JP2014117106A - Conduction heat dissipation structure of power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for thermal separation, without impairing continuity of a circuit pattern assuming a single substrate, by arranging a plurality of substrates separately in the vertical direction, thereby separating high heat-generating components and low heat-generating components to different substrates.SOLUTION: A first circuit pattern on which low heat-generating components, such as an electrolytic capacitor C14, excepting high heat-generating components in a power supply circuit, are arranged is formed on a first substrate 10, and a second substrate 12 is arranged to face the first substrate 10 separately therefrom. A second circuit pattern on which high heat-generating components, such as a switching element Q, are arranged separately from the first circuit pattern is formed on the second substrate 12. Connection pin members 18a-18m are arranged between the first substrate 10 and second substrate 12, and the second circuit pattern of the second substrate 12 on which high heat-generating components are arranged is connected electrically with the first circuit pattern of the first substrate 10 on which only the low heat-generating components are arranged.

Description

The present invention relates to a conduction heat dissipation structure of a power supply device in which a circuit is constituted by a heat generating component such as a power semiconductor and a non-heat generating component such as an electrolytic capacitor.

  Conventionally, in a switching power supply device that converts commercial AC power into DC power of a predetermined voltage and outputs it, on a single substrate, a power semiconductor such as a MOS-FET or a diode that constitutes a power circuit, an input filter, Power semiconductor control circuit, electrolytic capacitor, etc. are mounted.

  Power semiconductors used in power circuits are high heat generating components that generate high heat, while input filters, power semiconductor control circuits, electrolytic capacitors, etc. are low heat generating components that themselves generate little heat and are mounted on the same board. In such a case, the heat of the high heat-generating component is transmitted to the entire substrate, and the heat dissipation of the low heat-generating component is obstructed. For example, when the temperature of the electrolytic capacitor that is a life component rises, the life is shortened.

  In order to suppress the heat radiation inhibition of the low heat-generating component due to the heat generated by such a high heat-generating component, for example, a conduction heat radiation structure (cooling structure) shown in FIG. 6 has been proposed.

  In FIG. 6, reference numeral 105 denotes a highly heat conductive substrate, and a high heat generation circuit M including a high heat generation component 103 is formed on the upper surface of the substrate 105. Reference numeral 106 denotes a low heat conductive substrate, and a low heat generation circuit N including a low heat generation component (non-heat generation component) 104 is formed on the upper surface of the substrate 106. The bottom plate of the metal case 101 is provided with a high platform 111, and a low platform 112 is formed around the high platform 111.

  The metal cover 102 of the metal case 101 is provided with a recess 121 facing the pedestal 111, and holes 122 are formed in the bottom plate portion of the recess 121 directly above the high heat generating component 103 mounted on the substrate 105. The substrate 105 is in close contact with the upper surface of the hill portion 111 of the metal case 101. The substrate 106 is brought into close contact with the surface of the lower base 112 of the metal case 101. By filling the concave portion 121 of the metal cover 102 with the high thermal conductive resin 130, it flows out to the substrate 105 side through the hole 122, and is cured in a state of being attached to the surface of the high heat generating component 103.

According to such a cooling structure, the heat of the high heat generating component 103 is transmitted to the metal cover 102 via the high thermal conductive resin 130 and released to the outside from the metal cover 102, and the metal case via the substrate 105. 101 is also transmitted to the hill part 111 of the board 101 and released to the outside from the metal case 101. Therefore, the heat of the high heat generating component 103 of the substrate 105 hardly diffuses to the substrate 106, thereby preventing the heat dissipation of the low heat generating component 104. There is no.
Further, by attaching a radiator so as to be in contact with the high platform 111, the low platform 112, and the metal case 101, the heat generated by the high heat generation circuit M can be efficiently radiated to the outside of the apparatus.

JP-A-5-47968

  However, in the conventional power supply device having such a heat dissipation structure, the substrate 105 on which the high heat generating component 103 is mounted and the substrate 106 on which the low heat generating component 104 is mounted are separated. The heat from the high heat generating component 104 is diffused into the metal case 101 to heat the low heat generating component 104, and the high heat generating component 103 and the low heat generating component 104 are connected to the metal case 101 and the metal. Since it is located in the same space covered with the cover 102, it is heated by receiving radiant heat from the high heat-generating component 103. For this reason, the low heat-generating component 104 is not sufficiently isolated from the heat of the high heat-generating component 103. For example, when an electrolytic capacitor is mounted as a low heat-generating component, the temperature of the electrolytic capacitor, which is a life component, rises, resulting in a long service life. There is a problem that cannot be made.

  In order to solve such a problem, a heat dissipating structure is conceivable in which the substrate 105 on which the high heat generating component 103 is mounted and the substrate 106 on which the low heat generating component 104 is mounted are separated from each other, for example.

  However, the high heat generating component and the low heat generating component are basically arranged by forming a circuit pattern on the substrate on the assumption that the circuit component is mounted on a single substrate. When separated into a plurality of substrates 105 and 106 with a step, the separated substrates are in the category of two-dimensional arrangement, and the circuit pattern can be placed on a single substrate by connecting the separated portions using wiring. There is almost no difference from the case where it is formed, and the continuity of the circuit pattern assuming a single substrate is not impaired.

  However, in the case of a heat dissipation structure in which two substrates are separated from each other, circuit components are arranged in three dimensions instead of two dimensions, so it is assumed that they are formed on a single substrate. How to separate the circuit pattern including the circuit components and how to perform electrical connection in three dimensions after the separation remains as a problem, and a specific solution is required.

The present invention provides thermal isolation by separating a plurality of substrates in the vertical direction and separating high heat-generating components and low heat-generating negative components on separate substrates without impairing the continuity of the circuit pattern assuming a single substrate. It is an object of the present invention to provide a conductive heat dissipation structure for a power supply device that enables the above.

(Switching power supply)
The present invention relates to a conductive heat dissipation structure of a power supply device in which a power supply circuit is configured with parts including a predetermined high heat generating component and a predetermined low heat generating component.
A first substrate on which only a low heat-generating component is formed by forming a first circuit pattern in which low-heat generating components excluding high heat generating components in a power supply circuit are disposed;
A second substrate on which one or a plurality of second circuit patterns are arranged to dispose a high heat-generating component separated from the first circuit pattern and disposed on the first circuit pattern;
A second circuit pattern in which the high heat-generating component of the second substrate is arranged electrically is arranged on the first circuit pattern that is arranged between the first substrate and the second substrate and in which only the low heat-generating component of the first substrate is arranged. A connecting member to be connected to,
It is provided with.

(Thermal conductivity of the substrate)
The first substrate is a substrate having a low dielectric constant, and only the low heat-generating component is mounted on the opposite surface or both surfaces of the second substrate.
The second substrate is a substrate having a low dielectric constant and a high thermal conductivity, and a heat-generating component is mounted on a surface facing the first substrate and a heat radiating surface is provided on the opposite surface.

(High heat generation parts and low heat generation parts)
The first substrate has at least an electrolytic capacitor, an input filter, and a power semiconductor control circuit as low heat generation components,
On the second substrate, at least a power semiconductor is disposed as a highly heat-generating component.

(Connecting member)
The connection member that connects the first substrate and the second substrate is a pin member or a bar member made of a metal material having high electrical conductivity.

(Standardization of board size)
At least one of the first substrate and the second substrate has a predetermined rectangular size standardized by inch dimensions, and the other has a smaller or equivalent outer shape than the predetermined rectangular size standardized by the inch dimensions. Have.

(Disposition of the third substrate)
Separating and arranging a third substrate on the opposite side of the second substrate relative to the first substrate;
Forming a third circuit pattern for disposing a high heat generating component separated from the first circuit pattern on the third substrate;
A third circuit pattern in which high heat-generating components of the third substrate are arranged is electrically connected to the first circuit pattern of the first substrate by a connecting member.

(Basic effect)
In the conductive heat dissipation structure of the power supply device according to the present invention, the first circuit pattern for arranging and connecting the low heat generation components except the high heat generation components in the power supply circuit is formed on the first substrate, and only the low heat generation components are arranged. Are arranged separately from the first substrate, and a second circuit pattern for arranging and connecting the high heat generating components separated from the first circuit pattern is formed on the second substrate to arrange the high heat generating components. Since the connecting member is disposed between the first substrate and the second substrate so that the second circuit pattern of the second substrate is electrically connected to the first circuit pattern of the first substrate, the heat of the high heat generating component is mounted. Conducted to the second substrate and dissipated, and not conducted to the first substrate separated through the space, but mounted on the opposite surface of the first substrate relative to the heat generating component mounted on the second substrate For low-heat-generating parts, radiant heat from high-heat-generating parts Although it is blocked by the first substrate and does not reach, the atmosphere between the second substrate and the first substrate is also heated by the heat of the heat-generating component, but is also blocked by the first substrate and mounted on the opposite surface. When the low heat-generating component is not reached, the low heat-generating component is thermally isolated from the high heat-generating component, and the high heat-generating component is sufficiently radiated. It is possible to keep the electrolytic capacitor at a low temperature, and it is possible to achieve both the long life of the electrolytic capacitor and the efficiency of conduction heat dissipation of high heat-generating components such as power semiconductors.

(Effect due to thermal conductivity of substrate)
Further, the first substrate is a substrate having a low dielectric constant, and only the low heat-generating component is mounted on the opposite surface or both surfaces of the surface facing the second substrate, and the second substrate has a low dielectric constant and a high thermal conductivity. Since the high heat-generating component is mounted on the surface facing the first substrate and the opposite surface is used as the heat dissipation surface, the thermal isolation of the low heat generation component with respect to the heat of the high heat generation component is completed and the high heat generation component It is possible to reliably conduct heat dissipation.

(Effects on specific examples of high heat generation parts and low heat generation parts)
The first substrate includes at least an electrolytic capacitor, an input filter, and a power semiconductor control circuit as low heat generation components, and the second substrate includes at least a power semiconductor as a high heat generation component, thereby providing an electrolytic capacitor and an input filter. In addition to maintaining the power semiconductor control circuit at a low temperature, the power semiconductor can sufficiently conduct and dissipate heat to improve the stability and durability of each.

(Effects of connecting members)
In addition, since the connecting member for connecting the first substrate and the second substrate is a pin member or a bar member made of a metal material having high electrical conductivity, the first circuit pattern of the first substrate excluding the high heat generation component is used. On the other hand, the circuit pattern is separated and three-dimensionally arranged on the first substrate and the second substrate by directly connecting the second circuit pattern in which the high heat-generating component separated on the second substrate is arranged in the vertical direction. Can be easily performed.

(Effect of standardization of board size)
In addition, since at least one of the first substrate and the second substrate has a predetermined rectangular size standardized in inch dimensions, the circuit patterns of the high heat generation component and the low heat generation component are separated and mounted on separate substrates. By arranging them vertically, it is possible to make a power supply device having an external size that conforms to the size standardized in inches.

(Effects of arrangement of third substrate)
In addition, a third substrate is disposed separately on the opposite side of the second substrate relative to the first substrate, and a high heat generating component and / or a low heat generating component separated from the first circuit pattern is disposed and connected to the third substrate. Since the circuit pattern is formed and the high heat generation component and / or the low heat generation component arranged and connected to the third circuit pattern of the third substrate are electrically connected to the first circuit pattern of the first substrate by the connection member, When there are many high heat generation parts and / or low heat generation parts to be separated, the third board is added to standardize in inch dimensions while ensuring thermal isolation of low heat generation parts and conduction heat dissipation of high heat generation parts. Therefore, it is possible to produce a switching power supply having an outer size suitable for a single substrate type switching power supply having the outer shape.

The side view which showed embodiment of the thermal radiation structure by this invention The top view which extracted and showed the 1st board | substrate of FIG. The top view which extracted and showed the 2nd board | substrate of FIG. Circuit diagram showing an embodiment of a power supply circuit that is mounted separately on a first substrate and a second substrate The side view which showed other embodiment which added the 3rd board | substrate. Explanatory drawing showing conventional heat dissipation structure

[Two-stage substrate structure]
An embodiment of the conductive heat dissipation structure of the power supply apparatus according to the present invention will be described with reference to FIGS. 1 to 4 as follows.

  As shown in FIG. 1, the conduction heat dissipation structure of this embodiment is basically a structure in which a first substrate 10 and a second substrate 12 are separated and arranged in two upper and lower stages. The first substrate 10 is, for example, a double-sided substrate, and includes a pattern surface 10a, an insulator 10b, and a pattern surface 10c, and uses an FR4 substrate or a CEM3 substrate known as a low dielectric constant glass epoxy substrate. Here, the FR4 substrate is made by impregnating a glass fiber woven cloth with an epoxy resin as an insulator 10b, and the CEM substrate is made by mixing glass fiber and an epoxy resin as an insulator 10b.

  On the pattern surface 10a of the first substrate 10, a first circuit pattern for disposing only predetermined low heat generation components excluding the predetermined high heat generation components in the power supply circuit shown in FIG. On the other hand, inductances L11 and L12, a fuse F12, a capacitor C13, a thermal resistor (resistance with temperature fuse) TH11, an electrolytic capacitor C14, and the like are arranged as predetermined low heat-generating components. Further, control chips IC11 and IC12 included in predetermined low heat generating components of the power supply circuit shown in FIG. 4 are arranged on the pattern surface 10c which is the back surface of the first substrate 10.

  The second substrate 12 is a substrate having a pattern surface 12a and an insulator 12b and having a low dielectric constant and high thermal conductivity. For example, a metal base substrate such as an aluminum base plate substrate or a ceramic substrate is used. As the second substrate 12, an FR4 substrate or a CEM3 substrate having a multilayer structure of two or more layers may be used.

  On the pattern surface 12a of the second substrate 12 facing the first substrate 10, a second circuit pattern in which predetermined high heat generating components in the power supply circuit shown in FIG. For example, a diode bridge SS11, a switching element Q12, a rectifier diode Q14, and the like are arranged as the predetermined high heat generating components.

  High heat-generating components such as the diode bridge SS11, the switching element Q12, and the rectifier diode Q14 generate high heat due to power loss accompanying the operation of the power supply circuit, and this heat is transmitted to the insulator 12b having high thermal conductivity. Since the lower surface of the insulator 12b forms a heat radiating surface, the heat transmitted to the insulator 12b is efficiently radiated from the heat radiating surface.

  High heat-generating components such as the diode bridge SS11, the switching element Q12, and the rectifier diode Q14 mounted on the second substrate 12 have electrical conductivity upright at predetermined positions of the second circuit pattern formed on the pattern surface 12a of the second substrate 12. It is electrically connected to the corresponding position of the first circuit pattern formed on the pattern surface 10a of the first substrate 10 by good connection pin members 18a to 18m or a copper bar member (not shown).

(Separate arrangement of circuits corresponding to the first substrate and the second substrate)
Next, the point that circuit components and circuit patterns are separated (extracted) from the power supply circuit of FIG. 4 on the first substrate 10 and the second substrate 12 will be described.

  The power supply circuit shown in FIG. 4 is preliminarily separated into two second substrate mounting portions 50-1 and 50-2 surrounded by a one-dot chain line and the other first substrate mounting portions 40. The second board mounting portions 50-1 and 50-2 are separated by extracting a circuit portion including a high heat generation component.

  In the present embodiment, the second substrate mounting unit 50-1 includes a second circuit pattern for connecting the diode bridge S11 and its circuit, and the second substrate mounting unit 50-2 uses a MOS-FET. The switching elements Q1 and Q2, the transformer T11, the rectifying diodes Q13 and Q14 using MOS-FET, the choke coil L13, and the capacitors C15 and C16 and the second circuit pattern for connecting the circuits are included.

  Among them, when the power supply circuit is operated, the switching elements Q11 and Q12 that are the power semiconductors have the highest temperature, and the next highest are the rectifying diodes Q13 and Q14 and the diode bridge S11 that are also the power semiconductors. Further, the transformer T11 and the choke coil L13 also generate heat due to the current flowing through the switching operation of the switching elements Q11 and Q12.

  On the other hand, the capacitors C15 and C16 are low heat generation components with little heat generation, but are components attached to the transformer T11 and the choke coil L13, and when left on the first substrate 10, they are connected in the vertical direction by connection pin members or copper bar members. Since the structure is complicated, it is a low heat generating component, but is included in the second board mounting portion 50-2.

  The first board mounting part 40 includes circuit parts other than the circuit parts of the second board mounting parts 50-1 and 50-2 and the second circuit pattern for connecting them, and the portion including the first circuit pattern for connecting them. It is separated. The circuit components included in the first board mounting portion 40 are only low heat generation components, and all high heat generation components are excluded.

  When viewed from the input side, the low heat generation components included in the first board mounting part 40 are input terminals L and N, fuses F11 and F12, capacitors C11 and C12, inductances L11 and L12, and a surge absorber SK11. Configure. Subsequently, the capacitor C13, the thermal resistor TH11, the electrolytic capacitor C14, the driving IC 11, and the control IC 12 constitute a DC input circuit unit and a switching control unit. Further, the rectifying electrolytic capacitor C17 is provided on the output terminals Vo + and Vo− side. Capacitors C18, C19, and C20 are coupling capacitors that form a balanced circuit for the frame ground terminal FG.

  As described above, the circuit components included in the first board mounting portion 40 do not generate heat by themselves, or are low heat generation components with a small amount of heat even if heat is generated. Electrolytic capacitors C14 and C17 are included as low heat-generating components whose life is impaired.

  Corresponding to the first substrate mounting portion 40 shown in FIG. 4, the input surface L, N, fuses F11 and F12, which are low heat-generating components, and a capacitor are formed on the pattern surface 10a on the upper side of the first substrate 10 shown in FIG. C11, C12, C13, inductances L11, L12, surge absorber SK11, thermal resistance TH11, electrolytic capacitor C14 (two components connected in parallel), and output terminals Vo +, Vo− are mounted. A driving IC 11 and a control IC 12 are mounted on the pattern surface 10c, which is the back surface of the first substrate 10, as indicated by a dotted line. The first substrate 10 is provided with a rectangular notch 12d through which the transformer T11 mounted on the second substrate 12 passes.

  Further, corresponding to the second substrate mounting portions 50-1 and 50-2 shown in FIG. 4, the upper pattern surface 12a of the second substrate 12 shown in FIG. Q11, Q12, transformer T11, rectifying diodes Q13, Q14 (two components connected in parallel) and choke coil L13 are mounted, and capacitors C15, C16 that are low heat generating components are also mounted. The capacitors C18 to C20 are not shown.

  Also, the connection portions of the circuit patterns of the first board mounting portion 40 and the second board mounting portions 50-1 and 50-2 in the power supply circuit of FIG. 4 are indicated by lands a to m, corresponding to the lands a to m. 2 are formed with pin insertion holes 20a to 20m, and the second substrate 12 of FIG. 3 is connected to the second substrate 12 at positions corresponding to the pin insertion holes 20a to 20m of the first substrate 10. The members 18a to 18m are erected.

  As a result, as shown in FIG. 1, when the first substrate 10 and the second substrate 12 are assembled up and down via the support post 14, the first and second substrates 10 and 12 are separated from each other by the connection pin members 20a to 20m. The first circuit pattern and the second circuit pattern thus connected are electrically connected to realize the power supply circuit assuming a single substrate shown in FIG. 4 with a two-stage substrate structure.

[Heat dissipation]
Next, the heat dissipation action when the power supply device according to this embodiment is operating will be described.

  When the power supply circuit shown in FIG. 4 operates, when the switching element Q11 is turned on and the switching element Q12 is turned off by the driving IC 12, a current flows from the capacitor C14 to the primary winding of the transformer T11, and a current flows to the secondary side. Rectifying and smoothing is performed by the rectifying diode Q14, the capacitor C16, the choke coil L13, and the electrolytic capacitor C17. At this time, energy is stored in the capacitor C15 so that the voltage at the connection point with the transformer T11 is increased. Next, when the switching element Q11 is turned off and Q12 is turned on, the energy stored in the capacitor C15 is released and a current flows to the secondary side, and the current is rectified and smoothed by the rectifier diode Q13, capacitor C16, choke coil L13, and electrolytic capacitor C17. The operating frequency of the switching elements Q11 and Q12 is controlled by the control IC 12 so as to keep the output voltage at a predetermined value.

  With such operation of the power supply circuit, the switching elements Q11 and Q12 generate heat due to power loss accompanying the switching operation and become high temperature, and the switching elements Q11 and Q12 are disposed on the second substrate 12 having high thermal conductivity. The generated heat is transferred to the second substrate 12 and radiated from the lower heat radiating surface.

  As a result, the temperature of the second substrate 12 is increased, but the first substrate 10 is arranged separately from the second substrate 12, there is almost no heat transfer by the support posts 14, and heat conduction by the connection pin members 18a to 18m. The temperature is extremely small and is thermally isolated from the second substrate 12, and the temperature rise due to heat conduction is small.

  Further, the radiation heat and atmosphere due to the heating of the switching elements Q11 and Q12 disposed on the second substrate 12 are blocked by the first substrate 10, and low heat-generating components such as electrolytic capacitors C14 and C17 disposed on the opposite pattern surface 10a are provided. There is no heating. This also applies to the heat generation of the diode bridge S11, the transformer T11, the rectifying diodes Q13 and Q14, and the choke coil L13, which are other high heat generating components arranged on the second substrate 12.

  In this way, the low heat generating component disposed on the first substrate 10 is thermally isolated from the high heat generating component disposed on the second substrate 12 and the high heat generating component on the second substrate 12 is sufficiently radiated. It is possible to keep the electrolytic capacitors C14 and C17 mounted on the substrate 10 as low heat-generating components at a low temperature, and to extend the life of the electrolytic capacitors C14 and C17.

[Standardization of external size]
Here, with respect to the first substrate 10, as shown in FIG. 2, when the vertical dimension is L1 and the horizontal dimension is L2, the second substrate 12 shown in FIG. 3 is also the same vertical and horizontal dimension (L1 × L2) or smaller than that. The dimensions are as follows. The vertical and horizontal dimensions (L1 × L2) of the first substrate 10 are standardized by an inch size such as (3 inches × 5 inches), (2 inches × 4 inches), (2 inches × 3 inches), etc. In accordance with a standardized size generally used in a single substrate type switching power supply apparatus having the substrate structure of the two-stage substrate according to this embodiment, the single substrate type switching power source having an external shape standardized in inches. It can be handled as a product that conforms to the standard size of the device. The relationship between the first substrate 10 and the second substrate 12 may be reversed.

[Embodiment including third substrate]
5, the present embodiment is characterized in that a third substrate 30 is further provided to the substrate structure including the first substrate 10 and the second substrate 12 shown in FIG. The third substrate 30 is separated from the second substrate 12 on the opposite side of the second substrate 12.

  The third substrate 30 includes a pattern surface 30a and an insulator 30b, and is a substrate having a low dielectric constant and a high thermal conductivity as in the case of the second substrate 12. For example, a metal base substrate such as an aluminum base plate substrate or a ceramic Use a substrate.

  On the pattern surface 30a of the third substrate 13 facing the first substrate 10, for example, a switching element Q11 is disposed as a high heat generating component separated from the power supply circuit of FIG. 4, and for example, a driving IC 11 is disposed as a low heat generating component. ing.

  Both ends of the switching element Q11 and the driving IC 11 disposed on the third substrate 30 are placed with the copper bar 32 member or the connection pin member (not shown) standing on the pattern surface 10a of the first substrate 10 as a connection member. It is electrically connected by soldering. For example, the copper bar member 32 is bent at both ends of the bar body to form a solder connection portion.

  Such an additional arrangement of the third substrate 30 is such that when the arrangement space of the high heat-generating component with respect to the second substrate 12 is insufficient or the amount of heat radiation is insufficient, the newly provided third substrate 30 has a high heat-generating component. Place. In addition, when the space for arranging the low heat generation component relative to the first substrate 10 is insufficient, the low heat generation component is arranged on the newly provided third substrate 30.

  Such a third substrate 30 may have an outer shape standardized in inch dimensions, as in the relationship regarding the outer shape of the first substrate 10 and the second substrate 12, or the first substrate 10 and the second substrate 12 may be When the outer shape is standardized by inch dimensions, the vertical and horizontal dimensions (L1 × L2) of the substrate are (3 inches × 5 inches), (2 inches × 4 inches), ( It is possible to easily match the standardized size of a single substrate type switching power supply device having an outer shape standardized in inch dimensions such as 2 inches × 3 inches.

[Modification of the present invention]
The above embodiment is an example of a switching power supply device that converts alternating current power into direct current power of a predetermined voltage and outputs it. However, this is an example, and a switching power supply that combines this with a power factor correction circuit. It is good also as an apparatus. The power factor correction circuit (PFC circuit) is provided between the capacitor C13 and the electrolytic capacitor C14 in FIG. 4 and includes a switching element using a power semiconductor, a transformer, a rectifier diode, and the like. A high heat-generating component such as a power semiconductor provided in the circuit may be disposed separately on the second substrate 12, and only the low heat-generating component excluding the high heat-generating component may be disposed on the first substrate 10.

  In the above embodiment, the high heat-generating component such as the switching element and the low heat-generating component attached thereto are separately disposed on the second substrate. However, the low heat-generating component is left on the first substrate, and the switching element. Alternatively, only the high heat generating components such as the above may be separately arranged on the second substrate, and all the low heat generating components may be thermally isolated from the high heat generating components and kept at a low temperature.

  Further, in the above embodiment, in the power supply circuit, the second board mounting portion provided with the high heat generation component is extracted and separated at two places, and each is mounted on the second board. May be mounted on the second substrate, or may be extracted in three or more locations and mounted on the second substrate.

The present invention includes appropriate modifications without impairing the object and advantages thereof, and is not limited by the numerical values shown in the above embodiments.

10: 1st board | substrate 10a, 10c, 12a, 30a: Pattern surface 10b, 12b, 30b: Insulator 12: 2nd board | substrate 14: Support post 18a-18m: Connection pin member 20a-20m: Pin insertion hole 30: 3rd Substrate 32: Copper bar member 40: First substrate mounting portion 50-1, 50-2: Second substrate mounting portion

Claims (6)

In a conduction heat dissipation structure of a power supply device in which a power supply circuit is configured with parts including predetermined high heat generation parts and predetermined low heat generation parts,
A first substrate on which only the low heat generating component is disposed by forming a first circuit pattern in which the low heat generating component excluding the high heat generating component in the power supply circuit is disposed;
A second substrate on which the one or a plurality of second circuit patterns are arranged to dispose the high-heat-generating component, and the high-heat-generating component is arranged separately from the first substrate and arranged from the first circuit pattern; ,
A second circuit pattern in which the high heat generation component of the second substrate is arranged on the first circuit pattern which is arranged between the first substrate and the second substrate and in which only the low heat generation component of the first substrate is arranged. A connecting member for electrically connecting,
A conduction heat dissipation structure for a power supply device, comprising:
In the conduction heat dissipation structure of the power supply device according to claim 1,
The first substrate is a substrate having a low dielectric constant, and only the low heat-generating component is mounted on the opposite surface or both surfaces of the surface facing the second substrate,
The second substrate is a substrate having a low dielectric constant and high thermal conductivity, wherein the heat generating component is mounted on a surface opposite to the first substrate and a heat radiating surface is provided on the opposite surface. Conductive heat dissipation structure.
In the conduction heat dissipation structure of the power supply device according to claim 1,
The first substrate includes at least an electrolytic capacitor, an input filter, and a power semiconductor control circuit as the low heat generation component,
The conductive heat dissipation structure for a power supply device, wherein the second substrate includes at least a power semiconductor as the high heat-generating component.
The conductive heat dissipation structure for a power supply device according to claim 1, wherein the connecting member for connecting the first substrate and the second substrate is a pin member or a bar member made of a metal material having high electrical conductivity. A conduction heat dissipation structure for a power supply device.
In the conduction heat dissipation structure of the power supply device according to claim 1,
At least one of the first substrate and the second substrate has a predetermined rectangular size standardized by inch dimensions, and the other has a smaller or equivalent outer shape than the predetermined rectangular size standardized by the inch dimensions. Have.
In the conduction heat dissipation structure of the power supply device according to claim 1,
Separating and arranging a third substrate on the opposite side of the second substrate relative to the first substrate;
Forming a third circuit pattern for disposing a high heat-generating component separated from the first circuit pattern on the third substrate;
A conductive heat dissipation structure for a power supply device, wherein a third circuit pattern in which the high heat-generating component of the third substrate is arranged is electrically connected to the first circuit pattern of the first substrate by a connecting member.

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