JP2014195765A - Substrate cleaning treatment apparatus and cleaning treatment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning treatment apparatus capable of unfailingly cleaning a recessed groove formed along a predetermined direction in a substrate.SOLUTION: A substrate cleaning treatment apparatus includes: a holding table 2 that holds a substrate; a nozzle body 15 which is disposed facing an upper surface of the substrate held by the holding table and supplies a cleaning fluid to the upper surface of the substrate; and a linear motor 9 which relatively moves the holding table and the nozzle body along a direction of the recessed groove formed on the upper surface of the substrate.

Description

  The present invention relates to a cleaning processing apparatus and a cleaning processing method for cleaning and removing dirt remaining on the substrate after forming a pattern such as a circuit on a substrate such as a glass substrate, a semiconductor wafer, or an exposure mask.

  For example, in a manufacturing process of a liquid crystal display device, a pattern of R, G, B color filters is regularly formed in a matrix over the entire surface of a glass substrate as a substrate to be processed. After the dirt such as organic substances adhering to the surface is cleaned, a transparent electrode such as a common electrode or a common electrode is formed on the surface on the liquid crystal side. In other words, by forming R, G, and B patterns in a matrix on the entire surface of the glass substrate, a concave groove along the direction intersecting the predetermined direction and the predetermined direction is regularly formed on the upper surface of the glass substrate by these patterns. Is done.

  Further, in the manufacturing process of a semiconductor device, a resist is applied to a semiconductor wafer as a substrate to be processed, and the substrate is developed and then etched, so that a large number of semiconductor elements are formed on the upper surface of the semiconductor wafer. Are formed regularly and precisely along a predetermined direction. The semiconductor wafer having the concave grooves is cleaned on the surface and the concave grooves to remove dirt such as a resist film and a resist residue, and then a metal for forming a circuit pattern is embedded in the concave grooves in the next step. .

  The concave groove may be formed only in a predetermined direction of the semiconductor wafer, or may be formed in a predetermined direction and a direction crossing the predetermined direction.

  Therefore, in the substrate such as the glass substrate or the semiconductor wafer, if the dirt attached to the upper surface and the concave groove during the cleaning process cannot be surely removed, it adversely affects the next process and causes a product defect. Become.

  Conventionally, when a substrate such as a glass substrate or a semiconductor wafer is cleaned, the nozzle is disposed above the turntable while the substrate is held on the upper surface of the turntable and the substrate is rotated by the turntable. Then, the cleaning liquid is supplied to the upper surface of the substrate that is rotationally driven. In order to improve the cleaning efficiency of the substrate, the nozzle body is also rotated in the horizontal direction above the substrate.

JP 2000-164551 A

  However, in the conventional method of cleaning the upper surface of the substrate by supplying the cleaning liquid from the nozzle body while rotating the substrate, most of the cleaning liquid supplied to the upper surface of the rotating substrate is caused by the centrifugal force generated on the substrate. It flows along the direction away from the center of rotation.

  Therefore, it is difficult for the flow direction of the cleaning liquid and the direction of the concave grooves regularly formed along the predetermined direction on the substrate. Accordingly, most of the cleaning liquid supplied to the upper surface of the substrate flows out from the upper surface of the substrate along the rotation direction of the substrate, enters into the groove, and removes the dirt in the groove. Since there is almost no cleaning, the concave grooves formed in the substrate cannot be sufficiently cleaned.

  The present invention provides a substrate cleaning apparatus and a cleaning processing method capable of reliably cleaning and removing not only the upper surface of a substrate but also dirt in a groove formed in a predetermined direction on the substrate. There is to do.

This invention is a substrate cleaning apparatus for cleaning the upper surface of a substrate in which a concave groove along a predetermined direction is formed,
Holding means for holding the substrate;
A cleaning processing unit that is disposed to face the upper surface of the substrate held by the holding unit and supplies a cleaning liquid to the upper surface of the substrate;
A substrate cleaning apparatus, comprising: a driving unit that relatively moves the holding unit and the cleaning processing unit along a direction of the concave groove formed on the upper surface of the substrate.

The present invention is a substrate cleaning method for cleaning a top surface of a substrate formed with a groove along a predetermined direction,
Holding the substrate;
Supplying a cleaning liquid to the upper surface of the held substrate;
And a step of moving the substrate and the cleaning liquid supplied to the upper surface of the substrate relatively horizontally along the direction of the concave groove when supplying the cleaning solution to the upper surface of the substrate. There is a substrate cleaning method.

  According to the present invention, when supplying the cleaning liquid to the upper surface of the substrate, the substrate and the cleaning liquid supplied to the upper surface of the substrate are relatively moved along the direction of the groove formed in the predetermined direction on the substrate. Moved horizontally.

  Therefore, since the cleaning liquid supplied to the upper surface of the substrate flows along the direction of the concave groove formed in the substrate, it is possible to efficiently clean and remove the dirt remaining in the concave groove together with the upper surface of the substrate. Become.

The front view of the washing | cleaning processing apparatus which shows one Embodiment of this invention. The side view of the washing | cleaning processing apparatus shown in FIG. The top view which expands and shows a part of glass substrate used for a liquid crystal display device. Sectional drawing of the nozzle body which supplies a washing | cleaning liquid to a board | substrate. FIG. 3 is a control system diagram of the cleaning processing apparatus. Explanatory drawing when moving a nozzle body along the direction of the X groove | channel formed in the board | substrate. FIG. 7 is an explanatory diagram when the substrate is rotated 90 degrees from the state of FIG. 6 and the nozzle body is moved along the direction of the Y groove formed on the substrate.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a front view of a cleaning apparatus 1 according to an embodiment of the present invention, and FIG. 2 is a side view of the same. The cleaning processing apparatus 1 includes a holding table 2 that constitutes a holding unit. On the upper surface of the holding table 2, a substrate W which is a glass substrate used for a liquid crystal display device, for example, is placed. The substrate W may be held by means such as suction.

  On the upper surface of the substrate W, as shown in an enlarged view in FIG. 3, the color filter 3 that forms a set of three of R, G, and B is arranged in the X and Y directions of the substrate W at fine intervals (FIG. 3). (Indicated by arrows) in a matrix. Thereby, a plurality of X grooves 4 a along the X direction of the substrate W as concave grooves and a plurality of Y grooves 4 b along the Y direction are formed in a lattice pattern on the upper surface of the substrate W by the color filter 3. Is formed.

  The holding table 2 is provided on a θ table 6 a that is driven in the rotational direction by a θ drive source 6, and this θ table 6 a is provided on a Z table 7 a that is driven in the vertical direction by a Z drive source 7.

  Accordingly, the holding table 2 is rotated 90 degrees by the θ driving source 6 from the state in which the X groove 4a formed in the substrate W held on the upper surface of the holding table 2 is positioned in the direction along the X direction. Then, the X groove 4a formed on the substrate W is positioned in the direction along the Y direction from the direction along the X direction.

  That is, as will be described later, the Y groove 4b positioned in the Y direction can be positioned in the direction along the X direction by rotating the holding table 2 by 90 degrees.

  Further, when the Z drive source 7 is operated, the height of the holding table 2, that is, the substrate W held on the upper surface of the holding table 2 can be set.

  On both sides of the holding table 2 along the Y direction (indicated by arrows in FIG. 2), a pair of guide rails 8 are spaced at a larger interval than the dimension along the Y direction of the substrate W held on the upper surface of the holding table 2. Arranged along the X direction (indicated by an arrow in FIG. 1).

  Each guide rail 8 is slidably provided with a slider 11 that constitutes a linear motor 9 with the guide rail 8. A pair of sliders 11 are provided with support columns 12, and a lateral member 13 is installed on the upper ends of these support columns 12 along the Y direction.

  The horizontal member 13 is provided with a nozzle body 15 constituting a cleaning processing means. As shown in FIG. 4, the nozzle body 15 has a hollow box shape that is longer than the dimension along the Y direction of the substrate W, and has a container 16 whose upper surface opened is closed by a lid member 16a. The upper surface of the container 16 is attached to the lower surface of the transverse member 13.

  A vibration plate 17 is provided in the container 16 so as to separate the internal space vertically, and a plurality of ultrasonic vibrators 18 (only one is shown) are provided along the longitudinal direction on the upper surface of the vibration plate 17. They are provided at predetermined intervals.

  The ultrasonic transducer 18 is supplied with a high-frequency signal from a driving power source (not shown). Accordingly, the ultrasonic vibrator 18 is ultrasonically driven, so that the diaphragm 17 is ultrasonically vibrated.

  In the space below the diaphragm 17 in the container 16, the cleaning liquid L is supplied at a predetermined pressure through a liquid supply pipe 19 connected to a liquid supply source (not shown). A slit 21 is formed in the bottom wall of the container 16 along the longitudinal direction. That is, the slit 21 is provided along the Y direction. The supply amount of the liquid supply pipe 19 and the outflow amount from the slit 21 are set so that the cleaning liquid L fills the container 16.

  The cleaning liquid supplied and filled in the container 16 is subjected to ultrasonic vibration by the vibration plate 17 and flows out in a curtain shape along the Y direction from the slit 21 formed in the bottom surface of the container 16. .

  The θ driving source 6 and the linear motor 9 drive to drive the nozzle body 15 as the cleaning processing means along the direction of the X groove 4a or the Y groove 4b, which is a concave groove formed in the substrate W. Means.

  One side surface of the container 16 is provided with a measurement sensor 22 such as an optical sensor that detects the height of the upper surface of the substrate W held on the upper surface of the holding table 2. The detection signal detected by the measurement sensor 22 is output to the control device 23 shown in FIG.

  The control device 23 drives the Z drive source 7 according to the height of the upper surface of the substrate W detected by the measurement sensor 22 when the nozzle body 15 is driven in the X direction by the linear motor 9. The height of the upper surface of the substrate W and the lower surface of the container 16 of the nozzle body 15 are kept constant.

  Thereby, the upper surface of the substrate W held on the upper surface of the holding table 2 and the lower surface where the slit 21 of the container 16 is opened due to various causes such as a holding state of the substrate W and a change in thickness dimension, for example. The drive of the Z drive source 7 is controlled so that the height dimension is kept constant even if the height dimension of the Z is changed.

  That is, by maintaining the height dimension constant, the pressure on the upper surface of the substrate W that receives the cleaning liquid L supplied from the slit 21 is maintained constant. This prevents excessive stress from being applied to the minute color filter 3 formed on the upper surface of the substrate W.

  The drive of the θ drive source 6, the linear motor 9, and the ultrasonic transducer 18 are also controlled by the control device 23.

Next, an operation of cleaning the substrate W by the cleaning processing apparatus 1 having the above configuration will be described.
First, as shown in FIG. 1, the substrate W is supplied and mounted on the upper surface of the holding table 2 in a state where the nozzle body 15 is moved to one end side in the X direction to a position where it is removed from the upper surface of the holding table 2. At this time, as shown in FIG. 6, the substrate W is positioned so that the X groove 4a formed on the upper surface is simultaneously orthogonal to the X direction indicated by the arrow, that is, the longitudinal direction of the nozzle body 15 indicated by the chain line in FIG. Is done.

  The above-described positioning of the substrate W can be set by holding the substrate W on the upper surface of the holding table 2 and then driving the holding table 2 in the θ direction by the θ driving source 6. As another method, the alignment marks provided on the substrate W and the holding table may be imaged, and the substrate W may be positioned with respect to the holding table based on the imaging.

  As shown in FIG. 6, when the substrate W supplied and held on the holding table 2 is positioned with respect to the X direction, the cleaning liquid L is supplied to the nozzle body 15 and the ultrasonic transducer 18 inside the container 16 is operated. Then, the diaphragm 17 is ultrasonically vibrated.

  Accordingly, the cleaning liquid L in the container 16 to which ultrasonic vibration is applied by the diaphragm 17 flows out from the slit 21 on the lower surface of the container 16. The cleaning liquid L flows out from the slit 21 on the lower surface of the container 16, and the linear motor 9 is driven to move the nozzle body 15 along the + X direction (shown in FIG. 6) from one end of the substrate W to the other end. To drive.

  Accordingly, the cleaning liquid L is supplied to the upper surface of the substrate W from the slit 21 of the nozzle body 15 in a curtain shape (straight shape) along the Y direction orthogonal to the driving direction of the nozzle body 15. .

  Accordingly, the cleaning liquid L is positioned in parallel with the X direction of the substrate W by supplying the cleaning liquid L from the slit 21 in a curtain shape along the Y direction while the nozzle body 15 is driven in the + X direction. It flows along the X groove 4a.

  Therefore, not only the upper surface of the color filter 3 is cleaned by the cleaning liquid L but also the cleaning liquid L flows along the X direction on the upper surface of the substrate W, so that the X formed between the adjacent color filters 3 is removed. The dirt that enters the groove 4a and adheres to the inside of the X groove 4a is washed while flowing in the + X direction. Therefore, the substrate W is reliably cleaned with the upper surface as well as the inside of the X groove 4a.

  In this way, when the nozzle body 15 is driven from one end side in the X direction of the substrate W toward the other end side and the cleaning of the X groove 4a of the substrate W is completed, the controller 23 as shown in FIG. The holding table 2 holding the substrate W is rotated by 90 degrees, and the Y groove 4b formed in the substrate W is positioned so as to be parallel to the X direction.

  That is, the substrate W is positioned so that the Y groove 4b of the substrate W is orthogonal to the longitudinal direction of the nozzle body 15 along the Y direction and parallel to the X direction.

  When the substrate W is thus positioned, the nozzle body 15 is moved from the other end side in the X direction to the one end side while supplying the cleaning liquid L to which ultrasonic vibration is applied from the slit 21 of the nozzle body 15. Drive. That is, the nozzle body 15 is driven in the −X direction, which is the opposite direction to the previous cleaning of the X groove 4a.

  The Y groove 4b of the substrate W is located in parallel to the X direction, which is the same direction as the movement direction of the nozzle body 15. Therefore, the substrate W not only cleans the upper surface of the color filter 3 by the cleaning liquid L supplied from the slit 21, but also flows when the cleaning liquid L flows in the −X direction, which is the same direction as the Y groove 4b. Since it enters the inside of the Y groove 4b formed between the matching color filters 3, the dirt adhering to the inside of the Y groove 4b is washed while flowing in the −X direction. That is, the substrate W is reliably cleaned with the upper surface as well as the inside of the Y groove 4b.

  In this way, even if a large number of X grooves 4a and Y grooves 4b as concave grooves are formed on the upper surface of the substrate W in directions orthogonal to each other, the cleaning liquid L is relatively relative to the X liquid when cleaning the X grooves 4a. The liquid is supplied so as to flow in the direction along the groove 4a, and when the Y groove 4b is cleaned, the cleaning liquid L is supplied so as to flow relatively in the direction along the Y groove 4b. Therefore, even if dirt is attached in the X groove 4a or Y groove 4b, the dirt can be reliably washed and removed by being washed away along the X groove 4a or Y groove 4b by the cleaning liquid L.

  When cleaning the X groove 4 a and the Y groove 4 b, the distance between the upper surface of the substrate W and the lower surface of the container 16 in which the slit 21 of the nozzle body 15 is opened is measured by the measurement sensor 22. Then, the height of the holding table 2 is driven and controlled by the Z drive source 7 based on the detection of the measurement sensor 22, and the distance is kept constant.

  Therefore, even when the height of the upper surface of the substrate W changes due to various causes, the distance between the upper surface of the substrate W and the lower surface of the container 16 is maintained constant, so that The pressure applied to the upper surface of the substrate W by the cleaning liquid L supplied from the slit 21 is controlled to be constant.

  As a result, since the entire surface of the substrate W can be cleaned with the cleaning liquid L at the same pressure, not only the entire surface of the substrate W can be cleaned uniformly, but also the fine and brittle color filter 3 formed on the substrate W is more than necessary. Can be prevented from being damaged.

  In the above embodiment, the case where the substrate is a glass substrate of a liquid crystal display device has been described. However, even when the substrate is a semiconductor wafer, a recess formed on the upper surface of the semiconductor wafer along a predetermined direction by etching or the like. The present invention can be applied to the cleaning of the grooves.

  Also, in order to relatively drive the holding table and the nozzle body along the direction of the groove formed in the substrate, the nozzle body is driven along the guide rail by a linear motor, but the nozzle body is driven. Alternatively, the holding table may be driven along the X direction, which is a predetermined direction.

  In addition, the substrate is placed on the upper surface of the holding table with the upper surface as the surface (surface) on which the concave grooves are formed facing upward, and is subjected to the cleaning process. Is not limited to this.

  For example, the holding table is configured such that the holding surface faces downward, the nozzle body is configured such that the slit faces upward, and the substrate is held on the holding surface so that the upper surface faces downward. The substrate and the nozzle body may be relatively moved along the direction of the groove.

  Furthermore, the holding table is configured such that the holding surface is inclined at a predetermined angle such as 90 degrees with respect to the horizontal plane, and the nozzle body is configured such that the slit faces the holding surface, and this holding is performed. The substrate may be held on the surface, and the substrate and the nozzle body may be relatively moved along the direction of the groove in the substrate.

  Thus, when performing the cleaning process in a state where the substrate is inclined at a predetermined angle such as 90 degrees, the direction of the concave groove formed in the substrate is held on the holding table so as to be along the inclined direction, The substrate and the nozzle body may be relatively moved along the inclination direction of the upper surface so that the cleaning is performed from a high position on the substrate toward a low position.

  In this case, since the direction in which the cleaning is performed, that is, the moving direction of the nozzle body with respect to the substrate coincides with the direction in which the cleaning liquid flows along the inclined surface along the inclined surface, the cleaning liquid further increases. It becomes easy to flow along a ditch | groove, and there exists an effect which improves the force which pushes away the dirt adhering to a ditch | groove.

  In addition, the cleaning liquid adhering to the portion where the cleaning has been completed on the upper surface of the substrate flows or becomes easy to flow in the downward direction, which is the moving direction of the nozzle body. Therefore, after the cleaning process is completed, If the cleaning liquid hardly remains on the substrate and the substrate needs to be dried after the cleaning process, the drying can be efficiently performed in a short time.

  When the holding surface of the holding table is inclined with respect to the horizontal direction, the adjustment direction of the facing distance between the upper surface of the substrate and the surface on which the slit of the nozzle body is formed is based on the detection value of the measurement sensor. The Z-axis direction, that is, the direction perpendicular to the holding surface of the holding table may be used instead of the vertical direction.

  In addition, X grooves and Y grooves are formed as concave grooves on the substrate, and the cleaning process for each groove is performed once. However, the present invention is not limited to this. It should be set.

  For example, an input means and a storage means are electrically connected to the control device, and the input means is used to store the number of times (n) of the cleaning process for each groove, that is, the nozzle body of the substrate. The number of times of cleaning the upper surface and the moving direction thereof, that is, in the case of the X groove, the relative moving direction is set to the + X direction or the −X direction. You may make it memorize | store the conditions of washing | cleaning, such as performing in X direction alternately or in any of + X direction and -X direction. In addition, when the concave grooves are formed along a plurality of different directions, the rotation angle of the substrate when cleaning the respective grooves may be stored in the storage means.

  In addition, when the X groove and the Y groove are formed on the substrate and the cleaning process is performed n times for each groove, the cleaning for one groove may be performed n times continuously, The cleaning process for the X and Y grooves may be repeated n times.

  Further, the number of times of cleaning processing may be different between the X groove and the Y groove, for example, the number of times of cleaning the groove having the larger number of grooves may be increased.

  Moreover, although the board | substrate with which the X groove | channel along the edge | side of the X direction of a board | substrate and the Y groove | channel along the edge | side of a Y direction was formed was illustrated as a board | substrate, the direction and number of the groove | channels formed in a board | substrate are restricted to this. It is not a thing, and the groove | channel extended in the direction which cross | intersects diagonally with respect to the edge | side of a board | substrate is formed, and the groove | channel extended in the direction which inclines in these other than X groove | channel and Y groove | channel is formed. The present invention is applicable to any substrate that has a groove along the direction.

  In addition, the case of cleaning the X and Y grooves as the concave grooves formed on the glass substrate of the liquid crystal display device has been described as an example, but it is formed along one direction on a substrate such as a semiconductor wafer or a glass substrate. In the case of cleaning only the concave grooves, it is not necessary to provide a θ drive source for rotating the holding table.

  In addition, as the cleaning processing means, the example in which the ultrasonic vibration is applied to the cleaning liquid and supplied to the substrate has been described, but the cleaning liquid may be supplied to the substrate without applying the ultrasonic vibration to the cleaning liquid. Good.

  If the cleaning liquid is supplied by inclining the direction of the slit formed in the nozzle body of the cleaning processing means along the driving direction of the substrate, the cleaning liquid supplied to the substrate is inclined toward the moving direction of the nozzle body. As a result, not only does it easily enter the recessed groove, but also dirt removed by the cleaning liquid can be easily discharged from the recessed groove, so that the cleaning effect can be enhanced.

  In addition, slits were formed in the container of the nozzle body, and cleaning liquid was supplied to the substrate in the form of a curtain, but instead of slits, a large number of nozzle holes with a small diameter were formed in a row at a minute interval on the bottom wall of the container. Thus, the cleaning liquid may be supplied in a curtain shape.

  Further, the container and the substrate are relatively placed in a predetermined direction with the lower surface of the container approaching the upper surface of the substrate and a cleaning liquid to which ultrasonic vibration is applied interposed between the lower surface of the container and the upper surface of the substrate. You may make it move to.

  In this way, compared with the case where the cleaning liquid is caused to flow out from the slit, the impact given to the fine elements formed on the upper surface of the substrate is reduced, so that the substrate can be cleaned while preventing damage to the substrate. .

  In addition, the surface (front surface) in which the concave groove in the substrate was formed was referred to as the upper surface. Therefore, if the substrate is held so that the surface on which the groove is formed faces downward, the upper surface faces the lower side of the substrate, and if the surface on which the groove is formed is kept vertical. Needless to say, the upper surface is turned sideways.

  2 ... holding table (holding means), 4a ... X groove (concave groove), 4b ... Y groove (concave groove), 6 ... θ drive source, 7 ... Z drive source, 9 ... linear motor (drive means), 15 ... Nozzle body, 16 ... container, 17 ... diaphragm, 18 ... ultrasonic transducer, 21 ... slit, 22 ... measurement sensor, 23 ... control device.

Claims (6)

A substrate cleaning apparatus for cleaning a top surface of a substrate in which a concave groove along a predetermined direction is formed,
Holding means for holding the substrate;
A cleaning processing unit that is disposed to face the upper surface of the substrate held by the holding unit and supplies a cleaning liquid to the upper surface of the substrate;
A substrate cleaning apparatus, comprising: a driving unit that relatively moves the holding unit and the cleaning processing unit along a direction of the concave groove formed on the upper surface of the substrate. The driving means is adapted to change the rotation angle of the substrate by rotating the holding means,
On the upper surface of the substrate, the concave groove is formed along two directions of one direction and the other direction intersecting the one direction,
The driving means relatively moves the substrate holding means and the cleaning processing means along the concave groove in one direction formed on the upper surface of the substrate, and then relatively moves along the concave groove in the other direction. 2. The substrate cleaning apparatus according to claim 1, wherein the substrate cleaning process is performed. The drive means is
A rotation drive source for rotating the holding means holding the substrate to adjust the rotation angle of the substrate with respect to the cleaning processing means;
The holding means for holding the substrate whose rotation angle is adjusted by the rotation drive source and the cleaning processing means are relatively horizontal in the direction along one or the other concave groove formed on the upper surface of the substrate. The substrate cleaning apparatus according to claim 2, comprising: a linear drive source that moves in a direction. A measurement sensor for measuring the distance between the lower end surface of the cleaning processing means and the upper surface of the substrate;
Based on the measurement by the measurement sensor, at least one of the cleaning processing unit and the holding unit that holds the substrate is driven in the vertical direction to increase the distance between the lower end surface of the cleaning processing unit and the upper surface of the substrate. The substrate cleaning processing apparatus according to claim 1, further comprising a control unit that controls the substrate.   5. The nozzle body according to claim 1, wherein the cleaning processing means is a nozzle body having a slit for supplying a cleaning liquid in a curtain shape along a direction intersecting with a concave groove formed on the upper surface of the substrate. The substrate cleaning apparatus described in 1. A substrate cleaning method for cleaning a top surface of a substrate on which concave grooves along a predetermined direction are formed,
Holding the substrate;
Supplying a cleaning liquid to the upper surface of the held substrate;
And a step of moving the substrate and the cleaning liquid supplied to the upper surface of the substrate relatively horizontally along the direction of the concave groove when supplying the cleaning solution to the upper surface of the substrate. Substrate cleaning process.

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