JP2014130727A - Lamp and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp which achieves excellent durability, is not limited by a junction temperature etc., and enables an electric power supply contact to make a proper electric connection with a module substrate.SOLUTION: A lamp 3 is formed including: a module substrate 22 in which LEDs 22b are mounted and a pattern wiring 22a connected with the LED 22b is formed; a housing 21 which houses the module substrate 22; a contact holding part 23c which is disposed facing the module substrate 22 in a state where the contact holding part 23c is positioned relative to the housing 21 to be held thereon; and a contact 32 which is held by the contact holding part 23c, the contact 32 where a first contact part 32a installed at the one end side may be connected with a connector reception part 16 side and a second contact part 32b installed at the other end side contacts with the pattern wiring 22a thereby being connected with the pattern wiring 22a.

Description

  The present invention relates to a lamp and a lighting device using a light emitting element as a light source.

  In recent years, lighting devices using light emitting elements such as light emitting diodes (LEDs) as light sources have been widely put into practical use. In an illumination device using such a light emitting element, for example, a 3-LED light source module using LEDs of R, G, and B colors, and yellow phosphors such as YAG and red phosphors are excited by light from blue LEDs. It is possible to obtain white light by using a light source module of a type that causes blue, green, and red phosphors (BGR phosphors) to be excited and emitted by light from an ultraviolet LED (UV-LED). ing.

  Among these light source modules, in particular, in a light source module using a blue LED, a yellow phosphor, and a red phosphor, high light emission efficiency can be realized, and this type of light source module is generally an LED chip. Is formed by pouring a phosphor-containing resin into a concave frame, reflector, or frame. The LEDs used for such applications are being reduced in light source size in addition to increasing the amount of light and increasing efficiency, and accordingly, high heat dissipation is required. In addition, as a use environment, heat resistance is required when used for a guide light, an emergency light, and the like.

  Therefore, an illumination device including a light emitting element such as an LED has a heat dissipation structure that efficiently dissipates heat generated in the light emitting element. For example, a configuration is widely adopted in which heat from a substrate on which an LED is mounted is radiated by a heat dissipation structure made of aluminum having good thermal conductivity.

  In addition, a contact that is a terminal for supplying power to a light emitting element that is a light source is provided in a hole formed in a substrate on which the light emitting element is mounted, and a lamp including a light source module having the light emitting element is attached to a socket. Then, the lamp-side contact comes into contact with the socket-side electrical contact portion.

  In the case of adopting the heat dissipation structure as described above, an insulating member for ensuring electrical insulation is required. From the viewpoint of simplification of the structure, in order to eliminate this insulating member, the thermal conductivity is not as high as that of aluminum, but it is also conceivable to use a ceramic substrate having electrical insulation (see, for example, Patent Document 1). .

  However, when a ceramic substrate is used, it is not preferable in terms of cost and the like to form a hole for a contact as a terminal in the ceramic substrate itself. Furthermore, the connection between the power supply contact and the pattern wiring connected to the light emitting element is generally performed by soldering on the ceramic substrate. However, there is a difference between the thermal expansion coefficient of the ceramic substrate and the thermal expansion coefficient of the solder. Therefore, when the lighting device is turned on and off, the temperature of the light emitting element and the vicinity thereof rises and falls, which may cause cracks due to stress caused by the difference in thermal expansion in the solder of the terminal on the ceramic substrate. In addition, since the generation of outer gas is small in the ceramic substrate, the junction temperature can be set high. However, in consideration of the reliability of the solder portion, it is desirable to limit the temperature of the solder portion to 90 ° C. or less. There are certain restrictions on the usage situation.

JP 2009-218192 A

  Therefore, the present embodiment has an object to provide a lamp and a lighting device that are excellent in durability and can accurately connect the power supply contact to the module substrate without being limited by the junction temperature or the like. And

  In order to solve the above problems, a lamp according to an embodiment includes a module substrate on which a light emitting element is mounted and a pattern wiring connected to the light emitting element is formed; a housing that houses the module substrate; and the housing A contact holding part disposed opposite to the module substrate in a state where the module board is positioned and held; one end side of the contact holding part being held by the contact holding part and being connectable to the power feeding part and housed in the housing A contact whose other end is connected to the pattern wiring of the module substrate by contact.

  According to this embodiment, it is excellent in durability and is excellent in durability without being limited by the junction temperature or the like, and the power supply contact can be accurately electrically connected to the module substrate.

The perspective view for demonstrating the structure of an illuminating device Perspective view of socket body of lighting device Sectional view along line III-III in FIG. 1 is a cross-sectional view taken along the line III-III in FIG. 1 with the socket and the lamp separated. Exploded assembly view of the lamp viewed from diagonally below Exploded assembly view of the lamp viewed from above Side view of contact for connector Perspective view showing the connector part partially broken Cross-sectional view of the main part showing the lamp connector area The perspective view which shows the relationship between a connector part and a connector receiving part Side view showing a variation of connector contact The top view which shows the modification of a connector member Cross-sectional view of the main part showing a modification of the connector Charts related to connector contact examples

  The lamp of the present embodiment includes a module substrate on which a light emitting element is mounted and a pattern wiring connected to the light emitting element is formed; a housing that houses the module substrate; and a positioning and holding with respect to the housing A contact holding portion disposed opposite to the module substrate in a state of being connected; one end side of the contact holding portion held by the contact holding portion and connectable to the power feeding portion; and the pattern of the module substrate housed in the housing And a contact whose other end is connected to the wiring by contact.

  As the light emitting element of the embodiment, an LED can be suitably used, but other light emitting elements such as a laser diode other than the LED may be used.

  As the module substrate of the embodiment, a ceramic substrate such as aluminum oxide (alumina) can be suitably used. For example, a substrate such as aluminum nitride other than aluminum oxide may be used.

  The contact of the embodiment is a plate-like or leaf spring-like member, but the contact may be a member having a shape other than the plate-like or leaf spring shape.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings relate to an embodiment of the present invention, FIG. 1 is a perspective view for explaining the configuration of the lighting device, FIG. 2 is a perspective view of a socket body of the lighting device, and FIG. 3 is taken along the line III-III in FIG. 4 is a sectional view taken along the line III-III of FIG. 1 in a state in which the socket and the lamp are separated from each other, FIG. 5 is an exploded view of the lamp seen from the lower oblique direction, and FIG. FIG. 7 is a side view of a contact for a connector, FIG. 8 is a perspective view showing a part of the connector part broken away, and FIG. 9 is an enlarged view showing the periphery of the connector part of the lamp. FIG. 10 is a perspective view showing the relationship between the connector portion and the connector receiving portion, FIG. 11 is a side view showing a modified example of the connector contact, and FIG. 12 is a plan view showing a modified example of the connector member. 13 is a cross-sectional view of the main part showing a modification of the connector, FIG. It is a table according to an embodiment of the contact of the connector.

  The illuminating device 1 shown in FIG. 1 is, for example, a high-output, high-output type illuminating device that is suitably used as a downlight. The lighting device 1 includes a socket 2 embedded in an indoor ceiling portion and the like, and a lamp 3 held in the socket 2. Hereinafter, the lighting apparatus 1 used as a downlight will be described in accordance with its mounting state, with the distal end side from which the illumination light is emitted being referred to as “lower side” and the proximal end side referred to as “upper side”.

  The socket 2 has a socket body 11 made of a resin molded product having a flat, substantially cylindrical shape, for example. A concave groove 11a having a partial arc shape in plan view is extended in the vertical direction at appropriate positions on the outer peripheral portion of the socket body 11 (for example, at six convenient positions for each predetermined pitch). A screw insertion hole 11b is formed in a wall portion at the upper end portion of these concave grooves 11a. The socket 2 is fixed to a ceiling portion or the like via a screw 12 inserted from the lower side into the screw insertion hole 11b.

  As shown in FIG. 2, an inward flange 11 c having a substantially annular shape is integrally formed at the lower end portion of the socket body 11. The inward flange 11c is provided with three sets of pins 13 in a set of two. As shown in FIG. 4, a lamp spring 14 for fixing the lamp is assembled to each pair of pins 13. An engagement claw portion 15 that protrudes to the inside of the socket body 11 is formed at a substantially central portion of each leaf spring 14.

  The columnar lamp 3 is mounted on the socket body 11 so as to be inserted into the inward flange 11 c inside the cylindrical socket 2. When the lamp 3 is attached to the socket 2, the engaging claws 15 engage with the recesses 21 e formed on the outer peripheral side of the lamp 3, whereby the lamp 3 is fixed to the socket 2.

  Two connector receiving portions 16 having an electrical contact portion with the lamp 3 are provided on one side portion of the socket body 11. These connector receiving portions 16 are provided with a plurality of slits 17 for receiving respective contacts 32 of a connector portion 31 on the lamp 3 side which will be described later. In the present embodiment, each connector receiving portion 16 is provided with, for example, three slits 17.

  Further, in the connector receiving portion 16, a contact piece portion 18 for making contact with the contact 32 received in the slit 17 is provided for each slit 17. Each contact piece 18 is a female terminal having two spring-like plate-like portions (see FIGS. 4 and 10), and the contact 32 that is a male-type terminal is sandwiched between the two plate-like portions. In contact with the contact 32. A corresponding harness 19 is connected to each contact piece 18, and each harness 19 is connected to a power supply unit (not shown). Since the contact 32, which is a plate-like member, comes into contact with the two plate-like portions, the contact area between the contact piece 18 and the contact 32 is large.

  The lamp 3 includes a housing 21, a module substrate 22 disposed on the base end side of the housing 21, a connector holding member 23 interposed between the housing 21 and the module substrate 22, and the module substrate 22. The heat dissipating plate 24 is disposed on the base end side, and the heat dissipating sheet 25 is disposed on the base end side of the heat dissipating plate 24.

  The casing 21 is a frame made of a resin molded product having a double cylinder structure in which an outer frame portion 21a having a substantially cylindrical shape and an inner frame portion 21b having a substantially rectangular tube shape are connected to each other via a plurality of ribs. It is a member. An annular taper surface portion 21 c that is inclined inward from the outer frame portion 21 a is formed on the front end side of the housing 21. A lens portion 21d for irradiating light from the module substrate 22 within a predetermined angle range is integrally formed inside the annular tapered surface portion 21c.

  The module substrate 22 is made of, for example, an insulating ceramic whose main component is aluminum oxide (alumina) and has high thermal conductivity, and its planar view shape is substantially the same as the opening shape of the inner frame portion 21b. It is comprised by the plate-shaped member which makes | forms.

  A plurality of pattern wirings 22 a are provided on a component mounting surface set on the lower surface side of the module substrate 22, and a part of these pattern wirings 22 a (for example, six pattern wirings 22 a) It extends to the side (the side corresponding to the connector receiving portion 16 of the socket 2) (see FIG. 5).

  Further, on the component mounting surface of the module substrate 22, a region corresponding to the lens portion 21 d of the housing 21 has, for example, a plurality of surface-mount type (SMD type) or chip-on-board type (COB type) light emitting elements. The LED 22b is mounted (see FIGS. 3 and 4), and the LED 22b is electrically connected to the pattern wiring 22a, whereby the light emitting unit 30 is formed on the module substrate 22. In addition, an annular protrusion 22c surrounding the LED 22b group is formed on the component mounting surface of the module substrate 22, and, for example, a translucent silicone mixed with a phosphor is provided inside the protrusion 22c. A sealing material 22d made of resin or the like is filled.

  The connector holding member 23 is made of, for example, a heat-resistant resin molded product or the like, and is configured by a plate-like member whose planar view shape is substantially the same as the opening shape of the inner frame portion 21b. A circular opening 23 a corresponding to the light emitting unit 30 is provided at a substantially central portion of the connector holding member 23.

  In addition, on the side facing the module substrate 22, a plurality of protruding leg portions 23 b whose tip portions can abut on the module substrate 22 are provided at appropriate positions around the opening 23 a. In addition, the leg part 23b may be comprised by implanting elastic members, such as a leaf | plate spring piece, in the connector holding member 23, for example.

  Further, on one side of the connector holding member 23 (side corresponding to the connector receiving portion 16 of the socket 2), for example, two contact holding portions 23c having a substantially rectangular parallelepiped shape are integrally formed. Each of these contact holding portions 23c is for constituting a connector portion 31 that electrically connects the lamp 3 to the socket 2, and a contact 32 corresponding to each slit 17 of the connector receiving portion 16 is held.

  More specifically, each contact 32 is configured by a metal plate-like member obtained by plating the same material as the pattern wiring 22a on the surface of a base material made of, for example, SUS or phosphor bronze. For example, as shown in FIG. 7, each contact 32 is formed in a substantially crank shape, and one end thereof is set as a so-called knife edge type first contact portion 32 a that can be inserted into the slit 17 of the connector receiving portion 16. . The other end side of each contact 32 is set as a second contact portion 32b that can be connected to the pattern wiring 22a of the module substrate 22, and the second contact portion 32b side has a plate surface with respect to the first contact portion 32a. It is twisted in the orthogonal direction. Further, a part of the second contact portion 32b is bent in the thickness direction to form a spring portion 32c.

  For example, as shown in FIGS. 8 and 9, each contact 32 protrudes from one side of the contact holding portion 23 c with the first contact portion 32 a oriented in the vertical direction with respect to the connector holding member 23. In addition, the second contact portion 32b is held by the contact holding portion 23c in a state where the second contact portion 32b is positioned so as to protrude toward the module substrate 22 while being oriented in the horizontal direction with respect to the connector holding member 23.

  The connector part 31 (contact holding part 23c) configured in this way has a connector holding member 23 and a module substrate 22 whose plan view shape is substantially the same as the opening shape of the inner frame part 21b. By being inserted, it is interposed between the casing 21 and the module substrate 22 and is positioned with respect to the casing 21 in a predetermined position.

  The heat radiating plate 24 is a plate-like plate made of aluminum having a substantially circular shape in plan view similar to the shape of the outer frame portion 21a and having a notch 24a formed in part. Further, the heat dissipating plate 24 is provided with screw holes 24b at four locations. The heat dissipating plate 24 is screwed with screws 24c so as to sandwich the connector holding member 23 and the module substrate 22 between the housing 21 and the heat dissipating plate 24. And screwed to the housing 21.

  When the heat radiating plate 24 is screwed to the housing 21, the upper surface of the module substrate 22 sandwiched between the heat radiating plate 24 and the housing 21 is pressed against the heat radiating plate 24 by the leg portions 23b of the connector holding member 23, and the module The substrate 22 is fixed in the housing 21. Therefore, the heat generated in the module substrate 22 is transmitted to the heat radiating plate 24.

  Further, by screwing the heat radiating plate 24 to the housing 21, the second contact portions 32 b of the contacts 32 protruding from the connector holding member 23 are brought into contact with the corresponding pattern wirings 22 a on the module substrate 22 to be elastic. Touched. Thereby, each contact 32 of the connector part 31 is electrically connected to each pattern wiring 22a on the module substrate 22 (see FIG. 9).

  A heat radiating sheet 25 is attached to the heat radiating plate 24. The heat dissipation sheet 25 is an aluminum plate-like plate having a substantially circular shape in plan view similar to the shape of the outer frame portion 21a and having a notch 25a formed in part. Therefore, the heat generated in the module substrate 22 is transmitted to the heat radiating sheet 25 through the heat radiating plate 24 and is radiated from the heat radiating sheet 25.

  In addition, the notch part 24a is formed in the thermal radiation plate 24, and the notch part 24a is formed so that it may not overlap with the connector part 31 when planarly viewed. Therefore, an insulation distance between the connector part 31 and the heat radiating plate 24 is ensured, and heat from the light emitting part 30 is hardly transmitted to the connector part 31.

  The lamp 3 configured as described above can be attached to and removed from the socket 2. In this case, when the lamp 3 is mounted on the socket 2, for example, as shown in FIG. 10, each first contact portion 32 a protruding from one side of the connector portion 31 is placed in the slit 17 of the corresponding connector receiving portion 16. Inserted and electrically connected to the contact piece 18. That is, each LED 22b on the lamp 3 is electrically connected to a power supply unit (not shown) through the connection between the connector unit 31 and the connector receiving unit 16.

  In such a configuration, when the lamp 3 is mounted on the socket 2 fixed to the ceiling and the lighting device 1 is turned on, the light emitting unit 30 formed on the module substrate 22 emits light. Most of the heat generated in the light emitting unit 30 is radiated through the heat radiating plate 24 and the heat radiating sheet 25. For example, when the lighting device 1 is lit continuously for a long time, the module substrate is caused by the remaining heat. 22 becomes high temperature. When the temperature of the module substrate 22 is increased in this way, the module substrate 22 and the contact 32 made of different materials thermally expand with different thermal expansion coefficients, but the module substrate 22 resulting from the difference in these thermal expansion coefficients. The displacement between the side and the contact 31 side is absorbed by the second contact portion 32b elastically contacting the pattern wiring 22a sliding on the pattern wiring 22a. Therefore, even when the module substrate 22 is heated, the electrical connection between the contact 32 and the pattern wiring 22a is accurately maintained.

  According to such an embodiment, the module substrate 22 on which the LED 22b is mounted and the pattern wiring 22a connected to the LED 22b is formed, the housing 21 that houses the module substrate 22, and the positioning and holding with respect to the housing 21 In this state, the contact holding portion 23c disposed opposite to the module substrate 22 and the first contact portion 32a held on the contact holding portion 23c and set on one end side can be connected to the connector receiving portion 16 side. The second contact portion 32b set on the other end side is provided with a contact 32 that is connected to the pattern wiring 22a by abutting to constitute the lamp 3, so that it has excellent durability and the contact 32 side. The contact 32 is connected to the module substrate 22 without being limited by the junction temperature with the module substrate 22 side. It is possible to accurately electrical connection Te.

  That is, a connection structure (solderless connection) in which the contact holding portion 23c is arranged to face the module substrate 22 while being positioned and held by the housing 21, and the contact 32 held by the contact holding portion 23c is brought into contact with the module substrate 22 side. By adopting the structure, it is possible to prevent contact failure due to solder temperature degradation and the like, and the electrical connection between the contact 32 side and the module substrate 22 side can be made accurately.

  In this case, a connector holding member 23 is interposed between the casing 21 and the module substrate 22, and the module substrate 22 is pressed against the heat radiating plate 24 via the connector holding member 23, thereby the connector holding member 23. On the other hand, not only the function of positioning and holding the contact holding portion 23c but also a function as a spacer for positioning the module substrate 22 in the optical axis direction can be provided. In this case, the connector holding member 23 is provided with leg portions 23b, and the module substrate 22 is pressed against the heat radiating plate 24 via the leg portions 23b. Can be thermally isolated. In addition, by appropriately setting the shape of the opening 23 a provided in the connector holding member 23, the connector holding member 23 can have a function as a light shielding mask that blocks stray light from the light emitting unit 30. .

  Further, one end side (first contact portion 32a side) of the contact 32 is arranged perpendicular to the connector holding member 23 (and module board 22), and the other end side (second contact portion 32b side) is twisted. By disposing the first contact portion 32a horizontally with respect to the connector holding member 23 (and the module substrate 22), the second contact portion 32b is inserted into the module substrate 22 while ensuring the insertability of the first contact portion 32a into the connector receiving portion 16. And can be suitably elastically contacted.

  Here, for example, in the above-described embodiment, an example in which the first contact portion 32a side and the second contact 32b side are set in different directions by twisting the contact 32 has been described. For example, FIG. As shown, it is possible to set the first contact portion 32a side and the second contact 32b side surfaces in different directions (orthogonal directions) by bending a part of the contact 32.

  Further, in the above-described embodiment, an example in which the two connector portions 31 are arranged in the same direction with respect to the module substrate 22 has been described. For example, as shown in FIG. It is also possible to arrange them diagonally with respect to 22. If comprised in this way, the load balance which each contact 32 gives with respect to the module board | substrate 22 can be equalized. At this time, each contact may be used for power feeding, or one of them may be used for non-power feeding, that is, only for holding the substrate.

  In the above-described embodiment, an example in which the contact holding portion 23c is positioned and held in the housing 21 via the connector holding member 23 has been described. For example, as illustrated in FIG. It is also possible to hold the housing 21 directly by screwing or the like.

Here, an example of the contact 32 in the present embodiment will be described.
In this embodiment, the base material of the contact 32 is phosphor bronze, and the plating material is the same gold as the wiring layer material of the pattern wiring 22a. Even if stainless steel is used, the same effect can be obtained. When the wiring material to be a contact on the pattern wiring 22a is gold, gold plating is used for the contact 32. In other words, the surface of the contact 32 is made of the same material as that of the pattern wiring 22a in order to avoid cross-metal corrosion. As shown in FIG. 14, the load (fixed load) applied to the module substrate 22 by the second contact portion 32b of the contact 32 is appropriately 70 to 200 grams. If it is less than that, the oxide layer on the substrate wiring layer cannot be removed at the time of contact, resulting in a contact failure. On the other hand, when it was stronger than 200 grams, the fixation was too strong, and the contact trace to the gold wiring was too strong, and a Pd layer formed in the lower layer appeared.

  As described above, by setting the fixed load in the range of 70 to 200 grams, good thermal conductivity can be obtained, and the occurrence of breakage (cracking) of the module substrate 22 can be suppressed. In addition, there was little change up to an operating temperature of 120 ° C. with a life of 40000 hours, and reliability between the contacts could be secured.

  DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Socket, 3 ... Lamp, 11 ... Socket main body, 11a ... Groove, 11b ... Screw insertion hole, 11c ... Inward flange, 12 ... Screw, 13 ... Pin, 15 ... Engagement claw part, 16 DESCRIPTION OF SYMBOLS ... Connector receiving part, 17 ... Slit, 18 ... Contact piece part, 19 ... Harness, 21 ... Housing, 21a ... Outer frame part, 21b ... Inner frame part, 21c ... Tapered surface part, 21d ... Lens part, 21e ... Recessed part, 22 ... Module substrate, 22a ... Pattern wiring, 22b ... Light emitting diode (light emitting element), 22c ... Projection part, 22d ... Sealing material, 23 ... Connector holding member, 23a ... Opening part, 23b ... Leg part, 23c ... Contact holding 24, heat dissipation plate, 24a ... notch, 24b ... screwing hole, 25 ... heat dissipation sheet, 25a ... notch, 30 ... light emitting part, 31 ... connector part, 32 ... contact, 3 a ... first contact portion, 32 b ... second contact portion, 32c ... spring part

Claims (5)

A module substrate on which a light emitting element is mounted and a pattern wiring connected to the light emitting element is formed;
A housing for housing the module substrate;
A contact holding portion disposed opposite to the module substrate while being positioned and held with respect to the housing;
A contact that is held by the contact holding portion and that can be connected at one end side to the power feeding portion and that is connected at the other end side to the pattern wiring of the module substrate housed in the housing by contact: A lamp comprising:   2. The lamp according to claim 1, wherein the contact is sandwiched between the casing and the module substrate so that the other end abuts against the pattern wiring. A connector holding member provided between the housing and the module substrate and provided with an opening corresponding to a light emitting portion formed by the light emitting element;
The lamp according to claim 1, wherein the contact holding portion is positioned and held by the housing via the connector holding member.   The lamp according to any one of claims 1 to 4, wherein the module substrate is constituted by a ceramic substrate.   An illuminating device using the lamp according to any one of claims 1 to 5.

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