JP2014156650A - Composite plating film and thin grindstone using the same and method of producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite plating film which has anisotropy or periodicity in the in-plane direction or the direction perpendicular to the plane, an electrodeposition/electrocasting grindstone which is composite of the composite plating film and has good sharpness and a method of producing the composite plating film.SOLUTION: Fine particles are arranged periodically in a composite plating film in the form of linear rows of the fine particles so as to add directionality or periodicity to the functions of the composite plating film of the fine particles due to compositeness. An electrodeposition/electrocasting grindstone composed of the composite plating film in which fine particles of e.g. diamond are arranged regularly as hard grindstones has improved sharpness. A method of producing the composite plating film and the electrodeposition/electrocasting grindstone comprises forming a stationary wave sound field in a plating film formation surface by using an ultrasonic source.

Description

  The present invention relates to a composite plating film, a thin grindstone using the same, and a method for producing the same. More specifically, fine particles of several nanometers to several tens of micrometers are periodically arranged as linear fine particle rows, Using a composite plating film in which the functionality due to the combination of fine particles is directional, and the above-mentioned composite plating film in which the fine particles are hard abrasive grains such as diamond, and a sharp electrodeposition / electroforming grindstone, and an ultrasonic sound source In particular, the present invention relates to a composite plating film including periodic fine particle arrays by forming a standing wave sound field on a plating film forming surface and a method for producing an electrodeposition / electroforming grindstone.

  A composite plating film containing functional particles in a mother layer such as nickel or copper is widely used for the purpose of improving functionality such as slidability, conductivity, and mechanical strength of the plating film. Furthermore, in order to provide directionality and periodicity in the in-plane direction and the perpendicular direction (thickness direction), it is necessary to regularly combine fine particles.

  In the conventional method, a multi-stage process including a process of forming a mask on the substrate surface, performing a composite plating process, and further removing the mask has been studied. According to Patent Document 1, a manufacturing method using a patterning plating film and a mask related to nanoparticles such as carbon nanotubes is proposed. However, there is a problem that there is no effective method for periodically arranging fine particles of several nanometers to several tens of micrometers in the in-plane direction without using a mask. Furthermore, if it is intended to provide periodicity in the direction perpendicular to the surface, another mask must be prepared for each period, and there is a problem that workability is extremely poor.

  In a thin grindstone formed by a composite plating film containing hard abrasive grains, there is a demand for a thin grindstone that regularly controls the concentration of hard abrasive grains, has a long life, and has a high accuracy of the cut surface, and a method for producing the same. . According to Patent Document 1, in order to regularly arrange hard abrasive grains, a method of dropping the abrasive grains into the holes by ultrasonic vibration after processing fine holes in the substrate in advance has been proposed. There is a problem that it takes time and cost to prepare a substrate such as drilling, and a fundamental problem that only a single abrasive layer is available.

  According to Patent Document 3, a composite plating film having a high concentration of fine particles can be formed on a node portion of a standing wave formed on a diaphragm using a diaphragm having a bending vibration mode. Is limited by the shape of the diaphragm serving as a substrate, so that the degree of freedom of the period is low and there is room for improvement.

  As described above, in the conventional method, fine particles of several nanometers to several tens of micrometers are periodically arranged in the in-plane direction as a linear fine particle array, and the composite property of the fine particles is directional. It is difficult to form a plating film and a composite plating film in which the composite plating film has a periodicity in the direction perpendicular to the surface. Therefore, a composite plating film having periodicity and directionality in functionality such as slidability, conductivity, and mechanical strength, and an electrodeposition / electroforming grindstone using the same are not manufactured and put into practical use. .

  JP 2010-222707 A   JP 11-254331 A   JP 2012-77356 A

  The present invention provides a composite plating film in which fine particles of several nanometers to several tens of micrometers are periodically arranged as a linear fine particle array, the composite plating film whose functionality by the combination of the fine particles has directionality or periodicity, and the fine particles Periodic fine particle arrays by forming a standing wave sound field on the plating film forming surface using a sharp electrodeposition / electroformed grinding wheel composed of the composite plating film, which is a hard abrasive such as diamond, and an ultrasonic sound source It aims at providing the manufacturing method of the composite plating film containing this, and an electrodeposition and an electroforming grindstone.

  In order to achieve the above object, the composite plating film according to claim 1 has a composite plating layer in which fine particles of several nanometers to several tens of micrometers form a linear fine particle row, and the fine particle rows are periodically arranged. It is characterized by that.

  The composite plating film according to claim 2 is characterized in that a period of the fine particle row is 0.05 to 2 millimeters.

  The composite plating film according to claim 3 is characterized in that there are two or more pairs of finely arranged fine particles arranged in the same plane in the composite plated film, and each fine particle row is arranged at an angle α. And

  The composite plating film according to claim 4 is characterized in that a composite plating layer in which the fine particle rows are periodically arranged is laminated, and the cycle in each composite plating layer is the same.

  The composite plating film according to claim 5 is characterized in that a composite plating layer in which the fine particle rows are periodically arranged is laminated, and the period in the continuous composite plating layer is different.

  The composite plating film according to claim 6 is characterized in that the fine particles are fine particles of either diamond or cubic boron nitride.

  The composite plating film according to claim 7 is characterized in that the fine particles are fine particles of single-walled carbon nanotubes, multi-walled carbon nanotubes, or graphene.

  The composite plating film according to claim 8 is characterized in that the fine particles are fine metal particles that form an alloy with the plating matrix.

  The composite plating film according to claim 9, wherein the fine particles are two or more kinds of fine particles, and are selected from diamond, cubic boron nitride, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and metal fine particles. It is characterized by.

  The composite plating film according to claim 10 is characterized in that a parent phase of the plating film is any one of nickel, copper, a nickel alloy, and a copper alloy.

  The electrodeposited grindstone according to claim 11, wherein the composite plating film according to any one of claims 1 to 10, wherein the fine particles contain at least fine particles of either diamond or cubic boron nitride. A film is formed on the side surface and the outer peripheral surface of the base metal and is a cutting edge of a grindstone.

  The electroplating grindstone according to claim 12, wherein the composite plating film according to any one of claims 1 to 10 is a self-supporting film, wherein the fine particles include at least fine particles of either diamond or cubic boron nitride. It is a cutting edge of a grindstone.

  A method for producing a composite plating film according to claim 13 is the method for producing a composite plating film according to any one of claims 1 to 10, wherein a base material for forming the plating film and an ultrasonic sound source are used as the fine particles. Is immersed in a plating bath dispersed, and a standing wave sound field is formed on the surface of the base material by an ultrasonic sound source, while the fine particles are arranged by acoustic radiation force at the nodes of the standing wave sound field periodically present The plating film is grown from the surface of the base material.

  The method of manufacturing a composite plating film according to claim 14, wherein the ultrasonic sound source is a diaphragm, and the standing wave sound field is a combination of a diaphragm and a reflector above the plating substrate surface or two diaphragms. The vibration surface of the vibration plate, the reflection surface of the reflection plate, and the plating substrate surface of the base material are flat surfaces, and are normal to the vibration surface passing through the center point 9 of the plating forming portion. The angle of intersection between 1 and the plated substrate surface is θ, and the angle of intersection between the normal line 2 of the other vibration surface or reflecting surface that makes a pair with the vibration surface and the plated substrate surface is θ, The line 2 is different, and the normal line 1 and the normal line 2 are on the same plane and are plated by a plane wave excited from two vibration planes or a plane wave excited from one vibration plane and a plane wave reflected from a plane reflector. Λ / (2 × cos θ) interval L on the substrate surface (where λ [m] It is the wavelength of the ultrasonic wave in the plating bath, and is obtained by the product of the reciprocal of the frequency f [Hz] of the ultrasonic wave and the sound velocity c [m / s] of the ultrasonic wave in the plating bath. By forming a straight node in the direction of the line of crossing and directing the acoustic radiation force toward this node, a plating film is formed from the surface of the base material while arranging fine particles on the node in a straight line And

  The method for producing a composite plating film according to claim 15 is characterized in that the interval L between the linear particle rows is changed by changing the intersecting angle θ or the frequency f of the ultrasonic waves.

  The method for producing a composite plating film according to claim 16 is characterized in that the vibration speed on the vibration surface is controlled to adjust the acoustic radiation force on the plating substrate surface, thereby changing the width of the fine particle row.

The method for producing a composite plating film according to claim 17, wherein the fine particles are diamond abrasive grains, and the acoustic radiation force F _R [pN] is the following (1 ) Is satisfied.
^{_{F R ≧ 2.697 × D 2 -4.403}} × D-21.38 ···· (1)

  The method of manufacturing a composite plating film according to claim 18, wherein two or more vibration surfaces or one vibration surface and two or more plane reflectors are used to form a linear node intersecting at an angle α on the plating film forming surface. It is characterized by doing.

  The method for producing an electrodeposited grindstone according to claim 19 uses the method for producing a composite plating film according to any one of claims 13 to 18 on a side surface and an outer peripheral surface of a disk-shaped base metal. A composite plating film is formed as a cutting edge, and an electrodeposition grindstone is produced.

  A method for producing an electrodeposited grindstone according to claim 20 uses a method for producing a composite plating film according to any one of claims 13 to 18 to form a composite plating film on a substrate and to peel the composite plating film from the substrate. An electroforming grindstone consisting only of a composite plating film is manufactured.

  According to the first aspect of the present invention, fine particles of several nanometers to several tens of micrometers, which are difficult to arrange without a mask by the conventional method, form a linear fine particle array, and the fine particle array is periodic. As a result, the composite plating film that expresses the functionality of the nanoparticles or microparticles with directionality or periodicity is obtained.

  According to the second aspect of the present invention, the composite plating in which the functional particle expression level and the directionality of the nanoparticles or microparticles are changed according to the period when the period of the fine particle array is 0.05 to 2 millimeters. It becomes a film.

  According to the invention of claim 3, there are two or more pairs of finely arranged fine particles arranged in the same plane in the composite plating film, and each fine particle row is arranged at an angle α. The composite plating film has a functional directionality in two or more directions defined by the angle α. Furthermore, a composite plating film in which the degree of directivity is controlled by the angle α is obtained.

  According to invention of Claim 4, the composite plating film which expressed the functionality by a nanoparticle or microparticle in directionality or periodicity is laminated | stacked, and the period of the said microparticles | fine-particles in each composite plating layer is the same. Thus, a composite plating film having the same functionality in the thickness direction is obtained.

  According to the invention of claim 5, the composite plating film in which the functionality of the nanoparticles or microparticles is expressed in the directionality or periodicity is laminated, and the period of the fine particles in each composite plating layer is different. A composite plating film having different functionality in the thickness direction is obtained.

  According to the sixth aspect of the invention, the fine particles are fine particles of either diamond or cubic boron nitride, so that functions such as mechanical strength, slidability, hardness, elastic modulus, and thermal conductivity are provided. Therefore, a composite plating film having directionality in their functionality is exhibited.

  According to the invention of claim 7, the fine particles are fine particles of single-walled carbon nanotubes, multi-walled carbon nanotubes, or graphene, so that mechanical strength, slidability, hardness, elastic modulus, heat conduction Functionality such as property and electrical conductivity is expressed, and a composite plating film having directionality in the functionality is obtained.

  According to the eighth aspect of the invention, the fine particles are metal fine particles that form an alloy with the plating matrix phase, so that an alloy layer is formed by heat treatment or processing, and mechanical strength, slidability, and hardness are formed. Functionality such as elastic modulus, thermal conductivity, electrical conductivity, and magnetic properties is exhibited, and a composite plating film having directionality in the functionality is obtained.

  According to the invention described in claim 9, the fine particles are two or more kinds of fine particles, and are selected from diamond, cubic boron nitride, single-walled carbon nanotube, multi-walled carbon nanotube, graphene, and metal fine particle. Thus, two or more different functionalities are expressed, and a composite plating film having directionality in these functionalities is obtained.

  According to the invention described in claim 10, when the matrix phase of the plating film is any one of nickel, copper, nickel alloy, and copper alloy, the fine particles have a basic function of nickel, copper, nickel alloy, and copper alloy. Thus, a composite plating film having directionality in the functionality can be provided.

  According to the invention of claim 11, the fine particles include at least fine particles of diamond or cubic boron nitride, and functions such as mechanical strength, slidability, hardness, elastic modulus, thermal conductivity and the like. The composite plating film having the directivity in the functionality is formed on the side surface and the outer peripheral surface of the disk-shaped base metal, and is a sharpening blade due to the above-mentioned functionality by being a cutting edge of a grindstone It becomes an electrodeposition grindstone.

  According to the twelfth aspect of the invention, the fine particles include at least fine particles of diamond or cubic boron nitride, and functions such as mechanical strength, slidability, hardness, elastic modulus, and thermal conductivity. The composite plating film having the properties and the directionality of the functionality is a self-supporting film, and the cutting edge of the grindstone results in an electroformed grindstone having a good sharpness due to the functionality.

  According to the invention of claim 13, a base material for forming a plating film and an ultrasonic sound source are immersed in a plating bath in which the fine particles are dispersed, and a standing wave sound field is formed on the surface of the base material by the ultrasonic sound source. The composite coating film in which the fine particles periodically exist is grown by growing the plating film from the surface of the base material while arranging the fine particles by acoustic radiation force at the nodes of the standing wave sound field that exists periodically. Can be formed.

  According to the invention of claim 14, in the method of manufacturing a composite plating film, the ultrasonic sound source is a vibration plate, and the standing wave sound field is a set of a vibration plate and a reflection plate above the plating substrate surface or A set of two diaphragms is formed on the plating substrate surface, and the vibration surface of the diaphragm, the reflection surface of the reflection plate, and the plating substrate surface of the base material are flat and pass through the center point 9 of the plating forming portion. The crossing angle between the normal 1 of the vibration surface and the plating substrate surface is θ, and the crossing angle between the other vibration surface or the normal 2 of the reflecting surface and the plating substrate surface is θ, Normal line 1 and normal line 2 are different, and normal line 1 and normal line 2 are on the same plane and are reflected from a plane wave excited by two vibrating surfaces or a plane wave excited from one vibrating surface and a plane reflector. Λ / (2 × cos θ) on the plated substrate surface by plane waves L (where λ [m] is the wavelength of the ultrasonic wave in the plating bath, and is determined by the product of the reciprocal of the ultrasonic frequency f [Hz] and the sound velocity c [m / s] of the ultrasonic wave in the plating bath. ), Forming a straight nodal portion in the direction of the intersection of the vibration surface and the plated substrate surface, and by directing the acoustic radiation force toward this nodal portion, the fine particles are arranged in a straight line on the nodal portion surface. By forming a plating film from the above, it is possible to form a composite plating film having periodicity in function by incorporating fine particles into the plating film in a state of being arranged in a straight line.

  According to the invention of claim 15, in the method of manufacturing a composite plating film, by changing the interval L between the linear fine particle rows by changing the crossing angle θ or the frequency f of the ultrasonic wave, Composite plating films having different functional periods can be formed.

  According to the sixteenth aspect of the present invention, the vibration speed on the vibration surface can be controlled to adjust the acoustic radiation force on the plating substrate surface, thereby changing the width of the fine particle row. By increasing the vibration speed, the acoustic radiation force can be increased, and the width of the particle array can be narrowed, and conversely, the vibration speed can be decreased, the acoustic radiation force can be decreased, and the width of the particle array can be increased.

According to the seventeenth aspect of the present invention, in the diamond abrasive grain alignment, the acoustic radiation force F _R [pN] satisfies the following expression (1) with respect to the diamond abrasive grain diameter D [μm]. Thus, diamond abrasive grains having different particle diameters can be moved, and a composite plating film in which diamond abrasive grains are aligned can be produced.
^{_{F R ≧ 2.697 × D 2 -4.403}} × D-21.38 ···· (1)

  According to the invention of claim 18, in the method of manufacturing a composite plating film, two vibration surfaces or two vibration surfaces and two or more sets of planar reflectors are used, and a linear shape intersecting the plating film forming surface at an angle α. By forming the nodal portion, it is possible to form a composite plating film having functional directionality in two or more directions defined by the angle α. Furthermore, a composite plating film whose degree of directivity is controlled by the angle α can be formed.

  According to the nineteenth aspect of the present invention, in the electrodeposition grindstone manufacturing method, the composite plating film is used as a cutting edge of the grindstone on the side surface and the outer peripheral surface of the disk-shaped base metal by using the composite plating film manufacturing method. By forming the electrodeposition wheel, it is possible to produce an electrodeposition grindstone whose functionality due to the combination of fine particles has directionality or periodicity.

  According to the invention of claim 20, in the method of manufacturing an electroforming grindstone, the composite plating film is formed on the substrate using the method of manufacturing the composite plating film, peeled off from the substrate, and the function by combining fine particles It is possible to manufacture an electroforming grindstone composed only of a composite plating film having a directionality or periodicity.

  In the thin grindstone having a plurality of hard abrasive grains, the effects of the invention relating to the thin grindstone that regularly controls the concentration degree of the hard abrasive grains, has a long life, and has a high accuracy of the cut surface and its manufacturing method are summarized below. The method for producing a thin grindstone of the present invention uses an external ultrasonic sound source and a reflector to make an ultrasonic wave (plane wave) enter the substrate on which the thin grindstone is formed obliquely from the outside, and uses a reflected wave from the reflector. In this method, sound pressure distribution is formed in the liquid in the vicinity of the substrate, hard abrasive grains are concentrated on a portion where the sound pressure is low, and the hard abrasive grains are fixed by plating. In the prior art, in order to regularly arrange hard abrasive grains, a method of processing fine holes in a substrate in advance and dropping the abrasive grains into the holes by ultrasonic vibration has been proposed. There are problems that it takes time and cost to prepare the substrate and that the abrasive layer must basically be a single layer. According to the present invention, it is not necessary to process the substrate, and the arrangement of the abrasive grains can be controlled even after the plating layer is grown. Further, by changing the incident angle and frequency of the ultrasonic wave, the density density interval can be arbitrarily changed. Furthermore, in comparison with the case of using the flexural vibration of the diaphragm, in principle, a high abrasive concentration layer can be finely patterned (laminated) in the in-plane and perpendicular directions by using an external sound source, and further, depending on the patterning interval. There is an effect that it is possible to strictly control the concentration of abrasive grains.

The present invention will be described below with reference to the drawings. This diagram and description are merely examples and do not limit the general concept of the invention.
It is the cross-sectional schematic which shows the structure which has arrange | positioned 1 set of external sound sources and reflecting plates by reflection angle (theta) in the formation method of the composite plating film of this invention. It is the schematic (figure which looked at the board | substrate from the top) which shows the structure which has arrange | positioned two sets of external sound sources and reflectors in angle (alpha) in the formation method of the composite plating film of this invention. It is sectional drawing of the sound pressure distribution and acoustic radiation force in the board | substrate vicinity analyzed by the finite element method in the formation method of the composite plating film of this invention. It is the surface photograph of the fine particle row | line | column of the diamond abrasive grain with an average particle diameter of 15 micrometers arrange | positioned periodically by the formation method of the composite plating film of this invention. 4 (a) and 4 (b) are fine particle arrays formed with sound pressures of 10.7 kPa and 16.6 kPa, respectively. The relationship between the interval of fine particle rows of alumina abrasive grains having an average particle diameter of 16 μm arranged periodically and the reflection angle θ by the method for forming a composite plating film of the present invention. It is the relationship between the width of fine particle rows of diamond abrasive grains having an average particle diameter of 7.5, 15, and 50 μm periodically arranged by the method of forming a composite plating film of the present invention and the sound pressure near the substrate. The width of fine particle rows of diamond abrasive grains having an average particle diameter of 7.5, 15, and 50 μm periodically arranged by the method of forming a composite plating film of the present invention and the acoustic radiation force toward the nodes on the substrate surface at the edge portions of the fine particle rows It is a relationship. It is the relationship of the acoustic radiation force which goes to a node on the substrate surface required for the arrangement | sequence of an abrasive grain with respect to the particle diameter of the diamond abrasive grain periodically arrange | positioned with the formation method of the composite plating film of this invention. It is an electron micrograph of the composite plating film containing the fine particle row | line | column of the diamond abrasive grain of the average particle diameter of 15 micrometers arrange | positioned periodically of this invention. FIG. 10 shows the anisotropy of the thermal diffusivity of the composite plating film included in the fine particle rows of diamond abrasive grains having an average particle diameter of 15 μm arranged periodically according to the present invention shown in FIG. It is sectional drawing of the electroformed grindstone which has periodicity in the in-plane direction of this invention and a surface orthogonal | vertical direction. FIG. 11A and FIG. 11B are an AA ′ sectional view and a BB ′ sectional view in FIG. 10 showing the electroformed grinding wheel of the present invention, respectively.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  In FIG. 1, a standing wave sound field is generated on the surface of the plating substrate 3 arranged on the xy plane by the ultrasonic vibrator 1 having the vibration plate 1 a and the reflection plate 2. The ultrasonic vibrator 1 is fixed so that the normal line of the vibration plate 1a and the plating substrate 3 are at an angle θ [°] on the xz plane. Reflector 2 has a normal of reflector 2 and plated substrate 3 at an angle θ [°] on the xz plane, and diaphragm 1a and reflector 2 have an angle 180 ° -2θ on the xz plane. Fix to be. The ultrasonic plane wave irradiated from the vibration plate 1a travels straight through the plating solution 4 along the ultrasonic wave propagation direction 18, is reflected by the plating substrate 3 at an angle θ, and is then reflected by 180 ° by the reflecting plate. The traveling wave and the reflected wave generate a standing wave sound field having a nodal line that is periodic and perpendicular to the traveling direction of the ultrasonic wave on the substrate. The fine particles dispersed in the plating solution are aligned on the nodal line by the acoustic radiation force toward the nodal line to form the fine particle row 5. By embedding this fine particle row with a plating film grown from the surface of the plating substrate 3, a composite plating film having directionality can be formed. The reflector 2 may be replaced with a diaphragm.

  In the configuration of FIG. 1, the distance Lt between the diaphragm and the central point 9 of the plating formation portion on the plating substrate surface is 60 mm, the distance Lr between the reflection plate and the central point 9 of the plating formation portion is 40 mm, and the reflection angle θ is 45 °. In FIG. 3 showing the sound pressure distribution and the acoustic radiation force obtained by the finite element method analysis, sound pressure nodes exist on the plated substrate 3 at an interval 10 of λ / (2 × cos θ). However, λ [m] is the wavelength of the ultrasonic wave in the plating bath, and is obtained by the product of the reciprocal of the frequency f [Hz] of the ultrasonic wave and the sound velocity c [m / s] of the ultrasonic wave in the plating bath. On the plated substrate, the acoustic radiation force 8 works from the sound pressure antinode 7 toward the sound pressure node 6, and can collect fine particles on the sound pressure node 6. The interval 10 between the nodes of the sound pressure can be changed by the frequency f and the reflection angle θ.

  The ultrasonic frequency is preferably about 20 MHz (wavelength of about 0.075 mm) on the high frequency side in consideration of attenuation of the ultrasonic wave, and about 1 MHz (wavelength 1) on the low frequency side in consideration of the influence of ultrasonic diffraction. Up to about 5 mm). The reflection angle θ is preferably about 20 ° to 70 ° in consideration of interference between the vibration plate 1a, the reflection plate 2, and the plating substrate 3. In this frequency range and angle range, the fine particle rows can be arranged at intervals (periods) of 0.05 to 2 mm.

  The acoustic radiation force takes a maximum value from the node of the sound pressure at a position that is a quarter of the interval between the nodes. Furthermore, from the experimental verification, the maximum size of the abrasive grains that can be arranged is about one-tenth of the knot spacing.

  4A and 4B show optical micrographs of the fine particle arrangement performed in the configuration of FIG. A vibrator (diameter HM-1630 manufactured by Honda Electronics Co., Ltd.) having a diaphragm diameter of 18 mm and a resonance frequency of 1.6 MHz was used as the vibrator, and a SUS304 steel plate having a thickness of 10 mm was used as the substrate and the reflector. The distance Lt between the vibration plate and the substrate was 60 mm, the distance Lr between the reflection plate and the substrate was 40 mm, the reflection angle θ was 45 °, the experiment apparatus was filled with water, and the diamond abrasive grains having an average particle diameter of 15 μm were aligned. . 4 (a) and 4 (b) show the results of experiments conducted under conditions of a sound pressure of 10.7 kPa and a sound pressure of 22.4 kPa at the abdomen of sound pressure near the substrate. The sound pressure was measured with a laser Doppler vibrometer using the change in water density due to the sound pressure as the change in optical path length. At a low sound pressure of 10.7 kPa, a wide abrasive grain array was obtained. On the other hand, at 16.6 kPa where the sound pressure was high, a narrower abrasive grain row was formed compared to the case where the sound pressure was low.

  FIG. 5 shows the relationship between the interval between the fine particle arrays arranged in the configuration of FIG. 1 and the reflection angle θ. The interval between the rows of abrasive grains was measured using a digital microscope. A vibrator (diameter HM-1630 manufactured by Honda Electronics Co., Ltd.) having a diaphragm diameter of 18 mm and a resonance frequency of 1.6 MHz was used as the vibrator, and a SUS304 steel plate having a thickness of 10 mm was used as the substrate and the reflector. The distance Lt between the diaphragm and the substrate is 60 mm, the distance Lr between the reflector and the substrate is 40 mm, the reflection angle θ is 20 ° to 65 °, the experimental apparatus is filled with water, and the alumina abrasive grains are aligned with an average particle diameter of 16 μm. Went. The interval between the fine particle rows was increased by the reflection angle θ, and the interval substantially coincided with the calculated value by λ / (2 × cos θ).

  FIG. 6 shows the relationship between the width of the fine particle array arranged in the configuration of FIG. 1 and the sound pressure in the vicinity of the plating substrate. The width of the abrasive grain row was measured using a digital microscope. A vibrator (diameter HM-1630 manufactured by Honda Electronics Co., Ltd.) having a diaphragm diameter of 18 mm and a resonance frequency of 1.6 MHz was used as the vibrator, and a SUS304 steel plate having a thickness of 10 mm was used as the substrate and the reflector. Diamond abrasive grains having an average particle diameter of 7.5, 15, and 50 μm, with the distance Lt between the diaphragm and the substrate being 60 mm, the distance Lr between the reflector and the substrate being 40 mm, the reflection angle θ being 45 °, and the experimental apparatus being filled with water. An alignment experiment was conducted. From FIG. 6, it can be seen that the higher the sound pressure, the narrower the row of fine particles, and the smaller the diameter of the diamond abrasive grains, the narrower the row width. That is, the width of the fine particle row is determined by the sound pressure. Further, it can be determined by the vibration amplitude of the diaphragm that controls the sound pressure.

FIG. 7 shows the relationship between the acoustic radiation force at the edge portion of the particle array arranged in the configuration of FIG. 1 and the width of the particle array. It can be said that the acoustic radiation force at the end of the abrasive grain row indicates the acoustic radiation force necessary to move the abrasive grains. The acoustic radiation force at the edge portion was analyzed by the finite element method on the distribution of sound pressure and particle velocity under the assumption that a perfect plane wave was irradiated from the diaphragm and no abrasive grains were present. In the analysis, the vibration speed at the end face of the vibrator was set so that the calculated value of the sound pressure was the same as the actually measured value. The acoustic radiation force applied to the abrasive grains was calculated from the sound pressure and particle velocity at the center of the abrasive grains, and the volume of the abrasive grains. The volume was calculated assuming that the abrasive grains were perfect spheres. The experimental conditions are the same as in the experiment of FIG. In diamond abrasive grains having an average grain size of 7.5 μm, 15 μm, and 50 μm, the acoustic radiation force at the end of each abrasive grain row is about 4.7 × 10 ⁻¹¹ N, about 5.5 × 10 ⁻¹⁰ N, about 6 .5 × 10 ⁻⁹ N showed a substantially constant value. These values are the acoustic radiation forces required to move each abrasive grain.

FIG. 8 shows the relationship between the acoustic radiation force necessary to move the above-mentioned abrasive grains and the grain diameter of the diamond abrasive grains. It can be seen that the abrasive can be moved when the acoustic radiation force F _R [pN] satisfies the following equation (1) with respect to the particle size D [μm] of the diamond abrasive.
^{_{F R ≧ 2.697 × D 2 -4.403}} × D-21.38 ···· (1)

  FIG. 2 shows a schematic diagram (a view of the substrate viewed from above) of a configuration in which two sets of the vibrator 1 and the reflecting plate 2 are arranged at an angle α on the xy plane. The configurations of the two vibrators 1 and the xz plane of the reflector are the same as those in FIG. With such a configuration, two types of fine particle arrays 5 that intersect at an angle α can be formed on the plating substrate 3.

FIG. 9 shows an electron micrograph of a composite plating film including a fine particle array of diamond abrasive grains having an average particle diameter of 15 μm arranged periodically. In the plating treatment, diamond abrasive grains (average particle diameter of 15 μm) are dispersed in a nickel sulfamate bath (bath composition: Ni (NH ₂ SO ₃ ) ₂ .4H ₂ O: 500 g / L H ₃ BO ₃ : 33 g / L). The plating bath was formed at a bath temperature of 50 ° C. and a current density of 5 A / dm ² . It can be confirmed that the diamond abrasive grains are taken into the nickel plating film while forming a row.

  A self-supporting film of a composite plating film including fine particles of diamond abrasive grains having an average particle diameter of 15 μm arranged periodically as shown in FIG. 9 was prepared, and thermal diffusivity measurement was performed by a laser flash method. FIG. 10 shows the thermal diffusivity in the direction of the diamond abrasive grains and the direction perpendicular thereto. From FIG. 10, it can be confirmed that there is anisotropy in thermal conductivity, which is one of the functions of the composite of fine particles. Thus, by arranging the functional fine particles with directivity, the functionality of the composite plating film can be provided with directivity.

  FIG. 11 shows a cross-sectional view of an electroforming grindstone having periodicity in the in-plane direction and the perpendicular direction using the composite plating film of the present invention. FIGS. 12A and 12B show an A-A ′ sectional view and a B-B ′ sectional view in FIG. 11 showing the electroformed grinding wheel of the present invention, respectively. The composite plating layer shown in FIG. 12A and FIG. 12B has a row of abrasive grains such as diamond abrasive grains and cubic boron nitride abrasive grains orthogonal to each other at an angle of 90 °. The number of grain rows can be determined according to the application. In the case of a grindstone, the directionality of the function in the in-plane direction is unnecessary, but this periodic arrangement can control the concentration of abrasive grains, and there are effects such as chip removal by regular arrangement and expansion of the chip pocket. I can expect. The composite plating layer shown in FIG. 12A has a narrow abrasive grain width and a high degree of abrasive grain concentration. The composite plating layer shown in FIG. 12B has a wide abrasive grain width and a low degree of abrasive grain concentration. By giving periodicity in the direction perpendicular to the surface, it is possible to change the degree of function by giving different functions to the body layer sandwiched between the grinding wheel side surface 16 and the grinding wheel side surface layer acting on the processing. is there. For example, by changing the concentration of abrasive grains, it is possible to produce an electroformed grinding wheel having a configuration in which the sharpness is given priority on the side of the grinding wheel and the strength of the grinding stone is given priority in the body layer.

DESCRIPTION OF SYMBOLS 1 Ultrasonic vibrator 1a Ultrasonic vibrating plate 2 Reflector 3 Plating substrate 4 Plating solution 5 Fine particle row 5a Fine particle 6 Sound pressure node 7 Sound pressure antinode 8 Acoustic radiation force 9 Center point of plating forming part 10 Sound pressure node Period (interval)
DESCRIPTION OF SYMBOLS 11 Plating film 12 High concentration abrasive grain layer 13 Low concentration abrasive grain layer 14 Grinding wheel outer peripheral part 15 Grinding wheel inner peripheral part 16 Grinding wheel side face 17 Grinding wheel rotation center 18 Ultrasonic propagation direction (normal direction of a vibration board or a reflecting plate)

Claims (20)

  A composite plating film in which fine particles of several nanometers to several tens of micrometers are dispersed, the composite plating film having a linear fine particle array, and having a composite plating layer in which the fine particle array is periodically arranged   2. The composite plating film according to claim 1, wherein a period of the fine particle row is 0.05 to 2 millimeters.   3. Either one of claim 1 or claim 2, wherein there are two or more pairs of fine particles arranged periodically, which are in the same plane in the composite plating film, and each fine particle row is arranged at an angle α. Composite plating film according to   The composite plating layer according to any one of claims 1 to 3, wherein the composite plating layer in which the fine particle rows are periodically arranged is laminated, and the cycle in each composite plating layer is the same. Coating   The composite plating layer according to any one of claims 1 to 3, wherein the composite plating layer in which the fine particle rows are periodically arranged is laminated, and the period in the continuous composite plating layer is different.   The composite plating film according to any one of claims 1 to 5, wherein the fine particles are fine particles of either diamond or cubic boron nitride.   The composite plating film according to any one of claims 1 to 5, wherein the fine particles are fine particles of single-walled carbon nanotubes, multi-walled carbon nanotubes, or graphene.   6. The composite plating film according to claim 1, wherein the fine particles are metal fine particles that form an alloy with the plating matrix.   The fine particles are two or more types of fine particles, and are fine particles selected from diamond, cubic boron nitride, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and metal fine particles. 5. Composite plating film in any one of 5   The composite plating film according to any one of claims 1 to 9, wherein a matrix phase of the plating film is any one of nickel, copper, a nickel alloy, and a copper alloy.   The composite plating film according to any one of claims 1 to 10, wherein the fine particles contain at least fine particles of either diamond or cubic boron nitride on the side surface and the outer peripheral surface of the disk-shaped base metal. An electrodeposited grindstone that is formed into a film and is a cutting edge of a grindstone   The composite plating film according to any one of claims 1 to 10, wherein the fine particles contain at least fine particles of either diamond or cubic boron nitride, are self-supporting films, and are cutting edges of a grindstone. Electroforming grinding wheel featuring   A standing wave sound field that exists periodically is formed by immersing a base material for forming a plating film and an ultrasonic sound source in a plating bath in which the fine particles are dispersed, and forming a standing wave sound field on the surface of the base material by the ultrasonic sound source. 11. The method for producing a composite plating film according to claim 1, wherein the plating film is grown from the surface of the base material while the fine particles are arranged on the nodal portion by acoustic radiation force.   The ultrasonic sound source is a diaphragm, and the standing wave sound field is formed on the plating substrate surface by a combination of a vibration plate and a reflection plate above the plating substrate surface or a pair of two vibration plates, The vibration surface of the vibration plate, the reflection surface of the reflection plate, and the plating substrate surface of the base material are flat, and the intersection angle between the normal 1 of the vibration surface passing through the center point of the plating forming portion and the plating substrate surface is θ, The intersecting angle between the normal 2 of the other vibration surface or reflection surface paired with the vibration surface and the plating substrate surface is θ, and the normal 1 and the normal 2 are different, and the normal 1 and the normal 2 are the same. An interval L of λ / (2 × cos θ) on the plating substrate surface due to a plane wave that is on a plane and is excited from two vibration planes or a plane wave that is excited from one vibration plane and a plane wave that is reflected from a plane reflector. (However, λ [m] is the wavelength of the ultrasonic wave in the plating bath, and the frequency of the ultrasonic wave. a linear node is formed in the direction of the intersection of the vibration surface and the plating substrate surface by the product of the reciprocal of f [Hz] and the sound velocity c [m / s] of the ultrasonic wave in the plating bath. 14. The method of manufacturing a composite plating film according to claim 13, wherein the plating film is formed from the surface of the base material while directing the radiation force toward the node part so that the fine particles are arranged in a straight line at the node part.   The method for producing a composite plating film according to claim 13 or 14, wherein an interval L between the linear fine particle rows is changed by changing the crossing angle θ or the frequency f of the ultrasonic waves.   The composite plating according to any one of claims 13 to 15, wherein the vibration speed on the vibration surface is controlled to adjust the acoustic radiation force on the surface of the plating substrate to change the width of the fine particle row. Method for producing coating film The fine particles are diamond abrasive grains, and the acoustic radiation force F _R [pN] satisfies the following expression (1) with respect to the particle diameter D [μm] of the diamond abrasive grains. The manufacturing method of the composite plating film in any one of Claim 16
Serial ^{_{F R ≧ 2.697 × D 2 -4.403}} × D-21.38 ···· (1)   18. A straight nodal portion that intersects at an angle α is formed on the plating film forming surface by using two vibration surfaces or two or more pairs of one vibration surface and a plane reflecting plate. A method for producing a composite plating film according to any one of   A composite plating film is formed as a cutting edge of a grindstone on a side surface and an outer peripheral surface of a disk-shaped base metal using the method for manufacturing a composite plating film according to any one of claims 13 to 18, and electrodeposition A method for producing an electrodeposited grindstone characterized by producing a grindstone   A composite plating film is formed on a substrate using the method for manufacturing a composite plating film according to any one of claims 13 to 18, and is peeled from the substrate to manufacture an electroformed grinding wheel composed only of the composite plating film. Method for producing an electroformed grinding wheel