JP2014160766A - Multiple mounted component of lead frame with resin, and multiple mounted component of optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple mounted component of a lead frame with a resin capable of preventing damage or defacement of a part to be a product even if they are directly overlapped with each other, and a multiple mounted component of an optical semiconductor device.SOLUTION: A multiple mounted component R of a lead frame with a resin comprises: a multiple mounted component MS of the lead frame having a plurality of terminal parts 11, 12, and in which a lead frame 10 used for an optical semiconductor device 1 in which an LED element 2 is connected is multiple-mounted on a frame F; and a light-reflecting resin layer 20 having a frame resin part 20a, a front surface resin part 20b-1 projecting to at least of a part on opposite sides forming an outer shape of the frame on a front surface of the frame, and a rear surface resin part 20b-2 formed at a position opposed to the front surface resin part across the frame on a rear surface of the frame. The front surface resin part is fitted to the rear surface resin part of an other multiple mounted component of the lead frame with the resin, and has a guide part P for guiding a relative displacement between the front surface and the rear surface resin parts.

Description

  The present invention relates to a multi-sided body of a lead frame with a resin for an optical semiconductor device on which an optical semiconductor element is mounted, and a multi-sided body of an optical semiconductor device.

2. Description of the Related Art Conventionally, an optical semiconductor element such as an LED element is fixed to a lead frame having two terminal portions that are electrically insulated and covered with a resin layer, and its periphery is covered with a transparent resin layer. (For example, patent document 1).
In such an optical semiconductor device, a resin layer is formed on a multi-sided lead frame (a multi-sided body of a lead frame) to produce a multi-sided body of a lead frame with resin, and the optical semiconductor elements are electrically connected. A plurality of products are manufactured simultaneously by forming transparent resin layers and cutting them into package units.
Here, in the manufacturing process of the optical semiconductor device, the multi-sided body of the resin-attached lead frame on which the resin layer is formed is stacked so as to be laminated at a predetermined interval in preparation for the next step such as connection of the optical semiconductor element. May be stored in a case. Since this storage case corresponds to a multi-faced body of various lead frames with resin, the storage interval of the multi-faced body of each lead frame with resin to be stored is set wide. For this reason, the number of multi-sided bodies of lead frames with resin to be stored is limited with respect to the overall shape of the storage case, which causes a problem of low storage efficiency.
Therefore, in order to improve the storage efficiency, it is conceivable to store a plurality of multi-sided bodies of resin-attached lead frames directly without using a storage case. However, in this case, the front and back surfaces of the multi-sided body of the lead frame with resin are in contact with the multi-sided body of the other lead frame with resin, and the terminal part that becomes the product part of the multi-sided body of the lead frame with resin In some cases, the resin portion formed around the terminal portion is soiled or damaged.

JP 2011-151069 A

  An object of the present invention is to provide a multi-sided body of a lead frame with a resin and a multi-sided body of an optical semiconductor device capable of preventing damage and contamination of a product part even when directly stacked.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this. In addition, the configuration described with reference numerals may be improved as appropriate, or at least a part thereof may be replaced with another configuration.

1st invention has a some terminal part (11,12), The lead frame used for the optical semiconductor device (1) by which an optical semiconductor element (2) is connected to at least one surface among the said terminal parts. (10) a multi-faced body (MS) of a lead frame in which the face (F) is multi-faced, a frame resin part (20a) formed between an outer peripheral side surface of the lead frame and the terminal part, and the frame A surface resin part (20b-1) formed on the surface of the body to project at least part of the sides opposite to each other and forming the outer shape of the frame, and sandwiching the frame on the back surface of the frame And a resin layer (20) having a back surface resin portion (20b-2) formed at a position corresponding to the surface resin portion, and at least one of the surface resin portion and the back surface resin portion is the surface resin. Part or said back resin Has a guide part (P) for fitting with the back surface resin part or the front surface resin part of the other multi-faced body (R) of the lead frame with resin (R) and guiding relative movement with the back surface resin part or the front surface resin part. A multi-faced body of a lead frame with a resin characterized by the above.
According to a second aspect of the present invention, in the multifaceted body (R) of the lead frame with resin of the first aspect, at least one of the front surface resin portion (20b-1) and the back surface resin portion (20b-2) A multifaceted body of a lead frame with resin, characterized by having a locking portion (Q) for locking the movement of the guiding portion (P) in the guiding direction.
According to a third aspect of the present invention, in the multifaceted body (R) of the lead frame with resin of the first aspect or the second aspect, the surface resin portion (20b-1) and the back surface resin portion (20b-2) are: Each of them forms the outer shape of the frame (F) and is formed in plural along the opposite sides, and the length (w1) of the surface resin portions in the direction parallel to the sides is equal to the adjacent surface resin portions. And the length (w1) of the back surface resin portion in the direction parallel to the side is longer than the space (w2) between the adjacent back surface resin portions. This is a multi-faced body of a resin-attached lead frame.
According to a fourth aspect of the present invention, in the multifaceted body (R) of the lead frame with resin according to any one of the first to third aspects, the surface resin portion (20b-1) and the back surface resin portion (20b- 2) is a multi-sided body of a lead frame with resin, which is formed on a side parallel to the longitudinal direction of the multi-sided body (MS) of the lead frame.
According to a fifth aspect of the present invention, in the multifaceted body (R) of the lead frame with resin according to any one of the first to fourth aspects, the frame body (F) is the surface resin portion (20b-1). A resin having a through hole (H) in at least a part of a surface on which the resin is formed, and the front surface resin portion is coupled to the back surface resin portion (20b-2) through the through hole. It is a multi-faced body of a lead frame with a pad.

A sixth invention is a lead frame used in an optical semiconductor device (1) having a plurality of terminal portions (11, 12) and having an optical semiconductor element (2) connected to at least one surface of the terminal portions. (10) a multi-faced body (MS) of a lead frame in which the face (F) is multi-faced to the frame (F), a frame resin part (420a) formed between the outer peripheral side surface of the lead frame and the terminal part, and the frame A resin layer (420) having a projecting resin part (420b) formed on at least one of the front and back surfaces of the body and forming the outer shape of the frame and projecting at least partially on opposite sides. The frame body is fitted to the protruding resin portion of the multi-sided body (R) of the other lead frame with resin on the surface opposite to the surface on which the protruding resin portion is formed, and the protrusion Guide the direction of resin movement Having a guide portion (P), a multi with body resin-lead frame according to claim.
In a seventh aspect of the present invention, in the multifaceted body (R) of the lead frame with resin according to the sixth aspect of the invention, the guide portion (P) has a locking portion (Q) for locking movement in the guiding direction. A multi-sided body of a lead frame with a resin characterized by the following.
According to an eighth aspect of the present invention, in the multifaceted body (R) of the lead frame with resin of the sixth aspect or the seventh aspect, the protruding resin portion (420b) is a length of the multifaceted body (MS) of the lead frame. A multi-sided body of a lead frame with resin characterized by being formed on a side parallel to a direction.

  According to a ninth aspect of the present invention, there is provided the resin-attached lead frame multifaceted body (R) according to any of the first to eighth inventions, and the resin leadframe multifaceted body of the leadframe (10). The optical semiconductor element (2) connected to at least one of the terminal portions (11, 12) and the surface of the multifaceted body of the lead frame with resin connected to the optical semiconductor element. And a transparent resin layer (30) covering the optical semiconductor element.

  According to the present invention, the multi-faced body of a lead frame with a resin and the multi-faced body of an optical semiconductor device can prevent damage or contamination of a product part even if they are directly stacked.

1 is a diagram illustrating an overall configuration of an optical semiconductor device 1 according to a first embodiment. 1 is an overall view of a multifaceted body MS of a lead frame according to a first embodiment. It is a figure explaining the detail of the multi-faced body MS of the lead frame of 1st Embodiment. It is a general view of the multi-faced body R of the lead frame with resin of the first embodiment. It is a figure explaining the detail of the multi-faced body R of the lead frame with resin of 1st Embodiment. It is a figure explaining the lamination | stacking state of the multi-faced body R of the lead frame with resin of 1st Embodiment. It is a figure explaining the manufacturing process of the lead frame 10 of 1st Embodiment. It is a figure which shows the multi-faced body of the optical semiconductor device 1 of 1st Embodiment. It is a figure explaining the manufacturing process of the optical semiconductor device 1 of 1st Embodiment. It is a figure explaining the outline of transfer molding. It is a figure explaining the outline of injection molding. It is a general view of the multi-faced body R of the lead frame with resin of the second embodiment. It is a figure explaining the detail of the multi-faced body R of the lead frame with a resin of 2nd Embodiment. It is a figure explaining the latching | locking part Q provided in the protrusion resin part 220b of 2nd Embodiment. It is a general view of the multi-faced body R of the lead frame with resin of the third embodiment. It is a whole figure of the multi-faced body R of the lead frame with resin of a 4th embodiment. It is a general view of the multi-faced body R of the lead frame with resin of the fifth embodiment. It is a figure which shows the multi-faced body R of the lead frame with a resin of a deformation | transformation form. It is a figure which shows the multi-faced body R of the lead frame with a resin of a deformation | transformation form.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings and the like.
FIG. 1 is a diagram illustrating an overall configuration of an optical semiconductor device 1 according to the first embodiment.
FIG. 1A, FIG. 1B, and FIG. 1C show a plan view, a side view, and a back view of the optical semiconductor device 1, respectively. FIG.1 (d) shows the dd sectional drawing of Fig.1 (a).
FIG. 2 is an overall view of the multi-faceted body MS of the lead frame of the first embodiment.
FIG. 3 is a diagram for explaining the details of the multi-faced body MS of the lead frame according to the first embodiment. 3 (a) and 3 (b) show a plan view and a back view of the multi-faced body MS of the lead frame, respectively, and FIGS. 3 (c) and 3 (d) respectively show FIG. 3 (a). A cc sectional view and a dd sectional view are shown.
FIG. 4 is an overall view of the multi-faced body R of the lead frame with resin according to the first embodiment. 4 (a), 4 (b), and 4 (c) show a plan view, a back view, and a side view, respectively, of the multifaceted body R of the lead frame with resin.
FIG. 5 is a diagram for explaining the details of the multifaceted body R of the lead frame with resin according to the first embodiment. FIGS. 5A and 5B are a plan view and a back view, respectively, of the multifaceted body R of the lead frame with resin, and FIGS. 5C and 5D are respectively shown in FIG. The cc sectional view of a) and the dd sectional view are shown. FIG.5 (e) is a figure which shows the e section detail of FIG.5 (d).
FIG. 6 is a view for explaining a stacked state of the multi-faced body R of the lead frame with resin according to the first embodiment. 6 (a) and 6 (b) are diagrams in the case of laminating the multi-faced body R of the lead frame with resin of the present invention, and FIGS. 6 (c) and 6 (d) are conventionally performed. It is a figure explaining the case where the lead frame with a resin laminated | stacked.
In each figure, the horizontal direction in the plan view of the optical semiconductor device 1 is the X direction, the vertical direction is the Y direction, and the thickness direction is the Z direction.

The optical semiconductor device 1 is an illumination device in which the mounted LED element 2 emits light when attached to a substrate such as an external device. As shown in FIG. 1, the optical semiconductor device 1 includes an LED element 2 (optical semiconductor element), a lead frame 10, a light reflecting resin layer 20 (resin layer), and a transparent resin layer 30.
In the optical semiconductor device 1, the light reflecting resin layer 20 is formed on the multi-sided lead frame 10 (lead-frame multi-sided body MS, see FIG. 2) to form a multi-sided body R of the lead frame with resin (see FIG. 4). Is manufactured by electrically connecting the LED elements 2, forming the transparent resin layer 30, and cutting (dicing) into package units (details will be described later).
The LED element 2 is an LED (light emitting diode) element generally used as a light emitting layer. For example, a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, and AlInGaP, or various GaN compound semiconductor single elements such as InGaN are used. By appropriately selecting a material made of crystals, an emission wavelength ranging from ultraviolet light to infrared light can be selected.

The lead frame 10 includes a pair of terminal portions, that is, a terminal portion 11 on which the LED element 2 is placed and connected, and a terminal portion 12 connected to the LED element 2 through a bonding wire 2a.
Each of the terminal portions 11 and 12 is formed of a conductive material, for example, copper, a copper alloy, 42 alloy (Ni 40.5% to 43% Fe alloy), etc. In this embodiment, heat conduction and It is formed from a copper alloy from the viewpoint of strength.
As shown in FIG. 3, the terminal portions 11 and 12 have a gap S formed between sides facing each other, and are electrically independent. Since the terminal portions 11 and 12 are formed by pressing or etching a single metal substrate (copper plate), the thicknesses of both are the same.

As shown in FIG. 1, the terminal portion 11 has an LED terminal surface 11a on which the LED element 2 is mounted and connected on the surface thereof, and an external terminal surface 11b mounted on an external device on the back surface. The so-called die pad is formed. Since the LED element 2 is placed on the terminal portion 11, the outer shape of the terminal portion 11 is larger than that of the terminal portion 12.
The terminal portion 12 has an LED terminal surface 12a connected to the bonding wire 2a of the LED element 2 formed on the surface thereof, and an external terminal surface 12b mounted on an external device formed on the back surface of the terminal portion 12 so-called lead side. Configure the terminal part.
The terminal portions 11 and 12 have plating layers C formed on the front and back surfaces thereof (see FIG. 7E), and the plating layer C on the front surface side serves as a reflective layer that reflects the light emitted from the LED element 2. The plating layer C on the back side has a function of improving the solderability when mounted on an external device.

As shown in FIG. 3, the terminal portions 11 and 12 are each provided with a concave portion M having a reduced thickness on the outer peripheral portion on the back surface side.
The recess M is a recess formed in the outer peripheral portion of each of the terminal portions 11 and 12 when viewed from the back side of the lead frame 10, and the thickness of the recess is 1/3 to 2 of the thickness of the terminal portions 11 and 12. / 3 or so.

  As shown in FIG. 5, when the lead frame 10 is filled with the resin that forms the light reflecting resin layer 20 around the terminal portions 11 and 12, or the gap S between the terminal portions 11 and 12, etc. The recess M is also filled with resin, and the contact area between the light reflecting resin layer 20 and the terminal portions 11 and 12 is increased. Further, the lead frames 10 and the light reflecting resin layers 20 can be alternately configured in the thickness (Z) direction. Thereby, the recessed part M can suppress that the light reflection resin layer 20 peels from the lead frame 10 in a plane direction (X direction, Y direction) and a thickness direction.

The connecting portion 13 connects the terminal portions 11 and 12 of each lead frame 10 multifaceted in the frame F to the terminal portions of other adjacent lead frames 10 and the frame F. The connecting portion 13 has an outer shape that forms the lead frame 10 when the LED element 2 or the like is mounted on each of the multiple lead frames 10 and a multi-faced body (see FIG. 7) of the optical semiconductor device 1 is formed. Dicing (cutting) is performed along a line (broken line in FIGS. 3A and 3B).
The connection part 13 is formed in the edge | side except the edge | side which the terminal parts 11 and 12 oppose among each edge | side which forms the terminal parts 11 and 12. FIG.

  Specifically, as shown in FIG. 3A, the connecting portion 13a is formed on the right (+ X) side of the terminal portion 12 and the left (−) of the terminal portion 11 of another lead frame 10 adjacent to the right side. X) is connected to the side, and the left side of the terminal portion 11 is connected to the right side of the terminal portion 12 of another lead frame 10 adjacent to the left side. For the terminal portions 11 and 12 adjacent to the frame body F, the connecting portion 13a connects the frame body F with the left side of the terminal portion 11 or the right side of the terminal portion 12.

The connecting portion 13 b connects the upper (+ Y) side of the terminal portion 11 and the lower (−Y) side of the terminal portion 11 of another lead frame 10 adjacent to the upper side, and the terminal portion 11. The lower side is connected to the upper side of the terminal portion 11 of another lead frame 10 adjacent to the lower side. For the terminal portion 11 adjacent to the frame F, the connecting portion 13b connects the frame F with the upper or lower side of the terminal portion 11.
The connecting portion 13c connects the upper side of the terminal portion 12 and the lower side of the terminal portion 12 of another lead frame 10 adjacent to the upper side, and the lower side and the lower side of the terminal portion 12 The upper side of the terminal portion 12 of another lead frame 10 adjacent to the side is connected. For the terminal portion 12 adjacent to the frame F, the connecting portion 13 c connects the frame F with the upper or lower side of the terminal portion 12.

The connecting portion 13 d (reinforcing portion) is formed so as to cross over the extension of the gap S between the terminal portion 11 and the terminal portion 12. Here, “on the extension of the gap S” means a region where the gap S is extended in the vertical (Y) direction. In the present embodiment, the connecting portion 13d is located on the opposite side of the terminal portion (12, 11) and the gap S between the terminal portions, and is adjacent to the upper or lower lead frame. In order to connect the parts (11, 12), it is formed in a shape that is inclined (for example, 45 degrees) with respect to the upper side of the terminal part 11 and the lower side of the terminal part 12.
Specifically, the connecting part 13d connects the upper side of the terminal part 12 and the lower side of the terminal part 11 of another lead frame 10 adjacent to the upper side, and the lower side of the terminal part 11 Are connected to the upper side of the terminal portion 12 of the other lead frame 10 adjacent to the lower side. For the terminal portions 11 and 12 adjacent to the frame F, the connecting portion 13d connects the frame F with the upper side of the terminal portion 12 or the lower side of the terminal portion 11. .

  By providing the connecting portion 13d, in the step of forming the light reflecting resin layer 20, the multifaceted body MS of the lead frame has a gap between the terminal portion 11 and the terminal portion 12 or the terminal portions 11 and 12 are connected to each other. It is possible to suppress twisting with respect to the frame F. Moreover, the connection part 13d can improve the intensity | strength of the space | gap part S of the optical semiconductor device 1, and can suppress damaging in the space | gap part S. FIG.

  The terminal portions 11 and 12 are electrically connected to the terminal portions 11 and 12 of the other adjacent lead frames 10 by the connecting portion 13. However, after the multifaceted body of the optical semiconductor device 1 is formed, Insulation is performed by cutting (dicing) each connecting portion 13 in accordance with the outer shape of the semiconductor device 1 (lead frame 10) (broken line in FIG. 3A). Moreover, when it divides into pieces, each piece can be made into the same shape.

As shown in FIGS. 3B and 3C, the connecting portion 13 is thinner than the terminal portions 11 and 12, and the surface thereof is formed in the same plane as the surfaces of the terminal portions 11 and 12. Has been. Specifically, the back surface of the connecting portion 13 is formed in substantially the same plane as the bottom surface (recessed portion) of the concave portion M of each terminal portion 11, 12. Thereby, when the resin of the light reflection resin layer 20 is filled, as shown in FIG. 5B and FIG. 5C, the resin also flows into the back surface of the connecting portion 13, and the light reflection resin layer 20 is The peeling from the lead frame 10 can be suppressed.
Further, as shown in FIG. 5B, rectangular external terminal surfaces 11 b and 12 b are exposed on the back surface of the lead frame 10 on which the light reflecting resin layer 20 is formed. In addition to being able to improve the appearance, when mounting on the board with solder, solder printing on the board side is easy, solder is evenly applied, and the generation of voids in the solder after reflow is suppressed. Can be. In addition, since it is axisymmetric with respect to the center line in the plane of the optical semiconductor device 1 (in the XY plane), the reliability against thermal stress and the like can be improved.

The lead frame multi-faced body MS is obtained by multi-faced the above-described lead frame 10 in the frame F. In this embodiment, as shown in FIGS. 2 and 3, a plurality of sets G (four sets in this embodiment) of the lead frames 10 connected by the connecting portions 13 in the vertical and horizontal directions are arranged in the left-right direction. They are arranged and formed in the frame F.
The frame F is a member that fixes the lead frame 10 for each aggregate G of the lead frames 10, and the outer shape thereof is formed in a rectangular shape. The frame F is provided with a plurality of through holes H on the surface of the light reflecting resin layer 20 on which the front surface resin portion 20b-1 and the rear surface resin portion 20b-2 (described later) are formed.
When the resin forming the light reflecting resin layer 20 is filled in the multi-faced body MS of the lead frame, the through hole H is filled with the resin in the through hole H, and the front surface resin portion 20b-1 and the back surface resin portion. 20b-2 is bound. Thereby, it can prevent that the surface resin part 20b-1 and the back surface resin part 20b-2 (light reflection resin layer 20) peel from the frame F. FIG.

As shown in FIGS. 4 and 5, the light reflecting resin layer 20 includes a frame resin portion 20a, a protruding resin portion 20b, and a reflector resin portion 20c.
The frame resin portion 20 a is formed not only on the outer peripheral side surfaces of the terminal portions 11 and 12 (the outer periphery of the lead frame 10 and the gap portion S), but also on the concave portions M provided in each terminal portion and the back surface of the connecting portion 13. . The frame resin portion 20 a is formed to have a thickness substantially equal to the thickness of the lead frame 10.
The protruding resin portion 20b is a resin portion provided on the front surface and the back surface of the frame F, and includes a front surface resin portion 20b-1 and a back surface resin portion 20b-2.

The surface resin portion 20b-1 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the surface of the frame F. The surface resin portion 20b-1 is connected to the reflector resin portion 20c, and is molded with resin together with the reflector resin portion 20c. The front surface resin portion 20b-1 includes a guide portion P that fits with the back surface resin portion 20b-2 of the multi-faced body R of another lead frame with resin and guides relative movement with the back surface resin portion 20b-2. .
As shown in FIG. 5, the guide portion P is a notch formed on the center side of the multifaceted body R of the lead frame with resin along the longitudinal side of the surface of the surface resin portion 20b-1. It comprises a contact surface P1 and a guide surface P2.
The contact surface P1 is a surface with which the back surface of the back surface resin portion 20b-2 contacts, and is formed in parallel with the surface of the frame F.
The guide surface P2 is a surface with which the side surface parallel to the longitudinal direction of the frame body F of the back surface resin portion 20b-2 abuts, and the movement of the multi-sided body R of the laminated lead frame with resin is used for multi-sided attachment of the lead frame. Guide in the longitudinal direction (X direction) of the body MS.

The back surface resin portion 20b-2 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the back surface of the frame F. The back resin part 20b-2 is formed at a position facing the front resin part 20b-1 with the frame F interposed therebetween. The back surface resin portion 20b-2 is formed in a shape corresponding to the notch of the guide portion P of the front surface resin portion 20b-1. As described above, the back surface resin portion 20b-2 is connected to the front surface resin portion 20b-1 via the through hole H of the frame F, and is molded with resin together with the front surface resin portion 20b-1.
The front surface resin portion 20b-1 and the back surface resin portion 20b-2 are formed such that the height dimension in a state of being fitted to each other is larger than the height dimension of the reflector resin portion 20c. Specifically, as shown in FIG. 5E, the sum of the height h1 of the contact surface P1 of the guide portion P of the front surface resin portion 20b-1 and the height h2 of the back surface resin portion 20b-2 ( h1 + h2) is larger than the height h3 of the reflector resin portion 20c (h3 <h1 + h2).

  With the above configuration, as shown in FIG. 6 (a), the protruding resin portion 20b is formed on the guide portion P of the surface resin portion 20b-1 when a plurality of multi-faced bodies R of lead frames with resin are stacked. The contact surface P1 contacts the back surface of the back surface resin portion 20b-2 of the multi-faced body R of the other lead frame with resin. Further, the back surface of the back surface resin portion 20b-2 comes into contact with the contact surface P1 of the guide portion P of the surface resin portion 20b-1 of the multifaceted body R of the other lead frame with resin. Therefore, the parts (the surface of the reflector resin portion 20c and the external terminal surfaces 11b and 12b) that are products of the multi-sided body R of the lead frame with resin come into contact with the multi-sided body R of the other lead frame with resin. To avoid.

Here, as shown in FIG. 6D, a multi-sided body of a lead frame with a resin may be stacked at a predetermined interval and stored in a storage case 50. In this case, With respect to the overall shape of 50, the number of the multi-faced body R4 of the lead frame with resin to be accommodated is limited, resulting in a problem that the storage efficiency is lowered.
For this reason, in order to improve the storage efficiency, it is conceivable to store a plurality of multi-sided bodies of lead frames with resin in a directly stacked manner without using a storage case. However, when the multi-sided body of the lead frame with resin in which the protruding resin portion 20b is not formed, that is, as shown in FIG. 6C, the multi-sided body R2 of the lead frame with resin is stacked. In this case, the multi-faced body R2 of another lead frame with resin is laminated on the front and back surfaces of the multi-faced body R2 of lead frame with resin.
In this case, since the part which becomes the product such as the reflector resin part of the multi-faced body R2 of each lead frame with resin comes into contact with the multi-faced body R of the other lead frame with resin, the part which becomes the product becomes Cause problems of fouling and scratching.

  On the other hand, as described above, the multifaceted body R of the resin-attached lead frame of the present invention has a product portion (the surface of the reflector resin portion 20c, the external terminal surface 11b, etc.) even when a plurality of sheets are directly laminated. , 12b) can be prevented from coming into contact with the multi-faceted body R of the other lead frame with resin, and the portion to be the product can be prevented from being soiled or damaged.

  In general, when the metal material constituting the lead frame 10 or the frame F or the like comes into contact with other members, metal powder is generated from the metal material, and the metal powder may short-circuit the terminal portion. An optical semiconductor device having defects such as inability to emit light will be manufactured. On the other hand, in this embodiment, even when the multi-faced body R of the lead frame with resin is laminated, since the resins are in contact with each other, the optical semiconductor device 1 having a defect due to the above-described metal powder is provided. Production can be avoided.

Further, since the guide part P is formed along the longitudinal direction of the multi-faceted body R of the lead frame with resin, as shown in FIG. 6 (a), it fits into the guide part P when laminated. The back resin portion 20b-2 thus made can move with respect to the longitudinal direction (X direction). Therefore, as shown in FIG. 6B, the multi-faced body R of the lead frame with resin can be easily carried out from the laminated body of the multi-faced body R of the lead frame with resin as necessary by the pusher mechanism 60 or the like. Can do. Further, by providing the guide portion P, it is possible to prevent the multi-faced body R of the laminated lead frame with resin from collapsing in the short direction (Y direction).
Further, the front surface resin portion 20b-1 and the rear surface resin portion 20b-2 can efficiently and stably stack the multi-faced body R of the lead frame with resin without using the storage case 50.

As shown in FIG. 5, the front surface resin portion 20 b-1 includes a locking portion Q that locks the movement of the back surface resin portion 20 b-2 fitted to the guide portion P.
The locking portion Q is the transport direction (+ X direction) of the multi-faced body R of the laminated lead frame with resin among the movements in the longitudinal direction (X direction) of the back surface resin portion 20b-2 fitted to the guide portion P. Is a part that regulates movement in the opposite direction (−X direction). The locking portion Q is a resin portion formed at an end portion on the notch formed in the guide portion P, and is molded together with the molding of the surface resin portion 20b-1.
In the present embodiment, the locking portion Q is opposite to the transport direction of the surface resin portion 20b-1 related to the assembly G on the opposite side (−X side) to the transport direction of the multifaceted body R of the lead frame with resin. It is formed only on the side (−X side) end. As a result, the multi-faced body R of the laminated lead frame with resin can be moved in the transport direction, but the movement is restricted in the direction opposite to the transport direction (−X direction). It will be. Therefore, it is possible to prevent the multifaceted body R of the lead frame with resin from moving in a direction other than the transport direction from the laminated body of the multifaceted body R of the leadframe with resin.

In the present embodiment, the multi-faced body MS of the lead frame has a surface resin portion 20b-1 and a reflector resin portion 20c formed on the surface thereof, and a back surface resin portion 20b-2 formed on the back surface thereof.
Here, the lead frame 10 is formed of a metal such as copper, the light reflecting resin layer 20 is formed of a resin such as a thermosetting resin, and the linear expansion coefficients of the two materials are different. If the back resin portion 20b-2 is not formed, the lead frame multi-sided body MS is formed with more resin on the front side than on the back side. Therefore, in the resin curing process, warpage occurs in the multi-faced body R (lead face multi-faced body MS) of the lead frame with resin due to the difference in the linear expansion coefficient.

In order to suppress the occurrence of the warp, a specific filler (powder) may be included in the resin of the light reflecting resin layer 20 so that the linear expansion coefficient is close to that of the metal of the lead frame 10. However, in order to maintain the light reflection characteristics of the light reflecting resin layer 20, the filler content is limited, and the linear expansion coefficient of the resin may not be sufficiently close to that of the metal. In addition, when a thermoplastic resin is used as the resin, the molecular structure that the three-dimensional crosslinking density cannot be increased in order to maintain the thermoplasticity, the strength cannot be maintained when a large amount of filler is filled, so that the practical use is not possible. As a level, the linear expansion coefficient cannot be adjusted.
Therefore, in this embodiment, by providing the back surface resin portion 20b-2 on the back surface of the frame F, the amount of resin formed on the front surface and the back surface of the multifaceted body MS of the lead frame is made equal or substantially equal. Thereby, the multi-faced body R of the lead frame with resin of the present embodiment can suppress the occurrence of the above-described warpage during the resin curing process.

As described above, the front surface resin portion 20b-1 and the back surface resin portion 20b-2 are formed separately for each aggregate G along the longitudinal sides (long sides) of the frame F that face each other. Here, as shown in FIG. 4, the front surface resin portion 20b-1 and the back surface resin portion 20b-2 have a length w1 in the longitudinal direction that is adjacent to the front surface resin portion 20b-1 and the back surface resin portion 20b-2. It is formed so as to be longer than the interval w2 (w1> w2). By carrying out like this, when the multi-faced body R of the lead frame with resin is laminated and the back surface resin part 20b-2 is in contact with the front surface resin part 20b-1, the multi-faced body R of the lead frame with resin is conveyed. When moved in the direction, the back surface resin portion 20b-2 is prevented from falling off the contact surface P1 of the front surface resin portion 20b-1.
In addition, the length w3 of the back surface resin portion 20b-2 on the opposite side (−X side) from the conveyance direction of the multifaceted body R of the lead frame with resin is equal to the length of the other back surface resin by the presence of the locking portion Q. Although it is formed shorter than the portion 20b-2 (w3 <w1), the relationship with the above-described adjacent back surface resin portion 20b-2 is the same (w3> w2).

  One of the surface resin portions 20b-1 (on the lower side in this embodiment) of the surface resin portions 20b-1 provided on the long sides facing each other on the surface of the frame F is a lead disposed in the mold. The multi-sided body MS of the frame also serves as a gate portion serving as a filling port for filling the resin for forming the light reflecting resin layer 20. Thereby, the resin of the gate part which becomes unnecessary after filling with the resin can be effectively used.

The light reflecting resin layer 20 is made of a thermoplastic resin having a light reflecting property or a thermosetting resin in order to reflect light emitted from the LED element 2 placed on the lead frame 10.
The resin forming the light reflecting resin layer 20 has high fluidity when the resin is formed with respect to the resin filling in the recessed portion, and the adhesiveness at the recessed portion is easy to introduce a reactive group into the molecule. Since it is necessary to obtain chemical adhesion with the lead frame, a thermosetting resin is desirable.
For example, as the thermoplastic resin, polyamide, polyphthalamide, polyphenylene sulfide, liquid crystal polymer, polyether sulfone, polybutylene terephthalate, polyolefin, or the like can be used.
As the thermosetting resin, silicone, epoxy, polyetherimide, polyurethane, polybutylene acrylate, or the like can be used.
Furthermore, the reflectance of light can be increased by adding any of titanium dioxide, zirconium dioxide, potassium titanate, aluminum nitride, and boron nitride as a light reflecting material to these resins.
Moreover, after molding a thermoplastic resin such as polyolefin, a so-called electron beam curable resin using a method of crosslinking by irradiation with an electron beam may be used.

The transparent resin layer 30 is a transparent or substantially transparent resin layer provided to protect the LED element 2 placed on the lead frame 10 and transmit the emitted light of the LED element 2 to the outside. It is. The transparent resin layer 30 is formed on the LED terminal surfaces 11 a and 12 a surrounded by the reflector resin portion 20 c of the light reflecting resin layer 20.
For the transparent resin layer 30, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the LED element 2 in order to improve the light extraction efficiency. For example, an epoxy resin or a silicone resin can be selected as a resin that satisfies the properties of high heat resistance, light resistance, and mechanical strength. In particular, when a high-brightness LED element is used for the LED element 2, the transparent resin layer 30 is preferably made of a silicone resin having high light resistance because it is exposed to strong light. Moreover, a phosphor for wavelength conversion may be used, or it may be dispersed in a transparent resin.

Next, a method for manufacturing the lead frame 10 will be described.
FIG. 7 is a view for explaining the manufacturing process of the lead frame 10 of the first embodiment.
Fig.7 (a) shows the top view which shows the metal substrate 100 in which the resist pattern was formed, and the aa sectional drawing of the top view. FIG. 7B shows the metal substrate 100 that has been etched. FIG.7 (c) is a figure which shows the metal substrate 100 after an etching process. FIG. 7D shows the metal substrate 100 from which the resist pattern has been removed. FIG. 7E shows the metal substrate 100 that has been subjected to plating.
In FIG. 7, the manufacturing process of one lead frame 10 is illustrated, but in reality, a multi-faced body MS of the lead frame is manufactured from one metal substrate 100.

  In the manufacture of the lead frame 10, the metal substrate 100 is processed to form the lead frame 10. The processing may be press processing, but an etching process that easily forms a thin portion is desirable. Below, the manufacturing method of the lead frame 10 by an etching process is demonstrated.

First, a flat metal substrate 100 is prepared, and as shown in FIG. 7A, resist patterns 40a and 40b are formed on portions of the front and back surfaces that are not etched. The material and the formation method of the resist patterns 40a and 40b use a conventionally known technique as an etching resist.
Next, as shown in FIG. 7B, the metal substrate 100 is etched with a corrosive solution using the resist patterns 40a and 40b as etching resistant films. The corrosive liquid can be appropriately selected according to the material of the metal substrate 100 to be used. In this embodiment, since a copper plate is used as the metal substrate 100, an aqueous ferric chloride solution can be used and spray etching can be performed from both surfaces of the metal substrate 100.

Here, in the lead frame 10, the outer peripheral part of the terminal parts 11 and 12, the space part S between the terminal parts 11 and 12, the penetrating space such as the through hole H of the frame body F, the concave part M, There is a recessed space in which the thickness is reduced without penetrating like the back surface of the connecting portion 13 (see FIG. 3). In the present embodiment, a so-called half-etching process that etches up to about half the plate thickness of the metal substrate 100 is performed, and a resist pattern is not formed on both surfaces of the metal substrate 100 in the penetrating space. Etching is performed from both sides of the substrate 100 to form a penetrating space. For the recessed space, a resist pattern is formed only on the surface opposite to the side where the thickness is reduced, and only the surface without the resist pattern is etched to form a recessed space.
As shown in FIG. 7C, terminal portions 11 and 12 having recesses M are formed on the metal substrate 100 by the etching process, and the lead frame 10 and the through holes H are formed on the metal substrate 100. The

Next, as shown in FIG. 7D, the resist pattern 40 is removed from the metal substrate 100 (lead frame 10).
Then, as shown in FIG. 7 (e), the metal substrate 100 on which the lead frame 10 is formed is subjected to a plating process to form a plating layer C on the terminal portions 11 and 12. The plating process is performed, for example, by performing electroplating using a silver plating solution containing silver cyanide as a main component.
In addition, before forming the plating layer C, for example, an electrolytic degreasing process, a pickling process, and a copper strike process may be selected as appropriate, and then the plating layer C may be formed through an electrolytic plating process.
As described above, the lead frame 10 is manufactured in a state of being multifaceted to the frame body F as shown in FIGS. In FIGS. 2 and 3, the plating layer C is omitted.

Next, a method for manufacturing the optical semiconductor device 1 will be described.
FIG. 8 is a view showing a multi-faced body of the optical semiconductor device of the first embodiment.
FIG. 9 is a diagram illustrating a manufacturing process of the optical semiconductor device 1 according to the first embodiment.
9A is a cross-sectional view of the lead frame 10 on which the light reflecting resin layer 20 is formed, and FIG. 9B is a cross-sectional view of the lead frame 10 to which the LED element 2 is electrically connected. . FIG. 9C shows a cross-sectional view of the lead frame 10 on which the transparent resin layer 30 is formed. FIG. 9D shows a cross-sectional view of the optical semiconductor device 1 singulated by dicing.
In FIG. 9, the manufacturing process of one optical semiconductor device 1 is illustrated, but actually, a plurality of optical semiconductor devices 1 are manufactured from one metal substrate 100. 9A to 9D are based on the cross-sectional view of FIG. 7A.

As shown in FIG. 9A, the light reflecting resin layer 20 is formed by filling the outer periphery of the lead frame 10 formed by etching on the metal substrate 100 with the resin having the above-described light reflection characteristics. The light reflecting resin layer 20 is formed by inserting a lead frame 10 (metal substrate 100) into a resin molding die and injecting resin, for example, transfer molding or injection molding (injection molding), or lead frame 10 It is formed by a method such as screen printing of resin. At this time, the resin flows from the outer peripheral side of each of the terminal portions 11 and 12 to the concave portion M and the back surface of the connecting portion 13, and the frame resin portion 20 a is formed and joined to the lead frame 10.
At the same time, the front surface resin portion 20b-1 and the back surface resin portion 20b-2 are formed so as to protrude to the front surface and the back surface side of the frame F, respectively. At this time, the front surface resin portion 20b-1 and the back surface resin portion 20b-2 are coupled to each other by the through hole H of the frame F.
Thereby, the multi-faced body R of the lead frame with resin is in a state in which the LED terminal surfaces 11a and 12a and the external terminal surfaces 11b and 12b of the terminal portions 11 and 12 are exposed on the front and back surfaces, respectively. (See FIG. 5A and FIG. 5B).
In this way, the resin-attached lead frame multifaceted body R shown in FIGS. 4 and 5 is formed.

  Next, as shown in FIG. 9B, the LED element 2 is placed on the LED terminal surface 11 a of the terminal portion 11 via a heat-dissipating adhesive such as die attach paste or solder, and the terminal portion 12. The LED element 2 is electrically connected to the LED terminal surface 12a via the bonding wire 2a. Here, there may be a plurality of LED elements 2 and bonding wires 2a, a plurality of bonding wires 2a may be connected to one LED element 2, or the bonding wires 2a may be connected to a die pad. Moreover, you may electrically connect the LED element 2 by a mounting surface. Here, the bonding wire 2a is made of a material having good conductivity such as gold (Au), copper (Cu), silver (Ag), and the like.

Then, as shown in FIG. 9C, a transparent resin layer 30 is formed on the surface of the multi-faced body MS of the lead frame so as to cover the LED element 2.
The transparent resin layer 30 may have an optical function such as a lens shape and a refractive index gradient in addition to a flat shape. As described above, as shown in FIG. 8, the multi-faced body of the optical semiconductor device is manufactured.
Finally, as shown in FIG. 9D, the connecting portion 13 of the lead frame 10 is cut (dicing, punching, cutting) together with the light reflecting resin layer 20 and the transparent resin layer 30 in accordance with the outer shape of the optical semiconductor device 1. Etc.) to obtain the optical semiconductor device 1 (see FIG. 1) separated (divided into one package).

Next, transfer molding and injection molding for forming the light reflecting resin layer 20 on the lead frame 10 in FIG. 9A will be described.
FIG. 10 is a diagram for explaining the outline of transfer molding. FIG. 10A is a diagram for explaining the configuration of the mold, and FIGS. 10B to 10I are diagrams for explaining the steps until the multi-faced body R of the lead frame with resin is completed. It is.
FIG. 11 is a diagram for explaining the outline of injection molding. FIG. 11A to FIG. 11C are diagrams for explaining the process until the multifaceted body R of the lead frame with resin is completed.
10 and 11, for the sake of clarity, the light reflecting resin layer 20 is formed on a single lead frame 10, but actually, the lead frame multi-faced body MS is shown. On the other hand, the light reflecting resin layer 20 is formed.

(Transfer molding)
In the transfer molding, as shown in FIG. 10A, a mold 110 including an upper mold 111 and a lower mold 112 is used.
First, the operator heats the upper die 111 and the lower die 112, and then places the multi-faced body MS of the lead frame between the upper die 111 and the lower die 112 as shown in FIG. The pot portion 112a provided with the lower mold 112 is filled with a resin that forms the light reflecting resin layer 20.
Then, as shown in FIG. 10C, the upper mold 111 and the lower mold 112 are closed (clamping), and the resin is heated. When the resin is sufficiently heated, as shown in FIGS. 10 (d) and 10 (e), pressure is applied to the resin by the plunger 113 to fill (transfer) the resin into the mold 110, and the predetermined The pressure is kept constant for a period of time.

  After the elapse of a predetermined time, as shown in FIGS. 10 (f) and 10 (g), the upper mold 111 and the lower mold 112 are opened, and light is emitted from the upper mold 111 by the ejector pins 111 a provided on the upper mold 111. The lead frame multi-faced body MS in which the reflective resin layer 20 is molded is removed. Thereafter, as shown in FIG. 10 (h), the excess resin portion such as the flow path (runner) portion of the upper mold 111 is removed from the product portion, and the light reflection is performed as shown in FIG. 10 (i). A multi-faced body R of a lead frame with a resin on which the resin layer 20 is formed is completed.

(Injection molding)
As shown in FIG. 11A, the injection molding uses a mold 120 including a nozzle plate 121, a sprue plate 122, a runner plate 123 (upper mold), a lower mold 124, and the like in order from the top.
First, the operator arranges the multi-faced body MS of the lead frame between the runner plate 123 and the lower mold 124, and closes the mold 120 (clamping).
Then, as shown in FIG. 11B, the nozzle 125 is disposed in the nozzle hole of the nozzle plate 121, and the resin forming the light reflecting resin layer 20 is injected into the mold 120. The resin injected from the nozzle 125 passes through the sprue 122a of the sprue plate 122, passes through the runner 123a and the gate sprue 123b of the runner plate 123, and then in the mold 120 in which the multifaceted body MS of the lead frame is arranged. Filled with resin.

  After being held for a predetermined time after the resin is filled, the operator opens the runner plate 123 from the lower mold 124 and reflects light by the ejector pins 124a provided on the lower mold 124 as shown in FIG. The lead frame multi-faced body MS on which the resin layer 20 is formed is removed from the lower mold 124. Then, excess burrs and the like are removed from the multi-sided body MS of the lead frame on which the light reflecting resin layer 20 is formed, thereby completing the multi-sided body R of the lead frame with resin.

Here, when the multi-faced body R of the lead frame with resin is obtained by injection molding of the electron beam curable resin, after removing the multi-faced body R of the lead frame with resin from the lower mold as described above, A plurality of multi-faced bodies R are directly stacked. Then, in a state where the multi-faced body R of the lead frame with resin is overlapped, a desired electron beam is irradiated by an electron beam irradiation device to cure the electron beam curable resin.
By curing the electron beam curable resin in this way, unnecessary heat generation due to the absorption of the electron beam into the jig when the resin is cured using a jig or the like, and the shadow of the jig In addition to preventing problems such as insufficient irradiation and uneven irradiation, it is possible to prevent foreign matter from being mixed during handling (conveyance), and to reduce the handling itself.

  In the injection molding die 120 of the present embodiment, the resin flow path is branched from a single sprue to a plurality of gates via a runner, so that the multi-faced body MS of the lead frame is Resin is injected evenly from multiple locations. As a result, the resin can be appropriately filled in each lead frame 10 of the multi-sided body MS of the lead frame, and a multi-sided body R of the lead frame with resin without resin unevenness can be obtained.

As described above, the invention of this embodiment has the following effects.
(1) Since the front surface resin portion 20b-1 and the rear surface resin portion 20b-2 are formed on the multi-faceted body R of the lead frame with resin, a plurality of multi-faceted bodies R of the lead frame with resin are directly stacked. Even if it is made, it can prevent that the part used as a product contacts the multi-faced body R of the lead frame with other resin. Thereby, it can prevent that the part used as the product of the multi-faced body R of the lead frame with resin is soiled or damaged.
Further, when the multi-faced body R of the lead frame with resin is laminated, since the resins are in contact with each other, it is possible to avoid the production of the optical semiconductor device 1 having a defect due to the metal powder.
Further, since storage by the storage case 50 becomes unnecessary, the multi-faced body R of the lead frame with resin R generates metal powder due to rubbing between the end surface and the rail of the storage case, thereby short-circuiting the terminal portions 11 and 12. It is possible to prevent problems such as

(2) Since the multi-faced body R of the lead frame with resin includes the guide portion P, when multiple sheets of the multi-faced body R of the lead frame with resin are stacked, the multi-faced body of each lead frame with resin R can be moved with respect to the longitudinal direction (X direction). Therefore, it is possible to easily carry out the multi-faced body R of the lead frame with resin by the pusher mechanism 60 or the like from the laminated body of the multi-faced body R of the lead frame with resin as necessary.
Further, by providing the guide portion P, it is possible to prevent the multi-faced body R of the laminated lead frame with resin from collapsing in the short direction (Y direction).
(3) When an electron beam curable resin is used, there is virtually no chemical bonding between the molded products unlike the thermosetting resin. Before curing, the resin can be cured in a state where a plurality of sheets are directly stacked, and the highly crosslinked light reflecting resin layer 20 can be obtained at a low cost.

(4) The multifaceted body R of the lead frame with resin is formed by molding shrinkage that occurs in the resin molding process because the front surface resin portion 20b-1 and the rear surface resin portion 20b-2 are formed on the front surface and the back surface. The occurrence of warping can be suppressed. In addition, when an electron beam curable resin is used, curing shrinkage due to electron beam irradiation after molding is large, but the back surface of the frame F is filled with the resin of the light reflecting resin layer 20 at the time of molding. In addition, it is possible to suppress the occurrence of warpage during curing by electron beam irradiation.
(5) The multi-faced body R of the lead frame with resin can be stably laminated by forming the protruding resin portion 20b. Moreover, the multi-faced body R of the lead frame with resin can be directly laminated without using the storage case 50, and the storage efficiency of the multi-faced body R of the lead frame with resin can be improved.

(6) Since the multifaceted body R of the lead frame with resin is provided with the locking portion Q in the surface resin portion 20b-1, the multifaceted body R of the laminated leadframe with resin is in a direction other than the transport direction. Can be prevented from moving to.
(7) Since the protruding resin portion 20b is formed along the side (long side) in the longitudinal direction of the multifaceted body R of the lead frame with resin, warpage is likely to occur in the resin molding process. Warpage in the longitudinal direction of the multifaceted body R of the lead frame with resin can be effectively suppressed.

(8) The multi-faced body R of the lead frame with resin has a through hole H formed on the surface of the frame F on which the surface resin portion 20b-1 is formed, and the surface resin portion 20b-1 is back through the through hole H. It couple | bonds with the resin part 20b-2. Thereby, the multi-faced body R of the lead frame with resin can prevent the protruding resin portion 20b from being peeled off from the frame body F. Moreover, since the frame resin part 20a is combined with the protruding resin part 20b, it is possible to prevent the entire light reflecting resin layer 20 from being peeled off from the multi-faced body MS of the lead frame.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
FIG. 12 is an overall view of the multifaceted body R of the lead frame with resin according to the second embodiment. FIGS. 12A, 12B, and 12C are a plan view, a back view, and a side view, respectively, of the multi-faced body R of the lead frame with resin.
FIG. 13 is a diagram for explaining the details of the multifaceted body R of the lead frame with resin according to the second embodiment. FIGS. 13A and 13B are a plan view and a back view, respectively, of the multi-faced body R of the lead frame with resin, and FIGS. 13C and 13D are FIGS. The cc sectional view of a) and the dd sectional view are shown. FIG.13 (e) is a figure which shows the e section detail of FIG.13 (d).
FIG. 14 is a diagram illustrating the locking portion Q provided in the protruding resin portion 220b of the second embodiment. 14 (a) and 14 (b) are a detailed view of a part a in FIG. 13 (a) and a detailed view of the b part in FIG. 13 (b), respectively, and are a front surface resin part 220b-1 and a back surface resin part 220b. 2 shows the protrusion Q1 and the locking hole Q2 provided at -2. FIGS. 14C and 14D show a cc cross-sectional view and a dd cross-sectional view of FIGS. 14A and 14B, respectively. FIG. 14E shows a schematic diagram when the back surface resin portion 220b-2 is locked by the locking portion Q, and FIG. 14F shows the case where the back surface resin portion 220b-2 moves in the transport direction. The schematic diagram of is shown.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.

The multi-faceted body R of the lead frame with resin of the second embodiment is different from the case of the multi-faceted body R of the lead frame with resin of the first embodiment in the shape of the protruding resin portion 220b and the shape of the locking portion Q. To do.
As shown in FIGS. 12 and 13, the light reflecting resin layer 220 includes a frame resin portion 220a, a protruding resin portion 220b, and a reflector resin portion 220c.
The protruding resin portion 220b is a resin portion provided on the front surface and the back surface of the frame F, and includes a front surface resin portion 220b-1 and a back surface resin portion 220b-2.

The surface resin portion 220b-1 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the surface of the frame F. The front surface resin portion 220b-1 is provided with a guide portion P that fits with the back surface resin portion 220b-2 of the multifaceted body R of the other lead frame with resin and guides relative movement with the back surface resin portion 220b-2. .
The back surface resin portion 220b-2 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the back surface of the frame F. As shown in FIG. 13E, the back surface resin portion 220b-2 is formed in a trapezoidal columnar shape, and the side on the back surface side of the back surface resin portion 220b-2 is a frame body in the YZ plan view perpendicular to the longitudinal direction. It is shorter than the side of the boundary with F. The back surface resin portion 220b-2 is formed at a position facing the front surface resin portion 220b-1 with the frame F interposed therebetween.
The front surface resin portion 220b-1 and the back surface resin portion 220b-2 include a locking portion Q that engages and locks each other.

The guide part P is a groove formed along the side in the longitudinal direction on the surface of the surface resin part 220b-1, and includes a contact surface P1 and a guide surface P2 as shown in FIG. 13 (e). Is done. The groove shape of the guide portion P is formed in a trapezoidal column shape so as to correspond to the back surface resin portion 220b-1. Thereby, since the opening part of the groove | channel of the guide part P becomes wide, when laminating | stacking the multi-faced body R of the lead frame with resin, it can make it easy to fit the back surface resin part 220b-2 to the guide part P. .
The contact surface P1 is a surface with which the back surface of the back surface resin portion 220b-2 contacts, and is formed in parallel with the surface of the frame F.
The guide surface P2 is a surface that comes into contact with the side surface parallel to the longitudinal direction of the back surface resin portion 220b-2, and guides the movement of the multi-faced body R of the laminated lead frame with resin in the longitudinal direction (X direction). . Since the guide surface P2 comes into contact with the two surfaces so as to sandwich the back surface resin portion 220b-2, the movement of the back surface resin portion 220b-2 fitted to the guide portion P can be stably guided.
With the above configuration, the back surface resin portion 220b-2 is fitted into the guide portion P, so that the back surface of the back surface resin portion 220b-2 comes into contact with the contact surface P1, and the back surface resin portion 220b- The two side surfaces abut against the guide surface P2. Thereby, the multi-faced body R of the lead frame with resin can be moved in the longitudinal direction while restricting the movement in the short direction when laminated.

As shown in FIG. 13, the locking portion Q is a multi-faceted body R of a resin-added lead frame with resin out of the movement in the longitudinal direction (X direction) of the back surface resin portion 220 b-2 fitted to the guide portion P. This is a portion that stops the movement in the opposite direction (−X direction) to the transport direction (+ X direction). The locking part Q is composed of a protrusion Q1 and a locking hole Q2.
The protrusion Q1 is a protrusion provided in the vicinity of the end portion (on the −X side) opposite to the conveyance direction of the contact surface P1 of the guide portion P of the surface resin portion 220b-1, and is shown in FIG. As shown, it is formed in a trapezoidal shape in the XZ plan view. The protrusion Q1 is formed with an inclined surface Q1a inclined from the abutment surface P1 on the opposite side (−X side) to the longitudinal conveyance direction of the surface resin portion 220b-1, and the conveyance direction side (+ X side) ) Is formed with a vertical surface Q1b perpendicular to the contact surface P1.

The locking hole Q2 is a hole formed on the back surface of the back surface resin portion 220b-2 in accordance with the position and shape of the projection portion Q1, and as shown in FIG. Is formed. In the locking hole Q2, an inclined surface Q2a inclined from the back surface is formed on the opposite side (−X side) of the back surface resin portion 220b-2 in the longitudinal direction, and on the transport direction side (+ X side). A vertical surface Q2b perpendicular to the back surface is formed.
In addition, the latching | locking part Q may be provided in each of the protrusion resin part 220b formed for every aggregate G, and you may make it provide in any one or more in it.

With the above configuration, when the multifaceted body R of the lead frame with resin is laminated, the locking portion Q is engaged with the protrusion Q1 and the locking hole Q2, as shown in FIG. 14 (e). The inclined surface Q1a contacts the inclined surface Q2a, and the vertical surface Q1b contacts the vertical surface Q2b. Thereby, the latching | locking part Q latches that the multi-faced body R of the laminated | stacked lead frame with a resin moves to the direction (-X direction) opposite to a conveyance direction.
Further, the locking portion Q locks the movement of the multi-faced body R of the resin-attached lead frame R in the transport direction (+ X direction) by the inclined surface Q1a coming into contact with the inclined surface Q2a. However, it is possible to move in this direction by applying a predetermined force to the multifaceted body R of the lead frame with resin. Specifically, the multi-faced body R of the lead frame with resin has a predetermined force applied to the end portion thereof and is pushed toward the conveyance direction side, whereby as shown in FIG. -2 of the locking hole Q2 is slid up on the inclined surface Q1a of the protrusion Q1 of the multi-faceted body R of the other lead frame with resin. As a result, the multifaceted body R of the resin-attached lead frame has the locking holes Q2 disengaged from the projections Q1 of the other resin-attached leadframe multifaceted bodies R and moves in the transport direction.

As described above, the multi-faced body R of the lead frame with resin of the present embodiment can achieve the same effects as the multi-faced body R of the lead frame with resin of the first embodiment described above.
Further, in the multi-faceted body R of the lead frame with resin of the present embodiment, the locking portion Q is composed of the protrusion Q1 having the inclined surfaces Q1a and Q2a and the vertical surfaces Q1b and Q2b and the locking hole Q2. Movement in the longitudinal direction when stacked is stopped. In addition, the multi-faced body R of the lead frame with resin can move in the transport direction from the laminated body of the multi-faced body R of the lead frame with resin by applying a predetermined force in the transport direction. As a result, when the laminate of the multi-faced body R of the lead frame with resin is transported, the multi-faced body R of the lead frame with resin jumps out of the laminated body even if the stacked body is inclined due to transportation or the like. Can be suppressed.

(Third embodiment)
Next, a third embodiment of the present invention will be described.
FIG. 15 is an overall view of a multifaceted body R of the lead frame with resin according to the third embodiment. FIGS. 15A, 15B, and 15C are a plan view, a back view, and a side view, respectively, of the multi-faced body R of the resin-attached lead frame. FIG. 15D is a diagram showing a state in which a plurality of multi-faced bodies R of resin-made lead frames are stacked. FIG.15 (e) is a figure which shows the e section detail of FIG.15 (d).
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.

The multi-faceted body R of the lead frame with resin of the third embodiment is different from the multi-faceted body R of the lead frame with resin of the first embodiment in that the shape of the protruding resin portion 320b on which the frame body F is formed is different. .
As shown in FIG. 15, the light reflecting resin layer 320 includes a frame resin portion 320a, a protruding resin portion 320b, and a reflector resin portion 320c.
The protruding resin portion 320b is a resin portion provided on the front and back surfaces of the frame F, and includes a front surface resin portion 320b-1 and a back surface resin portion 320b-2. In addition, the front resin portion 320b-1 and the back resin portion 320b-2 are formed with guide portions P that guide the movement of the multi-faced body R of the laminated lead frame with resin.

  The surface resin portion 320b-1 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the surface of the frame F. Further, the surface resin portion 320b-1 is formed along the outer peripheral edge of the aggregate G. The surface resin portion 320b-1 is formed in a trapezoidal columnar shape, and the side on the surface side of the surface resin portion 320b-1 is shorter than the side on the boundary side with the frame F in the YZ plan view perpendicular to the longitudinal direction. Is formed. The surface resin portion 320b-1 is connected to the reflector resin portion 320c, and is molded with resin together with the reflector resin portion 320c.

The back surface resin portion 320b-2 is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the back surface of the frame F. The back surface resin part 320b-2 is formed at a position corresponding to the front surface resin part 320b-1 with the frame F interposed therebetween. Specifically, the back surface resin portion 320b-2 is formed along the outer peripheral edge of the frame F, and is formed alternately with the surface resin portion 320b-1 with the frame F interposed therebetween. The back resin part 320b-2 is formed in a trapezoidal columnar shape, and the side on the back side of the back resin part 320b-2 is shorter than the side on the boundary side with the frame F in the YZ plan view perpendicular to the longitudinal direction. Is formed.
In the present embodiment, the front surface resin portion 320b-1 and the back surface resin portion 320b-2 are formed such that their heights are higher than the height of the reflector resin portion 320c. As a result, as shown in FIGS. 15 (d) and 15 (e), the multi-faceted body R of the other resin-made leadframes becomes the product of the multifaceted body R of the laminated leadframes with resin as shown in FIGS. Can be prevented. In addition, even if it makes the height of any one of the front surface resin part 320b-1 and the back surface resin part 320b-2 be higher than the height of the reflector resin part 320c, the above effect can be obtained.

The guide part P is comprised from the guide surface P1 provided in the surface resin part 320b-1, and the guide surface P2 provided in the back surface resin part 320b-2. The guide surface P1 is a surface on the outer peripheral side of the frame F among the longitudinal side surfaces of the surface resin portion 320b-1. The guide surface P2 is a surface on the opposite side to the outer periphery of the frame F among the longitudinal side surfaces of the back surface resin portion 320b-2.
As shown in FIGS. 15D and 15E, the guide surface P1 and the guide surface P2 come into contact with each other when the multi-faced body R of the lead frame with resin is laminated. Thereby, the guide part P guides the movement of the multi-faced body R of the laminated lead frame with resin.
As described above, since the front surface resin portion 320b-1 and the rear surface resin portion 320b-2 are each formed in a trapezoidal column shape, when the multi-faced body R of the lead frame with resin is laminated, the guide surface P1 and the guide surface P2 can be easily brought into contact.

As described above, since the front surface resin portion 320b-1 and the rear surface resin portion 320b-2 are formed in the multi-faced body R of the lead frame with resin according to the present embodiment, a plurality of multi-faced bodies R of the lead frame with resin are formed. Even if the sheets are directly stacked, it is possible to prevent the product portion of the multifaceted body R of the lead frame with resin from being damaged or damaged.
Further, since the multi-faced body R of the lead frame with resin is provided with the guide portion P, the lead frame with resin is formed by a pusher mechanism or the like from the laminated body of the multi-faced body R of the lead frame with resin as required. It is possible to easily carry out the multi-faced body R in the longitudinal direction.
Furthermore, by providing the guide portion P, it is possible to prevent the multifaceted body R of the laminated lead frame with resin from collapsing in the short direction (Y direction).
The multifaceted body R of the lead frame with resin has warpage due to molding shrinkage that occurs in the molding process of the resin, because the front surface resin portion 320b-1 and the rear surface resin portion 320b-2 are formed on the front surface and the back surface. Can be suppressed.
The multi-faced body R of the lead frame with resin can be stably laminated by forming the protruding resin portion 320b. Moreover, the multi-faced body R of the lead frame with resin can be directly laminated without using the storage case 50, and the storage efficiency of the multi-faced body R of the lead frame with resin can be improved.
Since the protruding resin portion 320b is formed along the side (long side) in the longitudinal direction of the multifaceted body R of the lead frame with resin, the lead with resin that is likely to warp in the resin molding process. Warpage in the longitudinal direction of the multifaceted body R of the frame can be effectively suppressed.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described.
FIG. 16 is an overall view of a multifaceted body R of a lead frame with resin according to the fourth embodiment. FIGS. 16A, 16B, and 16C are a plan view, a back view, and a side view, respectively, of the multi-faced body R of the resin-attached lead frame. FIG.16 (d) shows the d section detail drawing of FIG.16 (c). FIG. 16E is a diagram showing a state in which a plurality of multi-faced bodies R of the lead frame with resin shown in FIG.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.

The multi-faceted body R of the lead frame with resin according to the fourth embodiment is different in that the surface resin portion is not formed on the surface of the frame F and the guide portion P is formed on the surface of the frame F. This is mainly different from the multi-faceted body R of the lead frame with resin of the embodiment.
As shown in FIG. 16, the light reflecting resin layer 420 includes a frame resin portion 420a, a protruding resin portion 420b, and a reflector resin portion 420c.
The protruding resin portion 420b is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the back surface of the frame F.

On the surface of the frame body F, a guide portion P that fits with the protruding resin portion 420b is formed.
The guide portion P is a groove formed on the surface of the frame F along the long sides facing each other over the entire long side, and the protruding resin portion 420b across the frame F. Are formed so as to face each other.
Here, the difference (h4−h5) between the height h4 of the protruding resin portion 420b and the groove depth h5 of the guide portion P is formed to be larger than the height h3 of the reflector resin portion 420c (h4). -H5> h3). By doing this, when the multi-faced body R of the lead frame with resin is laminated, the surface of the reflector resin portion 420c to be the product and the external terminal surfaces 11b and 12b are multi-faceted bodies of other lead frames with resin. Contact with R can be avoided.

As described above, the multifaceted body R of the lead frame with resin of the present embodiment has the resin portion 420b formed on the back surface of the frame F and the guide portion P formed on the surface of the frame F. Even if a plurality of lead frame multi-faced bodies R are directly stacked, it is possible to prevent the product portion of the multi-faced body R of the lead frame with resin from being damaged or damaged.
Moreover, since the multi-faced body R of the lead frame with resin includes the guide portion P, it can be moved in the longitudinal direction by the protruding resin portion 420b fitted to the guide portion P. Thereby, it is possible to easily carry out the multi-faced body R of the lead frame with resin from the laminated body of the multi-faced body R of the lead frame with resin by a pusher mechanism or the like in the longitudinal direction.
Furthermore, by providing the guide portion P, it is possible to prevent the multifaceted body R of the laminated lead frame with resin from collapsing in the short direction (Y direction).
The multi-faceted assembly R of the lead frame with resin has a reflector resin portion 420c formed on the front surface and a protruding resin portion 420b formed on the back surface thereof, so that warpage due to molding shrinkage that occurs in the resin molding process occurs. Can be suppressed.
The multi-faced body R of the lead frame with resin can be stably laminated by forming the protruding resin portion 420b. Moreover, the multi-faced body R of the lead frame with resin can be directly laminated without using the storage case, and the storage efficiency of the multi-faced body R of the lead frame with resin can be improved.
Since the protruding resin portion 420b is formed along the side (long side) in the longitudinal direction of the multifaceted body R of the lead frame with resin, the lead with resin that is likely to warp in the resin molding process. Warpage in the longitudinal direction of the multifaceted body R of the frame can be effectively suppressed.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described.
FIG. 17 is an overall view of a multifaceted body R of a lead frame with a resin according to a fifth embodiment. FIGS. 17A and 17B are a plan view and a back view, respectively, of the multifaceted body R of the lead frame with resin. FIG. 17C is a cross-sectional view taken along the line cc in FIG. 17A, and FIG. 17D is a detailed view of a portion d in FIG. FIG. 17E is a view showing a state in which a plurality of multi-faced bodies R of the lead frame with resin shown in FIG.
Note that, in the following description and drawings, the same reference numerals or the same reference numerals are given to the portions that perform the same functions as those in the first embodiment described above, and overlapping descriptions will be omitted as appropriate.

The multi-faced body R of the lead frame with resin according to the fifth embodiment is different in that the back surface resin portion is not formed on the back surface of the frame body F and the guide portion P is formed on the back surface of the frame body F. This is mainly different from the multi-faceted body R of the lead frame with resin of the embodiment.
As shown in FIG. 17, the light reflecting resin layer 520 includes a frame resin portion 520a, a protruding resin portion 520b, and a reflector resin portion 520c.
The protruding resin portion 520b is a resin portion formed so as to protrude separately for each aggregate G along longitudinal sides (long sides) facing each other on the surface of the frame F.

The frame body F is formed with a guide portion P on the back surface thereof for fitting and guiding with the protruding resin portion 520b. Further, the frame F has a locking portion Q formed at an end portion (−X side) opposite to the conveying direction of the guide portion P.
The guide part P is a groove formed on the back surface of the frame F along substantially the entire long sides along the opposite longitudinal sides (long sides), and the protruding resin sandwiching the frame F It is formed so as to face the portion 520b.
Of the movement in the longitudinal direction (X direction) of the protruding resin portion 520b fitted to the guide portion P, the locking portion Q is the conveyance direction (+ X direction) of the multi-faced body R of the laminated lead frame with resin. This is a part that regulates movement in the opposite direction (−X direction). The locking portion Q is formed at the end portion (on the −X side) opposite to the conveyance direction of the guide portion P of the multifaceted body R of the lead frame with resin.

  Here, the difference (h4−h5) between the height h4 of the protruding resin portion 520b and the groove depth h5 of the guide portion P is formed to be larger than the height h3 of the reflector resin portion 520c (h4). -H5> h3). By doing this, even if the multi-faced body R of the lead frame with resin is laminated, the surface of the reflector resin portion 520c and the external terminal surfaces 11b and 12b, which are products, are multi-faceted body R of the other lead frame with resin. To avoid contact with the back side.

As described above, the multifaceted body R of the lead frame with resin of the present embodiment has the resin portion 520b formed on the front surface of the frame F and the guide portion P formed on the back surface of the frame F. Even if a plurality of lead frame multi-faced bodies R are directly stacked, it is possible to prevent the product portion of the multi-faced body R of the lead frame with resin from being damaged or damaged.
Moreover, since the multi-faced body R of the lead frame with resin includes the guide portion P, it can be moved in the longitudinal direction by the protruding resin portion 520b fitted to the guide portion P. Thereby, it is possible to easily carry out the multi-faced body R of the lead frame with resin from the laminated body of the multi-faced body R of the lead frame with resin by a pusher mechanism or the like in the longitudinal direction.

Furthermore, by providing the guide portion P, it is possible to prevent the multifaceted body R of the laminated lead frame with resin from collapsing in the short direction (Y direction).
The multi-faceted body R of the lead frame with resin can be stably laminated by forming the protruding resin portion 520b. Moreover, the multi-faced body R of the lead frame with resin can be directly laminated without using the storage case, and the storage efficiency of the multi-faced body R of the lead frame with resin can be improved.
Moreover, since the back surface of the multi-faced body R of the lead frame with resin becomes flat, it can be placed on an existing apparatus or the like without requiring a special jig or the like.

Since the multifaceted body R of the lead frame with resin is provided with a locking portion Q at the end of the frame F opposite to the conveying direction of the guide part P, the multifaceted body of the laminated leadframe with resin is laminated. It is possible to prevent R from moving in a direction other than the transport direction.
Since the protruding resin portion 520b is formed along the longitudinal side (long side) of the multifaceted body R of the resin-attached lead frame R, the resin-attached lead frame of the resin is likely to warp in the resin molding process. Warpage in the longitudinal direction of the multifaceted body R can be effectively suppressed.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made as in the modifications described later, and these are also included in the present invention. Within the technical scope. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the above-described embodiment and modifications described later can be used in appropriate combination, but detailed description thereof is omitted.

FIG. 18 is a view showing the entire multi-faceted body R of the lead frame with resin according to the modified embodiment of the present invention. FIG. 19 is a view showing a multifaceted body R of a lead frame with resin according to a modification of the present invention.
(Deformation)
(1) In each embodiment, although the protruding resin portion 20b is formed separately for each assembly G along the longitudinal sides (long sides) of the frame F that face each other, It is not limited. For example, as shown in FIG. 18A, the protruding resin portion 620b may be formed continuously along the longitudinal sides (long sides) of the frame F that face each other. In this case, it is possible to smoothly carry out the multi-faced body R of the laminated lead frame with resin.
Further, as shown in FIG. 18B, the frame F may be formed by being divided into short portions along the mutually opposing longitudinal sides (long sides). In this case, the amount of resin used can be reduced as compared with the above-described embodiment. In addition, when a protrusion resin part is comprised from a surface resin part and a back surface resin part, it is necessary to make length w1 of each division | segmentation protrusion resin part 720b larger than the space | interval w2 with the adjacent protrusion resin part 720b. (W1> w2).

(2) In each embodiment, although the protrusion resin part 20b showed the example formed in the multi-faced body R of the lead frame with resin provided with the reflector resin part 20c on the surface, it is not limited to this. For example, the protruding resin portion may be formed on a so-called flat type resin-equipped lead frame that does not include a reflector resin portion and has a flat LED terminal surface.
(3) In 2nd Embodiment, although the back surface resin part 220b-2 was formed in trapezoid column shape and the guide part P showed the example in which a trapezoid columnar groove | channel is formed, it is not limited to this. For example, as shown in FIG. 19, guide portions P each having a groove and a protrusion formed by joining prisms and cylinders extending in the longitudinal direction are respectively formed on the front surface resin portion 820 b-1 and the back surface resin portion 820 b-2. You may make it form in. By doing so, the back surface resin portion 820b-2 fitted to the front surface resin portion 820b-1 not only guides the movement in the transport direction, but the multi-faced body R of the laminated lead frame with resin is in the thickness direction ( (Z direction) can be prevented from deviating.

(4) In each embodiment, the multi-faced body R of the lead frame with resin has been described as being transported in the longitudinal direction. However, the present invention is not limited to this example. The body R may be transported in the short direction. In this case, the protruding resin portion and the guide portion need to be formed along the side (short side) in the short direction.
(5) In the first embodiment, an example has been described in which one of the opposing protruding resin portions 20b also serves as a gate portion serving as a resin filling port. However, the present invention is not limited to this example. Both of the resin portions may double as a resin gate portion. By doing so, it is possible to improve the resin filling efficiency with respect to the multi-faced body MS of the lead frame, and to reduce the formation of unnecessary resin parts after the resin is filled.
Further, in the protruding resin portion, not only the front surface resin portion but also at least a part of the back surface resin portion may serve as the gate portion.

(6) The protruding resin portion 20b that faces the protruding resin portion that also serves as the gate portion is filled with the resin in the mold last when the resin is filled in the mold when the light reflecting resin layer 20 is molded. You may make it provide in the site | part used as the air escape. Since such a portion may cause a resin filling failure, providing the protruding resin portion at such a portion can improve the resin filling efficiency with respect to the multi-faced body MS of the lead frame.
(7) In each embodiment, although the lead frame 10 showed the example provided with the terminal part 11 and the terminal part 12, the lead frame may be provided with the 3 or more terminal part. For example, three terminal portions may be provided, one of which is mounted with the LED element 2, and the other two may be connected to the LED element 2 via bonding wires 2a.

(8) In each embodiment, the lead frame 10 is a terminal portion 11 that becomes a die pad on which the LED element 2 is placed and connected, and a terminal that becomes a lead side terminal portion connected to the LED element 2 via the bonding wire 2a. Although the example comprised from the part 12 was demonstrated, it is not limited to this. For example, the LED element 2 may be placed and connected so as to straddle two terminal portions. In this case, the outer shapes of the two terminal portions may be formed equally.
(9) In each embodiment, although the lead frame 10 showed the example used for the optical semiconductor device 1 which connects optical semiconductor elements, such as the LED element 2, the semiconductor device using semiconductor elements other than an optical semiconductor element was shown. Can also be used.

DESCRIPTION OF SYMBOLS 1 Optical semiconductor device 2 LED element 10 Lead frame 11 Terminal part 12 Terminal part 13 Connection part 20 Light reflection resin layer 20a Frame resin part 20b Projection resin part 20b-1 Surface resin part 20b-2 Back surface resin part 30 Transparent resin layer F Frame Body G Assembly M Recess MS Multi-faceted body of lead frame P Guide part Q Locking part R Multi-faced body of lead frame with resin S Air gap part

Claims (9)

A lead frame multi-faced body having a plurality of terminal portions, and a lead frame used in an optical semiconductor device in which an optical semiconductor element is connected to at least one surface of the terminal parts;
The frame resin part formed between the outer peripheral side surface of the lead frame and the terminal part and the surface of the frame body are formed so as to project at least part of the sides opposite to each other that form the outer shape of the frame body. A resin layer having a front surface resin portion and a back surface resin portion formed at a position corresponding to the front surface resin portion across the frame body on the back surface of the frame body;
At least one of the front surface resin portion and the rear surface resin portion is such that the front surface resin portion or the rear surface resin portion is fitted to the rear surface resin portion or the front surface resin portion of the multi-sided body of another lead frame with resin, and the rear surface resin. Having a guide part for guiding relative movement with the part or the surface resin part,
Multi-faceted body of resin-attached lead frame characterized by In the multi-faced body of the lead frame with resin according to claim 1,
At least one of the front surface resin portion and the back surface resin portion has a locking portion that locks movement of the guide portion in the guide direction;
Multi-faceted body of resin-attached lead frame characterized by In the multi-faced body of the lead frame with resin according to claim 1 or 2,
The front surface resin portion and the back surface resin portion are each formed in plural along the opposite sides that form the outer shape of the frame, and the lengths of the front surface resin portions in the direction parallel to the sides are adjacent to each other. It is formed longer than the interval with the front surface resin portion, and the length of the back surface resin portion in the direction parallel to the side is formed longer than the interval between the adjacent back surface resin portions,
Multi-faceted body of resin-attached lead frame characterized by In the multi-sided body of the lead frame with a resin according to any one of claims 1 to 3,
The front surface resin portion and the back surface resin portion are formed on a side parallel to the longitudinal direction of the multifaceted body of the lead frame;
Multi-faceted body of resin-attached lead frame characterized by In the multi-faced body of the lead frame with a resin according to any one of claims 1 to 4,
The frame has a through hole in at least a part of the surface on which the surface resin portion is formed,
The front surface resin portion is coupled to the back surface resin portion through the through hole;
Multi-faceted body of resin-attached lead frame characterized by A lead frame multi-faced body having a plurality of terminal portions, and a lead frame used in an optical semiconductor device in which an optical semiconductor element is connected to at least one surface of the terminal parts;
At least one of the frame resin portion formed between the outer peripheral side surface of the lead frame and the terminal portion and at least one of the front surface and the back surface of the frame body on the sides facing each other and forming the outer shape of the frame body A resin layer having a protruding resin portion formed to protrude in part,
The frame body is fitted on the surface opposite to the surface on which the projecting resin portion is formed, with the projecting resin portion of the multi-faceted body of another lead frame with resin, and guides the moving direction of the projecting resin portion. Having a guide to
Multi-faceted body of resin-attached lead frame characterized by The multi-faced body of the lead frame with resin according to claim 6,
The guide part has a locking part for locking movement in the guiding direction;
Multi-faceted body of resin-attached lead frame characterized by In the multi-faced body of the resin-attached lead frame according to claim 6 or 7,
The protruding resin portion is formed on a side parallel to the longitudinal direction of the multi-faceted body of the lead frame;
Multi-faceted body of resin-attached lead frame characterized by A multi-faced body of a resin-attached lead frame according to any one of claims 1 to 8,
An optical semiconductor element connected to at least one of the terminal portions of each lead frame of the multi-faced body of the resin-attached lead frame;
A transparent resin layer that is formed on a surface to which the optical semiconductor element is connected of the multifaceted body of the lead frame with resin, and covers the optical semiconductor element;
A multifaceted body of an optical semiconductor device characterized by the above.

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