JP2014179473A5 - - Google Patents

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Publication number
JP2014179473A5
JP2014179473A5 JP2013052630A JP2013052630A JP2014179473A5 JP 2014179473 A5 JP2014179473 A5 JP 2014179473A5 JP 2013052630 A JP2013052630 A JP 2013052630A JP 2013052630 A JP2013052630 A JP 2013052630A JP 2014179473 A5 JP2014179473 A5 JP 2014179473A5
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JP
Japan
Prior art keywords
manufacturing
relates
present
ceramic substrate
conductor material
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Pending
Application number
JP2013052630A
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English (en)
Japanese (ja)
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JP2014179473A (ja
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Priority to JP2013052630A priority Critical patent/JP2014179473A/ja
Priority claimed from JP2013052630A external-priority patent/JP2014179473A/ja
Publication of JP2014179473A publication Critical patent/JP2014179473A/ja
Publication of JP2014179473A5 publication Critical patent/JP2014179473A5/ja
Pending legal-status Critical Current

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JP2013052630A 2013-03-15 2013-03-15 セラミック基板の製造方法および導体材料 Pending JP2014179473A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013052630A JP2014179473A (ja) 2013-03-15 2013-03-15 セラミック基板の製造方法および導体材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013052630A JP2014179473A (ja) 2013-03-15 2013-03-15 セラミック基板の製造方法および導体材料

Publications (2)

Publication Number Publication Date
JP2014179473A JP2014179473A (ja) 2014-09-25
JP2014179473A5 true JP2014179473A5 (sr) 2016-03-03

Family

ID=51699132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013052630A Pending JP2014179473A (ja) 2013-03-15 2013-03-15 セラミック基板の製造方法および導体材料

Country Status (1)

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JP (1) JP2014179473A (sr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107113986B (zh) 2015-01-13 2019-11-19 日本特殊陶业株式会社 陶瓷基板及其制造方法
CN110047611B (zh) * 2019-04-18 2021-06-01 北京元六鸿远电子科技股份有限公司 一种低温烧结ltcc用导电银浆

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289387A (ja) * 1988-09-27 1990-03-29 Asahi Glass Co Ltd 銅導体ペーストと多層セラミックス基板
JP4906258B2 (ja) * 2004-11-26 2012-03-28 京セラ株式会社 配線基板およびその製造方法
JP4797534B2 (ja) * 2005-09-16 2011-10-19 Ｔｄｋ株式会社 多層セラミックス基板
JP2008263129A (ja) * 2007-04-13 2008-10-30 Asahi Glass Co Ltd プリント配線板の製造方法

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