JP2014165264A - Substrate manufacturing apparatus and maintenance method of substrate manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate manufacturing apparatus to which a maintenance function of a nozzle head is given, without increasing the occupied area of the apparatus.SOLUTION: A stage holds a substrate, and moves the substrate thus held. A sheet holding device holds a maintenance sheet. A nozzle head discharges a droplet of ink toward the substrate held on the stage. A moving mechanism moves at least one of the maintenance sheet and nozzle head, and implements a state where the maintenance sheet is arranged at a maintenance position below the nozzle head, and a state where the maintenance sheet is arranged at a retreat position not overlapping the nozzle head, in plan view. The stage moves the substrate thus held, and passes the substrate under the maintenance sheet arranged at the retreat position, and under the nozzle head.

Description

  The present invention relates to a substrate manufacturing apparatus that ejects ink droplets from a nozzle head to attach ink to a substrate, and a maintenance method for the substrate manufacturing apparatus.

  Attention has been focused on a technique for forming a solder resist pattern by forming a solder resist into droplets, attaching the droplets only to a desired region of a printed circuit board, and curing the solder resist. Solder resist droplets are ejected from a plurality of nozzle holes toward the printed circuit board. By irradiating the droplets attached to the surface of the printed circuit board with ultraviolet rays, the droplets can be cured (Patent Document 1).

  A liquid material such as a solder resist may cause defects such as clogging in the nozzle holes. Patent Document 2 discloses a film forming apparatus capable of inspecting a nozzle head. In this film forming apparatus, a medium holding table for holding a medium to be formed and an inspection table for holding an inspection medium are guided by one guide and moved in one direction. By ejecting ink droplets from the nozzle head while moving the medium holding table or the inspection table along the guide, the ink can be attached to the medium to be formed or the inspection medium.

  An inspection pattern is formed on the inspection medium held on the inspection table, and this inspection pattern is imaged by the imaging device. The quality of the nozzle head can be determined from the imaging result.

JP 2004-104104 A JP 2012-170866 A

  While the film is formed on the medium held on the holding table, the inspection table must be retreated to a retreat location that does not hinder the movement of the holding table. For this reason, it is necessary to secure a retreat place for the inspection table within the stroke of the inspection table and the holding table. By securing this evacuation place, the area occupied by the apparatus increases.

  An object of the present invention is to provide a substrate manufacturing apparatus provided with a nozzle head maintenance function without increasing the area occupied by the apparatus. Another object of the present invention is to provide a maintenance method for the substrate manufacturing apparatus.

According to one aspect of the invention,
A stage for holding the substrate and moving the held substrate;
A sheet holding device for holding the maintenance sheet;
A nozzle head that ejects ink droplets toward the substrate held on the stage;
At least one of the maintenance sheet and the nozzle head is moved so that the maintenance sheet is disposed at a maintenance position below the nozzle head, and the maintenance sheet is at a retracted position so as not to overlap the nozzle head in plan view. And a moving mechanism that realizes the arranged state,
A substrate manufacturing apparatus is provided in which the stage moves the held substrate to pass under the maintenance sheet and the nozzle head, which are disposed at the retracted position.

According to another aspect of the invention,
In a plan view, a maintenance sheet is disposed at a retracted position that does not overlap with the nozzle head, and from the nozzle head during a period when the substrate passes below the maintenance sheet disposed at the retracted position and below the nozzle head. Forming a thin film pattern on the substrate by ejecting ink droplets toward the substrate;
Moving at least one of the nozzle head and the maintenance sheet and disposing the maintenance sheet under the nozzle head;
Forming a test pattern on the maintenance sheet by discharging ink droplets from the nozzle head toward the maintenance sheet;
By inspecting the inspection pattern, there is provided a maintenance method for a substrate manufacturing apparatus including a step of determining whether the nozzle head is good or defective.

According to yet another aspect of the invention,
In a plan view, a maintenance sheet is disposed at a retracted position that does not overlap with the nozzle head, and the nozzle head moves from the nozzle head during a period in which the substrate passes below the maintenance sheet disposed at the retracted position and below the nozzle head. Forming a thin film pattern on the substrate by discharging ink droplets toward the substrate;
And a step of removing ink remaining on the bottom surface of the nozzle head by moving at least one of the nozzle head and the maintenance sheet and bringing the maintenance sheet into contact with the bottom surface of the nozzle head. A maintenance method is provided.

  Since the substrate passes under the maintenance sheet disposed at the retracted position, it is possible to suppress an increase in the size of the apparatus due to securing the retracted position of the maintenance sheet.

1 is a perspective view of a substrate manufacturing apparatus according to a first embodiment. FIG. 2 is a front view of the floating stage, the nozzle unit, and the maintenance unit of the substrate manufacturing apparatus according to the first embodiment. FIG. 3 is a side view of the levitation stage, the nozzle unit, and the maintenance unit of the substrate manufacturing apparatus according to the first embodiment. FIG. 4 is a flowchart of the maintenance method for the substrate manufacturing apparatus according to the first embodiment. FIG. 5 is a front view of the floating stage, nozzle unit, and maintenance unit of the substrate manufacturing apparatus according to the first embodiment. FIG. 6 is a side view of the floating stage, nozzle unit, and maintenance unit of the substrate manufacturing apparatus according to the first embodiment. 7A is a plan view of the maintenance sheet and the nozzle head, FIGS. 7B to 7C are plan views of the maintenance sheet on which the inspection pattern is formed, and FIG. 7D is a front view of the nozzle head and the maintenance sheet. . FIG. 8 is a front view of the nozzle unit and the maintenance unit of the substrate manufacturing apparatus according to the second embodiment. FIG. 9 is a front view of the nozzle unit and the maintenance unit of the substrate manufacturing apparatus according to the third embodiment. FIG. 10 is a front view of the nozzle unit and the maintenance unit of the substrate manufacturing apparatus according to the third embodiment. FIG. 11 is a front view of the nozzle unit and the maintenance unit of the substrate manufacturing apparatus according to the fourth embodiment. FIG. 12 is a front view of the nozzle unit and the maintenance unit of the substrate manufacturing apparatus according to the fifth embodiment. 13A to 13C are sectional views of a nozzle head and a maintenance sheet for explaining a maintenance method of the substrate manufacturing apparatus according to the fifth embodiment.

[Example 1]
FIG. 1 is a perspective view of a substrate manufacturing apparatus according to the first embodiment. A floating stage 20 is supported on a surface plate (not shown). An xyz orthogonal coordinate system is defined in which the horizontal upper surface of the levitation stage 20 is defined as the xy plane, and the vertical upper direction is defined as the positive direction of the x axis. A substrate 30 on which a thin film is to be formed is held on the upper surface of the levitation stage 20 in a levitated state. The transport hand 21 grips the substrate 30 held on the upper surface of the levitation stage 20 and moves it on the holding surface of the levitation stage 20 in the y direction parallel to the upper surface of the substrate 30.

  Instead of the floating stage 20 and the transport hand 21, a moving mechanism using a stage, a linear guide, and an actuator may be employed. In this configuration, the substrate is held on the upper surface of the stage by a vacuum chuck or the like. By driving the actuator, the stage moves along the linear guide.

  The nozzle unit 40 and the maintenance unit 50 are supported by the portal frame 22 above the path along which the substrate 30 moves. The portal frame 22 is fixed to a surface plate.

  The configuration of the nozzle unit 40 will be described. A plurality of nozzle heads 41 are attached to the support plate 42. FIG. 1 shows an example in which eight nozzle heads 41 are attached to the support plate 42. Each of the nozzle heads 41 has a plurality of nozzle holes arranged in the x direction. The surface on which the nozzle holes are formed faces downward. That is, the surface on which the nozzle holes are formed faces the movement path of the substrate 30. The plurality of nozzle heads 41 are positioned so that the nozzle holes are arranged at equal intervals in the x direction as a whole.

  The nozzle head 41 ejects ink droplets toward the substrate 30 passing therebelow. A thin film pattern can be formed by curing the ink that has landed on the substrate 30. In the case of using a photocurable ink (for example, an ultraviolet curable ink), the ink can be cured by irradiating the ink landed on the substrate 30 with light (for example, an ultraviolet ray). A light source for curing the ink is attached to the support plate 42.

  The lifting mechanism 43 moves the nozzle head 41 and the support plate 42 up and down with respect to the floating stage 20.

  Next, the configuration of the maintenance unit 50 will be described. The maintenance sheet 58 is supported above the movement path of the substrate 30 by the sheet holding device 53. The sheet holding device 53 includes a feeding device 51A, a winding device 51B, and a moving mechanism 52. The feeding device 51 </ b> A holds a roll of the maintenance sheet 58. The maintenance sheet 58 is fed out from the feeding device 51A. The maintenance sheet 58 fed out from the feeding device 51A is sent in the x direction (direction orthogonal to the moving direction of the substrate 30) above the movement path of the substrate 30 and then taken up by the winding device 51B.

  The moving mechanism 52 moves the feeding device 51A and the winding device 51B in the y direction. By the movement of the feeding device 51A and the winding device 51B, the maintenance sheet 58 moves between a maintenance position that overlaps the nozzle head 41 and a retreat position that does not overlap the nozzle head 41 in plan view.

  The maintenance unit 50 further includes an imaging device 54. The imaging device 54 is attached to the support plate 42 to which the nozzle head 41 is fixed. For this reason, the imaging device 54 moves up and down together with the nozzle head 41. Further, the imaging device 54 is disposed downstream of the nozzle head 41 with respect to the feeding direction (x direction) of the maintenance sheet 58.

  The control device 25 controls the transport hand 21, the nozzle head 41, the lifting mechanism 43, the feeding device 51 </ b> A, the winding device 51 </ b> B, and the moving mechanism 52. When the maintenance sheet 58 is disposed at the maintenance position in plan view, the maintenance sheet 58 is disposed at a position lower than the lower end (surface on which the nozzle holes are formed) of the nozzle head 41 with respect to the height direction. When the maintenance sheet 58 is disposed at the retracted position in plan view, the maintenance sheet 58 is disposed at a position higher than the lower end of the nozzle head 41 in the height direction. At this time, for example, with respect to the height direction, the maintenance sheet 58 is disposed between the lower end and the upper end of the nozzle head 41.

  Further, the control device 25 controls the nozzle head 41 and the sheet holding device 53 in a state where the maintenance sheet 58 is disposed at the maintenance position, and causes ink droplets to be ejected from the nozzle head 41 onto the maintenance sheet 58. Thereby, an inspection pattern is formed on the maintenance sheet 58.

  When the maintenance sheet 58 on which the inspection pattern is formed is wound around the winding device 51B, the inspection pattern moves in the feeding direction. By sending the maintenance sheet 58 in the x direction, the imaging device 54 can take an image of the inspection pattern in a plurality of areas with respect to the feeding direction of the maintenance sheet 58. By imaging a plurality of regions that are continuous in the x direction, the entire inspection pattern can be imaged.

  FIG. 2 shows a front view of the floating stage 20, the nozzle unit 40, and the maintenance unit 50 of the substrate manufacturing apparatus according to the first embodiment. FIG. 2 shows a state in which the maintenance sheet 58 is disposed at the retracted position. A floating stage 20 and a portal frame 22 are fixed on a surface plate 23. The substrate 30 is held in a state of floating on the floating stage 20.

  A plurality of nozzle heads 41 attached to the support plate 42 are held above the substrate 30. The support plate 42 and the nozzle head 41 are attached to the portal frame 22 via an elevating mechanism 43. The lifting mechanism 43 moves the nozzle head 41 and the support plate 42 up and down with respect to the substrate 30.

  The sheet holding device 53 holds the maintenance sheet 58 above the movement path of the substrate 30. The maintenance sheet 58 is laid across the moving path of the substrate 30 between the feeding device 51A and the winding device 51B. The feeding device 51 </ b> A and the winding device 51 </ b> B are attached to the portal frame 22 via the moving mechanism 52. The sheet holding device 53 may be attached to a portal frame different from the portal frame 22 that supports the nozzle head 41. An imaging device 54 is attached to the support plate 42. The maintenance sheet 58 is disposed at a position higher than the lower end of the nozzle head 41.

FIG. 3 is a side view of the floating stage 20, the nozzle unit 40, and the maintenance unit 50 of the substrate manufacturing apparatus according to the first embodiment. FIG. 3 shows a state in which the maintenance sheet 58 is disposed at the retracted position.

  The maintenance sheet 58 is disposed at a position (retracted position) different from the nozzle head 41 with respect to the movement direction (y direction) of the substrate 30. At this time, the maintenance sheet 58 is disposed at a position higher than the lower end of the nozzle head 41. For this reason, the board | substrate 30 can move below the maintenance sheet 58, and can move along a movement path | route, without being disturbed by the maintenance sheet 58.

  Next, with reference to FIGS. 4-7D, the maintenance method of the board | substrate manufacturing apparatus by Example 1 is demonstrated. FIG. 4 is a flowchart of the maintenance method for the substrate manufacturing apparatus according to the first embodiment. This maintenance method is executed under the control of the control device 25 (FIG. 1). FIG. 5 shows a front view of the nozzle unit 40 and the maintenance unit 50, and FIG. 6 shows a side view of the nozzle unit 40 and the maintenance unit 50. 7A to 7C are plan views of the nozzle head 41 and the maintenance sheet 58, and FIG. 7D is a front view of the nozzle head 41 and the maintenance sheet 58.

  In step S1 (FIG. 4), the nozzle head 41 is raised until the lower end of the nozzle head 41 is higher than the maintenance sheet 58, as shown in FIG. In step S2 (FIG. 4), the maintenance sheet 58 is moved to a maintenance position below the nozzle head 41 as shown in FIG.

  In step S3 (FIG. 4), as shown in FIG. 7A, while the maintenance sheet 58 is moved in the y direction, ink droplets are ejected from the nozzle head 41 to form an inspection pattern on the maintenance sheet 58. FIG. 7B shows a plan view of the maintenance sheet 58 on which the inspection pattern 60 is formed. As an example, the inspection pattern 60 includes a plurality of short line segments parallel to the y direction. This line segment is formed for each nozzle hole and has a one-to-one correspondence with the nozzle hole.

  In step S4 (FIG. 4), as shown in FIGS. 7C and 7D, the inspection pattern 60 is imaged by the imaging device 54 while winding the maintenance sheet 58 by the winding device 51B (FIGS. 1 and 2). For example, by repeating the winding of the maintenance sheet 58, the winding stop of the maintenance sheet 58, and the imaging in this order, the entire region of the inspection pattern 60 can be imaged in the x direction.

  In step S5 (FIG. 4), the inspection pattern 60 is inspected. Specifically, the image captured by the imaging device 54 is analyzed. The presence / absence of a defective nozzle hole is determined based on the analysis result. In step S <b> 6, the maintenance sheet 58 is retracted from below the nozzle head 41 to the retreat location. Thereafter, in step S7, the nozzle head 41 is lowered to a position lower than the maintenance sheet 58, as shown in FIG. In this state, a thin film pattern is formed on the substrate 30.

  In the substrate manufacturing apparatus according to the first embodiment, as shown in FIGS. 2 and 3, the retreat location of the maintenance sheet 58 is secured above the movement path of the substrate 30. That is, when the maintenance sheet 58 is disposed at the retracted position, the maintenance sheet 58 overlaps the movement path of the substrate 30 in plan view. When forming a thin film pattern on the substrate 30, the substrate 30 passes below the maintenance sheet 58. For this reason, even if the place where the maintenance sheet 58 is retracted is secured, the exclusive area of the substrate manufacturing apparatus hardly increases.

Since a roll sheet is used as the maintenance sheet 58, the unused area can be easily exposed by winding up the used area of the maintenance sheet 58. For this reason, the number of replacements of the maintenance sheet 58 can be reduced. Further, as shown in FIGS. 7C and 7D, the inspection pattern 60 can be imaged by the imaging device 54 when the maintenance sheet 58 is wound up.

  The nozzle holes of the plurality of nozzle heads 41 are arranged at an equal pitch in the x direction as a whole. The inspection pattern 60 (FIG. 7B) is composed of short line segments formed corresponding to the respective nozzle holes. For this reason, a plurality of short line segments are distributed in a region that is long in the x direction and short in the y direction. Since the imaging device 54 captures an image while sending the inspection pattern 60 in the x direction, the imaging device 54 having an imaging range narrower than that of the inspection pattern 60 can image the entire region of the inspection pattern 60. Further, the inspection pattern 60 (FIG. 7C) can be imaged without moving the sheet holding device 53 and the imaging device 54 during imaging.

[Example 2]
With reference to FIG. 8, the board | substrate manufacturing apparatus by Example 2 is demonstrated. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.

  FIG. 8 is a front view of the nozzle unit 40 and the maintenance unit 50 of the substrate manufacturing apparatus according to the second embodiment. In the second embodiment, a support plate 55 is disposed under the maintenance sheet 58. The support plate 55 is fixed to the feeding device 51 </ b> A and the winding device 51 </ b> B, and provides a flat upper surface that supports the maintenance sheet 58.

  In the first embodiment, the maintenance sheet 58 is kept flat by the tension applied to the maintenance sheet 58. When the distance from the feeding device 51A to the winding device 51B is increased, the central portion of the maintenance sheet 58 hangs down, so that it is difficult to maintain flatness. In the second embodiment, since the maintenance sheet 58 is supported by the support plate 55, the maintenance sheet 58 can be kept flat even when the distance from the feeding device 51A to the winding device 51B is increased.

[Example 3]
With reference to FIGS. 9 and 10, a substrate manufacturing apparatus according to Embodiment 3 will be described. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.

  FIG. 9 shows a front view of the nozzle unit 40 and the maintenance unit 50 of the substrate manufacturing apparatus according to the third embodiment. In the first embodiment, the height of the sheet holding device 53 is fixed. In the third embodiment, the sheet holding device 53 is supported by the lifting mechanism 56 so as to be movable up and down with respect to the floating stage 20. FIG. 9 shows a state where the maintenance sheet 58 is disposed at the retracted position. At this time, the maintenance sheet 58 is disposed at a position higher than the lower end of the nozzle head 41.

  When performing maintenance, the elevating mechanism 56 is operated to lower the maintenance sheet 58 to a position lower than the lower end of the nozzle head 41 and higher than the upper surface of the floating stage 20.

  FIG. 10 shows a state where the maintenance sheet 58 is lowered to a position lower than the lower end of the nozzle head 41 and higher than the upper surface of the floating stage 20. In this state, by operating the moving mechanism 52, the maintenance sheet 58 is moved below the nozzle head 41 (maintenance position). An inspection pattern can be formed on the maintenance sheet 58 in a state where the maintenance sheet 58 is disposed at the maintenance position.

In the first embodiment, the nozzle head 41 is moved up and down, but a configuration in which the maintenance sheet 58 is moved up and down as in the third embodiment may be adopted. When the maintenance sheet 58 is disposed at the maintenance position, the maintenance sheet 58 may be lifted by the floating stage 20. When the maintenance sheet 58 is lifted by the floating stage 20, the floating stage 20 plays a role of flattening the maintenance sheet 58, like the support plate 55 (FIG. 8) of the second embodiment. When a stage using a vacuum chuck is employed instead of the floating stage 20, the maintenance sheet 58 may be brought into contact with the upper surface of the stage.

[Example 4]
FIG. 11 is a front view of the nozzle unit 40 and the maintenance unit 50 of the substrate manufacturing apparatus according to the fourth embodiment. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.

  In the first embodiment, the imaging device 54 (FIG. 2) is attached to the nozzle unit 40. In Example 4, as illustrated in FIG. 11, the imaging device 54 is attached to the winding device 51B. For this reason, the imaging device 54 moves together with the winding device 51B. When the maintenance sheet 58 is not being wound, the imaging device 54 moves together with the maintenance sheet 58.

  In the fourth embodiment, as illustrated in FIG. 3, the inspection pattern can be imaged with the sheet holding device 53 retracted to the retracted position.

[Example 5]
With reference to FIG.12 and FIG.13A-FIG.13C, the maintenance method of the board | substrate manufacturing apparatus by Example 5 is demonstrated. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.

  In Example 1, as shown in FIG. 5, the inspection pattern 60 (FIG. 7B) was formed with a gap provided between the maintenance sheet 58 and the nozzle head 41. In the fifth embodiment, the maintenance sheet 58 contacts the bottom surface of the nozzle head 41 as shown in FIG. As the maintenance sheet 58, a water-absorbing sheet is used.

  FIG. 13A shows a cross-sectional view of the nozzle head 41 and the maintenance sheet 58 before the maintenance sheet 58 contacts the bottom surface of the nozzle head 41. A plurality of nozzle holes 44 are provided on the bottom surface of the nozzle head 41. When ink droplets are ejected from the nozzle holes 44, the residual ink 45 remains with some of the ink attached to the bottom surface of the nozzle head 41.

  As shown in FIG. 13B, when the maintenance sheet 58 is brought into contact with the bottom surface of the nozzle head 41, the residual ink 45 (FIG. 13A) is sucked by the maintenance sheet 58. The sucked ink 45 a is included in the maintenance sheet 58.

  When the maintenance sheet 58 is pulled away from the bottom surface of the nozzle head 41 as shown in FIG. 13C, the residual ink 45 (FIG. 13A) is removed.

  By bringing the maintenance sheet 58 into contact with the bottom surface of the nozzle head 41, ink remaining on the bottom surface of the nozzle head 41 can be sucked and removed. After the ink is sucked by the maintenance sheet 58, the maintenance sheet 58 is fed from the feeding device 51A and taken up by the winding device 51B. As a result, a new area of the maintenance sheet 58 can be exposed. By using the roll type maintenance sheet 58, the replacement frequency of the maintenance sheet 58 can be reduced.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

20 Floating stage 21 Transport hand 22 Portal frame 23 Surface plate 25 Control device 30 Substrate 40 Nozzle unit 41 Nozzle head 42 Support plate 43 Lifting mechanism 44 Nozzle hole 45 Residual ink 45a Ink sucked 50 Maintenance unit 51A Feeding device 51B Winding Device 52 Moving mechanism 53 Sheet holding device 54 Imaging device 55 Support plate 56 Elevating mechanism 58 Maintenance sheet 60 Inspection pattern

Claims (10)

A stage for holding the substrate and moving the held substrate;
A sheet holding device for holding the maintenance sheet;
A nozzle head that ejects ink droplets toward the substrate held on the stage;
At least one of the maintenance sheet and the nozzle head is moved so that the maintenance sheet is disposed at a maintenance position below the nozzle head, and the maintenance sheet is at a retracted position so as not to overlap the nozzle head in plan view. And a moving mechanism that realizes the arranged state,
The stage is a substrate manufacturing apparatus that moves a held substrate to pass under the maintenance sheet disposed at the retracted position and below the nozzle head. The moving mechanism is
The substrate manufacturing apparatus according to claim 1, wherein the maintenance sheet is moved in a direction parallel to a moving direction of the substrate held on the stage and the nozzle head is moved up and down.   The sheet holding device includes a feeding device that feeds the maintenance sheet and a winding device that winds the maintenance sheet, and the maintenance sheet is sent in a direction orthogonal to a moving direction of the substrate. The board | substrate manufacturing apparatus of description.   Further, in a state where the maintenance sheet is disposed at the maintenance position, the nozzle head and the sheet holding device are controlled, and ink droplets are ejected from the nozzle head to the maintenance sheet. The board | substrate manufacturing apparatus of any one of Claim 1 thru | or 3 which forms a test | inspection pattern. Furthermore, it has an imaging device that images the inspection pattern formed on the maintenance sheet,
The substrate manufacturing apparatus according to claim 4, wherein the imaging device is disposed downstream of the nozzle head with respect to a feeding direction by feeding and winding the maintenance sheet.   The substrate manufacturing method according to claim 1, wherein the maintenance sheet has water absorption, and the moving mechanism places the maintenance sheet at the maintenance position and makes contact with the bottom surface of the nozzle head. apparatus. In a plan view, a maintenance sheet is disposed at a retracted position that does not overlap with the nozzle head, and from the nozzle head during a period when the substrate passes below the maintenance sheet disposed at the retracted position and below the nozzle head. Forming a thin film pattern on the substrate by ejecting ink droplets toward the substrate;
Moving at least one of the nozzle head and the maintenance sheet and disposing the maintenance sheet under the nozzle head;
Forming a test pattern on the maintenance sheet by discharging ink droplets from the nozzle head toward the maintenance sheet;
And a step of determining whether the nozzle head is good or bad by inspecting the inspection pattern. Determining whether the nozzle head is good or bad;
Imaging the inspection pattern with the imaging device while sending the maintenance sheet to the imaging device in a direction perpendicular to the direction in which the substrate moves;
The maintenance method of the board | substrate manufacturing apparatus of Claim 7 including the process of determining the quality of the said nozzle head by analyzing the image imaged with the said imaging device. In a plan view, a maintenance sheet is disposed at a retracted position that does not overlap with the nozzle head, and the nozzle head moves from the nozzle head during a period in which the substrate passes below the maintenance sheet disposed at the retracted position and below the nozzle head. Forming a thin film pattern on the substrate by discharging ink droplets toward the substrate;
And a step of removing ink remaining on the bottom surface of the nozzle head by moving at least one of the nozzle head and the maintenance sheet and bringing the maintenance sheet into contact with the bottom surface of the nozzle head. Maintenance method. The maintenance sheet has a roll structure wound around a take-up roll after being fed out from a feed roll,
After removing the ink remaining on the bottom surface of the nozzle head in a region of the maintenance sheet between the feeding roll and the take-up roll, the maintenance sheet is fed out from the feeding roll by a certain length. And the maintenance method of the board | substrate manufacturing apparatus of Claim 9 including the process wound up with the said winding-up roll.

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