JP2014196472A5 - - Google Patents
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- Publication number
- JP2014196472A5 JP2014196472A5 JP2014040373A JP2014040373A JP2014196472A5 JP 2014196472 A5 JP2014196472 A5 JP 2014196472A5 JP 2014040373 A JP2014040373 A JP 2014040373A JP 2014040373 A JP2014040373 A JP 2014040373A JP 2014196472 A5 JP2014196472 A5 JP 2014196472A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- electronic
- resin composition
- electronic materials
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 11
- 239000003822 epoxy resin Substances 0.000 claims 10
- 229920000647 polyepoxide Polymers 0.000 claims 10
- 239000000203 mixture Substances 0.000 claims 6
- 239000003566 sealing material Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- LALXQOVGAFIPFI-UHFFFAOYSA-N 2-[[1-[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2C=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 LALXQOVGAFIPFI-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014040373A JP5983662B2 (ja) | 2013-03-06 | 2014-03-03 | 電子材料用エポキシ樹脂組成物およびその硬化物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013043991 | 2013-03-06 | ||
| JP2013043991 | 2013-03-06 | ||
| JP2014040373A JP5983662B2 (ja) | 2013-03-06 | 2014-03-03 | 電子材料用エポキシ樹脂組成物およびその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014196472A JP2014196472A (ja) | 2014-10-16 |
| JP2014196472A5 true JP2014196472A5 (pt) | 2015-01-22 |
| JP5983662B2 JP5983662B2 (ja) | 2016-09-06 |
Family
ID=52357494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014040373A Active JP5983662B2 (ja) | 2013-03-06 | 2014-03-03 | 電子材料用エポキシ樹脂組成物およびその硬化物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5983662B2 (pt) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3425004A4 (en) * | 2016-03-02 | 2019-10-16 | JNC Corporation | COMPOSITION FOR LOW THERMAL EXPANSION ELEMENTS, LOW THERMAL EXPANSION ELEMENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING LOW THERMAL EXPANSION ELEMENT |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0582675A (ja) * | 1991-07-11 | 1993-04-02 | Nitto Denko Corp | 半導体装置 |
| TW575631B (en) * | 2001-05-23 | 2004-02-11 | Agi Corp | Photosensitive resin composition containing hetero atoms |
| JP5387872B2 (ja) * | 2006-07-31 | 2014-01-15 | Ｄｉｃ株式会社 | エポキシ樹脂組成物及びその硬化物 |
| CN104684902B (zh) * | 2012-09-28 | 2019-05-17 | Dic株式会社 | 环氧化合物、其制备方法、环氧树脂组合物及其固化物 |
-
2014
- 2014-03-03 JP JP2014040373A patent/JP5983662B2/ja active Active
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