JP2014185912A - Support pin for substrate inspection, support pin drive mechanism, and circuit substrate inspection device equipped with mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support pin for inspecting a substrate, for supporting such that an inspection coordinate of the substrate to be inspected is not positionally fluctuated even when a pushing-in force is added to the substrate at the time of probing, and the like.SOLUTION: A support pin 11 for inspecting a substrate is arranged in order to prevent the substrate to be inspected from being pushed in to one side surface side at the time of probe pinning. The support pin 11 for inspecting the substrate includes: a pin body 12 movable forwards and backwards; and a contact detection element 22 disposed so as to be floating with an elastic biasing force from a conductive tip face 13a side of the pin body 12 in an advancing direction thereof. During advancing of the pin body 12, an insulation surface 24a side of the contact detection element 22 is brought into contact with the other side surface side of the substrate to be inspected and is pushed back, and a conductive rear face 24b thereof is brought into conductive contact with the tip face 13a side of the pin body 12. A switch function stops the motion of the pin body 12 triggered by the above-described fact. Probing in a state that the other side surface side of the substrate to be inspected is supported is allowed by adding the switch function to the contact detection element 22.

Description

  According to the present invention, even if a pushing force in a direction opposite to the warp by the probe pin is applied to a warped substrate to be inspected in probing, the inspection coordinates adjusted in advance do not vary depending on the degree of the warp. And a support pin driving mechanism for supporting the circuit board, and a circuit board inspection apparatus including the mechanism.

  In general, a substrate to be inspected by a circuit board inspection apparatus has a warp directed to one side in the surface direction. For this reason, the substrate to be inspected during probing is placed on the inspection stage of the circuit board inspection apparatus in a warped state. Note that, in this specification, for the warping direction of the inspected substrate surface in this case, the probing is described as an example of the upper warping and the lower warping when the probe pin is moved in the vertical direction. It is assumed that the relative positional relationship of right and left warpage in the case where the pin is moved in the left and right direction is included.

  That is, in the conventional circuit board inspection apparatus, when the substrate to be inspected is warped and placed on the inspection stage, the support pin arranged below the substrate to be inspected has its tip at the lower surface side of the substrate to be inspected. It is possible to support the substrate to be inspected by pushing it up so that its downward warped part is leveled by advancing to a predetermined reference position and automatically stopping under a state of contact with It can be done.

  For this reason, since the inspection substrate can be used as inspection points by correcting the downward warping, the inspection pins can be inspected by bringing the probe pins into contact with the inspection points as prescribed. Probing the substrate can be performed accurately.

  On the other hand, if the substrate to be inspected is warped and placed on the inspection stage, even if the tip of the support pin is advanced to reach a predetermined reference position and automatically stopped, The tip of the support pin cannot be brought into contact with the upper warp portion of the substrate to be inspected located above the reference position, and a gap is generated between the two so that the upper warp state is not eliminated and is left as it is. Will end up.

  As a method for solving such inconvenience, for example, as disclosed in FIG. 4 and FIG. 5 of Patent Document 1, a substrate inspection apparatus having a warp correction function for a substrate to be inspected has already been proposed. .

JP-A-10-253716

  The warpage correction method for a substrate to be inspected disclosed in Patent Document 1 includes an upper warp correction pusher that uses an air cylinder that expands and contracts downward, and a receiving jig that corrects the bottom warp of the substrate to be inspected. By providing it in the substrate inspection apparatus, it is intended to eliminate the upper and lower warpage of the substrate to be inspected.

  On the other hand, as shown in FIG. 4, the substrate to be inspected that is warped is placed on the inspection stage 3 of the apparatus main body 2 in the circuit board inspection apparatus 1 using the fixing jig 4, and then laser measurement is performed in advance. Using a height measuring means 5 such as a long device, the distance between two points including the inspection point is measured separately for each predetermined range of the substrate 51 to be inspected, and this is determined in advance by linear interpolation. Probing is also performed by adjusting the inspection coordinates that have been set to the correct inspection point corresponding to the warped state.

However, in the case of probing technique shown in Figure 4, already results inspected substrate 51 as described is cambered, the tip 7a of the support pins 7 reach the reference position L ₁ which is predetermined However, since there is no contact with the inspected substrate 51 side, a gap t is formed between the inspected substrate 51 and the tip 7 a of the support pin 7.

  Thus, when probing is performed in a state where a gap t is formed between the substrate 51 to be inspected and the tip 7a of the support pin 7, a predetermined inspection coordinate is adjusted to be warped. The probe pin 6 disposed at a slight inclination with respect to the corresponding inspection point is pushed out and comes into contact therewith.

  At this time, when the substrate 51 to be inspected includes a large number of slits, a thin thickness of about 0.6 to 1.6 mm, or a material with poor rigidity, for example. Is pushed to the position indicated by the broken line in FIG. 5 when the inspected substrate 51 receives the contact pressure during probing, and is positioned between the adjusted inspection point and the actual contact position of the probe pin 6. There is a disadvantage that the probe pin 6 cannot be brought into contact with the inspection point accurately due to a deviation.

  In the present invention, in view of the above-described problems of the prior art, even if a pressing force acts on the inspected substrate side during probing, the position of inspection coordinates that have been adjusted in advance in relation to the degree of warping may vary. It is an object of the present invention to provide a substrate inspection support pin and a support pin driving mechanism that can maintain the initial position so that the initial position is maintained, and a circuit board inspection apparatus including the mechanism.

  The present invention has been made to achieve the above object, and a first invention (a support pin for substrate inspection) of the invention is based on a probe pin from one surface side of a substrate to be inspected placed on an inspection stage. In order to prevent excessive push-in, the substrate inspection support pin is disposed so as to be capable of supporting contact with the other side surface of the substrate to be inspected during probing. At least a pin main body disposed so as to be movable, and a contact detector arranged to float with an elastic biasing force in the advancing direction from the conductive tip surface side of the pin main body, The support pin has an insulating surface side of the contact detector in contact with the other side surface side of the substrate to be inspected and pushed back while the pin body is advanced, and the conductive back side is the conductive tip of the pin body. The most important feature that has been granted a switch function to stop the movement of the pin body in response to a side electrically conductive contact.

  According to a second aspect of the present invention (support pin drive mechanism), the pin main body of the support pin for substrate inspection according to claim 1 is arranged so as to be capable of moving forward and backward through an advance / retreat drive unit, and a contact detector. One conductive wire is drawn from the conductive back surface side, the other conductive wire is drawn from the conductive tip surface side of the pin body, and the conductive back surface side of the contact detector is the conductive tip surface side of the pin body. The driving of the advancing / retreating drive unit is stopped via a drive control unit that uses a current flowing between the one side conductor and the other side conductor as a stop control signal when in electrical contact with the conductor. The main feature is that the support pins for substrate inspection are arranged so as to enable probing in a state where the other surface side of the substrate is supported.

  Furthermore, a third invention (circuit board inspection apparatus) is characterized in that the support pin drive mechanism according to claim 2 is arranged on the apparatus main body formed so that the inspection substrate can be placed on the inspection stage. The most important feature.

  According to the first aspect of the present invention, the insulating surface side of the contact detector comes into contact with the other surface side of the substrate to be inspected and is pushed back to the support pins for substrate inspection while the pin body moves in the advance direction. Thus, it is possible to provide a switch function for stopping the movement of the pin body when the conductive back surface side comes into conductive contact with the conductive tip surface of the pin body.

  According to the invention according to claim 2, during the movement of the pin main body in the advance direction, the insulating surface side of the contact detector comes into contact with the other surface side of the substrate to be inspected and is pushed back so that the conductive back surface side is the pin main body. When the conductive tip surface side is brought into conduction contact, the drive of the advancing / retreating drive unit is stopped via the drive control unit using the current flowing between the one side conductor and the other side conductor as a stop control signal. Since the movement of the inspection support pins can be stopped, it is possible to perform probing in a state where the other surface side of the substrate to be inspected is supported by the substrate inspection support pins.

  According to the invention of claim 3, the circuit board inspection apparatus stably supports the inspected substrate placed on the inspection stage in the apparatus main body while maintaining the warped state. Since the described support pin drive mechanism is provided, even if a pressing force by the probe pin acts on the substrate to be inspected during probing, the inspection coordinates that have been adjusted in advance in relation to the degree of warping may vary. By keeping it supported at that position so that it does not occur, the probe pin can always be brought into contact with the inspection point adjusted as the inspection coordinate accurately.

It is explanatory drawing which shows typically an example of 1st invention (support pin for a board | substrate test | inspection), of which (a) is an example of whole structure, (b) is the surrounding site | part by the dashed-dotted line in (a). Examples of enlarged cross-sectional structures are shown respectively. Explanatory drawing which shows typically the structural example of 2nd invention (support pin drive mechanism). Explanatory drawing which shows typically the outline | summary of the example of the state at the time of probing in 3rd invention (circuit board inspection apparatus). Explanatory drawing which shows typically the example of a principal part structure of the conventional circuit board inspection apparatus. Explanatory drawing which shows typically the outline | summary of the state at the time of the non-probing at the time of probing at the time of using the circuit board inspection apparatus shown in FIG.

  Embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is an explanatory view schematically showing an example of the first invention (support pin for substrate inspection), of which (a) is an example of the overall configuration, and (b) is an encircled by a one-dot chain line in (a). An example of an enlarged cross-sectional structure of a part is shown.

  According to the figure, the substrate inspection support pin 11 is, for example, a surface on one side of the substrate 51 to be inspected (placed on the inspection stage 43 of the apparatus main body 42 in the circuit board inspection apparatus 41 shown as the third invention in FIG. 3). In order to prevent excessive push-in by the probe pin 45 from the side of the upper surface 51a in the illustrated example, it is arranged so as to be able to support and abut on the other surface (lower surface in the illustrated example) 51b side during the probing. Has been.

  That is, the board inspection support pin 11 includes a pin main body 12 disposed so as to be capable of advancing and retreating controlled by the support pin driving mechanism 31 shown in FIG. 2, and a conductive tip surface 13 a side of the pin main body 12. It comprises at least a contact detector 22 that is levitated and arranged with an elastic biasing force in the advance direction.

  Among these, the pin main body 12 is formed of a pin head 13 having a truncated conical shape and a support member 19 that is integrally suspended from the lower end surface 13 b side of the pin head 13. The whole is arranged so as to be movable in the Z-axis direction at least. In addition, the pin main body 12 may be arrange | positioned so that a movement to a triaxial (X, Y, Z) direction is possible if needed.

  In addition, a space portion 16 communicated with the outside through a guide hole 15 provided on the conductive tip surface 13 a side is provided in the tip portion 14 of the pin head portion 13. A spring material 18 made of a compression coil spring having a relatively weak repulsive force is disposed. The spring material 18 is formed of a conductive member when connected to the one-side conductor 332 side described later, and formed of a non-conductive member when not connected to the one-side conductor 332 side. desirable.

  On the other hand, the contact detector 22 includes a rod portion 23 of an appropriate length that is arranged so that the tip portion 23a side thereof can protrude and retract from the space portion 16 of the pin head portion 13 through the guide hole 15, and a tip portion of the rod portion 23. When the 23a side is protruded from the conductive tip surface 13a side of the pin head portion 13, at least the contact piece portion 24 arranged on the top end side in a positional relationship orthogonal to the length direction of the rod portion 23 is provided. It is formed in preparation.

  In this case, for example, as shown in FIG. 1B, the contact detector 22 is a flange-shaped spring receiving portion 26 for mounting on the distal end 18 a side of the spring material 18 on the proximal end side of the rod portion 23. To support the spring member 18, or to connect the distal end 18 a side of the spring member 18 directly to the proximal end side of the rod portion 23 without providing the spring receiving portion 26. It has a structure that can be used.

  Further, the arrangement relationship of the contact detector 22 with respect to the pin body 12 is shown in FIG. 1B when the rod portion 23 is supported on the spring material 18 side in a state where the contact piece portion 24 side is not pressurized. In this way, the contact piece 24 may be arranged so as to be floated by a required length from the conductive tip surface 13a side of the pin head 13 with an elastic biasing force in the advance direction.

  In addition, the insulating surface 24a side of the contact detector 22 is brought into contact with the other surface 51b side of the inspected substrate 51 during the advancement of the pin body 12, and the conductive back surface 24b of the substrate inspection support pin 11 is pushed back. A switch function is provided that can stop the movement of the pin body 12 when the side is in electrical conductive contact with the conductive tip surface 13a of the pin body 12.

  More specifically, the substrate inspection support pin 11 is configured such that at least the conductive tip surface 13a of the pin head 13 of the pin main body 12 is in contact with the contact detector 22 by the conductive portion 17 made of an appropriate conductive member. The conductive back surface 24b of the piece portion 24 is formed by a conductive portion 25 made of an appropriate conductive member. In addition, it is necessary to form other parts of the contact detector 22 excluding the conductive part 25 using an appropriate insulating metal material, and other parts of the pin body 12 excluding the conductive part 17 are also made of an insulating metal material. It is desirable to form by using.

  FIG. 2 is an explanatory view schematically showing a configuration example of the second invention (support pin driving mechanism) including the substrate inspection support pin 11 according to the first invention. The main body 12 is disposed so as to be capable of moving forward and backward through an advancing / retreating drive unit 38 that is driven and connected to the support portion 18 side.

  The advancing / retreating drive unit 38 in this case includes a motor 38a and a motion conversion unit 38b that converts the rotational motion from the motor 38a into a linear motion. Specifically, for example, a motion conversion unit 38b is formed by a combination mechanism of a rack and a pinion that is rotatably connected to the rotation shaft of the motor 38a, or a screw shaft that is rotatably connected to the rotation shaft of the motor 38a. The motion converting portion 38b can be formed by a ball screw mechanism combined with a nut portion that advances and retreats along the screw shaft.

  Further, the substrate inspection support pin 11 includes a one-side conductive wire 32 drawn from the conductive portion 25 side that forms the conductive back surface 24 b of the contact detector 22 and a conductive portion that forms the conductive tip surface 13 a of the pin body 12. The other side conducting wire 33 led out from the 17 side is provided.

  Among these, the one-side conductor 32 is inserted from a through-hole (not shown) provided so as to be fed from the distal end portion 23a side of the rod portion 23 and pulled out from the spring receiving portion 26 side, and then pulled out. In addition to being connected to the distal end 18a side of the spring member 18 and further connected to the proximal end 18b side of the spring material 18, the spring member 18 is pulled out in the direction of the contact detection unit 34. Further, the other-side conductor 33 is drawn out from the conductive portion 17 side forming the conductive tip surface 13a of the pin body 12 in the direction of the contact detection portion 34 constituted by the current generation portion 35 and the voltage detection portion 36. It is.

  The one-side conducting wire 32 and the other-side conducting wire 33 drawn out in this way are connected to the current generating unit 35 that constitutes the contact detection unit 34, and between the one-side conducting wire 32 and the other-side conducting wire 33. A current can flow. Further, the voltage detector 36 detects that the voltage has become 0 V when a current flows between the one-side conductor 32 and the other-side conductor 33, so that the voltage at the conductive back surface 24 b of the contact detector 22 is detected. It can be known that a certain conductive portion 25 has come into contact with the conductive portion 17 that is the conductive tip surface 13 a of the pin body 12.

  In addition, a drive control unit 37 that controls the rotation of the motor 38a is disposed between the voltage detection unit 36 and the motor 38a in the advance / retreat drive unit 38, and is driven when the voltage detection unit 36 detects a voltage of 0V. A stop control signal can be issued from the controller 37 to stop the rotation of the motor 38a.

  For this reason, the other surface 41b side of the inspected substrate 41 during probing is always stably supported by the substrate inspection support pins 11 in which the contact 22 side is retracted and is in contact with the pin body 12 side. Will be.

  On the other hand, FIG. 3 is an explanatory view schematically showing an outline of a state example during probing in the third invention (circuit board inspection apparatus). The circuit board inspection apparatus 41 is a substrate 51 to be inspected to the inspection stage 43. The support pin drive mechanism 31 described above is arranged on the apparatus main body 42 that can be fixed, and the whole is configured.

  In this case, the circuit board inspection apparatus 41 is similar to that shown in FIG. 4 when the inspection substrate 51 placed on the inspection stage 43 side of the apparatus main body 42 using the fixing jig 44 is warped. The distance between two points including the inspection point is measured by dividing the one side surface 51a side of the inspected substrate 51 in a warped state by using a height measuring means 5 such as a laser length measuring device in advance. Then, by linearly interpolating this, it is possible to grasp a correct inspection point corresponding to the warped state by adjusting predetermined inspection coordinates.

Further, the circuit board inspection apparatus 41 includes the support pin drive mechanism 31 according to the second invention, which is disposed below the other surface 51b of the inspected board 51 placed on the apparatus main body 42 side. , by advancing beyond the reference position L ₁ which is defined a substrate inspection support pin 11 in advance, the surface 24a side of the contact piece 24 of the contact detection element 22 on the other side surface 41b side of the substrate to be inspected 41 It can be contacted.

  In addition, even in this state, the pin main body 12 in the board inspection support pin 11 continues to advance, so that the contact piece 24 side is forced against the biasing force of the spring material 18. As a result of the retreat, the conductive portion 25 that is the conductive back surface 24 b of the contact piece 24 eventually comes into contact with the conductive portion 17 that is the conductive tip surface 13 a of the pin head 13 in the pin body 12.

  As described above, when the conductive portion 25 on the contact piece portion 24 side and the conductive portion 17 on the pin head portion 13 side come into contact, the movement of the advance / retreat drive portion 38 is stopped and the movement of the pin body 12 is also stopped. As shown in FIG. 3, the other surface 41 b side of the inspected substrate 41 placed under the warped state can be supported by the substrate inspection support pins 11.

  Next, of the present invention having the above-described configuration, first, the function and effect of the first invention (substrate inspection support pin) will be described. The substrate inspection support pin 11 is disposed so as to be movable forward and backward. Pin body 12 and a contact detector 22 that is floated in the direction of advancement from the conductive tip surface 13a side of the pin body 12 with an elastic biasing force by the spring material 18, The contact detector 22 side moves so as to be pushed back to the pin body 12 side against the urging force of the spring member 18 when receiving some pressure from the insulating surface 24a side of the contact piece 24.

  Moreover, when the pin main body 12 is moving in its advance direction, the substrate inspection support pins 11 are such that the insulating surface 24a side of the contact piece 24 in the contact detector 22 is the other surface 41b of the substrate 41 to be inspected. As a result, the conductive portion 25 which is the conductive back surface 24b is brought into contact with the conductive portion 17 which is the tip surface 13a of the pin head 13 in the pin main body 12, and is formed between the two. The movement of the pin main body 12 side can be stopped by operating the switch function.

  Next, the operation and effect of the second invention (support pin drive mechanism) will be described. The substrate inspection support pin 11 has an insulating surface of the contact detector 22 when the pin body 12 is moving in the advance direction. Even if the 24a side comes into contact with the other surface 51b side of the substrate 51 to be inspected, as a result of continuing the movement, the contact detector 22 side is pushed back to the pin body 12 side against the biasing force of the spring material 18. become.

  When the contact detector 22 side is pushed back, the conductive portion 25 which is the conductive back surface 24b eventually comes into conductive contact with the conductive portion 17 as the conductive tip surface 13a of the pin body 12.

  When the conductive portion 25 of the contact detector 22 comes into contact with the conductive portion 17 of the pin main body 12 and becomes conductive, the space between the one side conductor 32 and the other side conductor 33 connected to the current generator 35 is closed. At the same time as the current flows, the voltage detection unit 36 detects 0V and is transmitted to the drive control unit 37. As a result, the drive control unit 37 issues a stop control signal to stop the rotation of the motor 38a in the advance / retreat drive unit 38. By doing so, the motion converter 38b also stops its movement.

  When the movement of the motion converter 38b is stopped, the movement of the entire board inspection support pin 11 including the pin body 12 that follows the movement of the movement converter 38b is stopped. As a result, the board inspection support pin 11 is stopped. Thus, it is possible to perform probing under the condition where the other surface 51b side of the substrate 51 to be inspected is supported.

  Next, the operation and effect of the third invention (circuit board inspection apparatus) will be described. The circuit board inspection apparatus 41 uses the height measuring means 5 shown in FIG. The one-side surface 51a side is divided into fixed ranges, the distance between two points including the inspection point is measured, and the predetermined inspection coordinates are adjusted by linearly interpolating the distance to correct the warp state. It can be grasped as an inspection point.

Further, the circuit board inspection apparatus 41 includes the support pin drive mechanism 31 according to the second invention, which is disposed below the other surface 51b of the inspected board 51 placed on the apparatus main body 42 side. drives the advancing drive unit 38 that is advanced beyond the reference position L ₁ which is defined a substrate inspection support pin 11 in advance, the insulating surface 24a side of the contact piece 24 of the contact detection element 22 to be The inspection substrate 51 can be brought into contact with the other surface 51b side.

  In addition, even in this state, the pin main body 12 in the board inspection support pin 11 continues to advance, so that the contact piece 24 side relatively resists the biasing force of the spring material 18. As a result of the forcible retreat, the back surface 24b of the contact piece 24 eventually comes into contact with the conductive tip surface 13a of the pin head 13 in the pin body 12.

  At this time, the conductive back surface 24b of the contact piece portion 24 and the tip end surface 13a of the pin head portion 13 are moved by the switch function formed when the conductive contact portions 17 and 25 are brought into conductive contact with each other. As a result of the stop, as shown in FIG. 3, the other surface 51b side of the inspected substrate 51 placed under the warped state is supported by the substrate inspection support pins 11.

  Accordingly, the circuit board inspection device 41 places the substrate 51 to be inspected on the inspection stage 43 in the apparatus main body 42 while maintaining the warped state, and the substrate 51 to be inspected from the other surface 51b side. Unlike the conventional method shown in FIG. 5, even if a pressing force by the probe pin 35 acts from one side surface 51a side of the substrate 51 to be inspected during probing by stably supporting it with the substrate inspection support pins 11. Since the inspection coordinates that have been adjusted in advance in relation to the degree of warping can be kept supported at that position so as not to fluctuate, the probe pin is always accurately applied to the inspection point adjusted as the inspection coordinates. 45 can be brought into contact.

  Therefore, the circuit board inspection apparatus 41 supports the board 51 to be inspected by the board inspection support pins 11 from the other side surface 51b side (supports in the illustrated example), so that the height measuring means shown in FIG. Thus, accurate probing can be performed by effectively utilizing the adjusted inspection coordinates that have already been acquired using the No. 5 without causing a change.

  The present invention has been described with reference to the illustrated example, and the specific embodiment thereof is not limited to this. For example, the present invention is not limited to the case where the inspected substrate 51 is arranged in the horizontal direction as in the illustrated example, but can also be applied to the case where the inspected substrate 51 is arranged in the vertical direction. Further, the one side conductor 32 may be wired outside the rod portion 23 of the contact detector 22 and directly connected to the current generator 35.

DESCRIPTION OF SYMBOLS 11 Board inspection support pin 12 Pin main body 13 Pin head 13a Conductive front end surface 13b Lower end surface 14 Front end portion 15 Guide hole 16 Space portion 17 Conductive portion 18 Spring material 18a Front end 18b Base end 19 Supporting portion 22 Contact detector 23 Rod portion 23a Tip portion 24 Contact piece portion 24a Insulating surface 24b Conductive back surface 25 Conductive portion 26 Spring receiving portion 31 Support pin drive mechanism 32 One side conducting wire 33 Other side conducting wire 34 Contact detecting portion 35 Current generating portion 36 Voltage detecting portion 37 drive control unit 38 advancing drive unit 38a motor 38b motion converter 41 circuit board inspection apparatus 42 apparatus main body 43 the inspection stage 34 fixing jig 45 probe pins 51 to be inspected substrate 51a one side surface 51b another side surface L ₁ reference position

Claims (3)

In order to prevent excessive push-in by a probe pin from one side surface side of the substrate to be inspected placed on the inspection stage, it is arranged to be able to support and abut on the other surface side of the substrate to be inspected during probing. In support pins for board inspection,
The substrate inspection support pin is floated and arranged with an elastic biasing force in the advancing direction from the pin main body arranged to be controlled to move forward and backward, and from the conductive tip surface side of the pin main body. At least a contact detector,
In the board inspection support pin, during the advancement of the pin body, the insulating surface side of the contact detector comes into contact with the other side surface side of the substrate to be inspected and is pushed back, and the conductive back side is the pin body of the pin body. A board inspection support pin, which is provided with a switch function to stop the movement of the pin body when electrically connected to the conductive tip surface side. The pin main body in the board inspection support pin according to claim 1, wherein the pin main body is arranged so as to be capable of advancing and retreating via an advancing / retreating drive unit,
One side conductor is drawn from the conductive back side of the contact detector, and the other side lead is drawn from the conductive tip side of the pin body,
Drive control using a current flowing between the one side conductor and the other side conductor as a stop control signal when the conductive back side of the contact detector is in electrical contact with the conductive tip side of the pin body The board inspection support pins are arranged so as to enable probing in a state where the other surface side of the board to be inspected is supported by stopping driving of the advance / retreat driving section through the section. Support pin drive mechanism. 3. A circuit board inspection apparatus according to claim 2, wherein the support pin drive mechanism according to claim 2 is disposed on the apparatus main body formed so that the inspection substrate can be placed on the inspection stage.

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