JP2014228664A5 - - Google Patents

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Publication number
JP2014228664A5
JP2014228664A5 JP2013107519A JP2013107519A JP2014228664A5 JP 2014228664 A5 JP2014228664 A5 JP 2014228664A5 JP 2013107519 A JP2013107519 A JP 2013107519A JP 2013107519 A JP2013107519 A JP 2013107519A JP 2014228664 A5 JP2014228664 A5 JP 2014228664A5
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JP
Japan
Prior art keywords
laminated structure
resin layer
wiring board
printed wiring
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013107519A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014228664A (ja
JP6050180B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013107519A external-priority patent/JP6050180B2/ja
Priority to JP2013107519A priority Critical patent/JP6050180B2/ja
Priority to PCT/JP2014/060986 priority patent/WO2014171525A1/ja
Priority to KR1020157028866A priority patent/KR102229343B1/ko
Priority to CN201480021937.5A priority patent/CN105164585B/zh
Priority to TW103114237A priority patent/TWI614571B/zh
Publication of JP2014228664A publication Critical patent/JP2014228664A/ja
Publication of JP2014228664A5 publication Critical patent/JP2014228664A5/ja
Publication of JP6050180B2 publication Critical patent/JP6050180B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013107519A 2013-04-18 2013-05-21 積層構造体およびフレキシブルプリント配線板 Active JP6050180B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013107519A JP6050180B2 (ja) 2013-05-21 2013-05-21 積層構造体およびフレキシブルプリント配線板
PCT/JP2014/060986 WO2014171525A1 (ja) 2013-04-18 2014-04-17 積層構造体、フレキシブルプリント配線板及びその製造方法
KR1020157028866A KR102229343B1 (ko) 2013-04-18 2014-04-17 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법
CN201480021937.5A CN105164585B (zh) 2013-04-18 2014-04-17 层叠结构体、柔性印刷电路板及其制造方法
TW103114237A TWI614571B (zh) 2013-04-18 2014-04-18 層合構造物、可撓性印刷配線板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013107519A JP6050180B2 (ja) 2013-05-21 2013-05-21 積層構造体およびフレキシブルプリント配線板

Publications (3)

Publication Number Publication Date
JP2014228664A JP2014228664A (ja) 2014-12-08
JP2014228664A5 true JP2014228664A5 (enrdf_load_stackoverflow) 2016-02-12
JP6050180B2 JP6050180B2 (ja) 2016-12-21

Family

ID=52128568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013107519A Active JP6050180B2 (ja) 2013-04-18 2013-05-21 積層構造体およびフレキシブルプリント配線板

Country Status (1)

Country Link
JP (1) JP6050180B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102021389B1 (ko) * 2016-10-13 2019-11-04 엘지전자 주식회사 공기 청정기
JP6387444B1 (ja) * 2017-07-10 2018-09-05 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005300857A (ja) * 2004-04-09 2005-10-27 Fuji Photo Film Co Ltd 感光性転写シート、感光性積層体、画像パターン形成方法、及び配線パターン形成方法
JP2009025699A (ja) * 2007-07-23 2009-02-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
JP5402332B2 (ja) * 2009-07-09 2014-01-29 東レ株式会社 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板
JP5740915B2 (ja) * 2010-10-28 2015-07-01 東レ株式会社 フィルム積層体

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