JP2014096522A - Teaching method and teaching system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a teaching method and a teaching system capable of reducing a work time of teaching after collet exchange and improving productivity.SOLUTION: The teaching method is provided for a bonding collet formed from an inverted pyramidal collet including a tapered part for guiding an edge of a chip in the case of adsorption, in a chip conveying step of picking up the chip at a pickup position by means of a pick-up collet, supplying the chip being adsorbed by the pick-up collet to an intermediate stage; picking up the chip being supplied onto the intermediate stage by means of the bonding collet, and supplying the chip being adsorbed by the bonding collet to a bonding position.

Description

  The present invention relates to a teaching method and a teaching system.

  In the manufacture of semiconductor devices, a chip bonding technique in which a wafer on which a large number of elements are formed is diced and separated into individual semiconductor chips, which are bonded one by one to a predetermined position such as a lead frame. Is adopted.

  Conventionally, as described in Patent Document 1 and the like, a chip is picked up by a pip-up collet at a pickup position, and the chip adsorbed by the pip-up collet is supplied to the intermediate stage. There is a type in which the chip supplied above is picked up by a bonding collet and the chip adsorbed by the bonding collet is supplied to the bonding position.

  As shown in FIG. 9, the bonding apparatus described in Patent Document 1 includes a wafer holding table 1 as a first holding unit that holds a semiconductor wafer, and a sheet holding table 2 as a second holding unit that holds a sheet. And an intermediate stage 3 disposed between the wafer holding table 1 and the sheet holding table 2.

  Then, an adsorber (adsorption collet) 5 for adsorbing and supplying the chips of the wafer holding table 1 to the glass mounting table 3, and an adsorber for adsorbing and supplying the chips of the intermediate stage 3 to the sheet holding table 2. (Adsorption collet) 6.

The collets 5 and 6 are attached to the arms 7 and 8 that reciprocate along the Y-axis direction, and the main body portions 7a and 8a of the arms 7 and 8 reciprocate on the base 11 along the X-axis direction. The block bodies 9, 10 are attached so as to be capable of reciprocating along the Z-axis direction.

  That is, the suction collet 5 becomes a pip-up collet, and the suction collet 6 becomes a bonding collet. Therefore, the suction collet 5 can move along the X, Y, and Z axes, and the chips of the wafer holding table 1 can be supplied to the intermediate stage 3. The bonding collet 6 can be moved to the X, Y, and Z axes. It can move along the Z-axis, and the chip on the intermediate stage 3 can be bonded at the bonding position of the sheet holder 2.

JP 2006-13073 A

  In such a bonding apparatus or the like, it is necessary to replace the collet due to a difference in chip size or deterioration. In particular, in the head on the bonding side, the bonding position is a heating atmosphere, so the collet replacement frequency is high. If the collet is replaced, there is a possibility that a positional deviation occurs, and if this positional deviation occurs, it is necessary to correct it.

  Next, a conventional general position correction method will be described. In this case, the collet is a positioning method when the collet for bonding is replaced as a pyramid collet having a tapered portion that guides the edge of the chip during suction.

  First, the chip is supplied to the intermediate stage with a pick-up collet. Then, the position of the chip on the intermediate stage is recognized by an observation camera or the like. This position recognition is stored as first data by a storage means or the like. Next, the chip on the intermediate stage is adsorbed by a bonding collet (replaced collet) and raised along the Z axis. In this case, the collet is operated manually. Further, since the pyramid collet is used, the chip can be adsorbed even if there is a slight misalignment.

  Next, the bonding collet is lowered by manual operation along the axial direction and stopped immediately before the intermediate stage. Thereafter, the suction force on the collet side is turned off, and the suction force on the intermediate stage is turned on. As a result, the chip is adsorbed to the intermediate stage. At this time, if the exchanged collet is misaligned, the chip is misaligned on the intermediate stage. Further, after the chip is returned on the interstage, the bonding collet is returned to the standby position.

  In this state, the chip position is recognized again on the intermediate stage. This position recognition is set as second data. Then, the second data is compared with the previous first data. That is, the difference between the second data and the first data is calculated (calculated), and the calculation result is reflected in each parameter of XYθ to correct the position of the bonding collet.

  In the alignment method (teaching work) as described above, manual operation is required. Therefore, it is necessary to switch the automatic operation to manual operation after replacing the collet. Moreover, the recognition result of the second data and the first data It was necessary to calculate the difference. That is, the teaching work time after the collet replacement is long, resulting in poor productivity.

  Therefore, in view of such a situation, the present invention aims to provide a teaching method and a teaching system that can reduce the teaching work time after collet replacement and are excellent in productivity.

  In the teaching method of the present invention, a chip is picked up by a pip-up collet at a pick-up position, a chip adsorbed by the pip-up collet is supplied to an intermediate stage, and the chip supplied on the intermediate stage Is picked up by a bonding collet made of a pyramid collet having a tapered portion that guides the edge of the chip at the time of suction, and the collet for bonding in the chip transporting process for supplying the chip sucked by the bonding collet to the bonding position In this method, after the chip adsorbed by the pip-up collet is supplied onto the intermediate stage, the collet returning step of returning the pip-up collet to a predetermined standby position and the pip-up collet were supplied. Chip intermediate A first position recognition process for recognizing the position on the surface, and the chip supplied on the intermediate stage is attracted by the bonding collet and raised along the Z-axis direction, and then again in the Z-axis direction. And then returning it onto the intermediate stage and then returning the bonding collet to a predetermined standby position, and a second step of recognizing the position of the chip returned in the chip return process on the intermediate stage. The position recognition process, the comparison process comparing the recognition result of the first position recognition process and the recognition result of the second position recognition process, and when the comparison of the comparison process exceeds a predetermined range, the position adjustment of the bonding process is performed. And a position adjusting step to be performed.

In the teaching method of the present invention, the chip can be supplied onto the intermediate stage in the collet returning step, and after the supply, the pip-up collet can be returned to a predetermined standby position. In the first position recognition step, the position of the chip supplied on the intermediate stage by the pickup collet can be recognized on the intermediate stage. In the auto tip return process,
After the chip supplied on the intermediate stage is adsorbed by the bonding collet and raised along the Z-axis direction, it can be lowered again along the Z-axis direction and returned to the intermediate stage. The bonding collet is returned to the predetermined standby position. In the second position recognition process, it is possible to perform position recognition on the intermediate stage of the chip returned to the intermediate stage in the auto chip returning process. In the comparison step, the recognition result of the first position recognition step and the recognition result of the second position recognition step can be compared. In the position adjustment process, the position of the bonding process can be adjusted.

  The teaching system of the present invention picks up a chip with a pip-up collet at the pick-up position, supplies the chip adsorbed by the pip-up collet to the intermediate stage, and the chip supplied on the intermediate stage Is picked up by a bonding collet made of a pyramid collet having a tapered portion that guides the edge of the chip at the time of suction, and the collet for bonding in the chip transporting process for supplying the chip sucked by the bonding collet to the bonding position In this system, the chip adsorbed by the pip-up collet is supplied to the intermediate stage, and then the pickup side control means for returning the pip-up collet to the predetermined standby position and the pip-up collet are supplied. The First position recognition means for recognizing the position of the wafer on the intermediate stage and the chip supplied on the intermediate stage are adsorbed by the collet for bonding and raised along the Z-axis direction, and then Z Lowering along the axial direction and returning it to the intermediate stage, then the bonding side control means for returning the bonding collet to the predetermined standby position, and the position of the chip returned in the chip returning process on the intermediate stage is recognized. The second position recognition means, the comparison means for comparing the recognition result of the first position recognition means and the recognition result of the second position recognition means, and when the comparison of the comparison means exceeds a predetermined range, A teaching system comprising position adjusting means for adjusting the position.

  According to the teaching system of the present invention, after the chip adsorbed by the pip-up collet is supplied onto the intermediate stage by the pickup side control means, the pip-up collet can be returned to a predetermined standby position. The first position recognition means can recognize the position of the chip supplied by the pip-up collet on the intermediate stage. The bonding side control means sucks the chip supplied on the intermediate stage with the bonding collet and raises it along the Z-axis direction, and then lowers it again along the Z-axis direction and puts it on the intermediate stage. Thereafter, the bonding collet can be returned to the predetermined standby position. The second position recognition means can recognize the position of the chip returned in the chip returning process on the intermediate stage. The comparison means can compare the recognition result of the first position recognition means with the recognition result of the second position recognition means. The position adjustment means can adjust the position of the bonding process.

  In the teaching method and teaching system of the present invention, it is possible to perform auto teaching after exchanging the collet for bonding using a bonding apparatus provided with a collet for pip-up and a collet for bonding.

  The teaching method includes a first step, a second step, and a third step. The first step includes the collet returning step and the first position recognizing step, and the second step is a chip returning step and a second position recognizing step. A teaching method including a process, a comparison process, and a position adjustment process, wherein the third step may include an intermediate stage origin return process.

  The teaching method includes a first step, a second step, and a third step. The first step includes the collet return step and the first position recognition step, and the second step includes a tip return step and a second step. A bonding method including a position recognition process, a comparison process, and a position adjustment process, wherein the third step includes a discarding process of discarding the chip on which the first step and the second step have been completed from an intermediate stage. There may be.

  In the teaching system, it is preferable that the position recognizing means includes a display unit for displaying a positional deviation between the chip and the chip holding position of the intermediate stage.

  The teaching system preferably includes a discarding unit that discards the chip on the intermediate stage from the intermediate stage. In this case, the discarding unit can be configured by a blow mechanism.

  In the present invention, teaching can be performed after exchanging the bonding collet using a bonding apparatus including a pip-up collet and a bonding collet. Therefore, manual operation is not necessary, and it is necessary to switch from automatic operation to manual operation. Absent. For this reason, the working time for teaching can be greatly reduced. In addition, the operator's work can be reduced, human error by the operator can be prevented, and stable teaching work can be performed.

  In the case where the display unit is provided, the operator can immediately recognize the positions of the chip and the intermediate stage by looking at the display unit, and the workability is excellent. In addition, since the position recognition monitor is also provided in the existing bonding apparatus, the existing display unit can be used as it is, and the cost can be reduced.

  In the case including the intermediate stage origin return process, the subsequent bonding process is stabilized. Further, in the case of having a discarding means for discarding the chip from the intermediate stage, the chip used for teaching can be discarded, and the operator's work can be reduced. The discarding means can be configured by a blow mechanism, and the chip can be reliably discarded without complicating the mechanism.

1 is a simplified diagram of a bonding apparatus in which a teaching method of the present invention is performed. It is a simplified block diagram of the teaching system of the present invention. It is a block diagram which shows the operation | work of the teaching method of this invention. It is process drawing of the 1st step of the teaching method of this invention. It is process drawing of the 2nd step of the teaching method of this invention. It is process drawing of the 3rd step of the teaching method of this invention. It is a simplified front view of the collet for bonding. It is a simplified bottom view of the collet for bonding. It is a simplified perspective view which shows the conventional bonding apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 shows a bonding apparatus in which a teaching method according to the present invention is implemented. A chip 21 is picked up by a pip-up collet 22 at a pickup position A, and the chip 21 adsorbed by the pip-up collet 22 is picked up. The chip 21 supplied to the intermediate stage 23 is picked up by the bonding collet 24 and the chip adsorbed by the bonding collet 24 is picked up at the bonding position B of the substrate 25 or the like. To supply. The chip 21 at the pickup position A is divided into a large number from the wafer 26.

  The collet 22 for pip-up is connected to an arm (not shown) via a collet holder, and this arm can be driven in the X, Y, Z, and θ directions by the pickup side conveying means 39 (see FIG. 2). It can be configured with a robot arm mechanism, an XYZθ axis stage, etc. Further, the collet 22 is vacuum-sucked through the suction holes opened in the lower end surface thereof, and the chip 21 is adsorbed on the lower end surface of the collet 22. When this vacuum suction (evacuation) is released, the chip 21 is detached from the collet 22. The pip-up collet 22 may be a flat collet having a flat suction surface or a pyramid collet having a tapered portion that guides the edge of the chip during suction, and is a type that sucks at two sides of the chip. Alternatively, it may be a type that adsorbs on the four sides of the chip. A vacuum generator such as a vacuum pump or an ejector is used for evacuating the pip-up collet 22.

  As a result, the pip-up collet 22 can move as shown in FIGS. 4 (a) to 4 (d). That is, from the standby position in FIG. 4 (a), that is, from the upper position of the intermediate position between the pickup position A and the intermediate stage 23, as shown in FIG. 4 (b), above the pickup position A along the arrow C1 direction. Move to the position, descend from this position along the arrow D1 direction, move to pick up the chip 21 at the pickup position A, rise from this position along the arrow D2 direction to the position above the pickup position A And the movement from this position back to the standby position along the arrow C2 direction is possible. Further, as shown in FIG. 4C, the chip moves from the standby position along the direction of the arrow C3 to the upper position of the intermediate stage 23, and descends from this position along the direction of the arrow D3. Movement to supply chips to the supply position, movement from this position along the direction of arrow D4 to movement to the upper position of the intermediate stage 23, and movement from this position to return to the standby position along the direction of arrow C4 are possible. is there. An observation camera 27 such as a CCD camera is disposed above the pickup position A, and position recognition at the time of pickup can be used.

  The bonding collet 24 is connected to an arm (not shown) via a collet holder, and this arm can be driven in the X, Y, Z, and θ directions by the bonding side collet transfer means 41 (see FIG. 2). It can be configured with a robot arm mechanism, an XYZθ axis stage, etc. Further, the collet 24 is a pyramid collet as shown in FIGS. That is, it has the taper part 30 which guides the edge of the chip | tip 21 at the time of adsorption | suction. In this case, as shown in FIG. 7B, even if the taper portion 30 is a type having four sides (a type that is attracted by four sides of the chip), the taper portion 30 has two sides as shown in FIG. It may be a type (a type that is adsorbed on two sides of the chip).

  The chip 21 is vacuum-sucked by the collet 24 through the suction hole 31 opened at the lower end surface, and the chip 21 is sucked by the collet 24. When this vacuum suction (evacuation) is released, the chip 21 is detached from the collet 24. A vacuum generator such as a vacuum pump or an ejector is also used for this vacuuming.

  Thereby, the bonding collet 24 can move as shown in FIGS. 5 (a) to 5 (d). That is, the movement from the standby position in FIG. 5A, that is, the upper position of the intermediate position between the bonding position B and the intermediate stage 23, to the upper position of the intermediate stage 23 along the arrow E1 direction, from this position the arrow F1 Move along the direction to suck the chip 21 on the intermediate stage 23, and move up from this position along the arrow F2 direction (see FIG. 5B) to the position above the intermediate stage 23. Movement and return from this position to the standby position along the direction of arrow E2 (see FIG. 5D) are possible. Further, the movement from the standby position to the upper position of the bonding position B along the arrow E3 direction, the movement to descend from the position along the arrow F3 direction and supply the chip 21 to the bonding position B, from this position. It is possible to move up to the position above the bonding position B along the direction of the arrow F4, and to move back from this position to the standby position along the direction of the arrow E4.

  Next, the configuration of the teaching system of the present invention will be described with reference to FIG. The teaching system compares the first position recognition means 35A, the second position recognition means 35B, and the data recognized by the first position recognition means 35 with the data recognized by the second position recognition means 36. A comparison unit 37; a pickup side control unit 38 for controlling the pickup side conveyance unit 39; and a bonding side control unit 41 for controlling the bonding side conveyance unit 40.

  The first position recognizing means 35A and the second position recognizing means 35B can be constituted by a common means. That is, it can be configured by one position recognition means 35, and this position recognition means 35 includes an observation camera 42 such as a CCD camera and a display unit 43 (see FIG. 1). As the display unit 43, a display device such as a liquid crystal panel, a touch panel, or the like can be used. The touch panel is a combination of a display device such as a liquid crystal panel and a position input device such as a touch pad.

  The position recognizing means 35 detects a positional shift of the chip 21 supplied to the chip supply unit of the intermediate stage 23 with respect to the intermediate stage 23. That is, the deviation of the X axis, the Y axis, and the θ axis can be detected with respect to the chip supply unit, and this data image is displayed on the display unit 43. In this case, the shift amount of each axis is displayed together with the image of the chip or the chip supply unit.

  Further, the intermediate stage 23 can be driven via a driving means 44 comprising an XYZθ axis stage or the like. Further, the intermediate stage 23 is provided with a suction means for sucking the chip 21 supplied to the chip supply unit. That is, the suction means includes a suction hole opened in the chip supply unit, and a vacuum generator such as a vacuum pump or an ejector that sucks air from the suction hole. When the suction hole is evacuated by the suction means, the chip 21 is vacuumed through the suction hole, and the chip 21 is sucked to the chip supply unit of the intermediate stage 23. When this vacuum suction (evacuation) is released, the chip 21 is detached from the chip supply unit.

  The driving means 44, the pickup side conveying means 39, the bonding side conveying means 41 and the like are controlled by the control means 50. The control means 50 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The control means 50 is connected to a storage device as a storage means, and this storage device is an HDD (Hard Disc Drive), DVD (Digital Versatile Disk) drive, CD-R (Compact Disc-Recordable) drive, EEPROM (Electronically). Erasable and Programmable Read Only Memory). The ROM stores programs executed by the CPU and data. Further, it can be constituted by a microcomputer constituting the control means 50 such as the comparison means 37, the pickup side control means 38, and the bonding side control means 40. The control means 50 constitutes a position adjusting means for aligning the bonding collet 23 based on the data compared by the comparison means 37.

  As shown in FIG. 1, a chip presence / absence sensor (take-home recognition) 45 is provided between the intermediate stage 23 and the bonding position B, that is, below the standby position of the bonding collet 24. The chip presence / absence sensor 45 supplies the chip 21 to the substrate 25 with the bonding collet 24 and then the chip 21 is adsorbed to the bonding collet 24 when the bonding collet 24 returns to its standby position. It is to detect whether it is not done. That is, in this state, if the chip 21 is attracted to the collet 24, the chip 21 is brought back without being bonded at the bonding position. Therefore, the presence / absence of the chip 21 is detected by the chip presence / absence sensor 45 to recognize whether the chip 21 has been brought home. The chip presence / absence sensor 45 can be constituted by a transmissive sensor or the like.

  Moreover, this apparatus is provided with a chip discarding means 46 as shown in FIG. The chip discarding means 46 can be constituted by a blow mechanism 47 that discharges air. The blow mechanism 47 includes an air injection nozzle 47 a that injects compressed air, and a chip receiving portion 47 b that accommodates the chip 21 that is injected from the air injection nozzle 47 a and is blown off from the intermediate stage 23.

  The bonding apparatus configured as described above performs the steps shown in FIG. 3 and performs teaching after collet replacement. That is, the teaching method according to the present invention includes teaching collet returning step 51, first position recognizing step 52, auto tip returning step 53, second position recognizing step 54, comparing step 55, and position adjusting step 56. And a disposal step 57 and an origin return step 58.

  The collet returning step 51 is a step from FIG. 4 (a) to FIG. 4 (c). That is, as shown in FIG. 4A, the pickup collet 22 is moved in the direction of the arrow C1 in FIG. Thereafter, the collet 22 is lowered along the direction of the arrow D1, and the chip 21 at the pickup position is adsorbed to the collet 22. Next, after raising the collet 22 along the direction of the arrow D2, the collet 22 is moved in the direction of the arrow C2 to return to the standby position.

  After returning to the standby position, as shown in FIG. 4C, the collet 22 is moved in the direction of the arrow C3 to be positioned above the intermediate stage 23. Then, the collet 22 is lowered along the direction of the arrow D3, and the suction force of the collet 22 is released at the lowest position, and the suction force is applied to the intermediate stage 23 side, and is sucked by the collet 22. The chip 21 is adsorbed on the intermediate stage 23.

  Thereafter, the collet 22 is raised along the arrow D4 direction, and then moved along the arrow C4 direction to return to the standby position. Thereby, the collet returning step 51 is completed. In the first position recognition step 52, the chip 21 is observed on the intermediate stage 23 by the observation camera 42 as shown in FIG. Then, the position data (first recognition result) of the recognized chip 21 on the intermediate stage 23 is stored in the storage means.

  The auto chip returning process 53 is a process from FIG. 5A to FIG. That is, as shown in FIG. 5A, the bonding collet 24 is moved from the state of being in the standby position in the direction of the arrow E1, and is positioned above the intermediate stage 23. Thereafter, the collet 24 is lowered along the direction of the arrow F <b> 1, and the chip 21 of the intermediate stage 23 is adsorbed to the collet 24. At this time, since the collet 24 is a pyramid collet, even if the adsorption position of the collet 24 is shifted, the edge of the collet 24 is guided and adsorbed by the tapered portion 30 of the pyramid collet. In this state, the suction force on the intermediate stage 23 side is set to the OFF state.

  Thereafter, as shown in FIG. 5 (b), the collet 24 is once raised as shown by the arrow F2, and then lowered again as shown by the arrow F1 as shown in FIG. 5 (c). At this time, the suction force on the intermediate stage side is applied, and the suction force on the collet 24 side is turned off. As a result, the chip 21 is attracted to the intermediate stage side. Next, after raising the collet 24 as shown by the arrow F2, the collet 24 is moved along the direction of the arrow E2 to return the collet 24 to the standby position. Thereby, the auto chip returning step 53 is completed.

  In the second position recognition step 54, the chip 21 is observed on the intermediate stage 23 by the observation camera 42 as shown in FIG. Then, the position data (second recognition result) of the recognized chip 21 on the intermediate stage 23 is stored in the storage means.

  The comparison step 55 compares the first recognition result of the first position recognition step 52 with the second recognition result of the second position recognition step 54. Then, the difference is taught as a deviation after the collet exchange. In this case, the parameters include the X-axis direction, the Y-axis direction, and the θ-axis direction. For this reason, for example, if the threshold value of the deviation amount in the three-axis direction is determined in advance and exceeds the threshold value set even for one axis, Teaching the deviation amount or teaching the deviation amount when the total deviation amount of the three axes exceeds the preset total deviation threshold value, although the threshold value is not exceeded for each axis Can be. That is, the position adjustment process 56 for correcting the shift amount is performed. In this case, the amount of deviation is displayed on the display unit 43, and the operator can decide whether or not to perform the position adjustment step 56.

  After the position adjustment step 56 is completed, the position information data of the chip 21 on the intermediate stage 23 is deleted from the storage means. Next, a disposal step 57 is performed. That is, as shown in FIG. 6B, the chip 21 on the intermediate stage 23 is discarded by performing an air blow by the blow mechanism 47. Thereafter, as shown in FIG. 6C, an origin return process 58 is performed, and this teaching process is completed.

  In the present invention, the collet return process 51 and the first position recognition process 52 are referred to as the first step, and the chip return process 53, the second position recognition process 54, the comparison process 55, and the position adjustment process 56 are the second step. The discarding process 57 and the origin returning process 58 can be called a third step. That is, up to the first step is a preparation process, the second step is a teaching process, and the third step is a post-process.

  As described above, after the teaching after the exchange of the collet for bonding is completed, the bonding work by this bonding apparatus is started.

  In the teaching method and teaching system of the present invention, auto-teaching after exchanging the collet for bonding using the bonding apparatus provided with the collet 22 for pip-up and the collet 24 for bonding becomes possible. For this reason, manual operation is not required, and there is no need to switch from auto operation to manual operation. For this reason, the working time for teaching can be greatly reduced. (The collet replacement work including teaching according to the conventional method takes about 2 hours, but if the teaching method of the present invention is used, the collet replacement work can be performed in about 15 minutes.) Therefore, human error by an operator can be prevented and stable teaching work can be performed.

  In the case where the display unit 43 is provided, the operator can immediately recognize the positions of the chip 21 and the intermediate stage 23 when the operator views the display unit 43, and is excellent in workability. In addition, since the position recognition monitor is also provided in the existing bonding apparatus, the existing display unit 43 can be used as it is, and the cost can be reduced.

  If the intermediate stage 23 includes an origin return process, the subsequent bonding process is stable. Further, in the case of including the discarding means 46 for discarding the chip 21 from the intermediate stage 23, the chip 21 used for teaching can be discarded, and the operator's work can be reduced. The discarding means can be constituted by the blow mechanism 47, and the chip 21 can be reliably discarded without complicating the mechanism.

  As described above, the embodiment of the present invention has been described, but various modifications are possible without being limited to the embodiment. For example, in the collet returning step, in the embodiment, FIG. 4 (a) to FIG. The process up to (b) and the processes from FIG. 4 (c) to FIG. 4 (d) may be continuous processes or discontinuous processes.

21 chip 22 pip-up collet 23 intermediate stage 24 bonding collet 35A first position recognizing means 35B second position recognizing means 35 position recognizing means 37 comparing means 38 pick-up side control means 39 pick-up side conveying means 43 display unit 46 chip discarding means 47 Blow mechanism 50 Control means (position adjustment means)
51 Collet return process 52 Position recognition process 53 Auto chip return process 54 Position recognition process 55 Comparison process 56 Position adjustment process 57 Disposal process 58 Origin return process A Pickup position B Bonding position

Claims (7)

The chip is picked up by the pip-up collet at the pick-up position, and the chip adsorbed by the pip-up collet is supplied to the intermediate stage. A method for teaching a bonding collet in a chip transporting process in which a chip picked up by a bonding collet including a pyramid collet having a taper portion to guide the chip and sucked by a bonding collet to a bonding position is provided.
A collet returning step of returning the chip adsorbed by the pip-up collet onto the intermediate stage and then returning the pip-up collet to a predetermined standby position;
A first position recognition step for recognizing the position of the chip supplied by the collet for pip-up on the intermediate stage;
After the chip supplied on the intermediate stage is adsorbed by the bonding collet and raised along the Z-axis direction, it is lowered again along the Z-axis direction and returned to the intermediate stage, and then the bonding collet An automatic chip returning step for returning to a predetermined standby position;
A second position recognition process for recognizing the position of the chip returned in the chip return process on the intermediate stage;
A comparison step for comparing the recognition result of the first position recognition step with the recognition result of the second position recognition step;
A teaching method comprising: a position adjusting step for adjusting the position of the bonding step when the comparison in the comparison step exceeds a predetermined range. A first step, a second step, and a third step, wherein the first step includes the collet return step and the first position recognition step, and the second step includes a chip return step, a second position recognition step, and a comparison step. A teaching method including a position adjusting step,
The teaching method according to claim 1, wherein the third step includes an intermediate stage origin return step. A first step, a second step, and a third step, wherein the first step includes the collet return step and the first position recognition step, and the second step includes a chip return step, a second position recognition step, and a comparison step. A teaching method including a position adjusting step,
2. The teaching method according to claim 1, wherein the third step includes a discarding step of discarding the chip that has completed the first step and the second step from an intermediate stage. The chip is picked up by the pip-up collet at the pick-up position, and the chip adsorbed by the pip-up collet is supplied to the intermediate stage. A teaching system for a bonding collet in a chip transporting process of picking up a chip adsorbed by a bonding collet and picking up the chip adsorbed by the bonding collet to a bonding position.
Pickup side control means for returning the chip adsorbed by the pip-up collet onto the intermediate stage and then returning the pip-up collet to a predetermined standby position;
First position recognition means for recognizing the position of the chip supplied by the collet for pip-up on the intermediate stage;
After the chip supplied on the intermediate stage is adsorbed by the bonding collet and raised along the Z-axis direction, it is lowered again along the Z-axis direction and returned to the intermediate stage, and then the bonding collet Bonding-side control means for returning the position to a predetermined standby position;
Second position recognition means for recognizing the position of the chip returned in the chip return step on the intermediate stage;
Comparison means for comparing the recognition result of the first position recognition means and the recognition result of the second position recognition means;
A teaching system comprising: a position adjusting means for adjusting a position of the bonding process when the comparison of the comparing means exceeds a predetermined range.   5. The teaching system according to claim 4, wherein the position recognition means includes a display unit that displays a positional deviation between the chip and the chip holding position of the intermediate stage.   6. The teaching system according to claim 4, further comprising a discarding unit that discards the chip on the intermediate stage from the intermediate stage.   7. The teaching system according to claim 6, wherein the discarding means is constituted by a blow mechanism.

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