JP2014165267A5 - - Google Patents

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Publication number
JP2014165267A5
JP2014165267A5 JP2013033473A JP2013033473A JP2014165267A5 JP 2014165267 A5 JP2014165267 A5 JP 2014165267A5 JP 2013033473 A JP2013033473 A JP 2013033473A JP 2013033473 A JP2013033473 A JP 2013033473A JP 2014165267 A5 JP2014165267 A5 JP 2014165267A5
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JP
Japan
Prior art keywords
dam
adhesive layer
bonding surface
composite
cured
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JP2013033473A
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English (en)
Japanese (ja)
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JP6110159B2 (ja
JP2014165267A (ja
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Priority to JP2013033473A priority Critical patent/JP6110159B2/ja
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Publication of JP2014165267A5 publication Critical patent/JP2014165267A5/ja
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JP2013033473A 2013-02-22 2013-02-22 複合部材及びその製造方法 Active JP6110159B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013033473A JP6110159B2 (ja) 2013-02-22 2013-02-22 複合部材及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013033473A JP6110159B2 (ja) 2013-02-22 2013-02-22 複合部材及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014165267A JP2014165267A (ja) 2014-09-08
JP2014165267A5 true JP2014165267A5 (enrdf_load_html_response) 2016-03-03
JP6110159B2 JP6110159B2 (ja) 2017-04-05

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ID=51615631

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JP2013033473A Active JP6110159B2 (ja) 2013-02-22 2013-02-22 複合部材及びその製造方法

Country Status (1)

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JP (1) JP6110159B2 (enrdf_load_html_response)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6463938B2 (ja) 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
US10688750B2 (en) 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
KR102176064B1 (ko) * 2017-11-10 2020-11-09 주식회사 아이앤티 정전척 제조방법 및 정전척
US10847402B2 (en) 2018-04-02 2020-11-24 Applied Materials, Inc. Bond protection around porous plugs
US11456161B2 (en) 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
JP7210192B2 (ja) * 2018-08-30 2023-01-23 日本特殊陶業株式会社 保持装置の製造方法
JP7387764B2 (ja) 2019-05-24 2023-11-28 アプライド マテリアルズ インコーポレイテッド 結合層の保護が改善された基板支持キャリア
WO2020252020A1 (en) * 2019-06-12 2020-12-17 Lam Research Corporation Sealant coating for plasma processing chamber components
KR102341865B1 (ko) * 2021-05-13 2021-12-21 고광노 수리가 용이한 정전척
KR102418014B1 (ko) * 2021-08-27 2022-07-07 주식회사 동탄이엔지 홀이 구비되는 필름형 본딩층을 포함하는 정전척 및 정전척의 제조 방법
KR102592339B1 (ko) * 2022-08-09 2023-10-23 주식회사 동탄이엔지 다공성 필터가 구비되는 정전척의 제조 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065047A (ja) * 1996-08-20 1998-03-06 Tokuyama Corp 半導体素子搭載用パッケージの製造方法
JP5143184B2 (ja) * 2010-05-07 2013-02-13 日本碍子株式会社 ウエハー載置装置の製造方法

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