CN203489203U - Lamp and illuminating device - Google Patents

Lamp and illuminating device Download PDF

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Publication number
CN203489203U
CN203489203U CN201320529511.3U CN201320529511U CN203489203U CN 203489203 U CN203489203 U CN 203489203U CN 201320529511 U CN201320529511 U CN 201320529511U CN 203489203 U CN203489203 U CN 203489203U
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CN
China
Prior art keywords
connector
module substrate
lamp
housing
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320529511.3U
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Chinese (zh)
Inventor
川岛净子
小柳津刚
柏木孝仁
高桥喜子
藤田正弘
木宫淳一
石田正纯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Filing date
Publication date
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Publication of CN203489203U publication Critical patent/CN203489203U/en
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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The utility model provides a lamp and an illuminating device which are excellent in durability, can be accurately and electrically connected to a module substrate through connectors for power supply and are not limited by the connecting-face temperature and the like. The lamp comprises the module substrate (22) provided with a light emitting diode (22b) and forming a pattern wire (22a) connected with the light emitting diode (22b), a casing (21) accommodating the module substrate (22), a connector keeping portion (23c) positioned relative to the casing (21) and opposite to the module substrate (22) in the kept state, and a connector (32) kept by the connector keeping portion (23c), wherein the first connection point portion (32a) arranged at one end can be connected with the connector accommodating portion (16), and the second connection point portion (32b) arranged at the other end is in abutting connection with the pattern wire (22a).

Description

Lamp and lighting device
Technical field
The utility model relates to a kind of light-emitting component that uses as lamp (1amp) and the lighting device of light source.
Background technology
In recent years, take lighting device that the light-emitting components such as light emitting diode (Light Emitting Diode:LED) are light source by practical widely.In using the lighting device of this kind of light-emitting component, for example, can pass through: the light source module that uses the 3LED mode of R, G, B LED of all kinds; Utilization makes the light source module of the yellow fluorophors such as Yttrium-Aluminium-Garnet (Yttrium Aluminum Garnet, YAG) and red-emitting phosphors stimulated luminescence mode from the light of blue led; Or utilize light from ultraviolet LED (UV-LED) to make the light source module etc. of indigo plant, green, red-emitting phosphors (BGR fluorophor) stimulated luminescence mode, and obtain white light.
Among these light source modules, especially can in using the light source module of blue led, yellow fluorophor and red-emitting phosphors, realize high-luminous-efficiency, this kind of light source module is generally by flowing into containing fluorophor resin and form being installed with among the concavity framework (frame) of LED chip (chip) or reflector (reflector) or frame portion.Be used for the LED of this kind of purposes except promoting large light quantization, high efficiency, also promote the downsizing of dimension of light source (size), follow these situations, require high-cooling property.In addition,, with regard to environment for use, in for situations such as guiding lamp, emergency lights, need heat resistance.
Therefore the lighting device that, possesses the light-emitting components such as LED has the radiator structure that the heat that makes to produce in light-emitting component is dispelled the heat expeditiously.For example, what adopt widely is following formation,, utilizes the heat-radiating structure of the good aluminium of thermal conductivity (aluminum) system that is, makes from the heat heat radiation that the substrate of LED is installed.
In addition, if the connector (contact) as being used for to the terminal of the light-emitting component supply power as light source is arranged in the hole forming on the substrate of light-emitting component is installed, and it is upper that the lamp that comprises the light source module with light-emitting component is arranged on to socket (socket), and the connector of lamp side contacts with the electric contact portion of socket side so.
In the situation that adopting radiator structure as above, need to be used for guaranteeing the insulating component of electrical insulating property.With regard to the viewpoint of designs simplification, in order to remove described insulating component, although also can consider to utilize thermal conductivity unlike so high pottery (ceramics) substrate (for example, with reference to patent documentation 1) with electrical insulating property of aluminium.
Yet, in the situation that utilizing ceramic substrate, at ceramic substrate itself, be formed for as the way in the hole of the connector of terminal unsatisfactory with regard to aspects such as costs.And, power supply supply normally utilized welding and carries out with connector and being connected of pattern distribution that is connected in light-emitting component on ceramic substrate, but because the difference of the coefficient of thermal expansion of ceramic substrate and the coefficient of thermal expansion of scolder is large, so, light-emitting component and near temperature thereof rise or decline because of the switch of lighting device, in the scolder of terminal that therefore, likely can be on ceramic substrate, produce and result from the slight crack (crack) of the stress that produces because of thermal expansion difference.In addition, because ceramic substrate seldom produces degassed (outgas), so, junction temperature (junction temperature) can be set as to height, but then, in the situation that consider the reliability of solder portion, wish the temperature limiting of solder portion at 90 ℃, with inferior, to be subject to the predetermined restriction of behaviour in service.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2009-218192 communique
Utility model content
Therefore, the object of present embodiment is to provide a kind of excellent in te pins of durability, and power supply can be electrically connected on to module substrate exactly with connector and not be subject to lamp and the lighting device of the restriction such as junction temperature.
In order to solve described problem, the lamp of embodiment comprises: module substrate, is installed with light-emitting component, and is forming the pattern distribution being connected with described light-emitting component; Housing, accommodates described module substrate; Connector maintaining part, to be positioned with respect to described housing and maintained state and the configuration of described module substrate subtend; And connector, by described connector maintaining part, kept, a distolateral power supply that is connected in, and another distolateral mode with butt is connected in the described pattern distribution of the described module substrate being housed in described housing.
The effect of utility model
According to present embodiment, can be so that excellent in te pins of durability be subject to the restrictions such as junction temperature, and excellent in te pins of durability, power supply is electrically connected on to module substrate exactly with connector.
Accompanying drawing explanation
Fig. 1 is for the stereogram of the formation of lighting device is described.
Fig. 2 is the stereogram of the socket main body of lighting device.
Fig. 3 is the sectional view along the III-III line of Fig. 1.
Fig. 4 is by the sectional view of the III-III line along Fig. 1 of socket and lamp released state.
Fig. 5 is the decomposition assembling figure from oblique lower side to observation lamp.
Fig. 6 is the decomposition assembling figure of side direction observation lamp from tiltedly.
Fig. 7 is the side view of connecting connector.
Fig. 8 blocks a part for connector portions and the stereogram that represents.
Fig. 9 amplifies by the connector portions periphery of lamp the major part sectional view representing.
Figure 10 means that connector portions and joint are subject to the stereogram of the relation of receiving part.
Figure 11 means the side view of the variation of connecting connector.
Figure 12 means the top view of the variation of connecting elements.
Figure 13 means the major part sectional view of the variation of connector portions.
The explanation of symbol
1 ... lighting device
2 ... socket
3 ... lamp
11 ... socket main body
11a ... groove
11b ... screw insertion hole
11c ... interior to flange
12 ... screw
13 ... pin
14 ... leaf spring
15 ... engaging claw
16 ... joint is subject to receiving part
17 ... slit
18 ... contact chip portion
19 ... wire harness
21 ... housing
21a ... outer frame
21b ... inside casing portion
21c ... conical surface portion
21d ... lens section
21e ... recess
22 ... module substrate
22a ... pattern distribution
22b ... light emitting diode (light-emitting component)
22c ... jut
22d ... encapsulant
23 ... joint retaining member
23a ... peristome
23b ... bracket part
23c ... connector maintaining part
24 ... heat sink
24a ... notch
24b ... screw fixed hole
24c ... screw
25 ... fin
25a ... notch
30 ... illuminating part
31 ... connector portions
32 ... connector
32a ... the 1st contact portion
32b ... the 2nd contact portion
32c ... spring portion
The specific embodiment
The lamp of present embodiment is characterised in that and comprises: module substrate, is installed with light-emitting component, and is forming the pattern distribution being connected with described light-emitting component; Housing, accommodates described module substrate; Connector maintaining part, to be positioned with respect to described housing and maintained state and the configuration of described module substrate subtend; And connector, by described connector maintaining part, kept, a distolateral power supply that is connected in, and another distolateral butt is connected in the described pattern distribution of the described module substrate being housed in described housing.
The light-emitting component of embodiment can preferably be used LED, but such as other light-emitting components such as laser diode (laser diode) that also can be except LED.
The module substrate of embodiment can preferably be used the ceramic substrate of aluminium oxide (alumina) etc., but such as the substrate that also can be aluminium nitride (aluminum nitride) beyond alumina etc.
The connector of embodiment is the member of tabular or leaf-spring-like, but connector also can be the member of the shape except tabular or leaf-spring-like.
Below, with reference to the accompanying drawings of this novel embodiment.Accompanying drawing is about this novel embodiment, Fig. 1 is for the stereogram of the formation of lighting device is described, Fig. 2 is the stereogram of the socket main body of lighting device, Fig. 3 is the sectional view along the III-III line of Fig. 1, Fig. 4 is with by the sectional view of the III-III line along Fig. 1 of the socket STA representation separated with lamp, Fig. 5 is the decomposition assembling figure from oblique lower side to observation lamp, Fig. 6 is the decomposition assembling figure of side direction observation lamp from tiltedly, Fig. 7 is the side view of connecting connector, Fig. 8 blocks a part for connector portions and the stereogram that represents, Fig. 9 amplifies by the connector portions periphery of lamp the major part sectional view representing, Figure 10 means that connector portions and joint are subject to the stereogram of the relation of receiving part, Figure 11 means the side view of the variation of connecting connector, Figure 12 means the top view of the variation of connecting elements, Figure 13 means that the major part cross section chart 1 of the variation of connector portions is the chart of the embodiment of connecting connector.
Table 1:
? Conventional example 1 Comparative example 1 Embodiment 1 Embodiment 2 Embodiment 3 Comparative example 2
Substrate material Aluminium oxide Aluminium oxide Aluminium oxide Aluminium oxide Aluminium oxide Aluminium oxide
Grade 96% 96% 96% 96% 96% 96%
Joint Screw Contact Contact Contact Contact Contact
Dead load (g) Be completely fixed 50 70 100 150 220
Judge ? × ×
Lighting device 1 shown in Fig. 1 is that the height output that is for example preferably used as Down lamp (down light) is the lighting device of high-power type.Lighting device 1 comprises the socket 2 in the ceiling portion that is embedded within doors etc. and the lamp 3 that kept by described socket 2 and forming.Below, to as the lighting device 1 of Down lamp, simulate its installment state, the front of radioluminescence light is called to " downside ", base end side is called to " upside " and describes.
Socket 2 comprises socket main body 11, and described socket main body 11 comprises the resin forming product that for example forms flat general cylindrical shape shape.Appropriate location (for example,, every preset space length, amounting to six places) at the peripheral part of described socket main body 11 is extended the groove 11a that plan view shape forms partial circle arcuation is set along above-below direction.Wall portion in the upper end of these grooves 11a is wearing screw insertion hole 11b.Socket 2 sees through from downside and is inserted through the screw 12 of described screw insertion hole 11b and is fixed on ceiling portion etc.
As shown in Figure 2, in the bottom of socket main body 11, be integrally formed become roughly circular interior to flange (flange) 11c.Described, interiorly to perpendicular in flange 11c, establishing three groups and take the pin (pin) 13 of two as a group.As shown in Figure 4, on described each group pin 13, assembling lamp fixing with leaf spring (bladespring) 14.Substantial middle portion at each leaf spring 14 is forming the interior side-prominent engaging claw 15 to socket main body 11.
The lamp 3 of cylindrical shape is arranged on socket main body 11 to be inserted into the interior mode to flange 11c of socket 2 inner sides of drum.When lamp 3 being installed to socket 2, by each engaging claw 15 is sticked in to the recess 21e that is formed on lamp 3 outer circumferential sides, and lamp 3 is fixed on socket 2.
At a sidepiece of socket main body 11, two joints with the contact site electrically contacting with lamp 3 are being set and are being subject to receiving part 16.At these joints, be subject to, in receiving part 16, a plurality of slits 17 (slit) are being set, described slit 17 is used for being held each connector 32 of the connector portions 31 of stating lamp 3 sides.In addition, in the present embodiment, at each joint, be subject to for example arranging respectively in receiving part 16 3 slits 17.
And, in joint is subject to receiving part 16, each slit 17 is being arranged respectively and is being used for and is subject to hold the contact chip portion 18 that the connector 32 in slit 17 contacts.Each contact chip portion 18 is for to comprise two gynetype terminals (with reference to Fig. 4, Figure 10) with flexible plate-like portion, and usings the state sandwiching as the connector 32 of male type terminal contact with connector 32 between two plate-like portions.In each contact chip portion 18, connect corresponding wire harness (harness) 19, each wire harness 19 is connected in not shown power supply unit.Connector 32 as tabular component contacts in the mode by two plate-like portion clampings, so contact chip portion 18 is large with the contact area of connector 32.
Lamp 3 is configured to and comprises: housing 21; Module substrate 22, is configured in the base end side of housing 21; Joint retaining member 23, is situated between and is contained between housing 21 and module substrate 22; Heat sink (radiator plate) 24, is provided in the base end side of module substrate 22; And fin (radiator sheet) 25, be provided in the base end side of heat sink 24.
Housing 21 is frame member, and described frame member comprises the outer frame 21a and the resin forming product that forms the double-tube structure that roughly 21b of inside casing portion of quadrangular barrel shape links mutually through a plurality of ribs (rib) that formation has general cylindrical shape shape.Front at housing 21 is forming the circular conical surface (tapered surface) 21c of portion towards inner side inclination from outer frame 21a.In addition, in the inner side of the circular 21c of conical surface portion, be integrally formed and be used for the irradiation from module substrate 22 to lens (lens) 21d of portion in predetermined angular range.
Module substrate 22 is such as comprising take that aluminium oxide (alumina) etc. is main component have insulating properties and have the pottery of high-termal conductivity, and formed with the tabular component of the roughly the same shape of opening shape of the 21b of inside casing portion and formed by plan view shape.
A plurality of pattern distribution 22a are set on the part installed surface of lower face side that is set in described module substrate 22, and a part of these pattern distributions 22a (for example six roots of sensation pattern distribution 22a) extends to a side (being subject to receiving part 16 respective side with the joint of socket 2) (with reference to Fig. 5) of module substrate 22.
In addition, on the part installed surface of module substrate 22, for example surface installing type (surface mount design is installed in the region of the lens section 21d corresponding to housing 21, SMD type) or chip on board type (Chip on Board, COB type) a plurality of LED22b as light-emitting component (with reference to Fig. 3, Fig. 4) form illuminating part 30 on module substrate 22 by these LED22b are electrically connected to pattern distribution 22a.In addition, on the part installed surface of module substrate 22, form the circular jut 22c around LED22b group, in the inner side of described jut 22c, filling such as the encapsulant 22d that comprises the silicon ketone resin with light transmission etc. of sneaking into fluorophor.
Joint retaining member 23 has stable on heating resin forming product etc. such as comprising, and is formed with the tabular component of the roughly the same shape of opening shape of the 21b of inside casing portion and formed by plan view shape.Substantial middle portion at described joint retaining member 23 is arranging the circular peristome 23a corresponding with illuminating part 30.
In addition,, in the subtend face side with module substrate 22, in the appropriate location of the periphery of peristome 23a, the bracket part 23b that leading section can be connected to a plurality of overshooting shapes of module substrate 22 is being set.In addition, bracket part 23b is such as also can be by planting the elastic components such as plate spring sheet in joint retaining member 23 and form.
And, in the side (joint corresponding to socket 2 is subject to receiving part 16 sides) of joint retaining member 23, be for example integrally formed and forming roughly 2 connector maintaining part 23c of rectangular shape.These each connector maintaining parts 23c is used for forming lamp 3 is electrically connected on to the connector portions 31 of socket 2, and is keeping being subject to corresponding to joint the connector 32 of each slit 17 of receiving part 16.
If described particularly, each connector 32 is for example by forming through enforcement on the surface of the base material that comprises stainless steel (Steel Use Stainless, SUS) or phosphor bronze (phosphor bronze) etc. and the metal tabular component of the plating of pattern distribution 22a same material so.For example, as shown in Figure 7, each connector 32 forms roughly crank (crank) shape, and one is distolateral to be set to and can be inserted into the 1st 32a of contact portion of the so-called edge of a knife (knife-edge) type that joint is subject to the slit 17 of receiving part 16.In addition, another distolateral the 2nd 32b of contact portion that can be connected with the pattern distribution 22a of module substrate 22 that is set to of each connector 32, described the 2nd 32b of contact portion side direction plate face is twisted curved with respect to the direction of the 1st 32a of contact portion quadrature.And, in the 2nd 32b of contact portion, by making its part crooked 32c of spring portion that forms on thickness direction.
And, for example, as shown in Figure 8, Figure 9, each connector 32 with the 1st 32a of contact portion with the state with respect to joint retaining member 23 directed in orthogonal directions one side-prominent from connector maintaining part 23c, and by connector maintaining part 23c, kept under the state that is positioned to the side-prominent mode of module substrate 22 with the state that points to horizontal directions with respect to joint retaining member 23 of the 2nd 32b of contact portion.
The connector portions 31 (connector maintaining part 23c) forming is in this way inserted in the 21b of inside casing portion successively by plan view shape being formed with joint retaining member 23 and the module substrate 22 of the roughly the same shape of opening shape of the 21b of inside casing portion, and be situated between, be loaded between housing 21 and module substrate 22, and with respect to housing 21 scheduled locate.
Heat sink 24 is that plan view shape has the circular similar to the shape of outer frame 21a, and a part is forming the tabular plate of the aluminum of notch 24a.And four positions on heat sink 24 are arranging screw fixed hole 24b, heat sink 24 with and housing 21 between the mode of staple joint retaining member 23 and module substrate 22 utilize screw 24c and be screwed on housing 21.
If heat sink 24 is screwed on housing 21, the upper side that is clamped in so the module substrate 22 between heat sink 24 and housing 21 utilizes the bracket part 23b of joint retaining member 23 and is pressed on heat sink 24, and module substrate 22 is fixed in housing 21.Thus, the heat producing in module substrate 22 is passed to heat sink 24.
In addition, by heat sink 24 is fixed to housing 21, from the 2nd 32b of contact portion of each outstanding connector 32 of joint retaining member 23, at module substrate 22, be connected to corresponding each pattern distribution 22a, and flexibly contact.Thus, each connector 32 of connector portions 31 is electrically connected to (with reference to Fig. 9) with each pattern distribution 22a on module substrate 22.
The fin 25 of fitting on heat sink 24.Fin 25 is that plan view shape has the circular similar to the shape of outer frame 21a, and a part is forming the tabular plate of the aluminum of notch 25a.Thus, the heat penetration producing in module substrate 22 is crossed heat sink 24 and is transmitted to fin 25, and from fin 25 heat radiations.
In addition, form notch 24a in heat sink 24, described notch 24a not form with the overlapping mode of connector portions 31 when overlooking.Thus, guarantee the insulation distance of 24 of connector portions 31 and heat sinks, and come the thermal change of self-luminescent part 30 must be difficult to transmit to connector portions 31.
The lamp 3 forming is in the above-described manner arranged on socket 2, and can removal.In said case, when socket 2 is installed to lamp 3, for example, as shown in figure 10, from one of connector portions 31 each side-prominent the 1st 32a of contact portion, be inserted in the slit 17 that corresponding joint is subject to receiving part 16, and be electrically connected to contact chip portion 18.That is to say, by connector portions 31 and joint, be subject to being connected of receiving part 16, each LED22b on lamp 3 is electrically connected to not shown power supply unit.
In this kind of formation, on the socket 2 being fixed on ceiling, lamp 3 is installed, and while lighting lighting device 1, the illuminating part 30 forming is luminous on module substrate 22.It most ofly sees through the heat producing in illuminating part 30 heat sink 24 and fin 25 and is dispelled the heat, but for example in the situation that continuing to light for a long time lighting device 1, and module substrate 22 becomes high temperature because of residual heat.And, if module substrate 22 so heats up, the module substrate 22 that comprises so different materials is from connector 32 because of different coefficient of thermal expansion thermal expansions, but module substrate 22 sides that cause because of the difference of these coefficient of thermal expansions are slided and alleviated by the 2nd 32b of contact portion flexibly contacting with respect to pattern distribution 22a with the deviation of connector 31 sides on pattern distribution 22a.Therefore,, even if in the situation that module substrate 22 heats up, also can maintain exactly the status of electrically connecting of connector 32 and pattern distribution 22a.
According to this kind of embodiment, by being configured to, lamp 3 comprises: module substrate 22, is installed with LED22b, and is forming the pattern distribution 22a being connected with LED22b; Housing 21, accommodates module substrate 22; Connector maintaining part 23c, to be positioned with respect to housing 21 and maintained state and module substrate 22 subtend configurations; And connector 32, by connector maintaining part, 23c keeps, being set in a 1st distolateral 32a of contact portion can be connected by receiving part 16 sides with joint, and being set in another the 2nd distolateral 32b of contact portion butt is connected in pattern distribution 22a, and can make excellent in te pins of durability, and connector 32 can be electrically connected on to module substrate 22 exactly and not be subject to the junction temperature limiting of connector 32 sides and module substrate 22 sides.
That is to say, by the state to be located by housing 21 and to keep, connector maintaining part 23c and module substrate 22 subtends are configured, and the syndeton (solderless syndeton) that adopts the connector 32 make to be held in described connector maintaining part 23c to be connected to module substrate 22 sides can prevent temperature because of the scolder loose contact causing such as deteriorated etc., and connector 32 sides can be electrically connected to exactly with module substrate 22 sides.
In said case, by the joint retaining member 23 that is situated between between housing 21 and module substrate 22, and through described joint retaining member 23, module substrate 22 is pressed on to heat sink 24 sides, with respect to joint retaining member 23, not only can make it have the function of locating and keeping connector maintaining part 23c, also can make it have the function as the space that is used at optical axis direction, module substrate 22 being positioned.In said case, by the outstanding bracket part 23b that arranges on joint retaining member 23, and through described bracket part 23b, module substrate 22 is compressed to heat sink 24 sides, joint can be kept structure material 23 and housing 21 with respect to module substrate 22 heat isolation.In addition, by suitable setting, be arranged on the shape of the peristome 23a in joint retaining member 23, can make joint retaining member 23 there is the conduct function of the shading shade of the shadings such as veiling glare of self-luminescent part 30 in the future.
In addition, by one distolateral (the 1st 32a of contact portion side) of connector 32 vertically configured with respect to joint retaining member 23 (and module substrate 22), and another distolateral (the 2nd 32b of contact portion side) twisted curved and flatly configured with respect to joint retaining member 23 (and module substrate 22), can guarantee that the 1st 32a of contact portion is subject to the insertion of receiving part 16 with respect to joint, and can make the 2nd 32b of contact portion with respect to module substrate 22 Elastic Contact preferably.
Here, for example, in said embodiment, to the example that the face of the 1st 32a of contact portion side and the 2nd contact 32b side is set as different directions being illustrated by connector 32 being twisted curved, but for example also can as shown in figure 11, by a part for connector 32 is twisted curved, the face of the 1st 32a of contact portion side and the 2nd contact 32b side be set as to different directions (orthogonal direction).
In addition, in said embodiment, the example that two connector portions 31 are configured in to equidirectional with respect to module substrate 22 is illustrated, but for example also can as shown in figure 12, each connector portions 31 be configured in to diagonal position with respect to module substrate 22.According to this kind of formation, the load balance homogenising that can make 32 pairs of module substrates 22 of each connector give.Now, each connector can be used for to the use of powering, also can, by one of them for the use of powering, that is to say and only with substrate, remain object and use.
In addition, in said embodiment, an example of to seeing through joint retaining member 23, connector maintaining part 23c locate and is held in housing 21 is illustrated, but for example also can be as shown in figure 13, and the bonding of utilization or spiral shell are consolidated etc. and to be made connector maintaining part 23c directly be held in housing 21.
Here, the embodiment of the connector 32 in present embodiment is described.
In the present embodiment, the base material of connector 32 is used phosphor bronze, and plating material is used the gold identical with the wiring layer material of pattern distribution 22a.In addition, stainless steel also has identical effect.In the situation that become the wiring material of the contact on pattern distribution 22a, be golden, to connector 32, implement gold-plated.That is to say, for fear of metal erosion between xenogenesis, the surface of connector 32 is made as to the identical material with pattern distribution 22a.As shown in table 1, the load (dead load) that the 2nd 32b of contact portion of connector 32 gives module substrate 22 be 70 grams~200 grams suitably.In addition in the situation that, the oxide layer when contact contacts on base material wiring layer cannot be removed, and it is bad to become contact.On the other hand, in the situation that 200 grams of duty factors are large, fixing intensity is excessive, to the contact trace of gold wiring, crosses dark and occurs being formed on the Pd layer of lower floor.
According to above situation, by dead load being set as to the scope of 70 grams~200 grams, can obtain good thermal conductivity, and also can suppress the generation of the breakage (splitting) etc. of module substrate 22.In addition, in 40000 hours life-spans (life), serviceability temperature reaches with low uncertainty before 120 ℃, can guarantee the reliability between contact.

Claims (5)

1. a lamp, is characterized in that comprising:
Module substrate, is installed with light-emitting component, and is forming the pattern distribution being connected with described light-emitting component;
Housing, accommodates described module substrate;
Connector maintaining part, to be positioned with respect to described housing and maintained state and the configuration of described module substrate subtend; And
Connector, is kept by described connector maintaining part, a distolateral power supply that is connected in, and another distolateral mode with butt is connected in the described pattern distribution of the described module substrate being housed in described housing.
2. lamp according to claim 1, is characterized in that: described connector is by described housing and the clamping of described module substrate, to be made another distolaterally be connected to described pattern distribution.
3. lamp according to claim 1, is characterized in that comprising: joint retaining member, is situated between and is loaded between described housing and described module substrate, and the peristome corresponding with the illuminating part being formed by described light-emitting component is being set; And
Described connector maintaining part is positioned and is held in described housing by described joint retaining member.
4. according to the lamp described in arbitrary claim in claims 1 to 3, it is characterized in that: described module substrate is to consist of ceramic substrate.
5. a lighting device, is characterized in that: used the lamp described in arbitrary claim in claim 1 to 4.
CN201320529511.3U 2012-12-28 2013-08-28 Lamp and illuminating device Expired - Fee Related CN203489203U (en)

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JP2012287573A JP2014130727A (en) 2012-12-28 2012-12-28 Lamp and lighting device
JP2012-287573 2012-12-28

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CN110360495A (en) * 2019-07-04 2019-10-22 深圳民爆光电股份有限公司 A kind of LED light easy for installation

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