JP2014100848A - Scribing wheel and manufacturing method thereof - Google Patents

Scribing wheel and manufacturing method thereof Download PDF

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Publication number
JP2014100848A
JP2014100848A JP2012254013A JP2012254013A JP2014100848A JP 2014100848 A JP2014100848 A JP 2014100848A JP 2012254013 A JP2012254013 A JP 2012254013A JP 2012254013 A JP2012254013 A JP 2012254013A JP 2014100848 A JP2014100848 A JP 2014100848A
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Prior art keywords
scribing wheel
diamond film
manufacturing
ridge line
cutting edge
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JP6044295B2 (en
Inventor
Toshio Fukunishi
利夫 福西
Mitsuru Kitaichi
充 北市
Naoko Tomei
直子 留井
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2012254013A priority Critical patent/JP6044295B2/en
Priority to TW102133765A priority patent/TWI602667B/en
Priority to KR1020130139645A priority patent/KR101779056B1/en
Priority to CN201310583178.9A priority patent/CN103833211B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape

Abstract

PROBLEM TO BE SOLVED: To make polishing and recessing of a scribing wheel easy in the scribing wheel which is formed a diamond film on the surface.SOLUTION: A V-shape edge is formed to a circumference part of a disciform scribing wheel substrate, and a diamond film doped electric conductive impurities is formed to the edge by CVD method. Electric source is supplied between the scribing wheel formed the diamond film and a grinding stone. An isotropic point which is a standard of polishing can be detected in this way. An edge line part of the diamond film is polished to be parallel to the edge line, and is got fixed so that a tip becomes sharp. Because the diamond film has electric conductive, polishing and recessing is easy.

Description

本発明は脆性材料基板に圧接・転動させてスクライブするためのスクライビングホイール及びその製造方法に関するものである。   The present invention relates to a scribing wheel for scribing by pressing and rolling on a brittle material substrate and a method for manufacturing the scribing wheel.

従来のスクライビングホイールは、特許文献１等に示されるように、超硬合金製又は多結晶焼結ダイヤモンド（以下、ＰＣＤという）製の円板を基材としている。ＰＣＤはダイヤモンド粒子をコバルトなどと共に焼結させたものである。スクライビングホイールは基材となる円板の両側より円周のエッジを互いに斜めに削り込み、円周面にV字形の刃先を形成したものである。このようにして形成されたスクライビングホイールをスクライブ装置のスクライブヘッド等に回転自在に軸着して脆性材料基板に所定の荷重で押し付け、脆性材料基板の面に沿って移動させることで、転動させながらスクライブすることができる。   A conventional scribing wheel uses, as a base material, a disc made of cemented carbide or polycrystalline sintered diamond (hereinafter referred to as PCD), as shown in Patent Document 1 and the like. PCD is obtained by sintering diamond particles together with cobalt or the like. The scribing wheel is formed by cutting the circumferential edges obliquely from both sides of a disk as a base material to form a V-shaped cutting edge on the circumferential surface. The scribing wheel formed in this way is rotatably attached to a scribing head of a scribing device, pressed against the brittle material substrate with a predetermined load, and moved along the surface of the brittle material substrate to roll it. You can scribe while.

特許文献２にはガラス切断用刃の寿命を長くするために、V字形状の刃先表面をダイヤモンドで被膜したガラス切断用刃が開示されている。このガラス切断用刃は、ダイヤモンドと相性の良いセラミックで形成された刃先表面にダイヤモンド膜を被覆し、このダイヤモンド膜を表面研磨処理して整形される。このようなガラス切断用刃を用いることにより、刃の寿命が長く、また切断面が平滑となるように高硬度ガラスを切断できると示されている。   Patent Document 2 discloses a glass cutting blade having a V-shaped cutting edge surface coated with diamond in order to extend the life of the glass cutting blade. This blade for cutting a glass is shaped by coating a diamond film on the surface of a cutting edge formed of a ceramic that is compatible with diamond and then polishing the diamond film. It has been shown that by using such a glass cutting blade, the high-hardness glass can be cut such that the blade has a long life and the cut surface is smooth.

国際公開ＷＯ２００３／５１７８４号公報International Publication WO2003 / 51784 特開平０４−２２４１２８号公報Japanese Patent Laid-Open No. 04-224128

多結晶焼結ダイヤモンド（ＰＣＤ）で形成された従来のスクライビングホイールは、ダイヤモンド粒子と結合材で構成されるため、特にセラミック等の硬度が高い脆性材料基板をスクライブすると磨耗が急激に進み、寿命が短いという欠点があった。又、近年ガラスの薄型化、大型化により、脆性材料基板をスクライブし、ブレイクしたときの脆性材料基板の端面強度が要求されるようになってきた。しかし、ＰＣＤで形成された従来のスクライビングホイールでは素材に含まれるダイヤモンド粒子の大きさに応じて刃先及び稜線の粗さが粗く、研磨によっても一定以下の粗さにすることが難しいので、脆性材料基板をスクライブし、ブレイクしたときの脆性材料基板の端面強度が低下するという欠点があった。   A conventional scribing wheel made of polycrystalline sintered diamond (PCD) is composed of diamond particles and a binder, so that when a brittle material substrate having a high hardness, such as ceramic, is scribed, the wear progresses rapidly and the life is shortened. There was the shortcoming of being short. In recent years, as the glass has been made thinner and larger, the end face strength of the brittle material substrate has been required when the brittle material substrate is scribed and broken. However, the conventional scribing wheel made of PCD has a rough cutting edge and ridge line depending on the size of diamond particles contained in the material, and it is difficult to make the roughness below a certain level by polishing. There was a drawback that the end face strength of the brittle material substrate was lowered when the substrate was scribed and broken.

特許文献２に記載のガラス切断用刃はダイヤモンド被膜を研磨するようにしているが、ダイヤモンド膜に導電性がないため、通電によって研磨時の基準位置となる零点検出をすることができない。このためダイヤモンド被膜の研磨時に作業者によって研磨開始点のばらつきが大きい。特にダイヤモンド被膜の厚さが薄く、数μｍ〜１０μｍの研磨作業をする場合にその影響が大きく、加工時の作業性が悪くなるという問題点があった。   Although the glass cutting blade described in Patent Document 2 polishes the diamond film, the diamond film does not have conductivity, so that it cannot detect the zero point as a reference position during polishing by energization. For this reason, the polishing start point varies greatly depending on the operator when the diamond film is polished. In particular, when the diamond coating is thin and a polishing operation of several μm to 10 μm is performed, the influence is large, and there is a problem that workability at the time of processing deteriorates.

本発明はこのような問題点に鑑みてなされたものであって、ダイヤモンド膜の研磨や溝加工を容易に行えるようにしたスクライビングホイール及びその製造方法を提供することを目的とする。   The present invention has been made in view of such problems, and an object of the present invention is to provide a scribing wheel and a method for manufacturing the scribing wheel that can easily polish and groove a diamond film.

この課題を解決するために、本発明のスクライビングホイールは、円周部に沿って稜線が形成され、前記稜線と前記稜線の両側の傾斜面からなる刃先を有するスクライビングホイールであって、基材と基材の刃先表面に形成されたダイヤモンド膜とを有し、前記稜線はダイヤモンド膜で形成され、前記ダイヤモンド膜は導電性を有するものである。   In order to solve this problem, the scribing wheel of the present invention is a scribing wheel in which a ridge line is formed along a circumferential portion, and has a cutting edge composed of the ridge line and inclined surfaces on both sides of the ridge line, And a diamond film formed on the surface of the cutting edge of the substrate, the ridge line is formed of a diamond film, and the diamond film has conductivity.

ここで前記ダイヤモンド膜の稜線部分に所定間隔で形成された溝を有し、その間を突起とするようにしてもよい。   Here, grooves formed at a predetermined interval may be formed in the ridge line portion of the diamond film, and a gap between the grooves may be formed as a protrusion.

この課題を解決するために、本発明のスクライビングホイールの製造方法は、円板の円周部に沿って稜線と前記稜線の両側の傾斜面からなる刃先を有するスクライビングホイールの製造方法であって、円板の中心に貫通孔を設け、その中心を回転軸とし、円周部に沿って刃先部分を形成してスクライビングホイール基材を構成し、前記スクライビングホイール基材の刃先部分に化学気相成長法によって不純物をドープしながらダイヤモンド膜を形成するものである。   In order to solve this problem, the manufacturing method of the scribing wheel of the present invention is a manufacturing method of a scribing wheel having a ridge line and a cutting edge formed of inclined surfaces on both sides of the ridge line along the circumferential portion of the disk, A through hole is provided in the center of the disc, the center of which is the axis of rotation, and a cutting edge portion is formed along the circumferential portion to form a scribing wheel base material. Chemical vapor deposition is performed on the cutting edge portion of the scribing wheel base material. A diamond film is formed while doping impurities by a method.

ここで前記不純物はホウ素であることが好ましい。   Here, the impurity is preferably boron.

ここで前記ダイヤモンド膜を形成したスクライビングホイールと砥石との間に電源を供給しつつ前記ダイヤモンド膜を研磨するようにしてもよい。   Here, the diamond film may be polished while supplying power between a scribing wheel on which the diamond film is formed and a grindstone.

ここで前記ダイヤモンド膜に放電加工を行い、稜線と斜面からなる刃先を更に形成するようにしてもよい。   Here, the diamond film may be subjected to electric discharge machining to further form a cutting edge composed of a ridge line and a slope.

ここで前記ダイヤモンド膜の稜線部分に所定間隔で切り欠いた溝を形成し、その間を突起とするようにしてもよい。   Here, grooves notched at a predetermined interval may be formed in the ridge line portion of the diamond film, and a gap between the grooves may be formed as a protrusion.

ここで前記ダイヤモンド膜と砥石との間に電源を供給しつつ前記溝を切り欠くようにしてもよい。   Here, the groove may be cut out while supplying power between the diamond film and the grindstone.

ここで前記ダイヤモンド膜に放電加工によって前記溝を形成するようにしてもよい。   Here, the grooves may be formed in the diamond film by electric discharge machining.

このような特徴を有する本発明によれば、スクライビングホイールに導電性を有するダイヤモンド膜を形成し、刃先のダイヤモンド膜を研磨する。こうすることによって研磨の際に導電性であることを利用して研削の基準となる零点検出を行ったり、通電、加熱を加えた摺動研磨を行ったり、放電加工を行うことができ、製造を容易にすることができる。又請求項２，４の発明では、スクライビングホイールの刃先が導電性であることを利用して容易に溝加工を行うことができ、表面にダイヤモンド層を有する高浸透型のスクライビングホイールを実現することができる。   According to the present invention having such characteristics, a diamond film having conductivity is formed on the scribing wheel, and the diamond film at the cutting edge is polished. This makes it possible to detect the zero point, which is the basis for grinding by utilizing the conductivity during polishing, to perform sliding polishing with energization and heating, and to perform electrical discharge machining. Can be made easier. According to the inventions of claims 2 and 4, it is possible to easily perform grooving by utilizing the conductivity of the cutting edge of the scribing wheel, and to realize a high penetration type scribing wheel having a diamond layer on the surface. Can do.

図１Ａは本発明の第１の実施の形態によるスクライビングホイールの正面図である。FIG. 1A is a front view of a scribing wheel according to a first embodiment of the present invention. 図１Ｂは第１の実施の形態によるスクライビングホイールの側面図である。FIG. 1B is a side view of the scribing wheel according to the first embodiment. 図２Ａは第１の実施の形態による刃先の研磨前の稜線部分の拡大断面図である。FIG. 2A is an enlarged cross-sectional view of a ridge line portion before polishing of the blade edge according to the first embodiment. 図２Ｂは第１の実施の形態による研磨後の稜線部分の拡大断面図である。FIG. 2B is an enlarged cross-sectional view of a ridge line portion after polishing according to the first embodiment. 図３Ａは本発明の第３の実施の形態によるスクライビングホイールの正面図である。FIG. 3A is a front view of a scribing wheel according to a third embodiment of the present invention. 図３Ｂは第３の実施の形態による研磨後の稜線部分の拡大断面図である。FIG. 3B is an enlarged cross-sectional view of a ridge line portion after polishing according to the third embodiment. 図３Ｃは図３Ａに示す円形部分の拡大図である。FIG. 3C is an enlarged view of the circular portion shown in FIG. 3A. 図４は第３の実施の形態による溝加工の状態を示す図である。FIG. 4 is a diagram showing a state of groove processing according to the third embodiment.

図１Ａは本発明の実施の形態によるスクライビングホイールの正面図、図１Ｂはその側面図である。スクライビングホイールを製造する際には、例えば、超硬合金等のスクライビングホイール基材となる円板１１の中央にまず図１Ａに示すように軸穴となる貫通孔１２を形成する。次にこの貫通孔１２に図示しないモータ等のシャフトを連通して貫通孔１２の中心軸を回転軸１２ａとして回転させつつ、円板１１の全円周を円板の表裏両側より回転軸１２ａに対して斜めに研磨して図１Ｂに示すように稜線と稜線の両側の傾斜面を垂直断面Ｖ字形に形成する。こうして形成したＶ字形の斜面を研磨面１３とする。   FIG. 1A is a front view of a scribing wheel according to an embodiment of the present invention, and FIG. 1B is a side view thereof. When manufacturing a scribing wheel, for example, a through hole 12 serving as a shaft hole is first formed in the center of a disc 11 serving as a scribing wheel base material such as cemented carbide, as shown in FIG. 1A. Next, a shaft such as a motor (not shown) is connected to the through hole 12 to rotate the central axis of the through hole 12 as the rotation shaft 12a, and the entire circumference of the disk 11 is connected to the rotation shaft 12a from both sides of the disk. On the other hand, as shown in FIG. 1B, the ridgeline and inclined surfaces on both sides of the ridgeline are formed in a V-shaped vertical section by polishing obliquely. The V-shaped slope formed in this way is defined as a polishing surface 13.

次にダイヤモンド薄膜の形成について図２Ａの刃先の稜線部分の拡大断面図を用いて説明する。まずダイヤモンド膜の付着が容易になるようにＶ字形の研磨面１３をあらかじめ粗面にしておく。次にサブミクロン以下の粒径の核となるダイヤモンドを斜面部分に形成した後、化学気相成長反応によってダイヤモンド薄膜を成長させる。このようにしてスクライビングホイールのＶ字形の斜面部分に化学気相成長法（ＣＶＤ法）によって、膜厚が例えば２０〜３０μｍのダイヤモンド膜１４を形成する。   Next, formation of the diamond thin film will be described with reference to an enlarged cross-sectional view of the ridge line portion of the blade edge in FIG. 2A. First, the V-shaped polished surface 13 is roughened in advance so that the diamond film can be easily attached. Next, after forming diamond as a core having a particle size of submicron or less on the slope portion, a diamond thin film is grown by chemical vapor deposition. Thus, the diamond film 14 having a film thickness of, for example, 20 to 30 μm is formed on the V-shaped slope portion of the scribing wheel by chemical vapor deposition (CVD).

本実施の形態では、化学気相成長反応によるダイヤモンド膜の成長の際に、ボロン等の不純物をドープする。こうすればダイヤモンド膜１４を導電性を有する膜とすることができる。ダイヤモンド膜１４の導電率はドープ量に依存するが、導電率を大きくすることにより放電加工時の放電が安定し易くなり、放電加工条件値を低くしたり、放電加工の効率を高くすることができる。   In the present embodiment, impurities such as boron are doped when a diamond film is grown by chemical vapor deposition. In this way, the diamond film 14 can be made a conductive film. The electrical conductivity of the diamond film 14 depends on the doping amount, but increasing the electrical conductivity makes it easier to stabilize the electric discharge during electric discharge machining, and can lower the electric discharge machining condition value or increase the electric discharge machining efficiency. it can.

この後、少なくとも先端部分を、後述のように先端が鋭くなるように研磨する。図２Ｂはこの研磨した後の状態を示す部分拡大断面図である。このように研磨の際には元のダイヤモンド膜１４よりも例えば５°〜１０°鈍角になるようにしてもよい。そして研磨した後の稜線から成る円が含まれる面を回転軸１２ａに対し垂直となるようにする。ここで研磨する領域は傾斜面の稜線を中央に含む帯状の部分のみであってもよい。図２Ｂの幅ｗの領域はこの先端部分、すなわち稜線の両側のダイヤモンド膜の研磨領域を示しており、例えば幅ｗは１０〜２０μｍとする。   Thereafter, at least the tip portion is polished so that the tip is sharp as will be described later. FIG. 2B is a partially enlarged sectional view showing the state after the polishing. In this way, the polishing may be performed at an obtuse angle of 5 ° to 10 °, for example, as compared with the original diamond film 14. Then, the surface including the circle composed of the ridge line after polishing is set to be perpendicular to the rotation axis 12a. Here, the region to be polished may be only a belt-like portion including the ridge line of the inclined surface in the center. The region of width w in FIG. 2B shows this tip portion, that is, the polishing region of the diamond film on both sides of the ridgeline. For example, the width w is 10 to 20 μm.

研磨時には、砥石を回転させ、ダイヤモンド膜を有するスクライビングホイールの刃先を研磨する。このときスクライビングホイールと砥石の間に電源を接続する。そして砥石を一定速度で回転させつつ、スクライビングホイール１０もその回転軸１２ａに沿って回転させながら、砥石への距離を近づける。ダイヤモンド膜１４とストレート砥石２０とが接触したときに通電するため、通電によりスクライビングホイール１０と砥石２０とが接触したことを検出することができる。この接触時を研磨開始点となる零点とし、そこからダイヤモンド膜を適切な厚さまで研磨する。また、通電を行うことによって、接触時の摩擦抵抗による発熱に加えて、ダイヤモンド膜が適度な電気抵抗を有することによってジュール熱が生じてダイヤモンド膜１４が加熱される。このためダイヤモンド膜１４の研磨をより高能率に行うことも可能になる。一方の面の研磨を終えると、他方の面についても同様に研磨する。このようにダイヤモンド膜が通電性を有することを利用して砥石と加工対象となるスクライビングホイールに電流を流し、研磨中に通電することによって研磨作業を効率的に行うことができる。   At the time of polishing, the grindstone is rotated to polish the cutting edge of the scribing wheel having the diamond film. At this time, a power source is connected between the scribing wheel and the grindstone. Then, while rotating the grindstone at a constant speed, the scribing wheel 10 is also rotated along the rotation shaft 12a, and the distance to the grindstone is reduced. Since the current is supplied when the diamond film 14 and the straight grindstone 20 come into contact with each other, it is possible to detect that the scribing wheel 10 and the grindstone 20 are brought into contact with each other by energization. This contact time is set as a zero point as a polishing start point, and the diamond film is polished to an appropriate thickness therefrom. Further, when energized, in addition to heat generation due to frictional resistance at the time of contact, the diamond film has an appropriate electrical resistance, so that Joule heat is generated and the diamond film 14 is heated. Therefore, the diamond film 14 can be polished more efficiently. When the polishing of one surface is finished, the other surface is similarly polished. Thus, the polishing operation can be efficiently performed by applying an electric current to the grindstone and the scribing wheel to be processed by applying the electric current to the grindstone and the object to be processed by utilizing the electric conductivity of the diamond film.

次に本発明の第２の実施の形態について説明する。この実施の形態は第１の実施の形態とは刃先の傾斜面の加工方法が異なっている。ダイヤモンド膜１４が導電性を有することから機械研磨だけでなく放電加工によって傾斜面を加工し、鋭利な稜線を形成することもできる。放電加工では通電したワイヤをダイヤモンド膜に沿って移動させることによって所望の形状に加工するワイヤ放電加工を用いてもよい。又これに代えて型彫り放電加工を用いてもよい。型彫り放電加工では、加工される凸状の刃先の反転形状を有するメス型を備えた治具電極を用いて回転体に押し付けることによって刃先を加工することができる。このようなワイヤ放電加工や型彫り放電加工を行った後、放電加工により生じる変質層を除去するため砥石による仕上げ研磨をさらにを行うことが好ましい。   Next, a second embodiment of the present invention will be described. This embodiment is different from the first embodiment in the method of processing the inclined surface of the blade edge. Since the diamond film 14 has conductivity, the inclined surface can be processed not only by mechanical polishing but also by electric discharge machining to form a sharp ridgeline. In electric discharge machining, wire electric discharge machining may be used in which an energized wire is moved along the diamond film to be processed into a desired shape. Alternatively, die-sinking electric discharge machining may be used. In die-sinking electric discharge machining, the cutting edge can be machined by pressing it against a rotating body using a jig electrode provided with a female die having an inverted shape of the convex cutting edge to be machined. After performing such wire electric discharge machining or die-sinking electric discharge machining, it is preferable to further perform finish polishing with a grindstone in order to remove the altered layer produced by electric discharge machining.

このように研磨あるいは放電加工することによってダイヤモンド膜のスクライブに寄与する刃先部分の稜線の粗さを細かくすることができる。従ってこのスクライビングホイールを用いて脆性材料基板、例えばセラミックス基板をスクライブし、分断すると、脆性材料基板の切断面の端面精度が向上し、これに伴い端面強度も向上させることができるという効果が得られる。   By grinding or electric discharge machining in this way, the roughness of the ridgeline of the cutting edge portion contributing to the scribe of the diamond film can be made fine. Therefore, by scribing and dividing a brittle material substrate, for example, a ceramic substrate, using this scribing wheel, the accuracy of the end face of the cut surface of the brittle material substrate is improved, and the end face strength can be improved accordingly. .

次に本発明の第３の実施の形態について説明する。日本国特許第３０７４１４３号にはスクライビングホイールの円周面に所定間隔を隔てて多数の溝を形成し、その間を突起として高浸透型としたスクライビングホイールが提案されている。本発明はこのようなスクライビングホイールにも適用することができる。図３Ａはこの実施の形態のスクライビングホイールの正面図、図３Ｂは先の稜線部分の拡大断面図、図３Ｃは図３Ａに一点鎖線で示した円形部分の拡大図である。スクライビングホイールを製造する際には、超硬合金、又はセラミック製等のスクライビングホイール基材となる円板３１の中央にまず図３Ａに示すように軸穴となる貫通孔３２を形成する。次にこの貫通孔３２にモータ等の回転軸を連通して回転させつつ、円板３１の全円周を両側より研磨してＶ字形に形成する。こうして形成したＶ字形の斜面を研磨面３３とする。この場合も第１の実施の形態と同様にスクライビングホイールの刃先部分にＣＶＤ法によってダイヤモンド膜３４をコーティングし、前述した方法で研磨する。   Next, a third embodiment of the present invention will be described. Japanese Patent No. 3074143 proposes a scribing wheel in which a large number of grooves are formed at predetermined intervals on the circumferential surface of the scribing wheel, and a high penetration type is formed with protrusions therebetween. The present invention can also be applied to such a scribing wheel. FIG. 3A is a front view of the scribing wheel of this embodiment, FIG. 3B is an enlarged cross-sectional view of the previous ridge line portion, and FIG. 3C is an enlarged view of the circular portion indicated by the one-dot chain line in FIG. When manufacturing a scribing wheel, first, a through hole 32 serving as an axial hole is formed in the center of a disc 31 serving as a scribing wheel base material made of cemented carbide or ceramic as shown in FIG. 3A. Next, the entire circumference of the disk 31 is polished from both sides to form a V-shape while rotating through a through shaft 32 such as a motor. The V-shaped slope formed in this way is defined as a polishing surface 33. Also in this case, as in the first embodiment, the diamond film 34 is coated on the cutting edge portion of the scribing wheel by the CVD method and polished by the method described above.

次にダイヤモンド膜３４を２０μｍとすると、図３Ｃに示すようにダイヤモンド膜３４の厚みの範囲内で溝３５を形成する。図４は溝３５を形成する状態を示す図である。図４に示すように、グラインダーモータ４１の軸に円板状の砥石４２を取付けて回転させる。この砥石の円周面はＶ字状に形成されており、この砥石によってスクライビングホイール１０の円周部に溝３５を形成する。この場合には図４に示すように電源２５よりスクライビングホイール１０と円板状の砥石４２との間に通電し、零点を検出しておくことで、溝の深さを確実に制御することができる。さらに、通電時の加熱によって研削加工を促進させることができる。こうして１つの溝を形成した後、スクライビングホイールを所定角度回転させて固定し、更にグラインダーモータ４１を回転させて砥石４２を近接させて溝を形成する。こうしてスクライビングホイールの全周に一定のピッチで溝を形成する。こうして高浸透型のスクライビングホイールを製造する場合に、溝の深さを均一にすることができる。スクライビングホイールの溝の深さは例えば脆性材料基板の厚さに応じて０．５〜１０μｍ程度である。   Next, when the diamond film 34 is 20 μm, the groove 35 is formed within the thickness range of the diamond film 34 as shown in FIG. 3C. FIG. 4 is a diagram showing a state in which the groove 35 is formed. As shown in FIG. 4, a disc-shaped grindstone 42 is attached to the shaft of the grinder motor 41 and rotated. The circumferential surface of this grindstone is formed in a V shape, and grooves 35 are formed in the circumferential portion of the scribing wheel 10 by this grindstone. In this case, as shown in FIG. 4, by energizing between the scribing wheel 10 and the disc-shaped grindstone 42 from the power source 25 and detecting the zero point, the depth of the groove can be reliably controlled. it can. Furthermore, grinding can be promoted by heating during energization. After forming one groove in this way, the scribing wheel is rotated by a predetermined angle and fixed, and the grinder motor 41 is further rotated to bring the grindstone 42 closer to form the groove. In this way, grooves are formed at a constant pitch all around the scribing wheel. Thus, when manufacturing a highly penetrating scribing wheel, the depth of the groove can be made uniform. The depth of the groove of the scribing wheel is, for example, about 0.5 to 10 μm depending on the thickness of the brittle material substrate.

研磨に代えて、ダイヤモンド膜を放電加工することにより溝を形成するようにしてもよく、またはレーザ加工により溝を形成するようにしてもよい。   Instead of polishing, the grooves may be formed by electric discharge machining of the diamond film, or the grooves may be formed by laser processing.

又これに代えてあらかじめスクライビングホイール基材のＶ字形の刃先部に溝を形成しておき、このスクライビングホイール基材にＣＶＤ法でダイヤモンド膜をコーティングし研磨することでスクライビングホイールを構成するようにしてもよい。   Instead of this, a groove is formed in advance in the V-shaped cutting edge portion of the scribing wheel base material, and the scribing wheel is configured by coating and polishing a diamond film on the scribing wheel base material by the CVD method. Also good.

本発明のスクライビングホイールは耐摩耗性、耐剥離性が高く、端面強度の高い脆性材料基板を切り出せるスクライビングホイールを提供することができ、スクライブ装置に好適に用いることができる。   The scribing wheel of the present invention can provide a scribing wheel that can cut a brittle material substrate having high wear resistance and peeling resistance and high end face strength, and can be suitably used for a scribing apparatus.

１０，３０ スクライビングホイール
１１，３１ 円板
１２，３２ 貫通孔
１３，３３ 研磨面
１４，３４ ダイヤモンド膜
１６ 円周面
２５ 電源
３５ 溝
４１ グラインダーモータ
４２ 砥石 DESCRIPTION OF SYMBOLS 10,30 Scribing wheel 11,31 Disk 12,32 Through-hole 13,33 Polishing surface 14,34 Diamond film 16 Circumferential surface 25 Power supply 35 Groove 41 Grinder motor 42 Grinding wheel

Claims (9)

円周部に沿って稜線が形成され、前記稜線と前記稜線の両側の傾斜面からなる刃先を有するスクライビングホイールであって、
基材と基材の刃先表面に形成されたダイヤモンド膜とを有し、
前記稜線はダイヤモンド膜で形成され、
前記ダイヤモンド膜は導電性を有するスクライビングホイール。 A scribing wheel having a cutting edge formed with a ridge line along a circumferential portion, the ridge line and an inclined surface on both sides of the ridge line,
It has a base material and a diamond film formed on the surface of the blade edge of the base material,
The ridge line is formed of a diamond film,
The diamond film is a conductive scribing wheel. 前記ダイヤモンド膜の稜線部分に所定間隔で形成された溝を有し、その間を突起とした請求項１記載のスクライビングホイール。   The scribing wheel according to claim 1, wherein grooves are formed at predetermined intervals in a ridge line portion of the diamond film, and protrusions are formed between the grooves. 円板の円周部に沿って稜線と前記稜線の両側の傾斜面からなる刃先を有するスクライビングホイールの製造方法であって、
円板の中心に貫通孔を設け、その中心を回転軸とし、円周部に沿って刃先部分を形成してスクライビングホイール基材を構成し、
前記スクライビングホイール基材の刃先部分に化学気相成長法によって不純物をドープしながらダイヤモンド膜を形成するスクライビングホイールの製造方法。 A method of manufacturing a scribing wheel having a cutting edge composed of a ridge line and inclined surfaces on both sides of the ridge line along a circumferential portion of a disk,
A through hole is provided in the center of the disc, the center of which is the rotation axis, and a cutting edge portion is formed along the circumferential portion to constitute a scribing wheel base material.
A method for manufacturing a scribing wheel, wherein a diamond film is formed on the cutting edge portion of the scribing wheel base material while doping impurities by chemical vapor deposition. 前記不純物がホウ素である請求項３記載のスクライビングホイールの製造方法。   The scribing wheel manufacturing method according to claim 3, wherein the impurity is boron. 前記ダイヤモンド膜を形成したスクライビングホイールと砥石との間に電源を供給しつつ前記ダイヤモンド膜を研磨する請求項３記載のスクライビングホイールの製造方法。   The manufacturing method of the scribing wheel of Claim 3 which grind | polishes the said diamond film, supplying power between the scribing wheel in which the said diamond film was formed, and a grindstone. 前記ダイヤモンド膜に放電加工を行い、稜線と斜面からなる刃先を更に形成する請求項３記載のスクライビングホイールの製造方法。   The method for manufacturing a scribing wheel according to claim 3, wherein the diamond film is subjected to electric discharge machining to further form a cutting edge composed of a ridgeline and a slope. 前記ダイヤモンド膜の稜線部分に所定間隔で切り欠いた溝を形成し、その間を突起とした請求項３記載のスクライビングホイールの製造方法。   The manufacturing method of the scribing wheel of Claim 3 which formed the groove | channel notched at the predetermined interval in the ridgeline part of the said diamond film, and made the space | interval between it. 前記ダイヤモンド膜と砥石との間に電源を供給しつつ前記溝を切り欠く請求項７記載のスクライビングホイールの製造方法。   The manufacturing method of the scribing wheel of Claim 7 which notches the said groove | channel while supplying power between the said diamond film and a grindstone. 前記ダイヤモンド膜に放電加工によって前記溝を形成する請求項７記載のスクライビングホイールの製造方法。   The method for manufacturing a scribing wheel according to claim 7, wherein the groove is formed in the diamond film by electric discharge machining.
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