JP2014112660A5 - - Google Patents

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Publication number
JP2014112660A5
JP2014112660A5 JP2013221086A JP2013221086A JP2014112660A5 JP 2014112660 A5 JP2014112660 A5 JP 2014112660A5 JP 2013221086 A JP2013221086 A JP 2013221086A JP 2013221086 A JP2013221086 A JP 2013221086A JP 2014112660 A5 JP2014112660 A5 JP 2014112660A5
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Japan
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alignment
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substrate
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alignment marks
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JP2013221086A
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Japanese (ja)
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JP6264831B2 (ja
JP2014112660A (ja
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JP2013221086A 2012-11-06 2013-10-24 アライメント装置、位置合わせ方法、及び、積層半導体装置の製造方法 Active JP6264831B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013221086A JP6264831B2 (ja) 2012-11-06 2013-10-24 アライメント装置、位置合わせ方法、及び、積層半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012244190 2012-11-06
JP2012244190 2012-11-06
JP2013221086A JP6264831B2 (ja) 2012-11-06 2013-10-24 アライメント装置、位置合わせ方法、及び、積層半導体装置の製造方法

Related Child Applications (1)

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JP2017249317A Division JP6489199B2 (ja) 2012-11-06 2017-12-26 アライメント装置、基板貼り合わせ装置、位置合わせ方法、及び、積層半導体装置の製造方法

Publications (3)

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JP2014112660A JP2014112660A (ja) 2014-06-19
JP2014112660A5 true JP2014112660A5 (enExample) 2016-11-24
JP6264831B2 JP6264831B2 (ja) 2018-01-24

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JP2013221086A Active JP6264831B2 (ja) 2012-11-06 2013-10-24 アライメント装置、位置合わせ方法、及び、積層半導体装置の製造方法
JP2017249317A Active JP6489199B2 (ja) 2012-11-06 2017-12-26 アライメント装置、基板貼り合わせ装置、位置合わせ方法、及び、積層半導体装置の製造方法

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JP2017249317A Active JP6489199B2 (ja) 2012-11-06 2017-12-26 アライメント装置、基板貼り合わせ装置、位置合わせ方法、及び、積層半導体装置の製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107329379B (zh) * 2016-04-29 2019-01-18 上海微电子装备（集团）股份有限公司 双层对准装置和双层对准方法
JP6973612B2 (ja) * 2016-08-29 2021-12-01 株式会社ニコン 積層装置、薄化装置、露光装置、制御装置、プログラム、積層体の製造方法、及び装置
CN114334770B (zh) * 2020-10-12 2025-07-22 矽磐微电子(重庆)有限公司 芯片贴装方法及芯片贴装装置
JP2026036495A (ja) * 2024-08-20 2026-03-05 株式会社Ｓｃｒｅｅｎホールディングス 基板接合装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232325A (ja) * 1987-03-20 1988-09-28 Canon Inc 位置合せ方法
JPH05190435A (ja) * 1992-01-17 1993-07-30 Hitachi Ltd 半導体装置の電子線描画方法
JPH07226359A (ja) * 1994-02-10 1995-08-22 Nikon Corp 位置合わせ方法
JPH0936202A (ja) * 1995-07-14 1997-02-07 Nikon Corp 位置決め方法
JPH1197510A (ja) * 1997-09-18 1999-04-09 Toshiba Corp アライメント方法
JP2000150361A (ja) * 1998-11-06 2000-05-30 Canon Inc 位置計測方法および位置計測装置
JP2001203147A (ja) * 2000-01-20 2001-07-27 Nikon Corp マーク検知装置、露光装置、デバイス、マーク検知方法及び露光方法
JP4777731B2 (ja) * 2005-03-31 2011-09-21 富士通セミコンダクター株式会社 半導体装置の製造方法
CN103258762B (zh) * 2007-08-10 2016-08-03 株式会社尼康 基板贴合装置及基板贴合方法
TW201015661A (en) * 2008-10-01 2010-04-16 Nikon Corp Alignment apparatus and alignment method
JP5549343B2 (ja) * 2010-03-18 2014-07-16 株式会社ニコン 基板接合装置、基板ホルダ、基板接合方法、デバイスの製造方法および位置合わせ装置
JP5617418B2 (ja) * 2010-08-05 2014-11-05 株式会社ニコン 半導体基板の積層方法、半導体基板の積層装置およびデバイスの製造方法

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