JP2014168000A - Wire bonding method and wire bonding device - Google Patents

Wire bonding method and wire bonding device Download PDF

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JP2014168000A
JP2014168000A JP2013039619A JP2013039619A JP2014168000A JP 2014168000 A JP2014168000 A JP 2014168000A JP 2013039619 A JP2013039619 A JP 2013039619A JP 2013039619 A JP2013039619 A JP 2013039619A JP 2014168000 A JP2014168000 A JP 2014168000A
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wire
bonding
joint
supply means
displacement information
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Takahiro Uchida
▲高▼弘 内田
Shigeaki Miura
栄朗 三浦
Yoko Fujiwara
陽子 藤原
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Amada Weld Tech Co Ltd
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Amada Miyachi Co Ltd
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  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wire bonding method which is capable of selecting a junction shape according to a purpose from junction shapes of various wires to execute wire bonding by using one wire bonding device having a simple configuration, and to provide a wire bonding device.SOLUTION: A front end part of a wire fed from wire supply means is bonded to a first bonding part by bonding means, and then, relative positions of the first bonding part and the wire supply means are displaced in accordance with preliminarily set displacement information during movement of the wire supply means to a second bonding part while the wire is fed from the wire supply means, whereby a preliminarily set wire deforming force is applied to the wire to deform the wire. Thereafter, a part corresponding to a rear end part of the wire fed from the wire supply means is bonded to the second bonding part by the bonding means, and the first bonding part and the second bonding part are electrically connected by the wire having a prescribed junction shape.

Description

本発明は、ワイヤボンディング方法およびワイヤボンディング装置に係り、特にワイヤの接合形状を適正に整えて接合するのに好適なワイヤボンディング方法およびワイヤボンディング装置に関する。   The present invention relates to a wire bonding method and a wire bonding apparatus, and more particularly, to a wire bonding method and a wire bonding apparatus suitable for appropriately bonding and bonding wires.

近年、ワイヤボンディングは半導体チップと外部の制御系とを電気的に接続する手段として多方面において作用されている。   In recent years, wire bonding has been used in various fields as a means for electrically connecting a semiconductor chip and an external control system.

例えば、半導体チップ上の電極パッドをパッケージの外部引き出し端子（リード）に電気的に接続する工程においてワイヤボンディングが採用されている。しかも、ワイヤボンディングにおいては、１本のワイヤを各接合箇所毎に接合したり、ワイヤを引き出したり、ワイヤを切断する作業を作業シーケンスに従って順番に実行するものであり、半導体実装工程の中でも最も高い信頼性を要求されている。   For example, wire bonding is employed in a process of electrically connecting an electrode pad on a semiconductor chip to an external lead terminal (lead) of a package. Moreover, in wire bonding, the operations of joining one wire at each joint location, drawing out the wire, and cutting the wire in order according to the work sequence are the highest in the semiconductor mounting process. Reliability is required.

このようなワイヤボンディングにおいては、ボンディングワイヤの材料はＡｕ（金）、Ａｌ（アルミニウム）またはＣｕ（銅）等であり、Ａｕワイヤをボンディングワイヤとする場合は熱圧着方式が用いられ、Ａｌワイヤをボンディングワイヤとする場合は超音波方式が用いられ、Ｃｕワイヤをボンディングワイヤとする場合はレーザワイヤボンディング方式が用いられてきた。   In such wire bonding, the material of the bonding wire is Au (gold), Al (aluminum), Cu (copper) or the like. When the Au wire is used as a bonding wire, a thermocompression bonding method is used. An ultrasonic method has been used for bonding wires, and a laser wire bonding method has been used for using Cu wires as bonding wires.

更に、実装状態におけるワイヤの接合形状としては、半導体チップの実装目的、実装部分の形状、大きさ等に応じて種々の接合形状が提案されている（特許文献１、図１０〜図１３参照）。   Furthermore, as the bonding shape of the wire in the mounted state, various bonding shapes have been proposed according to the mounting purpose of the semiconductor chip, the shape and size of the mounting portion (see Patent Document 1, FIGS. 10 to 13). .

特開平０７−０３７９２２号公報Japanese Patent Application Laid-Open No. 07-037922

前記特許文献１に記載されているワイヤボンディング方法においては、主としてワイヤの実装形状の省スペース化を図るために、ワイヤに２箇所の鋭角な湾曲部を形成している。   In the wire bonding method described in Patent Document 1, two sharp curved portions are formed on the wire mainly in order to save the space of the wire mounting shape.

しかしながら、特許文献１においては、ワイヤに２箇所の鋭角な湾曲部を形成するために、ワイヤを供給するためのカッターの他に、ワイヤを湾曲させるための成形矢を設ける必要があり、構成が特殊で複雑となるという不都合があった。   However, in Patent Document 1, it is necessary to provide a forming arrow for bending the wire in addition to the cutter for supplying the wire in order to form two sharp curved portions on the wire. There was an inconvenience that it was special and complicated.

一方、半導体チップを利用した半導体回路基板の実装分野においては、１基の簡単な構成のワイヤボンディング装置を用いて、種々のワイヤの接合形状から目的に応じた接合形状を選択してワイヤの接合を実行できるワイヤボンディング方法およびワイヤボンディング装置の出現が要望されている。   On the other hand, in the field of mounting semiconductor circuit boards using semiconductor chips, wire bonding is performed by selecting a bonding shape according to the purpose from various wire bonding shapes using a single wire bonding apparatus having a simple configuration. The advent of a wire bonding method and a wire bonding apparatus capable of performing the above-described processes is desired.

本発明は、これらの点に鑑みてなされたものであり、１基の簡単な構成のワイヤボンディング装置を用いて、種々のワイヤの接合形状から目的に応じた接合形状を選択してワイヤの接合を実行できるワイヤボンディング方法およびワイヤボンディング装置を提供することを目的とする。   The present invention has been made in view of these points, and uses a single wire bonding apparatus having a simple configuration to select a bonding shape in accordance with the purpose from various bonding shapes of wires and bond wires. It is an object of the present invention to provide a wire bonding method and a wire bonding apparatus that can execute the above.

本発明の第１態様のワイヤボンディング方法は、相互に離間している第１接合部と第２接合部とを所定の接合形状を備えた導電性を有するワイヤによって電気的に接続するワイヤボンディング方法であって、ワイヤ供給手段から繰り出された前記ワイヤの先端部を接合手段によって前記第１接合部に接合し、その後、前記ワイヤ供給手段から前記ワイヤの繰り出し作業を行いながら当該ワイヤ供給手段を前記第２接合部へ移動させる間に、前記第１接合部と前記ワイヤ供給手段の相対位置を予め設定した変位情報に従って変位させることにより、前記ワイヤに対して予め設定したワイヤ変形力を付与して前記ワイヤを変形させ、その後、前記ワイヤ供給手段から繰り出された前記ワイヤの後端部に相当する部分を前記接合手段によって前記第２接合部に接合し、前記第１接合部と第２接合部とを所定の接合形状を備えた前記ワイヤによって電気的に接続することを特徴とする。   The wire bonding method according to the first aspect of the present invention is a wire bonding method in which a first bonding portion and a second bonding portion that are separated from each other are electrically connected by a conductive wire having a predetermined bonding shape. The tip of the wire fed out from the wire supply means is joined to the first joint by the joining means, and then the wire supply means is moved out while performing the work of feeding out the wire from the wire supply means. By moving the relative position between the first joint and the wire supply means in accordance with preset displacement information while moving to the second joint, a predetermined wire deformation force is applied to the wire. The wire is deformed, and then a portion corresponding to the rear end of the wire fed out from the wire supply means is formed by the joining means. It joined to the joint portion, characterized in that electrically connected by the a first joint portion and the wire and the second bonding portion with a predetermined bonding shape.

また、本発明のワイヤボンディング方法の他の態様は、予め設定した変位情報が、記憶されている複数の変位情報から前記ワイヤの接合形状に対応するように選択された変位情報であることを特徴とする。   In another aspect of the wire bonding method of the present invention, the preset displacement information is displacement information selected from a plurality of stored displacement information so as to correspond to the bonding shape of the wire. And

また、本発明のワイヤボンディング方法の更に他の態様は、予め設定した変位情報が、記憶されている複数の変位情報に基づいて前記ワイヤの接合形状に対応するように算出された変位情報であることを特徴とする。   Still another aspect of the wire bonding method of the present invention is displacement information calculated so that preset displacement information corresponds to the bonding shape of the wire based on a plurality of stored displacement information. It is characterized by that.

また、本発明の第１態様のワイヤボンディング装置は、相互に離間している第１接合部と第２接合部とを所定の接合形状を備えた導電性を有するワイヤによって電気的に接続するワイヤボンディング装置であって、前記第１接合部および第２接合部を備えたワークを支持するワーク支持手段と、前記ワイヤを前記第１接合部と第２接合部との間に供給するとともに、当該ワイヤの繰り出し作業を行いながら前記第１接合部と第２接合部との間を移動自在に形成されているワイヤ供給手段と、前記ワーク支持手段と前記ワイヤ供給手段とを相対移動させる駆動手段と、前記ワーク支持手段、前記ワイヤ供給手段および前記駆動手段を関連動作させる指令を発信する制御手段であって、前記ワイヤ供給手段から前記ワイヤを繰り出しながら当該ワイヤ供給手段を前記第１接合部から前記第２接合部へ移動させる間に、前記第１接合部と前記ワイヤ供給手段の相対位置を予め設定した変位情報に従って変位させることにより、前記ワイヤに対して予め設定したワイヤ変形力を付与して前記ワイヤを変形させる制御手段と、前記ワーク支持手段と前記ワイヤ供給手段とを相対移動させることにより前記ワイヤを所定の接合形状に変形させる前記変位情報が複数種類記憶されている記憶手段とを有することを特徴とする。   The wire bonding apparatus according to the first aspect of the present invention is a wire that electrically connects a first bonding portion and a second bonding portion that are separated from each other by a conductive wire having a predetermined bonding shape. A bonding apparatus for supporting a workpiece having the first joint and the second joint; supplying the wire between the first joint and the second joint; and Wire supply means formed so as to be movable between the first joint and the second joint while performing a wire feeding operation; drive means for relatively moving the work support means and the wire supply means; A control means for transmitting a command for causing the work support means, the wire supply means and the drive means to perform related operations, wherein the wire is fed out from the wire supply means. While moving the wire supply means from the first joint to the second joint, the relative position between the first joint and the wire supply means is displaced according to preset displacement information, thereby The displacement information for deforming the wire into a predetermined joint shape by relatively moving the control means for deforming the wire by applying a predetermined wire deformation force and the workpiece support means and the wire supply means is provided. A plurality of types of storage means.

また、本発明のワイヤボンディング装置の他の態様は、予め設定した変位情報が、前記記憶手段に記憶されている複数の変位情報から前記ワイヤの接合形状に対応するように選択された変位情報であるあることを特徴とする。   According to another aspect of the wire bonding apparatus of the present invention, the preset displacement information is displacement information selected so as to correspond to the bonding shape of the wire from a plurality of displacement information stored in the storage means. It is characterized by being.

また、本発明のワイヤボンディング装置の更に他の態様は、予め設定した変位情報が、前記記憶手段に記憶されている複数の変位情報に基づいて前記ワイヤの接合形状に対応するように算出された変位情報であることを特徴とする。   According to still another aspect of the wire bonding apparatus of the present invention, the preset displacement information is calculated so as to correspond to the bonding shape of the wire based on a plurality of displacement information stored in the storage means. It is displacement information.

本発明のワイヤボンディング装置を本発明のワイヤボンディング方法によって動作させてワイヤボンディングを実行することにより、１基の簡単な構成のワイヤボンディング装置を用いて、種々のワイヤの接合形状から目的に応じた接合形状を選択してワイヤの接合を実行できるなどの効果を奏する。   By performing the wire bonding by operating the wire bonding apparatus of the present invention by the wire bonding method of the present invention, one wire bonding apparatus having a simple configuration can be used to meet various purposes from various wire bonding shapes. There is an effect that the bonding shape can be selected and the bonding of the wire can be executed.

本発明のワイヤボンディング装置の一実施形態を示すブロック図The block diagram which shows one Embodiment of the wire bonding apparatus of this invention 図１の要部の斜視図1 is a perspective view of the main part of FIG. （ａ）はワイヤの接合形状を示す正面図、（ｂ）は（ａ）に示すワイヤの接合形状の複数の変形例を示す正面図(A) is a front view showing the bonding shape of the wire, (b) is a front view showing a plurality of modifications of the bonding shape of the wire shown in (a). 図３（ｂ）に示す複数の接合形状を実行するパラメータの例を示す表Table showing examples of parameters for executing a plurality of joint shapes shown in FIG. ワイヤの接合形状の他の例を示す正面図Front view showing another example of wire joining shape

以下、本発明のワイヤボンディング方法およびワイヤボンディング装置の実施形態を図１から図５により説明する。   Embodiments of a wire bonding method and a wire bonding apparatus according to the present invention will be described below with reference to FIGS.

図１および図２は本発明のワイヤボンディング装置の１実施形態を示している。   1 and 2 show an embodiment of the wire bonding apparatus of the present invention.

本実施形態は、ワイヤボンディング対象（ワーク）としての半導体パッケージ１の半導体チップ２上の電極パッド３を半導体パッケージ１の外部引き出し端子（リード）４にＣｕワイヤ５をもって電気的に接続する場合に適用したものである。本実施形態においては、ワイヤ５が接続される相互に離間している電極パッド３とリード４について、一方のリード４をワイヤ５が接合される第１接合部Ａとし、他方の電極パッド３をワイヤ５が接合される第２接合部Ｂとする。   This embodiment is applied to the case where the electrode pad 3 on the semiconductor chip 2 of the semiconductor package 1 as a wire bonding target (work) is electrically connected to the external lead terminal (lead) 4 of the semiconductor package 1 through the Cu wire 5. It is a thing. In the present embodiment, with respect to the electrode pad 3 and the lead 4 which are separated from each other to which the wire 5 is connected, one lead 4 is used as the first joint A to which the wire 5 is joined, and the other electrode pad 3 is used as the other electrode pad 3. The second joint B is joined to the wire 5.

図１は、本実施形態のワイヤボンディング装置１１の主要な構成部分を示しており、ボンディング対象（ワーク）としての半導体パッケージ１を上面に載置して支持するワーク支持手段としてのワーク支持台１２を備えている。このワーク支持台１２は、図２に示すように、水平面のｘ方向およびｙ方向と鉛直面のｚ方向に移動自在に設置されており、支持台駆動機構１３によってｘｙｚ方向に駆動されるように形成されている。この支持台駆動機構１３としては、電磁アクチュエータ、サーボモータ等の公知の駆動源を用いて形成するとよい。   FIG. 1 shows main components of a wire bonding apparatus 11 of this embodiment, and a work support 12 as a work support means for mounting and supporting a semiconductor package 1 as a bonding target (work) on the upper surface. It has. As shown in FIG. 2, the work support 12 is installed so as to be movable in the x and y directions on the horizontal plane and the z direction on the vertical plane, and is driven in the xyz direction by the support drive mechanism 13. Is formed. The support base drive mechanism 13 may be formed using a known drive source such as an electromagnetic actuator or a servo motor.

ワーク支持台１２の上方には、リール状に巻回されている原反部（図示せず）からワイヤ５をワイヤボンディングのためにワークとしての半導体パッケージ１の第１接合部Ａおよび第２接合部Ｂに繰り出させるワイヤ供給手段としてのワイヤ供給アーム１４が配設されている。ワイヤ供給アーム１４はほぼ鉛直に近い細長い棒状に形成されており、横断面の中心部にはワイヤ挿通孔１４ａが貫通形成されており、ワイヤ５を貫通させて下端部の開口からワイヤ５の先端部を繰り出すように形成されている。ワイヤ供給アーム１４の下端部には水平方向に略Ｕ字形のワイヤ押さえ部１４ｂが折り曲げ形成されている。このワイヤ押さえ部１４ｂは第１接合部Ａおよび第２接合部Ｂとの間にワイヤ５を上下から挟持して不動状態とさせて、Ｕ字形の開口部越しにレーザ光を照射させて、ワイヤ５と第１接合部Ａおよび第２接合部Ｂとをスポット溶接させるものである。このワイヤ供給アーム１４は、図２に示すように、水平面のｘ方向およびｙ方向と鉛直面のｚ方向に移動自在に設置されており、アーム駆動機構１５によってｘｙｚ方向に駆動されるように形成されている。このアーム駆動機構１５としては、電磁アクチュエータ、サーボモータ等の公知の駆動源を用いて形成するとよい。このワイヤ供給アーム１４とワーク支持台１２との駆動により、ワイヤ供給アーム１４と第１接合部Ａおよび第２接合部Ｂとを相対移動させて、ワイヤ５を第１接合部Ａおよび第２接合部Ｂの間に供給するように形成されている。   Above the workpiece support 12, the first bonding portion A and the second bonding of the semiconductor package 1 as a workpiece for wire bonding from the raw fabric portion (not shown) wound in a reel shape to the wire 5. A wire supply arm 14 is disposed as a wire supply means for feeding to the part B. The wire supply arm 14 is formed in a substantially vertical bar shape, and a wire insertion hole 14a is formed through the center of the cross section. The wire 5 penetrates the wire 5 from the opening at the lower end to the tip of the wire 5. It is formed so as to extend the part. A substantially U-shaped wire pressing portion 14b is bent at the lower end portion of the wire supply arm 14 in the horizontal direction. The wire holding portion 14b is configured such that the wire 5 is sandwiched from above and below between the first joint portion A and the second joint portion B so as to be in an immobile state and irradiated with laser light through the U-shaped opening. 5 and the first joint A and the second joint B are spot-welded. As shown in FIG. 2, the wire supply arm 14 is movably installed in the x and y directions on the horizontal plane and the z direction on the vertical plane, and is configured to be driven in the xyz direction by the arm driving mechanism 15. Has been. The arm drive mechanism 15 may be formed using a known drive source such as an electromagnetic actuator or a servo motor. By driving the wire supply arm 14 and the work support 12, the wire supply arm 14 and the first joint A and the second joint B are moved relative to each other, so that the wire 5 is connected to the first joint A and the second joint. It is formed so as to be supplied between the parts B.

ワイヤ５の原反部からワイヤ供給アーム１４の間には、ワイヤ５を長手方向に出し入れ若しくは停止するように駆動してワイヤ５の繰り出し作業を実行するワイヤ駆動機構１６が設けられている。このワイヤ駆動機構１６としては、電磁アクチュエータ、サーボモータ等の公知の駆動源を用いて形成するとよい。   A wire driving mechanism 16 is provided between the original fabric portion of the wire 5 and the wire supply arm 14 to drive the wire 5 in and out or stop the wire 5 in order to carry out the wire 5 feeding operation. The wire drive mechanism 16 may be formed using a known drive source such as an electromagnetic actuator or a servo motor.

各部を駆動する支持台駆動機構１３、アーム駆動機構１５およびワイヤ駆動機構１６は全体としてワイヤ５の最終的な接合形状を決定するために構成各部を関連動作させる駆動手段を形成している。   The support drive mechanism 13, arm drive mechanism 15, and wire drive mechanism 16 that drive each part form a drive means for operating the constituent parts in association with each other in order to determine the final joint shape of the wire 5.

各駆動機構１３、１５および１６に対して動作指令を発信する制御手段としての制御部１７が設置されている。この制御部１７は、ｃｐｕ、メモリ等によって形成されており、全体としてワイヤ５の最終的な接合形状を決定するために各駆動機構１３、１５および１６を関連動作させる。具体的には、ワイヤ供給アーム１４の下端部からワイヤ５を繰り出しながらワイヤ供給アーム１４を第１接合部Ａから第２接合部Ｂへ移動させる間に、第１接合部Ａとワイヤ供給アーム１４の相対位置を予め設定した変位情報に従って変位させることにより、ワイヤ５に対して予め設定したワイヤ変形力を付与してワイヤ５を変形させて、全体としてワイヤ５の最終的な接合形状を予め設定した形状とさせるように形成されている。   A control unit 17 is installed as a control unit that transmits an operation command to each of the drive mechanisms 13, 15, and 16. The control unit 17 is formed by cpu, a memory, and the like, and operates the driving mechanisms 13, 15, and 16 in association with each other in order to determine the final bonding shape of the wire 5 as a whole. Specifically, while moving the wire supply arm 14 from the first joint A to the second joint B while feeding the wire 5 from the lower end of the wire supply arm 14, the first joint A and the wire supply arm 14 are moved. The wire 5 is deformed by applying a preset wire deformation force to the wire 5 by displacing the relative position of the wire according to the preset displacement information, so that the final bonded shape of the wire 5 as a whole is preset. It is formed so as to have a shape.

ここで図３および図４により本発明におけるワイヤ５の最終的な接合形状の設定方法を説明する。   Here, with reference to FIG. 3 and FIG. 4, a method for setting the final bonding shape of the wire 5 in the present invention will be described.

図３（ａ）は、本発明による典型的なワイヤ５の接合形状を示している。同図（ａ）において、ワイヤ５は最初に第１接合部Ａにおいて接合される。その後、ワイヤ供給アーム１４のワイヤ挿通孔１４ａからワイヤ５を繰り出しながらワイヤ供給アーム１４を第２接合部Ｂへ移動させると、第１接合部Ａにおいて固定状態にあるワイヤ５に対してワイヤ供給アーム１４の変位動作を調節することにより、ワイヤ５に対して塑性変形させたり、弾性変形させたり、湾曲部を形成したりするワイヤ変形力を付与することができ、そのワイヤ変形力を調整することによりワイヤ５の最終的な接合形状を自由度をもって設定することができる。その調整パラメータとしては、本実施形態においては、移動自在に形成されている３種類のワイヤ５、ワーク支持台１２およびワイヤ供給アーム１４の時間経過に伴う各移動方向の速度を挙げることができ、これらのパラメータをワイヤ５の最終的な接合形状を得ることのできる値にするとよい。   FIG. 3 (a) shows a typical bonding shape of the wire 5 according to the present invention. In FIG. 2A, the wire 5 is first joined at the first joint A. After that, when the wire supply arm 14 is moved to the second joint B while feeding the wire 5 out of the wire insertion hole 14a of the wire supply arm 14, the wire supply arm is fixed to the wire 5 fixed in the first joint A. By adjusting the displacement operation of the wire 14, it is possible to apply a wire deformation force that causes the wire 5 to be plastically deformed, elastically deformed, or to form a bending portion, and to adjust the wire deformation force. Thus, the final bonding shape of the wire 5 can be set with a degree of freedom. As the adjustment parameter, in this embodiment, the speed of each moving direction with the passage of time of the three types of wires 5 formed so as to be movable, the workpiece support 12 and the wire supply arm 14 can be mentioned. These parameters may be set to values that can obtain the final bonded shape of the wire 5.

一例として、図３（ａ）の場合のワイヤ５の変形方法を、ワイヤ５の繰り出し方向の順(i)〜(iii)に説明する。まず、(i)部分においては、ワイヤ５が第１接合部Ａにおけるスポット溶接された水平部から鉛直上向きに立ち上がるように変形させるために、ワイヤ５を繰り出しながら、ワイヤ供給アーム１４とワーク支持台１２とを鉛直方向に離れるように相対移動させて、ワイヤ５を９０度折り曲げるように塑性変形させるとよい。また、(ii)部分においては、ワイヤ５を繰り出しながら、ワイヤ供給アーム１４とワーク支持台１２とを、時間経過の前半は鉛直方向および水平方向に離れるように相対移動させて、時間経過の後半は鉛直方向は近づき水平方向は同様に離れるように移動させて、ワイヤ５を上向きから下向きに鈍角に折り曲げるように弾性変形させるとよい。この場合、ワイヤ供給アーム１４を第１接合部Ａの位置から鉛直上方に上昇させて最終的な接合形状における第１接合部Ａから第２接合部Ｂまでのワイヤ５の全長分を繰り出し、その後ワイヤ５の繰り出しを停止した状態で、ワイヤ供給アーム１４を第２接合部Ｂに近づくようにワーク支持台１２と相対移動させてもよい。(iii)部においては、ワイヤ５の第２接合部Ｂと接合すべき位置をワイヤ供給アーム１４のワイヤ押さえ部１４ｂによって第２接合部Ｂと挟持して、レーザ光を照射してスポット溶接する。その後、ワイヤ５の不要部を図示しないカッタによって切断するとよい。   As an example, the deformation method of the wire 5 in the case of FIG. 3A will be described in the order (i) to (iii) in the feeding direction of the wire 5. First, in part (i), in order to deform the wire 5 so as to rise vertically upward from the spot welded horizontal portion in the first joint A, the wire supply arm 14 and the work support base are extended while the wire 5 is being fed. 12 may be moved relative to each other in the vertical direction, and the wire 5 may be plastically deformed to be bent 90 degrees. In part (ii), the wire supply arm 14 and the work support 12 are moved relative to each other so that the first half of the time lapses in the vertical direction and the horizontal direction while feeding out the wire 5, and the second half of the time lapse. It is preferable to move the wire 5 so as to approach the vertical direction and leave the horizontal direction in the same manner, and to elastically deform the wire 5 so that it is bent from an upward direction to an obtuse angle. In this case, the wire supply arm 14 is raised vertically upward from the position of the first joint A to feed out the entire length of the wire 5 from the first joint A to the second joint B in the final joint shape, and thereafter The wire supply arm 14 may be moved relative to the work support 12 so as to approach the second joint B in a state where the feeding of the wire 5 is stopped. In the part (iii), the position to be joined to the second joint B of the wire 5 is sandwiched with the second joint B by the wire pressing part 14b of the wire supply arm 14, and spot welding is performed by irradiating a laser beam. . Thereafter, unnecessary portions of the wire 5 may be cut with a cutter (not shown).

図３（ｂ）は、同図（ａ）の典型的なワイヤの接合形状を、半導体パッケージ１の設計コンセプト等に応じて変化させた形状パターン（ｂ１、ｂ２、ｂ３・・・）を示しており、図４は図３（ｂ）の各形状パターンを実行するための各パラメータを示すものである。   FIG. 3B shows a shape pattern (b1, b2, b3...) In which the typical wire bonding shape of FIG. 3A is changed according to the design concept of the semiconductor package 1 and the like. FIG. 4 shows parameters for executing each shape pattern of FIG.

図５は図３と異なる典型的なワイヤの接合形状を示すものである。このようなワイヤの接合形状を得るためには、下側の接合部である電極パッド３を第１接合部Ａとし、上側の接合部であるリード４を第２接合部Ｂとすることで実現できる。すなわち、まず、(i
)部分において、ワイヤ５が下側の第１接合部Ａにおけるスポット溶接された水平部から図５において右斜め上方に立ち上がるように変形させるために、ワイヤ５を繰り出しながら、ワイヤ供給アーム１４とワーク支持台１２とを右斜め上方に離れるように相対移動させて、ワイヤ５を鋭角に折り曲げるように塑性変形させるとよい。また、(ii)部分においては、ワイヤ５を繰り出しながら、ワイヤ供給アーム１４とワーク支持台１２とを、時間経過の前半は鉛直方向および水平方向に離れるように相対移動させて、時間経過の後半は鉛直方向は近づき水平方向は同様に離れるように移動させて、ワイヤ５を上向きから下向きに鈍角に折り曲げるように弾性変形させるとよい。この場合、ワイヤ供給アーム１４を第１接合部Ａの位置から鉛直上方に上昇させて最終的な接合形状における第１接合部Ａから上側の第２接合部Ｂまでのワイヤ５の全長分を繰り出し、その後ワイヤ５の繰り出しを停止した状態で、ワイヤ供給アーム１４を第２接合部Ｂに近づくようにワーク支持台１２と相対移動させてもよい。(iii)部においては、ワイヤ５の第２接合部Ｂと接合すべき位置をワイヤ供給アーム１４のワイヤ押さえ部１４ｂによって第２接合部Ｂと挟持して、レーザ光を照射してスポット溶接する。その後、ワイヤ５の不要部を図示しないカッタによって切断するとよい。このように、接合順序を入れ換えることにより、所望のワイヤ形状に容易に成形することができる。 FIG. 5 shows a typical wire bonding shape different from FIG. In order to obtain such a wire bonding shape, the electrode pad 3 which is the lower bonding portion is the first bonding portion A, and the lead 4 which is the upper bonding portion is the second bonding portion B. it can. That is, first, (i
), In order to deform the wire 5 so that it rises diagonally upward to the right in FIG. 5 from the spot welded horizontal portion in the lower first joint A, the wire supply arm 14 and the work It is preferable that the support base 12 be moved relative to the right diagonally upward to be plastically deformed so that the wire 5 is bent at an acute angle. In part (ii), the wire supply arm 14 and the work support 12 are moved relative to each other so that the first half of the time lapses in the vertical direction and the horizontal direction while feeding out the wire 5, and the second half of the time lapse. It is preferable to move the wire 5 so as to approach the vertical direction and leave the horizontal direction in the same manner, and to elastically deform the wire 5 so that it is bent from an upward direction to an obtuse angle. In this case, the wire supply arm 14 is lifted vertically upward from the position of the first joint A to feed out the entire length of the wire 5 from the first joint A to the upper second joint B in the final joint shape. Thereafter, the wire supply arm 14 may be moved relative to the work support base 12 so as to approach the second joint B in a state where the feeding of the wire 5 is stopped. In the part (iii), the position to be joined to the second joint B of the wire 5 is sandwiched with the second joint B by the wire pressing part 14b of the wire supply arm 14, and spot welding is performed by irradiating a laser beam. . Thereafter, unnecessary portions of the wire 5 may be cut with a cutter (not shown). Thus, by changing the joining order, it can be easily formed into a desired wire shape.

図１および図２に戻り、本実施形態のワイヤボンディング装置１１においては、例えば図３（ｂ）に示す各形状パターンを実行するための図４に示す各パラメータを予め設定するデータとして記憶する記憶手段としてのパラメータメモリ１８が制御部１７に接続されている。更に、制御部１７には、入力手段と表示手段を兼ねたタッチパネル１９が接続されている。このタッチパネル１９により、パラメータメモリ１８に記憶されている複数のワイヤの接合データを表示し、ユーザが実行すべきワイヤの接合形状を選択入力して、選択された接合が実行させるように形成されている。この場合、ワイヤ５の接合形状について、第１接合部Ａからワイヤ５の最頂部までの高さや、第１接合部Ａと第２接合部Ｂとの間の高さや水平方向距離等を決定し、パラメータメモリ１８に記憶されている複数のワイヤの接合データの中よりこれらの高さや水平方向距離を備えたワイヤ５の接合形状を実現できる複数のワイヤの接合データを制御部１７において抽出してタッチパネル１９に表示させるようにしてもよい。   Returning to FIG. 1 and FIG. 2, in the wire bonding apparatus 11 of this embodiment, for example, each parameter shown in FIG. 4 for executing each shape pattern shown in FIG. 3B is stored as preset data. A parameter memory 18 as a means is connected to the control unit 17. Further, the control unit 17 is connected with a touch panel 19 serving both as input means and display means. The touch panel 19 is configured to display the bonding data of the plurality of wires stored in the parameter memory 18 and to select and input the bonding shape of the wire to be executed by the user so that the selected bonding is executed. Yes. In this case, with respect to the bonding shape of the wire 5, the height from the first bonding portion A to the topmost portion of the wire 5, the height between the first bonding portion A and the second bonding portion B, the horizontal distance, and the like are determined. The control unit 17 extracts the bonding data of the plurality of wires that can realize the bonding shape of the wire 5 having the height and the horizontal distance from the bonding data of the plurality of wires stored in the parameter memory 18. It may be displayed on the touch panel 19.

次に、このように形成されている本実施形態におけるワイヤボンディング装置１１を用いて実行される本発明のワイヤボンディング方法を説明する。   Next, the wire bonding method of the present invention executed using the wire bonding apparatus 11 in the present embodiment formed as described above will be described.

最初に、実行すべきワイヤボンディングの内容に対応したワイヤの接合形状の選択を行う。   First, the wire bonding shape corresponding to the content of the wire bonding to be executed is selected.

具体的には、タッチパネル１９に例えば図４に示すパターンデータを表示させ、所望のワイヤ５の接合形状に対応するパターンを選択する。   Specifically, for example, pattern data shown in FIG. 4 is displayed on the touch panel 19, and a pattern corresponding to a desired bonding shape of the wire 5 is selected.

次に、制御部１７により指定されたワイヤ５の接続形状を実行するための選択されたパタンデータを支持台駆動機構１３、アーム駆動機構１５およびワイヤ駆動機構１６に指令を発信して、ワーク支持台１２、ワイヤ供給アーム１４およびワイヤ５を予め設定された変形情報に従って稼働させる。   Next, the selected pattern data for executing the connection shape of the wire 5 designated by the control unit 17 is transmitted to the support base drive mechanism 13, the arm drive mechanism 15 and the wire drive mechanism 16 to support the workpiece. The base 12, the wire supply arm 14, and the wire 5 are operated according to preset deformation information.

具体的には、ワイヤ供給アーム１４を第１接合部Ａに近づけるとともにワイヤ５をワイヤ挿通孔１４ａの下端開口部より所定長だけ繰り出し、続いてワイヤ供給アーム１４を下降させて押さえ部１４ｂと第１接合部Ａとでワイヤ５を挟持固定する。   Specifically, the wire supply arm 14 is brought close to the first joint A, and the wire 5 is fed out from the lower end opening of the wire insertion hole 14a by a predetermined length. The wire 5 is clamped and fixed with one joint A.

次に、図示しないレーザ発信手段よりレーザ光を発振させてワイヤ５および第１接合部Ａに照射して、第１接合部Ａにおいてワイヤ５をスポット溶接する。   Next, a laser beam is oscillated from a laser transmitting means (not shown) and irradiated to the wire 5 and the first joint A, and the wire 5 is spot-welded at the first joint A.

次に、ワイヤ供給アーム１４からワイヤ５の繰り出し作業を行いながらワイヤ供給アーム１４を第２接合部Ｂに向けて移動させる間に、第１接合部Ａとワイヤ供給アーム１４の相対位置を予め設定した変位情報（選択されたパラメータ情報）に従って変位させることにより、ワイヤ５に対して予め設定したワイヤ変形力を付与してワイヤ５を変形させる。ここで、ワイヤ５の繰り出し作業としては、ワイヤ５をワイヤ供給アーム１４より外部に繰り出す作業と、ワイヤ５の繰り出しを停止させてワイヤ供給アーム１４のみを移動させる作業と、ワイヤ５をワイヤ供給アーム１４内に引き込む作業とを、ワイヤ５の接合形状の形成に適するように適宜に選択して実行するとよい。更に、ワイヤ供給アーム１４およびワーク支持台１２のいずれか一方を停止させ他方を移動させるようにしながら、前記のワイヤの繰り出し作業を組合わせることにより、ワイヤ５を種々の接合形状に変形させるとよい。   Next, the relative position between the first joint A and the wire supply arm 14 is set in advance while the wire supply arm 14 is moved toward the second joint B while the wire 5 is being unwound from the wire supply arm 14. By displacing according to the displacement information (selected parameter information), a predetermined wire deformation force is applied to the wire 5 to deform the wire 5. Here, as the operation of drawing out the wire 5, the operation of drawing out the wire 5 from the wire supply arm 14, the operation of stopping the drawing of the wire 5 and moving only the wire supply arm 14, and the wire 5 of the wire supply arm The operation of drawing into the wire 14 may be appropriately selected and executed so as to be suitable for forming the bonded shape of the wire 5. Furthermore, the wire 5 may be deformed into various joint shapes by combining the aforementioned wire feeding operations while stopping one of the wire supply arm 14 and the work support 12 and moving the other. .

続いて、ワイヤ供給アーム１４から繰り出されたワイヤ５の後端部に相当する部分を第２接合位置Ｂに位置合わせさせ、その後、ワイヤ供給アーム１４を下降させて押さえ部１４ｂと第２接合部Ｂとでワイヤ５を挟持固定する。   Subsequently, a portion corresponding to the rear end portion of the wire 5 fed out from the wire supply arm 14 is aligned with the second bonding position B, and then the wire supply arm 14 is lowered to hold the pressing portion 14b and the second bonding portion. The wire 5 is clamped and fixed with B.

次に、図示しないレーザ発信手段よりレーザ光を発振させてワイヤ５および第２接合部Ｂに照射して、第２接合部Ｂにおいてワイヤ５をスポット溶接する。   Next, a laser beam is oscillated from a laser transmitting means (not shown) and applied to the wire 5 and the second joint B, and the wire 5 is spot-welded at the second joint B.

その後、ワイヤ５の後端部の第２接合部Ｂとして不要な部分を図示しないカッタによって切断する。   Thereafter, an unnecessary portion as the second joint B at the rear end of the wire 5 is cut by a cutter (not shown).

また、前記の動作説明においては、図４のパラメータ表に示されている複数のパラメータ情報から１つのワイヤ５の接合形状を選択するものであるが、所望のワイヤ５の接合形状が表示されているパラメータ情報の中間に相当するものである場合には、制御部１７においてパラメータ情報を比例計算等によって算出して、所望のワイヤ５の接合形状を得るワイヤボンディングを実行するようにするとよい。   In the above description of the operation, the bonding shape of one wire 5 is selected from a plurality of parameter information shown in the parameter table of FIG. 4, but the bonding shape of the desired wire 5 is displayed. When the parameter information corresponds to the middle of the parameter information, the control unit 17 may calculate the parameter information by proportional calculation or the like, and execute wire bonding to obtain a desired bonding shape of the wire 5.

このように本発明のワイヤボンディング装置を本発明のワイヤボンディング方法によって動作させてワイヤボンディングを実行することにより、１基の簡単な構成のワイヤボンディング装置を用いて、種々のワイヤの接合形状から目的に応じた接合形状を選択してワイヤ５の接合を実行することができる。   As described above, the wire bonding apparatus of the present invention is operated by the wire bonding method of the present invention to execute the wire bonding, so that the wire bonding apparatus having one simple configuration can be used for various wire bonding shapes. It is possible to execute bonding of the wire 5 by selecting a bonding shape according to the above.

更に説明すると、特許文献１における成形矢を用いることなく、ワイヤ供給アーム１４のみからなる簡単な構成により、種々のワイヤの接合形状から目的に応じた接合形状を選択してワイヤ５の接合を実行することができる。   To explain further, the wire 5 is joined by selecting a joining shape according to the purpose from a joining shape of various wires with a simple configuration including only the wire supply arm 14 without using the forming arrow in Patent Document 1. can do.

なお、本発明は、上記の実施形態に限定されるものではなく、必要に応じて変更することができる。例えば、上記の実施形態では、ワイヤ５として断面が長方形状のリボン形のワイヤを用いているが、これに変えて、断面が円形状や楕円形状のワイヤを用いることもできる。また、上記の実施形態では、ワークとして半導体パッケージを用いているが、これに変えて、回路基板上の電極間接合等、種々の電子部品に適用できる。   In addition, this invention is not limited to said embodiment, It can change as needed. For example, in the above-described embodiment, a ribbon-shaped wire having a rectangular cross section is used as the wire 5, but instead, a wire having a circular or elliptical cross section can be used. In the above-described embodiment, a semiconductor package is used as a work, but instead, it can be applied to various electronic components such as interelectrode bonding on a circuit board.

１ 半導体パッケージ
３ 電気パッド（第１接合部Ａ）
４ リード（第２接合部Ｂ）
５ ワイヤ
１１ ワイヤボンディング装置
１２ ワーク支持台
１３ 支持台駆動機構
１４ ワイヤ供給アーム
１５ アーム駆動機構
１６ ワイヤ駆動機構
１７ 制御部 DESCRIPTION OF SYMBOLS 1 Semiconductor package 3 Electrical pad (1st junction part A)
4 Lead (second joint B)
DESCRIPTION OF SYMBOLS 5 Wire 11 Wire bonding apparatus 12 Work support stand 13 Support stand drive mechanism 14 Wire supply arm 15 Arm drive mechanism 16 Wire drive mechanism 17 Control part

Claims (6)

相互に離間している第１接合部と第２接合部とを所定の接合形状を備えた導電性を有するワイヤによって電気的に接続するワイヤボンディング方法であって、
ワイヤ供給手段から繰り出された前記ワイヤの先端部を接合手段によって前記第１接合部に接合し、
その後、前記ワイヤ供給手段から前記ワイヤの繰り出し作業を行いながら当該ワイヤ供給手段を前記第２接合部へ移動させる間に、前記第１接合部と前記ワイヤ供給手段の相対位置を予め設定した変位情報に従って変位させることにより、前記ワイヤに対して予め設定したワイヤ変形力を付与して前記ワイヤを変形させ、
その後、前記ワイヤ供給手段から繰り出された前記ワイヤの後端部に相当する部分を前記接合手段によって前記第２接合部に接合し、
前記第１接合部と第２接合部とを所定の接合形状を備えた前記ワイヤによって電気的に接続する
ことを特徴とするワイヤボンディング方法。 A wire bonding method for electrically connecting a first bonding portion and a second bonding portion separated from each other by a conductive wire having a predetermined bonding shape,
Joining the tip of the wire fed from the wire supply means to the first joint by a joining means;
After that, while moving the wire supply means from the wire supply means to the second joint, the relative information between the first joint and the wire supply means is set in advance. By deforming the wire by applying a preset wire deformation force to the wire,
Thereafter, a portion corresponding to the rear end portion of the wire fed out from the wire supply means is joined to the second joint portion by the joining means,
The wire bonding method, wherein the first bonding portion and the second bonding portion are electrically connected by the wire having a predetermined bonding shape. 前記予め設定した変位情報は、記憶されている複数の変位情報から前記ワイヤの接合形状に対応するように選択された変位情報であることを特徴とする請求項１に記載のワイヤボンディング方法。   The wire bonding method according to claim 1, wherein the preset displacement information is displacement information selected from a plurality of stored displacement information so as to correspond to a bonding shape of the wire. 前記予め設定した変位情報は、記憶されている複数の変位情報に基づいて前記ワイヤの接合形状に対応するように算出された変位情報であることを特徴とする請求項１に記載のワイヤボンディング方法。   2. The wire bonding method according to claim 1, wherein the preset displacement information is displacement information calculated so as to correspond to a bonding shape of the wire based on a plurality of stored displacement information. . 相互に離間している第１接合部と第２接合部とを所定の接合形状を備えた導電性を有するワイヤによって電気的に接続するワイヤボンディング装置であって、
前記第１接合部および第２接合部を備えたワークを支持するワーク支持手段と、
前記ワイヤを前記第１接合部と第２接合部との間に供給するとともに、当該ワイヤを繰り出しながら前記第１接合部と第２接合部との間を移動自在に形成されているワイヤ供給手段と、
前記ワーク支持手段と前記ワイヤ供給手段とを相対移動させる駆動手段と、
前記ワーク支持手段、前記ワイヤ供給手段および前記駆動手段を関連動作させる指令を発信する制御手段であって、前記ワイヤ供給手段から前記ワイヤの繰り出し作業を行いながら当該ワイヤ供給手段を前記第１接合部から前記第２接合部へ移動させる間に、前記第１接合部と前記ワイヤ供給手段の相対位置を予め設定した変位情報に従って変位させることにより、前記ワイヤに対して予め設定したワイヤ変形力を付与して前記ワイヤを変形させる制御手段と、
前記ワーク支持手段と前記ワイヤ供給手段とを相対移動させることにより前記ワイヤを所定の接合形状に変形させる前記変位情報が複数種類記憶されている記憶手段とを
有することを特徴とするワイヤボンディング装置。 A wire bonding apparatus that electrically connects a first bonding portion and a second bonding portion that are separated from each other by a conductive wire having a predetermined bonding shape,
A work support means for supporting a work provided with the first joint and the second joint;
Wire supply means for supplying the wire between the first joint and the second joint and movably between the first joint and the second joint while feeding the wire. When,
Drive means for relatively moving the workpiece support means and the wire supply means;
Control means for transmitting a command for causing the workpiece support means, the wire supply means, and the drive means to perform related operations, wherein the wire supply means is moved out from the wire supply means while the wire supply means is connected to the first joint portion. A predetermined wire deformation force is applied to the wire by displacing the relative position of the first joint and the wire supply means according to preset displacement information during the movement from the first joint to the second joint. And control means for deforming the wire,
A wire bonding apparatus comprising: storage means for storing a plurality of types of displacement information for deforming the wire into a predetermined bonding shape by relatively moving the work support means and the wire supply means. 前記予め設定した変位情報は、前記記憶手段に記憶されている複数の変位情報から前記ワイヤの接合形状に対応するように選択された変位情報であるあることを特徴とする請求項４に記載のワイヤボンディング装置。   The said preset displacement information is the displacement information selected so that it might respond | correspond to the joining shape of the said wire from the several displacement information memorize | stored in the said memory | storage means. Wire bonding equipment. 前記予め設定した変位情報は、前記記憶手段に記憶されている複数の変位情報に基づいて前記ワイヤの接合形状に対応するように算出された変位情報であることを特徴とする請求項４に記載のワイヤボンディング装置。   5. The displacement information that is calculated so as to correspond to a bonding shape of the wire based on a plurality of pieces of displacement information stored in the storage unit. Wire bonding equipment.
JP2013039619A 2013-02-28 2013-02-28 Wire bonding method and wire bonding device Pending JP2014168000A (en)

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