JP2014154088A - Protection panel-integrated touch panel sensor, method for manufacturing the same, and portable electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a protection panel-integrated touch panel sensor having a decorative part of thin film thickness and sufficient optical density at the periphery of a protection panel, to provide a method for manufacturing the protection panel-integrated touch panel sensor, and to provide a portable electronic device.SOLUTION: A protection panel-integrated touch panel sensor P having a transparent insulating base material for a protection panel as a substrate, comprises an operation part 30 and a decorative part 20 formed by being demarcated from the operation part 30 at the periphery of the operation part 30, when viewed from the viewing side. The operation part 30 of the substrate 10 has a capacitive sensor S formed on a side opposite to the viewing side. The decorative part 20 of the substrate 10 has a decorative layer 23 formed on the side opposite to the viewing side and metal layers 51, 52 formed in substantially the whole of an area of the decorative layer 23 on the side opposite to the viewing side. The metal layers 51, 52 comprise a wiring pattern 51 connected to electrodes of the capacitive sensor S and a metal back pressing layer 52 insulated from the wiring pattern 51 and formed in substantially the whole of the area of the decorative part 20 excluding an area with the wiring pattern 51.

Description

  The present invention relates to a decorative panel-integrated touch panel sensor that is decorated, a manufacturing method thereof, and a portable electronic device.

There is an increasing demand for portable electronic devices using touch panels such as mobile phones and tablet terminals.
A protective panel integrated touch panel sensor is often used for the display unit of such portable electronic devices. The protection panel integrated touch panel sensor includes a capacitance detection sensor unit (hereinafter referred to as a sensor unit) using a transparent conductive film as an electrode on the surface of the transparent substrate on the inner side of the electronic device, and the opposite side of the sensor unit. The outer surface is used as the operation surface. This operation surface is provided at the center of the surface opposite to the sensor unit. In recent years, decoration other than the operation surface has been required to have a beautiful appearance.

Conventionally, a dark color such as black or gray has been generally used as a decorative portion formed in a region other than the operation surface. However, in recent years, the popularity of white color among light colors is increasing.
The decoration part is often provided in a frame shape around the operation surface, but the frame pattern around the operation surface has a wiring pattern connected to the sensor on the operation surface on the surface inside the device. Is formed. Therefore, the decorative portion is required to have a shielding property so that the wiring pattern cannot be visually recognized from the outside of the device.
There is a method to increase the thickness of the coating layer of the decorative part in order to make the wiring pattern invisible from the outside of the device, but if the coating layer of the decorative part becomes thicker, There is a step, and a continuous wiring pattern cannot be formed. In particular, in the case of a white coating layer having high user needs, this problem is significant because the thickness necessary for shielding increases. There is a method to form the sensor part after first forming the decorative part and filling the step with a transparent flattening film, but a transparent film of up to several tens of μm is interposed between the sensor part and the substrate In many cases, the visibility of the operation surface is adversely affected, such as light interference due to.

Therefore, a technique is known in which the shielding property is improved with a thin coating layer by forming a metal backing layer (for example, Patent Documents 1 and 2).
Patent Document 1 relates to a structure of a decorative cover glass-integrated touch panel sensor, which is provided with a light-shielding metal layer on a screen printing layer formed on a glass substrate, and a back press by this metal layer. I do. In this technique, a metal vapor deposition film such as MAM (molybdenum-aluminum-molybdenum) having a very thin thickness of about 100 to 300 nm and a high light-shielding property is used. The thickness of the decorative part is about 120 μm by screen printing alone, and the thickness of the two layers is reduced to about 5 to 20 μm, and the display device wiring provided on the opposite side of the decorative part is shielded. And has a light shielding effect.

Patent Document 2 is a touch panel integrated with a decorative transparent protective substrate, and a decorative layer, an overcoat layer, and a touch panel layer are sequentially formed on the transparent protective substrate. In this touch panel, a display window portion and a decorative portion that covers the peripheral edge portion are formed on the surface of the transparent protective substrate on the opposite side to the visual recognition side. The display window unit has a touch panel function in which a signal line for detecting a touch position is formed. In the decorative layer, a colored resin layer formed by a photolithography method using a cured product of the photosensitive colored resin composition, and a metal film layer covering the colored resin layer are sequentially formed. The metal thin film has a function as a back presser that secures light shielding properties.
According to Patent Document 2, since the metal film layer is provided as a back press, the light shielding property is realized without increasing the film thickness of the entire decorative layer. A thin film with a thickness of about 1.0 to 3.0 μm can satisfy the required specifications of optical characteristics (concentration, etc.), so it is possible to reduce the number of manufacturing steps and form a decorative transparent protective substrate integrated touch panel. is there.

JP 2012-226688 A ([0029]) JP 2012-242928 A ([0013], [0017], [0018])

However, in the inventions of Patent Documents 1 and 2, since the metal backing layer is formed, a process for forming the backing layer is required in the touch panel manufacturing process, and the number of processes is increased.
Further, in the inventions of Patent Documents 1 and 2, metal wiring is formed on the decorative portion around the sensor portion of the touch panel and the metal backing layer via an overcoat layer made of an insulating material. There is a possibility that the metal wiring and the metal backing layer face each other with an insulator interposed therebetween, and parasitic capacitance is generated, which may adversely affect the circuit.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a thin film on the peripheral portion of the protective panel in the protective panel integrated touch panel sensor in which the front protective panel and the sensor unit are integrated. An object of the present invention is to provide a protective panel integrated touch panel sensor having a thick and sufficient optical density decorating part, a manufacturing method thereof, and a portable electronic device.
Another object of the present invention is to form a metal backing layer for the decorative portion at the same time as the wiring layer, so that it can be manufactured without increasing the number of steps and is cheaper, and is provided with a white coating layer for the decorative portion. A panel-integrated touch panel sensor, a manufacturing method thereof, and a portable electronic device are provided.
Still another object of the present invention is to provide a decorative portion that provides a sufficient optical density with a thin film thickness by providing a metal backing layer, and at the same time is less susceptible to parasitic capacitance due to the metal backing layer and the wiring layer. A protective panel integrated touch panel sensor, a manufacturing method thereof, and a portable electronic device are provided.

  According to the protection panel integrated touch panel sensor of claim 1, the subject is a protection panel integrated touch panel sensor using a transparent insulating base material for the protection panel as a substrate, as viewed from the viewing side, A decoration part formed of a region formed by dividing the operation part from the periphery of the operation part, and a capacitance sensor is formed on the operation part of the substrate on the opposite side of the visual recognition. The decorative portion of the substrate is formed with a decorative layer formed on the visual recognition reverse side, and a metal layer formed in substantially all regions on the visual recognition reverse side of the decoration layer, The metal layer includes a wiring pattern connected to the electrode of the capacitance sensor, and a metal backing that is insulated from the wiring pattern and formed in substantially all areas of the decorative portion except the wiring pattern. And the layer.

Thus, in order to provide the decoration part of the substrate with a decoration layer formed on the visual recognition reverse side and a metal layer formed in substantially all the region on the visual recognition reverse side of the decoration layer. Due to the light shielding property and high reflectivity of the metal layer, a sufficient light shielding property of the decorative portion can be obtained even if the decoration layer is thinned. As a result, it is possible to prevent the decorative portion from becoming darker or turbid than the color originally possessed by the decorative layer, and to obtain a decorative portion having a high aesthetic appearance.
In addition, the metal layer can improve the light-shielding property, so the decorative layer can be made thin, and while maintaining the light-shielding property, the level difference between the decorative part and the operation part that does not have the decorative layer is reduced. In addition, a continuous and good wiring quality wiring pattern can be easily formed between the sensor provided in the operation unit and the decoration unit without disconnection or the like in the stepped portion.

  Further, the metal layer formed in substantially all the region on the opposite side of the visual recognition layer includes a wiring pattern connected to the electrode of the capacitance sensor, and a metal backing layer insulated from the wiring pattern. Are arranged in parallel on a plane, and therefore, the generated parasitic capacitance can be expected to be smaller than the arrangement in which the surfaces face each other with an insulator interposed therebetween.

At this time, the metal layer has an overcoat layer that covers the entire area of the visual recognition reverse side of the operation part of the substrate and the visual recognition reverse side of the decoration part, or only the visual recognition reverse side of the decoration part. Is preferably formed on the decorative layer via the overcoat layer.
The overcoat layer has an effect of flattening fine irregularities on the surface of the substrate and / or the decorative layer, and can improve the adhesion with a film formed on the surface. In addition, as a result of the formation of a smooth film, the metal layer formed thereon can be finely patterned, so that defects due to short-circuit between the metal wiring and other portions are unlikely to occur, and the metal layer And the decorative layer can be reliably insulated. Since the overcoat layer in the present invention may be a thin film having a thickness of 5 μm or less, even if it is formed on the operation part, the visibility is not adversely affected.

At this time, it is preferable that the wiring pattern and the metal backing layer are insulated by a narrow slit formed between them.
In this way, since the slit is configured with a slight width, the slit is not visually recognized from the viewing side, and even if a slit for insulation is provided, the decorative effect of the decorative portion may be impaired. Absent.

At this time, it is suitable that the color of the decoration layer is white.
Since white has a low optical density, when the decorative layer is white, the metal wiring provided on the decorative layer is easy to see through, and the white decorative layer is shielded compared to other colors. The required film thickness increases. Therefore, when the color of the decorating layer is white, the light shielding effect by the metal backing layer of the present invention is remarkably exhibited.

At this time, the metal layer is formed of any one of an aluminum film or a multilayer film of an aluminum alloy film and a molybdenum alloy film, silver, and APC (silver, palladium, copper alloy), and the substrate is made of glass. Is preferable.
Since it comprises in this way, a metal layer can be comprised from a highly reflective metal, even if the film thickness of a decoration part is thin, glossiness can be increased and the beauty | look of a decoration part can be improved.
Specifically, the metal layer is a silver-white metal that exhibits a substantially flat reflectance of 80% or more in visible light of 400 to 700 nm, more preferably 85% or more, and further preferably 88% or more. It is preferable.

At this time, it is preferable that the portable electronic device has the protection panel integrated touch panel sensor according to any one of claims 1 to 5.
By comprising in this way, the aesthetics of the external appearance of a portable electronic device can be improved. Since portable electronic devices are frequently used daily by consumers, the portable electronic device having a touch panel sensor with a protective panel integrated touch panel sensor with high gloss and high aesthetics, As a gadget for achieving a sophisticated lifestyle, it is possible to appeal to consumers and increase the product value.

It is a manufacturing method of the protection panel integrated touch panel sensor of Claim 1, Comprising: The process of forming the said decoration layer in the said visual recognition reverse side surface of the said decoration part of the said board | substrate, and the said operation of the said board | substrate at least Forming a first ITO (indium tin oxide) film on the back surface of the part; forming a metal film on the decorative layer; patterning the metal film; and And forming the metal backing layer, forming a second ITO film, and patterning the second ITO film to form the remainder of the XY electrode pattern. Is preferred.
Thus, since the metal layer is formed by patterning the metal film formed on the decorative layer film, the wiring pattern and the metal backing layer can be formed simultaneously, and the number of manufacturing steps can be reduced.

In addition, by providing an overcoat layer over the entire substrate including the decorative layer, the level difference is further reduced, and the adhesion with the film formed on each surface is improved by flattening the surface unevenness. Can do.
At this time, it is preferable that a part of the XY electrode pattern is an intersection of the XY electrode patterns.
Since it comprises in this way, the intersection part of XY electrode pattern and the transparent conductive film of a decorating part can be formed into a film simultaneously, and the number of manufacturing processes can be reduced.

According to the present invention, the decoration portion of the substrate includes a decoration layer formed on the visual recognition reverse side and a metal layer formed in substantially all the region on the visual recognition reverse side of the decoration layer. Because of the provision of the light shielding property and high reflectance by the metal layer, even if the decoration layer is thin, sufficient light shielding properties of the decorative portion can be obtained. As a result, it is possible to prevent the decorative portion from becoming darker or turbid than the color originally possessed by the decorative layer, and to obtain a decorative portion having a high aesthetic appearance.
In addition, since the light shielding property can be improved by the metal layer, the decorative layer can be formed thinly, and the level difference between the decorative portion and the operation portion having no decorative layer is reduced while maintaining the light shielding property. In addition, a continuous and good wiring quality wiring pattern can be easily formed between the sensor provided in the operation unit and the decoration unit without disconnection or the like in the stepped portion.

Further, a metal layer formed in substantially all regions on the opposite side of the visual recognition layer of the decorative layer is insulated from the wiring pattern connected to the electrode of the capacitance sensor, and the decorative portion Among them, since the metal backing layer is provided in almost all regions except the wiring pattern, the wiring pattern and the metal backing layer can be formed simultaneously, and the number of manufacturing steps can be reduced.
Further, the influence of the generated parasitic capacitance on the circuit can be suppressed as compared with the conventional example in which the wiring pattern faces the metal backing layer through the insulator.

It is a portable electronic device which has a protection panel integrated touch panel sensor concerning one embodiment of the present invention. It is the plane explanatory view which looked at the protection panel integrated touch panel sensor concerning one embodiment of the present invention from the operation side back side. It is AA sectional drawing of FIG. It is a plane explanatory view of a sensor part of a protection panel integrated type touch panel sensor concerning one embodiment of the present invention. It is a perspective explanatory view of a sensor part of a protection panel integrated type touch panel sensor concerning one embodiment of the present invention. It is an expansion explanatory view of the part which the 1st electrode and the 2nd electrode of the protection panel integrated touch panel sensor concerning one embodiment of the present invention cross. It is BB sectional drawing of FIG. It is a flowchart which shows the manufacturing process of the protection panel integrated touch panel sensor which concerns on one Embodiment of this invention. It is a longitudinal cross-sectional view of the protection panel integrated touch panel sensor which concerns on other embodiment of this invention.

Hereinafter, a protection panel integrated touch panel sensor and a portable electronic device according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a portable electronic device having a protection panel integrated touch panel sensor according to an embodiment of the present invention. FIG. 2 is an explanatory plan view of the protection panel integrated touch panel sensor according to the embodiment of the present invention as viewed from the back side of the operation surface. FIG. 3 is a cross-sectional view taken along the line AA of FIG. FIG. 4 is an explanatory plan view of the sensor unit of the protection panel integrated touch panel sensor according to the embodiment of the present invention. FIG. 5 is an explanatory perspective view of the sensor portion of the protection panel integrated touch panel sensor according to the embodiment of the present invention. FIG. 6 is an enlarged explanatory view of a location where the first electrode and the second electrode of the protection panel integrated touch panel sensor according to the embodiment of the present invention intersect. 7 is a cross-sectional view taken along line BB in FIG. FIG. 8 is a flowchart showing a manufacturing process of the protection panel integrated touch panel sensor according to the embodiment of the present invention. FIG. 9 is a longitudinal sectional view of a protective panel integrated touch panel sensor according to another embodiment of the present invention.

(Portable electronic device and protection panel integrated touch panel sensor P)
FIG. 1 shows a portable electronic device 1 having a protection panel integrated touch panel sensor P (hereinafter referred to as “touch panel sensor P”) according to an embodiment of the present invention.
The portable electronic device 1 includes a shell 2 and a touch panel sensor P attached to the shell 2, and a device for operating the portable electronic device 1 is installed in a space surrounded by the shell 2 and the touch panel sensor P. Stored. The touch panel sensor P is attached to the shell 2 with the operation surface (viewing side surface) facing outside.

The touch panel sensor P according to the present embodiment is a protection panel integrated touch panel sensor for a projected capacitive touch panel, and is composed of a substantially rectangular plate-shaped body as shown in FIG. The decorative portion 20 formed in a frame shape from the end portion along the edge of the entire circumference of the touch panel sensor P and a substantially rectangular operation portion 30 formed inside the decorative portion 20. And are formed.
As shown in FIG. 3, the touch panel sensor P includes the substrate 10, the decoration layer 23 formed on the surface on the back side of the operation surface of the decoration portion 20 of the substrate 10, the entire operation portion 30 of the substrate 10, and the decoration. An overcoat layer 40 covering the layer 23, a sensor unit S formed on the overcoat layer 40 of the operation unit 30, a transparent conductive film 22 formed on the overcoat layer 40 in the decoration unit 20, and a metal wiring 51 and a metal backing layer 52. The sensor unit S corresponds to the capacitance sensor in the claims.

  The substrate 10 is made of glass, but may be formed of a transparent substrate such as plastic. As the plastic substrate, general-purpose resins such as PET resin, ABS resin, AS resin, polyolefin resin, and acrylic resin can be used. In addition, general-purpose engineering resins such as polystyrene resins, polycarbonate resins, polyacetal resins, ultrahigh molecular polyethylene resins, polysulfone resins, polyetherimide resins, polyimide resins, liquid crystal polyester resins, polyallyl heat resistant resins A super engineering resin such as, or a material obtained by combining a glass material and a resin material may be used. Moreover, you may comprise from the flexible film-like board | substrate which consists of PET resin etc.

The operation unit 30 of the substrate 10 has an overcoat layer 40 formed on the back side of the operation surface, and a sensor unit S is provided thereon.
The overcoat layer 40 covers the entire operation surface back surface of the substrate 10 from the operation surface back surface of the operation portion 30 of the substrate 10 to the surface on the operation surface back side of the decoration layer 23 formed on the substrate 10 of the decoration portion 20. It is formed to cover. The overcoat layer 40 reduces the level difference between the presence region and the non-existence region of the decorative layer 23, flattens the unevenness on the surface of the decorative layer 23, and the substrate 10 and the decorative layer 23, The adhesion with the transparent conductive film 22 formed thereon is improved. Note that the transparent conductive film 22 on the decorative layer 23 is not essential, and the metal wiring 51 and the metal backing layer 52 may be directly formed on the decorative layer 23. Even in that case, there is an effect of improving the adhesion as in the case of the transparent conductive film 22.

The overcoat layer 40 is made of an insulating material such as a thermosetting or radiation curable acrylate resin, methacrylate resin, epoxy resin, urethane resin, or polyimide resin. These resin compositions are formed on the substrate 10 on which the decorative layer 23 has been formed so as to have a film thickness of 1 to 10 μm and then cured by baking or ultraviolet irradiation.
The overcoat layer 40 may be formed of a substance other than a resin, for example, an inorganic material such as silicon oxide.
In this embodiment, since the overcoat layer 40 is formed, the metal wiring 51 and the metal backing layer 52 are separated from each other with a gap d2 on the continuous surface of the overcoat layer 40 in the decorative portion 20. When formed side by side, the patterning of the metal film becomes accurate due to the flattening of the surface. As a result, the metal wiring 51 and the metal backing layer 52 are also reliably insulated.

  In this embodiment, the overcoat layer 40 is formed so as to cover the entire back side of the operation surface of the substrate 10, but the entire back surface of the decorative layer 23, the decorative layer 23, and the operation unit The overcoat layer 40 is formed in a frame shape so as to cover the boundary line between the substrate 30 and the substrate 10 and not to provide the overcoat layer 40 in the central portion of the operation unit 30 on the back side of the operation surface of the substrate 10. May be. Further, regarding the substrate 10 and the decorative layer 23, the overcoat layer 40 may not be provided at all as long as the adhesion between the substrate 10 and the film material formed thereon is sufficient.

The structure of the sensor part S formed in the operation part 30 is shown in FIGS.
As shown in FIGS. 4 to 7, the sensor part S includes a first electrode (X electrode) 12, a second electrode (Y electrode) 14, and a first conduction part (X conduction part) made of the same transparent conductive film. 13, and has a second conductive portion 15 so as to cross across the first conductive portion 13, and an intermediate insulating layer made of an organic material layer is interposed between the first conductive portion 13 and the second conductive portion 15. 16.
The first electrodes 12 adjacent to each other in the panel horizontal direction (X direction) are connected by a first conduction portion 13.
The 1st electrode 12 and the 1st conduction | electrical_connection part 13 are transparent conductive films, such as an ITO (indium tin oxide) film | membrane.
As a result, a row is formed by the first electrode 12 and the first conductive portion 13, and a plurality of rows are formed as necessary to form the first electrode pattern.

The second electrodes 14 adjacent to each other in the panel vertical direction (Y direction) are connected by a second conduction portion 15.
The second electrode 14 and the second conducting portion 15 are transparent conductive films such as ITO films.
Thereby, a column is formed by the second electrode 14 and the second conductive portion 15, and a plurality of columns are formed as necessary to form a second electrode pattern.
The first electrode 12 and the second electrode 14 are arranged in a matrix in which the panels are alternately arranged in directions orthogonal to each other.

The first electrode 12 and the second electrode 14 are arranged with a predetermined gap d1 between the first electrode 12 and the second electrode 14 so that a predetermined capacity of charge can be stored.
The first conductive portion 13 and the second conductive portion 15 intersect with the intermediate insulating layer 16 therebetween.
The intermediate insulating layer 16 is generally large enough not to overlap the first electrode 12 and the second electrode 14.

As shown in FIGS. 2 to 4, the decorative portion 20 has a decorative layer 23 formed in a frame shape and an overcoat layer 40 sequentially formed on the surface on the back side of the operation surface of the substrate 10. A transparent conductive film 22 made of an ITO film, a metal wiring 51, and a metal backing layer 52 are formed.
The decorative layer 23 is composed of a colored resin layer formed of a cured product of the photosensitive colored resin composition in a predetermined pattern by a known screen printing or photolithography method.
The decorative layer 23 has a thickness of 1 μm or more, preferably 2 to 10 μm, and more preferably 1 to 5 μm.
When the white resin film is formed by screen printing or photolithography method without forming the metal backing layer, if it becomes thinner than about 5-10 μm, the shielding property cannot be obtained, and the fluorescent lamp on the opposite side of the film is transparent. However, in this embodiment, since the metal backing layer 52 is provided, sufficient shielding properties can be obtained even with a thickness of about 1 μm.

The photosensitive colored resin composition is prepared, for example, by dispersing a colorant in a resin binder using a dispersant and adding a monomer, a photopolymerization initiator, a sensitizer, a solvent, and the like to the dispersion. The colorant colors the decorative layer 23 in a desired color. Although pigments and dyes can be used, it is desirable to use pigments because of their excellent durability. The pigment may be either an organic pigment or an inorganic pigment, and the amount of the pigment is not particularly limited.
Moreover, although what color may be used as a pigment, it is especially suitable when a white pigment is used.

An overcoat layer 40 is formed on the upper surface of the decorative layer 23 to cover the entire surface on the back side of the operation surface of the substrate 10.
As shown in FIGS. 3 and 4, a transparent conductive film 22 made of an ITO film, a metal wiring 51 and a metal backing layer 52 are formed on the overcoat layer 40.
The transparent conductive film 22, the metal wiring 51, and the metal backing layer 52 are laminated so that each layer has the same shape when viewed from a direction perpendicular to the substrate 10 by patterning each layer by etching. Is formed.

  The metal wiring 51 is formed as a known pattern for connecting the first electrode 12 and the second electrode 14 and the connection terminal 51a constituting the output unit. FIG. 2 schematically shows the sensor portion S and the metal wiring 51, but there are a plurality of metal wirings 51 that connect the first electrode 12 and the second electrode 14 and the connection terminals 51a corresponding to each of them. They are formed in parallel with a slight gap between each other. Further, the plurality of metal wirings 51 are formed in the region near the operation unit 30 of the decoration unit 20, extending to the vicinity of the connection terminal 51 a along the operation unit 30, and separated from the operation unit 30 in the vicinity of the connection terminal 51 a. It is bent outwardly vertically toward the connected terminal 51a.

The metal backing layer 52 is formed in the decorative portion 20 with a gap d2 having a slight width between the metal wiring 51 and the connection terminal 51a. The metal backing layer 52 is formed on the entire surface of the decorative portion 20 other than the metal wiring 51, the connection terminal 51a, and the gap d2.
The gap d2 corresponds to a slit in the claims, and the end of the metal backing layer 52 in the direction parallel to the substrate 10 and the end of the metal wiring 51 and the connection terminal 51a in the direction parallel to the surface of the substrate 10. Is formed between. That is, the metal backing layer 52, the metal wiring 51, and the connection terminal 51a are formed at a distance of the gap d2 in the direction parallel to the surface of the substrate 10.
The width of the gap d2 is 10 to 50 μm, preferably 15 to 30 μm.
The metal backing layer 52, the metal wiring 51, and the connection terminal 51a are formed on the transparent conductive film 22 that are formed at the same time and constitute the same plane.

The metal wiring 51 and the metal backing layer 52 are made of a highly reflective metal such as aluminum or an aluminum alloy film, silver (Ag), or APC which is an alloy of silver (Ag), palladium (Pd), and copper (Cu). It is configured. Further, a laminated film composed of two layers of an aluminum aluminum or aluminum alloy film formed on the transparent conductive film 22 and a molybdenum alloy film formed thereon, and a molybdenum alloy film between the pair of aluminum aluminum or aluminum alloy films. You may comprise from the laminated film which consists of formed three layers.
If the metal wiring 51 and the metal backing layer 52 are composed of silver or APC, the metal wiring 51 and the metal backing layer 52 can be composed of a single layer instead of a plurality of layers. Since the film process can be performed only by forming a single film, the number of processes can be reduced, which is preferable.

For example, the metal wiring 51 and the metal backing layer 52 may have a reflectance of 80% or more at a wavelength of 400 to 700 nm (visible light region). When the reflectivity of the metal wiring 51 and the metal back pressing layer 52 is low, the color of the decorating portion 20 is gray when the decorating layer 23 is a light color such as white.
The thickness of the metal wiring 51 and the metal backing layer 52 may be a thickness that can function as a metal wiring, and is 100 nm or more, preferably 200 to 400 nm.
The connection terminal 51a can be connected to a flexible flat cable (not shown).

(Method for manufacturing touch panel sensor P)
Next, a manufacturing method of the touch panel sensor P of the present embodiment will be described based on FIG.
First, in Step 1, the decoration layer 23 is formed in a predetermined pattern on the back side of the operation surface of the decoration portion 20 of the substrate 10 by using a known photolithography method using a photosensitive colored resin composition.

In step 1, since the decorative layer 23 is formed by a photolithography method, it is possible to form a high-definition pattern that was impossible by screen printing or the like.
In this step, first, a photosensitive colored resin layer is formed by applying and drying a photosensitive colored resin composition on the substrate 10. Next, using a mask having a predetermined pattern, the photosensitive colored resin layer is exposed using an ultra-high pressure mercury lamp lamp or the like. Next, it develops with developing solutions, such as sodium carbonate aqueous solution, wash | cleans well after image development, and also it heat-processes and hardens after drying.

Next, after applying the resin composition so as to have a film thickness of 0.1 to 5 μm on the surface on the back side of the operation surface of the substrate 10 on which the decoration layer 23 has been formed in Step 1 in Step 2, firing or The overcoat layer 40 is formed by curing by ultraviolet irradiation.
Alternatively, an oxide of silicon or aluminum that is an inorganic material is formed to a thickness of 20 to 80 nm by a sputtering method, a vacuum evaporation method, or an ion plating method. The overcoat layer 40 is not limited to this, and the overcoat layer 40 is a material selected from other metal elements and transition metal compounds (oxides, nitrides, oxynitrides) and the like. Less metal compounds may be used.

Next, in step 3, a first ITO film is formed. This ITO film of the first layer is used for forming the first conductive portion 13 and the transparent conductive film 22 in the shape of the decorative portion 20 by etching in the subsequent step 6.
In this step, a transparent conductive film made of ITO is formed on the entire back side of the operation surface of the substrate 10 by sputtering.

  In this transparent conductive film, the substrate 10 is placed in a known planar magnetron type sputtering apparatus having an ITO target, and the flow rate of oxygen contained in the carrier gas is in the range of 0.1 to 1.0%. The substrate 10 is formed at a temperature of 200 to 300 ° C., more preferably 230 to 250 ° C.

Further, it is preferable that the inside of the sputtering apparatus is evacuated before film formation, and the pressure in the apparatus during sputtering is set to about 1 × 10 ⁻⁴ Pa. The oxygen amount in the carrier gas introduced after exhausting the apparatus is preferably 0.1% or more and 1% or less with respect to the inert gas used at the same time. At this time, argon (Ar), krypton (Kr), xenon (Xe) or the like can be used as the inert gas, and among these, Ar is preferable.

Thereafter, in step 4, a metal film made of a highly reflective metal such as aluminum or an aluminum alloy, silver (Ag), or an alloy of silver (Ag), palladium (Pd), copper (Cu) or the like is known. The film is formed by the sputtering method.
Next, in step 5, the metal film formed in step 4 is etched by photolithography to form a pattern in the shape of the metal wiring 51 and the metal backing layer 52.
Next, in Step 6, the first ITO film formed in Step 3 is etched by photolithography to form a pattern of the first conductive portion 13 and a pattern of the transparent conductive film 22 in the shape of the decorative portion 20 To do.

In the flow shown in FIG. 8, the first ITO film and the metal film are successively formed and then etched, but after the ITO film is formed, the ITO film is etched (step 6) first. Thereafter, metal film formation (step 4) and metal film etching (step 5) may be performed in this order.
Further, the transparent conductive film 22 below the decoration layer 23 and the wiring pattern 51 in the region of the decoration portion 20 is not an essential component, and a metal film may be formed directly on the decoration layer 23.

In step 7, an intermediate insulating layer 16 that covers a predetermined range where the first conductive portion 13 intersects the second conductive portion 15 is formed of a photoresist or the like.
In step 8, a second layer ITO film is formed by the same method as in step 3.
Next, in Step 9, the second layer ITO film formed in Step 8 is etched by photolithography in the same manner as in Step 6, and the first electrode 12, the second electrode 14, and the second conductive portion 15 are etched. Form a pattern.
The pattern of the first electrode 12 and the second electrode 14 corresponds to the remaining portion of the XY electrode pattern in the claims, and the pattern of the second conduction portion 15 corresponds to the wiring portion in the claims.
Thereafter, the process of FIG.

In the present embodiment, the transparent conductive film 22 is formed at the same time as the first conductive portion 13, but the present invention is not limited to this, and the transparent conductive film is formed at the time of film formation and patterning of the first conductive portion 13. The transparent conductive film 22 may be formed simultaneously with the formation and patterning of the first electrode 12, the second electrode 14, and the second conductive portion 15 after forming the intermediate insulating layer 16 without forming the intermediate insulating layer 16. In this case, the metal film formation and etching in steps 4 and 5 are performed after the second layer ITO film is formed, and the operation surface of the operation unit 30 is covered with the photoresist, and then the metal film is formed. .
In this embodiment, the ITO film is formed by the sputtering method. However, the present invention is not limited to this, and the ITO film may be formed by a vacuum evaporation method or a CVD method.
In the present embodiment, the metal wiring 51 and the metal backing layer 52 are formed on the transparent conductive film 22, but the transparent conductive film 22 may be formed on the metal wiring 51 and metal backing layer 52. . In this case, Step 3 and Step 4 are performed in reverse order, and Step 5 and Step 6 are performed in reverse order.

(Touch panel sensor P ')
In the above embodiment, the protection panel integrated touch panel sensor of the present invention is configured as a touch panel sensor for a projected capacitive touch panel. However, as shown in FIG. 9, a touch panel sensor P ′ for a surface capacitive touch panel is used. You may comprise as.
The touch panel sensor P ′ in FIG. 9 includes the substrate 10, a decoration layer 23 formed on the back surface of the operation surface of the decoration portion 20 of the substrate 10, the entire operation surface back side of the operation portion 30, and the decoration layer 23. A transparent electrode 17 made of an ITO transparent conductive film layer formed on the overcoat layer 40 of the operation section 30, and a transparent conductive film formed on the overcoat layer 40 of the decoration section 20. The film 22, the metal wiring 51, and the metal back pressing layer 52 are provided.

A method for manufacturing the touch panel sensor P ′ will be described.
First, in the same procedure as in step 1 of FIG. 8, the photosensitive colored resin composition is applied in a predetermined pattern on the back side of the operation surface of the decorative portion 20 of the substrate 10 by a known screen printing or photolithography method. The decoration layer 23 is formed.
Next, the overcoat layer 40 is formed in the same procedure as in step 2 of FIG.
Thereafter, an ITO film is formed on the entire surface by sputtering.
Next, in the same procedure as in step 4 of FIG. 8, a metal having high reflectivity such as APC which is aluminum or an aluminum alloy, silver (Ag), or an alloy of silver (Ag), palladium (Pd), and copper (Cu). A metal film made of is formed by a known sputtering method.

Next, the formed metal film is etched by photolithography to form a pattern in the shape of the metal wiring 51 and the metal backing layer 52.
The pattern of the metal wiring 51 and the metal backing layer 52 is such that the metal wiring 51 and the metal backing layer 52 are in a state in which a slight gap d2 is formed between the metal wiring 51 and the metal backing layer 52. It is formed so as to cover the entire area of the decorative portion 20 other than the gap d2.
Next, the formed ITO film is etched by photolithography to form a pattern of the transparent electrode 17 and the transparent conductive film 22 in the shape of the frame-shaped decorative portion 20 along the outer periphery of the substrate 10. Complete '.
The ITO film may be formed by a vacuum deposition method or a CVD method.

P, P 'Protection panel integrated touch panel sensor S Sensor part d1, d2 Gap 1 Portable electronic device 2 Shell 10 Substrate 12 First electrode (X electrode)
13 First conduction part (X conduction part)
14 Second electrode (Y electrode)
15 Second conductive portion 16 Intermediate insulating layer 17 Transparent electrode 20 Decorating portion 22 Transparent conductive film 23 Decorating layer 30 Operating portion 40 Overcoat layer 51 Metal wiring 51a Connection terminal 52 Metal backing layer

Claims (9)

A protection panel integrated touch panel sensor having a transparent insulating substrate for a protection panel as a substrate,
As seen from the viewing side, the operation unit, and a decoration unit composed of a region formed by partitioning the operation unit on the periphery of the operation unit,
In the operation portion of the substrate, a capacitance sensor is formed on the opposite side of the visual recognition,
The decorative portion of the substrate is formed with a decorative layer formed on the visual recognition reverse side, and a metal layer formed in substantially all regions on the visual recognition reverse side of the decorative layer,
The metal layer includes a wiring pattern connected to the electrode of the capacitance sensor, and a metal backing that is insulated from the wiring pattern and formed in substantially all areas of the decorative portion except the wiring pattern. And a protective panel integrated touch panel sensor. An overcoat layer that covers the entire area of the visual recognition reverse side of the operation part of the substrate and the visual recognition reverse side of the decoration part, or the visual recognition reverse side of the decoration part;
The protection panel integrated touch panel sensor according to claim 1, wherein the metal layer is formed on the decorative layer via the overcoat layer.   3. The protection panel integrated touch panel sensor according to claim 1, wherein the wiring pattern and the metal backing layer are insulated by a narrow slit formed between each other.   4. The protection panel integrated touch panel sensor according to claim 1, wherein the color of the decorative layer is white. The metal layer is formed of any one of aluminum or a multilayer film of an aluminum alloy film and a molybdenum alloy film, silver, and APC (silver, palladium, copper alloy),
5. The protection panel integrated touch panel sensor according to claim 1, wherein the substrate is made of glass.   A portable electronic device comprising the protection panel integrated touch panel sensor according to claim 1. It is a manufacturing method of the protection panel integrated touch panel sensor in any one of Claims 1 thru | or 5, Comprising:
Forming the decorative layer on the surface of the decorative portion of the substrate on the opposite side of the visual recognition;
Forming a first ITO (indium tin oxide) film on the back surface of the operation section of the substrate;
Patterning the first ITO film to form part of the XY electrode pattern on the operation surface;
Forming a metal film on the decorative layer;
Patterning the metal film to form the wiring pattern and the metal backing layer;
Forming a second ITO film;
And patterning the second ITO film to form the remainder of the XY electrode pattern. A method for manufacturing a protection panel integrated touch panel sensor, comprising: It is a manufacturing method of the protection panel integrated touch panel sensor in any one of Claims 1 thru | or 5, Comprising:
Forming the decorative layer on the surface of the decorative portion of the substrate on the opposite side of the visual recognition;
Forming the overcoat layer on the entire surface on the surface opposite to the visual recognition side of the operation portion of the substrate and the decorative layer;
Forming a first ITO (indium tin oxide) film on the overcoat layer;
Forming a metal film on the first ITO film;
Patterning the first ITO film and the metal film to form a part of the XY electrode pattern on the operation surface, the transparent conductive film of the decorative portion, and the metal layer;
Forming a second ITO film;
And patterning the second ITO film to form a remaining portion of the XY electrode pattern and a wiring portion. A method of manufacturing a protection panel integrated touch panel sensor, comprising:   9. The method of manufacturing a protection panel integrated touch panel sensor according to claim 8, wherein a part of the XY electrode pattern is an intersection of the XY electrode pattern.

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