JP2014177068A - Method and device for cleavage of single crystal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for cleavage of a single crystal that can easily perform cleavage of a single crystal, even if it is a single crystal requiring power above a certain level in cleavage like a single crystal diamond, and also having a cleavage plane inclined to a crystalline surface.SOLUTION: A method for cleavage of a single crystal includes: a groove forming step of forming grooves along a cleavage plane of the single crystal on the surface of the single crystal; and a cleavage step of performing cleavage of the single crystal along the cleavage plane to divide the single crystal into pieces by, after fixing the single crystal formed with the grooves and inserting the tip of a cutter blade in the groove, applying an ultrasonic wave to the single crystal from the surface other than the surface with the grooves formed thereon while pressurizing the bottom of the groove along the cleavage plane with the tip of the cutter blade. Also, a device for cleavage of the single crystal including means used in the cleavage method is provided.

Description

  The present invention relates to a method for cleaving a single crystal body and a cleavage apparatus for cleaving the single crystal body to obtain single crystal pieces used for tools such as cutting tools and wear-resistant tools.

  Among tools such as cutting tools and anti-abrasion tools, tools for high-precision machining techniques are obtained by dividing a single crystal such as single crystal diamond into small pieces for reasons such as being resistant to mechanical wear. It is used.

  In order to divide a crystal, a dividing method using the property that the crystal is easily broken along the cleavage plane is widely used, and various techniques have been developed.

  For example, Patent Document 1 discloses that a crystalline wafer is produced by ultrasonic power using a breaking cutter and an ultrasonic horn that supports the breaking cutter and vibrates the breaking cutter in a predetermined direction. A method of dividing is proposed.

  In Patent Document 2, a marking line is formed on the material substrate, and stress is applied in a direction perpendicular or parallel to the marking line forming surface while applying high frequency vibration such as ultrasonic vibration from the marking line forming surface or the back surface side. A method of cleaving by adding is proposed.

  Further, in Patent Document 3, a groove parallel to the (111) crystal plane is provided on the surface of a diamond single crystal using any one of an ion beam, an electron beam, and a laser, and a wedge is driven into this groove. A method of dividing single crystal diamond has been proposed.

JP 10-163134 A JP 2002-75914 A JP-A-3-138106

  However, in the case of the method of Patent Document 1, since the ultrasonic power is not sufficiently transmitted to the cutter blade, even if it is applied to the cleavage of a single crystal such as single crystal diamond, it can be appropriately cleaved due to insufficient power. Can not. Further, since the cutter blade is vibrated, the cutter blade is easily damaged and consumed, and needs to be frequently replaced. And since the cutter blade and the ultrasonic vibration part are connected, it is difficult to position the cutter blade with respect to the cleavage plane, and it is necessary to adjust the ultrasonic conditions each time the cutter blade is replaced.

  The method of Patent Document 2 is a method for a flat substrate such as a wafer, and is applied when cleaving a single crystal body whose cleavage plane is inclined with respect to a surface such as single crystal diamond. Can not do it.

  Further, in the case of the method of Patent Document 3, an excessive force is required to drive the wedge into the provided groove, and it cannot be easily cleaved.

  Therefore, the present invention can easily be applied to a single crystal body that requires a certain level of power for cleavage, such as single crystal diamond, and whose cleavage plane is inclined with respect to the crystal surface. It is an object to provide a cleavage method and a cleavage apparatus for a single crystal that can be cleaved.

The invention described in claim 1
A groove forming step of forming a groove along the cleavage plane of the single crystal on the surface of the single crystal;
After fixing the single crystal body in which the groove portion is formed and inserting the tip of the cutter blade into the groove portion, the groove portion is pressed while pressing the bottom of the groove portion along the cleavage plane with the tip of the cutter blade. A cleaving step of cleaving the single crystal along the cleavage plane and dividing the single crystal into individual pieces by applying ultrasonic waves to the single crystal from a plane other than the formed plane. Cleaving method.

  In the invention according to the present invention, since the ultrasonic wave is applied to the single crystal body while pressing the bottom of the groove portion along the cleavage plane with the tip of the cutter blade, a sufficient force is applied to the bottom of the groove portion. The body can be easily cleaved and divided into pieces.

  And since ultrasonic waves are applied to the single crystal body rather than applying ultrasonic waves to the cutter blade itself, it is possible to transmit sufficient ultrasonic power to the bottom of the groove, without applying excessive force. In addition, the single crystal can be easily cleaved.

  In addition, since the cutter blade is not vibrated ultrasonically, the cutter blade is less likely to be damaged and consumed, and there is no need to adjust the ultrasonic conditions each time the cutter blade is replaced, and the cutter blade can be easily positioned. Can do. As a result, it is possible to accurately and reliably cleave even a single crystal body in which a cleavage plane such as single crystal diamond is inclined with respect to the surface.

  Due to the above characteristics, the cleavage apparatus of the present invention can easily automate the cleavage operation of a single crystal such as single crystal diamond, which has been difficult in the past.

The invention described in claim 2
2. The method for cleaving a single crystal according to claim 1, wherein the groove forming step is a step of forming the groove by irradiating a surface of the single crystal with a laser.

  The method of forming the groove portion by irradiating the laser can form the groove portion along the cleavage plane easily and with higher accuracy than the method of ruled the surface of the crystal using a tool or the like.

The invention according to claim 3
3. The method for cleaving a single crystal according to claim 1, wherein in the cleaving step, an ultrasonic wave is applied to the single crystal from a surface opposite to a surface on which the groove is formed.

  By applying ultrasonic waves to the single crystal body from the surface opposite to the surface on which the groove portions are formed, it is possible to appropriately apply ultrasonic waves to the groove portions and to easily position the cutter blade.

The invention according to claim 4
A cleavage method for cleaving a single crystal diamond using the method for cleaving a single crystal according to any one of claims 1 to 3.

  The method for cleaving a single crystal according to the present invention can accurately and reliably cleave a single crystal having a cleaved surface with respect to the surface, so that single crystal diamond, sapphire, SiC, etc. On the other hand, it can be preferably applied to the cleavage of a single crystal having an inclined cleavage plane, and among these, particularly when applied to the cleavage of a very hard single crystal diamond, the effect of the present invention is remarkably exhibited. be able to.

The invention described in claim 5
A fixing member that fixes a single crystal body having grooves formed along the cleavage plane on the surface thereof on a surface different from the groove forming surface;
A cutter blade whose tip is inserted into the groove portion of the fixed single crystal body;
A pressurizing part for pressurizing the bottom of the groove part along the cleavage plane at the tip of the cutter blade;
An apparatus for cleaving a single crystal, comprising: an ultrasonic wave application unit that is attached to the fixing member and applies ultrasonic waves from the fixing member to the single crystal.

  In the present invention, as described above, an ultrasonic wave is applied to the single crystal while pressing the bottom of the groove portion along the cleavage plane with the tip of the cutter blade, so that a sufficient force is applied to the bottom of the groove portion. A single crystal can be easily cleaved and divided into pieces.

  In addition, since ultrasonic waves are applied to the single crystal body rather than applying ultrasonic waves to the cutter blade itself, it is possible to transmit sufficient ultrasonic power to the bottom of the groove, without applying excessive force. In addition, the single crystal can be easily cleaved.

The invention described in claim 6
The single crystal cleaving apparatus according to claim 5, wherein the fixing member is a member that is detachable from the ultrasonic vibration section.

  In the invention of this claim, since the fixing member can be removed from the ultrasonic vibration part, the single crystal body (work) that has been subjected to the cleaving work can be easily replaced, and the groove forming step and the cleaving step The workpiece can be easily moved between the two.

The invention described in claim 7
The single crystal cleavage apparatus according to claim 5 or 6, wherein the fixing member is formed of any one of stainless steel, copper, and aluminum alloy.

  The fixing member is preferably made of a material having high ultrasonic conductivity. Since stainless steel, copper, and aluminum alloys are inexpensive and have high ultrasonic conductivity, ultrasonic waves oscillated from the ultrasonic wave application unit can be efficiently applied to the single crystal.

  According to the present invention, even a single crystal body that requires a certain level of power for cleavage, such as single crystal diamond, and whose cleavage plane is inclined with respect to the surface of the crystal can be easily obtained. A cleavage method and a cleavage apparatus for a single crystal that can be cleaved can be provided.

It is a figure which shows typically the whole structure of the cleavage apparatus which concerns on one embodiment of this invention. It is the elements on larger scale of the cleavage apparatus of FIG.

  Hereinafter, the present invention will be described in detail based on embodiments.

1. Cleaving apparatus First, a single crystal cleavage apparatus according to the present embodiment will be described. FIG. 1 is a diagram schematically showing the overall configuration of the cleavage apparatus according to the present embodiment, and FIG. 2 is a partially enlarged view.

  As shown in FIGS. 1 and 2, the cleavage device 1 includes a fixing member 3 that fixes the single crystal W, a cutter blade 2 in which the tip 2 a is inserted into the groove W <b> 1 of the fixed single crystal W, and a cutter blade 2 is attached to a fixing member 3 and a pressurizing cylinder 6 as a pressurizing unit for pressurizing the bottom of the groove W1 along the cleavage surface with the tip 2a of the ultrasonic wave from the fixing member 3 to the single crystal W. And an ultrasonic horn 4 as an ultrasonic wave application unit for applying. Reference numeral 5 in FIG. 2 denotes an adhesive that fixes the single crystal body W and the fixing member 3, and a groove W1 along the cleavage plane is formed on the surface of the fixed single crystal body W.

  The ultrasonic horn 4 is provided with a concave portion 41 for attaching the fixing member 3 to the upper portion, and serves as a pedestal in addition to the role as an ultrasonic wave application unit that applies ultrasonic waves to the single crystal W. Yes. The ultrasonic horn 4 is formed of duralumin or the like.

  The fixing member 3 is an L-shaped member formed of stainless steel, copper, aluminum alloy or the like, and is detachable so that the bottom surface 3a and the side surface 3b are in contact with the bottom surface and the side surface of the recess 41 of the ultrasonic horn 4, respectively. Is attached.

  The cutter blade 2 is disposed above the ultrasonic horn 4 and is movable in the vertical direction. The cutter blade 2 is disposed so that the tip 2a of the cutter blade is inserted into the groove W1 of the single crystal W fixed to the fixing member 3, and can be pressurized with a predetermined pressure in the direction of arrow P by the pressurizing unit. ing.

2. Cleaving method Next, a cleavage method using the cleavage device 1 will be described. First, the adhesive 5 is applied to the bottom surface 3 a of the fixing member 3 removed from the ultrasonic horn 4, and the single crystal body W is arranged so that the cleavage plane of the single crystal body W is substantially parallel to the side surface 3 b of the fixing member 3. To fix.

  Next, a plurality of groove portions W <b> 1 along the cleavage plane of the single crystal body W are formed on the surface of the single crystal body W fixed to the fixing member 3. A preferable interval between the groove portions W1 is 0.2 to 0.6 mm.

  As a means for forming the groove portion W1, for example, a laser scribing method in which a laser such as a YAG laser (output: 10 W) is irradiated on the surface of the single crystal body W and run along the cleavage plane is used. Specifically, the groove portion W1 is formed to such a depth that the cutter blade 2 can be properly inserted by adjusting the intensity and traveling speed of the laser.

  Next, the fixing member 3 is attached to the concave portion 41 of the ultrasonic horn 4 and fixed so that the groove W1 faces upward. Thereafter, the cutter blade 2 is lowered, and the tip 2a of the cutter blade is inserted into the groove W1. And the predetermined stress P is applied with respect to the cutter blade 2, and the cutter blade 2 inserted in the bottom of the groove part W1 is further dropped toward the cleavage direction of the single crystal body W. The magnitude of the stress P is appropriately adjusted according to the material of the single crystal body W and the like.

  At this time, by applying stress P to the single crystal body W and simultaneously oscillating ultrasonic waves from the ultrasonic horn 4 at a predetermined frequency and intensity, the single crystal body passes through the bottom surface 3a and the side surface 3b of the fixing member 3. An ultrasonic wave is applied to W. Thereby, the single crystal body W is cleaved along the cleavage plane in which the groove portion W1 is formed. Note that the frequency and intensity of ultrasonic waves and the application time of ultrasonic waves are appropriately adjusted according to the type of the single crystal W and the material of the fixing member 3.

  According to the method for cleaving a single crystal according to the present embodiment, since the ultrasonic wave is applied to the single crystal W while pressing the bottom of the groove W1 along the cleavage surface with the tip 2a of the cutter blade 2, the groove W1. The single crystal W can be easily cleaved by applying a sufficient force to the bottom of the substrate.

  Furthermore, since the ultrasonic wave is applied to the single crystal body rather than applying the ultrasonic wave to the cutter blade itself, sufficient ultrasonic power can be transmitted to the bottom of the groove W1, and no excessive force is applied. However, the single crystal body W can be easily cleaved and divided into pieces.

  Next, based on an Example, this invention is demonstrated more concretely. In the following, single crystal diamond is cleaved into a sheet.

1. Formation of Groove A single crystal diamond was fixed to a stainless steel L-shaped fixing member 3 having a height of 5 mm, a width of 7 mm, and a length of 50 mm with a ceramic bond (trade name: Aron Ceramics, manufactured by Toagosei Co., Ltd.).

  Then, the surface of the single crystal diamond is irradiated with a YAG laser (10 W) along the (111) crystal plane, which is the cleavage plane of the single crystal diamond, and 0. A plurality of groove portions W1 were formed in parallel at intervals of 6 mm.

2. Cleavage Next, the fixing member 3 is fixed to the concave portion 41 of the ultrasonic horn 4, the cutter blade 2 (product name: NT Cutter, manufactured by NT Corporation) is fixed to the pressure cylinder 6, and the tip 2 a of the cutter blade 2 is fixed. Inserted into the groove.

  Next, using an ultrasonic device (SONOPET Σ1200) manufactured by Seidensha Electronics Co., Ltd., ultrasonic waves were applied to the single crystal diamond under the conditions of intensity: 70%, frequency: 19.15 kHz, time 0.15 seconds. However, the tip 2a of the cutter blade was inserted in parallel with the groove formed along the cleaved surface, and pressurized with a pressure of 0.165 MPa.

  Thereby, the single crystal diamond was cleaved along the (111) crystal plane which is a cleavage plane.

  Further, the cutter blade 2 was slid at intervals of the groove portions W, and the remaining groove portions W1 were similarly cleaved, whereby single crystal diamond pieces sliced to a thickness of 0.6 mm were obtained. In this way, the single crystal diamond could be easily cleaved into small pieces without damaging the cutter blade 2.

  While the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments. Various modifications can be made to the above-described embodiments within the same and equivalent scope as the present invention.

DESCRIPTION OF SYMBOLS 1 Cleaving device 2 Cutter blade 2a Tip of cutter blade 3 Fixed member 3a Bottom surface 3b of fixed member Side surface 4 of fixed member Ultrasonic horn 41 Recessed portion 5 Adhesive 6 Pressure cylinder W Single crystal W1 Groove portion P Stress direction

Claims (7)

A groove forming step of forming a groove along the cleavage plane of the single crystal on the surface of the single crystal;
After fixing the single crystal body in which the groove portion is formed and inserting the tip of the cutter blade into the groove portion, the groove portion is pressed while pressing the bottom of the groove portion along the cleavage plane with the tip of the cutter blade. A cleaving step of cleaving the single crystal along the cleavage plane and dividing the single crystal into individual pieces by applying ultrasonic waves to the single crystal from a plane other than the formed plane. Cleaving method.   The method for cleaving a single crystal according to claim 1, wherein the groove forming step is a step of forming the groove by irradiating a surface of the single crystal with a laser.   3. The method for cleaving a single crystal according to claim 1, wherein in the cleaving step, ultrasonic waves are applied to the single crystal from a surface opposite to a surface on which the groove is formed.   A cleavage method for cleaving a single crystal diamond using the method for cleaving a single crystal according to any one of claims 1 to 3. A fixing member that fixes a single crystal body having grooves formed along the cleavage plane on the surface thereof on a surface different from the groove forming surface;
A cutter blade whose tip is inserted into the groove portion of the fixed single crystal body;
A pressurizing part for pressurizing the bottom of the groove part along the cleavage plane at the tip of the cutter blade;
An apparatus for cleaving a single crystal, comprising: an ultrasonic wave application unit that is attached to the fixing member and applies ultrasonic waves from the fixing member to the single crystal.   The single crystal cleavage apparatus according to claim 5, wherein the fixing member is a member that is detachable from the ultrasonic vibration unit.   The single crystal cleavage device according to claim 5 or 6, wherein the fixing member is formed of any one of stainless steel, copper, and aluminum alloy.

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