JP2014207069A - Tab lead with resin, continuum thereof and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain satisfactory airtightness by promoting a smooth flow of a metal strip to a side surface by a softened resin in the case of heat sealing.SOLUTION: A tab lead with a resin comprises a metal strip, and a resin member covering the metal strip for a predetermined width in a width direction. An outermost layer of the resin member is formed from a thermoplastic resin. The metal strip in a portion covered with the resin member includes a first surface which is vertical to front and rear sides of the metal strip and a second surface in contact with one of the front and rear surfaces and the first surface. The first surface and the second surface are formed by grinding, and the thickness of the first surface is less than 0.1 mm.

Description

  The present invention relates to a resin-attached tab lead used for a lithium ion secondary battery, an electric double layer capacitor, and the like, a continuum thereof, and a method for producing them.

  Recently, large laminated lithium (Li) ion secondary batteries have come to be used for automobile applications and general household electricity storage applications. A laminated Li-ion secondary battery, for example, accommodates a power generation element including positive and negative electrodes and an electrolyte between two aluminum laminate films, and pulls out tab leads as lead terminals, and the peripheral edges of the aluminum laminate films of each other. The structure is sealed by heat sealing the part to enclose the power generation element.

  As the tab lead, a tab lead with resin including a metal strip made of, for example, aluminum (Al) or copper (Cu) and a strip-shaped resin member that covers the metal strip with a predetermined width in the width direction is used. The band-shaped resin member has, for example, thermoplasticity, and when the aluminum laminate film is fused and heat-sealed, the fusion also occurs and the sealing property (airtightness) between the aluminum laminate film and the tab lead is obtained. Secured.

  For example, Patent Document 1 describes a metal strip used for various applications. Further, for example, Patent Document 2 describes a resin member that covers the metal strip as described above.

JP 2011-173144 A JP 2010-165481 A

  A resin-coated tab lead provided with a metal strip or a strip-shaped resin member having a predetermined width on a metal strip is manufactured by sticking a tape on the metal strip or embedding the metal strip with a thermoplastic resin. At that time, the sharp edges including burrs in the cross section of the metal strip hinder the adhesion of the tape and the flow of the resin, the side of the metal strip when you try to put the tape on the metal strip or to embed it with the resin It may cause air bubbles to be caught in. Further, as the thickness of the metal strip increases, it tends to be difficult to provide the resin member so as not to entrain air bubbles on the side surface of the metal strip.

  Also, when resin-coated tab leads that have entrained air bubbles on the side of the metal strip are heat sealed with an aluminum laminate film, the air bubbles on the side of the metal strip often remain and the entire heat seal It may cause a decrease in reliability.

  The object of the present invention is to facilitate adhesion of the metal strip to the side surface when a tape is applied, or to promote a smooth flow to the side surface of the metal strip due to the softened resin during heat sealing, thereby achieving good airtightness. It is providing the tab lead with a resin which can obtain property, its continuous body, and the manufacturing method thereof.

According to a first aspect of the invention,
A tab lead with a resin comprising a metal strip and a resin member that covers the metal strip with a predetermined width in the width direction, the outermost layer of the resin member is made of a thermoplastic resin,
The metal strip of the portion covered with the resin member has a first surface perpendicular to the front and back surfaces, and a second surface in contact with one surface of the front and back surfaces and the first surface. Have
The first surface and the second surface are molded by polishing, and the first surface has a thickness of less than 0.1 mm. A tabbed with resin is provided.

According to a second aspect of the invention,
Having a third surface in contact with the other surface of the front and back surfaces and the first surface;
The tab lead with resin according to the first aspect is provided, wherein the third surface is polished.

According to a third aspect of the invention,
The angle between the main surface of the metal strip adjacent to the second surface and the second surface is 45 degrees or less, with resin according to the first or second aspect Tab leads are provided.

According to a fourth aspect of the invention,
At least one of the interface between the main surface of the metal strip and the second surface or the interface between the side surface of the metal strip and the second surface is a continuous curved surface. The resin-attached tab lead according to any one of the first to third aspects is provided.

According to a fifth aspect of the present invention,
The resin strip tab lead according to any one of the first to fourth aspects is provided, wherein the metal strip is made of copper, aluminum, or at least one of alloy materials thereof.

According to a sixth aspect of the present invention,
The resin-coated tab lead according to any one of the first to fifth aspects, wherein a plating layer containing nickel is formed on a surface of the metal strip including the second surface. .

According to a seventh aspect of the present invention,
Among the resin members,
The tab lead with resin according to any one of the first to sixth aspects is provided, wherein at least the outer side is made of a resin having no adhesiveness at normal temperature.

According to an eighth aspect of the present invention,
Among the resin members,
The tab lead with resin according to any one of the first to seventh aspects is provided, wherein at least a surface side in contact with the metal strip is made of a resin having adhesiveness at room temperature.

According to a ninth aspect of the present invention,
Among the resin members,
The tab lead with a resin according to any one of the first to eighth aspects, wherein at least the outer side is made of a polyolefin-based resin.

According to a tenth aspect of the present invention,
Among the resin members,
The resin-attached tab lead according to any one of the first to ninth aspects is provided, wherein at least a surface side in contact with the metal strip is made of an acrylic resin.

According to an eleventh aspect of the present invention,
A long metal strip,
A plurality of the metal strips provided at a predetermined pitch, and a strip-shaped resin member that covers the metal strips with a predetermined width in the width direction thereof,
The metal strip of the portion covered with the resin member has a first surface perpendicular to the front and back surfaces, and a second surface in contact with one surface of the front and back surfaces and the first surface. Have
The first surface and the second surface are formed by polishing, and the first surface has a thickness of less than 0.1 mm.

According to a twelfth aspect of the present invention,
Preparing a long metal slit material formed by shearing by slitting; and
A first surface that is perpendicular to the front and back surfaces of the copper strip and has a thickness of less than 0.1 mm by polishing a sheared side surface of the metal slit material, and one surface of the front and back surfaces Forming a long metal strip with a second surface in contact with the first surface;
A step of affixing a plurality of strip-shaped resin members having thermoplasticity to cover the metal strip with a predetermined width in the width direction;
And a step of cutting the elongated metal strip so as to be a metal strip including one or more of the resin members.

According to a thirteenth aspect of the present invention,
Preparing a long metal slit material formed by shearing by slitting; and
By polishing the sheared side surface of the metal slit material, a first surface that is perpendicular to the front and back surfaces of the copper strip in the width direction and has a thickness of less than 0.1 mm, and one of the front and back surfaces Forming a long metal strip with a second surface in contact with the side surface and the side surface;
And a step of affixing a plurality of thermoplastic strip-shaped resin members covering the metal strip with a predetermined width in the width direction at a predetermined pitch. The

  According to the present invention, at the time of heat sealing, smooth flow to the side surface of the metal strip by the softened resin can be promoted, and good airtightness can be obtained.

It is a perspective view of the metal slit material used for manufacture of the tab lead with resin concerning a 1st embodiment of the present invention. It is an expanded sectional view which shows the side surface of the width direction of the metal slit material used for manufacture of the tab lead with resin which concerns on 1st Embodiment of this invention. It is a block diagram which shows the structural unit of the side surface molding apparatus used for manufacture of the tab lead with resin which concerns on 1st Embodiment of this invention. It is a schematic block diagram of the drop-type plating apparatus used for manufacture of the resin-coated tab lead according to the first embodiment of the present invention. It is a perspective view of the metal strip which concerns on 1st Embodiment of this invention. It is a block diagram which shows the structural unit of the resin sticking apparatus used for manufacture of the continuous body of the tab lead with resin which concerns on 1st Embodiment of this invention. It is sectional drawing which shows a mode that the resin member was affixed on the metal strip which concerns on 1st Embodiment of this invention. It is a perspective view of the continuous body of the tab lead with a resin concerning a 1st embodiment of the present invention. (A) is a perspective view of the tab lead with resin concerning a 1st embodiment of the present invention, and (b) is an AA sectional view of (a). It is a perspective view which shows the partial internal structure of the lamination-type Li ion secondary battery provided with the tab lead with resin which concerns on 1st Embodiment of this invention. It is an expanded sectional view showing various modifications of a metal strip with which a tab lead with resin concerning a 1st embodiment of the present invention is provided. It is sectional drawing which shows the various modifications of the resin member with which the tab lead with resin which concerns on 1st Embodiment of this invention is provided. It is a perspective view of the continuous body of the tab lead with a resin concerning a 2nd embodiment of the present invention. (A) is a perspective view of the tab lead with resin concerning a 2nd embodiment of the present invention, and (b) is an AA sectional view of (a).

<Knowledge obtained by the present inventors>
As described above, when the peripheral portion of the aluminum laminate film is heat-sealed, sufficient airtightness may not be obtained at the portion where the resin-coated tab lead is heat-sealed. In such a case, the thickness of the resin member may not be sufficient on the side surface of the metal strip constituting the resin-coated tab lead, or a gap may be formed between the side surface and the resin member.

  The metal strip used for the tab lead with resin is obtained by further cutting a long metal strip into a strip shape. Moreover, the metal slit material formed by shearing by slit processing is used for such a metal strip, for example. Due to the slit processing, each end of the side surface of the metal slit material or the metal strip has a square shape. The above-described resin member covers the metal strip in a state of being bent at each end of the metal strip.

  As described above, when the peripheral portion of the aluminum laminate film is heat-sealed, the resin member of the tab lead with resin is heated to exhibit thermoplasticity (heating fluidity) and soften, and has fluidity. In the above-mentioned tab lead with resin, for example, the present inventors have prevented the smooth flow of the softened resin to the side surface of the metal strip due to, for example, the square end, and the resin is sufficiently spread on the side surface of the metal strip. I found that I can't let you.

  Particularly in recent years, the resin-attached tab lead used in some laminated Li-ion secondary batteries and the like tends to increase in size. For example, since a large current of 30 A or more flows in the example of the laminated Li ion secondary battery in the above-described automobile application, in consideration of Joule heat loss, for example, a pure copper type having a thickness of 0.2 mm or more and a width of 50 mm or more Copper strips may be used as tab leads.

  Thus, when the metal strip becomes thick, it becomes more difficult to ensure a smooth flow to the side surface of the softened resin. As countermeasures against this, for example, the shape of the sealing jig of the heat sealing machine can be devised, or the resin member can be made thicker corresponding to the thickness of the metal strip. However, these alone were not sufficient measures. Moreover, when the resin member becomes thick, it becomes difficult to manage the temperature distribution of heat applied to the resin member during heat sealing and to manage the behavior of the resin member. For example, in the above-mentioned Patent Document 2, it can be seen that the material, dimensions, and configuration of the resin tape to be attached to the heat seal portion of the tab lead have been devised, and that the above-mentioned temperature distribution management is difficult.

  Then, the present inventors considered processing the side surface of the metal strip itself. For example, Patent Document 1 described above discloses a method of crushing an end portion of a metal strip using a metal roll having a predetermined shape. However, although some resin-attached tab leads tend to be larger, the metal strips constituting them are originally very thin, for example, the thickness is 0.1 mm or less. Further, the metal strip is often used in a state after being annealed and softened to have a predetermined elongation rate. Therefore, when such a metal strip is processed by the method of Patent Document 1, for example, a waving phenomenon that the edge in the width direction of the copper slit material undulates occurs, and it is very difficult to apply such a method. .

  In light of such difficulties, the present inventors have earnestly studied the shape of the side surface of the metal strip that promotes the smooth flow of the resin member to the side surface, the method for obtaining such a shape, and the like. Repeated research.

  The present invention is based on these findings found by the inventors.

<First Embodiment of the Present Invention>
(1) Schematic Configuration of Laminated Li-ion Secondary Battery First, the schematic configuration of the laminated Li-ion secondary battery according to the first embodiment of the present invention will be described with reference to FIG. FIG. 10 is a perspective view showing a partial internal structure of a laminated Li ion secondary battery 50 including the tab lead 40 with resin according to the present embodiment.

  As shown in FIG. 10, a laminated Li-ion secondary battery 50 accommodates a power generation element 52 including, for example, a positive electrode 52c, a negative electrode 52a, and an electrolyte 52e between two aluminum laminate films 51, and the positive electrode 52c and the negative electrode In the state where the tab leads 40 with resin to be joined to the respective 52a are pulled out, the peripheral portions of the aluminum laminate films 51 are heat sealed and fused to enclose the power generating element 52.

  The resin-attached tab lead 40 includes a metal strip such as a copper strip 41 and a resin tape 32 as a resin member. The resin tape 32 is disposed at a heat seal portion of the aluminum laminate film 51 and is fused together with the aluminum laminate film 51 to ensure airtightness between the aluminum laminate film 51 and the tab lead 40 with resin. The detailed structure of the laminated Li ion secondary battery 50 and the tab lead 40 with resin will be described later.

(2) Manufacturing Method of Resin-equipped Tab Lead Next, a manufacturing method of the resin-attached tab lead 40 according to the first embodiment of the present invention will be described. The resin-attached tab lead 40 is manufactured using a metal strip manufacturing method and a resin tab-continuous manufacturing method. That is, the manufacturing method of the tab lead 40 with resin includes these manufacturing methods.

[Production method of metal strip]
First, the manufacturing method of the copper strip 20 as a metal strip according to the present embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a copper slit material 10 as a metal slit material used for manufacturing a metal strip according to the present embodiment. FIG. 2 is an enlarged cross-sectional view showing a side surface 10s in the width direction of the copper slit material 10 used for manufacturing the metal strip according to the present embodiment. FIG. 3 is a block diagram showing a constituent unit of the side surface forming apparatus 100 used for manufacturing the metal strip according to the present embodiment. FIG. 4 is a schematic configuration diagram of a drop-type plating apparatus 200 used for manufacturing the metal strip according to the present embodiment. FIG. 5 is a perspective view of a copper strip 20 as a metal strip according to the present embodiment.

(Cutting material preparation process)
First, a copper slit material 10 as a metal slit material shown in FIG. 1 is prepared. The copper slit material 10 is manufactured, for example, by slit processing in which a wide and long copper sheet (raw material) is sheared along the longitudinal direction with a predetermined narrow width by an apparatus such as a slitter.

  The thickness of the copper slit material 10 is, for example, not less than 0.1 mm and not more than 0.5 mm. As described above, when the thickness of the copper slit material 10 is 0.1 mm or more, a rolled material is generally used from the viewpoint of cost, but an electrolytic material may be used. In addition, pure copper is generally used for the application of the tab lead 40 with resin, but a copper alloy to which other elements are added may be used.

  The copper slit material 10 is subjected to a tempering treatment such as annealing for adjusting characteristics such as hardness and elongation. Such a tempering treatment is generally performed in a state of a copper sheet before slitting. By such a tempering treatment, the copper slit material 10 is in a state of being softened and reduced in hardness, for example, and if it is a pure copper-based copper slit material 10, for example, the elongation rate, that is, the elongation The allowable amount is 35% or more.

  The copper slit material 10 having a long and narrow shape by slit processing has a substantially rectangular cross section in the width direction, and each end portion 10c of the side surface 10s has a substantially square shape. However, the side surface 10s of the copper slit material 10 is subjected to the predetermined deformation described below by slit processing.

  As shown in FIG. 2, at least one or both of the side surfaces 10 s in the width direction of the copper slit material 10 are side surfaces 10 s generated by shearing by slit processing, and are sheared from the top to the bottom toward the paper surface. ing. On the side surface 10s generated by shearing, a sag, a sheared surface, and a fracture surface are generated in order from the top. In some cases, burrs are generated at the lower end 10c of the fracture surface.

  The “sag” is a portion where the upper surface of the copper sheet is pushed down by a shearing force and becomes rounded. Such sagging occurs in substantially the entire longitudinal direction of the upper end portion 10c of the side surface 10s of the copper slit material 10.

  The “shear surface” is a surface generated by cutting a copper sheet while generating a shift parallel to the shear direction by a shearing force. A substantially central portion of the side surface 10s of the copper slit material 10 is such a sheared surface. The shear surface is often a rough surface state.

  The “fracture surface” is a surface generated by completely cutting a copper sheet by a shearing force. The lower zone of the side surface 10s of the copper slit material 10 has such a fracture surface. The fracture surface is often a rougher surface state than the shearing surface.

  The “burr” is a portion generated when the lower surface side of the copper sheet is stretched downward when the copper sheet is completely cut off by the shearing force. The burr may have a sharp tip portion or may be in a state where it is relatively easy to drop off. In the lower end portion 10c of the copper slit member 10, such a burr may protrude from a part of the longitudinal direction or substantially the entire region.

  Thus, each edge part 10c of the side surface of the copper slit material 10 manufactured by slit processing has an angular shape. A burr may protrude from the lower end portion 10c. When such a copper slit material is applied to a tab lead with resin, as described above, the resin softened at the time of heat sealing cannot sufficiently wrap around the side surface, and the tab lead with resin is formed with an aluminum laminate film of a laminate type Li ion secondary battery. The airtightness at the heat-sealed portion is impaired.

  Nonetheless, the copper slit material is very thin, and is in a state of being easily softened and stretched by a tempering treatment, for example, and it is difficult to adopt a method of crushing an end portion or a burr as in Patent Document 1 described above. .

  Therefore, in the present embodiment, at least one end 10c is chamfered by the following method.

(Chamfering process)
In the present embodiment, the side surface forming apparatus 100 shown in FIG. 3 is used to polish the side surface 10s of the copper slit material 10 by polishing, and the first direction perpendicular to the front and back surfaces of the copper slit material in the width direction of the copper slit material. And the at least one end 10c are chamfered to form a second surface. The first surface is polished so that its thickness is less than 0.1 mm. In the following configuration, a case where all the end portions 10c of the side surface 10s of the copper slit material 10 are chamfered to form the second surface and the third surface will be described. Specifically, as shown in FIG. 5, the first surface 20s perpendicular to the main surface 20m (the surface of the copper slit material 10) is in contact with the main surface 20m and the first surface 20s, and burrs are generated. The third surface 202c formed on the side (upper side) that contacts the second surface 201c formed on the side (lower side), the main surface 20m, and the first surface 20s. Polishing process.
Here, forming the second surface and the third surface is a chamfering step, but it is sufficient that at least the second surface is formed by chamfering.

  As shown in FIG. 3, the side surface forming apparatus 100 includes a delivery unit 101 and a driving roller 109r on the most upstream side and the most downstream side in the apparatus. Accordingly, for example, the copper slit material 10 wound in a coil shape on a winding core or the like is configured to be conveyed from the most upstream delivery unit 101 to the most downstream drive roller 109r. For example, a plating apparatus 200 (see FIG. 4) may be connected in series (tandemized) further downstream of the drive roller 109r. In the middle of the side surface forming apparatus 100, chamfering units 103c, 105c and the like are provided, and the end portion 10c of the side surface 10s of the copper slit material 10 is configured to be chamfered. For example, each unit of the side surface molding apparatus 100 is controlled by the control unit 110 that is a computer or the like including a CPU or the like.

  Below, the chamfering process using the side surface shaping | molding apparatus 100 is demonstrated.

  First, the copper slit material 10 is delivered from the delivery unit 101 into the apparatus. For example, a brake roller 102r having a driving force opposite to the conveying direction is installed on the downstream side of the delivery unit 101, and an appropriate tension can be applied to the copper strip 20. The brake roller 102r is caused to cooperate with the drive roller 109r on the most downstream side, and is adjusted so that the copper slit material 10 is conveyed through the apparatus at a predetermined speed while applying a predetermined tension that does not cause permanent elongation. An accumulation unit (not shown) may be further provided at a necessary portion such as a downstream side of the delivery unit 101 or the driving roller 109r, and the copper slit material 10 may be decelerated and stopped to finely adjust the conveyance speed difference. According to the accumulation unit, it is possible to perform material exchange or the like while the apparatus is in operation. Moreover, you may provide an auxiliary stage etc. as needed.

  The copper slit material 10 that has passed through the brake roller 102r is conveyed to the chamfering unit 103c and further passed through the auxiliary roller 104r that is installed as necessary, to the chamfering unit 105c.

  The chamfering unit 103c is arranged slightly above the copper slit material 10 being conveyed, and one or more sets of abrasives such as a rotating grindstone and a rotating sandpaper arranged so as to straddle the width direction of the copper slit material 10 Prepare. Thereby, the upper end portions 10c of the copper slit material 10 are polished.

  The chamfering unit 105c is disposed slightly below the copper slit material 10 being conveyed, and one or more sets of abrasives such as a rotating grindstone and a rotating sandpaper disposed so as to straddle the width direction of the copper slit material 10 Prepare. Thereby, both lower end portions 10c of the copper slit material 10 are polished.

  Thus, when each edge part 10c of the copper slit material 10 is grind | polished, the load added to the copper slit material 10 and the grinding | polishing allowance of the copper slit material 10 are controlled. Such control is performed, for example, by adjusting the position of the chamfering units 103c and 105c, the chamfering angle of the abrasive, the rotational speed, the number of combinations, and the like.

  Specifically, the chamfering units 103c and 105c are each fixed with an abrasive provided at a predetermined chamfering angle, for example, 45 ° or less with respect to the upper and lower surfaces which are the main surfaces of the copper slit material 10, 105 c is operated in parallel with the longitudinal direction of the copper slit material 10. The load of each set of abrasives is adjusted according to the thickness of the copper slit material 10. At this time, for example, the load is 500 weight grams (also referred to as gf: gram weight) or less. When the amount of polishing increases due to the copper slit material 10 becoming thick or the like, it is preferable not to increase the load but to increase the number of combinations of abrasives, for example. Thereby, it can suppress that the copper slit material 10 deform | transforms or position shifts.

  Thus, each chamfering unit 103c, 105c has a function of performing the adjustment as described above. Alternatively, it may be controlled by the control unit 110 having such a function.

  As described above, at least one end portion 10c of the side surface 10s of the copper slit material 10 is removed, and the first surface 20s and the second surface 201c are formed. Further, at least a part of the fracture surface, the sheared surface, and the sagging is removed. Moreover, when the burr | flash has generate | occur | produced, at least one part of a burr | flash is removed.

  When the side surface 10s of the copper slit material 10 is polished perpendicularly to the main surface to form the first surface 20s, for example, a chamfering unit (not shown) in which the chamfering angle is fixed at 90 ° with respect to the main surface is added. Thus, the shearing surface and the fracture surface are more reliably removed.

  Further, the polishing in these chamfering units may be performed by a dry method, or may be performed by a wet method using a water-resistant abrasive or a polishing unit while applying water or a cooling liquid (coolant).

  The copper slit material 10 whose edges are chamfered by the chamfering units 103 c and 105 c is passed through an auxiliary roller 106 r installed as necessary, and then conveyed to the finishing unit 107 and further to the cleaning unit 108.

  In the finishing unit 107, for example, the surface including the side surface 10 s of the copper slit material 10 is polished with rotating buffs disposed above and below the copper slit material 10, finer abrasive material, or the like while water is applied to the copper slit material 10. Thereby, for example, the corners formed by chamfering are smoothed. In the cleaning unit 108, for example, pure water is sprayed on the copper slit material 10 at a pressure of about 0.2 MPa to perform cleaning.

  Thus, the process of chamfering the end portion 10c of the copper slit material 10 is completed.

(Plating layer forming process)
Subsequently, a plating layer such as nickel (Ni) is formed on the surface of the copper slit material 10 that has been chamfered by the above-described chamfering process using the plating apparatus 200 shown in FIG. At this time, for example, a full-plated copper strip in which a plating layer is formed on substantially the entire surface of the copper slit material 10 may be used.

  As shown in FIG. 4, the plating apparatus 200 includes a delivery part 201 and a take-up part 209 on the most upstream side (side forming apparatus 100 side in the case of tandem) and the most downstream side in the apparatus. For example, it is configured to convey the copper slit material 10 wound in a coil shape. The plating apparatus 200 includes a Ni plating bath 206 and a plurality of drop-type (vertical) treatment baths in which, for example, the copper slit material 10 is immersed to perform each treatment, and the chamfered copper slit material. 10 is configured to form a plating layer on the surface. For example, each unit of the plating apparatus 200 is controlled by a control unit 210 that is a computer or the like including a CPU or the like.

  Below, the plating layer formation process using the plating apparatus 200 is demonstrated.

  First, the copper slit material 10 is sent from the delivery unit 201 into the apparatus, and sequentially conveyed to the degreasing tank 202, the chemical polishing tank 203, the acid cleaning tank 204, and the copper plating tank 205.

  In the degreasing tank 202, for example, alkali degreasing or electrolytic degreasing is performed to remove oil and dirt on the surface of the copper slit material 10. In the chemical polishing tank 203, the surface of the copper slit material 10 is chemically polished using, for example, a hydrogen peroxide-based liquid. Thereby, favorable surface quality is obtained and the quality of the plating layer required for the final product can be improved. In the acid cleaning tank 204, acid cleaning is performed with, for example, a 10% sulfuric acid aqueous solution. In the copper plating tank 205, a short copper plating process (copper strike plating process) is performed to form a very thin copper plating layer.

  When the copper plating layer is formed as a base, the copper slit material 10 is conveyed to the Ni plating tank 206. In addition, illustration is abbreviate | omitted about the collection tank which each plating tank 205,206 is equipped and collect | recovers a waste liquid, and the processing tank which is arrange | positioned between each plating tank 205,206 and performs washing with water.

  In the Ni plating tank 206, for example, a Ni plating layer (not shown) as a plating layer is formed on the surface of the copper slit material 10. For example, the Ni plating layer is formed to a thickness of 1 μm or more at the center in the width direction of each main surface (front and back surfaces) of the copper slit material 10. Accordingly, the thickness is sufficient to suppress the influence of pinholes generated in the plating layer when the plating layer is formed. However, the required glossiness of the surface and the thickness of the Ni plating layer differ depending on the use of the final product. For this reason, the specification of the Ni plating tank 206 may be changed.

  However, it is difficult to greatly change the conveyance speed of the copper slit material 10 in consideration of the treatment before and after the Ni plating tank. When the plating apparatus 200 is tandem with the side surface forming apparatus 100, there is also a balance with the side surface forming apparatus 100. Therefore, when the thickness of the Ni plating layer varies over a wide range, the Ni plating tank 206 preferably has a variable size (conveyance distance in the Ni plating tank 206).

  Next, the copper slit material 10 on which the Ni plating layer is formed is conveyed to the cleaning tank 207 and further to the dryer 208.

  In the cleaning tank 207, for example, pure water is sprayed on the copper slit material 10 at a pressure of about 0.2 MPa to perform cleaning. In the dryer 208, the copper slit material 10 is dried at a predetermined temperature for a predetermined time.

  Thereafter, the copper slit material 10 is wound around the winding portion 209, and the plating layer forming step is completed.

  In addition, by connecting the side surface forming apparatus 100 and the plating apparatus 200 in series to form a tandem, after the cleaning by the side surface forming apparatus 100, the copper slit material 10 is continuously wetted to the plating apparatus 200. Can be transported. Thus, for example, since the copper slit material 10 is sent to the next process without being dried, the plating layer can be formed while suppressing the occurrence of qualitative modification such as oxidation on the surface of the copper slit material 10. it can.

  As described above, the copper strip 20 as the metal strip according to the present embodiment shown in FIG. 5 is manufactured.

  The long copper strip 20 manufactured as described above includes the second surface 201c and the third surface in which the respective end portions 10c of the side surface 10s of the copper slit material 10 generated by the slit processing are removed by chamfering. 202c is provided on both sides in the width direction. The copper strip 20 includes first surfaces 20s that are substantially perpendicular to the main surfaces 20m of the copper strip 20 on both sides in the width direction.

  In the present embodiment, since the second surface 201c is formed by removing at least one of the angular end portions 10c of the copper slit material 10 by the chamfering step, a plating layer having a uniform thickness and quality is easily formed. . Moreover, it can suppress that the plating layer of the edge part 10c is damaged or peeled off by friction etc., after applying to various processes after a plating layer formation process, or uses, such as the above-mentioned tab lead 40 with resin.

  Thereby, it can suppress that the copper strip 20 is exposed and corroded by corrosive external air. When the copper strip 20 is applied to, for example, the tab lead 40 with resin of the laminated Li ion secondary battery 50, corrosion due to the electrolyte solution can be suppressed. Therefore, it can suppress that the airtightness in the heat-sealed part of the tab lead 40 with resin is impaired and ventilates.

  In addition, the formed plating layer has a rough surface compared to other surfaces, particularly at the fracture surface, and the plating pretreatment is very difficult and the plating layer is easily peeled off, and is formed on the side surface of the copper slit material. However, it is possible to suppress these by forming the second surface and the third surface by polishing.

  In the present embodiment, at least a part of the fracture surface, sheared surface, sagging, and burrs having a rough surface state is removed by the chamfering process described above, so that the above various effects on the plating layer can be further obtained. It is easy to be done.

[Manufacturing method of resin-coated tab lead continuum]
Next, the manufacturing method of the continuous body 30 of the tab lead with resin which concerns on this embodiment is demonstrated using FIGS. FIG. 6 is a block diagram showing a structural unit of the resin pasting apparatus 300 used for manufacturing the continuous body 30 of resin-equipped tab leads according to the present embodiment. FIG. 7 is a cross-sectional view illustrating a state in which a resin member is attached to the metal strip according to the present embodiment. FIG. 8 is a perspective view of the continuous body 30 of the resin-attached tab lead according to the present embodiment.

(Resin member pasting process)
In the manufacturing method of the continuous body 30 of the resin-attached tab lead, the step of attaching the resin tape 32 as a belt-like resin member is performed using the resin attaching device 300 shown in FIG.

  As shown in FIG. 6, the resin pasting apparatus 300 includes a delivery part 301 and a take-up part 309 on the most upstream side and the most downstream side in the apparatus, for example, a long copper coil wound in a coil shape. It is configured to transport the strip 20. In the middle of the resin pasting apparatus 300, a pasting unit 304, a crimping unit 306, and the like are provided, and the resin tape 32 is pasted on the copper strip 20. For example, each part of the resin sticking apparatus 300 is controlled by the control part 310 which is a computer etc. which consist of CPUs.

  Below, the resin member sticking process using the resin sticking apparatus 300 is demonstrated.

  First, the copper strip 20 is sent out from the delivery unit 301 into the apparatus. For example, a brake roller 302r having a driving force opposite to the conveying direction is installed on the downstream side of the delivery unit 301, and an appropriate tension can be applied to the copper strip 20. The brake roller 302r is caused to cooperate with the winding portion 309 on the most downstream side, and adjusted so that the copper slit material 10 is conveyed through the apparatus at a predetermined speed while giving a predetermined tension that does not cause permanent elongation. An accumulation unit (not shown) may be further provided at a necessary portion such as the downstream side of the feeding unit 301 and the winding unit 309, and the copper strip 20 may be decelerated and stopped to finely adjust the conveyance speed difference. According to the accumulation unit, it is possible to perform material exchange or the like while the apparatus is in operation. Moreover, you may provide an auxiliary stage etc. as needed.

  The copper strip 20 passed through the brake roller 302r is conveyed to the heating unit 303, and the copper strip 20 is heated to a temperature at which the resin tape 32 can be temporarily bonded.

  Next, the resin tape 32 is affixed to the copper strip 20 by the affixing unit 304 while the copper strip 20 having reached a predetermined temperature is pulled at a predetermined pitch by the gripper unit 304 g further downstream of the affixing unit 304. Here, temporary adhesion before pressure bonding of the resin tape 32 described later is performed.

  The resin tape 32 is cut into a tape shape with a predetermined length and a predetermined width in advance. As a material of the resin tape 32, for example, a resin having no adhesiveness at room temperature, that is, a resin having no room temperature tackiness can be used. Here, the absence of room temperature tackiness means that, for example, a 90 ° peel strength when peeled in a 90 ° tensile direction is about 10 N / m on a member attached at a temperature of 20 ° C. to 25 ° C. It refers to something less than.

  As described above, examples of the resin that does not have room temperature tackiness and has thermoplasticity that generates fluidity when heated and can be thermally fused include polyolefin resins such as polypropylene (PP) resin. Further, as described above, a thermoplastic polyolefin-based resin layer may be interposed on the side in contact with the copper strip 20 as the adhesive layer at the time of temporary adhesion. These resins having no room-temperature tackiness are excellent in chemical resistance and the like, and are proven materials for use in laminated Li-ion secondary batteries.

  When the resin tape 32 is affixed to the copper strip 20, the resin tape 32 crosses the longitudinal direction of the copper strip 20 on the upper surface side and the lower surface side of the copper strip 20 by a drawing mechanism provided in the pasting unit 304. Pull out each one. Further, the resin tape 32 pulled out by the pulling mechanism is pressed by the pressing unit included in the pasting unit 304 so as to be sandwiched from above and below the copper strip 20. And by the cutting mechanism with which the bonding unit 304 is provided, the upper and lower resin tapes 32 protruding from both ends in the width direction of the copper strip 20 are sandwiched (clamped), and the resin tapes 32 are bonded to each other. Separate.

  As a result, as shown in FIG. 7, the two resin tapes 32 are pasted so as to sandwich the copper strip 20 from the upper and lower surfaces, and the edges of the resin tape 32 protruding from both ends of the copper strip 20 are pasted together. It becomes a state.

  Each mechanism of the affixing unit 304 repeats the above operation so that the resin tape 32 is affixed to the copper strip 20 at a predetermined pitch as the gripper unit 304 g pulls the copper strip 20. The gripper unit 304g may have a function of calculating a take-off amount that determines a next attachment position of the resin tape 32 on the basis of the position of the attached resin tape 32. Alternatively, it may be controlled by the control unit 310 having such a function.

  Next, the auxiliary roller 305r installed as necessary is passed, and the copper strip 20 with the resin tape 32 attached is conveyed to the crimping unit 306 and further to the cutting unit 307.

  In the crimping unit 306, the resin tape 32 attached to the copper strip 20 as a temporary bond is crimped. That is, crimping is performed at a predetermined temperature, pressure, and time with a crimping head having a shape matching the chamfered shape of the copper strip 20. At this time, it is preferable to perform pressure bonding in the order of pressurization, temperature increase, temperature maintenance, temperature decrease, and pressure release. Further, it is preferable to perform pressure bonding under reduced pressure. Moreover, you may crimp | bond the some resin tape 32 at once.

  In the cutting unit 307, the edges of the resin tape 32 protruding from both ends of the copper strip 20 are cut to a predetermined length based on the width of the copper strip 20. As described above, the resin tape 32 is attached to the copper strip 20.

  After that, the auxiliary roller 308r installed as necessary is passed, and the copper strip 20 on which a plurality of resin tapes 32 are bonded at a predetermined pitch is wound by the winding unit 309, and the resin member bonding step is completed. To do.

  Thus, the continuous body 30 of the resin-attached tab lead according to this embodiment shown in FIG. 8 is manufactured.

  The resin-coated tab lead continuum 30 manufactured as described above includes a copper strip 20 and a plurality of resin tapes 32 provided on the copper strip 20 at a predetermined pitch and covering the copper strip 20 with a predetermined width in the width direction. Prepare.

(Metal strip cutting process)
Next, a method of obtaining the resin-attached tab lead 40 according to the present embodiment from the continuous tab lead 30 with resin will be described with reference to FIG.

  (A) of FIG. 9 is a perspective view of the tab lead 40 with resin which concerns on this embodiment, (b) is AA sectional drawing of (a).

  In this embodiment, the copper strip 20 provided in the continuous body 30 of resin-attached tab leads 30 is cut into copper strips 41 including one or more resin tapes 32, thereby producing the tab lead 40 with resin shown in FIG.

  Such a metal strip cutting process may be performed using the resin sticking apparatus 300 by providing a cutting unit in the resin sticking apparatus 300 described above. In this case, the copper strip 20 to which the resin tape 32 is attached is cut by the cutting unit without being wound by the winding portion, and the cut copper strips 41 are stored one by one in a tray, for example.

  As described above, the resin-attached tab lead 40 according to this embodiment shown in FIG. 9 is manufactured.

(3) Configuration of Tab Lead with Resin The strip-shaped tab lead with resin 40 manufactured as described above is provided with a plurality of copper strips 41 and copper strips 41 at a predetermined pitch, as shown in FIG. A resin tape 32 is provided as a belt-shaped resin member that covers the copper strip 41 with a predetermined width in the width direction.

  The copper strip 41 included in the resin-attached tab lead 40 includes a second surface 411c and a third surface 412c in which the respective end portions 10c of the side surface 10s of the copper slit material 10 generated by slit processing are removed by chamfering in the width direction. Prepare on both sides. An angle θ between each main surface (front and back surfaces) 41m of the copper strip 41 and the second surface 411c and the third surface 412c is, for example, 45 ° or less. The cross-sectional shapes of the second surface 411c and the third surface 412c are, for example, 0.05R or more or 0.05C or more.

  The copper strip 41 includes first surfaces 41 s that are substantially perpendicular to the main surfaces 41 m of the copper strip 41 on both sides in the width direction. The first surface 41 s may be a surface that is not chamfered, that is, a sheared surface or a fractured surface generated by slit processing remains as it is. Alternatively, it may be a polished surface with a chamfering angle of 90 ° with respect to the main surface 41m.

  Thus, in the tab lead with resin 40 according to the present embodiment, at least one of the angular end portions 10c generated by the slit processing is removed by chamfering. Further, at least a part of the fracture surface, the sheared surface, the sagging, and the burrs are removed by chamfering the end portion 10c of the side surface 10s of the copper slit material 10.

  Moreover, the thickness of the copper strip 41 with which the resin-attached tab lead 40 is provided is, for example, not less than 0.1 mm and not more than 0.5 mm. Moreover, the width | variety of the thickness direction of 1st surface 41s of the copper strip 41 is 0.1 mm or less, for example. Moreover, when it is the pure copper-type copper strip 41 etc., the allowable amount of elongation (elongation rate) may become 35% or more, for example, by annealing.

  Further, for example, a plated layer of Ni or the like is formed on the surface of the copper strip 41 including the second surface 411c from which the fracture surface has been removed. The thickness of the plating layer is, for example, 1 μm or more at the center in the width direction of the main surface 41 m of the copper strip 41.

  In the above description, the metal strip used for the tab lead 40 with resin is the copper strip 41. The copper strip 41 according to the present embodiment is in a softened state after being subjected to a tempering treatment, for example, but is harder than many other members such as aluminum. For this reason, a burr | flash etc. are easy to arise and a process is also difficult, and the above-mentioned subject tends to arise.

  However, as a material for the metal strip, other metals such as aluminum, alloys thereof, and the like can also be used. In this case, for example, an aluminum slit material is used as a starting material, and chamfering is performed in the same procedure as described above to produce an aluminum strip, and a resin tape is applied to form a continuous body of tab leads with resin, and further this is cut. A tab lead with resin made of aluminum can be used.

(4) Laminated Li-ion Secondary Battery Next, a laminated lithium (Li) ion secondary battery 50 including the tab lead with resin 40 according to the present embodiment will be described with reference to FIG.

  As shown in FIG. 10, the laminated Li-ion secondary battery 50 includes, for example, a power generation element 52 that is a laminate including a positive electrode 52 c, a negative electrode 52 a, and an electrolyte 52 e between two aluminum laminate films 51 as an exterior. Contained and enclosed structure. In the drawing, the electrolyte 52e is depicted as a film-like member such as an electrolyte polymer, but an electrolyte solution may be enclosed. The two laminated aluminum laminate films 51 have, for example, a three-layer structure including a polyethylene terephthalate (PET) resin layer, an aluminum layer, and a polypropylene (PP) resin layer from the outside. By heat-sealing the peripheral portions of the overlapped aluminum laminate film 51, the softened polypropylene resin layers are fused together to form a seal portion 51s. As a result, the power generation element 52 and the electrolyte solution are sealed in the two aluminum laminate films 51.

  Further, a tab lead 40c with resin for positive electrode is joined to the positive electrode 52c, and a tab lead 40a with resin for negative electrode is joined to the negative electrode 52a. These tab leads 40c, 40a with resin are heat-sealed in a state of being drawn out between the two aluminum laminate films 51. At this time, the resin tapes 32c and 32a included in the resin-attached tab leads 40c and 40a are arranged at positions overlapping the seal portion 51s. The polyolefin resin such as polypropylene resin constituting the resin tapes 32c and 32a is softened during heat sealing, so that it is fused with the polypropylene resin layer included in the aluminum laminate film 51. Therefore, the sealing performance (airtightness) of the sealing portion 51 s constituted by the resin-attached tab leads 40 c and 40 a and the aluminum laminate film 51 is ensured.

  The tab lead 40c with resin for the positive electrode includes, for example, an aluminum strip 41c as a metal strip and a resin tape 32c as a strip-shaped resin member that covers the aluminum strip 41c with a predetermined width in the width direction. The resin-attached tab lead 40a for the negative electrode includes, for example, a copper strip 41a as a metal strip and a resin tape 32a as a strip-shaped resin member that covers the copper strip 41a with a predetermined width in the width direction.

  As described above, when the laminated Li ion secondary battery 50 is heat-sealed, the resin tape 32 of the resin-attached tab lead 40 superimposed on the seal portion 51 s is also heated to exhibit thermoplasticity (heating fluidity). Soften. The softened resin of the resin tape 32 has fluidity and flows along the outer periphery of the metal strip constituting the resin-attached tab lead 40 by pressurization during heat sealing.

  In the present embodiment, since at least one end of the metal slit material is removed by the chamfering process described above, the angular end becomes a bottleneck with respect to the resin having the fluidity of the resin tape 32. This can be suppressed. Therefore, the resin can smoothly flow into the side surface of the metal strip, and can be distributed evenly over the entire outer periphery of the metal strip. Therefore, the thickness of the resin tape 32 can be sufficiently obtained on the side surface of the metal strip, and the occurrence of a gap between the side surface and the resin tape 32 can be suppressed.

  Such an effect can also be obtained when the resin tape 32 is pressure-bonded to the metal strip in the above-described resin member attaching step.

  Moreover, the following effects are also recognized at the time of heat sealing of the laminated Li ion secondary battery 50. That is, at the time of heat sealing, the polypropylene resin layers of the two aluminum laminate films 51 are also softened. In the metal strip having the chamfered end portion according to the present embodiment, the softened polypropylene resin layer is suppressed from being pushed away by the angular end portion.

  As described above, the resin tape 32 and the aluminum laminate film 51 are sufficiently wrapped around the side surface of the metal strip, so that the aluminum laminate film 51 and the resin tape 32 are more reliably fused and airtight between them. Improves. Therefore, it can suppress that the airtightness by heat sealing is impaired and it ventilates, and that the electrolyte solution, the reaction product by charging / discharging of a battery, etc. leak out of a battery. Moreover, it can suppress that it short-circuits by the abnormal proximity | contact and contact of the aluminum layer of the aluminum laminated film 51, and the metal part of the tab lead 40 with resin.

  In the present embodiment, the width in the thickness direction of the side surface 10s of the copper slit material 10 is set to 0.1 mm or less by the above-described chamfering process, and this makes it easier to obtain the various effects described above.

  In the present embodiment, the chamfering step described above removes at least part of the fractured surface, the sheared surface, the sagging, and the burr having a rough surface state together with the angular end portion. Various effects are more easily obtained.

  Further, in the present embodiment, even if burrs are generated, they can be removed together with the end portions, and therefore, for example, burrs are prevented from dropping in the battery and coming into contact with the power generation element 52 to be short-circuited. it can.

(5) Effects of the present embodiment According to the present embodiment, one or more of the following effects are achieved.

(A) According to the present embodiment, at least one end 10c of the side surface of the copper strip 41 covered with the resin tape 32 is removed from the tab lead 40 with resin to form the second surface 411c.

  This facilitates a smooth flow of the resin tape 32 to the first surface 41 s of the copper strip 41 caused by the softening of the resin tape 32 during heat sealing when incorporated into the laminated Li-ion secondary battery 50, Good airtightness can be obtained.

  Therefore, even when the thin resin tape 32 is used, good airtightness can be obtained. Alternatively, even when a thick resin tape 32 is used, it is easy to attach to the copper strip 20, and good airtightness can be obtained. Therefore, workability during heat sealing and stability of heat sealing can be improved.

(B) Moreover, in the manufacturing process of the tab lead 40 with resin, when the resin tape 32 is pressure-bonded to the copper strip 20, the same effect as described above with respect to the resin is obtained.

(C) Further, during heat sealing, the softened resin layer of the aluminum laminate film 51 is suppressed from being pushed away by the angular end portion 10c, and good airtightness can be obtained.

(D) Moreover, according to this embodiment, the width | variety of the thickness direction of the 1st surface 41s of the copper strip 41 is 0.1 mm or less. Thereby, at the time of heat sealing, the wrapping of the softened resin into the first surface 41s of the copper strip 41 is further promoted. Further, the wraparound of the resin at the time of pressure bonding is further promoted.

(E) Further, by setting the width in the thickness direction of the first surface 41 s of the copper strip 41 to 0.1 mm or less, it becomes easy to attach the resin tape 32 even when the copper strip 41 is thick. The resin tape 32 can be affixed by an operation substantially equivalent to that for a copper strip of 0.1 mm or less.

(F) Further, according to the present embodiment, at least a part of the fractured surface, the sheared surface, the sagging, and the burr generated by the slit processing is removed. Thereby, said effect further increases.

(G) Further, according to the present embodiment, by removing the burrs, for example, the resin tape 32 is affixed in a state where the burrs are about to fall off, and the airtightness may be impaired. It is possible to suppress the burr from falling off and coming into contact with the power generation element 52 and causing a short circuit.

(H) Further, according to the present embodiment, the chamfering of the end portion 10 c of the side surface 10 s of the copper slit material 10 is performed by polishing using the side surface forming apparatus 100. At this time, the load of each abrasive is set to 500 gf or less. As a result, the thickness of the copper slit material 10 is as thin as 0.1 mm or more and 0.5 mm or less, and the allowable amount of elongation (elongation rate) is 35% or more, so that the soft and easily deformable copper slit material 10 is prevented from being displaced or deformed. However, chamfering can be performed to obtain a shape capable of obtaining the predetermined effect of the present embodiment.

As a confirmation of the effect, the width in the thickness direction of the first surface 41 s of the 0.2 mmt copper strip 41 is less than 0.05 mm, 0.05 mm or more to less than 0.10 mm, 0.10 mm or more to 0.15 mm. Less than 5 pieces each of 0.15 mm or more, and the first surface 41 s of the copper strip 41 when the resin tape 32 made of polypropylene having the same thickness is attached to the same while changing the thickness. The presence or absence of voids generated in the vicinity of was confirmed. The results are shown in Table 1. Thus, it has been found that it is effective to use a resin tape 32 having a thickness equal to or greater than the thickness of the first surface 20s of the copper strip 20 in order to prevent the generation of voids. In order to reduce the thickness of the resin tape 32, it is effective to reduce the thickness of the first surface 20 s of the copper strip 20, and the first of the copper strip 20 with respect to the thickness of the resin tape 32. This indicates that the thinner the surface 20s, the more margin there is for voids.

(I) According to the present embodiment, the copper slit material 10 formed by simple slit machining is used as a starting material, although the side surface 10s has a rough side surface 10s having a sheared surface and a fracture surface. Thus, the cost of the copper strip 20 can be suppressed. Moreover, such a copper slit material 10 has an advantage that it is easily available.

(J) Also, according to the present embodiment, in the formation of the plating layer using electrolytic plating, the angular end portion 10c where the electric field tends to concentrate is removed, so that the thickness of the plating layer such as Ni can be reduced. The uniformity of quality can be improved. Further, even after the plating layer is formed, the plating layer can be prevented from being damaged or peeled off by friction or the like.

(6) Modified example of this embodiment Next, as a modified example of this embodiment, the case where the shape of the side surface of the copper strip 41 included in the tab lead 40 with resin is made different from the mounting mode of the resin tape 32 is made different. In the following, the case will be described.

(Modification related to the side of the metal strip)
As shown in FIG. 11A, the copper strip 41 included in the resin-attached tab lead 40 according to the above-described embodiment has a second angle θ of, for example, 45 ° or less with respect to each main surface 41m. The surface 411c and the 3rd surface 412c, and the 1st surface 41s substantially perpendicular | vertical with respect to each main surface are provided. Various modifications to this will be described with reference to FIG. FIG. 11 is an enlarged cross-sectional view showing various modifications of the copper strip 41 provided in the tab lead 40 with resin according to the present embodiment.

  The copper strip 42 shown in FIG. 11B has a predetermined roundness at each corner formed by chamfering. That is, the interface between each main surface 42m and the second surface 421c and the third surface 422c, and the interface between the first surface 42s and the second surface 421c and the third surface 422c are formed of continuous curved surfaces. . At this time, the curvature radius of each curved surface is set to 0.03 or more, for example. For example, in the chamfering step, such a shape allows each corner portion of the copper slit material obtained by passing each chamfering unit to obtain the shape shown in FIG. It is obtained by polishing with a fine abrasive.

  In the copper strip 43 shown in FIG. 11C, the chamfering amount is varied on the main surface 43m side. The difference in the chamfering amount is shown in FIG. Such a shape can be obtained, for example, by varying the chamfering angle, rotational speed, number of combinations, load, and the like of the abrasive in each of the above-described chamfering units.

  The second surface 411c, the third surface 412c, the second surface 431c, and the third surface 432c described above may be formed not only in a flat surface but also in a curved surface that draws a gentle arc or curve.

  As mentioned above, according to the application etc. which were applied, various deformation | transformation was further given from the copper strips 41-43 of various shapes shown to FIG.11 (a)-(c), and these copper strips 41-43. A copper strip can be selected as appropriate.

(Modifications related to resin members)
In the tab lead with resin 40 according to the above-described embodiment, two resin tapes 32 are bonded to the upper and lower surfaces of the copper strip 41 as shown in FIG. Various modifications to this will be described with reference to FIG. FIG. 12 is a cross-sectional view showing various modifications of the resin tape 32 included in the tab lead 40 with resin according to the present embodiment.

  In the modification shown in FIG. 12 (b), the first resin tape 33a completely covers one main surface of the copper strip, and the edge of the resin tape 33a is at the end of the other main surface. It is provided as such. Thereby, the resin tape 33a can be adhered to the side surface of the copper strip, and the airtightness is further improved. The second resin tape 33b is provided so as to cover each edge of the first resin tape 33a and the surface of the copper strip exposed therebetween. The second resin tape 33b may further cover part or all of the resin tape 33a covering the opposite surface. Thereby, the thickness of the resin tape on the side surface is increased, and the shortage of the amount of resin that flows during heat sealing can be compensated.

  In the modification shown in FIG. 12C, only one resin tape 34 is attached to the outer periphery of the copper strip, and the edges of the resin tape 34 are attached in the vicinity of one side surface of the copper strip. It is matched. At this time, it is preferable to loosen and crush the resin tape 34 in the vicinity of the other side surface so that the vicinity of both side surfaces has the same shape as possible. Alternatively, as in the modification shown in FIG. 12 (d), the edges of the single resin tape 35 attached to the outer periphery of the copper strip are overlapped on one main surface of the copper strip. Also good. Alternatively, as in the modification shown in FIG. 12E, one resin tape 36 may be wound around the outer periphery of the copper strip a plurality of times. Thereby, the thickness of the resin tape 36 can be made more uniform over the entire circumference of the copper strip.

  As described above, the resin tapes 32 to 36 of each aspect shown in FIGS. 12A to 12E and the resin tapes further modified from these resin tapes 32 to 36 according to the application to be applied. Can be appropriately selected.

<Second Embodiment of the Present Invention>
In the above-described embodiment, the resin-attached tab lead 40 and its continuous body 30 are configured using the resin tape 32 made of a resin having no room temperature tackiness. In contrast, in the second embodiment of the present invention, a resin-free tab lead and a continuous body thereof are configured by using a resin having no room temperature tack and a resin having room temperature tack for a resin tape.

  Hereinafter, a tab lead with resin according to the present embodiment, a continuous body thereof, and a manufacturing method thereof will be described with reference to FIGS. FIG. 13 is a perspective view of a continuous body 130 of resin-equipped tab leads according to the present embodiment. FIG. 14A is a perspective view of the resin-attached tab lead 140 according to this embodiment, and FIG. 14B is a cross-sectional view taken along line AA of FIG. 13 and 14, configurations having the same functions as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 14B, in the resin-coated tab lead 140 according to the present embodiment, the resin tape 132 that covers the copper strip 41 that has been chamfered and cut into strips in the width direction in the same manner as the above-described embodiment. Includes an outer layer 132t made of a resin having no room temperature tack property and an inner layer 132b made of a resin having a room temperature tack property on the side in contact with the copper strip 41.

  Here, the absence of room temperature tackiness refers to a material having a 90 ° peel strength of less than about 10 N / m when pasted at a temperature of 20 ° C. or more and 25 ° C. or less, for example. Examples of the resin having no room temperature tackiness include polyolefin resins. The term “room temperature tackiness” refers to a material having a 90 ° peel strength of about 10 N / m or more when pasted at a temperature of 20 ° C. or more and 25 ° C. or less. Examples of the room temperature tacky resin include acrylic resins used as an adhesive material.

  In order to manufacture the tab lead 140 with resin, the resin tape 132 is affixed to the copper strip 20 that has been chamfered in the same manner as the above-described embodiment. In the pasting of the resin tape 132, the resin pasting apparatus 300 can be used as in the above-described embodiment.

  At this time, it is preferable to cut the resin tape 132 into a tape shape having a predetermined length and a predetermined width after the outer layer 132t and the inner layer 132b are laminated in advance.

  A plurality of resin tapes 132 are affixed to the copper strip 20 at a predetermined pitch using the resin affixing device 300 in the same procedure as in the above-described embodiment. However, in the present embodiment, the application of the resin tape 132 by the application unit 304 can be temporarily bonded at room temperature. In this case, the heating unit 303 can be eliminated, and the step of heating the copper strip 20 in the heating unit 303 can be omitted.

  In this way, the continuous body 130 of the resin-attached tab lead shown in FIG. 13 is manufactured.

  Subsequently, when the copper strip 20 is cut so as to be the copper strip 41 having one or more resin tapes 132, the tab lead 140 with resin shown in FIG. 14 is manufactured.

  As described above, a resin having no room temperature tackiness is excellent in chemical resistance and has a reputation for use in a laminated Li-ion secondary battery. Moreover, since it does not have adhesiveness at normal temperature, it is convenient for handling before and after being attached to the copper strip 41. However, on the other hand, when only such a resin is used for a resin tape, when affixing to a metal strip such as a copper strip, a primer for improving the adhesive property of the resin tape is applied to the surface of the metal strip, etc. In some cases, the primer treatment was required.

  In the present embodiment, since the resin tape 132 includes the outer layer 132t having no room temperature tack property and the inner layer 132b having the room temperature tack property, the adhesiveness on the surface side in contact with the copper strip 41 is maintained even at the stage of temporary adhesion. improves. Thereby, the above-mentioned primer treatment and the temperature raising step by the heating unit 303 can be omitted. Further, when the resin tape 132 is temporarily bonded to the copper strip 20, the positional deviation of the resin tape 132 can be suppressed.

  In the above configuration, the resin tape only needs to be made of a resin having at least an outside temperature-free tack property, and at least a surface side in contact with the metal strip being made of a resin having an ordinary temperature tack property. Therefore, one or more other layers made of a resin having various characteristics, including the presence or absence of room temperature tackiness, may be interposed between the outer layer and the inner layer. Thereby, in addition to the above-described effects, the resin tape can exhibit various effects including further improvement of airtightness.

<Other Embodiments of the Present Invention>
As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

  For example, in the above-described embodiment, in the chamfering step, all four end portions 10c of the side surface 10s of the copper slit material 10 are chamfered. However, it is sufficient that at least one of the end portions is removed.

  In the above-described embodiment, chamfering is performed over the entire length direction of the copper slit material 10, but chamfering is performed only on a part of the region, for example, a portion where the resin tape is to be attached. Even if it is performed, a predetermined effect can be obtained.

  In the above-described embodiment, the copper slit material 10 is subjected to slit processing by shearing from one direction of the copper sheet. However, the copper slit material 10 is sheared from both the upper and lower directions of the copper sheet, for example, when being cut with scissors. It may be. Also by such a method, each edge part of a side surface becomes a substantially square shape, and a predetermined effect is acquired by applying this invention.

  In the above-described embodiment, the chamfering of the end portion 10c of the copper slit material 10 is performed by polishing, but may be performed by repeating the cutting process little by little with a tool tool such as a blade or a bite. . Further, polishing may be combined as a finish.

  Moreover, in the above-mentioned embodiment, although each processing tank with which the plating apparatus 200 is provided was made into the vertical system, it may be set as a horizontal system, or each system may be mixed according to a processing tank.

  In the above-described embodiment, the Ni plating layer is formed, but an alloy containing Ni may be used. In addition to Ni, various materials such as Au, Sn, Ag, Pd, and Ti can be used alone, alloyed, or laminated.

  Moreover, in the above-mentioned embodiment, although it was set as the whole surface plating copper strip which forms a plating layer in the substantially whole surface, for example, a plating layer is only in a part of copper strip, such as a part where a resin tape will be stuck. It may be formed. Thereby, at least the part to which the resin tape is attached is smoothed, and the airtightness can be further improved. Further, depending on the application, the plating layer may not be formed at all on the copper strip.

  In the above-described embodiment, the copper strip 20 is cut after the resin tape 32 is pasted on the copper strip 20, but the resin tape may be pasted on each piece of copper strip after the cutting. .

  In the above-described embodiment, polypropylene resin or the like is used as the material of the outer layer 132t of the resin tape 32 or the resin tape 132. However, as the resin used for the resin tapes 32 and 132, other than this, for example, high Polyethylene resins such as high-density polyethylene, low-density polyethylene, low-density polyethylene, linear low-density polyethylene, polyethylene-based vinyl acetate copolymer resins, and ionomers can be used.

  In the above-described embodiment, the resin-attached tab leads 40 and 140 are used for the laminated Li-ion secondary battery 50. However, the use of the resin-attached tab leads is not limited to this, for example, an electric double layer capacitor or the like. Can also be used.

10 Copper slit material (metal slit material)
10c End 10s Side 20 Copper strip (metal strip)
30 Continuation of tab lead with resin 32 Resin tape (resin member)
40 Tab lead with resin 41 Copper strip (metal strip)
411c Second surface 412c Third surface 41m Main surface 41s Side surface 50 Laminated Li-ion secondary battery 100 Side surface forming device 103c, 105c Chamfering unit 200 Plating device 206 Ni plating tank 300 Resin pasting device 304 Pasting unit 306 Crimping unit

Claims (13)

A tab lead with a resin comprising a metal strip and a resin member that covers the metal strip with a predetermined width in the width direction, the outermost layer of the resin member is made of a thermoplastic resin,
The metal strip of the portion covered with the resin member has a first surface perpendicular to the front and back surfaces, and a second surface in contact with one surface of the front and back surfaces and the first surface. Have
The resin-coated tab lead, wherein the first surface and the second surface are molded by polishing, and the first surface has a thickness of less than 0.1 mm. Having a third surface in contact with the other surface of the front and back surfaces and the first surface;
The tab lead with resin according to claim 1, wherein the third surface is polished. The tab lead with resin according to claim 1 or 2, wherein an angle formed between a main surface of the metal strip adjacent to the second surface and the second surface is 45 degrees or less. At least one of the interface between the main surface of the metal strip and the second surface, or the interface between the side surface of the metal strip and the second surface is a continuous curved surface. The tab lead with resin in any one of claim | item 1-3. The said metal strip consists of copper, aluminum, or an alloy material of at least any one of these, The tab lead with resin in any one of Claims 1-4 characterized by the above-mentioned. The tab lead with resin according to any one of claims 1 to 5, wherein a plating layer containing nickel is formed on a surface of the metal strip including the second surface. Among the resin members,
The tab lead with resin according to any one of claims 1 to 6, wherein at least the outer side is made of a resin having no adhesiveness at room temperature. Among the resin members,
The tab lead with resin according to any one of claims 1 to 7, wherein at least a surface side in contact with the metal strip is made of a resin having adhesiveness at room temperature. Among the resin members,
The tab lead with resin according to any one of claims 1 to 8, wherein at least the outer side is made of a polyolefin-based resin. Among the resin members,
The tab lead with resin according to any one of claims 1 to 9, wherein at least a surface side in contact with the metal strip is made of an acrylic resin. A long metal strip,
A plurality of the metal strips provided at a predetermined pitch, and a strip-shaped resin member that covers the metal strips with a predetermined width in the width direction thereof,
The metal strip of the portion covered with the resin member has a first surface perpendicular to the front and back surfaces, and a second surface in contact with one surface of the front and back surfaces and the first surface. Have
A continuous body of tab leads with resin, wherein the first surface and the second surface are molded by polishing, and the first surface has a thickness of less than 0.1 mm. Preparing a long metal slit material formed by shearing by slitting; and
A first surface that is perpendicular to the front and back surfaces of the copper strip and has a thickness of less than 0.1 mm by polishing a sheared side surface of the metal slit material, and one surface of the front and back surfaces Forming a long metal strip with a second surface in contact with the first surface;
A step of affixing a plurality of strip-shaped resin members having thermoplasticity to cover the metal strip with a predetermined width in the width direction;
And a step of cutting the elongated metal strip so as to form a metal strip having one or more of the resin members. Preparing a long metal slit material formed by shearing by slitting; and
By polishing the sheared side surface of the metal slit material, a first surface that is perpendicular to the front and back surfaces of the copper strip in the width direction and has a thickness of less than 0.1 mm, and one of the front and back surfaces Forming a long metal strip with a second surface in contact with the side surface and the side surface;
And a step of attaching a plurality of thermoplastic strip-like resin members covering the metal strip with a predetermined width in the width direction at a predetermined pitch.

Images