JP2014210041A - Imaging device and electronic endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic endoscope for making it possible to make an insertion part have a small diameter, by implementing a downsized imaging device capable of obtaining a stable image by reducing noise generated in an image signal with a simple configuration to downsize a tip part of the insertion part.SOLUTION: An imaging device 40 comprises: a solid state imaging element 44 comprising a light receiving element unit 44a for detecting an analyte image; circuit substrate units 45, 46 in which electronic components 47, 48 configuring a drive circuit of the solid state imaging element 44 are mounted, and between which level difference is provided; and a plurality of cables 51, 52, 53, 54, and 55 connected to cable connection lands provided on the circuit substrate units 45, 46, where an image cable 51 for transmitting an image signal and synchronization signal cable 53 for transmitting a synchronization signal of the plurality of cables 51, 52, 53, 54, and 55 are respectively connected to different surfaces of the circuit substrate units 45, 46 which are separated by the level difference.

Description

  The present invention relates to an imaging device and an electronic endoscope provided with the imaging device.

  As is well known, endoscopes are widely used for medical observation and treatment in the body of a living body (inside a body cavity) or for inspection and repair in industrial plant equipment. In particular, medical endoscopes can observe a region to be examined in a body cavity by inserting an elongated insertion portion into the body cavity without requiring an incision. Since it can be treated, it has become widely used.

  An example of such an endoscope is an electronic endoscope in which an imaging device is disposed at a distal end portion of an insertion portion as disclosed in Patent Document 1. In this conventional electronic endoscope imaging apparatus, cables connected to a circuit board are soldered to cable connection lands formed on the same surface of the circuit board close to each other.

JP 2005-304876 A

  However, when the image signal cable and the synchronization signal cable are arranged adjacent to each other on the circuit board as in the electronic endoscope of Patent Document 1, the electromagnetic wave generated from the synchronization signal cable is converted into an image signal transmitted by the image signal cable. There is a risk of noise due to interference. When noise occurs in the image signal, there is a problem that the endoscope image displayed on the monitor is disturbed and becomes unstable.

  In addition, as disclosed in Patent Document 1, a relay member is provided on the cable land of the circuit board so that a difference in height is provided in the connection portion of various signal cables, or cable connection lands are provided on the front and back surfaces of the board. Although it is possible to increase the distance between the cables by providing them, the process of attaching the relay member increases and the trouble of soldering on the front and back surfaces of the substrate remains as a problem.

  Furthermore, by providing the relay member on the circuit board, the circuit board becomes large, and there is a limit to downsizing of the imaging device. For this reason, there is a limit to miniaturization of the distal end portion of the insertion portion of the electronic endoscope in which the imaging device is built in, and there has been a problem that the diameter reduction of the insertion portion of the electronic endoscope is hindered.

  Therefore, the present invention has been made in view of the above circumstances, and an object of the present invention is a compact imaging device that can obtain a stable image by reducing noise generated in an image signal with a simple configuration, and is inserted. An object of the present invention is to provide an electronic endoscope capable of reducing the diameter of the insertion portion by allowing the tip portion of the portion to be miniaturized.

  An imaging apparatus according to an aspect of the present invention is a circuit board on which a solid-state imaging device including a light-receiving element portion that detects a subject image and an electronic component that constitutes a driving circuit of the solid-state imaging device are mounted and provided with a step. And a plurality of cables connected to cable connection lands provided on the circuit board unit, and among the plurality of cables, an image cable that transmits an image signal and a synchronization signal cable that transmits a synchronization signal are And connected to different surfaces of the circuit board portion separated by the step.

  An endoscope according to an aspect of the present invention is a circuit in which a solid-state imaging device including a light-receiving element portion that detects a subject image and an electronic component that configures a driving circuit of the solid-state imaging device are mounted, and a step is provided. A board part and a plurality of cables connected to a cable connection land provided on the circuit board part, and among the plurality of cables, an image cable for transmitting an image signal and a synchronization signal cable for transmitting a synchronization signal The image pickup device connected to different surfaces of the circuit board portion separated by the step is provided at the distal end portion of the insertion portion.

  According to the present invention, it is possible to reduce the noise generated in the image signal with a simple configuration and obtain a stable image, and to reduce the diameter of the insertion portion by reducing the size of the distal end of the insertion portion. An electronic endoscope can be provided.

The perspective view which shows the external appearance of the endoscope apparatus which comprises the endoscope of this Embodiment Sectional drawing showing the internal configuration of the tip Same as above, top view of imaging device Sectional drawing which shows the structure of the imaging device along the IV-IV line of FIG. The top view showing the configuration of the imaging apparatus The same top view which looked at the imaging device of a modification from back The side view which shows the structure of the imaging device of a modification same as the above

  Hereinafter, with reference to the drawings, an endoscope provided with the endoscope tip structure of the present embodiment will be described. FIG. 1 is a perspective view illustrating an external appearance of an endoscope apparatus including an endoscope according to the present embodiment, FIG. 2 is a cross-sectional view illustrating an internal configuration of a distal end portion, and FIG. 3 is a plan view of the imaging apparatus viewed from the rear. 4 is a cross-sectional view illustrating the configuration of the imaging device along the line IV-IV in FIG. 3, FIG. 5 is a top view illustrating the configuration of the imaging device, and FIG. 6 is a plan view of the imaging device according to the modification viewed from the rear. 7 and 7 are side views showing the configuration of an imaging apparatus according to a modification.

  In the following description, the drawings based on the embodiments are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like are different from the actual ones. There should be a case where parts having different dimensional relationships and ratios are included in the drawings.

  As shown in FIG. 1, an endoscope apparatus 1 is mainly composed of an electronic endoscope (hereinafter simply referred to as an endoscope) 2 and a peripheral device 3. The endoscope 2 is mainly composed of an insertion portion 4 to be inserted into a subject, an operation portion 5 connected to the proximal end side of the insertion portion 4, a universal cord 6, and an endoscope connector 7. It is configured.

  In the peripheral device 3, a light source device 9, a video processor 10, a connection cable 11, a keyboard 12, a monitor 13, and the like are placed on a gantry 8 to constitute a system. Further, the endoscope 2 and the peripheral device 3 having such a configuration are connected to each other by an endoscope connector 7.

  The operation section 5 of the endoscope 2 includes a bending operation knob 14, buttons 15 and 16 for operating the endoscope function, a treatment instrument insertion port 17, and a rotatable fixing lever 18 that is an operation member. And are provided. The bending operation knob 14 includes an up / down bending operation knob 21 and a left / right bending operation knob 22.

  The insertion portion 4 of the endoscope 2 includes, in order from the distal end side, a distal end portion 31, a bending portion 32 that can be bent in a plurality of directions as an operation portion connected to the proximal end side of the distal end portion 31, and the bending portion. And a flexible tube portion 33 that is connected to the base end side of the portion 32.

  The bending portion 32 is operated by a rotational operation input by two up / down bending operation knobs 21 and a left / right bending operation knob 22 of the bending operation knobs 14 provided in the operation unit 5. In other words, the bending portion 32 is bent by the operation of the bending operation knob 14, and can be bent in, for example, four directions, up, down, left, and right as the bending operation wire (not shown) inserted into the insertion portion 4 is pulled or loosened. It has become.

  An endoscope connector 7 provided at the distal end of the universal cord 6 of the endoscope 2 is connected to the light source device 9 of the peripheral device 3. The endoscope connector 7 is provided with various bases (not shown) and various electrical contacts, and is electrically connected to the video processor 10 via a connection cable 11.

  The endoscope 2 is provided with a light guide bundle (not shown) that transmits illumination light from the light source device 9, and an illumination lens (not shown) is arranged at the emission light emitting end of the light guide bundle. Yes. This illumination lens is provided at the distal end portion 31 of the insertion portion 4, and the illumination light is irradiated toward the subject.

  Note that the configuration of the endoscope apparatus 1 described above is merely an example, and is not limited to the configuration described above.

Next, the configuration of the distal end portion 31 of the endoscope 2 according to the present embodiment and the configuration of the imaging device disposed in the distal end portion 31 will be described in detail below.
As shown in FIG. 2, an imaging device 40 is provided in the distal end portion 31 of the insertion portion 4 of the endoscope 2, and a substantially columnar distal portion main body 41 that fits and holds the imaging device 40 is provided. Yes. A rigid tube 42 that forms an internal space for accommodating the imaging device is fitted to the distal end portion 31 at the proximal end outer peripheral portion of the distal end portion main body 41.

  The imaging device 40 mainly includes a lens unit 43, a solid-state imaging device 44, an FPC (flexible printed circuit board) 45, and a rigid board 46 as a circuit board. A plurality of various cables 51, 52, 53, a power cable 54, or a ground (GND) cable 55 are connected to the rigid board 46 and the FPC 45 (see FIG. 3).

  The lens unit 43 includes a lens holder 43b that holds a plurality of objective lenses 43a, which is an objective optical system, and the lens holder 43b is inserted into and fixed to the tip body 41. Thereby, the lens unit 43 is fixed to the tip body 41.

  The solid-state imaging device 44 is a CCD, CMOS, or the like, and receives light as a pixel unit that detects an object image (shooting light indicated by the shooting optical axis O in the drawing) focused by a plurality of objective lenses of the lens unit 43. An element portion 44a is provided. And the solid-state image sensor 44 has the glass lid 49 stuck so that the light receiving element part 44a may be covered.

  The front surface of the glass lid 49 is fixed to the objective lens 43 a at the most proximal end of the lens unit 43. That is, the lens unit 43 and the solid-state imaging device 44 are fixed via the glass lid 49.

  The solid-state imaging device 44 is sealed with an electrode (not shown) on the lower surface of the solid-state imaging device 44 by electrically connecting a flying lead (not shown) of the FPC 45 and a sealing resin 45a. The sealing resin 45a covers and seals the flying lead bent at approximately 90 ° at the tip of the FPC 45.

  The FPC 45 extends rearward from the solid-state image sensor 44. A rigid board 46 is electrically and mechanically connected to the upper surface of the front side of the FPC 45.

  These FPC 45 and rigid board 46 constitute a circuit board portion 50 of the imaging device 40. The FPC 45 has a length that extends further to the rear than the base end of the rigid substrate 46.

  That is, the length in the longitudinal direction of the base material portion formed of the base film, conductor, coverlay, etc. of the FPC 45 is longer than the length in the longitudinal direction of the rigid substrate 46. The longitudinal direction of the FPC 45 here is a direction along the photographing optical axis O.

  A plurality of cable connection lands (not shown) are formed on the surface of the base portion of the FPC 45 extended rearward, and the synchronization signal cable 53, the power cable 54, or the GND cable are formed on the plurality of cable connection lands. 55 is connected.

  That is, the FPC 45 is provided with a plurality of cable connection lands (not shown) on a base material portion exposed rearward from the rigid board 46 in a state where the rigid boards 46 are laminated. The cable 54 and the GND cable 55 are soldered.

  The rigid substrate 46 is a substrate formed from a glass epoxy substrate, a ceramic substrate, or the like. On the upper surface of the rigid substrate 46, a plurality of, here two, electronic components 47 and 48 constituting a circuit for driving the solid-state imaging device are mounted.

  A plurality of cable connection lands (not shown) are formed on the rear surface of the rigid board 46, and the image cable 51 and other control cables 52 are soldered to the plurality of cable connection lands (not shown). Attached and connected.

  The rigid board 46 may have a small configuration in which the board area is reduced by using a component built-in board in which electronic components are built.

  As described above, in the imaging device 40 according to the present embodiment, a step having a height difference is formed between the upper substrate surface of the FPC 45 constituting the circuit board unit 50 and the upper substrate surface of the rigid substrate 46. Yes.

  A synchronization signal cable 53, a power cable 54, and a GND cable 55 are connected to the substrate surface of the FPC 45, and an image cable 51 and other control cables 52 are connected to the substrate surface of the rigid substrate 46. .

  The image cable 51, the other control cable 52, the synchronization signal cable 53, the power cable 54, and the GND cable 55 are bundled from the proximal end portion of the distal end portion 31 and covered with an outer sheath to be inserted as an unillustrated electric cable bundle. The part 4 is inserted and arranged. This electric cable bundle extends to the endoscope connector 7 via the operation unit 5 and the universal cord 6 shown in FIG.

  The imaging device 40 may be provided with a heat-shrinkable tube so as to cover from the proximal end portion of the lens unit 43 to be connected to the distal end portion of the electric cable bundle. The heat shrinkable tube may be filled with a sealing resin that fills a gap between components. Further, a sealing resin may be filled between the heat-shrinkable tube and the hard tube 42 so as to fill the internal space of the distal end portion 31.

  The light guide bundle (not shown) has a configuration in which a plurality of optical fibers that transmit illumination light from the light source device 9 to the distal end portion are bundled, and the insertion portion 4 is covered with the outer skin. The bending portion 32 and the flexible tube portion 33 are inserted and arranged, and extend to the endoscope connector 7 via the operation portion 5 and the universal cord 6 shown in FIG.

Next, the connection configuration of the image cable 51, the other control cable 52, the synchronization signal cable 53, the power cable 54, and the GND cable 55 in the imaging device 40 of the present embodiment to the rigid board 46 will be described in detail below.
As shown in FIG. 3, the image cable 51 including the pair of image signal cables 51a and 51b and the other control cable 52 including the pair of control signal cables 52a and 52b are arranged in parallel in the width direction of the rigid board 46. The cable core wires 61 and 62 from which the outer skins are peeled off are connected to a plurality of cable connection lands (not shown) provided on the surface of the rigid board 46 by soldering.

  Specifically, when the imaging device 40 is viewed from behind, as shown in FIG. 3, the paired image signal cables 51a and 51b are on the right side, and the paired control signal cables 52a and 52b are on the left side. Are connected so as to be juxtaposed on the surface of the rigid board 46 on the upper side of the circuit board 50.

  The synchronization signal cable 53, the power supply cable 54 and the GND cable 55 are arranged in parallel in the width direction of the FPC 45, and the cable core wires 63, 64, 65 from which the outer skins are peeled off are the lower side of the circuit board 50. Are connected by soldering to a plurality of cable connection lands (not shown) provided on the surface.

  That is, the image cable 51 and other control cables 52, the synchronization signal cable 53, the power cable 54, and the GND cable 55 have a height difference between the surface of the FPC 45 and the surface of the rigid substrate 46. To be separated by a predetermined distance H.

  The image cable 51 is connected to one image signal cable 51a connected to the center on the inner side of the rigid board 46 and the side part to the outer side of the rigid board 46 (here, the right side as viewed from the rear). Both of the other image signal cables 51b connected in the above are connected to the synchronizing signal cable 53 at a position separated by a predetermined distance H in the height direction of the circuit board unit 50.

  Accordingly, the image cable 51 and the synchronization signal cable 53 are connected at a position separated by a predetermined distance H at least in the height direction of the circuit board unit 50.

  In addition to this, in the image cable 51, the cable core 61 of one of the image signal cables 51a is connected to the cable connection land A, and the cable core of the synchronization signal cable 53 on the left side of the FPC 45 as viewed from the rear. The connection part B 63 connected to the cable connection land is connected so as to be separated by a predetermined distance L1 in the width direction of the circuit board part 50.

  Therefore, the other image signal cable 51b located on the side of the rigid board 46 (the right side in FIG. 3) than the one image signal cable 51a is also connected to the circuit board part 50 with respect to the synchronization signal cable 53. Are connected at positions separated by a predetermined distance L1 or more in the width direction.

  Accordingly, the image cable 51 and the synchronization signal cable 53 are connected at a position separated by at least a predetermined distance L1 in the width direction of the circuit board portion 50.

  The connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are cross sections (short direction) perpendicular to the longitudinal direction of the FPC 45 and the rigid substrate 46 constituting the circuit board portion 50 of the imaging device 40. Are separated by a predetermined distance L2 in a diagonal direction. In addition, the longitudinal direction of the circuit board part 50 here is a direction along the imaging optical axis O.

  For this reason, the other image signal cable 51b located closer to the side of the rigid board 46 than the one image signal cable 51a is also a cross section orthogonal to the longitudinal direction of the circuit board part 50 with respect to the synchronization signal cable 53 ( They are connected at positions separated by a predetermined distance L2 or more in the diagonal direction (cross section in the short direction).

  Accordingly, the image cable 51 and the image signal cable 51b are connected at positions separated by at least a predetermined distance L2 in a diagonal direction in a cross section (cross section in the short direction) orthogonal to the longitudinal direction of the circuit board portion 50.

  Further, the connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are separated from each other by a predetermined distance L3 in the longitudinal direction in a side view of the circuit board portion 50 as shown in FIG. Connected at the position to be.

  For this reason, the one image signal cable 51a and the other image signal cable 51b arranged in parallel in the width direction are also at least a predetermined distance L3 in the longitudinal direction with respect to the synchronization signal cable 53 in the side view of the circuit board portion 50. Are connected at positions separated by

  Accordingly, the image cable 51 and the image signal cable 51b are connected at a position separated by at least a predetermined distance L3 in the longitudinal direction when the circuit board unit 50 is viewed from the side.

  The connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are predetermined in the diagonal direction in the longitudinal cross section of the FPC 45 and the rigid substrate 46 constituting the circuit board portion 50 of the imaging device 40. Are separated by a distance L4.

  Therefore, the other image signal cable 51b provided in parallel with one image signal cable 51a is also at least a predetermined distance L4 in the diagonal direction in the longitudinal section of the circuit board portion 50 with respect to the synchronization signal cable 53. Are connected at positions separated by

  Therefore, the image cable 51 and the image signal cable 51b are connected so as to be separated at least by a predetermined distance L4 in the diagonal direction in the longitudinal section of the circuit board portion 50.

  Further, as shown in FIG. 5, the connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are separated at a predetermined distance L5 in a top view of the circuit board portion 50. It is connected.

  Therefore, the one image signal cable 51a and the other image signal cable 51b arranged in parallel in the width direction are also separated from the synchronization signal cable 53 by a predetermined distance L5 or more in the top view of the circuit board unit 50. Connected in position.

  Therefore, the image cable 51 and the image signal cable 51b are connected at a position separated by at least a predetermined distance L5 when the circuit board unit 50 is viewed from above.

  As described above, the imaging apparatus 40 of the present embodiment has a predetermined distance H between the surface of the FPC 45 connected to the synchronization signal cable 53 and the surface of the rigid board 46 connected to the image cable 51 in particular. In addition to the height difference due to the step, the synchronization signal cable is located at a position separated by a predetermined distance L3 in the longitudinal direction of the circuit board portion 50 in a side view and at a position separated by a predetermined distance L5 in a top view. 53 and the image cable 51 are connected.

  As described above, since the imaging device 40 is configured such that the image cable 51 and the synchronization signal cable 53 are spatially separated from each other, the influence of electromagnetic waves from the synchronization signal cable 53 to the image cable 51 is suppressed, and the image cable Noise generated by interference of electromagnetic waves with the image signal transmitted at 51 can be suppressed. As a result, the endoscope image displayed on the monitor is stabilized without any disturbance.

  In addition, although the imaging device 40 demonstrated the structure which provided the level | step difference of the predetermined distance H in the height direction by the thickness of the rigid board | substrate 46, the contact bonding layer with FPC45, etc., the height difference of the level | step difference is 0.2 mm-4. It is preferable to be within a range of 0.0 mm, and the size of this step can be selected according to the height dimension of the solid-state imaging device 44 and the thickness of various cables.

  Further, the rigid board 46, the electronic components 47 and 48 mounted on the rigid board 46, the image cable 51, the other control cable 52, the synchronization signal cable 53, the power cable 54, and the GND cable 55 are various cables. The small-sized imaging device 40 can be realized by arranging so as to be within the projected area.

  That is, as shown in FIG. 3, the imaging device 40 includes a rigid board 46, two electronic components 47 and 48 mounted on the upper surface of the rigid board 46, an FPC 45 or an image cable 51 connected to the rigid board 46, All other cables such as the control cable 52, the synchronization signal cable 53, the power cable 54, and the GND cable 55 are arranged so as to be within the projection area of the solid-state imaging device 44. For this reason, size reduction of the imaging device 40 is realizable.

  Note that the imaging device 40 has a rigid board 46, electronic components 47 and 48, and all the various cables within the projected area of the solid-state imaging device 44, and is connected to a lower cable connection land provided in the FPC 45. The signal cable 53, the power cable 54, and the GND cable 55 have a predetermined distance H so as not to interfere with the image cable 51 connected to the upper cable connection land provided on the rigid board 46 and the other control cables 52. It is preferable to set a step difference between the surface of the FPC 45 and the surface of the rigid substrate 46.

  Such a height difference of the step can be easily obtained as a relatively large one having a predetermined distance H depending on the thickness of the rigid substrate 46. Therefore, by connecting a relatively large-diameter power cable 54, a GND cable 55, and the like to the lower cable connection land provided in the FPC 45, the power cable 54 and the GND cable 55 are within the projection area of the solid-state image sensor 44. It is difficult to protrude from the image pickup device, and the diameter of the image pickup device 40 can be easily reduced.

  Of the various cables, a coaxial cable is used for a relatively large diameter, so that the coaxial cable is not limited to the power cable 54 or the GND cable 55, and is connected to the lower cable connection land provided in the FPC 45. Thus, it is preferable that the solid-state imaging device 44 does not protrude from the projected area.

  Furthermore, in the imaging device 40 described above, the image cable 51 is connected to the upper side of the circuit board unit 50 and the synchronization signal cable 53 is connected to the lower side of the circuit board unit 50. Since the cables 53 only need to be spatially separated, the image cable 51 is connected to the lower side, the synchronization signal cable 53 is connected to the upper side, and the respective positions are separated by the predetermined distances (L1 to L5) described above. It is good also as a structure.

  As described above, in the imaging apparatus 40 of the present embodiment, in particular, the relay member is provided on the cable connection land of the rigid board 46, the height difference is provided in the connection part of various signal cables, the FPC 45 or the rigid board 46 is provided. Without providing the cable connection lands on the front and back surfaces, it is possible to reduce the noise generated in the image signal and reduce the noise generated in the image signal as a simple configuration. As described above, since the imaging device 40 is small, the endoscope 2 can be downsized at the distal end portion 31 of the insertion portion 4 on which the imaging device 40 is mounted. As a result, the insertion portion 4 can be reduced in diameter. .

(Modification)
As shown in FIGS. 6 and 7, the width of the rigid board 46 is reduced, an area is provided in the FPC 45 from the side of the rigid board 46, and the electronic component 49 is mounted on this area. Alternatively, the synchronization signal cable 53 may be connected.

  Also in this modified example, as described above, among the image cables 51, the cable core 61 of one of the image signal cables 51a is synchronized with the connection portion A connected to the cable connection land and the left side of the FPC 45 as viewed from the rear. As shown in FIG. 6, the connection part B where the cable core 63 of the signal cable 53 is connected to the cable connection land is connected so as to be separated by a predetermined distance L6 in the width direction of the circuit board part 50.

  Therefore, the other image signal cable 51b located closer to the side of the rigid board 46 than the one image signal cable 51a also has a predetermined distance L6 in the width direction of the circuit board part 50 with respect to the synchronization signal cable 53. The connection is made at the positions separated as described above.

  Therefore, the image cable 51 and the synchronization signal cable 53 are connected at a position separated by at least a predetermined distance L6 in the width direction of the circuit board unit 50.

  Further, the connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are separated by a predetermined distance L7 in a diagonal direction in a cross section orthogonal to the longitudinal direction of the circuit board portion 50.

  Therefore, the other image signal cable 51b located closer to the side of the rigid board 46 than the one image signal cable 51a is also in a cross section orthogonal to the longitudinal direction of the circuit board part 50 with respect to the synchronization signal cable 53. They are connected at positions that are separated by a predetermined distance L7 or more in the diagonal direction.

  Accordingly, the image cable 51 and the image signal cable 51b are connected at positions separated by at least a predetermined distance L7 in a diagonal direction in a cross section (cross section in the short direction) orthogonal to the longitudinal direction of the circuit board portion 50.

  In the longitudinal direction of the circuit board portion 50, as shown in FIG. 7, the connection portion A of the image signal cable 51a and the connection portion B of the synchronization signal cable 53 are connected at the same position, and the circuit board portion. It is separated by a predetermined distance L8 in the height direction of 50.

  Therefore, the other image signal cable 51b located closer to the side of the rigid board 46 than the one image signal cable 51a is also a predetermined distance in the height direction of the circuit board 50 with respect to the synchronization signal cable 53. They are connected at positions separated by L8.

  Therefore, the image cable 51 and the image signal cable 51b are connected at a position separated by at least a predetermined distance L8 in the height direction of the rigid board 46. The predetermined distance L8 is substantially the same as the predetermined distance H in the height direction of the imaging device 40, which is a height difference between the surface of the FPC 45 and the surface of the rigid substrate 46 (L8≈H).

  Even in such a configuration, the imaging device 40 can connect the image cable 51 and the synchronization signal cable 53 so as to be spatially separated from each other, and the effect is less than that of the above-described configuration. By suppressing the influence of the electromagnetic wave, it is possible to suppress noise generated by the interference of the electromagnetic wave with the image signal transmitted through the image cable 51. As a result, the endoscope image displayed on the monitor is stabilized without any disturbance.

  The invention described in the above-described embodiment is not limited to the embodiment and modifications, and various modifications can be made without departing from the scope of the invention in the implementation stage. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the described requirements can be deleted if the stated problem can be solved and the stated effect can be obtained. The configuration can be extracted as an invention.

DESCRIPTION OF SYMBOLS 1 ... Endoscope apparatus 2 ... Electronic endoscope 3 ... Peripheral apparatus 4 ... Insertion part 5 ... Operation part 6 ... Universal cord 7 ... Endoscope connector 8 ... Base 9 ... Light source apparatus 10 ... Video processor 11 ... Connection cable 12 ... keyboard 13 ... monitor 14 ... bending operation knobs 15 and 16 ... buttons 17 ... treatment instrument insertion port 18 ... fixing lever 21 ... vertical bending operation knob 22 ... left and right bending operation knob 31 ... distal end 32 ... bending part 33 ... flexible tube part 40 ... imaging device 41 ... tip body 42 ... hard tube 43 ... lens unit 43a ... objective lens 43b ... lens holder 44 ... solid-state image sensor 44a ... light receiving element part 45 ... flexible printed circuit board 45a ... sealing resin 46 ... Rigid board 47, 48 ... Electronic component 49 ... Glass lid 50 ... Circuit board 51 ... Image cable 51a, 51b ... Image signal cable 52 ... Control cable Le 52a, 52 b ... control signal cable 53 ... synchronization signal cable 54 ... Power cable 55 ... Grand cable 61,62,63,64,65 ... cable core O ... photographing optical axis

Claims (9)

A solid-state imaging device having a light receiving element portion for detecting a subject image;
A circuit board portion on which electronic components constituting a driving circuit of the solid-state imaging device are mounted and provided with a step, and
A plurality of cables connected to cable connection lands provided in the circuit board unit;
With
An image pickup apparatus, wherein among the plurality of cables, an image cable for transmitting an image signal and a synchronization signal cable for transmitting a synchronization signal are connected to different surfaces of the circuit board portion separated by the step. The circuit board portion is formed by laminating and connecting a rigid board on a flexible printed board, and the step is formed in the height direction by the surface of the flexible printed board and the surface of the rigid board,
The imaging device according to claim 1, wherein the image cable and the synchronization signal cable are connected to each other at positions separated from each other in the height direction of the circuit board unit.   The said image cable and the said synchronizing signal cable are connected to the position which mutually spaces apart in the longitudinal direction along the imaging | photography optical axis of the said subject image of the said circuit board part. 2. The imaging device according to 2.   4. The imaging apparatus according to claim 1, wherein the image cable and the synchronization signal cable are connected to positions separated in the width direction of the circuit board portion. 5.   The image cable and the synchronization signal cable are connected to diagonally spaced positions in a cross section perpendicular to the longitudinal direction along the imaging optical axis of the subject image of the circuit board portion. The imaging device according to any one of claims 1 to 4.   6. The rigid board, the electronic component, and the plurality of cables are accommodated within a projection area of a solid-state imaging device along a photographing optical axis of the subject image. The imaging device according to any one of the above.   The power cable and / or the ground cable among the plurality of cables are connected to a lower side in the height direction of the step. Imaging device.   The imaging device according to claim 1, wherein the step is in a range of 0.2 mm to 4.00 mm.   An electronic endoscope, wherein the imaging device according to any one of claims 1 to 7 is provided at a distal end portion of an insertion portion.

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