TWI526702B - A measuring device for testing electronic components - Google Patents

Description

Spot measuring device for testing electronic components

The present invention relates to a spot measuring device for testing electronic components, and more particularly to a probe for testing electronic components using a probe to detect semiconductor die properties such as light emitting diodes.

In the semiconductor packaging and testing industry, in order to detect the performance or parameters of a semiconductor device, a semiconductor device is often tested using a spot measuring device for testing electronic components. In detail, taking the detection of the light-emitting diode die as an example, after forming the light-emitting diode crystal on the wafer, it needs to be tested and classified according to the dominant wavelength, the luminous intensity, the luminous intensity, and the color temperature. Key parameters such as operating voltage and reverse breakdown voltage are used to classify the light-emitting diode grains. However, the role of the spotting device used to test electronic components is to turn on the light-emitting diode dies to illuminate them, and then pass them through a light collector (eg, integrating spheres, solar panels, etc.). And analyze the luminescent properties.

However, the conventional spot measuring devices for testing electronic components are mostly of a lever type, and the probe is fixed at one end, and the other end is set as a conductive contact, such as the "measuring device for testing electronic components" of the Chinese Patent No. M438630. The Edge Finder is contained in it. The above patent document is taken as an example. Please refer to FIG. 1 together. FIG. 1 is a side view of a state of use of a conventional pointing device for testing electronic components. As shown in Figure 1, the front end of the suspension member 90 is provided with a The probe 91 is provided with a second conductive member 92 at the rear end of the cantilever member 90 for electrically contacting the first conductive member 93 above. Moreover, an elastic piece 94 is disposed at the middle of the suspension member 90.

Moreover, the conventional point measuring device for testing electronic components As described below, when the probe 91 contacts the conductive contact Cp of the light-emitting diode die C, the reaction force of the light-emitting diode die-applying probe 91 overcomes the elastic piece 94 during the continuous feed. When the pre-stress is applied, the suspension member 90 and the probe 91 will swing with the elastic piece 94 as a fulcrum. At this time, the elastic piece 94 is elastically bent and deformed, and the first conductive member 93 and the second conductive member 92 are mutually coupled. Separating, a disconnection signal can be sent to stop the aforementioned feeding operation by the spot measuring device for testing the electronic component, and an electric current is applied to illuminate the light emitting diode die.

According to this, a conventional spot measuring device for testing electronic components The contact point between the first conductive member 93 and the second conductive member 92 is highly clicked and energized for a long time. After long-term testing, carbon deposition often occurs on the electrical contact surface, and the surface needs to be periodically removed to wipe the surface. Otherwise, there will be a situation of poor contact, which will affect the accuracy of the test. Moreover, regular maintenance such as regular disassembly and cleaning is necessary to stop, which will directly affect the utilization rate and efficiency of the test equipment. In addition, the elastic piece 94 will gradually become elastic and tired as time goes by, and must be replaced periodically, and must also be shut down for maintenance; and because the elastic ability of the elastic piece 94 varies with the use time, it is easy to affect the test accuracy.

In addition, it is used to test electronic components as shown in FIG. The spotting device adopts a sliding needle method, that is, between each of the tested light-emitting diode dies, the probe 91 is in contact with the wafer or the die to slide The manner of movement, coupled with the conventional probe 92, has a specific bending angle. Accordingly, not only the probe 92 will be worn, but also the wafer or the crystal grain will be scratched (needle marks); and, for a long time of use, as the wear of the probe 92 becomes more and more serious, because the probe 92 is inclined The relationship will lead to the enlargement of the needle marks and seriously affect the quality.

The main object of the present invention is to provide a test for testing electricity The sub-component spotting device can completely avoid the various conditions caused by the carbon deposition phenomenon between the electrical contact contacts of the spot measuring device for testing electronic components, and can also significantly reduce the wear of the probe, and The formation of needle marks.

In order to achieve the above object, the present invention is for testing electronic The component measuring device mainly comprises a fixing frame, a movable seat, an inductive switch, a probe holder, and a controller. The fixing frame comprises a lifting guide rod; the movable seat is provided with an upright through hole, and the movable seat is sleeved on the lifting guide rod of the fixing frame by the vertical through hole, and can be relatively moved up and down; the inductive switch is arranged on the fixing frame and the activity Between the seats; the probe holder is coupled to the movable seat, and the probe holder is for holding a probe; the controller is electrically connected to the sensor switch, and the controller controls the application of the current according to the sensor switch, or The electrical signal is on the probe.

In conclusion, the present invention can be guided by a lifting guide. The movable seat is lifted and lowered; and, through the setting of the inductive switch, the reaction force fed back by the probe can be sensed, and thereby the controller can determine whether the current or the electrical signal is applied. Accordingly, the present invention can completely eliminate the carbon deposition problem caused by the lever principle of the conventional measuring device for testing electronic components, thereby improving the test accuracy and the service life, and eliminating the need for regular cleaning and maintenance, and improving Usage, and efficiency.

Preferably, the inductive switch of the present invention can be a pressure sense The controller controls the application of a current or electrical signal to the probe when the pressure sensed by the pressure sensor reaches a certain value. In other words, the present invention can sense the reaction force fed back by the probe by the pressure sensor to determine whether the needle pressure is appropriate; when the appropriate needle pressure is reached, the controller applies a current or an electrical signal to the probe. The semiconductor crystal grains are caused to detect or emit light. However, the present invention is not limited to pressure sensors, and other sensing devices such as limit switches, strain gauges, photocouplers, and the like that can sense or measure pressure, strain, or displacement can be used in the present invention.

Furthermore, the holder of the present invention can be a U-shaped holder. The first side wall and the second side wall are respectively connected to the corresponding two side ends of the bottom sill; and the two ends of the lifting guide are respectively fixed on the bottom side, respectively. a first side wall and a second side wall of the U-shaped fixing frame. Accordingly, the movable seat can be moved up and down between the first side wall and the second side wall of the U-shaped fixing frame by the guiding of the lifting guide.

In addition, the present invention may further include a positioning roller that can be grouped It is placed on the movable seat and abuts against the bottom of the U-shaped fixing frame; and the positioning roller rolls as the movable seat moves up and down. In addition, the positioning roller may include a circumferential surface of a specific width; and the positioning roller abuts against the bottom of the U-shaped bracket with a circumferential surface. In detail, when the probe is pressed down to the end surface of the wafer or the die, the probe holder is prone to a slight amount of yaw. Therefore, the present invention uses the positioning roller on the movable seat to avoid the yaw. Phenomenon; wherein the circumferential surface of the positioning roller is completely abutted against the bottom cymbal of the U-shaped fixing frame, so when the movable seat is actuated, the positioning roller will only allow up and down movement displacement, and the horizontal yaw displacement is determined by the positioning roller The circumference of the ring is suppressed.

However, the present invention is for suppressing the yaw position of the movable seat level The mechanism of movement is not limited to the positioning of the roller, but can also be suppressed by other means, such as setting the lifting guide and the upright through hole as a rectangular type, an H type, a semicircular shape, a geometric polygonal line or other special type, or Additional lifting guides can be added to effectively suppress the horizontal yaw of the movable seat.

Moreover, the present invention may further include a lifting drive, the electric The controller is coupled to the bracket and coupled to the mounting bracket; the controller controls the lifting actuator to drive the mounting bracket to move up and down. Accordingly, the present invention can lift and lower the holder, the movable seat, and the probe holder by the lifting and lowering drive, so that the probe can be used for height measurement and spot measurement. In addition, the present invention may further include a three-axis displacement adjusting seat, and the lifting drive may be assembled on the three-axis displacement adjusting seat, or the position adjustment of the lifting driver may be performed by the three-axis displacement adjusting seat, and then the fixing frame The probes on the movable base and the probe holder are calibrated for position.

Preferably, the probe of the present invention can be a 90 degree straight Probe. In detail, since the present invention uses a straight probe instead of a conventional oblique probe, the wear of the probe is not an oblique angle, so the entire wear surface does not expand, and the needle mark is also fixed. Does not enlarge the needle marks on the wafer or the grain due to the bevel.

Furthermore, the invention may further comprise an elastic element, and the elasticity The component is placed between the holder and the movable seat, and the movable seat can be lifted and lowered. In other words, the elastic member of the present invention not only provides the effect of lifting and lowering the movable seat, but also provides appropriate acupressure to avoid serious needle marks or severe needle damage on the wafer or the crystal surface due to excessive needle pressure, or Because the needle pressure is too small, the probe and the die contact are in poor contact, which affects the spot measurement result.

Moreover, the probe holder of the present invention may further include at least one guide The electric body is electrically connected between the controller and the probe. In particular, the controller can apply current or electrical signals to the probe by the electrical conductors disposed on the probe holder to improve the conventionally used measuring device for testing electronic components by using a lever contact type. Carbon problem.

[知知]

90‧‧‧Cantilever parts

91‧‧‧Probe

92‧‧‧Second conductive parts

93‧‧‧First conductive parts

94‧‧‧Elastic film

C‧‧‧Light-emitting diode grains

Cp‧‧‧ conductive contacts

[This creation]

1‧‧‧ Lifting drive

10‧‧‧Three-axis displacement adjustment seat

101‧‧‧X-axis displacement adjustment module

102‧‧‧Y-axis displacement adjustment module

103‧‧‧Z-axis displacement adjustment module

11‧‧‧Connecting frame

2‧‧‧ Fixing frame

20‧‧‧U-shaped holder

21‧‧‧

22‧‧‧First side wall

23‧‧‧ second side wall

3‧‧‧ Lifting guide

4‧‧‧ activity seat

41‧‧‧Upright through hole

411‧‧‧ Ball Bushing

42‧‧‧Insulation board

5‧‧‧ probe holder

51‧‧‧ probe

52‧‧‧Electrical conductor

6‧‧‧Sensor switch

60‧‧‧pressure sensor

7‧‧‧ Controller

8‧‧‧Locating wheel

81‧‧‧Circular surface

9‧‧‧Flexible components

D‧‧‧Specific width

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing a state of use of a conventional pointing device for testing electronic components.

2 is a perspective view of a preferred embodiment of the present invention.

3 is a perspective view of another perspective of a preferred embodiment of the present invention.

Figure 4 is a side elevational view of a preferred embodiment of the present invention.

Figure 5 is a partial exploded view of a preferred embodiment of the present invention.

6 is a system architecture diagram of a preferred embodiment of the present invention.

Before the present invention is described in detail in the present embodiment, it is to be noted that in the following description, similar elements will be denoted by the same reference numerals.

2 is a perspective view of a preferred embodiment of the present invention, FIG. 3 is a perspective view of another preferred embodiment of the present invention, and FIG. 4 is a side view of a preferred embodiment of the present invention. FIG. 5 is a partial exploded view of a preferred embodiment of the present invention. It should be particularly noted that the following embodiments are described by taking a spot measuring device for testing an electronic component for detecting a light emitting diode as an example, but the invention is not limited thereto, and any semiconductor component detecting device is used for The spotting device for testing electronic components is intended to be included within the scope of the present invention.

As shown in the figure, a three-axis displacement adjusting seat 10 is disposed on one The detecting device (not shown) includes an X-axis displacement adjusting module 101, a Y-axis displacement adjusting module 102, and a Z-axis displacement adjusting module 103, which are respectively in the X-axis and the Y-axis. The displacement is adjusted in the direction of the Z and the Z axis. Furthermore, a lifting drive 1 is disposed on the three-axis displacement adjusting base 10, so the three-axis displacement adjusting seat 10 can perform three-axis displacement adjustment on the lifting drive 1. The lifting drive 1 of the embodiment adopts micro-stepping. motor. In addition, a connecting frame 11 is coupled to the three-axis displacement adjusting base 10 by a sliding rail and a sliding seat, and is connected to the lifting and lowering drive 1, so that the lifting and lowering drive 1 can drive the connecting frame 11 to perform lifting operation.

As shown in the figure, the fixing frame 2 is fixed to the connecting frame. 11, and the holder 2 includes a lifting guide 3. In this embodiment, the fixing frame 2 is a U-shaped fixing frame 20, and includes a bottom cymbal 21, a first side wall 22, and a second side wall 23. The first side wall 22 and the second side wall 23 are respectively connected. The two ends of the bottom rail 21 are fixed to the first side wall 22 and the second side wall 23 of the U-shaped bracket 20 respectively.

In addition, the movable seat 4 is provided with an upright through hole 41, and is live The movable seat 4 is sleeved on the lifting guide 31 by the upright through hole 41, and is slidable relative to the lift. In other words, the movable seat 4 of the present embodiment can be moved up and down between the first side wall 22 and the second side wall 23 of the U-shaped fixing frame 20 by the guiding of the lifting guide rod 31. Further, a ball bushing, a shaft bushing or other means for reducing friction may be disposed in the upright through hole 41. In the upright through hole 41 of the embodiment, a ball bushing 411 is additionally provided, and the movable seat 4 is made of balls. The bushing 411 is sleeved on the lifting guide 31; therefore, the movable seat 4 When the lifting and lowering is performed, the ball bushing 411 can achieve a stable linear lifting motion with a very small frictional resistance.

As shown in the figure, the rear side group of the movable seat 4 is provided with a certain The position roller 8 abuts against the bottom cymbal 21 of the U-shaped holder 20, and the positioning roller 8 rolls as the movable seat 4 moves up and down. In addition, the positioning roller 8 used in this embodiment is a ball bearing, and since the ball bearing has a circumferential surface 81 having a specific width D, the positioning roller 8 is abutted against the U-shaped fixing frame 20 by the circumferential surface 81. The bottom is 璧21.

Moreover, as shown in FIG. 4 and FIG. 5, at the top of the movable seat 4 An inductive switch 6 is disposed between the face and the inner face of the first side wall 22 of the holder 2. In the present embodiment, the inductive switch 6 is a pressure sensor 60 that is mainly used to sense the pressure between the top surface of the movable seat 4 and the inner surface of the first side wall 22 of the fixed frame 2. However, the inductive switch 6 of the present invention is not limited to the sensing pressure, and can sense other parameters such as displacement, strain, and the like. Therefore, the present invention can also adopt other sensible such as limit switches, strain gauges, and photocouplers. A sensing device that measures or measures parameters such as pressure, strain, or displacement.

In addition, as shown in the figure, in the fixed frame 2 and the movable seat 4 The two sides are respectively provided with a resilient member 9, wherein the two ends of each elastic member 9 are respectively attached to the side of the fixed frame 2 and the movable seat 4 by screws, so as to promote the movable seat 4 to be lifted and lowered, and the embodiment is The elastic member 9 used is a spring. In other words, the spring provided in this embodiment not only provides the function of lifting and lowering the movable seat 4, but also provides appropriate tension or tension to provide appropriate acupressure to avoid wafer or die surface caused by excessive needle pressure. Severe needle marks, or severe needle damage, or Because the needle pressure is too small, the probe and the die contact are in poor contact, which affects the spot measurement result.

As shown in FIG. 2 to FIG. 5, the front side of the movable seat 4 is transparent. A probe holder 5 is connected via an insulating plate 42 and the probe holder 5 holds a probe 51. Furthermore, a top surface and a side surface of the probe holder 5 are respectively provided with a conductor 52 for electrically connecting between the controller 7 and the probe 51. In other words, the conductors 52 are mainly used as the contacts of the electrical connection, and the three conductors 52 are disposed in three directions because the conductive wires can be installed in different directions according to actual needs. Accordingly, the reaction of the sensing switch 6 can sense the reaction force fed back by the probe 51 to control the application of current or electrical signal on the probe 51, which is different from the lever type electrical contact, and can be eliminated because of high-speed click. There are many times of power-on and there is a problem of carbon deposition.

Please refer to FIG. 6 together. FIG. 6 is a preferred embodiment of the present invention. Example system architecture diagram. As shown in the figure, a controller 7 is electrically connected to the elevation drive 1, the inductive switch 6, and the probe 51, that is, the controller 7 will control the elevating drive 1 to drive the mounting bracket 2 to move up and down, and according to the inductive switch 6 To control the application of current to the probe 51; in other words, when the pressure sensed by the pressure sensor 60 reaches a certain value, the controller 7 controls the application of current to the probe 51.

The operation of the spot measuring device for testing electronic components of the present embodiment will be described in detail below. When the probe 51 is moved over the LED die (not shown), the controller 7 will control the lift driver 1 to drive the holder 2 down, so that the probe 51 is pressed against the LED die. Top surface. At this time, when the holder 2 is lowered, the movable seat 4 and the elastic member 9 will be negative. Excessive downward pressure is absorbed, and the pressure sensor 60 will also hold the reaction force fed back by the monitoring probe 51. When the pressure sensor 60 reaches a certain value, the controller 7 uses the probe holder 5 The upper conductor 52 applies an electric current to the probe 51 to cause the light-emitting diode to emit light and further detect it.

Accordingly, the embodiment is actuated by the lifting of the movable seat 4, And the reaction force of the feedback is monitored by the pressure sensor 60, and then the appropriate pressure can be obtained. The importance of this is that if the probing force of the probe 51 is too large during the spotting operation, the surface of the crystal grain may be damaged, and the probe may be easily worn. On the other hand, if the needle pressure is too small, it may cause The probe 51 is in poor contact with the die contact, which in turn affects the spot measurement result.

In addition, as described above, when the probe 51 is pressed down When the end face of the wafer or the die is used, the probe holder 5 is prone to a slight amount of yaw. Therefore, in this embodiment, the positioning roller 8 on the movable seat 4 is used to avoid the yaw phenomenon; The circumferential surface 81 of the roller 8 is completely abutted against the bottom cymbal 21 of the U-shaped fixing frame 2, so when the movable seat 4 is actuated, the positioning roller 8 will only allow up and down movement displacement, and the horizontal yaw displacement is determined by the positioning roller. The circumferential surface 81 of the ring 8 is suppressed.

More worth mentioning is that the probe 51 used in this embodiment It is a straight probe of 90 degrees instead of the traditional oblique probe, so the wear of the probe 51 is in the form of a tangent plane instead of a beveled section, so the entire wear surface will not pass. It is enlarged, and even if there are pin marks on the surface of the wafer or the surface of the crystal grain, it is fixed in size, and the needle marks on the wafer or the crystal grains are not enlarged by the oblique angle.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧ Lifting drive

10‧‧‧Three-axis displacement adjustment seat

101‧‧‧X-axis displacement adjustment module

102‧‧‧Y-axis displacement adjustment module

103‧‧‧Z-axis displacement adjustment module

11‧‧‧Connecting frame

2‧‧‧ Fixing frame

20‧‧‧U-shaped holder

21‧‧‧

22‧‧‧First side wall

23‧‧‧ second side wall

3‧‧‧ Lifting guide

4‧‧‧ activity seat

42‧‧‧Insulation board

5‧‧‧ probe holder

51‧‧‧ probe

52‧‧‧Electrical conductor

8‧‧‧Locating wheel

9‧‧‧Flexible components

Claims (10)

A spotting device for testing electronic components, comprising: a fixing frame comprising a lifting guide rod; a movable seat having an upright through hole, wherein the movable seat is sleeved on the fixing frame by the upright through hole The lifting guide rod is slidable relative to the lifting and lowering; an inductive switch is disposed between the fixing frame and the movable seat; a probe holder coupled to the movable seat, the probe holder The holder is for holding a probe; and a controller is electrically connected to the inductive switch, and the controller controls to apply a current or an electrical signal to the probe according to the inductive switch. The test device of claim 1 , wherein the inductive switch is a pressure sensor; when the pressure sensed by the pressure sensor reaches a specific value, the controller controls to apply the The current, or the electrical signal, is applied to the probe. The device of claim 1, wherein the holder is a U-shaped holder, and includes a bottom, a first side wall, and a second side wall, the first side wall, and The second side wall is respectively connected to the corresponding two side ends of the bottom sill; the two ends of the lifting guide rod are respectively fixed to the first side wall and the second side wall of the U-shaped fixing frame. The point measuring device for testing electronic components of claim 3, further comprising a positioning roller disposed on the movable seat and abutting against the bottom of the U-shaped fixing frame; The movable seat is raised and lowered to roll. The spot measuring device for testing electronic components of claim 4, wherein the positioning roller comprises a circumferential surface of a specific width; the positioning roller abuts the bottom of the U-shaped holder with the circumferential surface of the ring Hey. The point measuring device for testing electronic components of claim 1, further comprising a lifting driver electrically connected to the controller and coupled to the fixing frame; the controller controlling the lifting driver to drive the fixing frame to lift Actuate. The point measuring device for testing electronic components of claim 6, further comprising a three-axis displacement adjusting seat, wherein the lifting driver is assembled on the three-axis displacement adjusting seat. A spot measuring device for testing an electronic component according to claim 1, wherein the probe is a 90 degree straight probe. The point measuring device for testing electronic components of claim 1, further comprising an elastic member interposed between the fixing frame and the movable seat, and causing the movable seat to be lifted and lowered. The device of claim 1, wherein the probe holder further comprises at least one electrical conductor electrically connected between the controller and the probe.