JP2014220222A - 接地モジュール - Google Patents
接地モジュール Download PDFInfo
- Publication number
- JP2014220222A JP2014220222A JP2013133500A JP2013133500A JP2014220222A JP 2014220222 A JP2014220222 A JP 2014220222A JP 2013133500 A JP2013133500 A JP 2013133500A JP 2013133500 A JP2013133500 A JP 2013133500A JP 2014220222 A JP2014220222 A JP 2014220222A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- conductive
- core rod
- grounding
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 28
- 239000010439 graphite Substances 0.000 claims description 16
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 5
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 239000011294 coal tar pitch Substances 0.000 claims description 4
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- 239000010433 feldspar Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000440 bentonite Substances 0.000 claims description 2
- 229910000278 bentonite Inorganic materials 0.000 claims description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 235000010288 sodium nitrite Nutrition 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 2
- 239000010410 layer Substances 0.000 description 44
- 230000003014 reinforcing effect Effects 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 238000011109 contamination Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000003673 groundwater Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 7
- 239000005751 Copper oxide Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 229910000431 copper oxide Inorganic materials 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 4
- 239000000920 calcium hydroxide Substances 0.000 description 4
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- 229940116318 copper carbonate Drugs 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Curing Cements, Concrete, And Artificial Stone (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
Description
12:抵抗体
12A、12B:抵抗体層
14:伝導性板
20:伝導性芯棒
30A、30B:上部及び下部補強板
40A、40B:上部及び下部接続部材
Claims (8)
- 長手方向に沿って延びた接地体と、
前記接地体の横断面中心部に配設された伝導性芯棒と、
を備え、
前記接地体は、前記長手方向に延びた抵抗体及び前記伝導性芯棒に沿って所定の間隔を隔てて隔設されるように抵抗体に挿入された多数枚の伝導性板を備えることを特徴とする接地モジュール。 - 前記伝導性芯棒及び前記伝導性板は、腐食しない導電性物質から製作されることを特徴とする請求項1に記載の接地モジュール。
- 前記伝導性芯棒及び前記伝導性板は、ステンレス鋼から製作されることを特徴とする請求項2に記載の接地モジュール。
- 前記接地モジュールは、
前記伝導性芯棒(20)に所定の間隔を隔てて前記伝導性板(14)を嵌め込んで前記伝導性芯棒(20)と前記伝導性板(14)との組立体を得、
前記伝導性芯棒(20)と前記伝導性板(14)との前記組立体を金型に設け、
スラリー状態の抵抗物質を前記金型に注入して押し付けることによって形成されることを特徴とする請求項1に記載の接地モジュール。 - 前記抵抗体は、多数の抵抗体層を備え、
前記多数枚の伝導性板は、前記抵抗体層の間に介装されることを特徴とする請求項1に記載の接地モジュール。 - 前記抵抗体は、約55〜77重量%の黒鉛と、約20〜30重量%のセメントと、約6〜15重量%の長石と、約2〜4重量%の硫酸マグネシウム及び約1〜3重量%の添加剤を混合して得、合計100重量%からなることを特徴とする請求項1に記載の接地モジュール。
- 前記抵抗体は、黒鉛70〜85重量%と、コールタールピッチ15〜30重量%及び塩化銅0.5〜0.7重量%を混合して得、合計100重量%からなることを特徴とする請求項1に記載の接地モジュール。
- 前記抵抗体は、黒鉛50〜55%と、ベントナイト8〜12%と、セメント30〜40%と、硫酸マグネシウム(MgSO4)0.8%と、亜硝酸ナトリウム(NaNO2)0.3%と、酸化ケイ素(SiO2)0.25%と、酸化アルミニウム(Al2O3)0.25%と、酸化カルシウム(CaO)0.2%及び酸化マグネシウム(MgO)0.2%からなり、黒鉛は、炭素含量の低い鱗状黒鉛または土状黒鉛であることを特徴とする請求項1に記載の接地モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130050174A KR101321821B1 (ko) | 2013-05-03 | 2013-05-03 | 접지 모듈 |
KR10-2013-0050174 | 2013-05-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014220222A true JP2014220222A (ja) | 2014-11-20 |
JP5648092B2 JP5648092B2 (ja) | 2015-01-07 |
Family
ID=49639224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013133500A Active JP5648092B2 (ja) | 2013-05-03 | 2013-06-26 | 接地モジュール |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5648092B2 (ja) |
KR (1) | KR101321821B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117771A1 (ko) * | 2015-01-23 | 2016-07-28 | 정용기 | 흑연, 진주석 및 질석의 혼합 접지모듈 |
WO2016117770A1 (ko) * | 2015-01-23 | 2016-07-28 | 정용기 | 흑연, 진주석 및 질석의 혼합 접지모듈 |
CN112079637A (zh) * | 2020-09-10 | 2020-12-15 | 大连法伏安电器有限公司 | 一种复合接地模块及其制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104356571B (zh) * | 2014-10-29 | 2016-06-08 | 广东电网有限责任公司佛山供电局 | 接地模块用石墨碳纤维复合导电填料及其制备方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005240A (ja) * | 2003-06-11 | 2005-01-06 | Sankosha Corp | 接地体 |
JP2010092840A (ja) * | 2008-09-12 | 2010-04-22 | Chugoku Electric Power Co Inc:The | 接地電極 |
JP2012243768A (ja) * | 2011-05-19 | 2012-12-10 | Omni Lps Co Ltd | 接地モジュール及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958072B1 (ko) | 2010-02-02 | 2010-05-13 | 김경연 | 역서지 방지 연결형 접지봉 |
KR101089496B1 (ko) | 2010-07-20 | 2011-12-02 | (주)에이엠에스 엔지니어링 | 전도성이 우수한 고효율 접지봉 |
-
2013
- 2013-05-03 KR KR1020130050174A patent/KR101321821B1/ko active IP Right Grant
- 2013-06-26 JP JP2013133500A patent/JP5648092B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005240A (ja) * | 2003-06-11 | 2005-01-06 | Sankosha Corp | 接地体 |
JP2010092840A (ja) * | 2008-09-12 | 2010-04-22 | Chugoku Electric Power Co Inc:The | 接地電極 |
JP2012243768A (ja) * | 2011-05-19 | 2012-12-10 | Omni Lps Co Ltd | 接地モジュール及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117771A1 (ko) * | 2015-01-23 | 2016-07-28 | 정용기 | 흑연, 진주석 및 질석의 혼합 접지모듈 |
WO2016117770A1 (ko) * | 2015-01-23 | 2016-07-28 | 정용기 | 흑연, 진주석 및 질석의 혼합 접지모듈 |
CN107210547A (zh) * | 2015-01-23 | 2017-09-26 | 郑龙基 | 由石墨、珍珠岩和蛭石的组合制造的接地模块 |
CN107210546A (zh) * | 2015-01-23 | 2017-09-26 | 郑龙基 | 由石墨、珍珠岩和蛭石的组合制造的接地模块 |
CN112079637A (zh) * | 2020-09-10 | 2020-12-15 | 大连法伏安电器有限公司 | 一种复合接地模块及其制备方法 |
CN112079637B (zh) * | 2020-09-10 | 2022-06-07 | 大连法伏安电器有限公司 | 一种复合接地模块及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101321821B1 (ko) | 2013-10-23 |
JP5648092B2 (ja) | 2015-01-07 |
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