JP2014113662A - Apparatus and method for drilling substrate - Google Patents

Apparatus and method for drilling substrate Download PDF

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JP2014113662A
JP2014113662A JP2012269266A JP2012269266A JP2014113662A JP 2014113662 A JP2014113662 A JP 2014113662A JP 2012269266 A JP2012269266 A JP 2012269266A JP 2012269266 A JP2012269266 A JP 2012269266A JP 2014113662 A JP2014113662 A JP 2014113662A
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substrate
drill
drilling
hole
detection
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JP6023574B2 (en
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Yukihiro Yamada
幸宏 山田
Kosuke Suzuki
孝輔 鈴木
Koichi Suzuki
浩一 鈴木
Toru Yuki
徹 結城
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Via Mechanics Ltd
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Via Mechanics Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for drilling a substrate which can prevent drilling with a wrong position as a reference when chips and/or dust adheres to the surface of a drill or a substrate.SOLUTION: A substrate drilling apparatus causes a substrate pressing part 3 to descend and press a substrate 1 mounted on a table and then causes a drill 4 to descend and carry out drilling a blind hole continuously and comprises first detection means 10 of detecting, each time drilling is carried out, a position at which the substrate pressing part 3 comes in contact with the substrate 1 by being descended, second detection means 11 of detecting, each time drilling is carried out, a position at which the tip of the drill 4 comes in contact with the substrate 1 by the drill 4 being descended and control means 9 of comparing a difference between the positions detected by the first and second detection means 10 and 11 with a difference between preceding hole positions and, when the comparison result is within a predetermined range, after a detection operation of the second means 11, controlling so as to drilling a hole to a depth with the position detected by the second detection means 11 as reference .

Description

本発明は、テーブルに載置されたプリント基板の如き基板にドリルを用いて止まり穴の加工を行う基板穴明け装置及び基板穴明け方法に関する。   The present invention relates to a substrate drilling apparatus and a substrate drilling method for processing a blind hole using a drill on a substrate such as a printed circuit board placed on a table.

プリント基板穴明け装置においては、穴が基板全体に貫通せず基板深さ方向の途中までしかない止まり穴を加工する場合がある。この止まり穴の加工においては、プリント基板上面の高さ位置を検出し、そこから検出したプリント基板上面の高さ位置を基準にして、必要な深さまで穴明けしていた。従って、止まり穴の深さの精度を高めるには、プリント基板上面の高さ位置を正確に求める必要がある。   In the printed circuit board drilling device, there is a case where a blind hole is processed only in the middle of the substrate depth direction without penetrating the entire substrate. In this blind hole processing, the height position of the upper surface of the printed circuit board is detected, and a hole is drilled to a required depth based on the detected height position of the upper surface of the printed circuit board. Therefore, in order to increase the accuracy of the blind hole depth, it is necessary to accurately obtain the height position of the upper surface of the printed circuit board.

従来、特許文献１に開示されるように、加工位置のプリント基板上面の高さ位置をドリルで複数回測定し、それらの差が所定範囲であることを確認したら、正常とみなし、その測定位置を基準にして穴明けを行うものがある。   Conventionally, as disclosed in Patent Document 1, if the height position of the upper surface of the printed circuit board at the processing position is measured a plurality of times with a drill and the difference between them is confirmed to be within a predetermined range, it is regarded as normal and the measurement position There are some that drill holes on the basis of.

特開２００３−１５４８号公報JP 2003-1548 A

しかしながら、このような従来技術では、ドリルや基板の表面に切粉やゴミ等が付着し、複数回の測定が同じように影響を受けていても、基板上面の検出が正しいとみなしてしまい、誤った位置を基準にして穴明けを行うことがあった。   However, in such a conventional technique, even if chips or dust adheres to the surface of the drill or the substrate, and multiple measurements are similarly affected, the detection of the upper surface of the substrate is regarded as correct, Drilling was sometimes performed based on an incorrect position.

そこで、本発明は、ドリルや基板の表面に切粉やゴミ等が付着した場合に、誤った位置を基準にして穴明けを行ってしまうことを防止できる基板穴明け装置及び基板穴明け方法を提供することを目的とするものである。   Therefore, the present invention provides a substrate drilling device and a substrate drilling method that can prevent drilling with reference to an incorrect position when chips or dust adhere to the surface of a drill or a substrate. It is intended to provide.

上記課題を解決するため、請求項１に記載の基板穴明け装置においては、基板押付け部を降下させてテーブルに載置された基板を押付け、ドリルを降下させて止まり穴の加工を連続的に行う基板穴明け装置において、穴を明ける毎に前記基板押付け部を降下させて前記基板に当接する位置を検出する第一の検出手段と、穴を明ける毎に前記ドリルを降下させて先端が前記基板に当接する位置を検出する第二の検出手段と、前記第一及び第二検出手段による検出位置の差を前の穴位置のものと比較し、所定範囲内にあれば、前記第二検出手段の検出動作に続いて、当該第二検出手段による検出位置を基準にした深さまで穴を明けるよう制御する手段とを含むことを特徴とする。   In order to solve the above-mentioned problem, in the substrate drilling device according to claim 1, the substrate pressing portion is lowered to press the substrate placed on the table, the drill is lowered to continuously process the blind hole. In the substrate drilling device to be performed, the first detection means for detecting the position where the substrate pressing portion is lowered to make contact with the substrate every time a hole is made, and the tip is lowered by lowering the drill every time a hole is made. The second detection means for detecting the position in contact with the substrate and the difference between the detection positions of the first and second detection means are compared with those of the previous hole position. Subsequent to the detecting operation of the means, a means for controlling to make a hole to a depth based on the detection position by the second detecting means is included.

また請求項２に記載の基板穴明け装置においては、請求項１に記載の基板穴明け装置において、最初の穴を明ける場合、前記第一及び第二検出手段による検出動作をそれぞれ２回行い、当該２回における前記第一及び第二検出手段による検出位置の差を比較し、所定範囲内にあれば、２回目の前記第二検出手段の検出動作に続いて、１回目の前記第二検出手段による検出位置を基準にした深さまで穴を明けるよう制御する手段とを含むことを特徴とする。   Further, in the substrate drilling device according to claim 2, in the substrate drilling device according to claim 1, when the first hole is drilled, the detection operation by the first and second detection means is performed twice, The difference between the detection positions of the first and second detection means in the second time is compared, and if it is within a predetermined range, the second detection of the first time following the detection operation of the second detection means for the second time. And means for controlling to make a hole to a depth based on a detection position by the means.

また請求項３に記載の基板穴明け方法においては、穴を明ける毎に前記基板押付け部を降下させて前記基板に当接する位置を検出するステップと、穴を明ける毎に前記ドリルを降下させて先端が前記基板に当接する位置を検出するステップと、前記第一及び第二のステップにおける検出位置の差を前の穴位置のものと比較し、所定範囲内にあれば、前記第二ステップに続いて、当該第二ステップにおける検出位置を基準にした深さまで穴を明けるステップとを含むことを特徴とする。   Further, in the substrate drilling method according to claim 3, the step of detecting the position where the substrate pressing portion is lowered by lowering the substrate pressing portion every time a hole is made, and the drill being lowered every time a hole is made. The step of detecting the position where the tip abuts against the substrate and the difference between the detection positions in the first and second steps are compared with those in the previous hole position. Subsequently, the method includes a step of drilling a hole to a depth based on the detection position in the second step.

また請求項４に記載の基板穴明け方法においては、請求項３に記載の基板穴明け方法において、最初の穴を明ける場合、前記第一及び第二ステップをそれぞれ２回行い、当該２回における前記第一及び第二ステップにおける検出位置の差を比較し、所定範囲内にあれば、２回目の前記第二ステップに続いて、１回目の前記第二ステップにおける検出位置を基準にした深さまで穴を明けるステップとを含むことを特徴とする。   Further, in the substrate drilling method according to claim 4, in the substrate drilling method according to claim 3, when the first hole is drilled, the first and second steps are performed twice, respectively. The difference between the detection positions in the first and second steps is compared. If the difference is within a predetermined range, the depth is based on the detection position in the first second step following the second step in the second time. And a step of drilling holes.

本発明によれば、ドリルや基板の表面に切粉やゴミ等が付着した場合に、誤った位置を基準にして穴明けを行ってしまうことを防止できる基板穴明け装置及び基板穴明け方法が得られる。   According to the present invention, there is provided a substrate drilling device and a substrate drilling method capable of preventing drilling on the basis of an incorrect position when chips or dust adhere to the surface of a drill or a substrate. can get.

本発明の一実施例となる基板穴明け装置の構成を示す図である。It is a figure which shows the structure of the board | substrate drilling apparatus used as one Example of this invention. 本発明の一実施例となる基板穴明け装置の動作を説明するための図である。It is a figure for demonstrating operation | movement of the board | substrate drilling apparatus used as one Example of this invention. 本発明の一実施例となる基板穴明け装置において、最初の穴明けを行う場合のフローチャートである。It is a flowchart in the case of performing the first drilling in the board | substrate drilling apparatus which becomes one Example of this invention. 本発明の一実施例となる基板穴明け装置において、二番目以降の穴明けを行う場合のフローチャートである。It is a flowchart in the case of performing the 2nd drilling in the board | substrate drilling apparatus which becomes one Example of this invention.

以下、本発明の一実施例について説明する。図１は本発明の一実施例となる基板穴明け装置の構成を示す図である。   Hereinafter, an embodiment of the present invention will be described. FIG. 1 is a diagram showing a configuration of a substrate drilling apparatus according to an embodiment of the present invention.

図１において、１は止まり穴を加工すべきプリント基板、２はプリント基板１を載置するテーブル、３はプリント基板１をテーブル２に押付けるための基板押付け部、４はプリント基板１に穴を明けるためのドリルである。テーブル２は、プリント基板１に穴を明けようとする位置にドリル４が向くよう、テーブル駆動部５により駆動される。ドリル４はドリル回転駆動部６により回転駆動される。基板押付け部３とドリル４は、それぞれ押付け部駆動部７、ドリル駆動部８により上下方向に駆動される。   In FIG. 1, reference numeral 1 denotes a printed board on which a blind hole is to be processed, 2 denotes a table on which the printed board 1 is placed, 3 denotes a board pressing portion for pressing the printed board 1 against the table 2, and 4 denotes a hole in the printed board 1. It is a drill for dawning. The table 2 is driven by the table driving unit 5 so that the drill 4 faces a position where a hole is to be made in the printed circuit board 1. The drill 4 is driven to rotate by a drill rotation driving unit 6. The substrate pressing unit 3 and the drill 4 are driven in the vertical direction by the pressing unit driving unit 7 and the drill driving unit 8, respectively.

９はテーブル駆動部５、ドリル回転駆動部６、押付け部駆動部７及びドリル駆動部８を制御する全体制御部である。全体制御部９は、テーブル２の現在の二次元位置情報、基板押付け部３とドリル４の現在の高さ位置情報を検知しながら、それぞれテーブル駆動部５、押付け部駆動部７及びドリル駆動部８を制御するようになっている。   An overall control unit 9 controls the table driving unit 5, the drill rotation driving unit 6, the pressing unit driving unit 7, and the drill driving unit 8. The overall control unit 9 detects the current two-dimensional position information of the table 2 and the current height position information of the substrate pressing unit 3 and the drill 4 while detecting the table driving unit 5, the pressing unit driving unit 7, and the drill driving unit, respectively. 8 is controlled.

基板押付け部３とドリル４とは、互いに高さ方向に所定の間隔を保って係合していて、途中までは共に下降し、基板押付け部３がプリント基板１の上面位置に当接すると、その後はドリル４だけ独立に下降することができる。   The substrate pressing portion 3 and the drill 4 are engaged with each other at a predetermined interval in the height direction, and are lowered partway until the substrate pressing portion 3 contacts the upper surface position of the printed circuit board 1. Thereafter, only the drill 4 can be lowered independently.

基板押付け部３が降下してプリント基板１の上面位置に当接すると、その検出位置が押付け部基板当接位置検出部１０により検出できるようになっており、またドリル４が降下してプリント基板１の上面位置に当接すると、その検出位置がドリル先端基板当接位置検出部１１で検出できるようになっている。   When the substrate pressing portion 3 is lowered and comes into contact with the upper surface position of the printed circuit board 1, the detection position can be detected by the pressing portion substrate contact position detecting section 10, and the drill 4 is lowered and the printed circuit board is detected. When it comes into contact with the upper surface position of 1, the detection position of the drill tip substrate contact position detecting unit 11 can detect the detected position.

押付け部基板当接位置検出部１０は、例えば特開平９−２７７１４０号公報で知られているような、センサー（図示せず）を利用するものである。またドリル先端基板当接位置検出部１１は、例えば先行技術文献として掲げた特許文献１の特開２００３−１５４８号公報で知られているような、ドリル４を回転駆動するためのロータシャフト（図示せず）に発生する軸電圧を利用するものである。   The pressing portion substrate contact position detection unit 10 uses a sensor (not shown) as known in, for example, Japanese Patent Laid-Open No. 9-277140. Further, the drill tip board contact position detection unit 11 is a rotor shaft for rotating the drill 4 (see, for example, Japanese Patent Laid-Open No. 2003-1548 of Patent Document 1 listed as a prior art document). (Not shown) is used.

押付け部基板当接位置検出部１０の検出信号は全体制御部９に入力され、押付け部駆動部８への制御情報とから、基板押付け部３がプリント基板１の上面位置に当接した位置の高さが求められるようになっている。またドリル先端基板当接位置検出部１１の検出信号は全体制御部９に入力され、ドリル駆動部８への制御情報とから、ドリル先端がプリント基板１の上面位置に当接した位置の高さが求められるようになっている。   The detection signal of the pressing unit board contact position detection unit 10 is input to the overall control unit 9, and the position of the position where the board pressing unit 3 contacts the upper surface position of the printed circuit board 1 based on the control information to the pressing unit drive unit 8. Height is required. The detection signal of the drill tip board contact position detection unit 11 is input to the overall control unit 9, and the height of the position at which the drill tip touches the upper surface position of the printed circuit board 1 based on the control information to the drill drive unit 8. Is now required.

図２は本発明の一実施例となる基板穴明け装置の動作を説明するための図である。
全体制御部９は、プリント基板１に連続的に穴を明けるよう各部を制御するが、最初の穴の加工動作においては、以下のように制御する。図３は、この場合におけるフローチャートである。 FIG. 2 is a diagram for explaining the operation of the substrate drilling apparatus according to one embodiment of the present invention.
The overall control unit 9 controls each unit so as to continuously drill holes in the printed circuit board 1. In the first hole machining operation, the overall control unit 9 performs the following control. FIG. 3 is a flowchart in this case.

基板押付け部３とドリル４を共に降下させていき、先ず基板押付け部４がプリント基板１の上面位置に当接し基板上面検出位置Ｐ１を検出した後は、ドリル３だけを降下させていく。全体制御部９は、ドリル４がプリント基板１の上面位置に当接し基板上面検出位置Ｄ１を検出したら、基板押付け部４による基板上面検出位置Ｐ１との差Ｈ１を求める。   The substrate pressing portion 3 and the drill 4 are lowered together. First, after the substrate pressing portion 4 comes into contact with the upper surface position of the printed circuit board 1 and detects the substrate upper surface detection position P1, only the drill 3 is lowered. When the drill 4 comes into contact with the upper surface position of the printed circuit board 1 and detects the substrate upper surface detection position D1, the overall control unit 9 obtains a difference H1 from the substrate upper surface detection position P1 by the substrate pressing unit 4.

次に、基板押付け部３とドリル４を所定位置まで上昇させた後再び降下させ、前と同様、基板押付け部３による２回目の基板上面検出位置Ｐ２、ドリル４による２回目の基板上面検出位置Ｄ２を検出し、全体制御部９は両者の差Ｈ２を求める。   Next, the substrate pressing unit 3 and the drill 4 are raised to a predetermined position and then lowered again. As before, the second substrate upper surface detection position P2 by the substrate pressing unit 3 and the second substrate upper surface detection position by the drill 4 are the same as before. D2 is detected, and the overall control unit 9 obtains a difference H2 between them.

１回目の差Ｈ１と２回目の差Ｈ２は、いずれも、基板押付け部３がプリント基板１の上面位置に当接する直前まで保たれていた、基板押付け部３とドリル４の先端との高さ方向の間隔に相当するものである。   Both the first difference H1 and the second difference H2 are the heights of the substrate pressing portion 3 and the tip of the drill 4 that are maintained until just before the substrate pressing portion 3 contacts the upper surface position of the printed circuit board 1. This corresponds to the interval in the direction.

ここで、ドリル４による２回の基板上面検出動作であるが、最初の穴であるから、ドリル４や基板１の表面に切粉やゴミ等が付着している可能性は小さく、正確であることに注目する必要がある。   Here, the substrate upper surface detection operation is performed twice by the drill 4, but since it is the first hole, there is little possibility that chips, dust, etc. are attached to the surface of the drill 4 or the substrate 1, and it is accurate. It is necessary to pay attention to this.

次に、全体制御部９はＨ１とＨ２との差Ｋを求め、この差Ｋが所定範囲にあるならば、正常とみなし、先に得られていた１回目の基板上面検出位置Ｄ１を基準にした深さまで、ドリル４を回転させてプリント基板１に穴を明ける。   Next, the overall control unit 9 obtains a difference K between H1 and H2, and if this difference K is within a predetermined range, it is regarded as normal and the first substrate upper surface detection position D1 obtained previously is used as a reference. The drill 4 is rotated to the depth as described above to make a hole in the printed circuit board 1.

ここで、１回目の基板上面検出位置Ｄ１を基準にするのは、以下の理由による。
ドリル４による１回目の基板上面検出の際、ドリル４がプリント基板１に接触し、わずかの深さであるが、穴を明けてしまう。ドリル４による２回目の基板上面検出は、再び当該部分で行うので、精度は微妙に悪くなる現象が起こる。従って、この現象の影響を受けない１回目の基板上面検出位置Ｄ１を基準にするのである。 Here, the reason why the first substrate upper surface detection position D1 is used as a reference is as follows.
In the first detection of the upper surface of the substrate by the drill 4, the drill 4 comes into contact with the printed circuit board 1, and a hole is formed though the depth is slight. Since the second detection of the upper surface of the substrate by the drill 4 is performed again at that portion, a phenomenon in which the accuracy is slightly deteriorated occurs. Therefore, the first substrate upper surface detection position D1 that is not affected by this phenomenon is used as a reference.

上記において、差Ｋが所定範囲になかった場合、上記と同じ動作を繰り返し、繰り返し回数が所定回数を超えたら、加工動作を停止する。この停止状態では、ドリル４の周辺にゴミ等が付いていないか等、オペレータによる目視による異常検査が行われる。   In the above, when the difference K is not within the predetermined range, the same operation as described above is repeated, and when the number of repetitions exceeds the predetermined number, the machining operation is stopped. In this stopped state, the operator visually inspects whether there is any dust around the drill 4 or not.

次に、二番目の穴の加工動作に移る訳だが、全体制御部９は各部を以下のように制御する。図４は、この場合におけるフローチャートである。   Next, the process moves to the machining operation for the second hole. The overall control unit 9 controls each unit as follows. FIG. 4 is a flowchart in this case.

基板押付け部３とドリル４とを最初の穴の加工動作時と同様に降下させ、基板押付け部３が基板１の上面位置に当接し基板上面検出位置Ｐ１を検出した後は、ドリル４だけを降下させていく。全体制御部９は、ドリル４がプリント基板１の上面位置に当接し基板上面検出位置Ｄ１を検出したら、先に得られていた基板押付け部３による基板上面検出位置Ｐ１との差Ｈ１を求める。   After the substrate pressing portion 3 and the drill 4 are lowered in the same manner as in the first hole processing operation and the substrate pressing portion 3 abuts on the upper surface position of the substrate 1 and detects the substrate upper surface detection position P1, only the drill 4 is moved. I will let you go down. When the drill 4 comes into contact with the upper surface position of the printed circuit board 1 and detects the substrate upper surface detection position D1, the overall control unit 9 obtains a difference H1 from the substrate upper surface detection position P1 obtained by the substrate pressing unit 3 obtained previously.

全体制御部９は、今回求めた差Ｈ１とすでに記憶しておいた最初（前回）の穴の加工動作時での差Ｈ１とを比較し、その差Ｊが所定範囲にあるならば、正常とみなし、今回の基板上面検出位置Ｄ１を基準にした深さまで、ドリル３を回転させてプリント基板１に穴を明ける。   The overall control unit 9 compares the difference H1 obtained this time with the difference H1 already stored in the first (previous) hole machining operation, and if the difference J is within a predetermined range, it is normal. Accordingly, the drill 3 is rotated to a depth based on the current board upper surface detection position D1 to make a hole in the printed board 1.

ここで、上記の差Ｊが所定範囲になかった場合、上記と同じ動作を繰り返し、繰り返し回数が所定回数を超えたら、加工動作を停止する。この停止状態では、ドリル４の周辺にゴミ等が付いていないか等、オペレータによる目視による異常検査が行われる。   Here, when the difference J is not within the predetermined range, the same operation as described above is repeated, and when the number of repetitions exceeds the predetermined number, the machining operation is stopped. In this stopped state, the operator visually inspects whether there is any dust around the drill 4 or not.

三番目以降の穴についても、以上の二番目の穴の加工動作と同様に動作する。   The third and subsequent holes operate in the same manner as the second hole.

上記実施形態によれば、基板押付け部３がプリント基板１の上面位置に当接する直前まで保たれていた、基板押付け部３とドリル４の先端との高さ方向の間隔を参考にして、ドリル４の基板上面位置検出位置の正当性を判断するようにしている。   According to the above-described embodiment, the drill is determined with reference to the distance in the height direction between the substrate pressing portion 3 and the tip of the drill 4, which is maintained until just before the substrate pressing portion 3 contacts the upper surface position of the printed circuit board 1. The correctness of the substrate upper surface position detection position 4 is judged.

これにより、ドリル４や基板１の表面に切粉やゴミ等が付着していた場合には、差Ｋ、Ｊが所定範囲にならなくなり、加工動作を停止することになる。従って、誤った位置を基準にして穴明けを行ってしまうことを防止できるようになる。   As a result, when chips or dust adheres to the surface of the drill 4 or the substrate 1, the differences K and J are not within the predetermined range, and the processing operation is stopped. Accordingly, it is possible to prevent the drilling with respect to the wrong position.

２：テーブル
３：基板押付け部
４：ドリル
５：テーブル駆動部
６：ドリル回転駆動部
７：基板押付け部駆動部
８：ドリル駆動部
９：全体制御部
１０：押付け部基板当接位置検出部
１１：ドリル先端基板当接位置検出部 2: table 3: substrate pressing unit 4: drill 5: table driving unit 6: drill rotation driving unit 7: substrate pressing unit driving unit 8: drill driving unit 9: overall control unit 10: pressing unit substrate contact position detection unit
11: Drill tip board contact position detector

Claims (4)

基板押付け部を降下させてテーブルに載置された基板を押付け、ドリルを降下させて止まり穴の加工を連続的に行う基板穴明け装置において、穴を明ける毎に前記基板押付け部を降下させて前記基板に当接する位置を検出する第一の検出手段と、穴を明ける毎に前記ドリルを降下させて先端が前記基板に当接する位置を検出する第二の検出手段と、前記第一及び第二検出手段による検出位置の差を前の穴位置のものと比較し、所定範囲内にあれば、前記第二検出手段の検出動作に続いて、当該第二検出手段による検出位置を基準にした深さまで穴を明けるよう制御する手段とを含むことを特徴とする基板穴明け装置。   In the substrate drilling device that lowers the substrate pressing part and presses the substrate placed on the table, lowers the drill and processes the blind holes continuously, the substrate pressing part is lowered every time a hole is drilled. First detection means for detecting a position that contacts the substrate, second detection means for detecting a position where the tip contacts the substrate by lowering the drill each time a hole is made, and the first and first The difference between the detection positions of the two detection means is compared with that of the previous hole position, and if it is within a predetermined range, the detection position of the second detection means is used as a reference following the detection operation of the second detection means. And a means for controlling the drilling to a depth. 請求項１に記載の基板穴明け装置において、最初の穴を明ける場合、前記第一及び第二検出手段による検出動作をそれぞれ２回行い、当該２回における前記第一及び第二検出手段による検出位置の差を比較し、所定範囲内にあれば、２回目の前記第二検出手段の検出動作に続いて、１回目の前記第二検出手段による検出位置を基準にした深さまで穴を明けるよう制御する手段とを含むことを特徴とする基板穴明け装置。   2. The substrate drilling apparatus according to claim 1, wherein when the first hole is drilled, the detection operation by the first and second detection means is performed twice, and the detection by the first and second detection means is performed twice. If the difference in position is compared, and if it is within a predetermined range, then the second detection means of the second detection means will make a hole to a depth based on the detection position of the second detection means of the first time. And means for controlling the substrate. 基板押付け部を降下させてテーブルに載置された基板を押付け、ドリルを降下させて止まり穴の加工を連続的に行う基板穴明け装置における基板穴明け方法において、穴を明ける毎に前記基板押付け部を降下させて前記基板に当接する位置を検出するステップと、穴を明ける毎に前記ドリルを降下させて先端が前記基板に当接する位置を検出するステップと、前記第一及び第二のステップにおける検出位置の差を前の穴位置のものと比較し、所定範囲内にあれば、前記第二ステップに続いて、当該第二ステップにおける検出位置を基準にした深さまで穴を明けるステップとを含むことを特徴とする基板穴明け方法。   In the substrate drilling method in the substrate drilling device, which lowers the substrate pressing part and presses the substrate placed on the table and lowers the drill and continuously processes the blind holes, the substrate pressing is performed each time a hole is drilled. A step of lowering a portion to detect a position contacting the substrate, a step of detecting the position where the tip is brought into contact with the substrate by lowering the drill every time a hole is made, and the first and second steps Comparing the difference in the detected position with that of the previous hole position, and if within a predetermined range, following the second step, a step of drilling a hole to a depth based on the detected position in the second step; A method for drilling a substrate, comprising: 請求項３に記載の基板穴明け方法において、最初の穴を明ける場合、前記第一及び第二ステップをそれぞれ２回行い、当該２回における前記第一及び第二ステップにおける検出位置の差を比較し、所定範囲内にあれば、２回目の前記第二ステップに続いて、１回目の前記第二ステップにおける検出位置を基準にした深さまで穴を明けるステップとを含むことを特徴とする基板穴明け方法。   4. The substrate drilling method according to claim 3, wherein when the first hole is drilled, each of the first and second steps is performed twice, and the difference in detection position between the first and second steps in the two times is compared. And if it is within a predetermined range, a step of drilling a hole to a depth based on a detection position in the second step of the first time following the second step of the second time is included. Dawn method.
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