JP2014207261A - Semiconductor device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof, which can eliminate a resin burr and extend the lifetime of a die.SOLUTION: A method for manufacturing a semiconductor device comprises: a molding process of molding an encapsulated resin body (16) so as to have a recess (24) opening onto a lower surface (16b) and a resin lateral face (16c) and so as to make at least a part of a rear face (14b) on the lower surface side of a lead (14) be exposed at an encapsulated part (26) where one surface (14a) on an upper surface (16a) side is encapsulated by the encapsulation resin body; and a removal process of removing a resin burr (48) by punching after the molding, in which both sides on a width direction of an extension part (22) extending outward from the encapsulation resin body are punched together with the resin burr by a punch (54) from a predetermined position to at least a boundary between the encapsulated body and the extension part while a rear face exposed part (28) being exposed from the recess of the encapsulated part being supported by a die (52).

Description

  The present invention relates to a resin-encapsulated semiconductor device in which a part of each lead is sealed with a sealing resin body together with an electronic component, and a lead is extended to the outside from a side surface of the sealing resin body, and a manufacturing method thereof.

  When forming a resin-encapsulated semiconductor device in which a part of each lead is encapsulated in an encapsulating resin body together with electronic components such as a semiconductor chip, and the leads extend outside from the side surface of the encapsulating resin body, Resin flash occurs. Therefore, generally, after molding the sealing resin body, the resin burr is punched and removed. As a method for removing such resin burrs (resin debris), a method described in Patent Document 1 is known.

JP 63-31128 A

  In Patent Document 1, resin burrs are punched and removed together with the lead frame. Thus, in order to punch the resin burr together with the lead frame, in order to suppress metal sag due to punching, it is necessary to punch the peripheral portion punched from the upper surface side with the die supported from the lower surface side.

  For this reason, as described in Patent Document 1, in the conventional semiconductor device in which the upper and lower surfaces of the leads are almost equally covered with the sealing resin body, a punch is applied to a position away from the sealing resin body (package). The lead frame must be punched by supporting the punch and the sealing resin body with a die. Therefore, a resin burr remains in a predetermined range from the side of the sealing resin body on the side surface of the lead extending from the sealing resin body.

  If the resin burrs remain in this way, for example, in the process of mounting the semiconductor device on the printed circuit board, the remaining resin burrs fall off the semiconductor device and adhere to the printed circuit board, and the electrical connection reliability between the semiconductor device and the printed circuit board is ensured. There is a risk of reducing the performance.

  In addition, if the residual resin burrs are to be reduced as much as possible, the tip of the die that supports the lead frame becomes thin, and the die is likely to be prematurely worn or broken. That is, there arises a problem that the quality of the cut surface of the lead frame and the adhesion between the lead and the sealing resin body vary.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a semiconductor device that can eliminate resin burrs and extend the life of a die, and a method for manufacturing the same.

  The invention disclosed herein employs the following technical means to achieve the above object. Note that the reference numerals in parentheses described in the claims and in this section indicate a corresponding relationship with specific means described in the embodiments described later as one aspect, and limit the technical scope of the invention. Not what you want.

  One of the disclosed inventions is an electronic component (12) disposed on a lead frame (40) and a part of each of a plurality of leads (14) electrically connected to the electronic component of the lead frame. Among the molding step of molding the sealing resin body (16) so as to integrally cover the upper surface (16a), the lower surface (16b), and the resin side surface (16c) of the sealing resin body. And removing the resin burr (48) in contact with the lead side surface (14c) of the extended portion (22) extending from the resin side surface to the outside of the lead, Then, in the sealing portion (26) having a recess (24) opening on the lower surface and the resin side surface, and one surface (14a) of the upper surface side of the lead is sealed by the sealing resin body, the lower surface side rear surface At least part of (14b) is exposed by the recess. In this way, the sealing resin body is molded, and in the removing step, the back surface exposed portion (28) of the sealing portion is supported by the die (52), while the punch (54) is used on both sides in the width direction of the extending portion. Is punched and removed together with a resin burr from a predetermined position to at least a boundary with the sealing portion.

  According to this, the extension part (22) of the lead (14) is punched out together with the resin burr (48) at least to the boundary with the sealing part (26). Therefore, all the resin burrs (48) can be removed. That is, it is possible to prevent the resin burr (48) remaining after the punching from dropping and causing a poor connection with the printed circuit board, for example.

  Further, the sealing resin body (16) is provided with a recess (24) so that the back surface exposed portion (28) of the lead (14) is exposed, and the back surface exposed portion (28) exposed from the recess (24) is formed as a die ( 52). Therefore, while removing all the resin burrs (48), the width of the tip of the die (52) supporting the lead (14) can be widened, and the life of the die (52) can be extended.

  Further, with the back surface exposed portion (28) supported by the die (52), the resin burrs (48) together with the leads (14) are punched and removed by the punch (54). Therefore, it is also possible to suppress the occurrence of metal sagging at the cut portion of the lead (14).

  In another disclosed invention, a plurality of leads (14) are extended from the same resin side surface (16c) in the sealing resin body (16), and in the molding process, a plurality of leads (14) are formed by a common recess (24). The sealing resin body is molded so that the back surface exposed portion (28) of the lead is exposed.

  According to this, the structure of the die (52) can be simplified and the life can be further extended. Moreover, it can simplify also about the shaping | molding die which shape | molds the sealing resin body (16).

1 is a side view showing a schematic configuration of a semiconductor device according to a first embodiment. FIG. 2 is a top view of the semiconductor device shown in FIG. 1. FIG. 2 is a bottom view of the semiconductor device shown in FIG. 1. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing which follows the VV line of FIG. FIG. 2 is a top view showing a method for manufacturing the semiconductor device shown in FIG. 1 and shows a prepared lead frame. It is a top view which shows the process of arrange | positioning an electronic component to a lead frame. It is a top view which shows the shaping | molding process of a sealing resin body. It is a top view which shows the resin burr | flash produced through a formation process, and has shown the punching line with the dashed-dotted line. It is a top view which shows the removal process of a resin burr | flash. It is sectional drawing which follows the XI-XI line of FIG. It is sectional drawing which follows the XII-XII line | wire of FIG. It is a bottom view which shows schematic structure of the semiconductor device which concerns on 2nd Embodiment. FIG. 14 is a bottom view showing the method for manufacturing the semiconductor device shown in FIG. 13 and showing a removing step.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, common or related elements are given the same reference numerals. Unless otherwise specified, the planar shape means a shape of a surface along the upper surface of the sealing resin body.

(First embodiment)
First, a schematic configuration of the semiconductor device will be described. The semiconductor device 10 shown in FIGS. 1 to 5 includes an electronic component 12, a plurality of leads 14, and a sealing resin body 16.

  As the electronic component 12, a circuit board or a semiconductor chip can be adopted. In the present embodiment, a semiconductor chip in which an element such as a MOSFET is formed on a semiconductor substrate such as silicon is employed as the electronic component 12. As shown in FIG. 4, the electronic component 12 is fixed to the island 20 and is electrically connected to the lead 14 by a bonding wire (not shown).

  The lead 14 electrically relays the electronic component 12 and an external device such as a printed board. The lead 14 is configured as a part of the lead frame.

  The sealing resin body 16 seals a part of each lead 14 together with the electronic component 12. The sealing resin body 16 is formed by a transfer molding method using, for example, an epoxy resin.

  In the semiconductor device 10 configured as described above, the lead 14 includes the resin side surface 16c among the upper surface 16a of the sealing resin body 16, the lower surface 16b opposite to the upper surface 16a, and the resin side surface 16c connecting the upper surface 16a and the lower surface 16b. Is extended to the outside. That is, the lead 14 has an extending portion 22 that extends to the outside of the sealing resin body 16.

  In the present embodiment, as shown in FIGS. 2 and 3, the sealing resin body 16 has a substantially rectangular plane, and all (three) leads 14 extend in the same direction from the common resin side surface 16c. Has been. Further, the lead 14 has a flat plate shape, and the semiconductor device 10 has a SIP (Single Inline Package) structure.

  The sealing resin body 16 has the recessed part 24 opened to the lower surface 16b and the resin side surface 16c, as shown in FIGS. Here, each lead 14 has a sealing portion 26 in which one surface 14 a on the upper surface 16 a side is sealed with the sealing resin body 16. The sealing portion 26 is a portion of the lead 14 excluding the extending portion 22. Each lead 14 has a back surface exposed portion 28 in which at least a part of the sealing portion 26 is exposed by the recess 24 on the back surface 14b side opposite to the one surface 14a.

  In the present embodiment, as shown in FIG. 3, the sealing resin body 16 has the same number of recesses 24 as the back surface exposed portion 28. Each recess 24 opens to the same resin side surface 16c. Each back surface exposed portion 28 is exposed independently of each other by the corresponding recess 24.

  In addition, the planar shape of the recessed part 24 is not specifically limited. In the present embodiment, as shown in FIG. 3, the concave portion 24 has a substantially rectangular plane. In the width direction orthogonal to the extending direction of the leads 14, the width of the recess 24 is wider than the width of the back surface exposed portion 28.

  As shown in FIG. 3, each lead 14 has a notch 30 provided at a predetermined length from the boundary with the sealing portion 26 on both sides in the width direction of the extending portion 22. In the extending portion 22, the width of the narrow portion 32 sandwiched between the notches on both sides is equal to the width of the portion of the extending portion 22 adjacent to the narrow portion 32 in the extending direction, and the sealing portion 26. The width is narrower than the width of the portion adjacent to the narrow portion 32. In the present embodiment, the notch 30 is provided in a part of the lead 14 with a constant width. The notch 30 has a planar rectangular shape that is longer in the extending direction than in the width direction.

  Next, a method for manufacturing the semiconductor device 10 will be described.

  First, as shown in FIG. 6, a lead frame 40 is prepared. The lead frame 40 includes not only the lead 14 and the island 20 described above, but also an outer frame 42, the leads 14, and tie bars 44 that connect the leads 14 and the outer frame 42. In FIG. 6, a plurality of islands 20 are provided in one lead frame 40.

  Next, as shown in FIG. 7, the electronic component 12 is fixed to each island 20 via Ag paste or the like. Then, the electronic component 12 and the lead 14 are electrically connected by the bonding wire 46.

  Next, as shown in FIG. 8, a molding step for molding the sealing resin body 16 is performed. Specifically, the sealing resin body 16 is molded by transfer molding using an epoxy resin.

  In this step, the sealing resin body 16 is molded so as to integrally cover the electronic component 12 disposed on the island 20 of the lead frame 40 and a part of each of the plurality of leads 14. Moreover, the recessed part 24 opened to the lower surface 16b and the resin side surface 16c is formed as a part of sealing resin body 16 with shaping | molding. The recess 24 is formed to expose at least a part of the back surface 14 b in the sealing portion 26 of the lead 14 to form the back surface exposed portion 28.

  In the present embodiment, as shown in FIG. 3, the entire sealing portion 26 is exposed in the width direction, and a range of a predetermined length longer than the plate thickness of the lead 14 is exposed in the extending direction. A recess 24 is formed.

  Here, as the sealing resin body 16 is molded, a resin burr 48 is formed on the resin side surface 16c of the sealing resin body 16 as shown in FIG. A part of the resin burr 48 is formed so as to fill a dam region surrounded by the adjacent extension portion 22 and the tie bar 44. That is, the resin burr 48 is formed so as to come into contact with the lead side surface 14 c in the extending portion 22.

  For this reason, a removal process for removing the resin burr 48 is performed after the molding process. In this removing step, the resin burr 48 is removed together with the leads 14 in order to remove all the resin burr 48.

  A one-dot chain line shown in FIG. 9 indicates a punching line 50. Specifically, as shown in FIGS. 10 to 12, while supporting the back surface exposed portion 28 of the sealing portion 26 with a die 52, both sides in the width direction of the extending portion 22 are moved from a predetermined position by the punch 54. It punches out with the resin burr 48 at least to the boundary with the sealing part 26. In this embodiment, as shown in FIG. 12, each back surface exposed portion 28 is supported using, for example, a comb-like die 52.

  9 and 10 are enlarged views of a part of the lead frame 40. FIG. 10 and 11 show a state in which the punch 54 is in contact with the lead 14 immediately before punching.

  Further, when the resin burr 48 is punched, not only the lead 14 but also the tie bar 44 is punched together. That is, the removal of the resin burr 48 and the cutting of the tie bar 44 are performed simultaneously. Note that the resin burr 48 at a portion away from the lead 14 is also punched and removed by the punch 54.

  In the present embodiment, the punch 54 is disposed so that one end surface in the extending direction is in contact with the resin side surface 16 c of the sealing resin body 16. On the other hand, the dies 52 are arranged so as to substantially support the entire back surface exposed portions 28. The punch 54 is overlapped with the sealing resin body 16 so that the resin burr 48 can be removed even if the dimensions of the sealing resin body 16, the arrangement of the leads 14, and the arrangement of the punch 54 vary within the tolerance range. A part of the sealing resin body 16 may be punched together.

  In addition, the punch 54 is disposed so as to overlap the extending portion 22 of the lead 14 with a width equal to or greater than the plate thickness of the lead 14. According to this, the dimensional accuracy of punching by the punch 54 can be improved.

  The semiconductor device 10 can be obtained through the above steps.

  Next, the function and effect of the semiconductor device 10 will be described.

  In this embodiment, when the resin burr 48 is punched and removed, the extended portion 22 of the lead 14 is punched at least to the boundary with the sealing portion 26 together with the resin burr 48. Thus, since the resin burr 48 is punched out together with the lead 14 up to the boundary with the sealing portion 26, the resin burr 48 can be completely removed. Thereby, it is possible to suppress the resin burr 48 remaining after the punching from dropping and causing a poor connection with the printed circuit board on which the semiconductor device 10 is disposed, for example.

  Further, when the sealing resin body 16 is molded, the recess 24 is formed so that the back surface exposed portion 28 in the sealing portion 26 of the lead 14 is exposed. When the resin burr 48 is removed, the back surface exposed portion 28 exposed from the recess 24 is supported by the die 52. Therefore, while removing all the resin burrs 48, the width of the tip of the die 52 supporting the lead 14 can be widened, and the life of the die 52 can be extended.

  Further, with the back surface exposed portion 28 of the sealing portion 26 supported by the die 52, the resin burr 48 is punched and removed together with the lead frame 40 (lead 14) by the punch 54. Therefore, it is possible to suppress the occurrence of metal sag at the cut portion of the lead 14. Moreover, peeling between the sealing resin body 16 and the lead 14 can be suppressed.

(Second Embodiment)
In the present embodiment, description of portions common to the semiconductor device 10 shown in the above embodiment is omitted.

  In the present embodiment, as shown in FIG. 13, the plurality of leads 14 extend from the same resin side surface 16 c in the sealing resin body 16. The recesses 24 extend in the direction in which the plurality of leads are arranged (in other words, the width direction of the leads 14), and the back surface exposed portions 28 of the plurality of leads 14 are exposed by the common recess 24.

  In the example shown in FIG. 13, as in the first embodiment, three leads 14 extend in the same direction from the same resin side surface 16c. And the recessed part 24 is extended from the one end of the arrangement direction to the other end with respect to the sealing resin body 16 of planar substantially rectangular shape. That is, the recess 24 is open to three continuous resin side surfaces 16c.

  Such a semiconductor device 10 can be formed basically by the manufacturing method described in the first embodiment. In the present embodiment, in the molding step, the sealing resin body 16 is molded so as to have the recesses 24 that are opened in the three consecutive resin side surfaces 16c.

  Further, in the removing step, as shown in FIG. 14, all the back surface exposed portions 28 are supported by a common die 52. In FIG. 14, the dies 52 are arranged so as to straddle the planar substantially rectangular sealing resin bodies 16 in the arrangement direction, and the respective back surface exposed portions 28 are supported almost entirely by the common dies 52. . FIG. 14 shows a state in which the punch 54 is in contact with the lead 14 immediately before punching.

  According to this, the structure of the die 52 can be simplified. Therefore, the life of the die 52 can be further extended. Further, the mold for molding the sealing resin body 16 can be simplified.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the above-described embodiment, an example in which substantially the entire back surface exposed portion 28 is supported by the die 52 has been described. That is, the example in which the die 52 contacts almost the entire back surface exposed portion 28 is shown. However, the die 52 may support the back surface exposed portion 28 so that metal sag does not occur when punching with the punch 54. For this reason, what is necessary is just to support at least the part adjacent to the part which the punch 54 contacts among the back surface exposed parts 28. FIG.

  Although an example of the SIP has been shown as the resin-encapsulated semiconductor device 10, it is not limited to this. The present invention can also be applied to a configuration in which the leads 14 are extended from a plurality of resin side surfaces 16 c of the sealing resin body 16. Further, the present invention can be applied to a configuration in which the extending portion 22 of the lead 14 is bent.

  The number of leads 14 is not limited to the above example.

  The shape of the recess 24 is not limited to a substantially rectangular plane. As the recess 24, any one that opens to the lower surface 16 b and the resin side surface 16 c and exposes a predetermined range of the sealing portion 26 of the lead 14 from the boundary with the extending portion 22 can be adopted.

DESCRIPTION OF SYMBOLS 10 ... Semiconductor device, 12 ... Electronic component, 14 ... Lead, 14a ... One surface, 14b ... Back surface, 14c ... Lead side surface, 16 ... Sealing resin body, 16a ..Upper surface, 16b ... lower surface, 16c ... resin side surface, 20 ... island, 22 ... extending portion, 24 ... recessed portion, 26 ... sealing portion, 28 ... back surface Exposed portion, 30 ... notch, 32 ... narrow portion, 40 ... lead frame, 42 ... outer frame, 44 ... tie bar, 46 ... bonding wire, 48 ... resin Burr, 50 ... punching line, 52 ... die, 54 ... punch

Claims (4)

The electronic component (12) disposed on the lead frame (40) and a part of each of the plurality of leads (14) electrically connected to the electronic component in the lead frame are integrally formed. A molding step of molding the sealing resin body (16) so as to cover;
Of the lead, an extended portion that extends to the outside from the resin side surface among the upper surface (16a), the lower surface (16b), and the resin side surface (16c) of the sealing resin body. A removal step of punching and removing the resin burr (48) in contact with the lead side surface (14c) of (22),
In the molding step, a sealing portion (24) having a recess (24) opened on the lower surface and the resin side surface, and one surface (14a) of the upper surface side of the lead is sealed with the sealing resin body ( 26), molding the sealing resin body so that at least a part of the back surface (14b) on the lower surface side is exposed by the recess,
In the removing step, the back surface exposed portion (28) of the sealing portion is supported by the die (52), and at least both sides of the extending portion in the width direction are sealed from the predetermined position by the punch (54). A method of manufacturing a semiconductor device, wherein the resin burr is removed by punching up to the boundary with the portion. A plurality of the leads (14) are extended from the same resin side surface (16c) in the sealing resin body (16),
2. The sealing resin body is molded in the molding step so that the back surface exposed portions (28) of the plurality of leads are exposed by the common recess (24). The manufacturing method of the semiconductor device of description. An electronic component (12);
A plurality of leads (14) electrically connected to the electronic component;
A sealing resin body (16) for sealing a part of each lead together with the electronic component,
Of the upper surface (16a), the lower surface (16b), and the resin side surface (16c) of the sealing resin body, the lead is extended to the outside from the resin side surface,
The sealing resin body has a recess (24) that opens in the lower surface and the resin side surface,
In each lead, one surface (14a) on the upper surface side is exposed to the sealing portion (26) sealed with the sealing resin body, and at least a part of the rear surface (14b) on the lower surface side is exposed by the recess. A back surface exposed portion (28)
Each lead has a notch (30) provided with a predetermined length from the boundary with the sealing portion on both sides in the width direction of the extending portion (22) extending outward from the resin side surface. Have
The width of the narrow part (32) sandwiched between the notches on both sides in the extension part is the width of the part adjacent to the narrow part in the extension part, and the narrow part in the sealing part. A semiconductor device characterized in that it is narrower than the width of the portion adjacent to. A plurality of the leads (14) are extended from the same resin side surface (16c) in the sealing resin body (16),
The recess (24) extends in the direction in which the leads are arranged,
The semiconductor device according to claim 3, wherein the back surface exposed portions (28) of the plurality of leads are exposed by the common concave portion.

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