JP2014116338A - Cleaving device and cleaving method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaving device and a cleaving method capable of eliminating the need for adhering an adhesive sheet onto a plate-like member in advance.SOLUTION: A cleaving device 1 comprises: fragile part formation means 20 forming a fragile part to a wafer WF provided as a plate-like member; and vibration giving means 30 giving the wafer WF vibration that can break the fragile part. By breaking the fragile part by the vibration giving means 30, the wafer WF is cleaved in semiconductor chips of a plurality of small pieces.

Description

  The present invention relates to a cleaving device and a cleaving method, and more particularly to a cleaving device and a cleaving method for cleaving a plate-like member into a plurality of small pieces.

  Conventionally, a cleaving apparatus using a laser is known as a cleaving apparatus that cleaves a plate-like member into a plurality of small pieces. For example, the following Patent Document 1 irradiates a semiconductor wafer (hereinafter sometimes referred to as a “wafer”) as a plate-like member with a laser beam having a focused point, and multi-photon absorption phenomenon inside the wafer. It is disclosed that a modified region is formed by cleaving and the wafer is cleaved starting from the modified region.

JP 2005-57158 A

  However, in such a conventional cleaving apparatus, the adhesive sheet affixed to the plate-like member is stretched to cleave the plate-like member into a plurality of small pieces, so that the adhesive sheet can be affixed to the plate-like member in advance. It became indispensable, and equipment and a process for attaching the adhesive sheet to the plate member were necessary.

  It is an object of the present invention to provide a cleaving apparatus and a cleaving method that do not necessarily require that an adhesive sheet is attached to a plate-like member in advance.

  In order to achieve the above object, the cleaving device according to the first aspect of the present invention provides fragile portion forming means for forming a fragile portion in a plate-like member, and vibrations capable of collapsing the fragile portion to the plate member. Vibration imparting means, and the plate-like member is cleaved into a plurality of small pieces by collapsing the fragile portion with the vibration imparting means.

  In the cleaving device of the second aspect, in the configuration of the first aspect, the fragile portion forming means has an output portion that outputs an output line forming the fragile portion, and the vibration applying means is the fragile portion. A vibration applying unit that applies vibration to the unit, and the vibration applying unit is provided alongside the output unit along a direction in which the fragile portion is formed.

  In the cleaving device of the third aspect, in the configuration of the first aspect, the fragile portion forming means has an output portion that outputs an output line that forms the fragile portion, and the vibration applying means is the fragile portion. A vibration applying unit configured to apply vibration to the unit, wherein the vibration applying unit is provided so that an output line output from the output unit can pass through the vibration applying unit.

  The cleaving method of the 4th mode concerning the present invention is the process of forming a weak part in a plate-like member, and giving the vibration which can collapse the weak part to the plate member, in order to achieve the above-mentioned object. The plate-like member is cleaved into a plurality of small pieces by collapsing the weakened portion.

  In the cleaving device of the fifth aspect, in the configuration of any one of the first to third aspects, the weakened portion forming means may be a laser irradiation device, and the vibration applying means may be a vibration applying device.

  The cleaving device of the sixth aspect may include suction means for sucking scattered matter due to the collapse of the fragile portion in the configuration of any one of the first to third and fifth aspects.

  A cleaving device according to a seventh aspect includes the supporting means for supporting the plate-like member in the configuration according to any one of the first to third and fifth to sixth aspects, and the vibration applying means includes the support It may be provided on the means side.

  The cleaving device according to an eighth aspect is the configuration according to any one of the first to third and fifth to seventh aspects, wherein the plate-like member is affixed to an adhesive sheet. You may provide the tension | pulling means which pulls the said adhesive sheet in the direction.

  According to the 1st aspect and 4th aspect which concern on this invention mentioned above, the cleaving apparatus which does not make it essential to stick an adhesive sheet to a plate-shaped member beforehand by providing the vibration provision means. And a cleaving method can be provided.

  According to the second aspect or the third aspect described above, the fragile portion can be collapsed by the vibration applying means while the fragile portion is formed by the fragile portion forming means, so the plate-like member is cleaved into a plurality of small pieces. Time can be shortened.

  According to the 5th aspect mentioned above, a narrow weak part can be formed. Moreover, a weak part can be collapsed by non-contact.

  According to the 6th aspect mentioned above, the fall and adhesion of the scattered material to a small piece can be suppressed.

  According to the 7th aspect mentioned above, since a weak part can be collapsed collectively by a vibration provision collapse means, the time which cleaves a plate-shaped member into a several small piece can be shortened.

  According to the 8th aspect mentioned above, after dividing a plate-shaped member into a several small piece, the space | interval of a small piece can be expanded.

The fragmentary sectional view which shows schematic structure of the cleaving apparatus which concerns on embodiment of this invention. The partial top view concerning the embodiment of the present invention. The fragmentary sectional view which shows the 1st modification which concerns on embodiment of this invention. The fragmentary sectional view which shows the 2nd modification concerning embodiment of this invention.

  Hereinafter, a cleaving apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  In FIG. 1, the cleaving apparatus 1 includes a supporting unit 10 that supports a wafer WF as a plate member, a fragile part forming unit 20 that forms a fragile part WF1 (see FIG. 3) on the wafer WF, and a wafer WF. Vibration imparting means 30 for imparting vibration capable of collapsing the weak part WF1, suction means 40 for sucking scattered matter due to the collapse of the weak part WF1, CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random And a control means (not shown) configured to control the entire operation of the cleaving apparatus 1.

  The support means 10 is supported by an output shaft 12 of a linear motion motor 11 as a drive device, and is also supported by a linear motor 13 as a drive device extended in the Y-axis direction, and a slider 14 of the linear motor 13. A support table 17 supported by an output shaft 16 of a rotation motor 15 as a drive device, and a decompression means 19 such as a decompression pump or a vacuum ejector connected to a chamber 17A formed in the support table 17 via a pipe 18. And. A plurality of suction holes 17C penetrating the chamber 17A are formed on the mounting surface 17B.

  The weak part forming means 20 is supported by a rotation motor 23 as a drive device supported by a slider 22 of a linear motor 21 as a drive device extended in the X-axis direction, and an output shaft 24 of the rotation motor 23. And a laser irradiation device 26 having an output portion 26A that outputs a laser beam 26L (see FIG. 3) as an output line. The laser irradiation device 26 irradiates the laser beam 26L with the condensing point inside the wafer WF, and forms a modified region inside the wafer WF, thereby weakening to a fragile strength that can be collapsed by vibration. The fragile portion WF1 can be formed inside the wafer WF. Examples of the type of laser light 26L include those that cause porous absorption such as Nd-YAG laser, Nd-YVO laser, Nd-YLF laser, and titanium sapphire laser that generate pulsed laser light. The wavelength of the laser beam 26L can be appropriately selected depending on the composition and configuration of the wafer WF.

  The vibration applying unit 30 includes a vibration applying device 31 that is supported by the support plate 25 and includes a vibration applying unit 31A that outputs vibration. The vibration applying unit 31A can be exemplified by a unit having a vibrator that vibrates due to, for example, a piezoelectric effect or an eccentric motor as a driving device, and the frequency and amplitude can be appropriately selected depending on the composition and configuration of the wafer WF.

  The suction means 40 is connected to an exhaust means (not shown) such as a decompression pump or a ventilation fan, and includes a suction portion 42 supported by the vibration applying device 31 via a bracket 41. In the present embodiment, as shown in FIG. 2, the output unit 26A is on a straight line connecting the output unit 26A and the vibration applying unit 31A (hereinafter referred to as “output unit straight line L1”), and the output unit is based on the vibration applying unit 31A. The suction part 42 is arranged on the opposite side of 26A.

  As shown in FIG. 2, the wafer WF includes a plurality of chip formation areas WF2 arranged in a matrix, and each chip formation area WF2 includes, for example, an integrated circuit such as a logic circuit, a memory circuit, and a communication control circuit, or a large power A single element such as a power transistor used as a switching element, a light emitting element, a light receiving element, or a diode element is formed. In the state shown in FIG. 2, each chip formation region WF <b> 2 includes first to eleventh horizontal dividing planned lines WX <b> 1 to WX <b> 11 (hereinafter, collectively) extending in the first direction (X-axis direction) in the plane of the wafer WF. "Scheduled line WX" may be referred to) and the first to twelfth vertical line WY1 to WY12 extending in the second direction (Y-axis direction) (hereinafter collectively "vertical line WY" It is divided by). Note that the horizontal cutting planned line WX and the vertical cutting planned line WY serve as a cutting reference for cutting the wafer WF to form a plurality of semiconductor chips, and are not physically formed.

  Next, using FIG. 1 and FIG. 2, the cleaving method will be described while explaining the operation of the cleaving apparatus 1.

  First, as shown in FIG. 2, when the wafer WF is positioned and mounted on the mounting surface 17B with the horizontal and vertical cutting planned lines WX and WY aligned with the X axis and the Y axis, respectively, the supporting means 10 is decompressed. The means 19 is driven to hold the wafer WF by suction. After the wafer WF is sucked and held by the mounting surface 17B, the support means 10 drives the rotation motor 15 based on the detection results of the imaging means such as a camera (not shown) and the detection means such as an optical sensor, Positioning may be performed so that the vertical splitting lines WX and WY coincide with the X axis and the Y axis, respectively. After that, the support means 10 drives the linear motor 13 and, as shown in FIG. 2, after moving the support table 17 so that the first transverse cutting planned line WX1 overlaps the extension line of the output portion straight line L1 in plan view, The linear motion motor 11 is driven, and the support table 17 is raised so that the upper surface of the wafer WF becomes substantially the same height as the position of the lowest point of the vibration applying unit 31A.

  Next, the weak part forming unit 20 drives the laser irradiation device 26 to start irradiation of the laser light 26L from the output unit 26A, and the vibration applying unit 30 drives the vibration applying device 31 to vibrate the vibration applying unit 31A. Let At the same time, the suction means 40 drives an exhaust means (not shown), and suction is started by the suction portion 42.

  Thereafter, the fragile portion forming means 20 drives the linear motor 21 to perform a forward operation of moving the slider 22 from the position indicated by the solid line in FIG. 1 to the position indicated by the two-dot chain line in FIG. As a result, the weak part WF1 along the first horizontal cutting planned line WX1 is continuously formed inside the wafer WF by the laser light 26L, and the weak part WF1 along the first horizontal cutting planned line WX1 is vibrated. The part 31A is blown and collapses, and the wafer WF is cleaved along the first horizontal cleavage line WX1. In addition, since the scattered matter due to the collapse of the fragile portion WF1 is sucked by the suction portion 42, the falling and adhesion of the scattered matter to the semiconductor chip can be suppressed, and the yield of the semiconductor chip can be prevented from being lowered. Can do.

  Then, after the weakened portion forming means 20 drives the rotation motor 23 and rotates the support plate 25 by 180 degrees in a plane parallel to the upper surface of the wafer WF, the support means 10 drives the linear motor 13 and is viewed in plan view. Then, the support table 17 is moved so that the second horizontal cutting planned line WX2 overlaps the extended line of the output portion straight line L1. Next, the fragile portion forming means 20 drives the linear motor 21 to perform a backward operation of moving the slider 22 from the position indicated by the two-dot chain line in FIG. 1 to the position indicated by the solid line in FIG. Thereby, the wafer WF is cut along the second horizontal cutting planned line WX2 by the same operation as described above. Then, after the weak part forming means 20 drives the rotation motor 23 and rotates the support plate 25 by 180 degrees, the support means 10 drives the linear motor 13, and the second part is on the extension line of the output part straight line L1 in plan view. The support table 17 is moved so that the three horizontal cutting planned lines WX3 overlap, and the same operation is repeated until the wafer WF is cut along the eleventh horizontal cutting planned line WX11.

  When the wafer WF is cleaved along the eleventh horizontal cleaving line WX11, the support means 10 drives the rotation motor 15 and moves the support table 17 in the counterclockwise direction in a plane parallel to the upper surface of the wafer WF. After the rotation, the linear motor 13 is driven, and the support table 17 is moved so that the first vertical splitting line WY1 overlaps the extended line of the output portion straight line L1 in plan view. Next, the wafer WF is moved along the first to twelfth vertical cutting lines WY1 to WY12 by performing the same operation as the operation of cutting the wafer WF along the first to eleventh horizontal cutting lines WX1 to WX11. Cleaving to form a plurality of semiconductor chips.

  According to the present embodiment as described above, the following effects can be obtained.

  That is, by providing the vibration applying means 30, it is possible to provide a cleaving apparatus and a cleaving method that do not necessarily require the adhesive sheet to be attached to the wafer WF in advance.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the present invention has been illustrated and described with particular reference to particular embodiments, but it is not intended to depart from the technical idea and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, the plate-like member may be a glass plate, a resin plate, a steel plate, or other plate-like member, and the wafer may be a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, It may have an orientation flat as shown in FIG. 2 or a V notch.

  The weak part forming means uses a physical phenomenon called ablation (transpiration) by laser light irradiation, and forms a weak part that collapses by vibration of a predetermined size by partially reducing the thickness of the plate-like member. You may make it do.

  Alternatively, the fragile portion WF1 may be collapsed by applying ultrasonic vibration to the fragile portion WF1 in a state where the vibration applying portion 31A is separated from the upper surface of the wafer WF. In this case, since no contact is made with the wafer WF, the generation of foreign matter due to the friction of the vibration applying portion 31A can be suppressed.

  Further, the formation of the fragile part WF1 and the collapse of the fragile part WF1 may be performed via separate drive devices. For example, the fragile part WF1 is formed in the forward operation, and the fragile part WF1 is destroyed in the backward operation. You may do it.

  Further, as shown in FIG. 3, the vibration applying means 30 may form a laser passing portion 31Ba through which the laser light 26L output from the output portion 26A of the laser irradiation device 26 can pass through the vibration applying portion 31B. . In this case, the weak part forming means 20 and the vibration applying means 30 can be integrated, and the size can be reduced. The laser passing portion 31Ba may be a through hole or a transmitting member such as glass or resin that can transmit the laser light 26L. When the laser passing portion 31Ba is formed of a transmissive member, the tip of the transmissive member can be shaped sharply, the interval between the cleaved semiconductor chips can be reduced, and the scattered matter due to the collapse of the fragile portion WF1 And the yield of the semiconductor chip can be prevented from lowering due to the falling or adhering of scattered matter on the semiconductor chip.

  Furthermore, as shown in FIG. 4, the vibration applying unit 31 </ b> C may be configured such that the laser beam 26 </ b> L output from the output unit 26 </ b> A of the laser irradiation device 26 passes through the side and irradiates the wafer WF.

  Further, the wafer WF supported by the ring frame via the adhesive sheet may be sucked and held on the placement surface 17B via the adhesive sheet. In this case, it becomes easy to transport a plurality of semiconductor chips that are cut and formed to the next step.

  Alternatively, vibration applying means may be arranged inside the support means 10, for example, in the chamber 17A or below the placement surface 17B, and the support table 17 may be vibrated to collapse the fragile portion WF1. In this case, the plurality of weak parts WF1 can be collapsed together.

  Moreover, the cleaving apparatus according to the present invention may include a pulling unit that pulls the adhesive sheet attached to the lower surface of the wafer to the outside of the wafer. This pulling means does not stretch the adhesive sheet when cleaving the wafer into a plurality of semiconductor chips, but stretches the adhesive sheet after cleaving the wafer into a plurality of semiconductor chips. By providing such a pulling means, the wafer can be cleaved to form a plurality of semiconductor chips, and then the interval between adjacent semiconductor chips can be widened. When picking up, it is possible to prevent a problem that adjacent semiconductor chips come into contact with each other. Moreover, the handling property of the semiconductor chip by the suction collet is improved.

  Further, the weakened portion forming means may employ other devices such as a device that outputs a high output energy electron beam instead of the laser irradiation device 26.

  Further, a driving device that allows the weak portion forming means 20 to move also in the Y-axis direction is adopted, and the weak portion WF1 is formed along the horizontal and vertical split planned lines WX and WY without moving the support means 10. Alternatively, a driving device that allows the supporting means 10 to move in the X-axis direction is adopted, and the weakened portion WF1 is formed along the horizontal and vertical planned cutting lines WX and WY without moving the weakened portion forming means 20. You may make it do.

  Further, the fragile portion forming means is configured to include a plurality of output portions, and is configured to form the fragile portion WF1 along the plurality of horizontal and vertical dividing planned lines WX and WY by one forward operation or backward operation. Also good.

  Further, the weak part forming means includes both a dedicated output part that forms the weak part WF1 along the horizontal splitting line WX and a dedicated output part that forms the weak part WF1 along the vertical split line WY. It is good.

  Moreover, you may use other vibration provision apparatuses, such as a shock wave output apparatus and a striking apparatus, as a vibration provision means. The shock wave output device may generate a shock wave by a voltage method using displacement due to voltage ceramics, for example.

  Further, the vibration applying means may be configured to vibrate the liquid and collapse the fragile portion WF1.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed.

1 Cleaving Device 20 Fragile Portion Forming Means 26A Output Portion 26L Laser Light (Output Line)
30 vibration applying means 31A vibration applying portion WF wafer (plate-like member)
WF1 vulnerable section

Claims (4)

Fragile portion forming means for forming a fragile portion in a plate-like member;
Vibration imparting means for imparting vibration capable of collapsing the fragile portion to the plate member;
With
A cleaving apparatus characterized by cleaving the plate-like member into a plurality of small pieces by collapsing the fragile portion with the vibration applying means. The weak part forming means has an output part that outputs an output line forming the weak part,
The vibration imparting means has a vibration imparting portion that imparts vibration to the fragile portion,
The cleaving apparatus according to claim 1, wherein the vibration applying unit is provided alongside the output unit along a direction in which the fragile portion is formed. The weak part forming means has an output part that outputs an output line forming the weak part,
The vibration imparting means has a vibration imparting portion that imparts vibration to the fragile portion,
The cleaving device according to claim 1, wherein the vibration applying unit is provided so that an output line output from the output unit can pass through the vibration applying unit. Forming a fragile portion in the plate-like member;
Applying a vibration capable of collapsing the fragile portion to the plate member;
And
A cleaving method comprising cleaving the plate-like member into a plurality of small pieces by collapsing the fragile portion.

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