JP2014222698A - Electrode-embedded quartz member and method of manufacturing the same - Google Patents
Electrode-embedded quartz member and method of manufacturing the same Download PDFInfo
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
Description
本発明は、半導体プロセスにおいて用いられる静電チャックやヒータ等の電極埋め込み石英部材及びその製造方法に関する。 The present invention relates to an electrode-embedded quartz member such as an electrostatic chuck or a heater used in a semiconductor process and a method for manufacturing the same.
半導体処理装置では、ウェーハ等を保持・固定するための静電チャックや、熱処理に用いられるヒータ、あるいはまた、これらの両者の機能を兼ね備えた部材として、電極埋め込み部材が用いられている。特に、石英ガラス製の電極埋め込み部材は、石英ガラスが高純度であり、セラミックスよりも平坦性及び絶縁性に優れていることから、半導体プロセスに好適である。 In a semiconductor processing apparatus, an electrode embedding member is used as an electrostatic chuck for holding / fixing a wafer or the like, a heater used for heat treatment, or a member having both functions. In particular, an electrode embedding member made of quartz glass is suitable for a semiconductor process because quartz glass has a high purity and is superior in flatness and insulation to ceramics.
例えば、特許文献１には、ガラス板の内部に金属層の電極が埋設されたガラス製静電チャックが開示されている。特許文献１には、前記電極が、金属層の蒸着により、又は、金属箔や金属メッシュを用いて形成されることが記載されている。 For example, Patent Literature 1 discloses a glass electrostatic chuck in which a metal layer electrode is embedded in a glass plate. Patent Document 1 describes that the electrode is formed by vapor deposition of a metal layer or using a metal foil or a metal mesh.
また、特許文献２には、同一素材からなるガラス質絶縁層とガラス質基盤とが、間に電極を具備して、実質的に一体化されたガラス質静電チャックが開示されている。該静電チャックは、予め加工された溝の内面に製膜法により電極が配置されており、その製膜法としては、ドライプロセス、特に、イオンプレーティング、スパッタリング、ＣＶＤ、真空蒸着が好ましいとされている。
しかしながら、上記特許文献１，２に記載されているような蒸着等のドライプロセスによって形成された電極は、一般に、成膜速度は０．０００１〜０．１μｍ／ｍｉｎ．程度であり、厚さ１μｍ以上の電極を形成するには長時間を要するものであった。その一方で、成膜厚さが薄すぎると、静電チャックやヒータとして十分に機能するための電極が形成されない。また、厚さ１〜１００μｍの金属箔では、微細な電極パターンの作製は難しく、作製できた場合であっても、ガラス基板上に設置する際に形状が崩れて配線が折れたり、隣接する配線と接触して短絡したりする等、電極の形態を保持することが困難である。
However, an electrode formed by a dry process such as vapor deposition as described in
また、上記のような金属電極が形成されたガラス板の接合面は、他のガラス板と接合し、熱をかけて圧着されるが、このとき、両ガラス板に挟まれる電極が厚すぎると、ガラス板と金属電極の熱膨張差により、電極が破断したり、ガラス板の電極近傍にクラックが生じたりする場合があった。 In addition, the bonding surface of the glass plate on which the metal electrode as described above is bonded to another glass plate and is crimped by applying heat. At this time, if the electrodes sandwiched between the two glass plates are too thick Depending on the difference in thermal expansion between the glass plate and the metal electrode, the electrode may break or a crack may occur near the electrode of the glass plate.
ところで、近年、ウェーハの大口径化に対応して、静電チャックやヒータも大型化され、また、より高精度での加工を行うために、電極パターンが微細化されている。
このため、特許文献２に記載されているような電極を配置するための溝加工は、プロセスが煩雑となり、加工時間及び製造コストも増加することとなる。しかも、上述したような電極の破断や溝部分におけるガラス板のクラックもより生じやすくなる。
By the way, in recent years, electrostatic chucks and heaters have been increased in size in response to an increase in wafer diameter, and electrode patterns have been miniaturized in order to perform processing with higher accuracy.
For this reason, the groove processing for arranging the electrodes as described in
したがって、大型であっても、ガラス板内に、電極パターンを破断させることなく、容易に形成する方法が求められている。 Therefore, there is a demand for a method for easily forming an electrode pattern in a glass plate without breaking it, even if it is large.
本発明は、上記技術的課題を解決するためになされたものであり、静電チャックやヒータ等の半導体処理用部材であって、電極が破断することなく、長時間安定的に使用可能な電極埋め込み石英部材及びその製造方法を提供することを目的とするものである。 The present invention has been made to solve the above technical problem, and is a semiconductor processing member such as an electrostatic chuck or a heater, which can be used stably for a long time without breaking the electrode. An object of the present invention is to provide an embedded quartz member and a manufacturing method thereof.
本発明に係る電極埋め込み石英部材は、石英ガラス板の内部に、導電性材料からなる粉体が未焼結状態で密着した集合体からなる電極が埋設されていることを特徴とする。
このような電極を備えた石英部材は、電極の破断や石英ガラスのクラックの発生が抑制され、しかも、長時間安定的に使用することができる。
The electrode-embedded quartz member according to the present invention is characterized in that an electrode made of an aggregate in which a powder made of a conductive material is adhered in an unsintered state is embedded in a quartz glass plate.
A quartz member provided with such an electrode can be used stably for a long period of time, with the occurrence of electrode breakage and quartz glass cracking being suppressed.
前記電極の厚さは１〜１００μｍであることが好ましい。
上記範囲内の厚さであれば、石英ガラス板を熱圧着により支障なく一体化させることができ、静電チャックやヒータとしての十分な機能を得ることができる。
The thickness of the electrode is preferably 1 to 100 μm.
If it is the thickness within the said range, a quartz glass plate can be integrated without trouble by thermocompression bonding, and sufficient function as an electrostatic chuck or a heater can be obtained.
また、本発明によれば、上記のような電極埋め込み石英部材を製造する方法であって、第１の石英ガラス板の一主面上に、スクリーン印刷により電極パターンを形成した後、前記第１の石英ガラス板の電極形成面と前記第２の石英ガラス板を接合して、前記電極を構成する導電性材料の融点よりも低い温度で熱圧着することを特徴とする電極埋め込み石英部材の製造方法が提供される。
このような製造方法は、本発明に係る電極埋め込み石英部材を得る上で好適な方法である。
According to the present invention, there is also provided a method of manufacturing the electrode-embedded quartz member as described above, wherein an electrode pattern is formed on one main surface of the first quartz glass plate by screen printing, and then the first An electrode-embedded quartz member produced by bonding an electrode-forming surface of a quartz glass plate to the second quartz glass plate and thermocompression bonding at a temperature lower than the melting point of the conductive material constituting the electrode A method is provided.
Such a manufacturing method is a preferable method for obtaining the electrode-embedded quartz member according to the present invention.
本発明に係る電極埋め込み石英部材は、製造プロセスにおいて、電極が破断したり、石英ガラスにクラックが生じたりすることがなく、また、長時間の使用においても、電極の断線や該部材の破損等を生じにくく、安定的に使用することができる。しかも、電極パターンの大型化及び微細化にも対応可能である。
また、本願発明に係る製造方法によれば、上記のような電極埋め込み石英部材を好適に得ることができる。
The electrode-embedded quartz member according to the present invention does not break the electrode or cause cracks in the quartz glass in the manufacturing process, and the electrode breaks or the member is damaged even when used for a long time. Can be used stably. Moreover, it is possible to cope with an increase in size and miniaturization of the electrode pattern.
Moreover, according to the manufacturing method which concerns on this invention, the above electrode embedding quartz members can be obtained suitably.
以下、本発明を、図面を参照して、より詳細に説明する。
図１に、本発明に係る電極埋め込み石英部材の概略構成を示す。図１に示したように、本発明に係る電極埋め込み石英部材は、石英ガラス板１，２の内部に電極３が埋設されているものである。該電極３は、導電性材料からなる粉体が未焼結状態で密着した集合体からなるものである。なお、図１でいう第２の石英ガラス板２には、給電端子用穴４が形成されている。
ここで、石英ガラス板１，２は、区分されて記載されているが、実際には、上面側の第１の石英ガラス板１と下面側の第２の石英ガラス板２は、熱圧着により一体化されており、１枚の板状をなしている。
Hereinafter, the present invention will be described in more detail with reference to the drawings.
FIG. 1 shows a schematic configuration of an electrode-embedded quartz member according to the present invention. As shown in FIG. 1, the electrode-embedded quartz member according to the present invention is one in which an
Here, the
上記のように、本発明に係る電極埋め込み石英部材においては、電極３は、導電性材料が、未焼結状態の導電性材料からなる粉体が密着した状態の集合体として形成されている。
電極をこのような構成とすることにより、電極を構成する導電性材料と石英ガラスとの熱膨張差が大きくても、石英ガラス板の熱圧着後の冷却の際に、電極が破断したり、石英ガラス板にクラックが生じたりすることを防ぐことができる。
As described above, in the electrode-embedded quartz member according to the present invention, the
By making the electrode in such a configuration, even when the difference in thermal expansion between the conductive material constituting the electrode and quartz glass is large, the electrode breaks during cooling after thermocompression bonding of the quartz glass plate, It is possible to prevent the quartz glass plate from being cracked.
電極は、静電チャックの場合は、載置されたウェーハ等を吸着するための静電力を発生させるものであり、また、ヒータの場合は、載置されたウェーハ等を加熱するための発熱体として機能する。必要に応じて、これらの両機能を具備するようにしてもよい。 In the case of an electrostatic chuck, the electrode generates an electrostatic force for adsorbing the mounted wafer or the like. In the case of a heater, the electrode is a heating element for heating the mounted wafer or the like. Function as. You may make it comprise both of these functions as needed.
前記電極の厚さは１〜１００μｍであることが好ましい。
前記厚さが１μｍ未満では、静電チャックやヒータとしての機能が十分に得られない。一方、１００μｍを超える場合は、石英ガラス板を熱圧着により一体化させることが困難となる。
The thickness of the electrode is preferably 1 to 100 μm.
When the thickness is less than 1 μm, a function as an electrostatic chuck or a heater cannot be obtained sufficiently. On the other hand, when it exceeds 100 μm, it becomes difficult to integrate the quartz glass plate by thermocompression bonding.
上記のような電極埋め込み石英部材は、図１によれば、第１の石英ガラス板１の一主面上に、スクリーン印刷により電極パターンを形成した後、第１の石英ガラス板１の電極形成面と第２の石英ガラス板２を接合して、電極３を構成する金属の融点よりも低い温度で熱圧着することにより製造することができる。
なお、第１の石英ガラス板１と第２の石英ガラス板２は相互に入れ替わっていてもよく、すなわち、電極３は、図１でいう下面側の第２の石英ガラス板２に形成してもよい。
２枚の石英ガラス板の間に電極を挟み込むようにして、上記のような熱圧着温度で一体化させることにより、前記電極を構成する導電性材料は未焼結状態で密着した粉末の集合体の状態で維持され、電極が破断したり、石英ガラスにクラックが生じたりすることを防ぐことができる。
According to FIG. 1, the electrode-embedded quartz member as described above is formed by forming an electrode pattern on one main surface of the first quartz glass plate 1 by screen printing, and then forming an electrode on the first quartz glass plate 1. It can be manufactured by bonding the surface and the second
The first quartz glass plate 1 and the second
The electrode is sandwiched between two quartz glass plates and integrated at the above-described thermocompression bonding temperature, so that the conductive material constituting the electrode is in an aggregated state of a powder that adheres in an unsintered state. It is possible to prevent the electrode from being broken and the quartz glass from being cracked.
ここで、前記電極に用いられる導電性材料は、導電性が高く、抵抗率を制御しやすい金属が好適である。特に、熱圧着温度が通常１２００〜１３００℃程度であることを考慮して、融点が１２５０℃以上の金属粉体であることが好ましい。石英ガラス板を熱圧着する際に、粉体が、融解せず、未焼結の状態が維持されるようにするため、このような高融点金属を用いることが好ましい。 Here, the conductive material used for the electrode is preferably a metal having high conductivity and easy to control resistivity. In particular, considering that the thermocompression bonding temperature is usually about 1200 to 1300 ° C., a metal powder having a melting point of 1250 ° C. or higher is preferable. When the quartz glass plate is thermocompression bonded, it is preferable to use such a refractory metal so that the powder does not melt and maintains an unsintered state.
前記金属としては、具体的には、マンガン、ベリリウム、スカンジウム、ケイ素、ニッケル、イットリウム、コバルト、鉄、パラジウム、バナジウム、チタン、白金、トリウム、クロム、ロジウム、ジルコニウム、ルテニウム、イリジウム、ニオビウム、モリブデン、オスミウム、タンタル、タングステン、ハフニウム、又は、これらの合金が挙げられる。これらのうち、石英ガラス部材の用途に応じて、比抵抗や熱伝導率等を考慮して、適宜選択して用いられる。 Specific examples of the metal include manganese, beryllium, scandium, silicon, nickel, yttrium, cobalt, iron, palladium, vanadium, titanium, platinum, thorium, chromium, rhodium, zirconium, ruthenium, iridium, niobium, molybdenum, Examples thereof include osmium, tantalum, tungsten, hafnium, or alloys thereof. Of these, the quartz glass member is appropriately selected and used in consideration of specific resistance, thermal conductivity, and the like, depending on the use of the quartz glass member.
金属以外の導電性材料としては、窒化物や炭化物のうち、導電性を示す炭化珪素（ＳｉＣ）、炭化チタン（ＴｉＣ）、窒化チタン（ＴｉＮ）等のセラミックス材料も適用することができる。この場合も、石英ガラス板を熱圧着する際に、該セラミックス粉体同士が未焼結状態を維持するように、製造条件は適宜調整される。
なお、前記電極３は、単一層構造であっても、あるいはまた、上記金属やセラミックス等の導電性材料のうちの２種以上による多層構造であってもよい。
As the conductive material other than metal, ceramic materials such as silicon carbide (SiC), titanium carbide (TiC), and titanium nitride (TiN) exhibiting conductivity can be used among nitrides and carbides. Also in this case, when the quartz glass plate is subjected to thermocompression bonding, the manufacturing conditions are appropriately adjusted so that the ceramic powders are maintained in an unsintered state.
The
前記電極パターンは、任意であり、用途に応じて適宜定められ、例えば、静電チャックの吸着用電極の場合、双極タイプであっても単極タイプであってもよい。その形成方法としては、電極材料となる金属粉体を各種溶媒に分散させた分散液やペーストとして、石英ガラス板の電極形成面にスクリーン印刷する方法が用いられる。
スクリーン印刷によれば、電極パターンが大型又は微細な場合であっても、金属粉体が均等な密度である電極パターンを容易かつ効率的に形成することができる。
The electrode pattern is arbitrary and appropriately determined according to the application. For example, in the case of an electrostatic chuck attracting electrode, the electrode pattern may be a bipolar type or a monopolar type. As the forming method, a method of screen printing on the electrode forming surface of a quartz glass plate as a dispersion or paste in which metal powder as an electrode material is dispersed in various solvents is used.
According to screen printing, even when the electrode pattern is large or fine, it is possible to easily and efficiently form an electrode pattern in which the metal powder has a uniform density.
上記のようにして、電極パターンをスクリーン印刷した後、該電極形成面を他方の石英ガラス板と接合して、２枚の石英ガラス板を熱圧着する。
このように、石英ガラス板の接合は、接着剤等の他の材料を用いることなく、熱圧着によって容易に一体化することができる。
After the electrode pattern is screen-printed as described above, the electrode forming surface is joined to the other quartz glass plate, and two quartz glass plates are thermocompression bonded.
As described above, the quartz glass plates can be easily joined by thermocompression bonding without using other materials such as an adhesive.
熱圧着時の加熱により、スクリーン印刷のために用いられた溶媒成分は、揮発又は酸化して消失するが、このとき、電極を構成する導電性材料からなる粉体同士が焼結しないようにする必要がある。このため、熱圧着時には、石英ガラス板が圧着により一体化されるように加熱する必要があり、通常、３〜６ＭＰａの加圧下で１２００〜１３００℃程度とされるが、熱圧着温度は、電極を構成する導電性材料の融点よりも低い温度とする。 The solvent component used for screen printing disappears by volatilization or oxidation due to heating during thermocompression bonding, but at this time, it is necessary to prevent the powders made of conductive materials constituting the electrodes from being sintered to each other. There is a need. For this reason, at the time of thermocompression bonding, it is necessary to heat so that the quartz glass plate is integrated by pressure bonding, and it is usually about 1200 to 1300 ° C. under a pressure of 3 to 6 MPa. The temperature is lower than the melting point of the conductive material constituting the.
本発明に係る電極埋め込み石英部材は、熱圧着により一体化された石英ガラス板の内部に導電性材料からなる粉体が埋設されているため、第１の石英ガラス板の厚さは、セラミックス板の場合より薄くても、電極に対する十分な絶縁性及び平坦性を確保することができ、所望の強度及び静電チャックやヒータとしての機能を考慮して、適宜定めることができる。第２の石英ガラス板の厚さについても同様である。 In the electrode-embedded quartz member according to the present invention, since the powder made of a conductive material is embedded in the quartz glass plate integrated by thermocompression bonding, the thickness of the first quartz glass plate is the ceramic plate. Even if it is thinner than this case, sufficient insulation and flatness with respect to the electrode can be ensured, and it can be appropriately determined in consideration of desired strength and functions as an electrostatic chuck or heater. The same applies to the thickness of the second quartz glass plate.
なお、第２の石英ガラス板２には、図１に示したような電極３に通じる給電端子用穴４を、第２の石英ガラス板２と第１の石英ガラス板１とを接合させる前に、予め形成しておくことが好ましい。
これにより、接合後、前記給電端子用穴４内で、導電ペースト等を用いて、電極３に給電端子及び導線を固定することができる。
The second
Thereby, after joining, the power supply terminal and the conductive wire can be fixed to the
本発明において用いられる石英ガラス板は、気泡や不純物の混入が少なく、比較的均質であることから、ＶＡＤ（Vaper-phase Axial Deposition）法や直接法により製造された石英ガラスが好ましい。
このような石英ガラスを用いれば、より高電圧を印加しても絶縁破壊しにくく、長期間安定して使用することができる部材を構成することができる。
なお、熱膨張係数の低い石英ガラスが求められる場合には、チタニアがドープされたもの等を用いることができる。
The quartz glass plate used in the present invention is preferably a quartz glass produced by a VAD (Vaper-phase Axial Deposition) method or a direct method because it contains few bubbles and impurities and is relatively homogeneous.
By using such quartz glass, it is possible to constitute a member that is difficult to break down even when a higher voltage is applied and can be used stably for a long period of time.
In addition, when quartz glass with a low thermal expansion coefficient is calculated | required, what doped titania etc. can be used.
以下、本発明を実施例に基づきさらに具体的に説明するが、本発明は下記実施例により制限されるものではない。
［実施例１］
直径３００ｍｍ、厚さ５ｍｍの第１の石英ガラス板に、タングステンペースト（７８重量％）を用いて電極パターンをスクリーン印刷した。該電極は、厚さ１０μｍ、ライン２ｍｍ、間隔０．５ｍｍのくし型状の双極型電極とした。
この面に、直径３００ｍｍ、厚さ２０ｍｍの第２の石英ガラス板を接合し、１２７５℃、プレス圧６ＭＰａで６０分間保持し、熱圧着した。
両石英ガラス板は完全に一体化した状態で圧着され、電極を構成するタングステンは、未焼結状態で密着した粉体の集合体となっていることが顕微鏡観察により確認された。
また、電圧１．５ｋＶを印加しても、ガラスにクラックも生じず、電極に断線も見られなかった。
EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not restrict | limited by the following Example.
[Example 1]
An electrode pattern was screen-printed on a first quartz glass plate having a diameter of 300 mm and a thickness of 5 mm using tungsten paste (78% by weight). The electrode was a comb-shaped bipolar electrode having a thickness of 10 μm, a line of 2 mm, and an interval of 0.5 mm.
A second quartz glass plate having a diameter of 300 mm and a thickness of 20 mm was joined to this surface, held at 1275 ° C. and a press pressure of 6 MPa for 60 minutes, and thermocompression bonded.
It was confirmed by microscopic observation that the two quartz glass plates were pressure-bonded in a completely integrated state, and that the tungsten constituting the electrode was an aggregate of powders in close contact in an unsintered state.
Moreover, even when a voltage of 1.5 kV was applied, no crack was generated in the glass, and no disconnection was observed in the electrodes.
［比較例１］
直径３００ｍｍ、厚さ５ｍｍの第１の石英ガラス板に、タングステンを厚さ１０μｍで蒸着し、実施例１と同様の電極パターンを形成した。
この面に、直径３００ｍｍ、厚さ２０ｍｍの第２の石英ガラス板を接合し、１２１５℃、プレス圧６ＭＰａで６０分間保持し、熱圧着した。
電圧１．５ｋＶを印加したところ、電極パターンにおいて断線が生じた。
[Comparative Example 1]
Tungsten was vapor-deposited with a thickness of 10 μm on a first quartz glass plate having a diameter of 300 mm and a thickness of 5 mm to form an electrode pattern similar to that in Example 1.
A second quartz glass plate having a diameter of 300 mm and a thickness of 20 mm was joined to this surface, held at 1215 ° C. and a press pressure of 6 MPa for 60 minutes, and thermocompression bonded.
When a voltage of 1.5 kV was applied, disconnection occurred in the electrode pattern.
１ 第１の石英ガラス板
２ 第２の石英ガラス板
３ 電極
４ 給電端子用穴
DESCRIPTION OF SYMBOLS 1 1st
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| CN113039863A (en) * | 2019-09-18 | 2021-06-25 | 日本碍子株式会社 | Electrostatic chuck heater |
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