JP2014103201A - Component transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component transfer device in which a reference mark can be captured stably regardless of the size of a component being collected by a component collecting device.SOLUTION: Since a reference member 80 includes a shading wall 81 for blocking the light from a first light irradiation device 64 for a reference mark M, the light from a first light irradiation device 64, out of the light with which the reference mark M is irradiated, is blocked and the reference mark M is irradiated mainly with the light from a second light irradiation device 65. Consequently, the brightness of the reference mark M can be maintained at a substantially constant level, regardless of the size of a component P collected by a component collecting device 41, and the reference mark M can be captured stably. Position of the component P, the image of which is recognized, can thereby be determined with high accuracy.

Description

  The present invention relates to a component transfer apparatus that picks up a component and transfers it onto a substrate, and in particular, picks up a component that has been picked up by the picking device and a reference mark formed on a reference member, and simultaneously picks up the position of the component with an image pickup device. The present invention relates to a component transfer apparatus that can recognize an image.

  In general, in a component mounting apparatus provided with a component transfer device, a component is sampled from a component supply position by a sampling device, and the sampled component is imaged by an imaging device while being moved onto a substrate. Then, by processing the image of the component and recognizing the component misalignment and angular misalignment with respect to the center of the sampling device, the component can be accurately mounted at a predetermined coordinate position on the substrate.

  In such a component mounting apparatus, in order to shorten the tact time, a reference mark is provided in the sampling device as a method for imaging the component without stopping the sampling device on the imaging device, and the component and the reference mark are simultaneously imaged. Thus, the position of the component can be image-recognized using the reference mark as a reference. As this type of component mounting apparatus, for example, the one described in Patent Document 1 is known.

JP 2005-11950 A

  By the way, when the thickness (height) of the front part mounted on the substrate is high, it is necessary to arrange the reference mark at a high position in order to avoid interference between the front part and the reference mark. However, if the part collected by the sampling device is a large part, part of the light from the light irradiation device that irradiates the part and the reference mark from below is blocked by the large part, and the brightness of the reference mark changes. There is a risk that. In this case, the reference mark cannot be stably imaged, and an error occurs in the position of the recognized component.

  The present invention has been made to solve the above-described problems, and provides a component transfer device capable of stably imaging a reference mark regardless of the size of a component collected by the sampling device. It is for the purpose.

  In order to solve the above-described problems, the invention according to claim 1 is a collection device capable of collecting a component, and a moving device capable of moving the component collected by the collection device onto a substrate on which the component is mounted. An imaging device capable of imaging the component collected by the sampling device from below, and a reference mark used as a reference when the image of the component is imaged at the same time when the component is imaged by the imaging device A reference member provided with: a first light irradiation device capable of irradiating the component and the reference member from below with light inclined at a predetermined angle with respect to the optical axis of the imaging device; and light parallel to the optical axis. A second light irradiation device capable of irradiating the component and the reference member from below, wherein the reference member includes a light shielding wall that blocks light from the first light irradiation device with respect to the reference mark. .

  According to a second aspect of the present invention, in the first aspect, the reference member is a stepped step portion formed on the periphery of the reference mark so that light from the first light irradiation device is blocked by the light shielding wall. Is further provided.

  According to a third aspect of the present invention, in the first or second aspect, the reference mark is formed in a bottomed hole drilled upward with respect to the reference member.

  According to the first aspect of the present invention, of the light emitted to the reference mark, the light from the first light irradiation device that is easily affected by the component collected by the sampling device is almost blocked by the light shielding wall, and the component. The light from the second light irradiation device which is not easily affected by the light is mainly irradiated. As a result, the luminance of the reference mark can be maintained at a substantially constant value regardless of the size of the parts collected by the sampling device, and the reference mark can be stably imaged. Therefore, the position of the image-recognized component can be obtained with high accuracy.

  According to the second aspect of the present invention, the light from the first light irradiation device that is easily influenced by the components collected by the sampling device among the light irradiated to the stepped portion around the reference mark is almost blocked by the light shielding wall. The light from the second light irradiation device that is hardly affected by the component is mainly irradiated. As a result, the reference mark is bordered by contours having different luminances, so that the reference mark can be recognized with high accuracy. Therefore, it is possible to obtain the position of the recognized component with higher accuracy.

  According to the invention of claim 3, since the reference mark and the light shielding wall can be formed by drilling the bottomed hole in the reference member, the reference member can be manufactured at low cost.

It is a schematic perspective view which shows the whole component mounting apparatus provided with the component transfer apparatus which concerns on embodiment of this invention. It is a figure which shows a components transfer apparatus. It is a control block diagram which shows the control apparatus which controls a component mounting apparatus. It is sectional drawing which shows the reference | standard member which has a reference | standard mark and a light-shielding wall. It is a top view which shows the light irradiation surface of a reference member. It is a figure which shows the state of the brightness | luminance when light is irradiated to a reference member. It is a flowchart which shows operation | movement of a component mounting apparatus. It is sectional drawing which shows another form of a reference member. It is sectional drawing which shows another form of a reference member.

  Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the component mounting apparatus 10 includes a component supply device 20, a substrate transfer device 30, a component transfer device 40, and a control device 70 (see FIG. 3).

  As an example, the component supply device 20 is configured by a cassette type device in which a plurality of feeders 21 are arranged on the base 11 in the X-axis direction. The feeder 21 is provided with a supply reel 23 around which a tape containing a large number of parts spaced in a row is wound, and is detachably attached to a device base 22 installed on the base 11. Although not shown, the feeder 21 has a built-in motor serving as a driving source for pitch-feeding the tape. The feeder 21 is configured to be capable of sequentially supplying components housed in the tape to a component supply position P1 provided at the tip of the feeder 21 by feeding the tape one pitch at a time by a motor.

  As an example, the substrate transfer device 30 is configured of a double conveyor type in which transfer means 31 and 32 are arranged in parallel on the base 11. A pair of guide rails 33 and 34 are parallel to each other and are arranged in parallel to each transport means 31 and 32, and support and transport the substrate B guided by the guide rails 33 and 34. (Not shown) are juxtaposed. Each of the transporting units 31 and 32 is configured to transport the substrate B in the X-axis direction and be positioned and held at a predetermined position.

  The component transfer device 40 is mounted on the base 11 and disposed above the component supply device 20 and the substrate transport device 30, and moves the sampling device 41 capable of collecting components and the component onto the substrate B. The moving device 42 includes a component recognition device 60 that is provided between the component supply device 20 and the substrate transfer device 30 and recognizes a component collected by the collection device 41.

  As shown in FIGS. 1 and 3, the moving device 42 includes a guide rail 52, a Y-axis moving table 43, a Y-axis servo motor 44, an X-axis moving table 45, an X-axis servo motor 46, a substrate recognition camera 53, and the like. It is configured. As shown in FIGS. 1 to 3, the sampling device 41 includes a component mounting head 47, a lifting shaft 48, a Z-axis servo motor 49, a θ-axis servo motor 51, a suction head 54, a suction nozzle 55, and the like. Yes. The component recognition device 60 includes a component recognition camera 61, a lens 62, a light source cover 63, a first light irradiation device 64, a second light irradiation device 65, a reference member 80 attached to the component mounting head 47, and the like. Yes.

  As shown in FIG. 1, the Y-axis moving table 43 is provided so as to be movable along the guide rail 52 in the Y-axis direction orthogonal to the X-axis direction. The movement of the Y-axis moving table 43 in the Y-axis direction is controlled by a Y-axis servo motor 44 via a ball screw. An X-axis moving table 45 is guided and supported by the Y-axis moving table 43 so as to be movable in the X-axis direction. The movement of the X-axis moving table 45 in the X-axis direction is controlled by the X-axis servo motor 46 via a ball screw.

  A substrate recognition camera 53 that captures an unillustrated substrate mark (fiducial mark) provided on the substrate B is attached to the X-axis moving table 45. The board recognition camera 53 recognizes the position of the board mark formed on the board B carried into the component mounting position by the board transfer device 30 and moves the X axis and the Y axis based on the recognized board mark position. It is provided to correct the positions of the bases 45 and 43 so that the component P can be accurately mounted at a predetermined coordinate position on the board B. Further, a component mounting head 47 is attached to the X-axis moving table 45.

  As shown in FIG. 2, the component mounting head 47 supports a lifting shaft 48 that can move up and down in the Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions and that can rotate around the lifting axis O <b> 1. Has been. The elevating shaft 48 is controlled to move and rotate in the Z-axis direction by a Z-axis servo motor 49 and a θ-axis servo motor 51 (see FIG. 3). A suction head 54 is provided at the lower end of the lifting shaft 48, and a suction nozzle 55 that sucks the component P onto the suction head 54 is held on the rotation axis O <b> 1 of the lifting shaft 48. In addition, the component mounting head 47 is provided with a reference mark M (see FIGS. 4A and 4B) that serves as a reference when the component recognition camera 61 captures the component P at the same time and processes the image of the component P. A fixed reference member 80 is attached.

  The component recognition camera 61 is, for example, a CCD camera having an optical axis O2 parallel to the Z-axis direction. The lens 62 is provided above the component recognition camera 61 and collects the light irradiated and reflected from the first and second light irradiation devices 64 and 65. The light source cover 63 is provided above the lens 62 and includes first and second light irradiation devices 64 and 65. The first and second light irradiation devices 64 and 65 are provided for shadowless illumination.

  The first light irradiation device 64 is provided with a first light source 66 in which a large number of light sources (LEDs) 66b are arranged on the entire circumference of a bowl-shaped curved surface 66a that is convex downward and has an open bottom center. Yes. The first light irradiation device 64 is configured as a side light source capable of irradiating light emitted obliquely upward from the first light source 66 to the component P and the reference member 80 adsorbed by the adsorption nozzle 55 from obliquely below.

  In the second light irradiation device 65, a second light source 67 in which a large number of light sources (LEDs) 67b are arranged on a plane 67a parallel to the Z-axis direction and a half mirror 68 inclined at 45 degrees with respect to the Z-axis are spaced apart from each other. Are opposed to each other. The second light irradiation device 65 reflects light emitted from the second light source 67 in the horizontal direction in the vertical direction by the half mirror 68, and can irradiate the component P and the reference member 80 sucked by the suction nozzle 55 from below vertically. It is configured as a simple coaxial incident light source. Both or one of the first light irradiation device 64 and the second light irradiation device 65 is turned on according to the type of electronic component.

  As shown in FIGS. 4A and 4B, the reference member 80 receives light from the first light irradiation device 64 through the light shielding wall 81 that blocks the light from the first light irradiation device 64 with respect to the reference mark M. A stepped step portion 84 formed on the periphery of the reference mark M is provided so as to be blocked.

  The reference member 80 is formed of, for example, stainless steel in a cylindrical shape, and four bottomed holes 82 are formed in one end surface 80a of the reference member 80 at equal angle (90 degrees) intervals. A mark member 83 is screwed onto the bottom surface 82 a of the four bottomed holes 82. The bottomed hole 82 has a larger diameter than the head 83 a of the mark member 83. One end surface 80a of the reference member 80, the inner peripheral surface 82b and the bottom surface 82a of the bottomed hole 82 are covered with a black covering material capable of absorbing light. The top of the head 83a of the mark member 83 is mirror-finished to provide a reference mark M.

  The wall-shaped portion including the one end surface 80a of the reference member 80 and the inner peripheral surface 82b of the bottomed hole 82 having such a configuration functions as a light shielding wall 81 that blocks light from the first light irradiation device 64 from the reference mark M. To do. The reference mark is formed so that the stepped portion constituted by the outer peripheral surface 83b of the head 83a of the mark member 83 and the bottom surface 82a of the bottomed hole 82 is blocked by the light shielding wall 81 from the first light irradiation device 64. It functions as a stepped step portion 84 formed on the periphery of M.

  That is, the light from the first light irradiation device 64 is almost blocked by the light shielding wall 81 at the peripheral portion of the reference mark M of the reference member 80 and the bottom surface 82a of the bottomed hole 82, and the second light irradiation device. Light from 65 is mainly irradiated through the bottomed hole 82. On the other hand, one end surface 80 a of the reference member 80 is irradiated with each light from the first and second light irradiation devices 64 and 65.

  Conventionally, in particular, when the component P sucked by the suction nozzle 55 is a large component, a part of light from the obliquely lower side from the first light irradiation device 64 is blocked, and the luminance of the reference mark M may change. was there. However, in this embodiment, since the reference mark M is mainly irradiated with light from vertically below the second light irradiation device 65, the luminance of the reference mark M can be maintained at a substantially constant value. Further, the peripheral portion of the reference mark M on the bottom surface 82 a of the bottomed hole 82 is mainly irradiated with light from the second light irradiation device 65, and the one end surface 80 a of the reference member 80 is irradiated with the first and second light irradiations. Since each light from the devices 64 and 65 is irradiated, the luminance of the peripheral portion of the reference mark M on the bottom surface 82a of the bottomed hole 82 is smaller than the luminance of the one end surface 80a of the reference member 80.

  That is, as shown in FIG. 5, the luminance of the reference mark M is maximized, the luminance of the one end surface 80a of the reference member 80 is smaller than the luminance of the reference mark M, and the reference mark M on the bottom surface 82a of the bottomed hole 82 The brightness of the peripheral portion is minimized. As a result, the reference mark M can be stably imaged regardless of the size of the component P sucked by the suction nozzle 55, and the peripheral portion of the reference mark M is contoured to define the reference mark M. Since the image can be clearly recognized, the position of the recognized component P can be obtained with high accuracy.

  In addition, although the case where the bottomed hole 82 to be drilled in the reference member 80 is formed in a cylindrical shape has been described, the same effect can be obtained by drilling in the shape of a truncated cone extending to the one end face 80a side of the reference member 80. Further, although the case where the peripheral portion of the reference mark M is formed at a position deeper than the top of the head 83a of the mark member 83 has been described, the same applies even if formed at a position shallower than the top of the head 83a of the mark member 83. There is an effect. Further, the case where four reference marks M are formed on the reference member 80 has been described, but the same effect can be obtained even if an arbitrary number of reference marks M are formed.

  As shown in FIG. 3, the control device 70 includes a CPU 71, a ROM 72, a RAM 73 and a bus 74 for connecting them, and an input / output interface 75 is connected to the bus 74. The input / output interface 75 includes an X-axis and Y-axis servomotors 46 and 44 that move the component mounting head 47 in the X-axis and Y-axis directions, a Z-axis servomotor 49 that moves the lift shaft 48 in the Z-axis direction, and A motor control unit 76 that controls a θ-axis servomotor 51 that rotates the elevating shaft 48 around the elevating axis O1 is connected. The input / output interface 75 includes image data captured by the light irradiation control unit 77 that instructs the first and second light irradiation devices 64 and 65 to perform light irradiation, the component recognition camera 61, and the board recognition camera 53. An image processing device 78 for image processing is connected.

Next, the operation of the component mounting apparatus 10 will be described with reference to the flowchart of FIG.
Based on a command from the control device 70, the conveyor belt of the substrate transport device 30 is driven, the substrate B is guided to the guide rail 33 (34), transported to a predetermined position, and positioned and clamped. Next, when the X-axis servo motor 46 and the Y-axis servo motor 44 are driven, the X-axis moving table 45 and the Y-axis moving table 43 are moved in the X-axis direction and the Y-axis direction, and the component mounting head 47 supplies the components. The device 20 is moved to the component supply position P1. With the component mounting head 47 moved to the component supply position P1, the suction head 54 is lowered in the Z-axis direction by the Z-axis servo motor 49 together with the lifting shaft 48, and the component is supplied by the suction nozzle 55 provided in the suction head 54. The component P supplied to the position P1 is sucked.

  Subsequently, the component mounting head 47 is moved to a predetermined coordinate position on the board B by the movement of the X-axis moving table 45 and the Y-axis moving table 43, but passes above the component recognition camera 61 on the way. At this time, by imaging the component P sucked by the suction nozzle 55 by the component recognition camera 61, the shift amount of the component P with respect to the suction nozzle 55 and the suction posture of the component P are recognized. Then, the component P is mounted at a predetermined position on the board B after correcting the displacement amount of the component P and the suction posture of the component P.

  In step 101, the component mounting head 47 is controlled to move so as to pass above the component recognition camera 61 without being stopped. When the component mounting head 47 reaches the upper position of the component recognition camera 61, in step 102, the component recognition camera 61 is exposed to the first and second light irradiation devices 64 and 65 by the light irradiation control unit 78. A light irradiation command is issued.

  Thereby, the first and second light sources 66 and 67 emit light instantaneously. As a result, the reference mark M is imaged in the same field of view as the component P sucked by the suction nozzle 55 by the component recognition camera 61. In this case, since the first and second light sources 66 and 67 only emit light instantaneously like a strobe light, even if the component recognition camera 61 is in an exposure state, the first and second light sources 66 and 67 are imaged by the component recognition camera 61. In addition, the image of the component P and the reference mark M can be clearly captured without flowing. When the reference mark M and the component P are imaged by the component recognition camera 61, the component P sucked by the suction nozzle 55 is positioned within the depth of field of the component recognition camera 61.

  Next, in step 103, the image processor 78 recognizes the position of the component P with reference to the reference mark M, thereby accurately recognizing the misalignment and angular misalignment of the component P with respect to the center of the suction nozzle 55. it can. In this way, the tact time can be shortened by recognizing the position of the component P without being stopped on the component recognition camera 61 by the component P attracted to the suction nozzle 55. Even if the component mounting head 47 is moved and stopped above the component recognition camera 61 and controlled so as to image the component P and the reference mark M, the position of the component P is recognized with reference to the reference mark M. Can do.

  Next, another embodiment of the reference member will be described with reference to FIG. The reference member 90 is provided with a light shielding wall 91 that blocks the light from the first light irradiation device 64 with respect to the reference mark M. The reference member 90 is formed of, for example, stainless steel in a cylindrical shape, and four bottomed holes 92 are formed at one end surface 90a of the reference member 90 at equal angles (90 degrees). A mark member 93 is screwed onto the bottom surface 92 a of the four bottomed holes 92. The bottomed hole 92 is formed to have substantially the same diameter (slightly larger diameter) as the head 93 a of the mark member 93. One end surface 90a of the reference member 90 and the inner peripheral surface 92b of the bottomed hole 92 are covered with a black covering material capable of absorbing light. The top of the head 93a of the mark member 93 is mirror-finished to provide a reference mark M.

  The wall-shaped portion including the one end surface 90a of the reference member 90 and the inner peripheral surface 92b of the bottomed hole 92 having such a configuration functions as a light shielding wall 91 that blocks the light from the first light irradiation device 64 from the reference mark M. To do. In other words, the reference mark M of the reference member 90 is almost shielded by the light shielding wall 91 from the first light irradiation device 64, and the light from the second light irradiation device 65 is mainly irradiated through the bottomed hole 92. Is done. On the other hand, one end surface 90 a of the reference member 90 is irradiated with each light from the first and second light irradiation devices 64 and 65.

  Conventionally, in particular, when the component P sucked by the suction nozzle 55 is a large component, a part of light from the obliquely lower side from the first light irradiation device 64 is blocked, and the luminance of the reference mark M may change. was there. However, in this embodiment, since the reference mark M is mainly irradiated with light from vertically below the second light irradiation device 65, the luminance of the reference mark M can be maintained at a substantially constant value. That is, regardless of the size of the component P sucked by the suction nozzle 55, the reference mark M can be stably imaged, and the position of the recognized component can be obtained with high accuracy.

  Next, still another embodiment of the reference member will be described with reference to FIG. In each of the above-described embodiments, the reference members 80 and 90 that are applicable when a part of light from the obliquely lower side from the first light irradiation device 64 is blocked by the component P sucked by the suction nozzle 55 have been described. In this embodiment, a reference member 100 that can be applied when light is not blocked by the component P sucked by the suction nozzle 55 will be described.

  The reference member 100 is provided so that the reference mark M is on the same plane as the one end surface 100 a of the reference member 100, and the light from the first light irradiation device 64 is blocked by the light shielding wall 101. A stepped portion 104 is provided on the periphery of the mark M.

  The reference member 100 is formed of, for example, stainless steel in a cylindrical shape, and four bottomed holes 102 are formed at one end surface 100a of the reference member 100 at equal angles (90 degrees). The mark member 103 is screwed onto the bottom surface 102 a of the four bottomed holes 102. The bottomed hole 102 has a larger diameter than the head 103 a of the mark member 103. The depth of the bottomed hole 102 is the same as the length of the head 103 a of the mark member 103. One end surface 100a of the reference member 100, the inner peripheral surface 102b and the bottom surface 102a of the bottomed hole 102 are covered with a black covering material capable of absorbing light. The top of the head 103a of the mark member 103 is mirror-finished to provide a reference mark M.

  The wall-shaped portion including the one end surface 100a of the reference member 100 having such a configuration and the inner peripheral surface 102b of the bottomed hole 102 functions as a light shielding wall 101 that blocks light from the first light irradiation device 64 from the reference mark M. To do. The reference mark is formed so that the stepped portion formed by the outer peripheral surface 103b of the head 103a of the mark member 103 and the bottom surface 102a of the bottomed hole 102 is blocked by the light shielding wall 101 from the first light irradiation device 64. It functions as a stepped step portion 104 formed on the periphery of M.

  That is, the light from the first light irradiation device 64 is almost blocked by the light shielding wall 101 and the light from the second light irradiation device 65 is mainly irradiated on the bottom surface 102 a of the bottomed hole 102 of the reference member 100. On the other hand, each light from the first and second light irradiation devices 64 and 65 is irradiated to one end surfaces of the reference mark M and the reference member 100.

  Thus, the peripheral portion of the reference mark M on the bottom surface 102 a of the bottomed hole 102 is mainly irradiated with light from the second light irradiation device 65, and the first end of the reference mark M and the reference member 80 is exposed to the first surface. Since each light from the second light irradiation devices 64 and 65 is irradiated, the luminance of the peripheral portion of the reference mark M on the bottom surface 92a of the bottomed hole 92 is smaller than the luminance of one end surface of the reference member 80. In other words, since the peripheral portion of the reference mark M becomes an outline and the reference mark M can be recognized more clearly, the position of the image-recognized component can be obtained with high accuracy.

  According to the above-described embodiment, the reference members 80 and 90 include the light shielding walls 81 and 91 that block the light from the first light irradiation device 64 with respect to the reference mark M, so that the reference mark M is irradiated. Of the light, the light from the first light irradiation device 64 that is easily affected by the component P collected by the sampling device 41 is blocked by the light shielding walls 81 and 91, and is not easily affected by the component P. The light from 65 is mainly irradiated. Accordingly, the luminance of the reference mark M can be maintained at a substantially constant value regardless of the size of the component P collected by the sampling device 41, and the reference mark M can be stably imaged. Therefore, the position of the component P that has been image-recognized can be obtained with high accuracy, and the mounting accuracy of the component P on the board B can be increased.

  Further, since the reference member 80 further includes a stepped step portion 84 formed at the periphery of the reference mark M so that the light from the first light irradiation device 64 is blocked by the light shielding wall 81, the reference mark M is provided. Of the light irradiated to the stepped portion 84 at the periphery of the light, the light from the first light irradiation device 64 that is easily affected by the component P collected by the sampling device 41 is blocked by the light shielding wall 84, and the influence of the component P The light from the second light irradiation device 65 that is difficult to receive is mainly irradiated. As a result, the reference mark M is bordered by contours having different luminances, so that the reference mark M can be recognized with high accuracy. Therefore, the position of the component P that has been image-recognized can be determined with higher accuracy, and the mounting accuracy of the component P on the board B can be further increased.

  Further, since the reference mark M is formed in the bottomed holes 82, 92, 102 drilled upward with respect to the reference members 80, 90, 100, the reference members 80, 90, 100 have bottomed holes. By drilling 82, 92, 102, the reference mark M and the light shielding walls 81, 101 can be formed, and the reference members 80, 90, 100 can be manufactured at low cost.

  In the above-described embodiment, the component mounting apparatus 10 including the feeder-type component supply apparatus 20 has been described. However, the present invention can also be applied to an apparatus including the tray-type component supply apparatus 20. The substrate transfer device 30 and the component transfer device 40 are not limited to those in the embodiment.

  In addition to the Cartesian coordinate robot shown in FIG. 1, a cylindrical coordinate robot or an indirect robot can be used as the moving device 42, and the suction nozzle 55 is placed between the component supply position P1 and the component mounting position. Any form can be used as long as it can move. Moreover, although the component transfer apparatus 40 demonstrated the case where it applied to the component mounting apparatus 10, if it is an apparatus which needs to extract | collect and move the components P, it is applicable.

  DESCRIPTION OF SYMBOLS 10 ... Component mounting apparatus, 20 ... Component supply apparatus, 30 ... Board | substrate conveyance apparatus, 40 ... Component transfer apparatus, 47 ... Component mounting head, 54 ... Suction head, 55 ... Suction nozzle, 61 ... Camera for component recognition, 64 ... 1st light irradiation apparatus, 65 ... 2nd light irradiation apparatus, 66 ... 1st light source, 67 ... 2nd light source, 70 ... control apparatus, 80, 90, 100 ... reference | standard member, 81, 101 ... light shielding wall, 82, 92 , 102 ... Bottomed holes, 83, 93, 103 ... Mark members, 84, 104 ... Stepped portions, M ... Reference mark, B ... Substrate, P ... Parts.

Claims (3)

A collecting device capable of collecting parts;
A moving device capable of moving the component collected by the collecting device onto a substrate on which the component is mounted;
An imaging device capable of imaging the component collected by the sampling device from below;
A reference member provided with a reference mark as a reference when imaging the component with the imaging device and processing the image of the component at the same time;
A first light irradiation device capable of irradiating the component and the reference member from below with light inclined at a predetermined angle with respect to the optical axis of the imaging device;
A second light irradiation device capable of irradiating the component and the reference member with light parallel to the optical axis from below;
The component transfer device, wherein the reference member includes a light shielding wall that blocks light from the first light irradiation device with respect to the reference mark.   The component transfer device according to claim 1, wherein the reference member further includes a stepped step portion formed on a periphery of the reference mark so that light from the first light irradiation device is blocked by the light shielding wall.   The component transfer apparatus according to claim 1, wherein the reference mark is formed in a bottomed hole formed in an upward direction with respect to the reference member.

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