JP2014093337A - Method for manufacturing package, method for manufacturing electronic device, electronic equipment, and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package and a method for manufacturing an electronic device, capable of preventing a bonding failure due to an insufficient application height of a low-melting glass and extrusion to the inside of a package due to an excessive application height.SOLUTION: A method for manufacturing a package comprises the steps of: preparing a first substrate having a plurality of cavities surrounded by a partition and a flat plate-like second substrate; measuring a height variation of the partition; calculating an application height of a low-melting glass from the height variation of the partition; applying the low-melting glass to the partition; and disposing the first substrate and the second substrate overlapping with each other and bonding the substrates.

Description

  The present invention relates to a package manufacturing method, an electronic device manufacturing method, an electronic apparatus, and a moving body.

Conventionally, along with the downsizing and thinning of electronic equipment, electronic parts such as piezoelectric devices are required to be further downsized and thinned, and surface-mounting types suitable for mounting on circuit boards and the like are also available. It is used a lot. In general, a surface-mount type piezoelectric device widely adopts a structure in which a piezoelectric vibrating piece is sealed in a package formed of an insulating material such as ceramic.
For example, such a package is known in which a piezoelectric vibrating piece is mounted in a cavity of a box-type base in which ceramic material sheet materials are stacked, and a lid is joined to the base so as to be hermetically sealed. In general, the base and the lid are joined in an airtight manner by placing a brazing material such as low-melting glass between them and heating and melting them. In either case, the separated base and lid are joined individually. Therefore, in order to join each base and the lid accurately, it is necessary to use a jig for positioning them individually. Furthermore, such operations such as positioning and conveyance require a great deal of labor and labor, resulting in a problem that productivity is lowered and manufacturing cost is increased.
In order to solve such a problem, in Patent Document 1, an electronic component such as a piezoelectric vibrating piece is fixed in a cavity of each base of a base plate composed of a plurality of bases, and then a lid plate composed of a plurality of lids is attached. A manufacturing method is disclosed in which the layers are collectively bonded and sealed. This eliminates the need to individually align the individual bases and lids, and simplifies the handling and sealing operations of the bases and lids. Therefore, productivity can be improved and manufacturing cost can be reduced.

JP 2006-5019 A

  However, when a base plate made of a plurality of bases and a lid plate made of a plurality of lids are overlapped and collectively bonded and sealed, if the base plate or the lid plate has thickness variations or warpage, the low melting point glass is applied. There are problems such as poor bonding due to insufficient amount, and conversely, the amount of coating is too large, causing the low melting point glass to protrude into the cavity of the package.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A package manufacturing method according to this application example includes a step of preparing a first substrate having a plurality of cavities surrounded by a partition wall and a flat plate-like second substrate, and the partition wall Determining the height variation of the partition wall, calculating the coating height of the low melting point glass from the height variation of the partition, applying the low melting point glass to the partition, the first substrate and the And a step of superposing and bonding the second substrate.

  According to this application example, for each substrate, the height of each partition wall of the first substrate having a plurality of cavities surrounded by the partition walls is measured, the height variation is obtained from the height difference, and the low melting point glass Calculate the coating height. As a result, low melting point glass having a height capable of absorbing the height variation of each partition wall caused by manufacturing variation is applied, so that the amount of low melting point glass applied after joining with the second substrate serving as the lid There is an effect that it is possible to prevent the poor bonding of the low melting glass into the cavity of the package due to the insufficient bonding due to the shortage and the excessive coating amount.

  Application Example 2 An electronic device manufacturing method according to this application example prepares a first substrate having a plurality of cavities surrounded by partition walls, a flat plate-like second substrate, and an electronic component. A step of obtaining a height variation of the partition, a step of calculating a coating height of the low-melting glass from the height variation of the partition, a step of applying the low-melting glass to the partition, The first substrate and the second substrate are stacked and bonded, and before the bonding step, either the bottom surface in the cavity or the second substrate is connected to the second substrate. And a step of arranging electronic parts.

  According to this application example, for each substrate, the height of each partition wall of the first substrate having a plurality of cavities surrounded by the partition walls is measured, the height variation is obtained from the height difference, and the low melting point glass After calculating the coating height, low-melting glass with the calculated height is applied onto each partition wall for each substrate. After that, by arranging the electronic component on either the bottom surface in the cavity of the first substrate or the second substrate, it is possible to absorb the height variation of each partition wall caused by the manufacturing variation, After the first substrate and the second substrate are bonded, there is an effect that it is possible to obtain an electronic device which prevents the low melting glass from joining poorly and the low melting glass protruding into the cavity of the package.

  Application Example 3 In the electronic device manufacturing method according to the application example described above, in the step of obtaining the height variation of the partition walls, the first height difference of the partition walls surrounding one of the cavities is adjacent. The second height difference of the partition wall sandwiched between the two cavities is measured, and the height variation is obtained from the first height difference and the second height difference.

  According to this application example, not only the first height difference in the partition wall surrounding one cavity but also the second height difference between the partition walls surrounding the adjacent cavity is measured, By obtaining the height variation from the height difference and the second height difference and determining the optimum coating height, even in the cavity around one cavity, bonding failure due to insufficient coating amount of low melting point glass and excessive coating amount This prevents the low melting point glass from protruding into the cavity of the package.

  Application Example 4 In the electronic device manufacturing method according to the application example described above, in the step of obtaining the height variation of the partition wall, the height variation of the partition wall at a plurality of locations on the first substrate is obtained, and a plurality of height variations are obtained. The maximum value of the height difference is defined as the height variation.

  According to this application example, the height of the partition walls in the first substrate is measured, and the maximum value of the height difference is determined as the height variation based on the result. In addition, since the region where the coating amount is excessive can be eliminated, it is possible to prevent defective bonding and protrusion of the low melting point glass into the cavity of the package in almost the entire area of the first substrate.

  Application Example 5 In the electronic device manufacturing method according to the application example described above, in the step of calculating the coating height of the low-melting glass, the height of the gap material contained in the low-melting glass in the height variation When the value obtained by adding T is T1, the coating height is in the range of T1 or more and T2 or less of T2 added by 10 μm.

  According to this application example, the coating height of the low melting point glass for each substrate is set to the maximum value of the height variation in the substrate, and the value obtained by adding the height of the gap material contained in the low melting point glass to the minimum. The value obtained by adding 10 μm of the coating height variation width in manufacturing to the value is limited to the maximum range. As a result, even when the coating height variation in manufacturing is the smallest, it is possible to ensure the bonding height of the gap material height, so that it is possible to prevent poor bonding due to insufficient coating height of the low melting point glass. it can. Further, even when the coating height variation in manufacturing is the largest, there is an effect that it is possible to prevent the low melting glass from protruding into the cavity of the package due to the excessive application amount of the low melting glass.

  Application Example 6 An electronic apparatus according to this application example includes an electronic device manufactured by the manufacturing method described in the application example.

  According to this application example, it is possible to configure an electronic apparatus including an electronic device in which poor bonding due to insufficient application amount of the low-melting glass or protrusion of low-melting glass into the cavity of the package due to excessive application amount is prevented. There is.

  Application Example 7 A moving object according to this application example includes an electronic device manufactured by the manufacturing method described in the application example.

  According to this application example, there is an effect that it is possible to configure a moving body including an electronic device that does not have poor bonding or low-melting glass protruding into the cavity of the package.

It is a top view of the board | substrate used for the manufacturing method which concerns on the 1st Embodiment of this invention, (a) is the 1st board | substrate with which the cavity was formed, (b) is a flat board-shaped 2nd board | substrate. It is a schematic diagram explaining the height variation of the partition of the board | substrate used for the manufacturing method which concerns on the 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional drawing, (c) is BB sectional drawing. It is a schematic diagram of the electronic device manufactured by the manufacturing method which concerns on the 2nd Embodiment of this invention, (a) is a top view, (b) is CC sectional drawing before joining, (c) is after joining. CC sectional drawing of this and the enlarged view of a junction part. It is a schematic diagram of the electronic device manufactured by the manufacturing method which concerns on the 2nd Embodiment of this invention, (a) is a top view, (b) is DD sectional drawing. It is a schematic diagram of the electronic device manufactured by the manufacturing method which concerns on the 3rd Embodiment of this invention, (a) is sectional drawing before joining, (b) is sectional drawing after joining. The top view of the board | substrate of the electronic device manufactured by the manufacturing method which concerns on the 4th Embodiment of this invention. It is a schematic diagram of the electronic device manufactured by the manufacturing method which concerns on the 4th Embodiment of this invention, (a) is a top view, (b) is EE sectional drawing before joining, (c) is after joining. EE sectional drawing. The perspective view which shows the structure of the mobile type (or notebook type) personal computer as electronic equipment provided with the electronic device manufactured by the manufacturing method which concerns on this invention. The perspective view which shows the structure of the mobile telephone (PHS is also included) as an electronic device provided with the electronic device manufactured by the manufacturing method which concerns on this invention. The perspective view which shows the structure of the digital camera as an electronic device provided with the electronic device manufactured by the manufacturing method which concerns on this invention. The perspective view which shows the structure of the motor vehicle as a moving body provided with the electronic device manufactured by the manufacturing method which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view of a substrate used in the manufacturing method according to the first embodiment of the present invention. FIG. 1 (a) is a first substrate with a cavity formed, and FIG. 1 (b) is a flat plate. This is the second substrate. FIG. 2 is a schematic diagram for explaining the height variation of the partition walls of the substrate used in the manufacturing method according to the first embodiment of the present invention. FIG. 2A is a plan view of a portion A in FIG. (B) is AA sectional drawing of Fig.2 (a), FIG.2 (c) is BB sectional drawing of Fig.2 (a).
As shown in FIG. 1, the first substrate 10 in which a plurality of cavities 20 are formed corresponds to a base in a conventional ceramic package, and has a flat ceramic sheet and a partition wall 22 constituting the cavity 20. Ceramic sheets are laminated and formed. Although not shown here, a predetermined number of electrodes and wiring patterns necessary for mounting the electronic component 30 (shown in FIG. 3) in the cavity 20 are formed on the first substrate 10 in advance. The flat plate-like second substrate 12 corresponding to the lid in the conventional ceramic package is formed of a ceramic sheet having a predetermined thickness.

  In the package manufacturing method according to the present embodiment, first, a first substrate 10 having a plurality of cavities 20 surrounded by a partition wall 22 and a plate-like second substrate 12 are prepared. Next, the height difference of each partition wall 22 formed on the first substrate 10 for each first substrate 10 is measured by a laser interferometer or the like, and the height variation is obtained from the height difference, and the first substrate 10 is determined. The coating height of the low melting point glass 40 (shown in FIG. 3) is calculated. Thereafter, a low melting point glass 40 having a calculated height is applied to each partition 22 formed on the first substrate 10 for each first substrate 10 by a screen printing apparatus or the like, and the first substrate 10 and the second substrate The two substrates 12 are arranged so as to overlap with each other. The joining is performed by heating in a vacuum or nitrogen atmosphere with a sealing device or the like to melt the low melting point glass 40. Thereafter, the package is cut into pieces by a method such as dicing, whereby a hermetically sealed package is obtained.

  Here, in the case of a large substrate in which a plurality of cavities 20 are formed, the variation in thickness varies from substrate to substrate due to the variation in thickness within the sheet due to manufacturing variations of the ceramic sheet and the warpage due to stress during sheet firing. 22 height variations occurred. Therefore, in the conventional method in which the coating height of the low-melting glass 40 for bonding is constant, depending on the substrate, bonding failure due to insufficient coating height or conversely the coating height is too high and the inside of the cavity 20 of the package is low. There is a problem in that the protrusion of the melting point glass 40 is poor. As a result of investigating the height variation of the partition wall 22 of the first substrate 10 in this embodiment, the height variation of the partition wall 22 in the substrate is about ± 5 μm, whereas the height variation of the partition wall 22 between the substrates is It was found to be as large as about ± 10 μm, and it is necessary to determine the coating height of the low melting point glass 40 for each substrate in order to prevent poor bonding.

  Therefore, in the present embodiment, in order to solve this problem, the first height difference between the partition walls 22 constituting the adjacent cavities 20 at nine locations in the substrate indicated by the broken-line circles in FIG. Δt1 (shown in FIG. 2B) and a second height difference Δt2 in the partition wall 22 (shown in FIG. 2C) are measured. Thereafter, the maximum value Δtmax among the nine locations, the height T of the gap material 42 (shown in FIG. 3C) contained in the low-melting glass 40, and the application of the low-melting glass 40 measured by a coating experiment. The application height of the low-melting glass 40 on each substrate is calculated in consideration of the thickness variation of ± 5 μm. The coating height of the low-melting glass 40 is not less than a value T1 obtained by adding the height T of the gap member 42 to the maximum height variation Δtmax, and the thickness variation width of the coating height of the low-melting glass 40 is 10 μm. It is set as the range below the value T2 which added.

  In the present embodiment, the first substrate 10 and the second substrate 12 are made of oxide ceramics such as alumina, silica and zirconia, nitride ceramics such as silicon nitride, aluminum nitride and titanium nitride, and carbides such as silicon carbide. It is composed of various ceramics such as ceramic. In addition, about the 2nd board | substrate 12 used as a lid, a glass material or a metal material may be sufficient besides a ceramic.

The low-melting glass 40 is not particularly limited. For example, the P ₂ O ₅ —CuO—ZnO-based low melting glass, the P ₂ O ₅ —SnO-based low melting glass, B ₂ O ₃ —ZnO—Bi ₂ O ₃ — Al ₂ O ₃ -based low melting point glass or the like can be used.
The low melting point glass 40 includes a plurality of spherical gap members 42. Note that the shape of the gap member 42 is not limited to a spherical shape, and may be, for example, an elliptical spherical shape, a flat shape, an irregular shape, or a block shape.

As the gap material 42, a material having a high melting point that does not melt at a temperature at which the low melting point glass 40 melts is used.
The average particle diameter (average maximum width) of the gap material 42 is not particularly limited, but is preferably about 5 to 50 μm, and more preferably about 10 to 30 μm. In addition, the standard deviation of the particle size of the gap material 42 (the degree of particle size variation) is preferably as small as possible, but specifically, it is preferably 1.0 μm or less, more preferably 0.5 μm or less. preferable.

  The constituent material of the gap material 42 is not particularly limited. For example, a metal material such as Al, Au, Cr, Nb, Ta, Ti, quartz glass, alkali silicate glass, soda lime glass, potash lime glass, lead Glass materials such as (alkali) glass, barium glass, borosilicate glass, ceramic materials such as alumina, zirconia, ferrite, silicon nitride, aluminum nitride, boron nitride, titanium nitride, silicon carbide, boron carbide, titanium carbide, tungsten carbide And carbon materials such as graphite can be used, and one or more of these can be used in combination.

(Second Embodiment)
Next, an electronic device manufactured by the manufacturing method according to the second embodiment of the present invention will be described.
3A and 3B are schematic views of an electronic device manufactured by the manufacturing method according to the second embodiment of the present invention, in which FIG. 3A is a plan view, and FIG. 3B is FIG. CC sectional drawing of a), FIG.3 (c) is CC sectional drawing of Fig.3 (a) after board | substrate joining, and the enlarged view of a junction part. 4A and 4B are schematic views of an electronic device manufactured by the manufacturing method according to the second embodiment of the present invention, in which FIG. 4A is a plan view and FIG. 4B is D in FIG. 4A. It is -D sectional drawing. 3A and 4A, for convenience of explaining the internal configuration of the electronic device, a state where the second substrate 12 serving as a lid and the low-melting glass 40 are removed is illustrated.

The electronic device 14 includes a first substrate 10 that serves as a base, a second substrate 12 that serves as a lid, and an electronic component 30, and the partition 22 of the first substrate 10 and the second substrate 12 include Bonded by the low melting point glass 40. The electronic component 30 is bonded onto the first substrate 10 in the cavity 20 by a bonding material 44.
The manufacturing method of the electronic device 14 in this embodiment is substantially the same as the above-described package manufacturing method, and after applying the low melting point glass 40 having the coating height calculated for each substrate, the inside of each cavity 20 of the first substrate 10 The electronic component 30 is mounted on the bottom surface and bonded by the bonding material 44. Thereafter, the first substrate 10 and the second substrate 12 substrate in which the inside of the cavity 20 is hermetically sealed by bonding are separated into pieces by dicing along the cutting line 50, whereby the electronic device 14 is obtained. It is done.

(Third embodiment)
Next, an electronic device manufactured by the manufacturing method according to the third embodiment of the present invention will be described.
5A and 5B are schematic views of an electronic device manufactured by the manufacturing method according to the third embodiment of the present invention. FIG. 5A is a cross-sectional view before bonding, and FIG. 5B is a cross-sectional view after bonding. FIG.
Hereinafter, the third embodiment will be described with a focus on differences from the second embodiment described above, and description of similar matters will be omitted.
As shown in FIG. 5, the electronic device 14 a manufactured by the manufacturing method according to the third embodiment is compared with the electronic device 14 manufactured by the manufacturing method according to the second embodiment. And the structure of the second substrate 12a are vertically inverted, and are substantially equivalent. However, the electronic component 30 is bonded onto the second substrate 12 a via the bonding material 44. Although not shown here, a predetermined number of electrodes and wiring patterns necessary for mounting the electronic component 30 are formed in advance on the second substrate 12a. Further, the electronic component 30 bonded on the second substrate 12a is positioned, bonded and bonded in the cavity 20 of the first substrate 10a. After joining, it divides | segments into pieces by dicing along the cutting line 50a, and the electronic device 14a is obtained.

  With such a configuration, the electronic component 30 can be mounted on and bonded to the second substrate 12a while measuring the height variation of the partition wall 22 and calculating the coating height of the first substrate 10a. The manufacturing time is shortened and the cost is reduced.

(Fourth embodiment)
Next, an electronic device manufactured by the manufacturing method according to the fourth embodiment of the present invention will be described.
FIG. 6 is a plan view of a substrate used in the manufacturing method according to the fourth embodiment of the present invention.
7A and 7B are schematic views of an electronic device manufactured by the manufacturing method according to the fourth embodiment of the present invention. FIG. 7A is a plan view of a portion B in FIG. 6, and FIG. FIG. 7A is a cross-sectional view taken along line EE in FIG. 7A, and FIG. 7C is a cross-sectional view taken along line EE in FIG.
Hereinafter, the fourth embodiment will be described with a focus on differences from the second embodiment described above, and description of similar matters will be omitted.
As shown in FIG. 6, the 1st board | substrate 10b is the structure by which the partition 22a which forms the several cavity 20a was integrated. Although not shown here, a predetermined number of electrodes and wiring patterns necessary for mounting the electronic component 30 in the cavity 20a are formed on the first substrate 10b in advance.
Further, as shown in FIG. 7, the electronic device 14b manufactured by the manufacturing method according to the fourth embodiment has a plurality of cavities compared to the electronic device 14 manufactured by the manufacturing method according to the second embodiment. The structure is the same except that the partition wall 22a surrounding 20a is integrated, and the first substrate 10b and the second substrate 12 are joined through the low melting point glass 40a and then diced along the cutting line 50a. Thus, the electronic device 14b is obtained.

  With such a configuration, a large upper area of the partition wall 22a formed on the first substrate 10b can be secured, so that the bonding area at the time of bonding is widened, the airtightness of the cavity 20a is improved, and poor bonding is further prevented. There is an effect that can be.

  As described above, the method of dicing the package and the electronic devices 14, 14 a, and 14 b in the first to fourth embodiments has been described using the dicing method. However, in addition to dicing, A method may be used in which grooves are formed along the cutting lines 50, 50 a, 50 b in the first substrate 10, 10 a, 10 b or the second substrate 12, 12 a and are divided into pieces after bonding along the grooves.

(Electronics)
Next, an electronic apparatus to which the electronic device manufactured by the manufacturing method according to the present invention is applied will be described in detail with reference to FIGS.
FIG. 8 is a perspective view showing a configuration of a mobile (or notebook) personal computer as an electronic apparatus including an electronic device manufactured by the manufacturing method according to the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates an electronic device 14.

  FIG. 9 is a perspective view illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic device manufactured by the manufacturing method according to the present invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 has the electronic device 14 built therein.

FIG. 10 is a perspective view illustrating a configuration of a digital camera as an electronic apparatus including the electronic device manufactured by the manufacturing method according to the present invention. In this figure, the connection with an external device is also shown in a simplified manner. Here, an ordinary camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital camera 1300 captures a light image of a subject by photoelectrically converting it with an image sensor such as a CCD (Charge Coupled Device). A signal (image signal) is generated.
A display unit 100 is provided on the back surface of a case (body) 1302 in the digital camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 100 displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer (PC) 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital camera 1300 incorporates an electronic device 14.

  Note that an electronic apparatus including an electronic device manufactured by the manufacturing method according to the present invention includes, for example, an ink jet type discharge in addition to the personal computer 1100 in FIG. 8, the cellular phone 1200 in FIG. 9, and the digital camera 1300 in FIG. Device (for example, inkjet printer), laptop personal computer, TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, work Station, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measurements Equipment, instruments (eg, vehicles Aircraft, gauges of a ship), can be applied to a flight simulator.

(Moving body)
FIG. 11 is a perspective view schematically showing an automobile as a moving body including an electronic device manufactured by the manufacturing method according to the present invention. In this figure, an electronic device 14 is built in an electronic control unit 2108 that controls a tire 2109 and is mounted on a vehicle body 2107.
The automobile 2106 is equipped with the electronic device 14 manufactured by the manufacturing method according to the present invention. For example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), The present invention can be widely applied to electronic control units (ECUs) 2108 such as airbags, tire pressure monitoring systems (TPMS), engine controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 12 ... 2nd board | substrate, 14 ... Electronic device, 20 ... Cavity, 22 ... Partition, 30 ... Electronic component, 40 ... Low melting glass, 42 ... Gap material, 44 ... Bonding material, 50 ... Cutting line, 100 ... display unit, 1100 ... personal computer, 1102 ... keyboard, 1104 ... main body unit, 1106 ... display unit, 1200 ... mobile phone, 1202 ... operation button, 1204 ... earpiece, 1206 ... mouthpiece, 1300 ... Digital camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1312 ... Video signal output terminal, 1314 ... Input / output terminal, 1430 ... TV monitor, 1440 ... Personal computer, 2106 ... Car, 2107 ... Car body, 2108 ... Electronic control unit, 2109 ... I hate.

Claims (7)

Preparing a first substrate having a plurality of cavities surrounded by a partition, and a flat plate-like second substrate;
Determining the height variation of the partition;
Calculating the coating height of the low melting point glass containing the gap material from the height variation of the partition;
Applying the low melting point glass to the partition;
Placing and bonding the first substrate and the second substrate in an overlapping manner;
A method for manufacturing a package, comprising: Preparing a first substrate having a plurality of cavities surrounded by a partition, and a flat plate-like second substrate;
Determining the height variation of the partition;
Calculating the coating height of the low melting point glass containing the gap material from the height variation of the partition;
Applying the low melting point glass to the partition;
Placing and bonding the first substrate and the second substrate in an overlapping manner;
A method for manufacturing an electronic device, comprising: placing an electronic component on one of the bottom surface in the cavity and the second substrate before the joining step. In the step of determining the height variation of the partition wall,
Measuring a first height difference of the partition wall surrounding one of the cavities and a second height difference of the partition wall sandwiched between two adjacent cavities;
3. The method of manufacturing an electronic device according to claim 2, wherein the height variation is obtained from the first height difference and the second height difference. In the step of determining the height variation of the partition wall,
Obtaining height variations of the partition walls at a plurality of locations of the first substrate,
4. The method of manufacturing an electronic device according to claim 3, wherein a plurality of maximum height differences are defined as the height variation. In the step of calculating the coating height of the low melting point glass,
When T1 is a value obtained by adding the height of the gap material contained in the low melting point glass to the height variation,
5. The method of manufacturing an electronic device according to claim 2, wherein the coating height is in a range of T <b> 1 or more and T <b> 2 or less of T <b> 2.   An electronic device comprising the electronic device manufactured by the manufacturing method according to claim 2.   A moving body comprising the electronic device manufactured by the manufacturing method according to claim 2.

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