JP2014175455A - Maintenance method, device manufacturing method, program, and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a maintenance method capable of suppressing occurrence of exposure failure.SOLUTION: A maintenance method of an exposure device for exposing a substrate with exposure light through an exposure liquid between the emission surface of an optical member and the substrate. The exposure device has a liquid immersion member for forming a liquid immersion space of the exposure liquid on an object movable under an optical member. The liquid immersion member includes a first member arranged at least partially around the optical path of the exposure light, a second member movable for the first member on the outside of the optical path of the exposure light, and which the object can face, and a first opening. A maintenance method supplies a liquid from the first opening, in the cleaning which is performed in a period different from the exposure processing for exposing the substrate.

Description

  The present invention relates to a maintenance method, a device manufacturing method, a program, and a recording medium.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2009/0046261

  In the exposure apparatus, if at least a part of the exposure apparatus is contaminated, exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide a maintenance method capable of suppressing the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method, a program, and a recording medium that can suppress the occurrence of defective devices.

  According to a first aspect of the present invention, there is provided a maintenance method for an exposure apparatus that exposes a substrate with exposure light via an exposure liquid between an emission surface of the optical member and the substrate, the exposure apparatus comprising: A liquid immersion member that forms an immersion space for the exposure liquid on an object that is movable downward; the liquid immersion member includes a first member that is disposed at least around the optical path of the exposure light; A second member that can be opposed to each other and is movable with respect to the first member outside the optical path of the exposure light, and a first opening, and is performed in a period different from the exposure process in which the substrate is exposed. In the cleaning process, a maintenance method for supplying liquid from the first opening is provided.

  According to the second aspect of the present invention, maintaining by the maintenance method of the first aspect, exposing the substrate using the maintained exposure apparatus, and developing the exposed substrate, A device manufacturing method is provided.

  According to a third aspect of the present invention, there is provided a program for causing a computer to execute control of an exposure apparatus that exposes a substrate with exposure light via an exposure liquid between an emission surface of an optical member and the substrate. The first member disposed at least part of the periphery of the optical path of light can be opposed to an object movable below the optical member, and can move relative to the first member outside the optical path of exposure light. Forming an exposure liquid immersion space on the substrate using an immersion member including the second member; and exposing the substrate with exposure light emitted from an exit surface through the exposure liquid in the immersion space And a liquid immersion member in a cleaning process performed in a period different from the exposure process in which the exposure of the substrate is performed and the movement of the second member with respect to the first member in at least a part of the exposure of the substrate Supply liquid from the first opening Program for executing it and, is provided.

  According to the fourth aspect of the present invention, a computer-readable recording medium on which the program of the third aspect is recorded is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of this invention, generation | occurrence | production of a defective device can be suppressed.

It is a figure which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is sectional drawing which shows an example of the liquid immersion member which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view showing a part of the liquid immersion member according to the first embodiment. It is the figure which looked at the liquid immersion member concerning a 1st embodiment from the lower side. FIG. 6 is a diagram illustrating an example of the operation of the liquid immersion member according to the first embodiment. It is a flowchart which shows an example of the process in the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. FIG. 6 is a diagram illustrating an example of the operation of the liquid immersion member according to the first embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a flowchart which shows an example of the maintenance process which concerns on 1st Embodiment. It is a figure which shows an example of the maintenance process which concerns on 1st Embodiment. It is a figure which shows an example of the maintenance process which concerns on 1st Embodiment. It is a figure which shows an example of the maintenance process which concerns on 1st Embodiment. It is a figure which shows an example of the maintenance process which concerns on 2nd Embodiment. It is a figure which shows an example of the maintenance process which concerns on 3rd Embodiment. It is sectional drawing which shows a part of liquid immersion member which concerns on 4th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 4th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 5th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 6th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 7th Embodiment. It is sectional drawing which shows a part of liquid immersion member which concerns on 8th Embodiment. It is a figure which shows an example of operation | movement of the liquid immersion member which concerns on 8th Embodiment. It is a figure which shows a comparative example. It is a figure which shows an example of the liquid immersion member which concerns on 8th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 8th Embodiment. It is a figure which shows an example of the maintenance process which concerns on 8th Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 8th Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on this embodiment. It is a figure which shows an example of the liquid immersion member which concerns on 9th Embodiment. It is a figure which shows an example of the liquid immersion member which concerns on this embodiment. It is a figure which shows an example of a stage. It is a flowchart which shows an example of a device manufacturing method.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. The immersion space LS is formed so that the optical path K2 of the exposure light EL irradiated to the substrate P is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

    The exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113.

    In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A movable measuring stage 3 mounted with a measuring member (measuring instrument) C, a measuring system 4 for measuring the position of the substrate stage 2 and the measuring stage 3, and an illumination system IL for illuminating the mask M with the exposure light EL The projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P, the liquid immersion member 5 that forms the liquid immersion space LS of the liquid LQ, and the overall operation of the exposure apparatus EX are controlled. And a storage device 7 that is connected to the control device 6 and stores various types of information related to exposure.

    The exposure apparatus EX includes a reference frame 8A that supports various measurement systems including the projection optical system PL and the measurement system 4, an apparatus frame 8B that supports the reference frame 8A, and a reference frame 8A and an apparatus frame 8B. And an anti-vibration device 10 that is disposed between the device frame 8B and suppresses transmission of vibration from the device frame 8B to the reference frame 8A. The vibration isolator 10 includes a spring device and the like. In the present embodiment, the vibration isolator 10 includes a gas spring (for example, an air mount). One or both of a detection system that detects the alignment mark of the substrate P and a detection system that detects the position of the surface of an object such as the substrate P may be supported by the reference frame 8A.

  In addition, the exposure apparatus EX includes a chamber apparatus 9 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space CS in which the exposure light EL travels. The chamber device 9 includes an air conditioner 9S that supplies the gas Gs to the space CS. The air conditioner 9S supplies the gas Gs whose temperature, humidity, and cleanness are adjusted to the space CS. In the space CS, at least the projection optical system PL, the liquid immersion member 5, the substrate stage 2, and the measurement stage 3 are arranged. In the present embodiment, the mask stage 1 and at least a part of the illumination system IL are also arranged in the space CS.

    The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmissive mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chrome. A reflective mask can also be used as the mask M.

    The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

    The mask stage 1 can move while holding the mask M. The mask stage 1 is moved by the operation of a drive system 11 including a flat motor as disclosed in US Pat. No. 6,452,292, for example. The mask stage 1 can be moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 11. The drive system 11 may not include a planar motor. The drive system 11 may include a linear motor.

    The projection optical system PL irradiates the projection area PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. Projection optical system PL is a reduction system. The projection magnification of the projection optical system PL is ¼. The projection magnification of the projection optical system PL may be 1/5 or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. The optical axis of the projection optical system PL is parallel to the Z axis. Projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, or a catadioptric system that includes a reflective optical element and a refractive optical element. The projection optical system PL may form either an inverted image or an erect image.

    The projection optical system PL includes a terminal optical element 13 having an emission surface 12 from which the exposure light EL is emitted. The exit surface 12 emits the exposure light EL toward the image plane of the projection optical system PL. The last optical element 13 is an optical element closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 12 can be irradiated. The exit surface 12 faces the −Z direction. The exposure light EL emitted from the emission surface 12 travels in the −Z direction. The exit surface 12 is parallel to the XY plane. The exit surface 12 facing the −Z direction may be a convex surface or a concave surface. The exit surface 12 may be inclined with respect to the XY plane, or may include a curved surface. The optical axis AX of the last optical element 13 is parallel to the Z axis.

  With respect to the direction parallel to the optical axis AX of the last optical element 13, the exit surface 12 side of the last optical element 13 is the -Z side, and the incident face side of the last optical element 13 is the + Z side. Regarding the direction parallel to the optical axis of the projection optical system PL, the image plane side of the projection optical system PL is the −Z side, and the object plane side of the projection optical system PL is the + Z side. The exit surface 12 side (image surface side) is the lower side (lower side), and the incident surface side (object surface side) is the upper side (upper side).

  The substrate stage 2 is movable in an XY plane including a position (projection region PR) where the exposure light EL from the emission surface 12 can be irradiated while holding the substrate P. The measurement stage 3 is movable in an XY plane including a position (projection region PR) where the exposure light EL from the emission surface 12 can be irradiated with the measurement member (measuring instrument) C mounted. Each of the substrate stage 2 and the measurement stage 3 is movable on the guide surface 14G of the base member 14. The guide surface 14G and the XY plane are substantially parallel.

  The substrate stage 2 includes, for example, a first holding unit that releasably holds the substrate P as disclosed in US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. It has a 2nd holding part which is arranged around a holding part and holds cover member T so that release is possible. The first holding unit holds the substrate P so that the surface (upper surface) of the substrate P and the XY plane are substantially parallel to each other. The upper surface of the substrate P held by the first holding unit and the upper surface of the cover member T held by the second holding unit are arranged in substantially the same plane (arranged so as to be flush with each other). ). Regarding the Z-axis direction, the distance between the emission surface 12 and the upper surface of the substrate P held by the first holding portion is substantially the same as the distance between the emission surface 12 and the upper surface of the cover member T held by the second holding portion. equal.

  Note that the distance between the emission surface 12 and the upper surface of the substrate P is substantially equal to the distance between the emission surface 12 and the upper surface of the cover member T with respect to the Z-axis direction. And the distance between the emission surface 12 and the upper surface of the cover member T is, for example, within 10% of the distance (so-called working distance) between the emission surface 12 and the upper surface of the substrate P when the substrate P is exposed. Including. Note that the upper surface of the substrate P held by the first holding unit and the upper surface of the cover member T held by the second holding unit may not be arranged in the same plane. For example, the position of the upper surface of the substrate P and the position of the upper surface of the cover member T may be different with respect to the Z-axis direction. For example, there may be a step between the upper surface of the substrate P and the upper surface of the cover member T. Note that the upper surface of the cover member T may be inclined with respect to the upper surface of the substrate P, or the upper surface of the cover member T may include a curved surface.

  The substrate stage 2 and the measurement stage 3 are moved by the operation of a drive system 15 including a planar motor as disclosed in US Pat. No. 6,452,292, for example. The drive system 15 includes a mover 2 </ b> C disposed on the substrate stage 2, a mover 3 </ b> C disposed on the measurement stage 3, and a stator 14 </ b> M disposed on the base member 14. Each of the substrate stage 2 and the measurement stage 3 can move in six directions on the guide surface 14G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 15. Note that the drive system 15 may not include a planar motor. The drive system 15 may include a linear motor.

  The measurement system 4 includes an interferometer system. The interferometer system includes a unit that irradiates the measurement mirror of the substrate stage 2 and the measurement mirror of the measurement stage 3 with measurement light and measures the positions of the substrate stage 2 and the measurement stage 3. Note that the measurement system may include an encoder system as disclosed in, for example, US Patent Application Publication No. 2007/0288121. Note that the measurement system 4 may include only one of the interferometer system and the encoder system.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 6 determines the substrate stage 2 (substrate P) and the measurement stage 3 (measurement member) based on the measurement result of the measurement system 4. The position control of C) is executed.

  Next, the liquid immersion member 5 according to this embodiment will be described. The liquid immersion member may be referred to as a nozzle member. FIG. 2 is a cross-sectional view of the liquid immersion member 5 parallel to the XZ plane. FIG. 3 is an enlarged view of a part of FIG. FIG. 4 is a view of the liquid immersion member 5 as viewed from the lower side (−Z side).

  The last optical element 13 has an exit surface 12 facing the −Z direction, and an outer surface 131 disposed around the exit surface 12. The exposure light EL is emitted from the emission surface 12. The exposure light EL is not emitted from the outer surface 131. The exposure light EL passes through the emission surface 12 and does not pass through the outer surface 131. The outer surface 131 is a non-emission surface that does not emit the exposure light EL. The outer surface 131 is inclined upward toward the outside in the radiation direction with respect to the optical axis AX of the last optical element 13.

  The immersion member 5 forms an immersion space LS for the liquid LQ on an object that can move below the last optical element 13. An object that can move below the last optical element 13 can move in the XY plane including the position facing the exit surface 12. The object can face the emission surface 12 and can be arranged in the projection region PR. The object is movable below the liquid immersion member 5 and can be opposed to the liquid immersion member 5. In the present embodiment, the object is at least one of the substrate stage 2 (for example, the cover member T of the substrate stage 2), the substrate P held on the substrate stage 2 (first holding unit), and the measurement stage 3. Including one.

  In the exposure of the substrate P, the immersion space LS is formed so that the optical path K2 of the exposure light EL between the exit surface 12 of the last optical element 13 and the substrate P is filled with the liquid LQ. When the substrate P is irradiated with the exposure light EL, the immersion space LS is formed so that only a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. The exposure apparatus EX is a local immersion type immersion exposure apparatus.

  The immersion space LS is formed so that the optical path K2 of the exposure light EL emitted from the exit surface 12 of the last optical element 13 is filled with the liquid LQ. At least a part of the immersion space LS is formed in a space between the last optical element 13 and an object (such as the substrate P). At least a part of the immersion space LS is formed in a space between the immersion member 5 and an object (such as the substrate P).

  In the following description, it is assumed that the object is the substrate P. As described above, the object may be at least one of the substrate stage 2 and the measurement stage 3, or may be an object different from the substrate P, the substrate stage 2, and the measurement stage 3. The immersion space LS may be formed so as to straddle two objects. For example, the immersion space LS may be formed so as to straddle the cover member T and the substrate P of the substrate stage 2. The immersion space LS may be formed so as to straddle the substrate stage 2 and the measurement stage 3.

  The liquid immersion member 5 includes a first member 21 disposed at least part of the periphery of the optical path K of the exposure light EL, and a second member 22 disposed at least part of the periphery of the optical path K of the exposure light EL. I have. The second member 22 is a movable member that can move.

  The optical path K of the exposure light EL includes the optical path K1 of the exposure light EL in the terminal optical element 13 (the optical path K1 of the exposure light EL traveling through the terminal optical element 13). The optical path K of the exposure light EL includes the optical path K2 of the exposure light EL emitted from the emission surface 12. In other words, the concept of the optical path K of the exposure light EL may include the optical path K1 of the exposure light EL in the last optical element 13. The optical path K of the exposure light EL may be a concept including the optical path K2 of the exposure light EL between the exit surface 12 and the substrate P (object).

  A part of the first member 21 is disposed at least at a part around the terminal optical element 13 (optical path K1). A part of the first member 21 is disposed at least at a part around the optical path K2. A part of the second member 22 is disposed at least partly around the terminal optical element 13 (optical path K1) and the first member 21. A part of the second member 22 is disposed around the optical path K2.

  At least a part of the second member 22 is disposed below the terminal optical element 13. At least a part of the terminal optical element 13 is disposed on the second member 22. The last optical element 13 is disposed at a position farther from the substrate P (object) than the second member 22. At least a part of the second member 22 is disposed between the terminal optical element 13 and the substrate P (object). At least a part of the second member 22 is disposed below the first member 21. At least a part of the first member 21 is disposed on the second member 22. The first member 21 is disposed at a position farther from the substrate P (object) than the second member 22. At least a part of the second member 22 is disposed between the first member 21 and the substrate P (object).

  At least a part of the second member 22 is disposed outside the first member 21 with respect to the optical path K (optical axis AX) of the exposure light EL. At least a part of the second member 22 is disposed at a position farther from the last optical element 13 than the first member 21. At least a part of the first member 21 is disposed between the terminal optical element 13 and the second member 22.

  The second member 22 is movable outside the optical path K of the exposure light EL. At least a part of the second member 22 is movable under the last optical element 13. At least a part of the second member 22 is movable between the last optical element 13 and the substrate P (object). At least a part of the second member 22 is movable under the first member 21. At least a part of the second member 22 is movable between the first member 21 and the substrate P (object). That is, at least a part of the second member 22 is movable outside the optical path K of the exposure light EL and below the last optical element 13 and the first member 21. At least a part of the second member 22 is movable outside the first member 21 with respect to the optical path K (optical axis AX) of the exposure light EL. The second member 22 does not have to move under the first optical element 13 but moves under the first member 21.

  The last optical element 13 does not move substantially. The first member 21 also does not move substantially. The first member 21 does not substantially move with respect to the last optical element 13. The second member 22 is movable with respect to the last optical element 13. The second member 22 is movable with respect to the first member 21. The relative position between the last optical element 13 and the second member 22 changes. The relative positions of the first member 21 and the second member 22 change.

  The first member 21 is disposed so as not to contact the terminal optical element 13. A gap is formed between the last optical element 13 and the first member 21. The second member 22 is disposed so as not to contact the terminal optical element 13 and the first member 21. A gap is formed between the first member 21 and the second member 22. The second member 22 moves so as not to contact the terminal optical element 13 and the first member 21.

  The substrate P (object) can be opposed to at least a part of the last optical element 13 through a gap. The substrate P (object) can be opposed to at least a part of the second member 22 through a gap. The substrate P (object) is movable under the last optical element 13, the first member 21, and the second member 22.

  At least a part of the first member 21 faces the last optical element 13 through a gap. The first member 21 does not face the emission surface 12. A part of the first member 21 faces the outer surface 131. A part of the first member 21 is disposed on at least a part of the periphery of the outer surface 131 through a gap.

  At least a part of the second member 22 faces the first member 21 through a gap. The first member 21 is disposed between the second member 22 and the last optical element 13. A part of the second member 22 can face the last optical element 13. A part of the second member 22 can face the emission surface 12. The first member 21 is disposed so that the terminal optical element 13 and at least a part of the second member 22 face each other.

  The first member 21 is an annular member. A part of the first member 21 is disposed around the optical path K1 (terminal optical element 13). A part of the first member 21 is disposed around the optical path K2. The first member 21 includes a first opening 23 through which the exposure light EL emitted from the emission surface 12 can pass, a lower surface 25 at least partially facing the second member 22, and at least partially terminated. The optical element 13 has an inner surface 26 that faces the outer surface 131 and an outer surface 27 that faces outward in the radiation direction with respect to the optical axis AX (optical path K). Note that the first opening 23 may be referred to as a first passage 23.

  At least a part of the lower surface 25 faces the −Z direction. At least a portion of the lower surface 25 is substantially perpendicular to the optical axis AX. In other words, at least a part of the lower surface 25 is substantially parallel to the XY plane. The lower surface 25 is disposed around the optical path K of the exposure light EL. The lower surface 25 is disposed around the first opening 23. The inner edge of the lower surface 25 defines the first opening 23. The lower surface 25 faces the second member 22 through a gap. The lower surface 25 includes a region 251 and a region 252 arranged outside the region 251 with respect to the optical path K. Each of the region 251 and the region 252 is substantially perpendicular to the optical axis AX. In other words, each of the region 251 and the region 252 is substantially parallel to the XY plane.

  At least a part of the inner surface 26 faces the outer surface 131. The inner surface 26 faces the outer surface 131 through a gap. A part (lower part) of the inner surface 26 is disposed around the optical path K2. A part (upper part) of the inner surface 26 is disposed around the terminal optical element 13 (optical path K1).

  At least a part of the outer surface 27 faces the second member 22 through a gap. The lower end of the outer surface 27 is connected to the outer edge of the lower surface 25.

  The second member 22 is an annular member. A part of the second member 22 is disposed around the optical path K <b> 1 (terminal optical element 13) and the first member 21. A part of the second member 22 is disposed around the optical path K2. The second member 22 includes a second opening (aperture) 28 through which the exposure light EL emitted from the emission surface 12 can pass, an upper surface 29 at least partially facing the first member 21, and a substrate P (object). Has a lower surface 30 that can be opposed to each other, and at least a part of the inner surface 31 that faces the outer surface 27 of the first member 21. Note that the second opening 28 may be referred to as a second passage 28.

  The second member 22 is disposed so that the substrate P (object) can face the second member 22. The second member 22 includes at least a part 221 disposed below the first member 21 and at least a part 222 disposed outside the first member 21 with respect to the optical path K of the exposure light EL. including. The portion 222 is disposed outside the portion 221 with respect to the optical path K. The first member 21 is disposed at a position farther from the substrate P (object) than the portion 221. The portion 221 is disposed between the first member 21 and the substrate P (object).

  At least a part of the upper surface 29 faces the + Z direction. At least a portion of the upper surface 29 is substantially perpendicular to the optical axis AX. In other words, at least a part of the upper surface 29 is substantially parallel to the XY plane. The upper surface 29 is disposed around the optical path K of the exposure light EL. The upper surface 29 is disposed around the second opening 28. The inner edge of the upper surface 29 defines the second opening 28. The upper surface 29 faces the first member 21 through a gap. The upper surface 29 can face at least a part of the lower surface 25. The upper surface 29 faces at least a part of the lower surface 25 with a gap therebetween. Portion 221 includes a top surface 29.

  At least a part of the lower surface 30 faces the −Z direction. At least a portion of the lower surface 30 is substantially perpendicular to the optical axis AX. In other words, at least a part of the lower surface 30 is substantially parallel to the XY plane. The lower surface 30 is disposed around the optical path K of the exposure light EL. The lower surface 30 is disposed around the second opening 28. The inner edge of the lower surface 30 defines the second opening 28. The surface (upper surface) of the substrate P (object) can face the lower surface 30. The surface (upper surface) of the substrate P (object) can be opposed to the lower surface 30 via a gap. The portion 221 includes the lower surface 30. The lower surface 30 includes a region 301 and a region 302 disposed outside the region 301 with respect to the optical path K. The region 302 is disposed above the region 301. Each of the region 301 and the region 302 is substantially perpendicular to the optical axis AX. In other words, each of the region 301 and the region 302 is substantially parallel to the XY plane.

  At least a part of the inner surface 31 faces the outer surface 27. The inner surface 31 faces the outer surface 27 through a gap. A part (lower part) of the inner surface 31 is disposed around the optical path K2. A part (upper part) of the inner surface 31 is disposed around the first member 21. The lower end of the inner surface 31 is connected to the outer edge of the upper surface 29. Portion 222 includes inner surface 31.

  A region 251 on the lower surface 25 is a region where liquid cannot pass (cannot flow). The area 251 is a non-supply area where liquid cannot be supplied. The region 251 is a non-recovery region where the liquid cannot be recovered. A region 252 on the lower surface 25 is a region through which liquid can pass (flow). The region 252 may function as a supply region that can supply liquid. The area 252 may function as a collection area where the liquid can be collected. At least a part of the lower surface 25 can hold the liquid LQ with the second member 22.

  At least a part of the inner surface 26 is a region through which liquid cannot pass (cannot flow). At least a part of the inner surface 26 is a non-supply area where liquid cannot be supplied. At least a part of the inner surface 26 is a non-recovery area where the liquid cannot be recovered. At least a part of the inner surface 26 can hold the liquid LQ with the last optical element 13.

  The upper surface 29 is an area where liquid cannot pass (cannot flow). The upper surface 29 is a non-supply area where liquid cannot be supplied. The upper surface 29 is a non-recovery area where the liquid cannot be recovered. At least a part of the upper surface 29 can hold the liquid LQ with the first member 21.

  A region 301 on the lower surface 30 is a region through which liquid cannot pass (cannot flow). A region 301 is a non-supply region where liquid cannot be supplied. A region 301 is a non-recovery region where the liquid cannot be recovered. A region 302 on the lower surface 30 is a region through which liquid can pass (flow). The region 302 may function as a supply region that can supply liquid. The area 302 may function as a collection area where the liquid can be collected. At least a part of the lower surface 30 can hold the liquid LQ with the substrate P (object).

  Each of the outer surface 27 and the inner surface 31 is a region through which liquid cannot pass (cannot flow). Each of the outer surface 27 and the inner surface 31 is a non-supply area where liquid cannot be supplied. Each of the outer surface 27 and the inner surface 31 is a non-recovery area where liquid cannot be recovered.

  In the following description, a space including the optical path K2 between the emission surface 12 and the substrate P (object) is appropriately referred to as an optical path space SPK. The optical path space SPK includes a space between the exit surface 12 and the substrate P (object) and a space between the exit surface 12 and the upper surface 29. A space between the lower surface 25 and the upper surface 29 is appropriately referred to as a space SP1. A space between the lower surface 30 and the upper surface of the substrate P (object) is appropriately referred to as a space SP2. A space between the outer surface 131 and the inner surface 26 is appropriately referred to as a space SP3.

  The optical path space SPK and the space SP1 are connected via an opening 32 between the inner edge of the lower surface 25 and the upper surface 29. The liquid LQ can flow from one of the optical path space SPK and the space SP1 through the opening 32 to the other. The optical path space SPK and the space SP2 are connected via an opening 33 between the inner edge of the lower surface 30 and the upper surface of the substrate P. The liquid LQ can flow from one of the optical path space SPK and the space SP2 through the opening 33 to the other. The optical path space SPK and the space SP3 are connected via an opening 34 between the lower end of the outer surface 131 and the inner surface 26. The liquid LQ can flow from one of the optical path space SPK and the space SP3 through the opening 34 to the other. The space SP1 and the space SP2 are connected via the opening 32, the second opening 28, and the opening 33. The liquid LQ can flow from one of the space SP1 and the space SP2 through the opening 32, the second opening 28, and the opening 33 to the other.

  One end of the space SP1 on the optical path K side is connected to the optical path space SPK through the opening 32. The other end of the space SP1 away from the optical path K is connected to the space CS around the liquid immersion member 5 through the opening 35 between the outer edge of the lower surface 25 and the upper surface 29 and the gap between the outer surface 27 and the inner surface 31. It is. The space SP1 is opened to the space (atmosphere) CS outside the liquid immersion member 5 through the opening 35 and the gap between the outer surface 27 and the inner surface 31. When the space CS is atmospheric pressure, the space SP1 is opened to the atmosphere. One end of the space SP2 on the optical path K side is connected to the optical path space SPK through the opening 33. The other end of the space SP2 away from the optical path K is connected to the space CS around the liquid immersion member 5 through an opening 36 between the outer edge of the lower surface 30 and the upper surface of the substrate P (object). The space SP2 is opened to a space (atmosphere) CS outside the liquid immersion member 5 through the opening 36. When the space CS is atmospheric pressure, the space SP2 is opened to the atmosphere. One end (lower end) of the space SP3 on the optical path K side is connected to the optical path space SPK through the opening 34. The other end (upper end) of the space SP3 away from the optical path K is connected to the space CS around the liquid immersion member 5 through the opening 37 between the outer surface 131 and the upper end of the inner surface 26. The space SP3 is opened to the space (atmosphere) CS outside the liquid immersion member 5 through the opening 37. When the space CS is atmospheric pressure, the space SP3 is opened to the atmosphere.

  In the present embodiment, the movement of the liquid LQ from one of the space SP1 on the upper surface 29 side and the space SP2 on the lower surface 30 side to the other side is suppressed. The space SP1 and the space SP2 are partitioned by the second member 22. The liquid LQ in the space SP1 can move to the space SP2 through the second opening 28. The liquid LQ in the space SP1 cannot move to the space SP2 without passing through the second opening 28. The liquid LQ in the space SP2 can move to the space SP1 through the second opening 28. The liquid LQ in the space SP2 cannot move to the space SP1 without passing through the second opening 28. That is, the liquid immersion member 5 does not have a flow path that fluidly connects the space SP1 and the space SP2 other than the second opening 28.

  As shown in FIG. 2 and the like, the dimension of the second opening 28 is smaller than the dimension of the first opening 23 in the X-axis direction. Regarding the Y-axis direction, the dimension of the second opening 28 is smaller than the dimension of the first opening 23. In the XY plane, the second opening 28 is smaller than the first opening 23. As shown in FIG. 4, in the XY plane, the second opening 28 has a rectangular (rectangular) shape that is long in the X-axis direction. The first opening 23 also has a rectangular (rectangular) shape that is long in the X-axis direction.

  As shown in FIG. 2 etc., the 1st member 21 is arrange | positioned so that the optical axis AX of the last optical element 13 and the center of the 1st opening part 23 may correspond substantially. When the second member 22 is disposed so that the optical axis AX of the last optical element 13 and the center of the second opening 28 substantially coincide, the center of the first opening 23 and the second opening 28 It is substantially coincident with the center. When the second member 22 is arranged so that the optical axis AX of the last optical element 13 and the center of the second opening 28 substantially coincide, the inner edge of the first member 21 (the inner edge of the lower surface 25) is With respect to the optical path K, the second member 22 is disposed outside the inner edge (the inner edge of the lower surface 30). The inner edge of the first member 21 (the inner edge of the lower surface 25) defines the first opening 23. The inner edge of the second member 22 (the inner edge of the lower surface 30) defines the second opening 28. When the second member 22 is arranged so that the optical axis AX of the terminal optical element 13 and the center of the second opening portion 28 substantially coincide with each other, a part of the upper surface 29 of the second member 22 becomes the terminal optical element. It faces the element 13 (the exit surface 12) and the first member 21 (the lower surface 25).

  In the following description, the position of the second member 22 where the optical axis AX of the terminal optical element 13 and the center of the second opening 28 substantially coincide is referred to as the origin as appropriate.

  The liquid immersion member 5 includes an opening 41 through which the liquid LQ can flow, an opening 42 through which the liquid LQ can flow, and an opening 43 through which the liquid LQ can flow. The opening 42 is disposed outside the opening 41 with respect to the radiation direction with respect to the optical axis AX (optical path K). The opening 43 is disposed outside the opening 41 with respect to the radial direction with respect to the optical axis AX (optical path K). The opening 43 is disposed outside the opening 42 with respect to the radial direction with respect to the optical axis AX (optical path K). The opening 42 is disposed below the opening 41. The opening 43 is disposed below the opening 41. The opening 43 is disposed below the opening 42.

  The opening 41 can supply the liquid LQ for forming the immersion space LS. In the exposure processing of the substrate P, the opening 41 functions as a liquid supply port (liquid supply unit) that supplies the liquid LQ. The opening 41 is disposed in the first member 21. The opening 41 is disposed so as to face the space around the terminal optical element 13 (one or both of the optical path space SPK and the space SP3). In the present embodiment, the opening 41 is disposed on the inner surface 26 of the first member 21 so as to face the space SP3. The opening 41 is disposed so as to face the outer surface 131. The opening 41 supplies the liquid LQ to the space SP3.

  At least a part of the liquid LQ supplied from the opening 41 to the space SP3 is supplied to the optical path space SPK through the opening 34. Thereby, the optical path K2 is filled with the liquid LQ. At least a part of the liquid LQ supplied from the opening 41 to the optical path space SPK is supplied to the space SP1 through the opening 32. At least a part of the liquid LQ supplied from the opening 41 to the optical path space SPK is supplied to the space SP2 through the opening 33.

  The opening 41 is disposed on each of the + X side and the −X side with respect to the optical path K (terminal optical element 13). The opening 41 may be arranged in the Y-axis direction with respect to the optical path K (terminal optical element 13). A plurality of openings 41 may be arranged around the optical path K (terminal optical element 13) including the X-axis direction and the Y-axis direction. There may be one opening 41. The opening 41 may be disposed in the first member 21 so as to face the optical path space SPK. For example, the opening 41 may be disposed in the lower end region of the inner surface 26.

  The opening 41 is connected to the liquid processing apparatus 41P via a flow path 41R formed inside the first member 21. The liquid processing apparatus 41P can supply the clean and temperature-adjusted liquid LQ to the opening 41. In the exposure process of the substrate P, the opening 41 supplies the liquid LQ from the liquid processing apparatus 41P to the optical path K2 (on the substrate P) in order to form the immersion space LS of the liquid LQ.

  In the present embodiment, the liquid processing apparatus 41P can supply a liquid different from the liquid LQ. In the present embodiment, the liquid processing apparatus 41P can connect the opening 41 (flow path 41R) and the vacuum system. The liquid processing apparatus 41P can collect (suction) liquid from the opening 41.

  The opening 42 can collect the liquid LQ in the immersion space LS. In the exposure processing of the substrate P, the opening 42 functions as a liquid recovery port (liquid recovery unit) that recovers the liquid LQ. The opening 42 is disposed in the first member 21. The opening 42 is disposed so as to face the space SP1. In the present embodiment, the opening 42 is disposed on the lower surface 25 of the first member 21 so as to face the space SP1. The opening 42 is arrange | positioned at the 1st member 21 so that the 2nd member 22 may oppose. The opening 42 is disposed in the first member 21 so as to face the upper surface 29. The opening 42 is disposed in the region 252 of the lower surface 25. A plurality of openings 42 are arranged around the region 251. A plurality of openings 42 are arranged so as to surround the optical path K of the exposure light EL. The opening 42 collects the liquid LQ from the space SP1. The opening 42 can collect at least a part of the liquid LQ in the space SP1. The opening 42 does not collect the liquid LQ in the space SP2.

  The opening 42 is connected to the liquid processing apparatus 42P via a flow path 42R formed inside the first member 21. The liquid processing apparatus 42P can connect the opening 42 (flow path 42R) and the vacuum system. At least a part of the liquid LQ in the space SP1 can flow into the flow path 42R through the opening 42. The liquid processing apparatus 42P can collect (suction) the liquid LQ from the opening 42. In the exposure processing of the substrate P, the opening 42 collects the liquid LQ from the space SP1.

  The liquid processing apparatus 42P can collect a liquid different from the liquid LQ from the opening 42. The liquid processing apparatus 42P can supply the clean and temperature-adjusted liquid LQ to the opening 42. The liquid processing apparatus 42P can supply a liquid different from the liquid LQ to the opening 42.

  The first member 21 includes a porous member 44. The opening 42 includes a hole of the porous member 44. The porous member 44 includes a mesh plate. The porous member 44 has a lower surface that can be opposed to the upper surface 29, an upper surface that faces the flow path 42R, and a plurality of holes that connect the lower surface and the upper surface. The liquid processing apparatus 42P collects the liquid LQ through the hole of the porous member 44. The region 252 of the lower surface 25 includes the lower surface of the porous member 44. The liquid LQ in the space SP1 recovered from the opening 42 (hole of the porous member 44) flows into the flow path 42R, flows through the flow path 42R, and is recovered by the liquid processing apparatus 42P.

  In the present embodiment, substantially only the liquid LQ is recovered through the opening 42, and the recovery of gas is limited. The control device 6 uses the pressure on the lower surface side of the porous member 44 (the pressure in the space SP1) and the upper surface so that the liquid LQ in the space SP1 passes through the hole of the porous member 44 and flows into the flow path 42R and does not pass the gas. The difference from the side pressure (pressure of the flow path 42R) is adjusted. The space SP1 is connected to the space CS. The control device 6 can adjust the pressure in the space SP1 by controlling the chamber device 9. The control device 6 can adjust the pressure in the flow path 42R by controlling the liquid processing device 42P. An example of a technique for recovering only the liquid through the porous member is disclosed in, for example, US Pat. No. 7,292,313.

  Note that both the liquid LQ and the gas may be collected (sucked) through the porous member 44. The liquid processing apparatus 42P may supply the liquid to the space SP1 through the hole of the porous member 44. The porous member 44 may not be provided on the first member 21. That is, the fluid (one or both of the liquid LQ and the gas) in the space SP1 may be recovered without passing through the porous member. The liquid may be supplied to the space SP1 without passing through the porous member.

  The opening 43 can collect the liquid LQ in the immersion space LS. In the exposure processing of the substrate P, the opening 43 functions as a liquid recovery port (liquid recovery unit) that recovers the liquid LQ. The opening 43 is disposed in the second member 22. The opening 43 is disposed so as to face the space SP2. The opening 43 is disposed on the lower surface 30 of the second member 22 so as to face the space SP2. The opening 43 is disposed in the second member 22 so that the substrate P (object) is opposed to the opening 43. The opening 43 is disposed in the second member 22 so as to face the upper surface of the substrate P (object). The opening 43 is disposed in the region 302 of the lower surface 30. A plurality of openings 43 are arranged around the region 301. A plurality of openings 43 are arranged so as to surround the optical path K of the exposure light EL. The opening 43 collects the liquid LQ from the space SP2. The opening 43 can collect at least a part of the liquid LQ in the space SP2. The opening 43 does not collect the liquid LQ in the space SP1.

  The opening 43 is connected to the liquid processing apparatus 43P via a flow path 43R formed inside the second member 22. The liquid processing apparatus 43P can connect the opening 43 (flow path 43R) and the vacuum system. At least a part of the liquid LQ in the space SP2 can flow into the flow path 43R through the opening 43. The liquid processing apparatus 43P can collect (suction) the liquid LQ from the opening 43. In the exposure process of the substrate P, the opening 43 collects the liquid LQ from the space SP2.

  The liquid processing apparatus 43P can collect a liquid different from the liquid LQ from the opening 43. The liquid processing apparatus 43P can supply the clean and temperature-adjusted liquid LQ to the opening 43. The liquid processing apparatus 43P can supply a liquid different from the liquid LQ to the opening 43.

  The second member 22 includes a porous member 45. The opening 43 includes a hole of the porous member 45. The porous member 45 includes a mesh plate. The porous member 45 has a lower surface on which the upper surface of the substrate P (object) can face, an upper surface facing the flow path 43R, and a plurality of holes connecting the lower surface and the upper surface. The liquid processing apparatus 43P collects the liquid LQ through the hole of the porous member 45. The region 302 of the lower surface 30 includes the lower surface of the porous member 45. The liquid LQ in the space SP2 collected from the opening 43 (hole of the porous member 45) flows into the flow path 43R, flows through the flow path 43R, and is collected by the liquid processing apparatus 43P.

  In the present embodiment, the gas is recovered together with the liquid LQ through the opening 43. In other words, the opening 43 collects and recovers the gas (liquid LQ and / or gas) existing in the space SP2. Note that only the liquid LQ may be recovered through the porous member 45, and the recovery of the gas may be limited.

  Note that only the liquid LQ may be substantially recovered through the holes of the porous member 45, and the recovery of the gas may be limited. Note that the liquid processing apparatus 43P may supply the liquid to the space SP2 through the hole of the porous member 45. The porous member 45 may not be provided on the second member 22. That is, the fluid (one or both of the liquid LQ and the gas) in the space SP2 may be recovered without passing through the porous member. The liquid may be supplied to the space SP2 without passing through the porous member.

  The flow path 43R is disposed outside the inner surface 31 with respect to the optical path K (optical axis AX). The flow path 43 </ b> R is disposed above the opening 43. By moving the second member 22, the opening 43 and the flow path 43 </ b> R of the second member 22 move outside the outer surface 27 of the first member 21.

  In parallel with at least a part of the supply of the liquid LQ from the opening 41, the liquid LQ is recovered from the opening 43, so that the terminal optical element 13 and the liquid immersion member 5 on one side and the substrate P on the other side are collected. An immersion space LS of the liquid LQ is formed between the (object). In the present embodiment, the liquid LQ is recovered from the opening 42 in parallel with at least part of the supply of the liquid LQ from the opening 41 and the recovery of the liquid LQ from the opening 43.

  A part of the interface LG of the liquid LQ in the immersion space LS is formed between the first member 21 and the second member 22. A part of the interface LG of the liquid LQ in the immersion space LS is formed between the second member 22 and the substrate P (object). A part of the interface LG of the liquid LQ in the immersion space LS is formed between the terminal optical element 13 and the first member 21. In the following description, the interface LG of the liquid LQ formed between the first member 21 and the second member 22 is appropriately referred to as an interface LG1. The interface LG formed between the second member 22 and the substrate P (object) is appropriately referred to as an interface LG2. The interface LG formed between the last optical element 13 and the first member 21 is appropriately referred to as an interface LG3.

  The interface LG1 is formed between the region 252 of the lower surface 25 and the upper surface 29. The interface LG1 is formed between the region 252 and the upper surface 29 of the lower surface 25, and the liquid LQ in the space SP1 is prevented from moving to the space outside the region 252 (including the space between the outer surface 27 and the inner surface 31). Is done. There is no liquid LQ in the space between the outer surface 27 and the inner surface 31. The space between the outer surface 27 and the inner surface 31 is a gas space. Therefore, the second member 22 can move smoothly. Even if the liquid LQ moves (outflows) outside the space SP1 (outside the outer surface 27) with respect to the optical path K, the inner surface 31 may cause the liquid LQ to move (outflow) onto the substrate P (space SP2). It is suppressed. The interface LG2 is formed between the region 302 of the lower surface 30 and the upper surface of the substrate P (object). The interface LG2 is formed between the region 302 on the lower surface 30 and the upper surface of the substrate P (object), and the liquid LQ in the space SP2 is suppressed from moving to the space outside the region 302.

  The second member 22 is movable in at least one direction of the X axis, the Y axis, the Z axis, θX, θY, and θZ. The second member 22 is moved by the operation of the driving device 46. The drive device 46 includes, for example, a motor. The drive device 46 can move the second member 22 using Lorentz force. The driving device 46 is capable of moving the second member 22 in six directions of X axis, Y axis, Z axis, θX, θY, and θZ. The driving device 46 can move the second member 22 with respect to the terminal optical element 13 and the first member 21. The driving device 46 is controlled by the control device 6.

  The second member 22 is movable at least in the XY plane perpendicular to the optical axis AX (Z axis) of the last optical element 13. The second member 22 is movable substantially parallel to the XY plane. In the following description, it is assumed that the second member 22 moves exclusively in the X-axis direction among the six directions X-axis, Y-axis, Z-axis, θX, θY, and θZ.

  FIG. 5 is a diagram illustrating an example of the operation of the second member 22. The second member 22 is movable within a movable range (movable range) determined in the XY plane. The second member 22 moves within a movable range defined with respect to the X-axis direction. FIG. 5 shows a state in which the second member 22 is moved to the −X side most in the movable range.

  As the second member 22 moves, the dimension of the gap between the outer surface 27 of the first member 21 and the inner surface 31 of the second member 22 changes. In other words, the size of the space between the outer surface 27 and the inner surface 31 changes as the second member 22 moves. In the example shown in FIG. 5, when the second member 22 moves in the −X direction, the dimension of the gap between the outer surface 27 and the inner surface 31 on the + X side with respect to the last optical element 13 is reduced (the outer surface 27 and the inner surface 31. The space between is smaller). When the second member 22 moves in the −X direction, the dimension of the gap between the outer surface 27 and the inner surface 31 on the −X side with respect to the last optical element 13 is increased (the space between the outer surface 27 and the inner surface 31 is increased). growing). When the second member 22 moves in the + X direction, the dimension of the gap between the outer surface 27 and the inner surface 31 on the + X side with respect to the last optical element 13 is increased (the space between the outer surface 27 and the inner surface 31 is increased). ). When the second member 22 moves in the + X direction, the dimension of the gap between the outer surface 27 and the inner surface 31 on the −X side with respect to the last optical element 13 is reduced (the space between the outer surface 27 and the inner surface 31 is reduced). Become).

  For example, the movable range (movable range) of the second member 22 may be determined so that the first member 21 (outer surface 29) and the second member 22 (inner surface 30) do not contact each other. The liquid LQ may be recovered from the opening 43 while the second member 22 moves.

  Next, an example of the operation of the second member 22 will be described. The second member 22 is movable in cooperation with the movement of the substrate P (object). The second member 22 is movable independently of the substrate P (object). The second member 22 is movable in parallel with at least part of the movement of the substrate P (object). The second member 22 is movable in parallel with at least a part of the period during which the substrate P (object) moves. The second member 22 is movable in the moving direction of the substrate P (object). For example, the second member 22 is movable in the moving direction of the substrate P (object) during at least a part of the period in which the substrate P (object) is moved. For example, when the substrate P (object) is moved in one direction (for example, + X direction) in the XY plane, the second member 22 is synchronized with the movement of the substrate P (object) in one direction in the XY plane. It can move in (+ X direction).

  The second member 22 is movable in parallel with at least a part of the liquid supply from the opening 41. The second member 22 is movable in parallel with at least a part of the liquid recovery from the opening 41. The second member 22 is movable in parallel with at least part of the liquid supply from the opening 42. The second member 22 is movable in parallel with at least part of the recovery of the liquid from the opening 42. The second member 22 is movable in parallel with at least a part of the liquid supply from the opening 43. The second member 22 is movable in parallel with at least part of the recovery of the liquid from the opening 43.

  In the exposure processing of the substrate P, the liquid LQ is supplied from the opening 41 and the liquid LQ is recovered from the opening 42 and the opening 43. In the exposure processing of the substrate P, the second member 22 is movable in parallel with at least a part of the supply of the liquid LQ from the opening 41, the recovery of the liquid LQ from the opening 42, and the recovery of the liquid LQ from the opening 43. It is. The second member 22 is movable in a state where an immersion space LS for the liquid LQ is formed. The second member 22 is movable while in contact with the liquid LQ in the immersion space LS. The second member 22 is movable in a state where a liquid immersion space different from the liquid LQ is formed.

  The second member 22 is movable in at least a part of a period in which the exposure light EL is emitted from the emission surface 12. The second member 22 is movable in parallel with at least a part of the period during which the substrate P (object) moves in the state where the immersion space LS is formed. The second member 22 is movable in at least a part of a period in which the exposure light EL is emitted from the emission surface 12 in a state where the immersion space LS is formed.

  The second member 22 may move in a state where the second member 22 and the substrate P (object) do not face each other. For example, the second member 22 may move in a state where no object exists below the second member 22. The second member 22 may move in a state where the liquid LQ does not exist in the space between the second member 22 and the substrate P (object). For example, the second member 22 may move in a state where the immersion space LS is not formed.

  In the exposure processing of the substrate P, the control device 6 performs the second operation while supplying the liquid LQ from the opening 41 and collecting the liquid LQ from the opening 42 and the opening 43 so that the immersion space LS is continuously formed. The member 22 is moved. In the exposure processing of the substrate P, the second member 22 moves based on, for example, the moving condition of the substrate P (object). The control device 6 moves the second member 22 in parallel with at least a part of the movement of the substrate P (object) based on, for example, the movement condition of the substrate P (object).

  The second member 22 is movable so that the relative speed with respect to the substrate P (object) becomes small. The second member 22 is movable so that the relative speed between the second member 22 and the substrate P (object) is smaller than the relative speed between the first member 21 and the substrate P (object). The second member 22 is movable so that the relative acceleration with the substrate P (object) becomes small. The second member 22 is movable so that the relative acceleration between the second member 22 and the substrate P (object) is smaller than the relative acceleration between the first member 21 and the substrate P (object). The second member 22 may move in synchronization with the substrate P (object). The second member 22 may move so as to follow the substrate P (object).

  The second member 22 is configured such that the relative speed with respect to the substrate P (object) becomes small in a state where the immersion space LS is formed (a state where the liquid LQ exists in the first and second spaces SP1 and SP2). It is movable. The second member 22 is a state in which the immersion space LS is formed (the state in which the liquid LQ exists in the first and second spaces SP1 and SP2), and the relative speed between the second member 22 and the substrate P (object). However, it can move so that it may become smaller than the relative speed of the 1st member 21 and the board | substrate P (object). The second member 22 is configured such that the relative acceleration with respect to the substrate P (object) becomes small in a state where the immersion space LS is formed (a state where the liquid LQ exists in the first and second spaces SP1 and SP2). It is movable. The second member 22 is a relative acceleration between the second member 22 and the substrate P (object) in a state where the immersion space LS is formed (a state where the liquid LQ exists in the first and second spaces SP1 and SP2). However, it can move so that it may become smaller than the relative acceleration of the 1st member 21 and the board | substrate P (object).

  The second member 22 is movable in the moving direction of the substrate P (object). When the substrate P (object) moves in the + X direction, the second member 22 can move in the + X direction. When the substrate P (object) moves in the −X direction, the second member 22 can move in the −X direction. When the substrate P (object) moves in the + Y direction (or -Y direction) while moving in the + X direction, the second member 22 is movable in the + X direction. When the substrate P (object) moves in the + Y direction (or -Y direction) while moving in the −X direction, the second member 22 is movable in the −X direction.

  In the present embodiment, when the substrate P (object) moves in a certain direction including a component in the X-axis direction, the second member 22 moves in the X-axis direction. For example, the second member 22 moves in the X-axis direction in parallel with at least part of the movement of the substrate P (object) in a certain direction including the component in the X-axis direction.

  The second member 22 may move in the Y axis direction. When the substrate P (object) moves in a certain direction including a component in the Y-axis direction, the second member 22 may move in the Y-axis direction. In parallel with at least part of the movement of the substrate P (object) in a certain direction including the component in the Y-axis direction, the second member 22 moves in the Y-axis direction so that the relative speed with respect to the substrate P (object) decreases. You may move on.

  Next, an example of the operation of the exposure apparatus EX will be described. As shown in FIG. 6, in the exposure apparatus EX, an exposure process (step STP1) in which the substrate P is exposed and a maintenance process (step STP2) including a cleaning process are performed. The maintenance process (cleaning process) is performed in a different period from the exposure process in which the substrate P is exposed. Maintenance processing (cleaning processing) is performed after the exposure processing. The period during which the maintenance process (cleaning process) is performed is a period after the period during which the exposure process is performed. Note that the period during which the maintenance process (cleaning process) is performed may be a period before the period during which the exposure process is performed. The period during which the maintenance process (cleaning process) is performed may be both before and after the period during which the exposure process is performed.

  An exposure process (step STP1) for exposing the substrate P using the exposure apparatus EX will be described. In the following description, in the exposure process, the liquid LQ is supplied from the opening 41 and the liquid LQ is collected from each of the opening 42 and the opening 43 in order to form the immersion space LS. In order to form the immersion space LS, for example, the liquid LQ may be supplied from the opening 41, the liquid LQ may be recovered from the opening 43, and the liquid LQ may not be recovered from the opening 42.

  At the substrate exchange position away from the last optical element 13 and the liquid immersion member 5, a process of loading (loading) the substrate P before exposure into the substrate stage 2 (first holding unit) is performed. The measurement stage 3 is disposed so as to face the terminal optical element 13 and the liquid immersion member 5 at least in a part of the period in which the substrate stage 2 is separated from the terminal optical element 13 and the liquid immersion member 5. The control device 6 supplies the liquid LQ from the opening 41 and collects the liquid LQ from the opening 42 and the opening 43 to form an immersion space LS for the liquid LQ on the measurement stage 3.

  After the substrate P before exposure is loaded onto the substrate stage 2 and the measurement process using the measurement stage 3 is completed, the control device 6 causes the last optical element 13 and the liquid immersion member 5 to face the substrate stage 2 (substrate P). Then, the substrate stage 2 is moved. In a state where the last optical element 13 and the liquid immersion member 5 face the substrate stage 2 (substrate P), the liquid LQ is recovered from the opening 42 and the opening 43 in parallel with the supply of the liquid LQ from the opening 41. Accordingly, an immersion space LS is formed between the last optical element 13 and the immersion member 5 and the substrate stage 2 (substrate P) so that the optical path K2 is filled with the liquid LQ.

  The control device 6 starts exposure of the substrate P. The control device 6 emits the exposure light EL from the illumination system IL in a state where the immersion space LS is formed on the substrate P. The illumination system IL illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS between the emission surface 12 and the substrate P. Accordingly, the substrate P is exposed with the exposure light EL emitted from the emission surface 12 through the liquid LQ in the immersion space LS between the emission surface 12 of the last optical element 13 and the substrate P, and the pattern of the mask M Are projected onto the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. The scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 6 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction.

  FIG. 7 is a diagram illustrating an example of the substrate P held on the substrate stage 2. A plurality of shot areas S as exposure target areas are arranged in a matrix on the substrate P. The control device 6 moves the substrate P held by the first holding unit in the Y-axis direction (scanning direction) with respect to the exposure light EL emitted from the exit surface 12 of the last optical element 13, and then exits the exit surface. Each of the plurality of shot regions S of the substrate P is sequentially exposed with the exposure light EL emitted from the emission surface 12 through the liquid LQ in the immersion space LS between the substrate 12 and the substrate P.

  In order to expose one shot region S of the substrate P, the control device 6 performs exposure light EL (projection region PR of the projection optical system PL) emitted from the emission surface 12 in a state where the immersion space LS is formed. ) With respect to the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. The shot region S is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P. Thereby, an image of the pattern of the mask M is projected onto the shot area S, and the shot area S is exposed with the exposure light EL emitted from the emission surface 12.

  After the exposure of the shot area S is completed, the control device 6 moves the substrate P to the Y axis in the XY plane in the state where the immersion space LS is formed in order to start the exposure of the next shot area S. In a direction intersecting with (for example, the X-axis direction or a direction inclined with respect to the X-axis and Y-axis directions in the XY plane) and the next shot area S is moved to the exposure start position. Thereafter, the control device 6 starts exposure of the shot area S.

  In the state where the immersion space LS is formed on the substrate P (substrate stage 2), the control device 6 sets the shot region with respect to the position (projection region PR) irradiated with the exposure light EL from the emission surface 12. An operation of exposing the shot area while moving in the Y-axis direction, and after the exposure of the shot area, the next shot area is exposed in a state where the immersion space LS is formed on the substrate P (substrate stage 2). The substrate P is moved in a direction intersecting the Y-axis direction in the XY plane (for example, the X-axis direction or a direction inclined with respect to the X-axis and Y-axis directions in the XY plane) so as to be arranged at the start position. Each of the plurality of shot areas of the substrate P is sequentially exposed while repeating the operation.

  In the following description, in order to expose the shot area, a position (projection area) where the exposure light EL from the emission surface 12 is irradiated in a state where the immersion space LS is formed on the substrate P (substrate stage 2). The operation of moving the substrate P (shot region) in the Y-axis direction with respect to (PR) is appropriately referred to as a scan movement operation. After the exposure of a certain shot area, the substrate P in the XY plane before the exposure of the next shot area is started in the state where the immersion space LS is formed on the substrate P (substrate stage 2). The operation of moving is appropriately referred to as a step movement operation.

  The scan movement operation includes an operation in which the substrate P moves in the Y-axis direction from a state where a certain shot region S is arranged at the exposure start position to a state where it is arranged at the exposure end position. In the step movement operation, the substrate P intersects with the Y-axis direction in the XY plane from a state where a certain shot area S is arranged at the exposure end position to a state where the next shot area S is arranged at the exposure start position. Includes movement in the direction.

  The exposure start position includes the position of the substrate P when one end of the shot area S in the Y-axis direction passes through the projection area PR for exposure of the shot area S. The exposure end position includes the position of the substrate P when the other end portion in the Y-axis direction of the shot area S irradiated with the exposure light EL passes through the projection area PR.

  The exposure start position of the shot area S includes a scan movement operation start position for exposing the shot area S. The exposure start position of the shot area S includes a step movement operation end position for arranging the shot area S at the exposure start position. The exposure end position of the shot area S includes a scan movement operation end position for exposing the shot area S. The exposure end position of the shot area S includes a step movement operation start position for placing the next shot area S at the exposure start position after the exposure of the shot area S is completed.

  In the following description, a period during which the scan movement operation is performed for exposure of a certain shot area S is appropriately referred to as a scan movement period. The period during which the step movement operation is performed from the end of exposure of a certain shot area S to the start of exposure of the next shot area S is appropriately referred to as a step movement period. The scan movement period includes an exposure period from the start of exposure of a certain shot area S to the end of exposure. The step movement period includes a movement period of the substrate P from the end of exposure of a certain shot area S to the start of exposure of the next shot area S.

  In the scan movement operation, the exposure light EL is emitted from the emission surface 12. In the scan movement operation, the exposure light EL is irradiated to the substrate P (object). In the step movement operation, the exposure light EL is not emitted from the emission surface 12. In the step movement operation, the exposure light EL is not irradiated onto the substrate P (object).

  The control device 6 sequentially exposes each of the plurality of shot regions S of the substrate P while repeating the scan movement operation and the step movement operation. The scan movement operation is a constant speed movement mainly in the Y-axis direction. The step movement operation includes acceleration / deceleration movement. The step movement operation from the end of exposure of a certain shot area S to the start of exposure of the next shot area S includes one or both of acceleration / deceleration movement in the Y-axis direction and acceleration / deceleration movement in the X-axis direction.

  In at least a part of the scan movement operation and the step movement operation, at least a part of the immersion space LS may be formed on the substrate stage 2 (cover member T). In at least part of the scan movement operation and the step movement operation, the immersion space LS may be formed so as to straddle the substrate P and the substrate stage 2 (cover member T). When the substrate P is exposed with the substrate stage 2 and the measurement stage 3 approaching or in contact with each other, the immersion space LS is formed in the substrate stage 2 (cover member T) in at least a part of the scan movement operation and the step movement operation. And the measurement stage 3 may be formed.

  The control device 6 moves the substrate P (substrate stage 2) by controlling the drive system 15 based on the exposure conditions of the plurality of shot regions S on the substrate P. The exposure conditions for the plurality of shot areas S are defined by, for example, exposure control information called an exposure recipe. The exposure conditions (exposure control information) include arrangement information of the plurality of shot areas S (positions of the plurality of shot areas S on the substrate P). The exposure condition (exposure control information) includes dimension information (dimension information about the Y-axis direction) of each of the plurality of shot regions S. The exposure control information is stored in the storage device 7.

  Based on the exposure conditions (exposure control information) stored in the storage device 7, the control device 6 sequentially exposes each of the plurality of shot regions S while moving the substrate P under a predetermined movement condition. The movement condition of the substrate P (object) includes at least one of movement speed, acceleration, movement distance, movement direction, and movement locus in the XY plane.

  As an example, when sequentially exposing each of the plurality of shot regions S, the control device 6 causes the projection region PR of the projection optical system PL and the substrate P to be relative to each other along the movement locus indicated by the arrow Sr in FIG. The projection region PR is irradiated with the exposure light EL while moving the substrate P (substrate stage 2) so as to move, and each of the plurality of shot regions S is sequentially exposed with the exposure light EL via the liquid LQ. The controller 6 sequentially exposes each of the plurality of shot areas S while repeating the scan movement operation and the step movement operation.

  The second member 22 moves in at least a part of the exposure processing of the substrate P. The second member 22 moves in parallel with at least a part of the step movement operation of the substrate P (substrate stage 2) in a state where the immersion space LS is formed. The second member 22 moves in parallel with at least a part of the scan movement operation of the substrate P (substrate stage 2) in a state where the immersion space LS is formed. In parallel with the movement of the second member 22, the exposure light EL is emitted from the emission surface 12.

  The second member 22 has a relative speed (relative acceleration) between the second member 22 and the substrate P (substrate stage 2) when the substrate P (substrate stage 2) performs a step movement operation. You may move so that it may become smaller than relative speed (relative acceleration) with (substrate stage 2). When the substrate P (substrate stage 2) performs a scanning movement operation, the second member 22 has a relative speed (relative acceleration) between the second member 22 and the substrate P (substrate stage 2). You may move so that it may become smaller than relative speed (relative acceleration) with (substrate stage 2).

  Note that the second member 22 does not have to move during the scan movement operation of the substrate P (substrate stage 2). In parallel with the emission of the exposure light EL from the emission surface 12, the second member 22 may not move.

  FIG. 8 is a schematic diagram illustrating an example of the operation of the second member 22. FIG. 8 is a view of the second member 22 as viewed from above. In the present embodiment, the second member 22 moves in the X-axis direction. Note that the second member 22 may move in the Y-axis direction, or may move in any direction within the XY plane including the component in the X-axis direction (or Y-axis direction).

  The 2nd member 22 moves the movable range (movable range) prescribed | regulated regarding the X-axis direction. The movable range of the second member 22 is determined so that the exposure light EL from the emission surface 12 passes through the first opening 23 and the second opening 28 and the second member 22 does not contact the first member 21. .

  In at least a part of the period during which the substrate P (object) moves, the second member 22 moves in the X-axis direction as shown in FIGS. 8A to 8E. FIG. 8A shows a state in which the second member 22 is arranged at the position Jr of the end on the most + X side of the movable range. FIG. 8C shows a state in which the second member 22 is arranged at the center position Jm of the movable range. FIG. 8E shows a state in which the second member 22 is disposed at the position Js at the end of the most movable −X side of the movable range. FIG. 8B shows a state where the second member 22 is disposed at a position Jrm between the position Jr and the position Jm. FIG. 8D shows a state where the second member 22 is disposed at a position Jsm between the position Js and the position Jm. In the following description, the position Jr of the second member 22 shown in FIG. 8A is appropriately referred to as a first end position Jr, and the position Jm of the second member 22 shown in FIG. The position Jm is referred to as a position Js, and the position Js of the second member 22 shown in FIG. 8E is appropriately referred to as a second end position Js. The dimension of the movable range of the second member 22 includes the distance between the first end position Jr and the second end position Js in the X-axis direction.

  The state in which the second member 22 is disposed at the center position Jm is a state in which the second member 22 is disposed at the origin where the optical axis AX of the last optical element 13 and the center of the second opening portion 28 substantially coincide. Including.

  The control device 6 can change the position of the second member 22 with respect to the terminal optical element 13 (projection region PR). The control device 6 can move the second member 22 between two positions selected from the position Jr, the position Jrm, the position Jm, the position Jsm, and the position Js. The control device 6 can stop the second member 22 at at least one of the position Jr, the position Jrm, the position Jm, the position Jsm, and the position Js.

  The moving distance of the second member 22 between the position Jr and the position Jm is longer than the moving distance of the second member 22 between the position Jrm and the position Jm. The moving distance of the second member 22 between the position Js and the position Jm is longer than the moving distance of the second member 22 between the position Jsm and the position Jm.

  The control device 6 can move the second member 22 under a predetermined movement condition. The moving condition of the second member 22 includes at least one of a moving direction, a moving speed, an acceleration, and a moving distance. The control device 6 can control at least one of the moving direction, moving speed, acceleration, and moving distance of the second member 22.

  FIG. 9 is a diagram schematically illustrating an example of the movement trajectory of the substrate P when the shot area Sa, the shot area Sb, and the shot area Sc are sequentially exposed while the substrate P is moved stepwise. The shot area Sa, the shot area Sb, and the shot area Sc are arranged in the X-axis direction. As shown in FIG. 9, when the shot area Sa, the shot area Sb, and the shot area Sc are exposed, the position from the state in which the projection area PR is disposed at the position d1 of the substrate P under the last optical element 13 Path Tp1 from the state arranged at the position d2 adjacent to the + Y side to d1, the path from the state arranged at the position d2 to the state arranged at the position d3 adjacent to the + X side with respect to the position d2 Path Tp3 from the state arranged at Tp2, position d3 to the state arranged at position d4 adjacent to −Y side with respect to position d3, from the state arranged at position d4 to the + X side with respect to position d4 The path Tp4 up to the state arranged at the position d5 adjacent to and the state arranged at the position d5 to the state arranged at the position d6 adjacent to the + Y side with respect to the position d5 The road Tp5, the substrate P is successively moved. The positions d1, d2, d3, d4, d5, and d6 are positions in the XY plane.

  At least a part of the path Tp1 is a straight line parallel to the Y axis. At least a part of the path Tp3 is a straight line parallel to the Y axis. At least a part of the path Tp5 includes a straight line parallel to the Y axis. The path Tp2 includes a curve passing through the position d2.5. The path Tp4 includes a curve passing through the position d4.5. The position d1 includes the start point of the path Tp1, and the position d2 includes the end point of the path Tp1. The position d2 includes the start point of the path Tp2, and the position d3 includes the end point of the path Tp2. The position d3 includes the start point of the path Tp3, and the position d4 includes the end point of the path Tp3. The position d4 includes the start point of the path Tp4, and the position d5 includes the end point of the path Tp4. The position d5 includes the start point of the path Tp5, and the position d6 includes the end point of the path Tp5. The path Tp1 is a path along which the substrate P moves in the −Y direction. The path Tp3 is a path along which the substrate P moves in the + Y direction. The path Tp5 is a path along which the substrate P moves in the −Y direction. The path Tp2 and the path Tp4 are paths along which the substrate P moves in a direction whose main component is the −X direction.

  When the substrate P moves along the path Tp1 in the state where the immersion space LS is formed, the exposure light EL is irradiated to the shot region Sa through the liquid LQ. When the substrate P moves along the path Tp3 in a state where the immersion space LS is formed, the exposure light EL is irradiated to the shot region Sb through the liquid LQ. When the substrate P moves along the path Tp5 in a state where the immersion space LS is formed, the exposure light EL is irradiated to the shot region Sc through the liquid LQ. When the substrate P moves along the path Tp2 and the path Tp4, the exposure light EL is not irradiated.

  Each of the movement of the substrate P along the path Tp1, the movement along the path Tp3, and the movement along the path Tp5 includes a scanning movement operation. Each of the operation of moving the substrate P along the path Tp2 and the operation of moving along the path Tp4 includes a step movement operation. That is, each of the period during which the substrate P moves along the path Tp1, the period during which the path Tp3 moves, and the period during which the substrate P moves along the path Tp5 is a scan movement period (exposure period). Each of the period during which the substrate P moves along the path Tp2 and the period during which the substrate P moves along the path Tp4 is a step movement period.

  10 and 11 are schematic diagrams illustrating an example of the operation of the second member 22 when the shot area Sa, the shot area Sb, and the shot area Sc are exposed. 10 and 11 are views of the second member 22 as viewed from above. The liquid LQ is recovered from the opening 43 while the second member 22 moves. While the second member 22 moves, the liquid LQ is supplied from the opening 41 and the liquid LQ is recovered from the opening 42.

  When the substrate P is at the position d1, as shown in FIG. 10A, the second member 22 is arranged at the position Js with respect to the projection region PR (the optical path AT of the exposure light EL).

  When the substrate P is at the position d2, as shown in FIG. 10B, the second member 22 is disposed at the position Jr with respect to the projection region PR (the optical path AT of the exposure light EL). That is, during the scan movement operation from the position d1 to the position d2 of the substrate P, the second member 22 moves in the + X direction opposite to the step movement direction (−X direction) of the substrate P. During the scanning movement operation of the substrate P from the position d1 to the position d2, the second member 22 moves from the position Js to the position Jr through the position Jsm, the position Jm, and the position Jrm. In other words, when the substrate P moves along the path Tp1, the second member 22 moves in the + X direction so as to change from the state shown in FIG. 10A to the state shown in FIG. 10B.

  When the substrate P is at the position d2.5, as shown in FIG. 10C, the second member 22 is disposed at the position Jm with respect to the projection region PR (the optical path AT of the exposure light EL).

  When the substrate P is at the position d3, as shown in FIG. 10D, the second member 22 is disposed at the position Js with respect to the projection region PR (the optical path AT of the exposure light EL). That is, during the step movement operation from the position d2 to the position d3 of the substrate P, the second member 22 moves in the −X direction, which is the same as the step movement direction (−X direction) of the substrate P. During the step movement operation of the substrate P from the position d2 to the position d3, the second member 22 moves from the position Jr to the position Jm via the position Jrm, the position Jm, and the position Jsm. In other words, when the substrate P moves along the path Tp2, the second member 22 changes from the state shown in FIG. 10B to the state shown in FIG. 10D through the state shown in FIG. 10C. Move in the -X direction.

  When the substrate P is at the position d4, as shown in FIG. 11A, the second member 22 is disposed at the position Jr with respect to the projection region PR (the optical path AT of the exposure light EL). In other words, during the scan movement operation from the position d3 to the position d4 of the substrate P, the second member 22 moves in the + X direction opposite to the step movement direction (−X direction) of the substrate P. During the scan movement operation of the substrate P from the position d3 to the position d4, the second member 22 moves from the position Js to the position Jr through the position Jsm, the position Jm, and the position Jrm. In other words, when the substrate P moves along the path Tp3, the second member 22 moves in the + X direction so as to change from the state shown in FIG. 10D to the state shown in FIG.

  When the substrate P is at the position d4.5, as shown in FIG. 11B, the second member 22 is disposed at the position Jm with respect to the projection region PR (the optical path AT of the exposure light EL).

  When the substrate P is at the position d5, as shown in FIG. 11C, the second member 22 is disposed at the position Js with respect to the projection region PR (the optical path AT of the exposure light EL). That is, during the step movement operation from the position d4 to the position d5 of the substrate P, the second member 22 moves in the −X direction, which is the same as the step movement direction (−X direction) of the substrate P. During the step movement operation of the substrate P from the position d4 to the position d5, the second member 22 moves from the position Jr to the position Jm through the position Jrm, the position Jm, and the position Jsm. In other words, when the substrate P moves along the path Tp4, the second member 22 changes from the state shown in FIG. 11A to the state shown in FIG. 11C through the state shown in FIG. 11B. Move in the -X direction.

  When the substrate P is at the position d6, as shown in FIG. 11D, the second member 22 is disposed at the position Jr with respect to the projection region PR (the optical path AT of the exposure light EL). That is, during the scanning operation movement from the position d5 to the position d6 of the substrate P, the second member 22 moves in the + X direction opposite to the step movement direction (−X direction) of the substrate P. During the scanning movement operation of the substrate P from the position d5 to the position d6, the second member 22 moves from the position Js to the position Jr through the position Jsm, the position Jm, and the position Jrm. In other words, when the substrate P moves along the path Tp5, the second member 22 moves in the + X direction so as to change from the state shown in FIG. 11C to the state shown in FIG.

  The second member 22 moves in the −X direction so that the relative speed (relative acceleration) with the substrate P becomes small in at least a part of the period in which the substrate P moves along the path Tp2. In other words, the second member 22 has the −X direction so that the relative speed with respect to the X axis direction becomes small during at least part of the period during which the substrate P includes the −X direction component during the step movement operation. Move to. The second member 22 moves in the −X direction so that the relative speed with respect to the substrate P in the X-axis direction becomes small during at least a part of the period in which the substrate P moves along the path Tp4.

  The second member 22 moves in the + X direction during at least a part of the period during which the substrate P moves along the path Tp3. Thereby, after the movement of the path Tp3 of the substrate P, in the movement of the path Tp4, the exposure light EL can pass through the first and second openings 23 and 28 even if the second member 22 moves in the −X direction. The contact between the first member 21 and the second member 22 is suppressed. The same applies when the substrate P moves along the paths Tp1 and Tp5. That is, when the substrate P repeats the scan movement operation and the step movement operation including the component in the −X direction, the second member 22 is set so that the relative speed (relative acceleration) with the substrate P becomes small during the step movement operation. The second member 22 moves from the position Js to the position Js so that the second member 22 can move again in the −X direction in the next step movement operation during the scan movement operation from the position Jr to the position Js. Return to. Since the second member 22 moves in the + X direction during at least a part of the period during which the substrate P performs the scanning movement operation, the size of the second opening 28 is minimized, and the first member 21 and the second member 22 are reduced. Contact with is suppressed.

  Even when the second member 22 is disposed at the first end position Jr (second end position Js), at least a part of the opening 43 continues to face the substrate P (object). Thereby, for example, in the step movement operation, the opening 43 can collect the liquid LQ on the substrate P (object).

  In the example described with reference to FIGS. 10 and 11, the second member 22 is disposed at the second end position Js when the substrate P is at the positions d1, d3, and d5. When the substrate P is at the positions d1, d3, and d5, the second member 22 may be disposed at the central position Jm, or at the position Jsm between the central position Jm and the second end position Js. May be.

  In the example described with reference to FIGS. 10 and 11, the second member 22 is disposed at the first end position Jr when the substrate P is at the positions d2, d4, and d6. When the substrate P is at the positions d2, d4, and d6, the second member 22 may be disposed at the central position Jm or at a position Jrm between the central position Jm and the first end position Jr. May be.

  In addition, when the board | substrate P exists in position d2.5, d4.5, the 2nd member 22 may be arrange | positioned in the position different from the center position Jm. That is, when the board | substrate P exists in position d2.5, d4.5, the 2nd member 22 may be arrange | positioned at the position Jsm between the center position Jm and the 2nd edge part position Js, for example, It may be arranged at a position Jrm between the position Jm and the first end position Jr.

  Note that the second member 22 may stop or move in the same −X direction as the step movement direction (−X direction) of the substrate P in at least a part of the scan movement period of the substrate P. . Note that the second member 22 may stop during at least a part of the step movement period of the substrate P or move in the −X direction opposite to the step movement direction (−X direction) of the substrate P. Also good. That is, in a part of the movement period (scan movement period and step movement period) of the substrate P, the second member 22 has a relative speed (relative acceleration) between the second member 22 and the substrate P (object). 21 and the substrate P (object) move so as to be smaller than the relative speed (relative acceleration), and stop or move so that the relative speed (relative acceleration) increases during a part of the movement period of the substrate P. You may do it.

  According to this embodiment, since the second member 22 movable with respect to the first member 21 is provided, the substrate P (object) moves in the XY plane while the immersion space LS is formed. In addition, it is possible to prevent the liquid LQ from flowing out from the space between the liquid immersion member 5 and the substrate P (object) or the liquid LQ remaining on the object. That is, when the substrate P (object) moves at high speed in the XY plane in a state where the immersion space LS is formed, if a member (an immersion member or the like) facing the object is stationary, the liquid LQ May flow out, the liquid LQ may remain on the substrate P (object), or bubbles may be generated in the liquid LQ. In the present embodiment, the second member 22 moves so that the relative speed (relative acceleration) with respect to the substrate P (object) becomes small. Therefore, even if the substrate P (object) moves at a high speed in the state where the immersion space LS is formed, the liquid LQ flows out, the liquid LQ remains on the substrate P (object), or the liquid LQ It is possible to suppress the generation of bubbles.

  Next, the maintenance process (step STP2) of the exposure apparatus EX will be described. FIG. 12 is a flowchart illustrating an example of the maintenance process according to the present embodiment. As shown in FIG. 12, the maintenance process includes a cleaning process (step STP21) in which the liquid LC is supplied and a rinse process (step STP22) in which the liquid LC is removed by supplying the rinsing liquid. The rinsing process (step STP22) is performed after the cleaning process (step STP21).

  In the cleaning process, at least a part of the exposure apparatus EX is cleaned. In the present embodiment, at least a part of the liquid immersion member 5 is cleaned in the cleaning process.

  In the cleaning process, the liquid LC is supplied from the liquid immersion member 5. In the cleaning process, the liquid LC is supplied from at least one of the opening 41, the opening 42, and the opening 43 of the liquid immersion member 5. In the present embodiment, the liquid LC is supplied from the opening 41 of the liquid immersion member 5 in the cleaning process. In the cleaning process, the exposure light EL is not emitted from the emission surface 12.

  The liquid (cleaning liquid) LC supplied from the opening 41 in the cleaning process is different from the liquid (exposure liquid) LQ used in the exposure process. An alkaline liquid may be used as the liquid LC. As the liquid LC, an alkaline solution containing a predetermined substance may be used. The liquid LC may contain tetramethyl ammonium hydroxide (TMAH) as a predetermined substance. An alkaline aqueous solution may be used as the liquid LC. As the liquid LC, an aqueous tetramethyl ammonium hydroxide (TMAH) solution may be used. As an alkaline solution used as the liquid LC, not only tetramethylammonium hydroxide, but also an inorganic alkali solution such as sodium hydroxide and potassium hydroxide, and an organic alkali solution such as trimethyl (2-hydroxyethyl) ammonium hydroxide are used. Also good. Aqueous ammonia may be used as the liquid LC. An acidic liquid may be used as the liquid LC. An acidic solution containing a predetermined substance may be used as the liquid LC. The liquid LC may contain hydrogen peroxide as the predetermined substance. An acidic aqueous solution may be used as the liquid LC. As the liquid LC, an aqueous hydrogen peroxide solution (hydrogen peroxide solution) may be used. The liquid LC may contain a buffered hydrofluoric acid solution. The liquid LC may be a solution containing buffered hydrofluoric acid and hydrogen peroxide. Buffered hydrofluoric acid (buffered hydrofluoric acid) is a mixture of hydrofluoric acid and ammonium fluoride. The mixing ratio may be 5 to 2000 in terms of a volume ratio of 40 wt% ammonium fluoride solution / 50 wt% hydrofluoric acid. The mixing ratio of buffered hydrofluoric acid and hydrogen peroxide may be 0.8 to 55 in terms of the weight ratio of hydrogen peroxide / hydrofluoric acid. As the liquid LC, an ozone liquid containing ozone may be used. The liquid LC may be a solution containing hydrogen peroxide and ozone. The liquid LC may contain alcohol. The liquid LC may include at least one of ethanol, isopropyl alcohol (IPA), and pentanol.

  FIG. 13 is a diagram illustrating an example of the cleaning process. In the cleaning process, an object is disposed below the liquid immersion member 5 so as to face the liquid immersion member 5. The object disposed below the liquid immersion member 5 may be the substrate stage 2, the measurement stage 3, or an object different from the substrate stage 2 and the measurement stage 3.

  In the present embodiment, a substrate DP different from the substrate P is disposed at a position facing the liquid immersion member 5 in the cleaning process. No device is manufactured from the substrate DP. A device pattern cannot be formed on the substrate DP. The substrate DP is a substrate that is less likely to emit foreign matters (contaminants) than the substrate P. The substrate DP does not include a photosensitive material (photosensitive film). The substrate DP may be referred to as a cleaning substrate DP. The outer shape and dimensions of the substrate DP are substantially equal to the outer shape and dimensions of the substrate P. Note that at least one of the outer shape and dimensions of the substrate DP may be different from that of the substrate P. For example, the outer shape (dimension) of the substrate DP may be smaller than the outer shape (dimension) of the substrate P.

  The first holding unit of the substrate stage 2 can hold the substrate DP. The cleaning process is performed in a state where the substrate DP held on the substrate stage 2 (first holding unit) and the liquid immersion member 5 face each other. The liquid LC is supplied from the opening 41 in a state where the liquid immersion member 5 and the substrate DP (object) face each other. At least a part of the liquid LC from the opening 41 is supplied to the space SP <b> 1 between the first member 21 and the second member 22. At least a part of the liquid LC from the opening 41 is supplied to the space SP2 between the second member 22 and the substrate DP (object). At least a part of the liquid LC from the opening 41 is supplied to the space around the terminal optical element 13. The space around the terminal optical element 13 includes one or both of the space SP3 between the terminal optical element 13 and the first member 21 and the optical path space SPK between the terminal optical element 13 and the substrate DP (object). Thereby, an immersion space LT for the liquid LC is formed between the immersion member 5 and the substrate DP (object).

  The liquid LC in the immersion space LT is in contact with at least a part of the immersion member 5. Thereby, at least a part of the liquid immersion member 5 is cleaned. The liquid LC in the immersion space LT is in contact with at least a part of the last optical element 13. Thereby, at least a part of the last optical element 13 is cleaned. The liquid LC in the immersion space LT is in contact with at least a part of the object facing the liquid immersion member 5. Thereby, at least a part of the object is cleaned. Note that the liquid LC may not be in contact with the last optical element 13. When there is a possibility that the liquid LC may change the surface state, optical characteristics, and the like of the terminal optical element 13, the liquid LC and the terminal optical element 13 may not be in contact with each other.

  At least a part of the liquid LC supplied from the opening 41 is recovered from the opening 43. From the opening 43, the liquid LC in the space SP2 between the second member 22 and the substrate DP (object) is recovered. In parallel with at least a part of the supply of the liquid LC from the opening 41, the liquid LC is recovered from the opening 43. Thereby, an immersion space LT of the liquid LC is formed between the last optical element 13 and the liquid immersion member 5 on one side and the substrate DP (object) on the other side.

  At least a part of the liquid LC supplied from the opening 41 may be recovered from the opening 42. From the opening 42, the liquid LC in the space SP1 between the first member 21 and the second member 22 may be recovered. In the present embodiment, the liquid LC is recovered from the opening 42 in parallel with the supply of the liquid LC from the opening 41 and the recovery of the liquid LC from the opening 43.

  A part of the interface LH of the liquid LC in the immersion space LT is formed between the first member 21 and the second member 22. A part of the interface LH of the liquid LC in the immersion space LT is formed between the second member 22 and the substrate DP (object). A part of the interface LH of the liquid LC in the immersion space LT is formed between the terminal optical element 13 and the first member 21. In the following description, the interface LH of the liquid LC formed between the first member 21 and the second member 22 is appropriately referred to as an interface LH1. The interface LH formed between the second member 22 and the substrate DP (object) is appropriately referred to as an interface LH2. The interface LH formed between the last optical element 13 and the first member 21 is appropriately referred to as an interface LH3. The interface LH1 is formed between the region 252 of the lower surface 25 and the upper surface 29. The interface LH2 is formed between the region 302 of the lower surface 30 and the upper surface of the substrate DP (object).

  At least a part of the liquid LC supplied from the opening 41 is in contact with at least a part of the surface (the lower surface 25, the inner surface 26) of the first member 21. Thereby, the surface (the lower surface 25, the inner surface 26) of the first member 21 is cleaned with the liquid LC. At least a part of the liquid LC supplied from the opening 41 is in contact with at least a part of the surface (the upper surface 29, the lower surface 30) of the second member 22. Thereby, the surface (upper surface 29, lower surface 30) of the second member 22 is cleaned with the liquid LC.

  By the contact between the lower surface 30 and the liquid LC, foreign substances (contaminants) present (attached) to the lower surface 30 are removed from the lower surface 30. Similarly, when the upper surface 29 (lower surface 25, inner surface 26) and the liquid LC come into contact with each other, foreign substances (contaminants) existing (attached) on the upper surface 29 (lower surface 25, inner surface 26) become upper surface 29 (lower surface 25). , Removed from the inner surface 26). When the liquid LC comes into contact with the region 252 (porous member 44) of the lower surface 25, the porous member 44 is cleaned. When the liquid LC contacts the region 302 (porous member 45) of the lower surface 30, the porous member 45 is cleaned.

  The liquid LC in the space SP1 in contact with at least one of the lower surface 25 and the upper surface 29 is collected from the opening 42. The liquid LC is collected from the opening 42 together with the foreign matter (contaminant). The liquid LC in the space SP2 in contact with at least one of the lower surface 30 and the substrate DP (object) is recovered from the opening 43. From the opening 43, the liquid LC is collected together with foreign matter (contaminant).

  The second member 22 is moved in at least a part of the period during which the liquid LC is supplied from the opening 41. In at least a part of the period during which the liquid LC is supplied from the opening 41, the second member 22 may be moved in the XY plane substantially perpendicular to the optical axis AX of the terminal optical element 13, or in the Z-axis direction. Or may be moved in at least one direction of θX, θY, and θZ. In the present embodiment, the second member 22 is moved in the X-axis direction during at least a part of the period in which the liquid LC is supplied from the opening 41.

  The second member 22 is moved in at least a part of a period in which the supply of the liquid LC from the opening 41, the recovery of the liquid LC from the opening 42, and the recovery of the liquid LC from the opening 43 are performed. The second member 22 is moved in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object). In a state where the liquid LC immersion space LT is formed, the second member 22 may be moved in the XY plane substantially perpendicular to the optical axis AX of the last optical element 13 or moved in the Z-axis direction. Or may be moved in at least one direction of θX, θY, and θZ. In the present embodiment, the second member 22 is moved in the X-axis direction in a state where the liquid LC immersion space LT is formed. The liquid LC is recovered from the opening 43 while the second member 22 moves.

  In the exposure process, the lower surface 30 faces the substrate P. Even if the foreign matter (contaminant) generated from the substrate P adheres to the lower surface 30, the lower surface 30 is well cleaned by moving the second member 22 while the lower surface 30 and the liquid LC are in contact with each other. As illustrated in FIG. 14, the second member 22 moves in a state where the immersion space LT is formed, so that a radial direction with respect to the optical axis AX is formed between the lower surface 30 and the upper surface of the substrate DP (object). The interface LH2 of the liquid LC moves. As the second member 22 moves, the interface LH2 moves so as to approach the optical axis AX or move away from the optical axis AX. Due to the movement of the second member 22, the interface LH2 reciprocates (vibrates) in the radial direction with respect to the optical axis AX. By moving the second member 22 in a state where the liquid LC exists in the space SP2, the liquid LC flows in the space SP2. Thereby, the lower surface 30 is cleaned favorably.

  The interface LH2 also moves (reciprocating movement, vibration) by repeating the operation of recovering the liquid LC with the first recovery amount from the opening 43 and the operation of recovering the liquid LC with the second recovery amount different from the first recovery amount. To do. The interface LH2 also moves (reciprocating movement, vibration) by repeating the operation of supplying the liquid LC from the opening 41 with the first supply amount and the operation of supplying the liquid LC with the second supply amount different from the first supply amount. To do.

  As shown in FIG. 15, when the second member 22 moves in a state where the immersion space LT is formed, the interface LH1 of the liquid LC in the radial direction with respect to the optical axis AX between the lower surface 25 and the upper surface 29. Move. Due to the movement of the second member 22, the interface LH1 moves so as to approach the optical axis AX or move away from the optical axis AX. Due to the movement of the second member 22, the interface LH1 reciprocates (vibrates) in the radial direction with respect to the optical axis AX. By moving the second member 22 in a state where the liquid LC exists in the space SP1, the liquid LC flows in the space SP1. Thereby, the lower surface 25 and the upper surface 29 are satisfactorily cleaned.

  The interface LH1 also moves (reciprocating movement, vibration) by repeating the operation of recovering the liquid LC with the first recovery amount from the opening 42 and the operation of recovering the liquid LC with the second recovery amount different from the first recovery amount. To do. The interface LH1 also moves (reciprocating movement, vibration) by repeating the operation of supplying the liquid LC from the opening 41 with the first supply amount and the operation of supplying the liquid LC with the second supply amount different from the first supply amount. To do.

  The substrate DP (object) may be moved in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object). In the state where the immersion space LT is formed, the substrate DP (object) may be moved in an XY plane substantially perpendicular to the optical axis AX of the last optical element 13 or moved in the Z-axis direction. Alternatively, it may be moved in at least one direction of θX, θY, and θZ. In the present embodiment, the substrate DP (object) is moved in the XY plane in a state where the liquid LC immersion space LT is formed.

  In a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object), the substrate DP (object) follows the movement locus (path) indicated by the arrow Sr shown in FIG. It may be moved. In a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object), the substrate DP (object) may move along the paths Tp1 to Tp5 illustrated in FIG. . When the substrate DP (object) is moved along the paths Tp1 to Tp5 shown in FIG. 9, the control device 6 defines a virtual shot area (virtual shot area) on the substrate DP (object), and the virtual shot area Based on the routes Tp1 to Tp5, the substrate DP (object) may be moved along the routes Tp1 to Tp5. By moving the substrate DP (object) in the XY plane, the interface LH2 of the liquid LC moves (reciprocates) between the lower surface 30 and the upper surface of the substrate DP (object) as described with reference to FIG. Move, vibrate). Further, the liquid LC flows in the space SP2. Thereby, the lower surface 30 is cleaned favorably.

  When the substrate DP (object) moves in the state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 may not be moved.

  When the substrate DP (object) moves in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 may be moved. By moving both the substrate DP (object) and the second member 22, for example, the lower surface 30 is cleaned well.

  When the substrate DP (object) moves in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 is connected to the substrate DP (object). It may be moved so that the relative speed of. The second member 22 may be moved such that the relative speed between the second member 22 and the substrate DP (object) is smaller than the relative speed between the first member 21 and the substrate DP (object). The second member 22 may be moved so that the relative acceleration with the substrate DP (object) becomes small. The second member 22 may be moved such that the relative acceleration between the second member 22 and the substrate DP (object) is smaller than the relative acceleration between the first member 21 and the substrate DP (object). When the substrate DP (object) moves along the paths Tp1 to Tp5 illustrated in FIG. 9 in the state where the immersion space LT is formed, the second member 22 has the movement condition described with reference to FIGS. 10 and 11. It may be moved with. Thereby, the cleaning process is performed while the outflow of the liquid LC from the space between the liquid immersion member 5 and the substrate DP (object), the remaining of the liquid LC, and the like are suppressed.

  After the cleaning process (step STP21), a rinsing process (step STP22) is performed. After cleaning using the liquid LC from the opening 41, a rinsing liquid is supplied. By supplying the rinsing liquid, the liquid LC of the liquid immersion member 5 is removed. The rinsing liquid is a liquid (exposure liquid) LQ used in the exposure process.

  In the rinsing process, the liquid LC remaining on the surface (the lower surface 25, the inner surface 26, the upper surface 29, the lower surface 30, etc.) of the liquid immersion member 5 is removed from the surface of the liquid immersion member 5 using the liquid LQ for rinsing. Including that. The rinsing process includes removing the liquid LC remaining on the surface (the exit surface 12, the outer surface 131, etc.) of the terminal optical element 13 from the surface of the terminal optical element 13 using the rinsing liquid LQ. The rinsing process may include removing the liquid LC remaining on the surface (upper surface) of the object (such as the substrate DP) from the surface of the object using the rinsing liquid LQ.

  The rinsing liquid LQ is supplied from the opening 41. In the rinsing process, an object is placed at a position facing the liquid immersion member 5. The object may be the substrate DP. In the present embodiment, the rinsing process is performed in a state where the substrate DP held by the substrate stage 2 (first holding unit) and the liquid immersion member 5 face each other. In the state where the liquid immersion member 5 and the substrate DP (object) face each other, the rinsing liquid LQ is supplied from the opening 41. At least a part of the liquid LQ from the opening 41 is supplied to the space SP <b> 1 between the first member 21 and the second member 22. At least a part of the liquid LQ from the opening 41 is supplied to the space SP2 between the second member 22 and the substrate DP (object). At least a part of the liquid LQ from the opening 41 is supplied to the space around the terminal optical element 13 (one or both of the space SP3 and the optical path space SPK). Thereby, an immersion space LS for the liquid LQ is formed between the immersion member 5 and the substrate DP (object).

  The liquid LQ in the immersion space LS is in contact with at least a part of the immersion member 5. Thereby, the liquid LC remaining in the liquid immersion member 5 is removed. The liquid LQ in the immersion space LS is in contact with at least a part of the last optical element 13. As a result, the liquid LC remaining in the last optical element 13 is removed. The liquid LQ in the immersion space LS is in contact with at least a part of the object facing the liquid immersion member 5. Thereby, the liquid LC remaining on the object is removed.

  At least a part of the liquid LQ supplied from the opening 41 is recovered from the opening 43. From the opening 43, the liquid LQ in the space SP2 between the second member 22 and the substrate DP (object) is recovered. In the present embodiment, the liquid LQ is recovered from the opening 43 in parallel with at least part of the supply of the liquid LQ from the opening 41. Thereby, an immersion space LS for the liquid LQ is formed between the last optical element 13 and the immersion member 5 on one side and the substrate DP (object) on the other side.

  At least a part of the liquid LQ supplied from the opening 41 may be recovered from the opening 42. From the opening 42, the liquid LQ in the space SP1 between the first member 21 and the second member 22 may be recovered. In the present embodiment, the liquid LQ is recovered from the opening 42 in parallel with the supply of the liquid LQ from the opening 41 and the recovery of the liquid LQ from the opening 43.

  At least a part of the liquid LQ supplied from the opening 41 is in contact with at least a part of the surface (the lower surface 25, the inner surface 26) of the first member 21. Thereby, the liquid LC remaining on the surface (lower surface 25, inner surface 26) of the first member 21 is removed. At least a part of the liquid LQ supplied from the opening 41 is in contact with at least a part of the surface (the upper surface 29, the lower surface 30) of the second member 22. Thereby, the liquid LC remaining on the surface (upper surface 29, lower surface 30) of the second member 22 is removed.

  The liquid LQ in the space SP1 in contact with at least one of the lower surface 25 and the upper surface 29 is collected from the opening 42. From the opening 42, the liquid LQ is recovered together with the liquid LC. The liquid LQ in the space SP2 in contact with at least one of the lower surface 30 and the substrate DP (object) is collected from the opening 43. From the opening 43, the liquid LQ is recovered together with the liquid LC.

  The second member 22 may be moved during at least a part of the period in which the rinsing liquid LQ is supplied from the opening 41. In at least a part of the period in which the rinsing liquid LQ is supplied from the opening 41, the second member 22 may be moved in an XY plane substantially perpendicular to the optical axis AX of the last optical element 13, It may be moved in the Z-axis direction, or may be moved in at least one of θX, θY, and θZ. In the present embodiment, the second member 22 is moved in the X-axis direction during at least a part of the period in which the rinsing liquid LQ is supplied from the opening 41.

  In the present embodiment, the second member 22 is moved during at least a part of a period in which the supply of the liquid LQ from the opening 41, the recovery of the liquid LQ from the opening 42, and the recovery of the liquid LQ from the opening 43 are performed. The The second member 22 is moved in a state where the immersion space LS of the rinsing liquid LQ is formed between the immersion member 5 and the substrate DP (object). In a state where the immersion space LS for the liquid LQ is formed, the second member 22 may be moved in the XY plane substantially perpendicular to the optical axis AX of the last optical element 13 or moved in the Z-axis direction. Or may be moved in at least one direction of θX, θY, and θZ. In the present embodiment, the second member 22 is moved in the X-axis direction in a state where the immersion space LS for the liquid LQ is formed. The liquid LQ is recovered from the opening 43 while the second member 22 moves.

  When the second member 22 moves in the state where the immersion space LS of the rinsing liquid LQ is formed, the liquid is emitted in the radial direction with respect to the optical axis AX between the lower surface 30 and the upper surface of the substrate DP (object). The LQ interface LG2 moves (reciprocates, vibrates). When the second member 22 is moved in a state where the liquid LQ is present in the space SP2, the liquid LQ flows in the space SP2. Thereby, the liquid LC is satisfactorily removed from the lower surface 30.

  When the second member 22 moves in the state in which the immersion space LS for the rinsing liquid LQ is formed, the interface LG1 of the liquid LQ is formed between the lower surface 25 and the upper surface 29 in the radial direction with respect to the optical axis AX. Move (reciprocate, vibrate). By moving the second member 22 in a state where the liquid LQ is present in the space SP1, the liquid LQ flows in the space SP1. Thereby, the liquid LC is satisfactorily removed from the lower surface 25 and the upper surface 29.

  The substrate DP (object) may be moved in a state where the immersion space LS of the rinsing liquid LQ is formed between the liquid immersion member 5 and the substrate DP (object). In a state where the immersion space LS is formed, the substrate DP (object) may be moved in the XY plane substantially perpendicular to the optical axis AX of the last optical element 13 or moved in the Z-axis direction. Alternatively, it may be moved in at least one direction of θX, θY, and θZ. In the present embodiment, the substrate DP (object) is moved in the XY plane in a state where the immersion space LS for the rinsing liquid LQ is formed. In a state where the immersion space LS of the rinsing liquid LQ is formed between the liquid immersion member 5 and the substrate DP (object), the substrate DP (object) moves along the movement locus (indicated by the arrow Sr shown in FIG. Route). With the immersion space LS for the rinsing liquid LQ formed between the immersion member 5 and the substrate DP (object), the substrate DP (object) moves along the paths Tp1 to Tp5 shown in FIG. May be. When the substrate DP (object) is moved along the paths Tp1 to Tp5 shown in FIG. 9, the control device 6 defines a virtual shot area (virtual shot area) on the substrate DP (object), and the virtual shot area Based on the routes Tp1 to Tp5, the substrate DP (object) may be moved along the routes Tp1 to Tp5. When the substrate DP (object) is moved in the XY plane, the interface LG2 of the liquid LQ moves (reciprocates and vibrates) between the lower surface 30 and the upper surface of the substrate DP (object). Further, the liquid LQ flows in the space SP2. Thereby, the liquid LC is satisfactorily removed from the lower surface 30.

  When the substrate DP (object) moves with the immersion space LS of the rinsing liquid LQ formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 is not moved. Also good.

  When the substrate DP (object) moves in a state where the immersion space LS of the rinsing liquid LQ is formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 may be moved. . By moving both the substrate DP (object) and the second member 22, for example, the liquid LC is favorably removed from the lower surface 30.

  When the substrate DP (object) moves while the immersion space LS of the rinsing liquid LQ is formed between the liquid immersion member 5 and the substrate DP (object), the second member 22 has the substrate DP ( It may be moved so that the relative speed with respect to the (object) becomes small. The second member 22 may be moved such that the relative speed between the second member 22 and the substrate DP (object) is smaller than the relative speed between the first member 21 and the substrate DP (object). The second member 22 may be moved so that the relative acceleration with the substrate DP (object) becomes small. The second member 22 may be moved such that the relative acceleration between the second member 22 and the substrate DP (object) is smaller than the relative acceleration between the first member 21 and the substrate DP (object). When the substrate DP (object) moves along the paths Tp1 to Tp5 shown in FIG. 9 in the state where the immersion space LS for the rinsing liquid LQ is formed, the second member 22 is referred to FIG. 10 and FIG. The movement conditions described above may be used. Accordingly, the rinsing process is performed while the outflow of the liquid LQ from the space between the liquid immersion member 5 and the substrate DP (object), the remaining of the liquid LQ, and the like are suppressed.

  After completion of the rinsing process (maintenance process), an exposure process for the substrate P may be performed.

  As described above, in the present embodiment, at least a part of the exposure apparatus EX is cleaned by the cleaning liquid (cleaning liquid) LC supplied from the liquid immersion member 5. At least the liquid immersion member 5 is cleaned by the liquid LC. Further, an object capable of forming the liquid LC immersion space LT with the liquid immersion member 5 is also cleaned. Therefore, the occurrence of exposure failure due to contamination of the exposure apparatus EX and the occurrence of defective devices are suppressed.

  In the cleaning process, the first member 21 facing the second member 22 and at least a part of the surface of the second member 22 is moved by moving the second member 22 in a state in which the liquid LC immersion space LT is formed. At least a part of the surface of the substrate is cleaned well.

  In the cleaning process, the object (substrate DP or the like) moves in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5 and the object (substrate DP or the like). At least a part of the surface of the two members 22 is cleaned well.

  As the rinsing liquid, a liquid of a different type (physical property) from the exposure liquid (exposure liquid) LQ may be used. When the rinsing liquid is the same type (physical properties) as the exposure liquid LQ, the rinsing liquid and the exposure liquid may have different cleanliness or different dissolved gas concentrations. The type of dissolved gas may be different. The temperature of the rinsing liquid and the temperature of the exposure liquid LQ may be different. For example, when the temperature of the liquid immersion member 5 is changed with respect to the reference temperature by the cleaning process using the liquid LC, the rinsing liquid LQ supplied in the rinsing process so that the temperature of the liquid immersion member 5 becomes the reference temperature. The temperature may be determined. In other words, temperature adjustment may be performed with the rinsing liquid LQ so that the liquid immersion member 5 becomes the reference temperature. The reference temperature includes, for example, a target temperature of the liquid immersion member 5 in the exposure process of the substrate P. The same applies to the embodiments described below.

  The liquid (cleaning liquid) LC supplied from the opening 41 in the cleaning process may be an exposure liquid (pure water) LQ. When the cleaning liquid LC is the exposure liquid (pure water) LQ, the rinsing process may be omitted. The same applies to the embodiments described below.

  In the cleaning process, the liquid LC for cleaning is supplied from the liquid immersion member 5 with the liquid immersion member 5 and the substrate stage 2 (cover member T) facing each other, so that the substrate stage 2 (cover member T) At least a portion is cleaned with the liquid LC. An immersion space LT of the liquid LC is formed on the gap between the substrate DP held by the first holding part and the cover member T held by the second holding part, whereby the inner edge of the cover member T, the first At least a part of the holding part and at least a part of the second holding part are cleaned. In the cleaning process, at least a part of the measurement stage 3 is cleaned with the liquid LC by supplying the cleaning liquid LC from the liquid immersion member 5 with the liquid immersion member 5 and the measurement stage 3 facing each other. . The same applies to the embodiments described below.

Second Embodiment
A second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram illustrating an example of the cleaning process according to the present embodiment. As illustrated in FIG. 16, the liquid immersion member 5 </ b> B includes a first member 21 and a second member 22. The first member 21 has an opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK) and an opening 42 facing the space SP1. The second member 22 has an opening 43 that faces the space SP2. In the cleaning process, the cleaning liquid LC is supplied from the opening 41 and the opening 43. From the opening 42, the liquid LC is recovered.

  In the present embodiment, the liquid immersion member 5 </ b> B includes a third member 50 that is disposed outside the second member 22 with respect to the optical path K. A fourth space SP4 is formed between the third member 50 and the substrate DP (object). The 3rd member 50 has the opening 51 arrange | positioned so that 4th space SP4 may be faced. The opening 51 is disposed outside the opening 41, the opening 42, and the opening 43 with respect to the radiation direction with respect to the optical axis AX. In the cleaning process, the liquid LC is recovered from the opening 51.

  In parallel with at least a part of the supply of the liquid LC from the opening 41 and the opening 43, the liquid LC is recovered from the opening 42 and the opening 51. Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5B.

  In the exposure process, the opening 51 may function as a liquid recovery port that recovers the liquid LQ. When the liquid LQ flows out from the space (space SP2) between the liquid immersion member 5 and the substrate P (object) in the exposure processing, the liquid LQ that has flowed out may be collected from the opening 51.

  In the exposure process, the opening 51 may function as a gas supply port for supplying gas. In the exposure process, gas is supplied from the opening 51 to at least part of the periphery of the immersion space LS of the liquid LQ formed on the substrate P (object), whereby the liquid LQ in the immersion space LS is supplied to the immersion member. 5 and the space between the substrate P (object).

  In the cleaning process, the opening 51 may function as a gas supply port that supplies gas. In the cleaning process, gas is supplied from the opening 51 to at least a part of the periphery of the liquid LC immersion space LT formed on the substrate DP (object), whereby the liquid LC in the liquid immersion space LT is immersed in the liquid immersion member. 5 and the space between the substrate DP (object).

<Third Embodiment>
A third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 17 is a diagram illustrating an example of the cleaning process according to the present embodiment. As illustrated in FIG. 17, the liquid immersion member 5 </ b> C includes a first member 21 and a second member 22. The first member 21 has an opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK) and an opening 42 facing the space SP1. The second member 22 has an opening 43 that faces the space SP2. In the cleaning process, the cleaning liquid LC is supplied from the opening 41, the opening 42, and the opening 43.

  In the present embodiment, the liquid immersion member 5C includes the third member 50 disposed outside the second member 22 with respect to the radial direction with respect to the optical axis AX, and the first member 21 and the second member 22 with respect to the radial direction with respect to the optical axis AX. And a fourth member 52 disposed between (portion 222). The 3rd member 50 has the opening 51 arrange | positioned so that 4th space SP4 may be faced. The fourth member 52 is disposed in the gap between the outer surface 27 and the inner surface 31. A fifth space SP5 is formed between the fourth member 52 and the second member 22 (part 221). The fourth member 52 has an opening 53 disposed so as to face the fifth space SP5. The opening 53 is disposed outside the opening 41 and the opening 42 with respect to the radiation direction with respect to the optical axis AX. In the cleaning process, the liquid LC is recovered from the opening 51 and the opening 53.

  In parallel with at least a part of the supply of the liquid LC from the opening 41, the opening 42, and the opening 43, the liquid LC is recovered from the opening 51 and the opening 53. Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5C.

  In the exposure process, the opening 51 may function as a liquid recovery port that recovers the liquid LQ. In the exposure process, the opening 51 may function as a gas supply port for supplying gas. In the cleaning process, the opening 51 may function as a gas supply port that supplies gas.

  In the exposure process, the opening 53 may function as a liquid recovery port that recovers the liquid LQ. When the liquid LQ flows out from the space (space SP1) between the first member 21 and the second member 22 in the exposure process, the liquid LQ that has flowed out may be collected from the opening 53.

  In the exposure process, the opening 53 may function as a gas supply port for supplying gas. In the exposure process, the liquid LQ can be enclosed in the space SP1 by supplying gas from the opening 53 to at least a part of the periphery LG1 of the space L1 in the space SP1.

  In the cleaning process, the opening 53 may function as a gas supply port that supplies gas. In the cleaning process, gas is supplied from the opening 53 to at least a part of the periphery of the interface LH1 of the liquid LC in the space SP1, so that the liquid LC can be contained in the space SP1.

  In the exposure process, the fourth member 52 (opening 53) may not be arranged.

<Fourth embodiment>
A fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 18 is a diagram illustrating an example of the liquid immersion member 5D according to the present embodiment. As illustrated in FIG. 18, the liquid immersion member 5 </ b> D includes a first member 21 </ b> D and a second member 22. The first member 21D faces the opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK) and the space SP1 between the first member 21D and the second member 22. And an opening 42 facing the space SP1. The second member 22 has an opening 43 that faces the space SP2.

  The opening 47 is disposed on the lower surface 25 of the first member 21D so as to face the space SP1. With respect to the radiation direction with respect to the optical axis AX, the opening 42 is arranged outside the opening 47. The opening 43 is arranged outside the opening 47 with respect to the radiation direction with respect to the optical axis AX. The opening 41 is disposed outside the opening 47 with respect to the radiation direction with respect to the optical axis AX. The opening 41 is disposed above the opening 47. The opening 47 is disposed above the opening 43. The opening 47 is disposed at substantially the same height as the opening 42.

  In the exposure process of the substrate P, the liquid LQ is supplied from the opening 41 and the opening 47. In the exposure process of the substrate P, the liquid LQ is recovered from the opening 42 and the opening 43.

  FIG. 19 is a diagram illustrating an example of the cleaning process according to the present embodiment. As shown in FIG. 19, the cleaning liquid LC is supplied from the opening 41 and the opening 47 in the cleaning process. The liquid LC is recovered from the opening 42 and the opening 43.

  The liquid LC is supplied from the opening 41 to the space around the terminal optical element 13 (one or both of the space SP3 and the optical path space SPK). The liquid LC is supplied from the opening 47 to the space SP1. The liquid LC supplied from the opening 41 and the liquid LC supplied from the opening 47 may be the same type of liquid or different types of liquid. For example, an exposure liquid (pure water) LQ may be supplied from the opening 41 and a liquid LC such as an alkaline solution may be supplied from the opening 47. When there is a possibility that the liquid LC supplied from the opening 47 may change the surface state, optical characteristics, etc. of the terminal optical element 13, the exposure liquid LQ is supplied from the opening 41 closer to the terminal optical element 13 than the opening 47. Thus, contact between the liquid LC and the last optical element 13 can be suppressed.

  Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5D. In the present embodiment, in the cleaning process, the liquid LC is supplied to the space SP1 from the opening 47 facing the space SP1. Therefore, for example, even if it is difficult for the liquid LC from the opening 41 to flow into the space SP1 through the opening 32, the liquid LC from the opening 47 contacts the lower surface 25 of the first member 21D and the upper surface 29 of the second member 22. Can be made.

<Fifth Embodiment>
A fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 20 is a diagram illustrating an example of the cleaning process according to the present embodiment. The liquid immersion member 5E includes a first member 21D and a second member 22. The first member 21D has an opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK), an opening 47 facing the space SP1, and an opening 42 facing the space SP1. Have The second member 22 has an opening 43 that faces the space SP2. In the cleaning process, the cleaning liquid LC is supplied from the opening 41, the opening 47, and the opening 43. From the opening 42, the liquid LC is recovered.

  In the present embodiment, the liquid immersion member 5 </ b> E includes a third member 50 that is disposed outside the second member 22 with respect to the optical path K. The 3rd member 50 has the opening 51 arrange | positioned so that 4th space SP4 may be faced. The opening 51 is disposed outside the opening 41, the opening 47, the opening 42, and the opening 43 with respect to the radiation direction with respect to the optical axis AX. In the cleaning process, the liquid LC is recovered from the opening 51.

  In parallel with at least part of the supply of the liquid LC from the opening 41, the opening 47, and the opening 43, the liquid LC is recovered from the opening 42 and the opening 51. Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5E.

  In the exposure process, the opening 51 may function as a liquid recovery port that recovers the liquid LQ. In the exposure process, the opening 51 may function as a gas supply port for supplying gas. In the cleaning process, the opening 51 may function as a gas supply port that supplies gas.

<Sixth Embodiment>
A sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 21 is a diagram illustrating an example of the cleaning process according to the present embodiment. The liquid immersion member 5F includes a first member 21D and a second member 22. The first member 21D has an opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK), an opening 47 facing the space SP1, and an opening 42 facing the space SP1. Have The second member 22 has an opening 43 that faces the space SP2. In the cleaning process, the cleaning liquid LC is supplied from the opening 41, the opening 47, the opening 42, and the opening 43.

  In the present embodiment, the liquid immersion member 5F includes the third member 50 disposed outside the second member 22 with respect to the radial direction with respect to the optical axis AX, and the first member 21 and the second member 22 with respect to the radial direction with respect to the optical axis AX. And a fourth member 52 disposed between (portion 222). The 3rd member 50 has the opening 51 arrange | positioned so that 4th space SP4 may be faced. The fourth member 52 has an opening 53 disposed so as to face the fifth space SP5. In the cleaning process, the liquid LC is recovered from the opening 51 and the opening 53.

  In parallel with at least part of the supply of the liquid LC from the opening 41, the opening 47, the opening 42, and the opening 43, the liquid LC is recovered from the opening 51 and the opening 53. Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5F.

  In the exposure process, the opening 53 may function as a liquid recovery port that recovers the liquid LQ. In the exposure process, the opening 53 may function as a gas supply port for supplying gas. In the cleaning process, the opening 53 may function as a gas supply port that supplies gas. In the exposure process, the fourth member 52 (opening 53) may not be arranged.

<Seventh embodiment>
A seventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 22 is a diagram illustrating an example of the cleaning process according to the present embodiment. As illustrated in FIG. 22, the liquid immersion member 5G includes a first member 21 and a second member 22G. The first member 21 faces the opening 41 facing the space around the last optical element 13 (one or both of the space SP3 and the optical path space SPK) and the space SP1 between the first member 21 and the second member 22G. And an opening 42 to be used. The second member 22 has an opening 48 that faces the space around the last optical element 13 (optical path space SPK), an opening 49 that faces the space SP1, and an opening 43 that faces the space SP2.

  The opening 48 is disposed on the inner surface 38 of the second member 22G so as to face the optical path space SPK. The opening 49 is disposed on the upper surface 29 of the second member 22G so as to face the space SP1. With respect to the radiation direction with respect to the optical axis AX, the opening 41 is disposed outside the opening 48. With respect to the radiation direction with respect to the optical axis AX, the opening 49 is arranged outside the opening 48. The opening 41 is disposed outside the opening 49 with respect to the radiation direction with respect to the optical axis AX. The opening 49 may be disposed outside the opening 41. With respect to the radiation direction with respect to the optical axis AX, the opening 43 is disposed outside the opening 48 and the opening 49. With respect to the radiation direction with respect to the optical axis AX, the opening 42 is disposed outside the opening 48 and the opening 49. The opening 41 is disposed above the opening 48 and the opening 49. The opening 42 is disposed above the opening 48 and the opening 49.

  In the exposure process of the substrate P, the liquid LQ is supplied from the opening 41. In the exposure process of the substrate P, the liquid LQ is supplied from the opening 48 to the optical path space SPK. In the exposure process of the substrate P, the liquid LQ is supplied from the opening 49 to the space SP1. In the exposure process of the substrate P, the liquid LQ is recovered from the opening 42 and the opening 43.

  In the cleaning process, the cleaning liquid LC is supplied from the opening 41, the opening 48, and the opening 49. The liquid LC is recovered from the opening 42 and the opening 43. The liquid LC is supplied from the opening 41 to the space around the terminal optical element 13 (one or both of the space SP3 and the optical path space SPK). The liquid LC is supplied from the opening 48 to the space around the last optical element 13 (optical path space SPK). The liquid LC is supplied from the opening 49 to the space SP1. The liquid LC supplied from the opening 41, the liquid LC supplied from the opening 48, and the liquid LC supplied from the opening 49 may be the same type of liquid or different types of liquid. For example, the exposure liquid (pure water) LQ may be supplied from the opening 41 and the opening 48, and the liquid LC such as an alkaline solution may be supplied from the opening 49. When there is a possibility that the liquid LC supplied from the opening 49 may change the surface state, optical characteristics, and the like of the terminal optical element 13, one or both of the opening 41 and the opening 48 closer to the terminal optical element 13 than the opening 49. By supplying the exposure liquid LQ from, contact between the liquid LC and the last optical element 13 can be suppressed.

  Also in the present embodiment, the cleaning process is favorably performed with the liquid LC supplied from the liquid immersion member 5G. In the present embodiment, in the cleaning process, the liquid LC is supplied to the space SP1 from the opening 49 facing the space SP1. Therefore, for example, even if it is difficult for the liquid LC from at least one of the opening 41 and the opening 48 to flow into the space SP1 through the opening 32, the liquid LC from the opening 49 is removed from the lower surface 25 and the second member of the first member 21. The upper surface 29 of 22G can be contacted.

  Note that the liquid immersion member 5G according to the present embodiment may include one or both of the third member 50 and the fourth member 52 described with reference to FIG. 16, FIG. 17, FIG. 20, FIG. .

  As in the first embodiment, also in the above-described second to seventh embodiments, the second member 22 (22G) may be moved or the substrate DP (object) may be moved in the cleaning process. . The second member 22 (22G) may be moved under the moving conditions described with reference to FIGS. 10 and 11, for example. The substrate DP (object) may be moved along the paths Tp1 to Tp5 described with reference to FIG. The second member 22 (22G) may be moved so that the relative speed (relative acceleration) with respect to the substrate DP (object) becomes small. The second member 22 (22G) has a relative speed (relative acceleration) between the second member 22 (22G) and the substrate DP (object), and a relative speed between the first member (21 and the like) and the substrate DP (object) ( It may be moved so as to be smaller than (relative acceleration).

In the cleaning process of the first to seventh embodiments described above, the liquid LC may be recovered from the opening 41.
In the cleaning processes of the first to fifth and seventh embodiments described above, for example, the liquid LC may be supplied from one or both of the opening 42 and the opening 43.
In the cleaning processes of the first to fifth and seventh embodiments described above, when the liquid LQ is supplied from the opening 42, the liquid LC can flow out to the space outside the opening 42 with respect to the optical path K (K2). Therefore, in the rinsing process after the cleaning process, one of the first member 21 and the second member 22 has an opening for supplying the liquid LQ to the space outside the opening 42 with respect to the optical path K (K2). Or you may provide in both. Alternatively, in the rinsing process, the liquid LQ supplied from the opening 41 is caused to flow from above the gap between the outer surface 27 of the first member 21 and the inner surface 31 of the second member 2 to the upper surface 29 of the second member 22 to open the opening. 42 may be recovered.

<Eighth Embodiment>
An eighth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  23 and 24 are diagrams showing an example of the liquid immersion member 5T according to the present embodiment. The liquid immersion member 5T includes a first member 21T and a movable second member 22T. The first member 21T includes a first opening 23T through which the exposure light EL can pass, and a lower surface 25T disposed around the optical path K (first opening 23T) of the exposure light EL. The second member 22T includes a second opening 28T through which the exposure light EL can pass, an upper surface 29T disposed around the optical path K (second opening 28T) of the exposure light EL, and an optical path K ( And a lower surface 30T disposed around the second opening 28T).

  At least a part of the first member 21 </ b> T is arranged to face the emission surface 12. At least a part of the first member 21 </ b> T is disposed below the emission surface 12. In the following description, the portion 211T of the first member 21T disposed below the emission surface 12 is appropriately referred to as a protection portion 211T. The protection part 211T may be referred to as a wall part 211T. The protection part 211T has an upper surface 24T that faces the emission surface 12 with a gap therebetween. The protection part 211T is disposed between the emission surface 12 and the upper surface of the substrate P (object). The protection part 211T is disposed above the second member 22T. The protection part 211T is disposed between the terminal optical element 13 and the second member 211T. Even if the second member 22T moves in a state where the immersion space LS is formed, the protection part 211T reduces (suppresses) the pressure fluctuation received by the last optical element 13 from the liquid LQ in the immersion space LS.

  The first member 21T has an opening 41T and an opening 47T that can supply the liquid LQ in the exposure processing of the substrate P, and an opening 42T that can collect the liquid LQ. The second member 22T has an opening 43T that can collect the liquid LQ in the exposure processing of the substrate P. The opening 41T is disposed so as to face the space around the last optical element 13. The space around the terminal optical element 13 includes one or both of the space SP3 between the first member 21T and the terminal optical element 13 and the optical path space SPK between the terminal optical element 13 and the substrate P (object). The opening 42T is disposed so as to face the space SP1 on the lower surface 25T side of the first member 21T. The space SP1 includes a space between the first member 21T and the second member 22T. The opening 43T is disposed so as to face the space SP2 on the lower surface 30T side of the second member 22T. The space SP2 includes a space between the second member 22T and the substrate P (object). The substrate 43 (object) can face the opening 43T.

  The opening 47T is disposed so as to face the space SP1. The opening 47T is disposed on the lower surface 25T of the first member 21T. The opening 47T is disposed in the moving direction of the second member 22T with respect to the optical path K (optical axis AX). The opening 47T is disposed on each of the + X side and the −X side with respect to the optical path K (optical axis AX).

  A plurality of openings 47T are arranged in the radiation direction with respect to the optical axis AX of the terminal optical element 13. In the example shown in FIG. 23, two openings 47T are arranged on the lower surface 25T on the + X side with respect to the optical path K. A plurality (two) of openings 47T are also arranged on the lower surface 25T on the −X side with respect to the optical path K.

  FIG. 23 shows a state in which the second member 22T is arranged at the origin (center position Jm). FIG. 24 shows a state where the second member 22T is arranged at the first end position Jr and a state where the second member 22T is arranged at the second end position Js. In FIG. 24, the second member 22T disposed at the first end position Jr is indicated by a solid line, and the second member 22T disposed at the second end position Js is indicated by a chain line.

  As shown in FIGS. 23 and 24, in a state where the second member 22T is disposed at the center position Jm or in a state where the second member 22T is disposed at the second end position Js, The opening 47T arranged on the lower surface 25T on the + X side faces the second member 22T. As shown in FIG. 24, in the state where the second member 22T is disposed at the first end position Jr, the opening 47T disposed on the lower surface 25T on the + X side with respect to the optical path K has the second member 22T. It faces the substrate P (object).

  That is, the second member 22T is movable so as to change from one of a state facing the opening 47T and a state not facing the opening 47T to the other. In the movement of the second member 22T in the X-axis direction, the second member 22T changes from one of the state facing the opening 47T and the state not facing the opening 47T to the other.

  Although illustration is omitted, in the state where the second member 22T is disposed at the central position Jm, or in the state where the second member 22T is disposed at the first end position Jr, − The opening 47T arranged on the lower surface 25T on the X side faces the second member 22T. Further, in the state where the second member 22T is disposed at the second end position Js, the opening 47T disposed on the lower surface 25T on the −X side with respect to the optical path K does not face the second member 22T. , Facing the substrate P (object).

  The liquid LQ is supplied from the opening 47T during at least a part of the period during which the second member 22 moves. As shown in FIG. 23, the liquid LQ is supplied from the opening 47T in a state where the second member 22T faces the opening 47T. The opening 47T supplies the liquid LQ to the space SP1 between the first member 21T and the second member 22T. As shown in FIG. 24, the liquid LQ is supplied from the opening 47T in a state where the second member 22T does not face the opening 47T. The opening 47T supplies the liquid LQ to the space between the first member 21T and the substrate P (object).

  When the second member 22T moves while the immersion space LS is formed, bubbles are generated in the liquid LQ in the optical path space SPK including the optical path K2 of the exposure light EL, or in the liquid LQ in the optical path space SPK. There is a possibility that the optical path space SPK is not sufficiently filled with the liquid LQ, for example, a gas portion is generated. In the present embodiment, since the opening 47T is provided, the generation of bubbles (gas portion) in the liquid LQ in the optical path space SPK is suppressed.

  FIG. 25 shows an example of the liquid immersion member that does not have the opening 47T. The second member 22T has a second opening 28T through which the exposure light EL can pass. When the second member 22T moves while the immersion space LS is formed, the interface LG2 of the liquid LQ between the second member 22T and the substrate P (object) approaches the second opening 28T. There is a possibility to move. For example, when the substrate P (object) moves in the Y-axis direction while the second member 22T moves in the X-axis direction, the interface LG2 of the liquid LQ may move closer to the second opening 28T. is there. When the interface LG2 of the liquid LQ moves so as to approach the second opening 28T and at least a part of the interface LG2 moves below the second opening 28T, bubbles (gas portions) are formed in the liquid LQ in the optical path space SPK. May be generated.

  FIG. 26 shows an example of the liquid immersion member 5T according to this embodiment. Since the opening 47T is provided, even if the second member 22T moves while the immersion space LS is formed, the interface LG2 of the liquid LQ between the second member 22T and the substrate P (object) remains. The movement toward the second opening 28T and the movement of at least a part of the interface LG2 below the second opening 28T are suppressed. That is, even if the interface LG2 tries to approach the second opening 28T, the liquid LQ is supplied from the opening 47T to the space between the first member 21T and the substrate P (object) as shown in FIG. As a result, at least a part of the liquid LQ flows into the space SP2 between the second member 22T and the substrate P (object). In other words, the liquid LQ supplied from the opening 47T is supplemented to the space SP2 between the second member 22T and the substrate P (object). Accordingly, the interface LG2 of the liquid LQ is suppressed from approaching the second opening 28T. Accordingly, the generation of bubbles (gas portion) in the liquid LQ in the optical path space SPK is suppressed.

  Next, the cleaning process according to the present embodiment will be described. As shown in FIGS. 27 and 28, in the cleaning process, the liquid LC is supplied from the opening 41T and the opening 47T of the liquid immersion member 5T. In the cleaning process, the liquid LC is recovered from the opening 42T and the opening 43T of the liquid immersion member 5T. In the cleaning process, the second member 22T is moved. In the cleaning process, the liquid LC is supplied from the opening 41 and the opening 47T while the second member 22T is moved. In the cleaning process, the liquid LC is recovered from the opening 42T and the opening 43T while the second member 22T is moved.

  As shown in FIG. 27, the liquid LC is supplied from the opening 47T in a state where the second member 22T faces the opening 47T. In a state where the second member 22T faces the opening 47T, the opening 47T faces the space (space SP1) between the first member 21T and the second member 22T. The liquid LC is supplied from the opening 47T to the space (space SP1) between the first member 21T and the second member 22T.

  As shown in FIG. 28, the liquid LC is supplied from the opening 47T in a state where the second member 22T does not face the opening 47T. In a state where the second member 22T does not face the opening 47T, the opening 47T faces the space between the first member 21T and the substrate DP (object). The liquid LC is supplied from the opening 47T to the space between the first member 21T and the substrate DP (object).

  The liquid LC may be supplied from the opening 47T when the second member 22T faces the opening 47T, and the supply of the liquid LC from the opening 47T may be stopped when the second member 22T does not face the opening 47T. The supply of the liquid LC from the opening 47T may be stopped in a state where the second member 22T faces the opening 47T, and the liquid LC may be supplied from the opening 47T in a state where the second member 22T does not face the opening 47T.

  The liquid LC is supplied from the opening 41T facing the space around the terminal optical element 13 (one or both of the space SP3 and the optical path space SPK), and is supplied from the opening 47T not facing the space around the terminal optical element 13. The liquid LC may be the same type of liquid or a different type of liquid. For example, the liquid LC supplied from the opening 41T may be an exposure liquid (pure water) LQ, and the liquid supplied from the opening 47T may be a liquid such as an alkaline solution. When there is a possibility that the liquid LC supplied from the opening 47T may change the surface state, optical characteristics, etc. of the terminal optical element 13, the exposure liquid LQ is supplied from the opening 41T closer to the terminal optical element 13 than the opening 47T. Thus, contact between the liquid LC and the last optical element 13 can be suppressed.

  Also in the present embodiment, in the cleaning process, the second member 22T and the substrate DP (object) move while the liquid LC immersion space LT is formed between the liquid immersion member 5T and the substrate DP (object). May be. The second member 22T may be moved so that the relative speed (relative acceleration) with respect to the substrate DP (object) becomes small. The second member 22T has a relative speed (relative acceleration) between the second member 22 and the substrate DP (object) smaller than a relative speed (relative acceleration) between the first member 21T and the substrate DP (object). It may be moved.

  In the cleaning process, the liquid LT may be supplied from the opening 47T in a state where the liquid immersion member 5 and the substrate stage 2 (cover member T) face each other. The liquid LC may be supplied from the opening 47T in a state where the opening 47T and the second member 22T do not face each other and the opening 47T and the substrate stage 2 (cover member T) face each other. Thereby, the substrate stage 2 (cover member T) is satisfactorily cleaned with the liquid LC supplied from the opening 47T. When the liquid LC is supplied from the opening 47T in a state where the opening 47T and the second member 22T do not face each other and the opening 47T and the measurement stage 3 face each other, the measurement stage 3 is measured by the liquid LC supplied from the opening 47T. Is well cleaned. In the state where the opening 47T and the second member 22 do not face each other, and the gap between the opening 47T and the substrate DP held by the first holding part and the cover member T held by the second holding part face each other, the opening 47T By supplying the liquid LC from, the inner edge of the cover member T, at least a part of the first holding part, and at least a part of the second holding part are cleaned well.

In the present embodiment, as shown in FIG. 29, the first member 21T may have a recess 16T. The recess 16T is formed on the lower surface 25T of the first member 21T. The second member 22T can face the recess 16T. The second member 22T is movable below the recess 16T. In the example shown in FIG. 29, the opening 47T is disposed inside the recess 16T.
In the cleaning process of the present embodiment, the liquid LC may be supplied from the opening 42T. In this case, since the liquid LC may flow out to the space outside the opening 42T with respect to the optical path K (K2), in the rinsing process after the cleaning process, the outside of the opening 42T with respect to the optical path K (K2). An opening for supplying the liquid LQ to the space may be provided in one or both of the first member 21T and the second member 22T. Alternatively, in the rinsing process, the liquid LQ supplied from the opening 41T is caused to flow from above the gap between the outer surface 27T of the first member 21T and the inner surface 31T of the second member 22T to the upper surface 29T of the second member 22T. It may be recovered from 42T.

  In the above-described first to eighth embodiments, as shown in FIG. 30, an opening 17 for supplying a gas may be disposed in the second member (22 or the like). The opening 17 is disposed outside the opening (43 or the like) with respect to the radial direction with respect to the optical axis AX. In the exposure process for the substrate P, the liquid LQ is recovered from the opening 43. In the exposure processing of the substrate P, gas is supplied from the opening 17 to at least a part of the periphery LG2 of the liquid LQ in the immersion space LS. Thereby, the liquid LQ in the immersion space LS is sealed between the second member 22 and the substrate P (object), and the outflow of the liquid LQ is suppressed. In the cleaning process, gas may be supplied from the opening 17. In the cleaning process, a gas may be supplied from the opening 17 to the interface LH2 of the liquid LC in the immersion space LT. Thereby, the liquid LC in the immersion space LT is sealed between the second member 22 and the substrate DP (object), and the outflow of the liquid LC is suppressed.

  In the cleaning process, the liquid LC may be recovered from the opening 17. In the cleaning process, the liquid LC may be supplied from the opening 43 and the liquid LC may be recovered from the opening 17. In the cleaning process, the liquid LC may be supplied from the opening 41 and the opening 43 and the liquid LC may be recovered from the opening 17. In the cleaning process, the liquid LC may be recovered from the opening 43 and the opening 17. In the cleaning process, the liquid LC may be supplied from the opening 17. In the cleaning process, the liquid LC may be supplied from the opening 43 and the opening 17. In the cleaning process, the liquid LC may be supplied from the opening 17 and the liquid LC may be recovered from the opening 43.

<Ninth Embodiment>
A ninth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 31 is a diagram illustrating an example of the liquid immersion member 5U according to the present embodiment. The liquid immersion member 5U includes a first portion 211U disposed around the optical path K2 of the exposure light EL emitted from the exit surface 12, and a second portion 212U disposed around the terminal optical element 13 (optical path K1). It has the 1st member 21U and the 2nd member 22U arrange | positioned at least one part outside the 1st part 211U with respect to the optical path K of exposure light EL. The first member 21U is an annular member. The second member 22U is an annular member. The first member 21U does not substantially move. The second member 22U is a movable member that can move. The second member 22U is movable with respect to the first member 21U outside the optical path K of the exposure light EL and the first portion 211U.

  The second portion 212U is disposed above the first portion 211U. The first portion 211U includes the lowermost portion of the first member 21U. The first portion 211U includes a portion of the first member 21U that is closest to the surface (upper surface) of the substrate P (object). The first portion 211U is disposed below the emission surface 12. In addition, the concept by which at least one part of the 1st part 211U is arrange | positioned above the injection surface 12 may be sufficient.

  The first member 21U is disposed so as not to contact the terminal optical element 13. A gap is formed between the last optical element 13 and the first member 21U. The second member 22U is disposed so as not to contact the terminal optical element 13 and the first member 21U. A gap is formed between the first member 21U and the second member 22U. The second member 22U moves so as not to contact the terminal optical element 13 and the first member 21U.

  The substrate P (object) can be opposed to at least a part of the last optical element 13 through a gap. The substrate P (object) can face at least a part of the first member 21U through a gap. The substrate P (object) can face at least a part of the second member 22U via a gap. The substrate P (object) is movable below the last optical element 13, the first member 21U, and the second member 22U.

  At least a part of the first member 21U faces the last optical element 13 through a gap. In the present embodiment, the first member 21U faces the outer surface 131 and does not face the exit surface 12. At least a part of the second member 22U is opposed to the first member 21U through a gap. The second member 22U does not face the last optical element 13. The first member 21U is disposed between the second member 22U and the last optical element 13.

  The first member 21U includes a first opening 23U through which the exposure light EL emitted from the emission surface 12 can pass, a lower surface 74 that is disposed around the first opening 23U and faces the -Z direction, and at least a part of the first member 21U. , The inner surface 75 facing the outer surface 131 of the last optical element 13, the outer surface 76 facing the opposite direction of the inner surface 75, the upper surface 77 facing the + Z direction, the lower surface 78 facing the opposite direction of the upper surface 77, and the radiation with respect to the optical axis AX. And an outer surface 79 facing outward with respect to the direction.

  The lower surface 74 is disposed around the first opening 23U. The surface (upper surface) of the substrate P (object) can face the lower surface 74. The lower surface 74 does not face the second member 22U. The first opening 23U and the lower surface 74 are provided in the first portion 211U. At least a part of the inner surface 75 faces the outer surface 131 through a gap. A part (lower part) of the inner surface 75 is disposed around the optical path K2. A part (upper part) of the inner surface 75 is disposed around the last optical element 13 (optical path K1). The first part 211U includes a part (lower part) of the inner surface 75, and the second part 212U includes a part (upper part) of the inner surface 75. At least a part of the outer surface 76 faces the second member 22U via a gap. The first part 211U includes a part (lower part) of the outer surface 76, and the second part 212U includes a part (upper part) of the outer surface 76. The lower surface 74 is disposed so as to connect the lower end of the inner surface 75 and the lower end of the outer surface 76. The inner edge of the lower surface 74 and the lower end of the inner surface 75 are connected. The outer edge of the lower surface 74 and the lower end of the outer surface 76 are connected. The upper surface 77 faces the space CS. The upper surface 77 does not face the second member 22U. The upper surface 77 is connected to the upper end of the inner surface 75. The upper surface 77 is disposed around the upper end of the inner surface 75. The second portion 212U includes an upper surface 77. At least a part of the lower surface 78 faces the second member 22U via a gap. The lower surface 78 is connected to the upper end of the outer surface 76. The lower surface 78 is disposed around the upper end of the upper surface 76. The second portion 212U includes a lower surface 78. The outer surface 79 faces the space CS. The outer surface 79 does not face the second member 22U. The outer surface 79 is disposed so as to connect the outer edge of the upper surface 77 and the outer edge of the lower surface 78. The second portion 212U includes an outer surface 79. The lower surface 74 can hold the liquid LQ with the substrate P (object). The inner surface 75 can hold the liquid LQ with the last optical element 13. The outer surface 76 and the lower surface 78 can hold the liquid LQ with the second member 22U.

  In the following description, a part of the first member 21U having the lower surface 74, the inner surface 75, and the outer surface 76 will be appropriately referred to as a surrounding portion 213U. A part of the first member 21U having the upper surface 77, the lower surface 78, and the outer surface 79 is appropriately referred to as an upper plate portion 214U.

  At least a part of the surrounding portion 213U faces the outer surface 131 of the last optical element 13. The surrounding portion 213U is disposed around the optical path K2 and the terminal optical element 13 (optical path K1). The upper plate portion 214U is disposed above the surrounding portion 213U. The upper plate portion 214U is connected to the upper end of the surrounding portion 213U. The surrounding portion 213U includes a first portion 211U. The surrounding portion 213U includes a part of the second portion 212U. The upper plate portion 214U includes a part of the second portion 212U. The second member 22U is disposed below the upper plate portion 214U (second portion 212U). Note that the surrounding portion 213U may not include the second portion 212U. The upper plate portion 214U may include a first portion 211U.

  The lower surface 74 is disposed below the emission surface 12. The lower surface 74 is substantially parallel to a plane (XY plane) perpendicular to the optical axis AX (Z axis) of the last optical element 13. The inner surface 75 is disposed above the lower surface 74. At least a portion of the inner surface 75 is inclined upward toward the outside with respect to the radial direction with respect to the optical axis AX. The outer surface 76 is disposed above the lower surface 74. At least a portion of the outer surface 76 is inclined upward and outward with respect to the radial direction with respect to the optical axis AX. The outer surface 76 is disposed outside the lower surface 74 in the radial direction with respect to the optical axis AX. The upper surface 77 is disposed above the lower surface 74, the inner surface 75, the outer surface 76, and the lower surface 78. The upper surface 77 is substantially parallel to the XY plane. The lower surface 78 is disposed above the lower surface 74 and the outer surface 76. The lower surface 78 is disposed outside the lower surface 74 and the outer surface 76 with respect to the radial direction with respect to the optical axis AX. The lower surface 78 is substantially parallel to the XY plane.

  The second member 22U is disposed so as to surround at least a part of the first portion 211U and the second portion 212U. Note that the second member 22U is disposed so as to surround the first portion 211U, and may not surround the second portion 212U. The second member 22U is disposed outside the surrounding part 213U. At least a part of the second member 22U is disposed below the upper plate portion 214U. At least a part of the second member 22U is disposed between the upper plate portion 214U and the substrate P (object). The second member 22U is disposed in a space below the upper plate portion 214U and outside the surrounding portion 213U. The second member 22U moves below the upper plate portion 214U and in a space outside the surrounding portion 213U.

  The second member 22U includes a second opening 28U through which the exposure light EL emitted from the emission surface 12 can pass, a lower surface 81 disposed around the second opening 28U and facing the −Z direction, and at least a part of the second member 22U. Has an inner surface 82 facing the outer surface 76 of the first member 21U, an upper surface 83 at least partially facing the + Z direction, and an outer surface 84 facing outward with respect to the radial direction with respect to the optical axis AX.

  In the XY plane, the second opening 28U is larger than the first opening 23U. At least a part of the optical path K and the first member 21U is disposed inside the second opening 28U. The first portion 211U of the first member 21U is disposed inside the second opening 28U.

  In the following description, the opening at one end (lower end) of the gap between the first member 21U and the second member 22U is appropriately referred to as an opening 301. The opening 301 is provided between the first portion 211U and the second member 22U. The opening 301 is disposed between the outer edge of the lower surface 74 and the inner edge of the lower surface 81. One end (opening 301) of the gap between the first member 21U and the second member 22U is disposed so that the surface (upper surface) of the substrate P (object) is opposed. From the opening 301, the liquid LQ on the substrate P (object) can flow into the gap between the first member 21U and the second member 22U.

  The lower surface 81 is disposed around the lower end of the second opening 28U (opening 301). The lower surface 81 is disposed around the lower surface 74. The surface (upper surface) of the substrate P (object) can face the lower surface 81. The opening 301 is disposed between the lower surface 74 and the lower surface 81. At least a part of the inner surface 82 faces the first member 21U through a gap. At least a part of the inner surface 82 faces the outer surface 76 through a gap. At least a part of the inner surface 82 is disposed around the surrounding portion 213U. The inner edge of the lower surface 81 and the lower end of the inner surface 82 are connected. At least a part of the upper surface 83 faces the first member 21U via a gap. The upper surface 83 is connected to the upper end of the inner surface 82. The upper surface 83 is disposed around the upper end of the inner surface 82. The outer surface 84 faces the space CS. The outer surface 84 does not face the first member 21U. The outer surface 84 is disposed so as to connect the outer edge of the upper surface 83 and the outer edge of the lower surface 81. The lower surface 81 can hold the liquid LQ with the substrate P (object). The inner surface 82 and the upper surface 83 can hold the liquid LQ with the first member 21U.

  The lower surface 81 is disposed below the emission surface 12. The lower surface 81 is substantially parallel to a plane (XY plane) perpendicular to the optical axis AX (Z axis) of the last optical element 13. The lower surface 74 and the lower surface 81 are disposed in the same plane (they are flush). The inner surface 82 is disposed above the lower surface 81. At least a part of the inner surface 82 is inclined upward toward the outside with respect to the radiation direction with respect to the optical axis AX. The upper surface 83 is disposed above the lower surface 81 and the outer surface 32. The upper surface 83 is disposed outside the inner surface 82 with respect to the radial direction with respect to the optical axis AX. At least a portion of the upper surface 83 is substantially parallel to the XY plane. The second member 22U has a convex part (wall part) 333.

  In the following description, a space that the exit surface 12 faces is appropriately referred to as an optical path space SPK. The optical path space SPK is at least a part of the space around the terminal optical element 13. The optical path space SPK is a space on the exit surface 12 side. The optical path space SPK is a space between the last optical element 13 and the substrate P (object). The optical path space SPK is a space including an optical path K2 between the exit surface 12 and the upper surface of the substrate P (object). A space that the lower surface 74 faces is appropriately referred to as a space SP6. The space SP6 is a space on the lower surface 74 side. The space SP6 is a space between the first member 21U and the substrate P (object). The space SP6 is a space between the lower surface 74 and the upper surface of the substrate P (object). A space that the lower surface 81 faces is appropriately referred to as a space SP7. The space SP7 is a space on the lower surface 81 side. The space SP7 is a space between the second member 22U and the substrate P (object). The space SP7 is a space between the lower surface 81 and the upper surface of the substrate P (object). A space that the inner surface 75 faces is appropriately referred to as a space SP8. The space SP8 is at least a part of the space around the terminal optical element 13. The space SP8 is a space on the inner surface 75 side. The space SP8 is a space between the first member 21U and the last optical element 13. The space SP8 is a space between the inner surface 75 and the outer surface 131. A space that the inner surface 82 and the upper surface 83 face is appropriately referred to as a space SP9. The space SP9 is a space where the inner surface 82 and the upper surface 83 face. The space SP9 is a space (gap) between the first member 21U and the second member 22U. The space SP9 is a space between the inner surface 82 and the upper surface 83, and the outer surface 76 and the lower surface 78.

  A part of the interface LG of the liquid LQ in the immersion space LS is formed between the second member 22U and the substrate P (object). A part of the interface LG of the liquid LQ in the immersion space LS is formed between the first member 21U and the second member 22U. A part of the interface LG of the liquid LQ in the immersion space LS is formed between the terminal optical element 13 and the first member 21.

  In the following description, the interface LG of the liquid LQ formed between the first member 21U and the second member 22U is appropriately referred to as an interface LG1u. The interface LG formed between the second member 22U and the substrate P (object) is appropriately referred to as an interface LG2u. The interface LG formed between the last optical element 13 and the first member 21U is appropriately referred to as an interface LG3u.

  The liquid immersion member 5U has an opening 41U through which the liquid LQ can flow, an opening 42U through which the liquid LQ can flow, an opening 43U through which the liquid LQ can flow, and a liquid LQ can flow through. Opening 51U through which liquid LQ can flow, opening 53U through which liquid LQ can flow, and opening 17U through which gas can flow. The liquid LQ can also flow through the opening 17U.

  The opening 41U is disposed in the first member 21U. The opening 41U is disposed in the first portion 211U. The opening 41U is disposed at least at a part around the first opening 23U. The opening 41U is disposed so that the substrate P (object) can face the opening 41U. The opening 41U is disposed so as to face the space SP6. The opening 41U is disposed on the lower surface 74. A plurality of openings 41U are arranged so as to surround the optical path K. The opening 41U can supply the liquid LQ for forming the immersion space LS. In the exposure processing of the substrate P, the opening 41U functions as a liquid supply port (liquid supply unit) that supplies the liquid LQ. The opening 41U supplies the liquid LQ to the space SP6.

  The opening 42U is disposed in the second member 22U. The opening 42U is disposed in at least a part of the periphery of the second opening 28U. The opening 42U is disposed so that the substrate P (object) can face the opening 42U. The opening 42U is disposed so as to face the space SP7. The opening 42U is disposed on the lower surface 81. A plurality of openings 42U are arranged so as to surround the optical path K. The opening 42U can supply the liquid LQ. In the exposure processing of the substrate P, the opening 42U functions as a liquid supply port (liquid supply unit) that supplies the liquid LQ. The opening 42U supplies the liquid LQ to the space SP7.

  The opening 43U is disposed in the first member 21U. The opening 43U is disposed in the first portion 211U. The opening 43U is disposed at least at a part around the optical path K2. The opening 43U is disposed so as to face the optical path space SPK. The opening 43U is disposed on the inner surface 75. The opening 43U can supply the liquid LQ for forming the immersion space LS. In the exposure processing of the substrate P, the opening 43U functions as a liquid supply port (liquid supply unit) that supplies the liquid LQ. The opening 43U supplies the liquid LQ to the optical path space SPK. The opening 43U may be disposed in the first member 21U so as to face the space SP8.

  The opening 51U is disposed in the second member 22U. The opening 51U is disposed in at least a part of the periphery of the second opening 28U. The opening 51U is disposed so that the substrate P (object) can face the opening 51U. The opening 51U is disposed so as to face the space SP7. The opening 51U is disposed on the lower surface 81. A plurality of openings 51U are arranged so as to surround the optical path K. The opening 51U can collect the liquid LQ. In the exposure processing of the substrate P, the opening 51U functions as a liquid recovery port (liquid recovery unit) that recovers the liquid LQ. The opening 51U collects the liquid LQ from the space SP7. In the present embodiment, the opening 51U collects (sucks) both the liquid LQ and the gas in the space SP7. The opening 51U can collect the liquid LQ and the gas together. The opening 51U collects and collects gas and liquid.

  The opening 52U is disposed in the first member 21U. The opening 52U is disposed in the second portion 212U. The opening 52U is disposed so as to face the space SP9. The opening 52U is disposed in the lower surface 78. The opening 52U is disposed above the opening 301. The opening 52U can collect the liquid LQ. In the exposure processing of the substrate P, the opening 52U functions as a liquid recovery port (liquid recovery unit) that recovers at least a part of the liquid LQ that has flowed into the space SP9 from above the substrate P (object). The opening 52U collects the liquid LQ from the space SP9.

  The opening 52U includes a hole of the porous member 107. The porous member 107 includes a mesh plate. Only the liquid LQ is substantially recovered through the opening 52U, and the recovery of the gas is limited. Note that both the liquid LQ and the gas may be collected (sucked) through the opening 52U (the hole of the porous member 107). The fluid (one or both of the liquid LQ and the gas) in the space SP9 may be recovered without passing through the porous member.

  The opening 53U is disposed in the first member 21U. The opening 53U is disposed so as to face the space SP8. The opening 53U is disposed on the inner surface 75. The opening 53U is disposed above the first opening 23U and the emission surface 12. The opening 53U can collect the liquid LQ. In the exposure processing of the substrate P, the opening 53U functions as a liquid recovery port (liquid recovery unit) that recovers at least a part of the liquid LQ that has flowed into the space SP8. The opening 53U collects the liquid LQ from the space SP8.

  The opening 53U includes a hole of the porous member 108. The porous member 108 includes a mesh plate. Only the liquid LQ is substantially recovered through the opening 53U, and the recovery of the gas is limited. Note that both the liquid LQ and the gas may be collected (sucked) through the opening 53U (the hole of the porous member 108). The fluid (one or both of the liquid LQ and the gas) in the space SP8 may be recovered without passing through the porous member.

  The opening 17U is disposed in the second member 22U. The opening 17U is disposed in at least a part of the periphery of the second opening 28U. The opening 17U is disposed so that the substrate P (object) can face the opening 17U. The opening 17U is disposed so as to face the space SP7. The opening 17U is disposed on the lower surface 81. A plurality of openings 17U are arranged so as to surround the optical path K. The opening 17U can supply a clean and temperature-adjusted gas. In the exposure processing of the substrate P, the opening 17U functions as a gas supply port (gas supply unit) for supplying gas. The opening 17U supplies gas to the space SP7.

  The opening 41U is disposed closer to the optical path K than the opening 42U. The opening 41U is disposed between the optical path K and the opening 42U with respect to the radiation direction with respect to the optical axis AX (optical path K). The opening 41U is disposed between the center of the first opening 23U and the opening 301 with respect to the radial direction with respect to the center of the first opening 23U.

  The opening 42U is disposed outside the opening 41U in the radial direction with respect to the optical axis AX (optical path K). The opening 42U is disposed between the optical path K and the opening 51U with respect to the radiation direction with respect to the optical axis AX (optical path K). The opening 42U is disposed between the center of the second opening 28U and the opening 51U in the radial direction with respect to the center of the second opening 28U.

  The opening 43U is disposed closer to the optical path K than the opening 42U. The opening 43U is disposed above the opening 41U and the opening 42U. The opening 43U is disposed below the opening 53U. The opening 43U is disposed closer to the optical path K than the opening 53U.

  The opening 51U is disposed outside the opening 42U with respect to the radial direction with respect to the optical axis AX (optical path K). The opening 51U is disposed below the opening 43U. The opening 52U is disposed outside the opening 41U and the opening 301 with respect to the radial direction with respect to the optical axis AX (optical path K). The opening 52U is disposed above the opening 301. The opening 52U is disposed above the opening 41U and the opening 42U. The opening 52U is disposed above the opening 301. The opening 53U is disposed above the opening 41U, the opening 42U, the opening 43U, the opening 51U, and the opening 17U. The opening 17U is disposed outside the opening 41U, the opening 42U, and the opening 51U in the radial direction with respect to the optical axis AX (optical path K).

  The space SP8 communicates with the space CS outside the liquid immersion member 5U through an opening 85 different from the first opening 23U. The space SP8 is opened to the space CS (atmosphere around the liquid immersion member 5U) through the opening 85. The opening 85 is disposed at a position higher than the first opening 23U. The space SP9 communicates with a space CS outside the liquid immersion member 5U through an opening 302 different from the opening 301. The space SP9 is opened to the space CS (atmosphere around the liquid immersion member 5U) through the opening 302. The opening 302 is disposed at a position higher than the opening 301. The space SP7 communicates with the space CS outside the liquid immersion member 5U through the opening 86. The space SP7 is opened to the space CS (atmosphere around the liquid immersion member 5U) through the opening 86.

  The space SP6 and the space SP9 are connected via the opening 301. The space SP7 and the space SP9 are connected via the opening 301. The space SP6 and the optical path space SPK are connected via the first opening 23U. The optical path space SPK and the space SP8 are connected via an opening 87 between the exit surface 12 and the inner surface 75. The fluid (one or both of the liquid LQ and the gas G) can flow between the space SP6 and the space SP9, can flow (move) between the space SP7 and the space SP9, and the space SP6 and the space SP7. Can be distributed (moved) between the optical path space SP6 and the space SPK, can be distributed (moved) between the optical path space SP8 and the space SPK, and the space SP6. And the space SP8 can be distributed (moved).

  In the exposure process of the substrate P, the liquid LQ is collected from the opening 51U in parallel with the supply of the liquid LQ from at least one of the opening 41U, the opening 42U, and the opening 43U, so that the terminal optical on one side is performed. An immersion space LS for the liquid LQ is formed between the element 13 and the liquid immersion member 5U and the substrate P (object) on the other side.

  When the liquid LQ is supplied from the opening 41U, the opening 51U can collect at least a part of the liquid LQ from the opening 41U. When the liquid LQ is supplied from the opening 42U, the opening 51U can collect at least a part of the liquid LQ from the opening 42U. When the supply operation of the liquid LQ from the opening 43U is performed, the opening 51U can collect at least a part of the liquid LQ from the opening 43U. By collecting the liquid LQ from the opening 51U, the interface LG (interface LG2u) of the liquid LQ in the immersion space LS is maintained inside the opening 51U in the radiation direction with respect to the optical axis AX (optical path K). The The interface LG2u is maintained inside at least the outer end of the opening 51U. In parallel with the supply of the liquid LQ from the opening 42U, the recovery of the liquid LQ from the opening 51U is performed, so that the interface LG (interface LG2u) of the liquid LQ in the immersion space LS has an optical axis AX (optical path K). Is maintained between the opening 42U and the opening 51U. The interface LG2u is maintained at least between the opening 42U and the outer end of the opening 51U. In parallel with the supply of the liquid LQ from the opening 42U, the recovery of the liquid LQ from the opening 51U causes the second member 22U to move in the XY plane while the immersion space LS is formed. However, the interface LG2u is maintained between the opening 42U and the opening 51U.

  In parallel with the supply of at least one liquid LQ from the opening 41U, the opening 42U, and the opening 43U and the recovery of the liquid LQ from the opening 51U, the recovery of the liquid LQ from the opening 52U may be performed. Thereby, the liquid LQ that has flowed into the space SP9 through the opening 301 is suppressed from flowing out of the space SP9.

  In parallel with the supply of at least one liquid LQ from the opening 41U, the opening 42U, and the opening 43U and the recovery of the liquid LQ from the opening 51U, the liquid LQ from the opening 53U may be recovered. Thereby, the liquid LQ that has flowed into the space SP8 is suppressed from flowing out of the space SP8.

  In the present embodiment, the gas is supplied from the opening 17U in parallel with the supply of at least one liquid LQ from the opening 41U, the opening 42U, and the opening 43U and the recovery of the liquid LQ from the opening 51U. In the exposure processing of the substrate P, the opening 17U supplies gas outside the immersion space LS. A gas seal is formed outside the immersion space LS by the gas supplied from the opening 17U. Thereby, the liquid LQ in the space SP7 is suppressed from flowing out of the space SP7.

  Similar to the above-described embodiments, in the exposure processing of the substrate P, the second member 22U moves in the XY plane. As in the above-described embodiments, in the exposure processing of the substrate P, the second member 22U may be moved so that the relative speed (relative acceleration) with the substrate P (object) becomes small. In the exposure processing of the substrate P, the second member 22U has a relative speed (relative acceleration) between the second member 22U and the substrate P (object), and a relative speed (relative acceleration) between the first member 21U and the substrate P (object). ) May be moved to be smaller than. In the exposure process of the substrate P, the liquid LQ is supplied from the opening 42U while the second member 22U moves. While the second member 22U moves, the fluid (one or both of the liquid LQ and the gas) is collected from the opening 51U. Gas is supplied from the opening 17U while the second member 22U moves.

  In the cleaning process, the cleaning liquid LC is supplied from at least one of the opening 41U, the opening 42U, and the opening 43U in a state where the liquid immersion member 5U and the substrate DP (object) face each other. The liquid LC is recovered from at least one of the opening 51U, the opening 52U, and the opening 53U. In the cleaning process, the liquid LC from at least one of the opening 51U, the opening 52U, and the opening 53U is collected in parallel with the supply of the liquid LC from at least one of the opening 41U, the opening 42U, and the opening 43U. Thus, an immersion space LT for the liquid LC is formed between the liquid immersion member 5U and the substrate DP (object).

  In the cleaning process, the liquid LC is supplied from each of the opening 41U, the opening 42U, and the opening 43U. The liquid LC is supplied from the opening 41U to the space SP6 between the first member 21U and the substrate DP (object). The liquid LC is supplied from the opening 42U to the space SP7 between the second member 22U and the substrate DP (object). The liquid LC is supplied from the opening 43U to the space around the last optical element 13 (one or both of the space SP8 and the optical path space SPK).

  In the cleaning process, the liquid LC supplied from the opening 41U, the liquid LC supplied from the opening 42U, and the liquid LC supplied from the opening 43U may be the same type of liquid or different types of liquid. For example, the liquid LC supplied to the space SP6 from the opening 41U and the liquid LC supplied to the space SP7 from the opening 42U arranged outside the opening 41U in the radial direction with respect to the optical axis AX may be different types of liquid. . For example, the liquid (exposure liquid) LQ may be supplied from the opening 41U, and an alkaline solution or the like may be supplied from the opening 42U. Further, the liquid LC supplied from the opening 43U to the space SP8 and the liquid LC supplied to the space SP7 from the opening 42U disposed outside the opening 43U in the radial direction with respect to the optical axis AX may be different types of liquid. . For example, the liquid (exposure liquid) LQ may be supplied from the opening 43U, and an alkaline solution or the like may be supplied from the opening 42U. The liquid (exposure liquid) LQ is supplied from one or both of the opening 41U and the opening 43U closer to the terminal optical element 13 than the opening 42U, so that the space around the terminal optical element 13 is filled with the liquid LQ. Thereby, it is suppressed that liquid LC, such as an alkaline solution supplied from the opening 42U, contacts the last optical element 13. The cleaning process is favorably performed by the liquid LC supplied from the opening 42U. When the liquid LC that does not affect the last optical element 13 is used, the liquid LC may be supplied from one or both of the opening 41U and the opening 43U.

  As in the above-described embodiments, in the cleaning process, the second member 22U may be moved in the XY plane in a state where the liquid LC immersion space LT is formed. The substrate DP (object) may be moved in a state where the liquid LC immersion space LT is formed between the liquid immersion member 5U and the substrate DP (object).

  Similar to the above-described embodiments, in the cleaning process, the second member 22U may be moved so that the relative speed (relative acceleration) with respect to the substrate DP (object) becomes small. In the cleaning process, the second member 22U has a relative speed (relative acceleration) between the second member 22U and the substrate DP (object) higher than a relative speed (relative acceleration) between the first member 21U and the substrate DP (object). You may move so that it may become small. The substrate DP (object) may be moved along the paths Tp1 to Tp5 as described with reference to FIG. When the substrate DP (object) is moved along the paths Tp1 to Tp5 shown in FIG. 9, the control device 6 defines a virtual shot area (virtual shot area) on the substrate DP (object), and the virtual shot area Based on the routes Tp1 to Tp5, the substrate DP (object) may be moved along the routes Tp1 to Tp5. The second member 22U may be moved under the movement condition described with reference to FIGS. Thereby, the outflow of the liquid LC from the space between the liquid immersion member 5U and the substrate DP (object) is suppressed.

  In the present embodiment, in the cleaning process, the liquid LC is supplied from the opening 42U while the second member 22U moves. While the second member 22U moves, the fluid (one or both of the liquid LC and the gas) is recovered from the opening 51U. Gas is supplied from the opening 17U while the second member 22U moves. The gas may be supplied from the opening 17U in parallel with at least a part of the supply of the liquid LC from the opening 42U or the like. In the cleaning process, the gas is supplied from the opening 17U to at least part of the periphery of the liquid LC immersion space LT formed on the substrate DP (object), whereby the liquid immersion member 5U, the substrate DP (object), and The liquid LC can be contained in the space between the two.

  In the cleaning process, the liquid LC may be supplied from the opening 51U to the space SP7. In the cleaning process, the liquid LC is supplied or recovered from at least one of the opening 41U, the opening 42U, the opening 43U, the opening 52U, the opening 53U, and the opening 17U, and the liquid LC may be supplied from the opening 51U. . The liquid LC may be supplied from each of the opening 51U, the opening 52U, and the opening 53U.

  In the cleaning process, the liquid LC may be recovered from the opening 17U. In the cleaning process, the liquid LC may be supplied from at least one of the opening 41U, the opening 42U, the opening 43U, the opening 51U, the opening 52U, and the opening 53U, and the liquid LC may be recovered from the opening 17U.

  In the cleaning process, the liquid LC may be supplied from the opening 17U to the space SP7. The liquid LC may be supplied or recovered from at least one of the opening 41U, the opening 42U, the opening 43U, the opening 51U, the opening 52U, and the opening 53U, and the liquid LC may be supplied from the opening 17U. The supply of the liquid LC from at least one of the opening 41U, the opening 42U, and the opening 43U and the supply of the liquid LC from the opening 17U may be performed. The supply of the liquid LC from at least one of the opening 51U, the opening 52U, and the opening 53U and the supply of the liquid LC from the opening 17U may be performed.

  In the cleaning process, the liquid LC may be recovered from the opening 41U. The opening 41U may collect the liquid LC from the space SP6. The liquid LC may be recovered from the opening 42U. The opening 42U may collect the liquid LC from the space SP7. The liquid LC may be recovered from the opening 43U. The opening 43U may collect the liquid LC from the space around the last optical element 13 (one or both of the space SP8 and the optical path space SPK).

  In the cleaning process, when the liquid LC is recovered from the opening 42U, the interface of the liquid LC is disposed between the opening 42U and the substrate DP (object) in the space SP7. In the cleaning process, the liquid LC may be collected from the opening 42U and gas may be supplied from the opening 51U. Thereby, the liquid LC can be sealed with the gas from the opening 51U.

  Similarly to the cleaning process, in the rinsing process, a rinsing liquid is supplied from at least one of the opening 41U, the opening 42U, the opening 43U, the opening 51U, the opening 52U, the opening 53U, and the opening 17U, and the rinsing is performed from another opening. The liquid for use may be recovered. The rinsing liquid is supplied from at least one of the opening 41U, the opening 42U, the opening 43U, the opening 51U, the opening 52U, the opening 53U, and the opening 17U, and the rinsing liquid is collected from another opening, and another opening. You may supply gas from.

  That is, in one or both of the cleaning process and the rinsing process, liquid (cleaning liquid, rinsing liquid) is supplied from a part of the openings 41U, 42U, 43U, 51U, 52U, 53U, and 17U. Alternatively, the liquid may be collected from some openings and the gas may be supplied from some openings. The opening for collecting the liquid may be disposed outside or inside the opening for supplying the liquid with respect to the radiation direction with respect to the optical axis AX (optical path K). The opening for supplying the gas may be arranged outside or inside the opening for collecting the liquid with respect to the radial direction with respect to the optical axis AX (optical path K).

  As described above, also in this embodiment, the cleaning process can be performed satisfactorily. Therefore, the occurrence of defective exposure and the occurrence of defective devices are suppressed.

  In the first to ninth embodiments described above, as shown in FIG. 32, an immersion space LS2 different from the immersion space LS can be formed in at least a part of the periphery of the immersion member (such as 5). A liquid immersion member 80 may be disposed. The liquid immersion member 80 has an opening (liquid supply port) 81 for supplying a liquid for forming the liquid immersion space LS2, and an opening (liquid recovery port) 82 for recovering the liquid. In the exposure processing of the substrate P, the liquid LQ that has flowed out of the space between the liquid immersion member (5, etc.) and the substrate P (object) is captured by the liquid immersion space LS2. Similarly, in the cleaning process, the liquid LC that has flowed out of the space between the liquid immersion member (such as 5) and the substrate DP (object) is captured by the liquid immersion space LS2. In the cleaning process, the immersion space LS2 may not be formed. The liquid LC that has flowed out of the space between the liquid immersion member (such as 5) and the substrate DP (object) may be collected from the opening 82 of the liquid immersion member 80.

  As shown in FIG. 32, an ultrasonic vibration device (vibrator) 90 that generates ultrasonic waves may be disposed on one or both of the liquid immersion member (5, etc.) and the object. In the cleaning process, by applying ultrasonic waves to the liquid LC, the cleaning process is performed satisfactorily. In the rinsing process, ultrasonic waves may be applied to the rinsing liquid.

  In each of the above-described embodiments, the immersion member (such as 5) may be irradiated with ultraviolet light in the cleaning process. The liquid immersion member (5, etc.) may be optically cleaned by irradiating the liquid immersion member (5, etc.) with ultraviolet light.

  In each of the above-described embodiments, the maintenance process may be performed at regular time intervals (periodically). Whether or not to perform maintenance processing may be determined based on the result of the exposure processing of the substrate P. When the liquid immersion member (such as 5) is contaminated, there is a possibility that a defect is generated in the pattern formed on the substrate P. Therefore, the pattern formed on the substrate P is inspected, and when it is determined that the pattern has a defect, a maintenance process may be performed. In the exposure processing of the substrate P, whether to perform the maintenance processing may be determined based on the state (quality) of the liquid LQ recovered from the liquid recovery port of the liquid immersion member (5, etc.). When the liquid immersion member (such as 5) is contaminated, the liquid LQ recovered from the liquid recovery port may also be contaminated. Therefore, the liquid LQ recovered from the liquid recovery port is inspected, and when it is determined that the liquid LQ is contaminated, a maintenance process may be performed.

  In each of the above-described embodiments, the first member (21, etc.) is provided with a suction port for sucking at least one of the liquid LQ and gas from the space between the first member (21, etc.) and the last optical element 13. Also good.

  In each of the above-described embodiments, the first member (21 or the like) may not be annular. For example, the first member (21 or the like) may be disposed at a part of the periphery of the optical path K. A plurality of first members (such as 21) may be arranged around the optical path K. In each of the above-described embodiments, the second member (22 or the like) may not be annular. For example, the second member (22 or the like) may be disposed at a part of the periphery of the optical path K. A plurality of second members (22 and the like) may be arranged around the optical path K.

  In each of the above-described embodiments, the control device 6 includes a computer system including a CPU and the like. The control device 6 includes an interface capable of executing communication between the computer system and an external device. The storage device 7 includes a memory such as a RAM, and a recording medium such as a hard disk and a CD-ROM. The storage device 7 is installed with an operating system (OS) that controls the computer system, and stores a program for controlling the exposure apparatus EX.

  Note that an input device capable of inputting an input signal may be connected to the control device 6. The input device includes an input device such as a keyboard and a mouse, or a communication device that can input data from an external device. Further, a display device such as a liquid crystal display may be provided.

  Various information including programs recorded in the storage device 7 can be read by the control device (computer system) 6. In the storage device 7, liquid immersion exposure is performed in which the control device 6 exposes the substrate with the exposure light through the liquid filled in the optical path of the exposure light between the exit surface of the optical member from which the exposure light is emitted and the substrate. A program for executing control of the apparatus is recorded.

  According to the above-described embodiment, the program recorded in the storage device 7 causes the control device 6 to move the first member disposed at least in the periphery of the optical path of the exposure light and an object that can be moved below the optical member. Is formed on the substrate by using an immersion member including a second member movable outside the optical path of the exposure light and movable relative to the first member. And exposing the substrate with exposure light emitted from the exit surface through the exposure liquid in the immersion space, and moving the second member relative to the first member in at least part of the exposure of the substrate; In the cleaning process performed in a different period from the exposure process in which the substrate is exposed, the liquid may be supplied from the first opening provided in the liquid immersion member.

  When the program stored in the storage device 7 is read into the control device 6, various devices of the exposure apparatus EX such as the substrate stage 2, the measurement stage 3, and the liquid immersion member 5 cooperate to form a liquid immersion space. Various processes such as an exposure process and a maintenance process for the substrate P are performed in a state where the LS is formed.

  In each of the above-described embodiments, for example, as disclosed in International Publication No. 2004/019128, the optical path K2 on the exit surface 12 side (image surface side) of the terminal optical element 13 of the projection optical system PL is a liquid LQ. The optical path on the incident side (object plane side) of the last optical element 13 may be filled with the liquid LQ.

  In each of the above embodiments, the liquid (exposure liquid) LQ may be a liquid different from water (pure water). It is transparent to the exposure light EL, has a high refractive index with respect to the exposure light EL, and is stable to a film such as a photosensitive material (photoresist) that forms the surface of the projection optical system PL or the substrate P. Liquid LQ may be used. The liquid LQ may be a fluorinated liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), and fomblin oil. The liquid LQ may be a supercritical fluid.

  In each of the above-described embodiments, the substrate P may include a semiconductor wafer for manufacturing a semiconductor device, a glass substrate for a display device, or a ceramic wafer for a thin film magnetic head. A mask (reticle) master (synthetic quartz, silicon wafer) used in the exposure apparatus may be included.

  In each of the above-described embodiments, the exposure apparatus EX is a step-and-scan type scanning exposure apparatus (scanning stepper) that exposes the pattern of the mask M by moving the mask M and the substrate P synchronously. It was. The exposure apparatus EX may be a step-and-repeat projection exposure apparatus (stepper) that collectively exposes the pattern of the mask M while the mask M and the substrate P are stationary, and sequentially moves the substrate P stepwise.

  After the exposure apparatus EX transfers the reduced image of the first pattern onto the substrate P using the projection optical system with the first pattern and the substrate P substantially stationary in the step-and-repeat exposure, An exposure apparatus (stitch-type batch) that performs batch exposure on the substrate P by partially overlapping the first pattern with the projection optical system while the second pattern and the substrate P are substantially stationary. Exposure apparatus). The stitch type exposure apparatus may be a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred onto the substrate P, and the substrate P is sequentially moved.

  The exposure apparatus EX combines two mask patterns on a substrate via a projection optical system as disclosed in, for example, US Pat. No. 6,611,316, and one shot on the substrate by one scanning exposure. An exposure apparatus that double-exposes the region almost simultaneously may be used. Further, the exposure apparatus EX may be a proximity type exposure apparatus, a mirror projection aligner, or the like.

  In each of the above-described embodiments, the exposure apparatus EX is a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It may be a device. As shown in FIG. 33, when the exposure apparatus EX includes two substrate stages 2001 and 2002, an object that can be arranged to face the emission surface 12 is one substrate stage, the first of the one substrate stage. It includes at least one of the substrate held by one holding unit, the other substrate stage, and the substrate held by the first holding unit of the other substrate stage. The exposure apparatus EX may be an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The exposure apparatus EX may be an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, or a reticle or mask may be used.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. Instead of a light transmission type mask, a variable shaping mask (electronic mask, which forms a transmission pattern or a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed, as disclosed in US Pat. No. 6,778,257. An active mask or an image generator may also be used. Instead of a variable molding mask provided with a non-light-emitting image display element, a pattern forming apparatus including a self-light-emitting image display element may be provided.

  In each of the above-described embodiments, the exposure apparatus EX includes the projection optical system PL. The components described in the above embodiments may be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an exposure apparatus and an exposure method for forming an immersion space between an optical member such as a lens and a substrate and irradiating the substrate with exposure light via the optical member are described in the above embodiments. Elements may be applied.

  The exposure apparatus EX exposes a line-and-space pattern on the substrate P by forming interference fringes on the substrate P as disclosed in, for example, WO 2001/035168 (lithography). System).

  The above-described exposure apparatus EX is manufactured by assembling various subsystems including the above-described components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Prior to the assembly process from the various subsystems to the exposure apparatus, there is an assembly process for each subsystem. After the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus may be manufactured in a clean room in which temperature, cleanliness, etc. are controlled.

  As shown in FIG. 34, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to each of the above-described embodiments. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like. Maintenance processing including cleaning processing is included in the substrate processing step.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Measurement stage, 5 ... Liquid immersion member, 6 ... Control apparatus, 7 ... Memory | storage device, 12 ... Ejection surface, 13 ... Terminal optical element, 21 ... 1st member, 22 ... 2nd member, 41 ... Opening, 42 ... Opening, 43 ... Opening, AX ... Optical axis, EL ... Exposure light, EX ... Exposure device, IL ... Lighting system, K ... Optical path, LC ... Liquid, LQ ... Liquid, LS ... Immersion space, LT ... Immersion space, P ... Substrate.

Claims (68)

An exposure apparatus maintenance method for exposing the substrate with exposure light via an exposure liquid between an emission surface of the optical member and the substrate,
The exposure apparatus includes an immersion member that forms an immersion space for the exposure liquid on an object that is movable below the optical member,
The liquid immersion member is
A first member disposed on at least a part of the periphery of the optical path of the exposure light;
A second member that can be opposed to the object and is movable with respect to the first member outside the optical path of the exposure light;
A first opening,
A maintenance method for supplying a liquid from the first opening in a cleaning process performed in a different period from an exposure process in which the substrate is exposed.   The maintenance method according to claim 1, wherein at least a part of the liquid immersion member is cleaned.   The maintenance method according to claim 1, wherein the period during which the cleaning process is performed is one or both of the period before and after the period during which the exposure process is performed.   The liquid is supplied from the first opening in a state where the liquid immersion member and the object face each other to form an immersion space for the liquid between the liquid immersion member and the object. The maintenance method as described in any one of -3.   The maintenance method according to claim 4, wherein the liquid interface of the immersion space is formed between the second member and the object.   The maintenance method according to claim 4, further comprising moving the second member in a state in which the liquid immersion space is formed.   The maintenance method according to claim 1, further comprising moving the second member in at least a part of a period in which the liquid is supplied from the first opening.   The maintenance method according to claim 6 or 7, wherein the second member is moved in a predetermined plane substantially perpendicular to the optical axis of the optical member.   The maintenance method according to claim 1, further comprising moving the object in a state where an immersion space for the liquid is formed between the liquid immersion member and the object.   The maintenance method according to any one of claims 1 to 9, wherein the second member is moved so that a relative speed with the object is reduced.   The said 2nd member is moved so that the relative speed of the said 2nd member and the said object may become smaller than the relative speed of the said 1st member and the said object. The maintenance method described.   The maintenance method according to any one of claims 1 to 11, wherein the second member is moved so that a relative acceleration with the object is reduced.   The said 2nd member is moved so that the relative acceleration of the said 2nd member and the said object may become smaller than the relative acceleration of the said 1st member and the said object. The maintenance method described.   At least a part of the liquid from the first opening is a space between the first member and the second member, a space between the first member and the object, and the second member and the object. The maintenance method according to claim 1, wherein the maintenance method is supplied to at least one of a space between the optical member and a space around the optical member.   The first opening includes a space between the first member and the second member, a space between the first member and the object, a space between the second member and the object, and the optical. The maintenance method as described in any one of Claims 1-13 arrange | positioned so that at least one of the space around a member may be faced. The first opening is disposed in the first member;
The maintenance method according to any one of claims 1 to 15, wherein the second member moves so as to change from one of a first state opposed to the first opening and a second state not opposed to the other. The first member has a first lower surface disposed around the optical path of the exposure light,
The maintenance method according to claim 16, wherein the first opening is disposed on the first lower surface.   The maintenance method according to claim 16 or 17, wherein liquid is supplied from the first opening in one or both of the first state and the second state.   The maintenance method according to any one of claims 1 to 15, wherein the first opening is disposed so that the object can be opposed to a first portion of a first member disposed around an optical path of the exposure light.   The maintenance method according to any one of claims 1 to 15, wherein the first opening is disposed in the first member so as to face a space around the optical member. The first opening is disposed in the second member;
The maintenance method according to claim 1, wherein the liquid is supplied from the first opening while the second member moves.   The maintenance method according to any one of claims 1 to 21, wherein, in the exposure process, the exposure liquid is supplied from the first opening.   The maintenance method according to any one of claims 1 to 21, wherein in the exposure process, the exposure liquid is recovered from the first opening.   The maintenance method according to claim 1, wherein in the exposure process, gas is supplied from the first opening. At least two of the first openings are arranged,
The maintenance method according to any one of claims 1 to 15, wherein in the maintenance process, the first liquid is supplied from one first opening and the second liquid is supplied from another first opening.   26. The maintenance method according to claim 25, wherein the other first opening is disposed outside the first opening with respect to a radial direction with respect to an optical axis of the optical member. The one first opening is disposed in the first member,
27. The maintenance method according to claim 25 or 26, wherein the other first opening is arranged in the second member. The first liquid is supplied from the first opening to the space between the first member and the object,
The maintenance method according to any one of claims 25 to 27, wherein the second liquid is supplied from the other first opening to a space between the second member and the object. The first liquid is supplied from the first opening to the space around the optical member,
The maintenance method according to any one of claims 25 to 27, wherein the second liquid is supplied from the other first opening to a space between the liquid immersion member and the object.   The maintenance method according to any one of claims 25 to 29, wherein the first liquid includes an exposure liquid.   The maintenance method according to any one of claims 25 to 30, wherein the second liquid is different from the first liquid.   32. The maintenance method according to claim 25, wherein, in the exposure process, the exposure liquid is supplied from the one first opening, and the exposure liquid is supplied from the other first opening.   32. The maintenance method according to claim 25, wherein, in the exposure process, the exposure liquid is supplied from the one first opening, and the exposure liquid is collected from the other first opening.   32. The maintenance method according to claim 25, wherein, in the exposure process, the exposure liquid is collected from the one first opening, and the exposure liquid is collected from the other first opening.   32. The maintenance method according to claim 25, wherein, in the exposure process, the exposure liquid is supplied from the one first opening, and a gas is supplied from the other first opening.   32. The maintenance method according to claim 25, wherein, in the exposure process, the exposure liquid is collected from the first opening and gas is supplied from the other first opening. The liquid immersion member includes a second opening,
The maintenance method according to any one of claims 1 to 36, wherein at least a part of the liquid supplied from the first opening is recovered from the second opening.   The maintenance method according to claim 37, wherein the liquid recovery from the second opening is performed in parallel with at least a part of the liquid supply from the first opening.   From the second opening, a space between the first member and the second member, a space between the first member and the object, a space between the second member and the object, and the optical The maintenance method according to claim 37 or 38, wherein at least one liquid in a space around the member is recovered.   The second opening includes a space between the first member and the second member, a space between the first member and the object, a space between the second member and the object, and the optical. The maintenance method according to claim 37 or 38, wherein the maintenance method is arranged so as to face at least one of the spaces around the member.   41. The maintenance method according to any one of claims 37 to 40, wherein the second opening is disposed outside the first opening with respect to a radial direction with respect to an optical axis of the optical member.   The maintenance method according to any one of claims 37 to 41, wherein the second opening is disposed below the first opening.   43. The maintenance method according to any one of claims 37 to 42, wherein the second opening is disposed in the second member so that the object is opposed to the second opening. The second opening is disposed in the second member;
44. The maintenance method according to any one of claims 37 to 43, wherein the liquid is recovered from the second opening while the second member moves.   45. The maintenance method according to any one of claims 37 to 44, wherein in the exposure process, the exposure liquid is supplied from the second opening.   45. The maintenance method according to any one of claims 37 to 44, wherein the exposure liquid is recovered from the second opening in the exposure process.   The maintenance method according to any one of claims 37 to 44, wherein in the exposure process, gas is supplied from the second opening.   45. The maintenance method according to any one of claims 37 to 44, wherein, in the exposure process, the exposure liquid is supplied from the first opening and the exposure liquid is recovered from the second opening. The liquid immersion member includes a third opening,
49. The maintenance method according to any one of claims 1 to 48, wherein in the cleaning process, gas is supplied from the third opening.   50. The maintenance method according to claim 49, wherein gas supply from the third opening is performed in parallel with at least part of the liquid supply from the first opening.   The maintenance method according to claim 49 or 50, wherein in the cleaning process, gas is supplied from the third opening to at least a part of the periphery of the liquid immersion space formed on the object.   52. The maintenance method according to any one of claims 49 to 51, wherein the third opening is disposed outside the first opening with respect to a radial direction with respect to an optical axis of the optical member.   53. The maintenance method according to any one of claims 49 to 52, wherein the third opening is disposed in the second member so that the object faces the object. The third opening is disposed in the second member;
The maintenance method according to any one of claims 49 to 53, wherein gas is supplied from the third opening while the second member moves.   The maintenance method according to any one of claims 49 to 54, wherein the exposure liquid is recovered from the third opening in the exposure process.   56. The maintenance method according to any one of claims 49 to 55, wherein in the exposure process, gas is supplied from the third opening.   56. The maintenance method according to any one of claims 49 to 55, wherein, in the exposure process, the exposure liquid is supplied from the first opening and a gas is supplied from the third opening.   58. The maintenance method according to any one of claims 1 to 57, wherein the liquid supplied from the first opening is the exposure liquid.   59. The maintenance method according to claim 1, wherein the liquid supplied from the first opening is different from the exposure liquid.   60. The maintenance method according to claim 59, further comprising supplying a rinsing liquid and removing the liquid after cleaning using the liquid from the first opening.   The maintenance method according to claim 60, wherein the rinsing liquid is the exposure liquid.   The maintenance method according to claim 60 or 61, wherein the rinsing liquid is supplied from the first opening.   The maintenance method according to any one of claims 1 to 62, wherein at least a part of the second member is disposed below the first member.   64. The maintenance method according to claim 1, wherein at least a part of the second member is disposed outside the first member with respect to the optical path of the exposure light.   The maintenance method according to any one of claims 1 to 64, wherein the cleaning includes applying an ultrasonic wave to the liquid. Maintenance with the maintenance method according to any one of claims 1 to 65;
Exposing the substrate using a maintained exposure apparatus;
Developing the exposed substrate. A device manufacturing method. A program that causes a computer to execute control of an exposure apparatus that exposes the substrate with exposure light via an exposure liquid between an emission surface of the optical member and the substrate,
A first member arranged at least part of the periphery of the optical path of the exposure light can be opposed to an object movable below the optical member, and the first member is disposed outside the optical path of the exposure light. Forming an immersion space for the exposure liquid on the substrate using an immersion member comprising a second member movable relative to the substrate;
Exposing the substrate with the exposure light emitted from the exit surface through the exposure liquid in the immersion space;
Moving the second member relative to the first member in at least a portion of the exposure of the substrate;
A program for executing supply of a liquid from a first opening provided in the liquid immersion member in a cleaning process performed in a different period from an exposure process in which the substrate is exposed.   A computer-readable recording medium on which the program according to claim 67 is recorded.

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