JP2014179414A - Electronic device and method of assembling the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an electronic device that facilitates connecting terminals between substrates when manufacturing and that prevents decrease in reliability.SOLUTION: An electronic device is configured to include a first substrate 71, a second substrate 72 and a fixing member 73. The first substrate 71 has a first terminal. The second substrate 72 in which a first through hole is formed has a second terminal through which the first through hole penetrates. The fixing member 73 in which a second through hole is formed fixes the second substrate 72 to the first substrate 71. The first substrate 71 and the second substrate 72 are fixed with the fixing member 73 so that a projection surface, on which respective orthogonal projections onto the surfaces of the opening of the second through hole on the first substrate side 71, the first through hole and the first terminal have common parts, exists. The first through hole is filled with a conducting material.

Description

  The present invention relates to a structure of an electronic device, and more particularly to a connection structure between electronic substrates.

  With the development of the information and communication society, information devices used therefor have been used for various purposes. Due to the expansion of applications, information devices are often required to have both high performance and downsizing, and there is also a demand for reliability that enables the information devices to be used stably and continuously during use. Furthermore, it is often required to reduce the price of information devices, and it is also necessary to reduce manufacturing costs.

  In order to improve the performance while reducing the size of an electronic device used as an information device, it is necessary to increase the density of electronic circuits and wiring of the electronic device. Electronic devices are often used in combination with a plurality of electronic boards on which electronic circuits and wirings are formed, but the terminals for connecting electronic boards are miniaturized by increasing the density of electronic circuits and wirings. And is densified. For this reason, the technology that can easily perform the connection between the terminal portions of such miniaturized and high-density substrates while maintaining reliability is high, and related technology development is actively carried out. It has been broken. As a technique related to the connection of the electronic substrate, for example, a technique as disclosed in Patent Document 1 is disclosed.

  Patent Document 1 relates to a technique for connecting a printed board and a flexible board. In Patent Literature 1, the vicinity of the terminals of the printed circuit board and the vicinity of the terminals of the flexible substrate are bonded together via an adhesive sheet. After bonding the printed circuit board and the flexible circuit board, the printed circuit board and the flexible circuit board are electrically connected by making holes in the terminals and adhesive sheet of the flexible circuit board with a laser and filling the holes with a conductive material. . In Patent Document 1, by using such a technique, a connecting conductor is formed only in the terminal portion, and therefore an effect of preventing a short circuit between the terminals even if the interval between the terminals is narrowed is obtained.

  Patent Document 2 discloses a technique for fixing a printed board and a flexible board using a fastener. In Patent Document 2, a hole is made in a printed board and a flexible board. In addition, the fastener is provided with a pin that is a protrusion for insertion into the hole and a pressing portion that applies pressure to the substrate side when it is attached to the substrate. In Patent Document 2, the position is fixed by overlapping a printed board and a flexible board and inserting a pin of a fastener into a hole. In addition, the fastener is designed so that the position of the pressing part coincides with the portion where the terminal part of the printed circuit board and the flexible circuit board overlap, and the terminal of the flexible circuit board is pressed against the terminal of the printed circuit board by the pressing part. The connection can be made. In Patent Document 2, such a configuration allows the substrates to be connected easily and reliably.

JP 2007-221077 A JP 2006-319118 A

  However, the technique disclosed in Patent Document 1 has the following problems. In Patent Document 1, a printed circuit board and a flexible substrate are bonded together with an adhesive sheet, and then a hole is made in a terminal portion of the flexible substrate and the adhesive sheet with a laser or the like. The technique of Patent Document 1 requires a high control technique such as laser intensity that does not damage the terminals of the printed circuit board directly below the adhesive sheet while reliably punching the adhesive sheet. In addition, the thickness of the flexible substrate and the adhesive sheet is thin, and in order to prevent leakage between the terminals while ensuring electrical connection between the terminals, the position and injection of the conductive material when filling the conductive material The amount to be played needs to be precisely controlled. Therefore, in the technique of Patent Document 1, the apparatus and work in the manufacturing process can be complicated.

  Moreover, in patent document 2, the connection between terminals is performed by hold | suppressing the terminal of a flexible substrate with the press part with respect to the terminal of a printed circuit board. For this reason, it is necessary to use a fastener that forms the pressing portion precisely so that the positions of the terminal and the pressing portion coincide with each other and that does not cause the pressure that the pressing portion presses the terminal to decline during the use period of the product or the like. Further, if stress is continuously applied to the terminal portion, the metal forming the terminal may cause a migration, which may lead to a decrease in reliability such as a connection failure.

  An object of the present invention is to obtain an electronic device that can easily connect terminals between substrates at the time of manufacture or the like and that does not cause a decrease in reliability.

  In order to solve the above problems, an electronic device of the present invention includes a first substrate, a second substrate, and a fixing member. The first substrate has a first terminal. The second substrate has a first terminal formed with a first through hole, and has a second terminal penetrated by the first through hole. The fixing member has a second through hole, and fixes the second substrate to the first substrate. The first through-hole of the second through-hole, the first through-hole, and the first terminal of each of the first terminals so that there is a projection surface in which the orthogonal projection onto the surface has a common part. The first substrate and the second substrate are fixed by a fixing member. The first through hole is filled with a conductive material.

  In the electronic device assembly method of the present invention, the second substrate is fixed to the substrate of the first substrate with a fixing member, and a conductive substance is injected from the second through hole formed in the fixing member, The first through hole formed in the terminal of the second substrate is filled with a conductive substance.

  In the present invention, it is only necessary to fill the hole formed in the fixing member with a conductive adhesive, so that workability at the time of connecting the substrates is improved, and the connection of the terminals between the substrates can be easily performed. Further, by connecting and bonding between terminals using a conductive adhesive, damage to the terminals on the substrate is small, and a decrease in reliability can be suppressed.

It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is sectional drawing of the electronic device of the 1st Embodiment of this invention. It is sectional drawing of the electronic device of the 1st Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is sectional drawing of the electronic device of the 3rd Embodiment of this invention. It is sectional drawing of the electronic device of the 4th Embodiment of this invention. It is sectional drawing of the electronic device of the 5th Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 6th Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 6th Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 7th Embodiment of this invention.

  A first embodiment of the present invention will be described in detail with reference to the drawings. 1 and 2 show an outline of the configuration of the electronic device according to the present embodiment. FIG. 1 shows each component and the positional relationship with each other, and FIG. 2 shows a diagram when the components are actually combined. The electronic device of this embodiment includes a printed circuit board 10, a flexible substrate 20, and a fixed block 30.

  The printed circuit board 10 includes a pad 11 and a hole 12. The pad 11 is a terminal for electrically connecting to the flexible substrate 20, and wiring is drawn from a circuit in the printed circuit board 10 and connected to the terminal portion. The printed circuit board 10 is formed of, for example, glass fiber, epoxy resin, or the like, and a circuit using metal wiring made of copper or the like is formed. Further, the surface of the printed circuit board 10 is protected by a solder resist or the like other than the portion that is electrically connected to other members such as the pad 11. The pad 11 is made of metal such as copper or an alloy of copper and tin. A predetermined number of pads 11 are formed in accordance with the circuit design of the printed circuit board 10. The hole 12 is formed so as to penetrate the printed circuit board 10 from one surface to the opposite surface. It is desirable to provide two or more holes 12 for alignment.

  The flexible substrate 20 includes a pad 21, a pad hole 22, and a hole 23. In the flexible substrate 20, a circuit using a metal wiring such as copper is formed on an insulating film such as polyimide. Further, the surface other than the portion to be electrically connected to another member such as the pad 21 is protected with a polyimide resin or the like. The pad 21 is a terminal for connecting to the printed circuit board 10 and is formed of copper, an alloy of copper and another metal, or the like, to which wiring from a circuit in the flexible substrate 20 is connected. In the present embodiment, an example is shown in which pads are formed on both surfaces of the flexible substrate 20, but the pads 21 may be formed only on the surface in contact with the printed circuit board 10. Further, the pads 21 are formed corresponding to the number of pads 11 of the printed circuit board 10. The pad hole 22 is formed in the pad 21 of the flexible substrate 20 and penetrates from one side of the flexible substrate 20 to the opposite side. The pad hole 22 is used for filling a conductive adhesive when the pad 11 of the printed board 10 and the pad 21 of the flexible board 20 are electrically connected and fixed. The pad holes 22 are formed corresponding to the number of pads 11 on the printed circuit board 10. The hole 23 penetrates from one surface of the flexible substrate 20 to the opposite surface. The holes 23 are formed so as to correspond in position and number to the holes 12 of the printed circuit board 10. The flexible board 20 is sometimes called a flexible printed board.

  The fixed block 30 includes a protrusion 31 and an adhesive filling hole 32. The protrusion 31 is for fixing the two substrates by being inserted into the hole 12 of the printed circuit board 10 and the hole 23 of the flexible substrate 20. The adhesive filling hole 32 penetrates from one surface of the fixed block 30 to the opposite surface. The adhesive filling holes 32 are formed corresponding to the number of terminals formed on the printed circuit board 10 and the flexible circuit board 20. The fixed block 30 is formed by resin or die casting. In the case of die-casting, the surface is insulated so that current leakage does not occur between the adjacent terminals via the fixed block 30.

  As shown in FIG. 2, the electronic device of the present embodiment is laminated in the order of a printed circuit board 10, a flexible substrate 20, and a fixed block 30. FIG. 3 is a cross-sectional view in a direction including a plurality of adhesive filling holes 32 and pads. As shown in FIG. 3, the protrusions 31 of the fixed block 30 are inserted into the holes of the flexible board 20 and the printed board 10. By setting it as such a structure, the printed circuit board 10 and the flexible substrate 20 are fixed so that a position may not shift | deviate mutually. Further, when the position is fixed, the pad 11 of the printed board 10, the pad 21 of the flexible board 20, and the adhesive filling hole 32 of the fixed block 30 are formed so as to be aligned with each other. The pad 11 of the printed board 10 and the pad 21 of the flexible board 20 are in contact with each other at each terminal. A space formed by the adhesive filling hole 32 of the fixing block 30 and the pad hole 22 of the flexible substrate 20 is filled with a conductive adhesive 33.

  The conductive adhesive 33 is formed using a conductive material such as gold or silver dispersed in a resin. Injection of the conductive adhesive 33 into the adhesive filling hole 32 and the pad hole 22 is performed in a state of being fluidized by being dissolved in a solvent or the like, and the injected adhesive is solidified by drying, thermosetting or the like. An epoxy resin or a conductive resin can be used as the resin.

  FIG. 4 is a cross-sectional view of a portion including the adhesive filling hole 32 and a pad at a corresponding position, and is a cross-sectional view in a direction orthogonal to FIG. As shown in FIG. 4, the printed circuit board 10, the flexible circuit board 20, and the fixed block 30 are sequentially stacked in a certain area such as a pad. Further, the printed circuit board 10 and the fixed block 30 are in direct contact with each other in a part of the region where pads or the like are not formed. Since the printed circuit board 10 and the fixed block 30 having a certain strength are in contact with each other, it is possible to form a stable structure while securing the space of the flexible substrate 20 and the space of the pads of the two substrates. Further, by forming such a structure, an electrical connection portion formed by the pad 11 of the printed board 10 and the pad 21 of the flexible board 20 which is one of the important parts for the electronic device is replaced with another component. It is possible to protect against contact with the like. A space formed by the adhesive filling 32 and the pad hole 22 of the flexible substrate 20 is filled with a conductive adhesive 33. The pads 11 of the printed board 10 and the pads 21 of the flexible board 20 are in contact with each other, and the pads are electrically connected. When the conductive adhesive 33 is filled and cured, the two pads do not leave. In addition, since an electrical signal flows between the two pads via the conductive adhesive 33, the electrical connection state is further stabilized.

  In the electronic device of the present embodiment, an electrical signal sent from the circuit formed inside the printed circuit board 10 to the pad 11 which is a terminal portion for connection is transmitted via the conductive adhesive 33 or directly to the flexible substrate 20. To the pad 21. The electrical signal sent to the pad 21 of the flexible substrate 20 is sent to a circuit formed inside the flexible substrate 20. Further, the electrical signal sent from the circuit inside the flexible substrate 20 to the pad 21 is sent to the pad 11 of the printed circuit board 10.

  Next, a method for assembling the electronic device of this embodiment will be described. The printed board 10 and the flexible board 20 are overlapped so that the holes 12 of the printed board 10 and the holes 23 of the flexible board 20 are aligned. When the two substrates are overlapped with the positions of the holes aligned, the protrusions 31 of the fixing block 30 are inserted into the holes of the two substrates, and the two substrates are fixed by the fixing block 30. At this time, an adhesive can be applied to the protruding portion 31 for bonding. A method of fixing the printed board 10 and the flexible board 20 by press-fitting by setting the size of the holes of the printed board 10 and the flexible board 20 and the size of the protrusion 31 of the fixed block 30 to a predetermined size at the design stage; You can also

  When the printed board 10 and the flexible board 20 are fixed by the fixing block 30, a conductive adhesive is injected into the adhesive filling hole 32. The conductive adhesive injected into the adhesive filling hole 32 is filled up to the surface of the pad 11 of the printed board 10 through the pad hole 22 of the flexible board 20. When injection of the conductive adhesive is finished, the conductive adhesive is cured by a predetermined method. By forming the layer of the conductive adhesive 33 in which the adhesive is cured, the pad 11 of the printed circuit board 10 and the pad 21 of the flexible circuit board 20 are fixed to each other and electrically connected in a stable state. It becomes.

  In the electronic device of this embodiment, the printed circuit board 10 and the flexible circuit board 20 are fixed by a fixing block 30 having a protrusion 31. In addition, the conductive adhesive 33 is filled around the pads of the two boards fixed by the fixing block 30, and the pads of the printed board 10 and the flexible board 20 are fixed and electrically connected in a stable state. ing. With such a configuration, in the electronic device of the present embodiment, the printed circuit board 10 and the flexible circuit board 20 can be easily and accurately aligned, and the terminals of the two boards are fixed and the electrical terminals are electrically connected. Connection can also be easily performed by the conductive adhesive 33. Further, in the electronic device according to the present embodiment, the alignment is high because the protrusion 31 is aligned when the substrate is connected, and the electrical connection can be easily and reliably performed by the conductive adhesive 33. A high yield can be obtained.

  A second embodiment of the present invention will be described with reference to the drawings. 5 and 6 show an outline of the configuration of the electronic device according to the present embodiment. FIG. 5 shows each component and the positional relationship with each other, and FIG. 6 shows a diagram when the components are actually combined. In the first embodiment, as shown in FIGS. 1 and 2, the pads are arranged in a line, but in the electronic device of the present embodiment, the pads are arranged in a staggered arrangement. The electronic device according to the present embodiment includes a printed circuit board 10, a flexible substrate 20, and a fixed block 30.

  The printed circuit board 10 includes a pad 11 and a hole 12. The configuration, material, and the like of each part of the printed circuit board 10 are the same as the parts having the same names in the first embodiment except for the arrangement of the pads 11. The material of the pad 11 is the same as that of the pad of the first embodiment, and the arrangement in the printed circuit board 10 is different from that of the first embodiment. As shown in FIG. 3, the pads 11 of this embodiment are arranged in two rows. Further, the pads 11 are alternately arranged for each column. The arrangement as shown in FIG. 5 is called a staggered arrangement. The pads 11 may be arranged in three or more rows. In that case, the pads 11 in adjacent rows are arranged alternately.

  The flexible substrate 20 includes a pad 21, a pad hole 22, and a hole 23. The configuration and material of the flexible substrate 20 are the same as the parts having the same names in the first embodiment except for the arrangement of the pads 21 and the pad holes 22. The configurations and materials of the pads 21 and the pad holes 22 are the same as the parts having the same names in the first embodiment, and the arrangement in the flexible substrate 20 is different from that in the first embodiment. The pads 21 and the pad holes 22 of this embodiment are arranged in a staggered arrangement as shown in FIG. The pads 21 and the pad holes 22 are arranged so as to correspond to the pads 11 of the printed circuit board 10.

  The fixed block 30 includes a protrusion 31 and an adhesive filling hole 32. The configuration and material of the fixing block 30 are the same as those of the same site in the first embodiment except for the arrangement of the adhesive filling hole 32. The adhesive filling holes 32 are formed in a staggered arrangement so as to correspond to the pads 11 of the printed board 10 and the pads 21 of the flexible board 20.

  A space formed by the adhesive filling hole 32 of the fixed block 30 and the pad hole 22 of the flexible substrate 20 is filled with the conductive adhesive 33. Further, the electronic device assembling method and the flow of electric signals of this embodiment are the same as those of the first embodiment.

  In the electronic device of this embodiment, the pads of the printed circuit board 10 and the flexible substrate 20 are arranged in a staggered arrangement. Therefore, more terminals can be arranged as compared with the electronic device of the first embodiment, so that a more complicated circuit can be handled without increasing the area of the substrate. Further, similarly to the first embodiment, by fixing the substrate by the fixing block 30, it is possible to suppress the displacement of the pads of the printed circuit board 10 and the flexible substrate 20 at the time of manufacture. The effect of improving the yield due to the suppression of the positional deviation is particularly remarkable in the present embodiment in which the pads are densely arranged.

  A third embodiment of the present invention will be described with reference to the drawings. 7 and 8 show an outline of the configuration of the electronic device according to the present embodiment. FIG. 7 shows each component and the positional relationship with each other, and FIG. 8 shows a diagram when the components are actually combined. In the first embodiment and the second embodiment, the printed circuit board and the flexible substrate pad are formed in substantially the same size, but in this embodiment, the printed circuit board pad is made larger than the flexible substrate. The electronic device according to the present embodiment includes a printed circuit board 10, a flexible substrate 20, and a fixed block 30.

  The printed circuit board 10 includes a pad 13 and a hole 12. The configuration and material of the printed circuit board 10 are the same as those in the first embodiment except that the pad 13 is formed larger than the pad 24 of the flexible substrate 20. The flexible substrate 20 includes a pad 24, a pad hole 25, and a hole 22. The configuration and material of the flexible substrate 20 are the same as those in the first embodiment except that the pad 24 is formed smaller than the pad 13 of the printed circuit board 10. The fixed block 30 includes a protrusion 31 and an adhesive filling hole 34. The adhesive filling hole 34 of the fixed block 30 is formed according to the size of the pad 13 of the printed circuit board 10. Except for the size of the adhesive filling hole 34, the configuration and material of the fixing block 30 are the same as those in the first embodiment.

  As shown in FIG. 8, the electronic device of the present embodiment is laminated in the order of a printed circuit board 10, a flexible substrate 20, and a fixed block 30. FIG. 9 shows a cross-sectional view of the structure in the vicinity of the pad of the electronic device of this embodiment when stacked as shown in FIG. As shown in FIG. 9, the pad 24 of the flexible board 20 is formed smaller than the pad 13 of the printed board 10. That is, a part of the pad 13 of the printed board 10 has a portion that does not overlap with the pad 24 of the flexible board 20. The adhesive filling hole 34 of the fixed block 30 is also formed larger than the pad 24 of the flexible substrate 20. In addition, in the adhesive filling hole 34 of the fixed block 30, an opening is formed in a direction extending from the end surface of the flexible substrate 20 to substantially the same position as the end of the pad 13 of the printed substrate 10. The space formed by the adhesive filling hole 34 of the fixed block 30 and the pad hole 25 of the flexible substrate 20 is filled with the conductive adhesive 33. The conductive adhesive 33 is filled so as to cover the pads 13 of the printed circuit board 10 formed larger than the pads 24 of the flexible circuit board 20.

  The method for assembling the electronic device and the flow of electrical signals in this embodiment are the same as those in the first embodiment. Further, the configuration in which the pads 13 of the printed circuit board 10 are formed larger than the pads 24 of the flexible substrate 20 of the present embodiment can be used in combination with the configuration in which the pads and the like of the second embodiment are arranged in a staggered arrangement.

  In the electronic device according to the present embodiment, the pad 13 of the printed board 10 is formed larger than the pad 24 of the flexible board 20, so that the area where the conductive adhesive 33 is in contact with the pad 13 of the printed board 10 is increased. For this reason, the adhesive force is improved and a stable adhesive strength can be obtained, so that the connection portion is hardly peeled off. By making it difficult for the connection portion to be peeled off, reliability at the time of manufacturing or using the electronic device is improved. Further, since the adhesive filling hole 34 of the fixed block 30 is formed large, it is easy to inject a conductive adhesive during manufacturing. In addition, since it becomes easy to inject the conductive adhesive at the time of manufacturing, generation of voids due to insufficient injection of the conductive adhesive can be suppressed, thereby improving yield and reliability.

  A fourth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 10 shows a cross-sectional structure of an electronic device according to an embodiment of the present invention. In the first embodiment, the size of the adhesive filling hole is the same on both sides of the fixed block, but in this embodiment, the hole on the opposite side is formed larger than the side facing the substrate. doing.

  The electronic device of this embodiment includes a printed circuit board 10, a flexible substrate 20, and a fixed block 30. As shown in FIG. 10, the electronic device of the present embodiment is laminated in the order of a printed board 10, a flexible board 20, and a fixed block 30. Except for the size of the adhesive filling hole 35 of the fixed block 30, the configurations and materials of the printed board 10, the flexible board 20, and the fixed block 30 are the same as those in the first embodiment.

  As shown in FIG. 10, the adhesive filling hole 35 of the fixed block 30 is formed so that the opening on the opposite surface is larger than the opening on the surface on the printed circuit board 10 and flexible substrate 20 side. . The size of the opening of the adhesive filling hole 35 on the surface of the printed board 10 and the flexible board 20 is designed according to the size of the pad and the like. Further, the space formed by the adhesive filling hole 35 and the pad hole 22 of the flexible substrate 20 is filled with the conductive adhesive 33 as in the first embodiment. Further, the electronic device assembling method and the flow of electric signals of this embodiment are the same as those of the first embodiment. The technique of enlarging the opening on the side opposite to the substrate of the adhesive filling hole 35 of the fixing block 30 of this embodiment can also be used in combination with the configuration of the second embodiment, the third embodiment, or both. .

  In the electronic device according to the present embodiment, the size of the opening of the adhesive filling hole 35 is changed on both sides of the fixed block 30. That is, the opening on the side facing the printed circuit board 10 and the flexible board 20 is sized according to the pad of the board, and the opening on the opposite side is larger than the opening on the side facing the printed circuit board 10 and the flexible board 20. ing. With such a configuration, it is possible to easily inject a conductive adhesive while maintaining the density of pads formed on the printed circuit board 10 and the flexible circuit board 20, that is, terminals. Therefore, even when the circuit of the electronic device is complicated, since the manufacturing can be easily performed, an improvement in yield can be expected.

  A fifth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 11 shows a cross-sectional view of the electronic device of this embodiment. In the present embodiment, current leakage due to the wraparound of the adhesive or the like is suppressed by forming a wall between the adhesive filling holes of the fixed block.

  The electronic device of this embodiment includes a printed circuit board 10, a flexible substrate 20, and a fixed block 30. As shown in FIG. 11, the electronic device of the present embodiment is laminated in the order of a printed circuit board 10, a flexible substrate 20, and a fixed block 30. Except for the wall 36 formed near the adhesive filling hole 35 of the fixed block 30, the configurations and materials of the printed board 10, the flexible board 20, and the fixed block 30 are the same as those in the fourth embodiment.

  A wall 36 is formed between the adhesive filling holes 35 of the fixed block 30. The wall 36 is formed on the surface of the fixed block 30 on the printed board 10 and flexible board 20 side so that the portion between the adhesive filling holes 35 increases in thickness on the printed board 10 and flexible board 20 side. The wall 36 is formed so as to be in contact with the flexible substrate 20, and has a space between the fixed block 30 and the flexible substrate 20 in a region where the adhesive filling hole 35 is not disposed. Further, the space formed by the adhesive filling hole 35 and the pad hole 22 of the flexible substrate 20 is filled with the conductive adhesive 33 as in the first embodiment.

  The method for assembling the electronic device and the flow of electrical signals in this embodiment are the same as those in the first embodiment. The technique of providing the wall 36 between the adhesive filling holes 35 of the fixing block 30 of this embodiment can also be used in combination with the configurations of the second embodiment, the third embodiment, or both.

  In the electronic device of this embodiment, a wall 36 is formed between the adhesive filling holes 35 of the fixed block 30. Therefore, it is possible to suppress the adhesive from flowing to the adjacent pad, that is, the adjacent terminal side when the conductive adhesive is injected. By suppressing the flow of the adhesive to the adjacent terminal side, it is possible to prevent the leakage of current between the terminals via the flowing conductive adhesive. Therefore, the yield at the time of manufacture of an electronic device, the reliability at the time of use, etc. improve.

  A sixth embodiment of the present invention will be described with reference to the drawings. 12 and 13 show an outline of the configuration of the electronic apparatus of this embodiment. FIG. 12 shows each component and the positional relationship with each other, and FIG. 13 shows a diagram when the components are actually combined. In the first embodiment, the substrate is fixed by the protrusions formed in the fixed block and the holes formed in the printed circuit board and the flexible substrate. In the present embodiment, the substrate is fixed by the claws formed in the fixed block.

  The electronic device according to the present embodiment includes a printed circuit board 40, a flexible substrate 50, and a fixed block 60. In addition, as shown in FIG. 13, the electronic device of the present embodiment is laminated in the order of the printed circuit board 40, the flexible substrate 50, and the fixed block 60, and is fixed by the claw 61 of the fixed block.

  The printed board 40 includes a pad 41. The configuration and material of the pad 41 are the same as those of the printed circuit board according to the first embodiment. The configuration and material of the printed circuit board 40 are the same as those in the first embodiment except that the holes are not provided. The flexible substrate 50 includes a pad 51 and a pad hole 52. The configuration and material of the pad 51 and the pad hole 52 are the same as the pad and the pad hole of the flexible substrate of the first embodiment. The configuration and material of the flexible substrate 50 are the same as those in the first embodiment except that the hole is not provided.

  The fixed block 60 includes a claw 61 and an adhesive filling hole 62. As shown in FIGS. 12 and 13, the claw 61 of the fixed block 60 has a structure in which the printed circuit board 40 and the flexible substrate 50 are sandwiched between the surface of the fixed block 60 that contacts the printed circuit board 40 and the flexible substrate 50 and the claw 61. Yes. Therefore, the printed board 40 and the flexible board 50 can be fixed by attaching the fixing block 60 in a state where the printed board 40 and the flexible board 50 are overlapped. Further, as in the first embodiment, resin, metal, or the like can be used as the material of the fixed block 60. In the case where metal is used as the material of the fixed block 60, the surface is insulated. Further, the flow of electrical signals and the like in the electronic device of this embodiment stacked as shown in FIG. 13 are the same as those of the first embodiment.

  Next, a method for assembling the electronic device of this embodiment will be described. The printed circuit board 40 and the flexible circuit board 50 are stacked so that predetermined positions are aligned. The alignment is performed by a method of aligning with an outer shape such as an end face of the substrate, or by forming a mark for position adjustment on the substrate and aligning the mark. When the printed board 40 and the flexible board 50 are overlapped, the fixing block 60 is attached to the printed board 40 and the flexible board 50. The fixing block 60 is attached so as to sandwich the printed circuit board 40 and the flexible circuit board 50 that are overlapped by the claw 61. When the fixing block 60 is attached, a conductive adhesive is injected into the adhesive filling hole 62 from the surface opposite to the surface in contact with the printed circuit board 40 and the flexible circuit board 50. The conductive adhesive injected into the adhesive filling hole 62 is filled up to the surface of the pad 41 of the printed board 40 through the pad hole 52 of the flexible board 50. When injection of the conductive adhesive is finished, the conductive adhesive is cured by a predetermined method. By curing to form a layer of the conductive adhesive 63, the pad 41 of the printed circuit board 40 and the pad 51 of the flexible circuit board 50 are bonded to each other and electrically connected in a stable state by the conductive component. It becomes.

  The structure which fixes a board | substrate with the nail | claw 61 of this embodiment can be used in combination with the structure in any one of 2nd-5th embodiment, or those combined. In this case, similarly to the fixed block 60 of the present embodiment, a fixed block on which no protrusion is formed is used.

  In the electronic device of this embodiment, the printed circuit board 40 and the flexible circuit board 50 are fixed by the claws 61 provided in the fixed block 60. It is not necessary to provide an area for forming a hole by fixing with the claw 61, and an area where pads, that is, terminals can be arranged on the printed board 40 and the flexible board 50 is widened. In addition, the conductive adhesive can be filled from the adhesive filling hole 62 in a state where the printed circuit board 40 and the flexible circuit board 50 are overlapped and fixed by the fixing block 60, so that the positional displacement between the terminals does not occur. Adhesion work can be easily performed. Therefore, the yield at the time of manufacturing the electronic device is improved.

  In the first to sixth embodiments, the example in which the printed circuit board and the flexible substrate pad are connected has been described. However, the configuration of each embodiment may be used for connection between the printed circuit boards or between the flexible substrates. Further, in the first to sixth embodiments, the example in which the pad is made of metal has been described. However, the pad and circuit wiring may be formed of a conductive polymer, conductive carbon, or the like. In the first to sixth embodiments, the conductive adhesive used is a dispersion of a conductive material such as a metal, but the conductive adhesive is only a resin layer made of a conductive polymer. You can also

  A seventh embodiment of the present invention will be described in detail with reference to the drawings. FIG. 14 shows an outline of the configuration of the electronic apparatus of this embodiment. The electronic device according to the present embodiment includes a first substrate 71, a second substrate 72, and a fixing member 73. The first substrate 71 has a first terminal. The second substrate 72 is formed with a first through hole and has a second terminal penetrated by the first through hole. The fixing member 73 has a second through hole, and fixes the second substrate 72 to the first substrate 71. So that there is a projection plane in which the orthogonal projection of each of the opening of the second through hole on the first substrate side 71, the first through hole, and the first terminal onto that surface has a common part, The first substrate 71 and the second substrate 72 are fixed by a fixing member 73. The first through hole is filled with a conductive material.

  In the electronic device of this embodiment, the connection between the terminals of the first substrate 71 and the second substrate 72 is performed using the fixing member 73 and the conductive adhesive. The positions of the first terminal of the first substrate 71, the second terminal of the second substrate, and the first hole of the fixing member 73 are substantially matched, and the two substrates are stacked on the substrate of the fixing member 73. The structure is such that a conductive material can be injected from the side opposite to the contact surface. By using the fixing member 73, it is only necessary to inject a conductive adhesive into the first hole having a constant volume, and precise control of the amount of the adhesive when connecting the substrates is eased. Therefore, the electronic device according to the present embodiment can easily connect the substrates. In addition, since the terminals are connected and bonded using a conductive adhesive, damage to the terminals of the first substrate 71 and the second substrate 72 is small, and a decrease in reliability can be suppressed. .

  A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.

  [Appendix 1] A first substrate having a first terminal, a second substrate having a second terminal formed with a first through hole and penetrating through the first through hole, and a second substrate A through-hole, and a fixing member that fixes the second substrate to the first substrate, the opening on the first substrate side of the second through-hole, and the first through-hole And the first substrate and the second substrate are fixed by the fixing member such that there is a projection surface in which the orthogonal projection of each of the first terminals onto the surface has a common part, An electronic device, wherein the first through hole is filled with a conductive substance.

  [Supplementary Note 2] In Supplementary Note 1, the orthogonal projection of the opening of the second through hole on the side opposite to the first substrate side onto the projection plane has a common part with the common part. The electronic device described.

  [Supplementary Note 3] A first substrate having a first terminal, a second substrate having a second terminal formed with a first through hole and penetrating through the first through hole, and a second substrate A through-hole, and a fixing member that fixes the second substrate to the first substrate, and when viewed from a direction substantially perpendicular to the plane of the first substrate, The first substrate and the second substrate are fixed by the fixing member so that the positions of the through holes of the first and the first through holes and the first terminals substantially coincide with each other. An electronic device, wherein the through hole is filled with a conductive substance.

  [Appendix 4] The first substrate includes a first fixing hole, the second substrate includes a second fixing hole, and the fixing member includes a protrusion formed in a protruding shape. The electronic device according to any one of appendices 1 to 3, wherein the protrusion is inserted into the first fixing hole and the second fixing hole.

  [Supplementary Note 5] The fixing member includes a fixing claw, and the first substrate and the second substrate are provided between the first substrate and the second substrate side surface of the fixing member and the claw. 4. The electronic device according to claim 1, wherein the second substrate is fixed to the first substrate by sandwiching the substrate.

  [Appendix 6] The electronic device according to any one of appendices 1 to 5, wherein the first through hole and the second through hole are continuously filled with the conductive material.

  [Appendix 7] The electronic device according to any one of claims 1 to 6, wherein a connection portion in which the first terminal and the second terminal are combined is provided in a staggered arrangement.

  [Supplementary Note 8] An area of the first terminal is formed to be larger than an area of the second terminal, and the area of the first terminal portion, the first substrate, and the first of the fixing member The electronic device according to any one of appendices 1 to 7, wherein the area of the opening of the second through hole on the surface of the second substrate is substantially equal.

  [Supplementary Note 9] The area of the opening of the second through hole of the fixing member is closer to the first substrate and the second substrate than to the surface on the first substrate and the second substrate side. 9. The electronic device according to any one of appendices 1 to 8, wherein a surface on the opposite side to the side is larger.

  [Supplementary Note 10] The electronic device according to any one of Supplementary notes 1 to 9, wherein a portion between the opening portions of the second through holes of the fixing member is in contact with the second substrate.

  [Supplementary Note 11] A second substrate is fixed to a substrate of the first substrate with a fixing member, a conductive material is injected from a second through hole formed in the fixing member, and the second substrate A method for assembling an electronic device, comprising filling a first through hole formed in each of the two terminals with a conductive material.

  [Supplementary Note 12] When the first through hole is filled with the conductive material, the conductive material is in contact with the first terminal of the first substrate. The electronic device assembling method according to claim 11.

  [Appendix 13] When the second substrate is fixed to the substrate of the first substrate by the fixing member, the first terminal of the first substrate, the first of the second substrate Fixing the projection surface such that an orthogonal projection of the through hole and the opening of the fixing member on the first substrate side of the second through hole has a common part. Item 13. The electronic device assembling method according to appendix 11 or 12,

  [Supplementary Note 14] When the second substrate is fixed to the substrate of the first substrate by the fixing member, the opening on the first substrate side of the second through hole, the second through hole The projection surface is fixed such that there is a common part of the orthogonal projection of the opening on the opposite side of the first substrate, the first through hole, and the first terminal to the surface of the first substrate. 13. An electronic device assembling method according to appendix 11 or 12, wherein the electronic device is assembled.

  [Supplementary Note 15] When the second substrate is fixed to the substrate of the first substrate with the fixing member, the second substrate is viewed from a direction substantially perpendicular to the plane of the first substrate. The first substrate and the second substrate are fixed by the fixing member so that the positions of the through holes of the first substrate and the positions of the first through holes and the first terminals substantially coincide with each other. 13. An electronic device assembling method according to appendix 11 or 12.

  [Supplementary Note 16] When the second substrate is fixed to the first substrate with the fixing member, the first substrate and the second substrate have the protrusions included in the fixing member. The electronic device assembling method according to any one of appendices 11 to 15, wherein the electronic device is inserted into a hole.

  [Supplementary Note 17] When the second substrate is fixed to the first substrate with the fixing member, the first substrate and the second substrate side surface of the fixing member, and the fixing member 16. The electronic device assembling method according to any one of appendices 11 to 15, wherein the first substrate and the second substrate are fixed by a claw formed for fixing.

  [Supplementary note 18] The electronic device assembling method according to any one of Supplementary notes 11 to 17, wherein the conductive substance is a conductive adhesive.

  INDUSTRIAL APPLICABILITY The present invention can be used as a connection technology between substrates used in information communication devices, industrial machines, household electric devices, and other electronic devices.

DESCRIPTION OF SYMBOLS 10 Printed circuit board 11 Pad 12 Hole 13 Pad 20 Flexible board 21 Pad 22 Pad hole 23 Hole 24 Pad 25 Pad hole 30 Fixed block 31 Protrusion part 32 Adhesive filling hole 33 Conductive adhesive 34 Adhesive filling hole 35 Adhesive filling hole 36 Wall 40 Printed Circuit Board 41 Pad 50 Flexible Board 51 Pad 52 Pad Hole 60 Fixed Block 61 Claw 62 Adhesive Filling Hole 71 First Board 72 Second Board 73 Fixing Member

Claims (10)

A first substrate having a first terminal;
A second substrate having a second terminal formed with a first through hole and penetrating through the first through hole;
A second through hole is formed, and a fixing member that fixes the second substrate to the first substrate,
There is a projection plane in which the orthogonal projection of each of the second through hole on the first substrate side, the first through hole, and the first terminal has a common portion. The first substrate and the second substrate are fixed by the fixing member,
The electronic device, wherein the first through hole is filled with a conductive material.   2. The electron according to claim 1, wherein an orthographic projection onto the projection plane of the opening portion on the opposite side of the second through hole from the first substrate side has a portion shared with the common portion. apparatus. A first substrate having a first terminal;
A second substrate having a second terminal formed with a first through hole and penetrating through the first through hole;
A second through hole is formed, and a fixing member that fixes the second substrate to the first substrate,
When viewed from a direction substantially perpendicular to the plane of the first substrate, the position of the second through hole and the position of the first through hole and the first terminal substantially coincide with each other. The first substrate and the second substrate are fixed by the fixing member;
The electronic device, wherein the first through hole is filled with a conductive material. The first substrate includes a first fixing hole;
The second substrate includes a second fixing hole;
The fixing member includes a protruding portion formed in a protruding shape,
4. The electronic device according to claim 1, wherein the protruding portion is inserted into the first fixing hole and the second fixing hole. 5. The fixing member includes a fixing claw,
The first substrate and the second substrate are sandwiched between the first substrate and the second substrate side surface of the fixing member and the claw, and the first substrate and the first substrate are sandwiched. The electronic device according to claim 1, wherein the second substrate is fixed.   6. The electronic device according to claim 1, wherein a connection portion in which the first terminal and the second terminal are combined is provided in a staggered arrangement.   The area of the first terminal is formed so as to be larger than the area of the second terminal, and the area of the first terminal portion and the first substrate and the second substrate side of the fixing member 7. The electronic device according to claim 1, wherein the areas of the openings of the second through holes on the surface of the surface are substantially equal.   The area of the opening of the second through-hole of the fixing member is opposite to the first substrate and the second substrate side than the surface of the first substrate and the second substrate side. The electronic device according to claim 1, wherein the surface of the electronic device is larger.   9. The electronic device according to claim 1, wherein a portion between the openings of the second through hole of the fixing member is in contact with the second substrate. Fixing the second substrate to the substrate of the first substrate with a fixing member;
Injecting a conductive substance from the second through hole formed in the fixing member,
A method of assembling an electronic device, comprising filling a first through hole formed in a terminal of the second substrate with a conductive material.

Images