing a power converter. Is.

One aspect of the present invention is a semiconductor unit having a semiconductor module including a switching element, and a cooling device that includes a cooling tube that circulates a refrigerant therein and cools the semiconductor module.
A conductive case for housing the semiconductor unit;
A base plate disposed below the semiconductor unit so as to face the semiconductor unit;
Having energization detection means for detecting energization between the base plate and the semiconductor module;
Among the plurality of main electrode terminals in the semiconductor module, any one of the positive electrode terminal, the negative electrode terminal, and the output terminal includes a protruding portion that protrudes toward the base plate from the other main electrode terminals. The power converter is a feature.

The power converter includes the base plate and a main electrode terminal provided with the protruding portion. Therefore, before the main electrode terminals are short-circuited, the electric current detection means can detect the electric leakage between the semiconductor module and the case at an early stage.
That is, when the refrigerant leaks in the cooling device of the power converter, the leaked refrigerant falls downward. Then, the dropped refrigerant stays on the base plate arranged to face the lower side of the semiconductor unit.

  When the refrigerant staying on the base plate is positioned between the base plate and the protrusion, the base plate and the protrusion are electrically connected. At this time, since the main electrode terminal having the protruding portion is any one of a positive electrode terminal, a negative electrode terminal, and an output terminal, the one main electrode terminal is energized between the base plate, There is no short circuit between the main electrode terminals.

  By detecting the energization between the base plate and the main electrode terminal by the energization detecting means, the leakage of the refrigerant in the power converter can be reliably and early without causing a short circuit between the main electrode terminals. Can be detected.

  As described above, according to the above-described power conversion device, it is possible to reliably and quickly detect a leakage while preventing a short circuit between the main electrode terminals due to the leakage of the refrigerant.

Sectional drawing of the power converter device in Example 1. FIG. II-II arrow sectional drawing in FIG. III-III arrow sectional drawing in FIG. Sectional drawing of the case in Example 1 (equivalent to the II-II arrow cross section in FIG. 1). The fragmentary sectional view of the power converter in Example 2. FIG.

  In the power conversion device, at least one plate-like rib may be erected on the surface of the base plate facing the semiconductor unit toward the semiconductor unit. In this case, the refrigerant staying on the base plate can be prevented from flowing down from the base plate. Thereby, the said protrusion part and the said refrigerant | coolant can be made easy to contact, and the detection accuracy at the time of refrigerant | coolant leakage can be improved.

  Moreover, it is preferable that the rib is formed in a circumferential shape so as to surround the main electrode terminal having the protruding portion when viewed from a direction orthogonal to the facing surface of the base plate. In this case, the refrigerant can be stored in the inner periphery of the rib formed in a circumferential shape. Thereby, the detection accuracy at the time of refrigerant leakage can be further improved.

  Moreover, it is preferable that the front-end | tip part of the said rib is distribute | arranged to the position on the said semiconductor unit side rather than the front-end | tip part distribute | arranged to the said baseplate side in the said protrusion part. In this case, the refrigerant staying on the base plate can be more reliably brought into contact with the protruding portion. Thereby, the detection precision at the time of refrigerant | coolant leakage can be improved.

Example 1
The Example concerning the said power converter device is described with reference to FIGS.
As shown in FIGS. 1 to 3, the power conversion device 1 of the present example includes a semiconductor unit 10, a case 4 having conductivity that accommodates the semiconductor unit 10, and the semiconductor unit 10 so as to face the semiconductor unit 10. It has a base plate 42 arranged below, and energization detecting means (not shown) for detecting energization between the base plate 42 and the semiconductor module 2.
The semiconductor unit 10 includes a semiconductor module 2 with a built-in switching element, and a cooling device 3 that includes a cooling tube 31 that circulates a refrigerant therein and cools the semiconductor module 2.
Of the three main electrode terminals 23 in the semiconductor module 2, the positive electrode terminal 24 includes a protruding portion 241 that protrudes toward the base plate 42 than the other main electrode terminals 23.

This will be described in more detail below.
In this example, as shown in FIGS. 1 and 2, the direction in which the semiconductor module 2 and the cooling tube 31 of the cooling device 3 are stacked is the stacking direction X, the longitudinal direction of the cooling tube 31 is the horizontal direction Y, and the stacking The direction orthogonal to both the direction X and the lateral direction Y will be described below as the height direction Z.
In the stacking direction X, the front end side of the refrigerant introduction pipe 341 and the refrigerant discharge pipe 342 protruding from the case 4 is defined as the front side, and the opposite side is defined as the rear side. Further, in the height direction Z, a side on which a DC-DC converter, which will be described later, is disposed is defined as a lower side, and the opposite side is defined as an upper side.

The power conversion apparatus 1 of this example is an apparatus for generating a drive current (U phase, V phase, W phase) for energizing a three-phase AC motor (not shown) from a DC power source in, for example, a hybrid vehicle. is there.
As shown in FIGS. 1 to 3, the power conversion device 1 includes a semiconductor unit 10 including a plurality of semiconductor modules 2, an electronic component 6 that forms a power conversion circuit together with the semiconductor unit 10, and a DC voltage for transforming The auxiliary power supply device 51, the auxiliary cooling device 52 that cools the auxiliary power supply device 51, and the case 4 that includes these are included.

  As shown in FIGS. 1 to 3, the case 4 is made of an aluminum alloy, and includes four wall portions 41 arranged circumferentially, and a base plate 42 that vertically divides a space surrounded by the wall portions 41. The upper lid body 471 and the lower lid body 472 that cover the upper and lower openings of the wall portion 41 are provided.

  As shown in FIGS. 1 to 3, the four wall portions 41 have a substantially rectangular tube shape extending along the height direction Z, and an upper end and a lower end are opened. The space inside the wall portion 41 is divided into two vertically by a base plate 42 disposed substantially in the center in the height direction Z, and an upper stage accommodating portion 401 disposed above and a lower stage accommodating disposed below. Part 402 is formed. In the present example, the upper housing portion 401 accommodates the semiconductor unit 10 and the upper side of the capacitor 61 and the reactor 62 which are the electronic components 6 that together constitute the power conversion circuit. The lower housing portion 402 is provided with a DC-DC converter that is the auxiliary power supply device 51 and a lower side of the capacitor 61.

  As shown in FIG. 4, the base plate 42 has a reactor placement portion 43 in which the reactor 62 is placed, a capacitor placement hole 44 in which the capacitor 61 is inserted, and a facing surface 45 that faces the semiconductor unit 10. . In addition, an auxiliary refrigerant channel 53 through which the refrigerant can flow is formed inside the base plate 42.

As shown in FIGS. 2 and 4, the reactor arrangement portion 43 formed on the upper surface side of the base plate 42 has a cylindrical shape having an inner diameter slightly larger than the outer diameter of the columnar reactor 62, and the reactor is disposed on the inner side. 62 can be arranged.
The capacitor arrangement hole 44 is formed in the lateral direction Y of the reactor arrangement portion 43 and the capacitor arrangement hole 44 arranged side by side in the stacking direction X. The capacitor arrangement hole 44 has a substantially rectangular shape whose longitudinal direction is the stacking direction X. The capacitor 61 inserted and disposed in the capacitor placement hole 44 is disposed on the upper housing portion 401 on the upper side and disposed on the lower housing portion 402 on the lower side.

  As shown in FIGS. 1, 3, and 4, the facing surface 45 facing the semiconductor unit 10 in the height direction Z is formed on the front side of the reactor arrangement portion 43 when viewed from above. The facing surface 45 is formed larger than the outer shape of the stacked portion 11 in the semiconductor unit 10, and a rib 46 is erected on the facing surface 45 toward the semiconductor unit 10 side.

  As shown in FIGS. 1 to 4, the rib 46 includes an outer rib 461, a rear rib 462, and a lateral direction Y of the facing surface 45 formed at the boundary with the capacitor arrangement hole 44 and the boundary with the reactor arrangement portion 43, respectively. And an inner rib 463 formed along the stacking direction X at a substantially central position. In this example, the front wall portion 411 arranged on the front side also serves as the rib 46.

  As shown in FIGS. 1 to 3, the outer rib 461 is formed so as to connect the wall portion 41 disposed on the front side and the rear rib 462 to the outer peripheral edge of the facing surface 45 on the capacitor arrangement hole 44 side.

  As shown in FIGS. 1 to 3, the rear rib 462 is formed orthogonal to the outer rib 461 at the boundary with the reactor arrangement portion 43. The height dimension of the rear rib 462 in the height direction Z is set to be larger than that of the outer rib 461 and the inner rib 463. One end of the outer rib 461 is formed so as to be connected to the inner peripheral surface of the rear rib 462, and the other end of the outer rib 461 is in contact with the inner peripheral surface of the front wall portion 411. The other end of the rear rib 462 is disposed at a position away from the inner peripheral surface of the wall portion 41 disposed on the opposite side of the capacitor arrangement hole 44 in the lateral direction Y. That is, a gap is formed between the wall portion 41 and the wall portion 41.

  As shown in FIGS. 2 and 3, the inner rib 463 is formed so as to extend in the stacking direction X at a substantially central position in the lateral direction Y on the facing surface 45, and one end thereof is connected to the inner peripheral surface of the front wall portion 411. The other end is connected to the rear rib 462. That is, the front wall portion 411, the outer rib 461, the rear rib 462, and the inner rib 463 are formed on the facing surface 45 in a circumferential shape, and are configured to be able to store liquid on the inner side. In this example, the height of the inner rib 463 is set to be the same as the height of the rear rib 462.

As shown in FIGS. 1 to 4, an auxiliary refrigerant channel 53 for circulating the refrigerant is formed in the base plate 42 below the facing surface 45 and the reactor arrangement portion 43. Therefore, the facing surface 45 constitutes a part of the ceiling surface 535 of the auxiliary refrigerant channel 53.
The front wall portion 411 is formed with an auxiliary refrigerant introduction port 533 and an auxiliary refrigerant discharge port 534 communicating with the auxiliary refrigerant flow channel 53, and an outward path 531 extending rearward from the auxiliary refrigerant introduction port 533 along the stacking direction X. And a return path 532 extending from the forward path 531 to the auxiliary refrigerant inlet 533 below the reactor arrangement portion 43. Therefore, the auxiliary power supply device 51 can be cooled by the base plate 42 by circulating the refrigerant in the auxiliary refrigerant flow path 53. That is, the base plate 42 forms an auxiliary cooling device 52 that cools the auxiliary power supply device 51.

As shown in FIGS. 1 and 3, the auxiliary power supply device 51 arranged in the lower housing portion 402 of the case 4 is fixed so as to contact the lower surface of the base plate 42. Therefore, the auxiliary power supply device 51 is effectively cooled by the auxiliary cooling device 52 including the base plate 42.
In this example, the base plate 42 can also provide a cooling effect to the reactor 62 arranged in the reactor arrangement portion 43.

  As shown in FIGS. 1 to 3, the semiconductor unit 10 housed in the upper housing portion 401 of the case 4 includes a plurality of semiconductor modules 2 incorporating switching elements, and a cooling device 3 that cools the semiconductor modules 2. Yes.

  As shown in FIGS. 1 to 3, the cooling device 3 includes a cooling tube 31 disposed on both surfaces of the semiconductor module 2, a refrigerant introduction pipe 341 and a refrigerant discharge pipe 342 for circulating the refrigerant to the cooling tube 31. ing. In this example, the cooling tube 31 is made of a metal such as aluminum and has a refrigerant flow path 32 through which a refrigerant flows. The plurality of cooling tubes 31 are arranged so as to sandwich the semiconductor module 2 from both surfaces, and the adjacent cooling tubes 31 are connected to each other by connecting tubes 33 in the vicinity of both ends in the lateral direction Y. And the lamination | stacking part 11 is formed by laminating | stacking the cooling tube 31 and the semiconductor module 2 alternately.

  As shown in FIGS. 1 to 3, the refrigerant introduction pipe 341 and the refrigerant discharge pipe 342 are provided so as to protrude forward from the front surface of the cooling tube 31 arranged at the front end portion of the stacked portion 11. The refrigerant introduced from the refrigerant introduction pipe 341 passes through the connection pipe 33 as appropriate, is distributed to each cooling tube 31 and flows in the longitudinal direction (lateral direction Y). Then, the refrigerant exchanges heat with the semiconductor module 2 while flowing through each cooling tube 31. The refrigerant whose temperature has increased due to the heat exchange passes through the downstream connecting pipe 33 and is led to the refrigerant discharge pipe 342 to be discharged. Examples of the refrigerant include natural refrigerants such as water and ammonia, water mixed with ethylene glycol antifreeze, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohol refrigerants such as methanol and alcohol. A refrigerant such as a ketone-based refrigerant such as acetone can be used.

  As shown in FIGS. 1 to 3, the semiconductor module 2 includes a main body 21 having a switching element, a plurality of control terminals 22 extending upward from the main body 21, and a plurality of extending downward from the main body 21. And a main electrode terminal 23.

As shown in FIGS. 1 to 3, the semiconductor module 2 constituting the semiconductor unit 10 includes a switching element such as an IGBT (insulated gate bipolar transistor) or a MOSFET (MOS field effect transistor). The main body 21 in the semiconductor module 2 of this example has a flat plate shape, and is formed by resin-molding two switching elements.
The control terminal 22 formed so as to extend upward from the main body portion 21 is connected to the control circuit board 7 and receives a control current for controlling the switching element.

  As shown in FIG. 3, the main electrode terminal 23 formed so as to extend downward from the main body portion 21 is composed of a positive electrode terminal 24, a negative electrode terminal 25, and an output terminal 26. The output terminal 26 of each semiconductor module 2 is set so as to output any one of the U phase, the V phase, and the W phase in a bridge circuit formed by a plurality of switching elements.

As shown in FIGS. 1 and 3, the positive terminal 24 of this example is formed with a protruding portion 241 that protrudes toward the base plate 42 from the negative terminal 25 and the output terminal 26. The protruding portion 241 extends from the tip of the positive electrode terminal 24 toward the base plate 42 side, and is disposed inside a rib 46 formed in a circumferential shape when viewed from above. Further, in the height direction Z, the distal end portions of the outer rib 461 and the inner rib 463 are arranged at a position closer to the semiconductor unit 10 than the distal end portion of the protruding portion 241. That is, the projecting portion 241 is arranged at a position inside the circumferentially formed rib 46 also in the height direction Z. In this example, protrusions 241 are formed on all the positive terminals 24 of the semiconductor module 2 constituting the semiconductor unit 10.
Note that the tip portions of the negative electrode terminal 25 and the output terminal 26 are both arranged at positions closer to the semiconductor unit 10 than the tip portions of the outer rib 461 and the inner rib 463.

  An energization detection unit (not shown) is connected to the case 4 and the semiconductor module 2 described above. This energization detecting means is configured to be able to detect energization between the case 4 and the semiconductor module 2, and the refrigerant stays on the base plate 42, and the protrusion 241 and the refrigerant come into contact with each other, so that the protrusion 241. And the base plate 42 can be detected as being electrically connected. The energization detection means may be provided integrally with the power conversion device 1, or may be incorporated as a separate body in, for example, an electric circuit on the vehicle side.

Next, the function and effect of this example will be described.
The power conversion device 1 includes a base plate 42 and a main electrode terminal 23 including a protruding portion 241. Therefore, before the main electrode terminals 23 are short-circuited, the electric leakage between the semiconductor module 2 and the case 4 can be detected at an early stage by the energization detecting means.
That is, when the refrigerant leaks in the cooling device 3 of the power conversion device 1, the leaked refrigerant falls downward. Then, the dropped refrigerant stays on the base plate 42 arranged facing the lower side of the semiconductor unit 10.

  When the refrigerant staying on the base plate 42 is positioned between the base plate 42 and the protruding portion 241, the base plate 42 and the protruding portion 241 are electrically connected. At this time, since the main electrode terminal 23 having the protruding portion 241 is only the positive electrode terminal 24, current is passed between the positive electrode terminal 23 and the base plate 42, while no short circuit occurs between the main electrode terminals 23.

  By detecting the energization between the base plate 42 and the main electrode terminal 23 by the energization detection means, the leakage of the refrigerant in the power conversion device 1 can be performed reliably and early without causing a short circuit between the main electrode terminals 23. Can be detected.

  In the power conversion device 1, at least one plate-like rib 46 stands on the surface 45 of the base plate 42 facing the semiconductor unit 10 toward the semiconductor unit 10. Therefore, the refrigerant staying on the base plate 42 can be prevented from flowing down from the base plate 42. Thereby, the protrusion part 241 and a refrigerant | coolant can be made easy to contact, and the detection accuracy at the time of refrigerant | coolant leakage can be improved.

  Further, when viewed from a direction orthogonal to the facing surface 45 of the base plate 42, the rib 46 is formed in a circumferential shape so as to surround the main electrode terminal 23 having the protruding portion 241. Therefore, the refrigerant can be stored in the inner periphery of the rib 46 formed in a circumferential shape. Thereby, the detection accuracy at the time of refrigerant leakage can be further improved.

  The tip of the rib 46 is arranged at a position closer to the semiconductor unit 10 than the tip of the protrusion 241 arranged on the base plate 42 side. Therefore, the refrigerant staying on the base plate 42 and the protruding portion 241 can be brought into contact with each other more reliably. Thereby, the detection precision at the time of refrigerant | coolant leakage can be improved.

  An auxiliary power supply 51 and an auxiliary cooling device 52 for cooling the auxiliary power supply 51 are arranged below the base plate 42 in the case 4. The auxiliary cooling device 52 is an auxiliary refrigerant that circulates refrigerant. The flow path 53 is provided, and at least a part of the ceiling surface 535 in the auxiliary refrigerant flow path 53 is formed by the base plate 42. Therefore, even when the refrigerant in the auxiliary cooling device 52 leaks to the base plate 42 side, the leakage can be detected by the protruding portion 241.

  As described above, according to the power conversion device 1 of the present example, it is possible to detect the leakage reliably and early while preventing a short circuit between the main electrode terminals 23 due to the leakage of the refrigerant.

In this example, the main electrode terminal 23 itself is extended, but the plurality of main electrode terminals 23 may have the same protruding amount, and the protruding portion 241 may be formed by joining different members.
Further, in this example, the protruding portions 241 are formed on the positive terminals 24 of all the semiconductor modules 2 constituting the semiconductor unit 10, but the present invention is not limited to this, and protrudes on the positive terminals 24 of some of the semiconductor modules 2. The part 241 may be formed. Further, although the protruding portion 241 is formed on the positive terminal 24, the protruding portion 241 may be formed on the negative terminal 25 or the output terminal 26.

(Example 2)
This example is an example in which the structure of the power conversion device 1 in the first embodiment is partially changed.
As shown in FIG. 5, the projecting portion 241 of this example includes a projecting main body portion 243 extending from the main electrode terminal 23 and an enlargement detecting portion 242 extending from the projecting main body portion 243 on both sides in the lateral direction Y. doing.
The enlargement detection unit 242 is arranged with a constant interval with respect to the base plate 42 so as to follow the facing surface 45 of the base plate 42. The protruding portion 241 shown in this example is joined to the main electrode terminal 23 which is formed separately.

As shown in FIG. 5, a pair of ribs 46 are formed on the facing surface 45 so as to face each other in the lateral direction Y. The distance between the pair of ribs 46 is set to be substantially the same as the length dimension of the cooling tube 31 in the lateral direction Y.
Of the reference numerals used in this example or the drawings relating to this example, the same reference numerals as those used in the first embodiment represent the same components as in the first embodiment unless otherwise specified.

  The protruding portion 241 shown in this example may have an enlargement detecting portion 242 extending from the protruding portion 241 so as to be along the facing surface 45 of the base plate 42. In this case, the range in which the protrusion 241 can come into contact with the refrigerant can be expanded. Thereby, the leakage of the refrigerant can be detected more reliably.

  In this example, the enlargement detection unit 242 is formed so as to extend on both sides in the horizontal direction Y. However, the present invention is not limited to this, and may be formed so as to extend in one of the horizontal directions Y or in the stacking direction X.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Semiconductor unit 2 Semiconductor module 23 Main electrode terminal 24 Positive electrode terminal 241 Protrusion part 25 Negative electrode terminal 26 Output terminal 3 Cooling device 31 Cooling tube 4 Case 42 Base plate

Claims (6)

A semiconductor unit (10) having a semiconductor module (2) having a built-in switching element and a cooling device (3) provided with a cooling tube (31) for circulating a refrigerant therein to cool the semiconductor module (2);
A conductive case (4) for housing the semiconductor unit (10);
An energization detecting means for detecting energization between the base plate (42) and the semiconductor module (2);
A base plate (42) is disposed below the semiconductor unit (10) so as to face the semiconductor unit (10).
Among the plurality of main electrode terminals (23) in the semiconductor module (2), any one of the positive terminal (24), the negative terminal (25), and the output terminal (26) is the other main electrode terminal (23). Rather, the power converter device (1) is provided with a projecting portion (241) projecting toward the base plate (42).   At least one plate-like rib (46, 461, 462, 463) stands on the surface (45) of the base plate (42) facing the semiconductor unit (10) toward the semiconductor unit (10). The power converter (1) according to claim 1, wherein the power converter (1) is provided.   When viewed from a direction orthogonal to the facing surface (45) of the base plate (42), the ribs (46, 461, 462, 463) surround the main electrode terminal (23) having the protruding portion (241). The power converter (1) according to claim 1 or 2, wherein the power converter (1) is formed in a circumferential shape.   The tip of the rib (46, 461, 462, 463) is arranged at a position closer to the semiconductor unit (10) than the tip of the protrusion (241) arranged on the base plate (42) side. The power converter device (1) according to claim 2 or 3, wherein the power converter device (1) is provided.   The said protrusion part (241) has the expansion | extension detection part (242) extended so that the said opposing surface (45) of the said baseplate (42) might be followed. The power converter device (1) as described in any one.   Below the base plate (42) in the case (4), an auxiliary power supply (51) and an auxiliary cooling device (52) for cooling the auxiliary power supply (51) are arranged. The auxiliary cooling device (52) includes an auxiliary refrigerant channel (53) for circulating the refrigerant, and at least a part of the ceiling surface (535) of the auxiliary refrigerant channel (53) is formed on the base plate (42). The power conversion device (1) according to any one of claims 1 to 5, wherein the power conversion device (1) is formed by the facing surface (45).

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