JP2014168001A5 - Substrate processing method, program, and computer storage medium - Google Patents

Substrate processing method, program, and computer storage medium Download PDF

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Publication number
JP2014168001A5
JP2014168001A5 JP2013039666A JP2013039666A JP2014168001A5 JP 2014168001 A5 JP2014168001 A5 JP 2014168001A5 JP 2013039666 A JP2013039666 A JP 2013039666A JP 2013039666 A JP2013039666 A JP 2013039666A JP 2014168001 A5 JP2014168001 A5 JP 2014168001A5
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program
storage medium
processing method
substrate processing
computer storage
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JP2013039666A
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JP5837525B2 (en
JP2014168001A (en
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Priority to TW103105856A priority patent/TW201503230A/en
Priority to PCT/JP2014/054686 priority patent/WO2014133004A1/en
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次いでウェハＷは、ウェハ搬送装置７０によって洗浄装置３１に搬送され、有機溶剤で洗浄されることで有機溶剤に可溶な第１のポリマー４００が、図１９に示すように、第２のポリマー４０１の上面から選択的に除去される（図１３の工程Ｓ６）。なお、この際、反射防止膜４１０の上面に配列した第１のポリマー４００はそのまま残る。 Then, the wafer W is transferred to the cleaning apparatus 31 by the wafer transfer apparatus 70, the first polymer 400 is soluble in an organic solvent by being washed with an organic solvent, as shown in FIG. 19, the second polymer 401 Is selectively removed from the upper surface (step S6 in FIG. 13). At this time, the first polymer 400 arranged on the upper surface of the antireflection film 410 remains as it is.

JP2013039666A 2013-02-28 2013-02-28 Substrate processing method, program, and computer storage medium Active JP5837525B2 (en)

Priority Applications (3)

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JP2013039666A JP5837525B2 (en) 2013-02-28 2013-02-28 Substrate processing method, program, and computer storage medium
TW103105856A TW201503230A (en) 2013-02-28 2014-02-21 Substrate processing method and computer storage medium
PCT/JP2014/054686 WO2014133004A1 (en) 2013-02-28 2014-02-26 Substrate processing method and computer storage medium

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JP2013039666A JP5837525B2 (en) 2013-02-28 2013-02-28 Substrate processing method, program, and computer storage medium

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JP2014168001A JP2014168001A (en) 2014-09-11
JP2014168001A5 true JP2014168001A5 (en) 2015-03-19
JP5837525B2 JP5837525B2 (en) 2015-12-24

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TW (1) TW201503230A (en)
WO (1) WO2014133004A1 (en)

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Publication number Priority date Publication date Assignee Title
US9396958B2 (en) * 2014-10-14 2016-07-19 Tokyo Electron Limited Self-aligned patterning using directed self-assembly of block copolymers
JP2017157632A (en) 2016-02-29 2017-09-07 東芝メモリ株式会社 Method of manufacturing semiconductor device, and pattern formation method

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* Cited by examiner, † Cited by third party
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JP4673266B2 (en) * 2006-08-03 2011-04-20 日本電信電話株式会社 Pattern forming method and mold
JP2012004434A (en) * 2010-06-18 2012-01-05 Toshiba Corp Patterning method and patterning apparatus
JP5171909B2 (en) * 2010-09-16 2013-03-27 株式会社東芝 Method for forming fine pattern
JP2012109322A (en) * 2010-11-15 2012-06-07 Toshiba Corp Pattern formation method
JP5112500B2 (en) * 2010-11-18 2013-01-09 株式会社東芝 Pattern formation method

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