JP2014151261A - Adjustment method for substrate manufacturing apparatus, substrate manufacturing method, and the substrate manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adjustment method for a substrate manufacturing apparatus for forming a pattern of target dimensions.SOLUTION: A substrate with an evaluation pattern formed thereon is held on a stage, a part of the evaluation pattern is imaged in an imaging area by an alignment camera, and thus, a first measurement image is acquired. The stage is moved in the imaging area, a part of the evaluation pattern other than the part of the first measurement image is imaged by the alignment camera, and thus, a second measurement image is acquired. On the basis of the first measurement image and the second measurement image, a distance between at least two points of the evaluation pattern is calculated. On the basis of the distance between two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient to be reflected on a command from a control device to a nozzle head, is calculated.

Description

  The present invention relates to a substrate manufacturing apparatus adjustment method, a substrate manufacturing method, and a substrate manufacturing apparatus.

  A technique for forming a thin film pattern on a substrate by discharging liquid material (ink) droplets from a nozzle head having a plurality of nozzle holes toward the surface of a printed circuit board or the like is known. This technique is applied to, for example, formation of a solder resist on a printed circuit board. By using a plurality of nozzle heads, the effective arrangement pitch of the nozzle holes as a whole can be narrowed and the resolution can be increased. Furthermore, it is possible to widen an area where the liquid material can be landed by one scanning.

  Patent Document 1 discloses a method for adjusting the relative positional relationship between a plurality of nozzle heads. In the method disclosed in Patent Document 1, first, a sample substrate is placed on a stage, and ink is ejected from a plurality of nozzle heads to form a test pattern on the sample substrate. The stage is moved within the imaging range of the camera, and the test pattern is imaged. Based on the imaging result, the relative displacement of the nozzle head can be detected.

  Since it is difficult to fit the entire surface of the substrate within the imaging range of the camera, when imaging a plurality of reference marks on the substrate, the stage is moved to place each of the reference marks within the imaging range of the camera. The distance between the reference marks is calculated based on the position of the reference mark image in the image obtained by the camera and the moving distance of the stage.

  The moving distance of the stage is measured by an encoder signal from the stage moving mechanism. Therefore, the positional accuracy in the feed direction of the stage is guaranteed by the accuracy of the encoder.

JP 2012-96205 A

  Based on the shape and dimensions of the pattern to be formed, a command for ejecting ink from the nozzle holes is sent to the nozzle head. It is expected that the dimension of the pattern calculated based on this command and the dimension of the pattern calculated from the imaging result by the camera match with the accuracy of the encoder. However, it has been found that there are cases where the two do not match. If they do not match, a pattern having a target dimension cannot be formed when a command is sent to the nozzle head based on the imaging result of the camera.

  An object of the present invention is to provide a method for adjusting a substrate manufacturing apparatus for forming a pattern having a target dimension. Another object of the present invention is to provide a method of forming a thin film using a substrate manufacturing apparatus adjusted by this adjusting method. Still another object of the present invention is to provide a substrate manufacturing apparatus capable of performing adjustment by this adjustment method.

According to one aspect of the invention,
A stage for holding a substrate;
A stage moving mechanism for moving the stage between the imaging region and the drawing region along a linear guide;
An alignment camera that images the pattern on the stage when the stage is arranged in the imaging region;
A nozzle head that, when the stage is disposed in the drawing area, causes ink droplets to be ejected toward the substrate held on the stage and land the ink on the substrate;
An adjustment method for a substrate manufacturing apparatus having a control device for giving a command to eject ink to the nozzle head,
Holding a substrate on which an evaluation pattern is formed on the stage, and capturing a first measurement image by imaging a part of the evaluation pattern with the alignment camera in the imaging region;
Moving the stage in the imaging region, capturing a portion of the evaluation pattern different from the first measurement image with the alignment camera, and obtaining a second measurement image;
Calculating a distance between at least two points of the evaluation pattern based on the first measurement image and the second measurement image;
Based on the distance between the two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient for reflecting in the command from the control device to the nozzle head There is provided a method for adjusting a substrate manufacturing apparatus having a calculating step.

According to another aspect of the invention,
Holding the substrate on which the plurality of alignment marks are formed on the stage, and imaging the alignment marks with the alignment camera in the imaging region;
Reflecting the measurement result correction coefficient in the imaging result of the alignment mark and calculating the expansion / contraction amount of the substrate;
A method of manufacturing a substrate is provided, which includes reflecting a calculation result of an expansion / contraction amount of the substrate in image data defining a thin film pattern to be formed on the substrate, and forming a thin film on the substrate in the drawing region. The

  According to still another aspect of the present invention, an adjustment method for the substrate manufacturing apparatus and a substrate manufacturing apparatus to which the substrate manufacturing method is applied are provided.

  Position measurement before and after movement by the linear guide by moving the stage along the linear guide and calculating the distance between two points of the evaluation pattern based on the two first measurement images and the second measurement image The error can be corrected.

FIG. 1 is a plan view of the substrate manufacturing apparatus according to the first embodiment. FIG. 2 is a side view of the substrate manufacturing apparatus according to the first embodiment. FIG. 3A and FIG. 3B are side views that emphasize the behavior of the stage when the stage is moved by the stage moving mechanism. FIG. 4 is a flowchart of the substrate manufacturing apparatus adjustment method according to the first embodiment. FIG. 5A is a plan view showing the dimensions of the evaluation pattern based on the command content when forming the evaluation pattern on the reference substrate, and FIG. 5B shows the evaluation pattern calculated based on the imaging result of the formed evaluation pattern. It is a top view which shows a dimension. FIG. 6 is a flowchart of the substrate manufacturing method according to the first embodiment. FIG. 7A is a plan view showing the relative positional relationship of the alignment marks calculated based on the design data of the alignment marks formed on the substrate, and FIG. 7B is based on the result of imaging the alignment marks with the alignment camera. It is a top view which shows the relative positional relationship of the calculated alignment mark. FIG. 7C is a plan view of the substrate on which the thin film pattern is formed. FIG. 8 is a flowchart of the substrate manufacturing apparatus adjustment method according to the second embodiment. FIG. 9 is a plan view showing the dimensions of the evaluation pattern based on the measurement result by the length measuring device. FIG. 10A is a plan view showing an evaluation pattern with a known dimension, and FIG. 10B is a plan view showing the dimension of the evaluation pattern calculated based on the result of imaging an evaluation pattern with a known dimension with an alignment camera. . FIG. 11 is a flowchart of the substrate manufacturing method according to the second embodiment. FIG. 12 is a plan view of the substrate manufacturing apparatus according to the third embodiment. FIG. 13 is a plan view of another state of the substrate manufacturing apparatus according to the third embodiment. FIG. 14 is a plan view of still another state of the substrate manufacturing apparatus according to the third embodiment. FIG. 15 is a plan view of still another state of the substrate manufacturing apparatus according to the third embodiment. FIG. 16 is a plan view of still another state of the substrate manufacturing apparatus according to the third embodiment. FIG. 17 is a plan view of still another state of the substrate manufacturing apparatus according to the third embodiment.

[Example 1]
FIG. 1 is a plan view of a substrate manufacturing apparatus according to the first embodiment. An xyz orthogonal coordinate system is defined in which the horizontal plane is the xy plane and the upper vertical direction is the positive direction of the z-axis. The stage moving mechanism 22 moves the stage 20 in the y direction along the y direction linear guide 21. An encoder signal indicating the position of the stage 20 in the y direction is sent to the control device 50. A substrate 40 is held on the stage 20. A plurality of alignment marks 41 are formed on the surface of the substrate 40.

  Regarding the y direction, when the stage 20 is disposed in the transfer area 23, the substrate 40 is transferred between the transfer device (not shown) and the stage 20. The stage 20 passes through the imaging region 24 and moves in the y direction between the transfer region 23 and the drawing region 25. When forming the thin film, the stage 20 receives the substrate 40 from the transfer device in the transfer area 23. When the formation of the thin film on the substrate 40 is completed, the substrate 40 is transferred from the stage 20 to the transfer device in the transfer region 23.

  A plurality of alignment cameras 30 are arranged above the path of the stage 20 in the imaging region 24. By arranging one alignment mark 41 within the imaging range of the alignment camera 30, imaging of the alignment mark 41 within the imaging range is performed. Thereafter, the substrate 40 is moved in the y direction, and another alignment mark 41 is arranged within the imaging range of the alignment camera 30. In this state, the alignment mark 41 within the imaging range is imaged. As described above, in the imaging region 24, the plurality of alignment marks 41 can be imaged by moving the substrate 40 in the y direction with respect to the alignment camera 30. The alignment camera 30 is arranged corresponding to the position of the alignment mark 41 in the x direction. An image captured by the alignment camera 30 is transmitted to the control device 50.

  The alignment camera 30 can also be moved in the x direction according to the position in the x direction of the alignment mark 41 formed on the substrate 40.

  A nozzle head 60 is disposed above the path of the stage 20 in the drawing area 25. The nozzle head 60 has a plurality of nozzle holes formed on the surface facing the substrate 40. The plurality of nozzle holes are arranged at an equal pitch in the x direction. A droplet of ink, which is a liquid thin film material, is ejected from the nozzle hole toward the substrate 40. For this ink, for example, a photocurable resin is used. The ink can be cured by irradiating the ink adhering to the substrate 40 with curing light. A light source that emits light for curing is disposed, for example, on the downstream side of the nozzle head 60 with respect to the moving direction of the stage 20.

  The control device 50 stores image data 51 that defines the planar shape of the thin film pattern to be formed on the substrate 40. The control device 50 sends an ink ejection command to the nozzle head 60 based on the position of the stage 20 calculated from the encoder signal received from the stage moving mechanism 22 and the image data 51. A target thin film pattern can be formed by ejecting ink from each nozzle hole of the nozzle head 60 based on the ejection command.

  The y-direction linear guide 21, the stage moving mechanism 22, the alignment camera 30, and the nozzle head 60 are supported on the surface plate 70.

  In FIG. 2, the side view of the board | substrate manufacturing apparatus by Example 1 is shown. The y-direction linear guide 21 is fixed on the surface plate 70. The stage 20 is guided by the y-direction linear guide 21 and moves in the y direction. A substrate 40 is held on the stage 20. An alignment camera 30 is supported above the path of the stage 20 in the imaging region 24. A nozzle head 60 is supported above the path of the stage 20 in the drawing area 25. The height from the substrate 40 to the alignment camera 30 is higher than the height from the substrate 40 to the nozzle head 60. For example, the height from the substrate 40 to the nozzle head 60 is in the range of 0.5 to 1 mm, and the height to the alignment camera 30 is about 20 mm.

  The inventor of the present application conducted an evaluation experiment in which ink was ejected from the nozzle head 60 to form various evaluation patterns, and the evaluation pattern was imaged by the alignment camera 30. When the dimension of the evaluation pattern was calculated from the imaging result, it was found that the dimension calculated based on the command value to the nozzle head 60 may not match the dimension calculated from the imaging result. The reason why the two dimensions do not match will be described with reference to FIGS. 3A and 3B.

  FIG. 3A shows a side view of the y-direction linear guide 21 and the stage 20. Due to distortion of the surface plate 70 (FIG. 2), the y-direction linear guide 21 may be bent in the vertical direction. Since the stage 20 is guided by the curved y-direction linear guide 21 and moves in the y direction, the stage 20 is inclined with respect to the horizontal plane. It is assumed that the distance in the y direction between the two alignment marks 41 formed on the surface of the substrate 40 is W0.

  In FIG. 3A, the alignment camera 41 is imaged with the alignment camera 30 to obtain a measurement image. 3A shows a state in which the left alignment mark 41 is arranged at the center of the imaging range of the alignment camera 30. FIG.

  FIG. 3B shows a state where the stage 20 is moved leftward by a distance W0 from the state of FIG. 3A. In this state, the alignment camera 41 images the right alignment mark 41. Ideally, the stage 20 moves in a direction (horizontal direction) perpendicular to the optical axis of the alignment camera 30. In this case, the right alignment mark 41 is located at the center of the imaging range of the alignment camera 30. However, it has been found that the right alignment mark 41 may deviate from the center of the imaging range of the alignment camera 30. It has been found that this deviation is caused by the fact that the inclination angle fluctuates when the stage 20 moves because the y-direction linear guide 21 is curved.

  When a metal plate is used for the surface plate 70, the surface plate 70 may be distorted due to deformation due to heat, low rigidity, or the like. It is considered that the bending of the y-direction linear guide 21 is caused by the distortion of the surface plate 70.

  FIG. 3B shows a state in which the right alignment mark 41 is shifted to the left by the distance D from the center of the imaging range of the alignment camera 30. The distance between the left alignment mark 41 and the right alignment mark 41 is the position of the image of the left alignment mark 41 imaged in the state of FIG. 3A, the position of the right alignment mark 41 imaged in the state of FIG. 3B. It is calculated based on the position of the image and the moving distance W0 of the stage 20.

  In the state of FIG. 3A, the image of the left alignment mark 41 is detected at the center in the imaging range of the alignment camera 30. In the state of FIG. 3B, the image of the right alignment mark 41 is detected at a position shifted from the center of the imaging range of the alignment camera 30 by the distance D to the left. If the distance in the y direction of the two alignment marks 41 is calculated based on the imaging result in the state of FIGS. 3A and 3B and the moving distance W0 of the stage 20, the distance becomes W0-D. Thus, due to the distortion of the surface plate 70 (FIG. 2), an error occurs in the dimension calculated from the measurement result by the alignment camera 30.

  The substrate 40 is stretched or shrunk in the in-plane direction due to the thermal history received before forming the thin film pattern. When forming a thin film pattern on the substrate 40, the amount of expansion / contraction in the in-plane direction of the substrate 40 is calculated from the relative positions of the plurality of alignment marks 41 formed on the substrate 40. By stretching the image data of the thin film pattern to be formed according to the amount of expansion / contraction of the substrate 40, the pattern already formed on the substrate 40 and the thin film pattern to be formed can be matched. If an error occurs in the dimension calculated from the measurement result by the alignment camera 30, an error also occurs in the calculation result of the expansion / contraction amount of the substrate 40. When the image data is expanded or contracted according to the amount of expansion or contraction in which an error has occurred, the thin film pattern to be formed is shifted from the pattern already formed on the substrate 40. In the embodiment described below, the measurement error of the expansion / contraction amount of the substrate 40 can be reduced.

  FIG. 4 shows a flowchart of a method for adjusting a substrate manufacturing apparatus according to the first embodiment. In step SA1, a rectangular reference substrate is placed on the stage 20, and the stage 20 is moved to the drawing area 25 (FIG. 1). An evaluation pattern is formed on the reference substrate by ejecting ink from the nozzle head 60 based on a command from the control device 50 (FIG. 1).

  FIG. 5A shows a plan view of the reference substrate 80 on which the evaluation pattern is formed. The evaluation pattern is composed of four circular marks Pe1 to Pe4. The marks Pe1 to Pe4 are respectively arranged in the vicinity of the four corners of the reference substrate. The mark Pe1 is parallel to the y direction and is disposed slightly inside the vertex at which the edge on the positive side of the x axis and the edge on the positive side of the y axis intersect with each other in the x direction. Marks Pe1, Pe2, Pe4, and Pe3 are arranged counterclockwise when the reference substrate 80 is viewed from the front.

  In step SA2 (FIG. 4), the stage 20 is moved to the imaging area 24 (FIG. 1), and the evaluation pattern is imaged by the alignment camera 30. For example, the marks Pe1 and Pe2 are arranged in the imaging range of the two alignment cameras 30 (FIG. 1), respectively. In this state, first measurement images of the marks Pe1 and Pe2 are acquired. Thereafter, by moving the stage 20 in the y direction, the marks Pe3 and Pe4 are respectively disposed within the imaging ranges of the two alignment cameras 30 (FIG. 1). In this state, second measurement images of the marks Pe3 and Pe4 are acquired.

  In step SA3 (FIG. 4), a distance between at least two points of the evaluation pattern is calculated based on the first measurement image and the second measurement image. Further, the distance between two corresponding points of the evaluation pattern is calculated based on the content of the command from the control device 50 (FIG. 1).

  FIG. 5A shows the distance in the x direction and the y direction between two points calculated based on the content of the command from the control device 50 (FIG. 1). In FIG. 5A, the coordinates of the marks Pe <b> 1 to Pe <b> 4 are defined by command values from the control device 50 to the nozzle head 60. A coordinate system in which a position is defined by a command value from the control device 50 to the nozzle head 60 is referred to as a “drawing coordinate system”. For example, in the drawing coordinate system, the distances between the marks Pe1 and Pe2 in the x direction and the y direction are L1x and L1y, respectively.

  FIG. 5B shows the distances in the x and y directions between two points calculated based on the measurement image. A coordinate system in which a position is defined based on a measurement image obtained by the alignment camera 30 is referred to as a “measurement coordinate system”. For example, in the measurement coordinate system, the distances in the x direction and the y direction between the marks Pe1 and Pe2 are M1x and M1y, respectively. The distance in the x direction is calculated from the analysis result of the first measurement image or the second measurement image and the interval between the two alignment cameras 30 in the x direction. The distance in the y direction is calculated from the analysis results of the first measurement image and the second measurement image, and the amount of movement of the stage 20.

  In step SA4 (FIG. 4), a measurement result correction coefficient is calculated based on the distance between the two points. The measurement result correction coefficient is a coefficient to be reflected in the command value when generating a command to be sent to the nozzle head 60 (FIG. 1) based on the image data 51 (FIG. 1). The calculated measurement result correction coefficient is stored in the control device 50 (FIG. 1). Hereinafter, a method for calculating the measurement result correction coefficient will be described with reference to FIGS. 5A and 5B.

  The mark Pe1 shown in FIG. 5A is set as a reference point. The positional relationship between the drawing coordinate system and the measurement coordinate system so that the position of the reference point in the drawing coordinate system shown in FIG. 5A and the position of the reference point in the measurement coordinate system shown in FIG. Has been adjusted. The coordinates of the marks Pe1 to Pe4 in the measurement coordinate system are defined as (x1, y1) to (x4, y4), respectively. The coordinates of the mark Pe1 in the drawing coordinate system coincide with the coordinates (x1, y1) of the mark Pe1 in the measurement coordinate system.

The coordinates (xd2, yd2) to (xd4, yd4) of the marks Pe2 to Pe4 in the drawing coordinate system are expressed by the following equations, respectively.

In the above equation, L1x / M1x, L2x / M2x, L3x / M3x, L1y / M1y, L2y / M2y, and L4y / M4y are measurement result correction coefficients. From the coordinates in the measurement coordinate system, the coordinates in the drawing coordinate system can be calculated using the measurement result correction coefficient. The control device 50 gives an ink ejection command to the nozzle head 60 based on the coordinates in the drawing coordinate system.

  FIG. 6 shows a flowchart of the substrate manufacturing method according to the first embodiment. In step SB1, the substrate 40 on which a thin film is to be formed is placed on the stage 20 (FIG. 1). In step SB2, the stage 20 is moved to the imaging region 24 (FIG. 1), and the alignment mark 41 (FIG. 1) formed on the substrate 40 is imaged. Specifically, a plurality of measurement images are acquired while moving the stage 20 within the imaging region 24.

  In step SB3 (FIG. 6), the amount of expansion / contraction of the substrate 40 is calculated by reflecting the measurement result correction coefficient calculated in step SA4 (FIG. 4) in the imaging result of the alignment mark 41. Hereinafter, a method for calculating the amount of expansion / contraction of the substrate 40 will be described with reference to FIGS. 7A and 7B.

  FIG. 7A shows the distance between the alignment marks 41 calculated based on the design data of the alignment marks 41. The alignment mark 41 includes four alignment marks Pa1 to Pa4. The alignment marks Pa1 to Pa4 are arranged at the four corners corresponding to the marks Pe1 to Pe4 shown in FIG. 5A, respectively. For example, the design distances of the alignment marks Pa1 and Pa2 in the x and y directions are A1x and A1y, respectively.

  FIG. 7B shows the distance between the alignment marks (the distance in the measurement coordinate system) calculated based on the imaging results of the alignment marks Pa1 to Pa4. For example, the distances between the alignment marks Pa1 and Pa2 in the measurement coordinate system in the x direction and the y direction are B1x and B1y, respectively. Since the substrate 40 is expanded and contracted in the in-plane direction, the distance between the alignment marks in the measurement coordinate system is not the same as the distance between the corresponding alignment marks calculated from the design data.

The amount of expansion / contraction in the measurement coordinate system is expressed by the following equation. In the following equation, Emx1 and Emx2 are respectively the amount of expansion / contraction in the x direction in the vicinity of the lower edge of FIG. 7B and x in the vicinity of the upper edge.
Emy1 and Emy2 represent the amount of expansion / contraction in the y direction in the vicinity of the left edge in FIG. 7B and the amount of expansion / contraction in the y direction in the vicinity of the right edge, respectively.

Based on the expansion / contraction amount in the measurement coordinate system and the measurement result correction coefficient, the expansion / contraction amounts Emx1, Emx2, Emy1, and Emy2 in the measurement coordinate system are converted into the expansion / contraction amounts Edx1, Edx2, Edy1, and Edy2 in the drawing coordinate system. Expansion amounts Edx1, Edx2, Edy1, and Edy2 in the drawing coordinate system are expressed by the following equations.

In step SB4 (FIG. 6), the expansion / contraction amount in the drawing coordinate system is reflected in the image data 51 (FIG. 1) defining the thin film pattern to be formed. Specifically, the image data 51 is corrected according to the expansion / contraction amounts Edx1, Edx2, Edy1, and Edy2 in the drawing coordinate system. The amount of expansion / contraction is determined in the vicinity of the four edges of the substrate 40. The correction of the image data inside the substrate 40 can be performed by appropriately performing an interpolation operation. Based on the image data after the expansion / contraction amount is reflected, an ink ejection command is given from the control device 50 to the nozzle head 60 (FIG. 1).

  FIG. 7C shows a plan view of the substrate 40 on which the thin film pattern 42 is formed. In order to calculate the expansion / contraction amount of the substrate from the positions of the alignment marks Pa1 to Pa4 and form the thin film pattern 42 according to the expansion / contraction amount, the thin film pattern 42 can be positioned with high accuracy with respect to the alignment marks Pa1 to Pa4. it can. Further, in the first embodiment, after the expansion / contraction amount in the measurement coordinate system is converted into the expansion / contraction amount in the drawing coordinate system, the image data is corrected based on the expansion / contraction amount in the drawing coordinate system. For this reason, it is possible to eliminate the influence of the bending of the y-direction linear guide 21 (FIG. 1) and form the highly accurate thin film pattern 42.

  If a stone surface plate that does not easily cause distortion is used as the surface plate 70 (FIG. 2), the overall cost of the substrate manufacturing apparatus increases. In the substrate manufacturing apparatus according to the first embodiment, since the planar shape of the thin film pattern 42 is not easily affected by the distortion of the surface plate 70, a metal surface plate can be used instead of an expensive stone surface plate. is there.

[Example 2]
Example 2 will be described with reference to FIGS. Hereinafter, differences from the first embodiment will be described, and description of the same configuration and procedure will be omitted.

  FIG. 8 shows a flowchart of a substrate manufacturing apparatus adjustment method according to the second embodiment. In step SC1, an evaluation pattern is formed on the reference substrate 80 (FIG. 5A). The process of step SC1 is the same as the process of step SA1 (FIG. 4) of the first embodiment. In step SC2, the distance between two points of the evaluation pattern formed on the reference substrate 80 is measured with a length measuring device.

  FIG. 9 shows the distance between two points of the evaluation pattern measured by the length measuring device. For example, the distances in the x and y directions between the marks Pe1 and Pe2 are N1x and N1y, respectively.

  In step SC3 (FIG. 8), the actual dimensions of the thin film pattern to be formed and the nozzle head 60 from the controller 50 (FIG. 1) based on the command when the evaluation pattern is formed and the measurement result by the length measuring device. The drawing coordinate correction coefficient representing the relationship with the command value given to the is calculated. The drawing coordinate correction coefficient can be expressed by the distance between two points shown in FIGS. 5A and 9. The drawing coordinate correction coefficient includes L1x / N1x, L3x / N3x, L2y / N2y, L4y / N4y, and the like.

  In step SC4 (FIG. 8), a pattern having a known dimension is imaged by the alignment camera 30 (FIG. 1) in the imaging region 24 (FIG. 1). The process of step SC4 is the same as the process of step SA2 (FIG. 4) of the first embodiment. In step SC5, a measurement coordinate correction coefficient for converting the measurement result of the dimension by the alignment camera 30 into an actual dimension is calculated based on the imaging result of the pattern having a known dimension. Hereinafter, a method for calculating the measurement coordinate correction coefficient will be described.

  FIG. 10A shows a plan view of the reference substrate 81 on which an evaluation pattern with known dimensions is formed. The reference substrate 81 has substantially the same planar shape as the substrate 40 (FIG. 7A) on which a thin film pattern is to be formed. The evaluation pattern whose dimensions are known is constituted by marks Po1 to Po4, for example. The marks Po1 to Po4 are arranged in the vicinity of the four corners corresponding to the alignment marks Pa1 to Pa4 (FIG. 7A), respectively. For example, the distances in the x and y directions between the marks Po1 and Po2 are K1x and K1y, respectively.

FIG. 10B shows an image obtained as a result of imaging the reference substrate 81 shown in FIG. 10A with the alignment camera 30. For example, the distances in the x and y directions in the measurement coordinate system between the marks Po1 and Po2 are R1x and R1y, respectively. The measurement coordinate correction coefficient includes K1x / R1x, K3x / R3x, K2y / R2y, K4y / R4y, and the like. The drawing coordinate correction coefficient and the measurement coordinate correction coefficient are stored in the control device 50 (FIG. 1).

  FIG. 11 shows a flowchart of the substrate manufacturing method according to the second embodiment. In step SD1, a substrate 40 (FIG. 1) on which a thin film pattern is to be formed is placed on the stage 20 (FIG. 1). In step SD2, the stage 20 is moved to the imaging region 24 (FIG. 1), and the alignment mark 41 (FIG. 1) formed on the substrate 40 is imaged. Steps SD1 and SD2 are the same as steps SB1 and SB2 (FIG. 6) of the first embodiment.

  In step SD3 (FIG. 11), the actual expansion / contraction amount of the substrate 40 is calculated by reflecting the measurement coordinate correction coefficient in the imaging result of the alignment mark 41. For example, the actual expansion / contraction amount in the x direction of the lower edge shown in FIG. 7B is expressed as Em1x × (K1x / R1x).

  In step SD4 (FIG. 11), the expansion / contraction amount of the substrate 40 in the drawing coordinate system is calculated by reflecting the drawing coordinate correction coefficient in the actual expansion / contraction amount of the substrate 40. For example, the expansion / contraction amount in the drawing coordinate system in the x direction of the lower edge of the substrate 40 illustrated in FIG. 7B is represented by Em1x × (K1x / R1x) × (L1x / N1x).

  Also in the second embodiment, as in the first embodiment, a highly accurate thin film pattern can be formed according to the expansion and contraction of the substrate 40. Furthermore, in Example 2, steps SC4 and SC5 (FIG. 8) are executed as necessary by attaching a pattern (FIG. 10A) having a known dimension to the stage 20 (FIG. 1). A measurement coordinate correction coefficient can be calculated.

[Example 3]
A substrate manufacturing apparatus according to Example 3 will be described with reference to FIGS. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted. The substrate manufacturing apparatus according to the third embodiment has two processing systems, that is, a first processing system and a second processing system.

  As shown in FIG. 12, the first processing system includes a first transfer area 23A, a first imaging area 24A, and a drawing area 25. The second processing system includes a second transfer area 23B, a second imaging area 24B, and a drawing area 25. The drawing area 25 is common to the first processing system and the second processing system. A nozzle head 60 is arranged in the drawing area 25. The first transfer area 23A and the first imaging area 24A are defined at the same position in the x direction. The second transfer area 23B and the second imaging area 24B are defined at the same position in the x direction. The drawing area 25 is defined between the first imaging area 24A and the second imaging area 24B in the x direction.

  Hereinafter, the structure of the first processing system will be described. Guided by the first y-direction linear guide 21A, the first intermediate table 26A moves in the y-direction. A first x-direction linear guide 28A is attached to the first intermediate table 26A. The first stage 20A is guided by the first x-direction linear guide 28A and moves in the x direction. The first stage 20A moves between the first transfer area 23A and the drawing area 25 via the first imaging area 24A in the y direction. With respect to the x direction, the first stage 20A moves between the first imaging area 24A (hereinafter referred to as “fixed position”) and the drawing area 25 (hereinafter referred to as “processing position”).

Similarly to the first processing system, the second processing system also includes a second y-direction linear guide 21B, a second intermediate table 26B, a second x-direction linear guide 28B, and a second stage 20B. The second stage 20B moves between the second transfer area 23B and the drawing area 25 via the second imaging area 24B in the y direction. With respect to the x direction, the second stage 20B moves between the second imaging area 24B (hereinafter referred to as “fixed position”) and the drawing area 25 (hereinafter referred to as “processing position”).

  The first intermediate table 26A and the second intermediate table 26B are arranged away from each other in the x direction. When the first stage 20A and the second stage 20B are both arranged at fixed positions, the first intermediate table 26A and the second intermediate table 26B are moved to each other when moving in the y direction. I can pass each other. The processing position of the first stage 20A and the processing position of the second stage 20B are the same position in the x direction.

  In both the first processing system and the second processing system, the procedure of the substrate manufacturing method according to the first embodiment or the second embodiment can be executed.

  FIG. 12 shows a state in which the first stage 20A is arranged at a fixed position in the first delivery area 23A and the second stage 20B is arranged at a fixed position in the second delivery area 23B. In this state, the substrate 40 is transferred between the first stage 20A and the transfer device (not shown) and between the second stage 20B and the transfer device (not shown).

  FIG. 13 shows a state where the first intermediate table 26A is arranged within the first imaging region 24A and the first stage 20A is arranged at a fixed position. In this state, in the first processing system, imaging of the evaluation pattern (step SA2 in the first embodiment (FIG. 4)) and imaging of the alignment mark (step SB2 in the first embodiment (FIG. 6)) are executed.

  FIG. 14 shows a state in the middle of the movement of the first stage 20A from the first imaging region 24A to the drawing region 25. During the period in which the first intermediate table 26A moves from the first imaging area 24A to the drawing area 25 in the y direction, the first stage 20A moves in the x direction from the fixed position to the processing position.

  FIG. 15 shows a state where the first stage 20 </ b> A is disposed within the drawing area 25. In this state, in the first processing system, an evaluation pattern is formed (step SA1 in the first embodiment (FIG. 4)) and a thin film pattern is formed (step SB4 in the first embodiment (FIG. 6)). At this time, the second intermediate table 26 </ b> B is arranged at a position other than the drawing area 25.

  FIG. 16 shows a state in which the second intermediate table 26B is disposed within the second imaging region 24B and the second stage 20B is disposed at a fixed position. In this state, in the second processing system, imaging of the evaluation pattern (step SA2 in the first embodiment (FIG. 4)) and imaging of the alignment mark (step SB2 in the first embodiment (FIG. 6)) are executed.

  FIG. 17 shows a state where the second stage 20 </ b> B is disposed within the drawing area 25. In this state, in the second processing system, an evaluation pattern is formed (step SA1 in the first embodiment (FIG. 4)) and a thin film pattern is formed (step SB4 in the first embodiment (FIG. 6)). At this time, the first intermediate table 26 </ b> A is arranged at a position other than the drawing area 25.

  Also in Example 3, a highly accurate thin film pattern can be formed according to the expansion and contraction of the substrate 40 as in Examples 1 and 2. Further, in the third embodiment, when the thin film is formed on the substrate 40 in the first processing system, the alignment mark of the other substrate 40 can be imaged in the second processing system. For this reason, throughput can be improved.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

20 stage 20A first stage 20B second stage 21 y-direction linear guide 21A first y-direction linear guide 21B second y-direction linear guide 22 stage moving mechanism 23 delivery area 23A first delivery area 23B second Delivery area 24 Imaging area 24A First imaging area 24B Second imaging area 25 Drawing area 26A First intermediate table 26B Second intermediate table 28A First x-direction linear guide 28B Second x-direction linear guide 30 Alignment Camera 40 Substrate 41 Alignment mark 42 Thin film 50 Controller 51 Image data 60 Nozzle head 70 Surface plate 80 Reference substrate 81 Reference substrate

Claims (9)

A stage for holding a substrate;
A stage moving mechanism for moving the stage between the imaging region and the drawing region along a linear guide;
An alignment camera that images the pattern on the stage when the stage is arranged in the imaging region;
A nozzle head that, when the stage is disposed in the drawing area, causes ink droplets to be ejected toward the substrate held on the stage and land the ink on the substrate;
An adjustment method for a substrate manufacturing apparatus having a control device for giving a command to eject ink to the nozzle head,
Holding a substrate on which an evaluation pattern is formed on the stage, and capturing a first measurement image by imaging a part of the evaluation pattern with the alignment camera in the imaging region;
Moving the stage in the imaging region, capturing a portion of the evaluation pattern different from the first measurement image with the alignment camera, and obtaining a second measurement image;
Calculating a distance between at least two points of the evaluation pattern based on the first measurement image and the second measurement image;
Based on the distance between the two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient for reflecting in the command from the control device to the nozzle head And adjusting the substrate manufacturing apparatus.   Before acquiring the first measurement image and the second measurement image, further, a substrate is placed on the stage, and the stage is moved in the drawing region, based on a command from a control device. The method for adjusting a substrate manufacturing apparatus according to claim 1, further comprising a step of forming the evaluation pattern on the substrate by discharging ink droplets from the nozzle head toward the substrate.   The height from the said board | substrate to the said alignment camera when imaging the said evaluation pattern with the said alignment camera is higher than the height from the said board | substrate to the said nozzle head when ejecting ink from the said nozzle head. Or the adjustment method of the board | substrate manufacturing apparatus of 2. A stage for holding a substrate;
A stage moving mechanism for moving the stage between the imaging region and the drawing region along a linear guide;
An alignment camera that images the pattern on the stage when the stage is arranged in the imaging region;
A nozzle head that, when the stage is disposed in the drawing area, causes ink droplets to be ejected toward the substrate held on the stage and land the ink on the substrate;
A substrate manufacturing method using a substrate manufacturing apparatus having a control device for giving a command to eject ink to the nozzle head,
Holding a reference substrate on which an evaluation pattern is formed on the stage, capturing a part of the evaluation pattern with the alignment camera in the imaging region, and obtaining a first measurement image;
Moving the stage in the imaging region, capturing a portion of the evaluation pattern different from the first measurement image with the alignment camera, and obtaining a second measurement image;
Calculating a distance between at least two points of the evaluation pattern based on the first measurement image and the second measurement image;
Based on the distance between the two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient for reflecting in the command from the control device to the nozzle head A calculating step;
Unloading the reference substrate from the stage;
Holding the substrate on which the plurality of alignment marks are formed on the stage, and imaging the alignment marks with the alignment camera in the imaging region;
Reflecting the measurement result correction coefficient in the imaging result of the alignment mark and calculating the expansion / contraction amount of the substrate;
Forming a thin film on the substrate in the drawing region by reflecting a calculation result of the expansion / contraction amount of the substrate in image data defining a thin film pattern to be formed on the substrate.   5. The height from the substrate to the alignment camera when the substrate is imaged by the alignment camera is higher than the height from the substrate to the nozzle head when ink is ejected from the nozzle head. The manufacturing method of a board | substrate of description. A stage for holding a substrate;
A stage moving mechanism for moving the stage between the imaging region and the drawing region along a linear guide;
An alignment camera that images the pattern on the stage when the stage is arranged in the imaging region;
A nozzle head that, when the stage is disposed in the drawing area, causes ink droplets to be ejected toward the substrate held on the stage and land the ink on the substrate;
A control device that transmits a command to eject ink to the nozzle head and controls the stage moving mechanism;
The controller is
In a state where a reference substrate on which an evaluation pattern is formed is held on the stage, a part of the evaluation pattern is imaged by the alignment camera in the imaging region to obtain a first measurement image,
In the imaging region, the stage is moved, and a part of the evaluation pattern different from the first measurement image is captured by the alignment camera to obtain a second measurement image,
Calculating a distance between at least two points of the evaluation pattern based on the first measurement image and the second measurement image;
Based on the distance between the two points calculated based on the first measurement image and the second measurement image, a measurement result correction coefficient for reflecting in the command from the control device to the nozzle head Calculate
A substrate manufacturing apparatus that stores the calculated measurement result correction coefficient.   The control device further moves the stage in the drawing area with the reference substrate placed on the stage before acquiring the first measurement image and the second measurement image. The substrate manufacturing apparatus according to claim 6, wherein the evaluation pattern is formed on the reference substrate by discharging ink droplets from the nozzle head toward the substrate.   The height from the reference substrate to the alignment camera when imaging the pattern on the stage with the alignment camera is higher than the height from the reference substrate to the nozzle head when ink is ejected from the nozzle head. The board | substrate manufacturing apparatus of Claim 6 or 7 which is high. The controller is
In a state where a substrate on which a thin film is to be formed is placed on the stage, in the imaging region, obtain an imaging result of the alignment mark on the substrate imaged by the alignment camera,
Reflecting the measurement result correction coefficient in the imaging result of the alignment mark, calculating the expansion / contraction amount of the substrate,
Reflecting the calculation result of the expansion / contraction amount of the substrate in the image data defining the thin film pattern to be formed on the substrate, a command for forming the thin film pattern is transmitted to the nozzle head in the drawing region. The board | substrate manufacturing apparatus of any one of Claim 6 thru | or 8.

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