JP2014086603A - Housing structure of on-vehicle electronic apparatus - Google Patents

Housing structure of on-vehicle electronic apparatus Download PDF

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JP2014086603A
JP2014086603A JP2012235223A JP2012235223A JP2014086603A JP 2014086603 A JP2014086603 A JP 2014086603A JP 2012235223 A JP2012235223 A JP 2012235223A JP 2012235223 A JP2012235223 A JP 2012235223A JP 2014086603 A JP2014086603 A JP 2014086603A
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circuit board
printed circuit
housing
case
component
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JP5539476B2 (en
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Kota Hozumi
仰太 穂積
Naoki Mori
直樹 森
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of conventional general structure that when a mounting component in close proximity to the end face of a printed circuit board is connected electrically with a connector connection pin by partial jet solder, the case sidewall touches the solder and is burnt or melted, and to solve such a problem that since the solder goes around the back side of the printed circuit board, a sufficient distance is required between the case sidewall and the printed circuit board end face and the mounting component, and thereby the size of the printed circuit board, the base and the cover is increased thus causing cost increase.SOLUTION: A housing structure of on-vehicle electronic apparatus has a printed circuit board 4 for mounting an electronic component, and a housing 1 for incorporating the printed circuit board 4. The housing 1 is divided by a case 3 and a cover 2 in a plane parallel with the surface of the printed circuit board 4. The case 3 supporting the printed circuit board 4 has a column 3e having a seating face 3b for holding the printed circuit board 4, and the seating face 3b is set at a position higher than the split face 3d of the housing.

Description

本発明は、車載用電子機器の筐体構造に関し、詳しくは、小型化、部品点数削減、コストダウンが可能で、且つプリント基板、金型、半田付けの品質の向上を併せ持つ構造に関するものである。   The present invention relates to a housing structure of an in-vehicle electronic device, and more particularly, to a structure that can be downsized, reduce the number of parts, reduce costs, and improve the quality of printed circuit boards, molds, and soldering. .

自動車に搭載する車載用の電子機器は、部品点数削減や環境負荷物質低減の観点から、ねじレスや鉛フリー半田を用いることが望ましい。また、近年自動車の高機能化および低燃費化実現のための手段として車両軽量化に伴う実装スペースの縮小から高いレイアウト性を確保するため、小型化および薄型化を考慮した電子機器が必要である。さらには、部品点数削減や部品サイズ縮小、プリント基板のサイズ縮小のため、筐体とコネクタを一体化した構造は部品点数削減及びコネクタの高強度化、薄型化が出来ることから高いレイアウト性が可能となる。
しかしながら、前記構造とする場合においても、プリント基板、筐体、半田付けには良好な品質が必要となる。
It is desirable to use screw-less or lead-free solder for in-vehicle electronic devices mounted on automobiles from the viewpoint of reducing the number of parts and reducing environmental load substances. Also, in recent years, as a means for realizing higher performance and lower fuel consumption of automobiles, electronic devices in consideration of downsizing and thinning are required in order to ensure high layout performance from the reduction of mounting space accompanying reduction in vehicle weight. . Furthermore, to reduce the number of components, reduce the size of components, and reduce the size of printed circuit boards, the structure that integrates the chassis and connector can reduce the number of components and increase the strength and thinness of the connector, enabling high layout. It becomes.
However, even in the case of the above structure, good quality is required for the printed circuit board, the housing, and the soldering.

この種の筐体とコネクタを一体化した構造の電子機器として、特許文献1に示すものがある。この特許文献1に示すものにおいては、プリント基板はプリント基板を内蔵する筐体の分割面に対して、同一な平面またはそれよりプリント基板を保持する筐体の底側に固定されると同時に、コネクタ接続ピンをプリント基板上に空けられた取付孔に差し込む事により配置し、その部分に半田を部分噴流することにより固定して、コネクタとプリント基板上の回路との電気的接続を確保していた。   As an electronic device having a structure in which this type of housing and connector are integrated, there is one disclosed in Patent Document 1. In the one shown in Patent Document 1, the printed circuit board is fixed on the same plane or the bottom side of the housing holding the printed circuit board with respect to the divided surface of the housing containing the printed circuit board, The connector connection pins are placed by inserting them into the mounting holes on the printed circuit board, and solder is partially sprayed onto the parts to secure the electrical connection between the connector and the circuit on the printed circuit board. It was.

特許第3748253号([0005]、[0006]、図4)Japanese Patent No. 3748253 ([0005], [0006], FIG. 4)

上述の特許文献1の発明では、ベースとカバーからなる筐体によってプリント基板を収納しているが、前記構造ではプリント基板端面に近接した位置に筐体側面或いは分割面があるため、プリント基板端面に近接した実装部品を図8のようにコネクタ接続ピン18を部分噴流半田19により、プリント基板15とコネクタ接続ピン18を電気的接続する場合、ケース側壁14bが半田20に接触しケース側壁14bが焼ける、或いは融けるという問題があった。
また、プリント基板15裏側に半田が廻りこむため、ケース側壁14b及びプリント基板15端面と実装部品16の間に十分な距離を取る必要があり、それによりプリント基板15やベース13、カバー14のサイズが大きくなることによって、コストアップに繋がるという問題があり、また、デザイン性、レイアウト性に制限があった。
In the above-mentioned invention of Patent Document 1, the printed circuit board is housed by a housing composed of a base and a cover. However, in the above structure, there is a housing side surface or a divided surface at a position close to the printed circuit board end surface. 8, when the printed circuit board 15 and the connector connection pin 18 are electrically connected to the connector connection pin 18 by the partial jet solder 19 as shown in FIG. 8, the case side wall 14b contacts the solder 20 and the case side wall 14b There was a problem of burning or melting.
In addition, since solder flows around the back side of the printed circuit board 15, it is necessary to provide a sufficient distance between the case side wall 14 b and the end surface of the printed circuit board 15 and the mounting component 16, and thereby the size of the printed circuit board 15, the base 13, and the cover 14. There is a problem that the increase in cost leads to an increase in cost, and there is a limitation in design and layout.

また、前記構造でコネクタ形状にロック機構など内側からスライドする構造があるような複雑なコネクタ形状の場合、コネクタ高さと同様の高さに筐体側壁があるため、金型が筐体底面と平行かつ内側方向に抜けないなど、金型抜き方向が制限され、コネクタ形状が構成できない場合があった。   Also, in the case of a complicated connector shape that has a structure in which the connector shape slides from the inside such as a lock mechanism in the above structure, the mold is parallel to the bottom surface of the housing because the housing side wall is at the same height as the connector height. In addition, there are cases in which the shape of the connector cannot be configured due to restrictions on the direction of die removal, such as failure to pull inward.

さらに、前記構造では、プリント基板端面に近接した位置に筐体側面があるため、プリント基板を筐体に組み付け後、プリント基板において、筐体との接面側実装面の状態を目視確認することが困難であった。   Furthermore, in the above structure, since the side surface of the casing is located close to the end face of the printed circuit board, after mounting the printed circuit board to the casing, the state of the mounting surface on the contact surface side with the casing on the printed circuit board is visually confirmed. It was difficult.

本発明は、上述の問題点に鑑みてなさせたものであり、半田回りこみ回避領域の縮小による実装面積の増加により基板面積および筐体サイズの縮小、筐体と複雑なコネクタを一体成形とする金型構造の成立、コネクタ端子とプリント基板を半田接続後、プリント基板の表裏両面の状態を容易に目視確認できることによる、プリント基板の品質向上および検査時間短縮を可能とする筐体構造を提供することを目的とする。   The present invention has been made in view of the above-described problems, and the board area and the housing size are reduced by increasing the mounting area by reducing the solder stagnation avoidance region, and the housing and the complex connector are integrally formed. Providing a housing structure that can improve the quality of the printed circuit board and shorten the inspection time by enabling the visual confirmation of the state of both the front and back sides of the printed circuit board after the connector structure and the printed circuit board are soldered. The purpose is to do.

本発明は、電子部品を実装するプリント基板と前記プリント基板を内蔵する筐体を有し、前記筐体は前記プリント基板面に平行な平面にて、前記プリント基板を保持する側の筐体部品と前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品との2つの部品により構成され、前記2つの筐体部品のうち、前記プリント基板を保持する側の筐体部品は、プリント基板を保持する座面を有する柱を備え、前記座面は筐体の分割面よりも前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品側に近い位置に設定したことを特徴とするものである。   The present invention includes a printed circuit board on which an electronic component is mounted and a housing containing the printed circuit board, and the housing is a housing component on the side that holds the printed circuit board in a plane parallel to the printed circuit board surface. And a casing component combined with a casing component on the side that holds the printed circuit board. Of the two casing components, the casing component on the side that holds the printed circuit board is printed A pillar having a seating surface for holding the board is provided, and the seating surface is set at a position closer to the housing component side combined with the housing component on the side holding the printed circuit board than the division surface of the housing. It is what.

本発明によれば、プリント基板を保持する柱の座面を筐体の分割面よりも前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品側に近い位置に設定することにより、部分噴流半田のスペースを確保することができ、プリント基板及び筐体を小型化することができるため、コストダウンを図ることができると共に、コネクタ接続ピンとプリント基板を半田接続後、プリント基板の表裏両面の状態を目視確認できることにより、品質を向上することができるという効果がある。   According to the present invention, by setting the seat surface of the column holding the printed circuit board closer to the housing component side combined with the housing component on the side holding the printed circuit board than the divided surface of the housing, Space for partial jet solder can be secured, and the printed circuit board and housing can be downsized, reducing costs, and after connecting the connector connection pins and the printed circuit board by soldering, both front and back sides of the printed circuit board By visually confirming the state, there is an effect that the quality can be improved.

この発明の実施の形態1に係る電子機器の筐体構造を示す分解斜視図である。It is a disassembled perspective view which shows the housing structure of the electronic device which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係るカバー組み付け前の電子機器の筐体構造を示す断面図である。It is sectional drawing which shows the housing structure of the electronic device before the cover assembly | attachment which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係るカバー組み付け後の電子機器の筐体構造を示す断面図である。It is sectional drawing which shows the housing structure of the electronic device after the cover assembly | attachment which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る部分噴流半田の実施状況を示す断面図である。It is sectional drawing which shows the implementation condition of the partial jet solder which concerns on Embodiment 1 of this invention. この発明の実施の形態1に係る電子機器の筐体構造におけるプリント基板の上面図である。It is a top view of the printed circuit board in the housing | casing structure of the electronic device which concerns on Embodiment 1 of this invention. この発明の実施の形態2に係る電子機器の筐体構造を示す分解斜視図である。It is a disassembled perspective view which shows the housing structure of the electronic device which concerns on Embodiment 2 of this invention. この発明の実施の形態2に係る電子機器の筐体構造を示す断面図である。It is sectional drawing which shows the housing structure of the electronic device which concerns on Embodiment 2 of this invention. 一般的に使用される電子機器の筐体における部分噴流半田を示す断面図である。It is sectional drawing which shows the partial jet solder in the housing | casing of the electronic device generally used.

実施の形態1.
この発明による実施の形態1を図1〜図3について説明する。図1はこの発明における車載用電子機器の筐体構造の全体構成を示す分解斜視図、図2は筐体を組み付ける前の状態を示す側断面図、図3は筐体を組み付けた後の状態を示す側断面図である。また、図4は部分噴流半田施工時の状態を示す側面図、図5はプリント基板の上面図である。
図1〜図3において、筐体1は、ケース3からなる筐体部品とカバー2からなる筐体部品によって構成されている。ケース3は板状底部3xの周縁から垂直上方に延在する角筒状の周壁部3yを有し、周壁部3yの上方周縁は上方に向け開口部を形成している。周壁部3yの四隅にはプリント基板4を保持する座面3bを上面部に有する柱3eが周壁部3yと平行して設けられている。カバー2は板状蓋部2xの周縁から垂直下方に延在する角筒状の周壁部2yを有し、周壁部2yの下方周縁は下方に向け開口部を形成している。
カバー2は周壁部2yの下方周縁をケース3における周壁3yの上方周縁に嵌合し合体した筐体1として組合わされ、このカバー2とケース3との組合せ状態においてカバー2における周壁部2yの下方開口部とケース3における周壁部3yの上方開口部とが合致して、筐体1の内部空間が閉塞状態となる。この筐体1の閉塞状態において、ケース3における周壁部3yの上方周縁とカバー2における周壁部2yの下方周縁とは固定状態で嵌合する嵌合部を構成し、筐体1の内部空間を閉塞状態に保持する。
カバー2とケース3との組合せ状態が解消される場合には、カバー2が上方へ移動され、カバー2における周壁部2yの下方周縁がケース3における周壁部3yの上方周縁から離れることによって分割状態となる。ケース3における周壁3yの上面が分割面3dを形成する。
柱3eの上面すなわちプリント基板4を保持する座面3bは、筐体1の分割面3dよりも高い位置に設けられている。また、プリント基板4にはU字状切欠部4aからなる係合部が設けられており、そのU字状切欠部4aを座面3bから突出しているリブ3cに圧入することによりプリント基板4が柱3eに係合されケース3に固定される。プリント基板4の縦或いは横方向の外形サイズは、ケース3で周壁部3yが区画する水平面でのケース3の内寸法に対し、同じ或いはやや大きくすることができる。
プリント基板4におけるU字状切欠部4aからなる係合部は、図5に示すように、プリント基板4の両側面に2個ずつ設けられ、それぞれが4本の柱3eの各々に圧入嵌合されるものである。プリント基板4は4本の柱3eによって水平面で延在して保持され、ケース3に固定される。
プリント基板4がケース3に固定されてから、プリント基板4上に設定されている実装部品(図示せず)の端子5を、図4のように部分噴流半田19にてプリント基板4と実装部品の端子5を半田20によって接続することにより電気的接続する。
Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an exploded perspective view showing an overall configuration of a housing structure of an in-vehicle electronic device according to the present invention, FIG. 2 is a side sectional view showing a state before the housing is assembled, and FIG. 3 is a state after the housing is assembled. FIG. FIG. 4 is a side view showing a state during partial jet soldering, and FIG. 5 is a top view of the printed circuit board.
In FIG. 1 to FIG. 3, the housing 1 is composed of a housing component consisting of a case 3 and a housing component consisting of a cover 2. The case 3 has a rectangular cylindrical peripheral wall portion 3y extending vertically upward from the peripheral edge of the plate-like bottom portion 3x, and the upper peripheral edge of the peripheral wall portion 3y forms an opening upward. At four corners of the peripheral wall portion 3y, pillars 3e having a seat surface 3b for holding the printed circuit board 4 on the upper surface are provided in parallel with the peripheral wall portion 3y. The cover 2 has a square cylindrical peripheral wall portion 2y extending vertically downward from the peripheral edge of the plate-like lid portion 2x, and the lower peripheral edge of the peripheral wall portion 2y forms an opening downward.
The cover 2 is combined as a housing 1 in which the lower peripheral edge of the peripheral wall portion 2y is fitted to and combined with the upper peripheral edge of the peripheral wall 3y in the case 3, and in the combined state of the cover 2 and the case 3, the lower portion of the peripheral wall portion 2y in the cover 2 The opening and the upper opening of the peripheral wall 3y in the case 3 coincide with each other, and the internal space of the housing 1 is closed. In the closed state of the housing 1, the upper peripheral edge of the peripheral wall portion 3 y in the case 3 and the lower peripheral edge of the peripheral wall portion 2 y in the cover 2 constitute a fitting portion that fits in a fixed state. Hold closed.
When the combined state of the cover 2 and the case 3 is eliminated, the cover 2 is moved upward, and the lower peripheral edge of the peripheral wall portion 2y in the cover 2 is separated from the upper peripheral edge of the peripheral wall portion 3y in the case 3. It becomes. The upper surface of the peripheral wall 3y in the case 3 forms a dividing surface 3d.
The upper surface of the pillar 3 e, that is, the seating surface 3 b that holds the printed circuit board 4 is provided at a position higher than the dividing surface 3 d of the housing 1. Further, the printed circuit board 4 is provided with an engaging portion made up of a U-shaped notch 4a, and the printed circuit board 4 is press-fitted into the rib 3c protruding from the seating surface 3b. It is engaged with the pillar 3e and fixed to the case 3. The external size in the vertical or horizontal direction of the printed circuit board 4 can be the same or slightly larger than the internal dimension of the case 3 on a horizontal plane defined by the peripheral wall 3y in the case 3.
As shown in FIG. 5, two engaging portions each having a U-shaped notch 4 a in the printed circuit board 4 are provided on both sides of the printed circuit board 4, and each is press-fitted to each of the four pillars 3 e. It is what is done. The printed circuit board 4 is extended and held in a horizontal plane by the four pillars 3 e and is fixed to the case 3.
After the printed circuit board 4 is fixed to the case 3, the terminals 5 of the mounting component (not shown) set on the printed circuit board 4 are connected to the printed circuit board 4 and the mounting component by partial jet solder 19 as shown in FIG. The terminals 5 are electrically connected by soldering 20.

そして、図2、図3に示すようにケース3には嵌合リブ3a、カバー2には嵌合フック2aを有しており、それらを嵌合することによってケース3とカバー2を固定している。この嵌合フック部は、貫通孔でも良いし、溝、凹部のように貫通しないものでも良い。また、図2、図3の例とは逆にケースに嵌合フック部を設け、カバーに嵌合リブを設けても良い。
なお、プリント基板4とケース3の嵌合による係合部は、リブ3cとU字状切欠部4aとの圧入の例を示したが、U字状切欠部4aに代えて嵌合穴を用いることも可能で、また、部品点数は増えるがこれの代わりにねじ止めでも良い。
また、上記説明では、プリント基板4を保持する座面3bを構成する柱3eをケース3の四隅に設けたが、それ以上の数を設けても良い。
As shown in FIGS. 2 and 3, the case 3 has a fitting rib 3a and the cover 2 has a fitting hook 2a. The case 3 and the cover 2 are fixed by fitting them. Yes. The fitting hook portion may be a through hole, or may not penetrate like a groove or a recess. 2 and 3, the case may be provided with a fitting hook portion and the cover may be provided with a fitting rib.
In addition, although the example of the press-fitting of the rib 3c and the U-shaped notch 4a is shown as the engaging part by the fitting of the printed circuit board 4 and the case 3, a fitting hole is used instead of the U-shaped notch 4a. In addition, the number of parts increases, but screwing may be used instead.
Further, in the above description, the pillars 3e constituting the seat surface 3b for holding the printed circuit board 4 are provided at the four corners of the case 3, but a larger number may be provided.

図2に示すように、柱3eを設けてプリント基板4を保持する座面3bをケース3の分割面3dよりも高い位置、すなわちカバー2側に近い位置に設けることで、ケース側壁が半田付けされる位置と十分距離が空く(図2の符号L)ため、プリント基板4上に配置された実装部品の端子5とプリント基板4端面との距離Yを縮小できることになる。このため、図4に示す、部分噴流による半田回りこみ回避領域4bを縮小でき、それによりプリント基板4及びケース3、カバー2のサイズダウンが図れるとともに、プリント基板4をケース3から取り外すことなくプリント基板4の表裏両面の実装部品や半田の状態を目視確認することを可能にしている。   As shown in FIG. 2, the side wall of the case is soldered by providing a pillar 3 e and a seat surface 3 b for holding the printed circuit board 4 at a position higher than the divided surface 3 d of the case 3, that is, a position close to the cover 2 side. A sufficient distance from the position to be placed (L in FIG. 2) allows the distance Y between the terminal 5 of the mounted component disposed on the printed circuit board 4 and the end surface of the printed circuit board 4 to be reduced. For this reason, the solder sneak avoidance region 4b shown in FIG. 4 can be reduced, thereby reducing the size of the printed board 4, the case 3, and the cover 2, and printing without removing the printed board 4 from the case 3. It is possible to visually check the state of mounted components and solder on both the front and back surfaces of the substrate 4.

実施の形態2.
この発明による実施の形態2を図6および図7について説明する。図6はこの発明による実施の形態2における車載用電子機器の筐体構造を示す分解斜視図、図7はそのケース部分の側断面図である。
この実施の形態2では、図6のように、ケース9はプリント基板4に対する電気的接続を行うコネクタの外被を構成するコネクタハウジング部9bと一体成形される。ケース9とコネクタハウジング部9bとは複数の金型部分からなる金型装置によって一体に樹脂成形されるものである。ケース9を覆うカバー8には嵌合フック8aが設けられている。
多数の接続ピン11がコネクタハウジング部9bへの圧入或いはコネクタハウジング部9bとの一体成形によってコネクタハウジング部9bにケース9開口部側へ垂直に曲げられた状態で配設され、プリント基板4に対するコネクタを構成する。
ケース9の分割面9d(実施の形態1におけるケース3の分割面3dに相当)は、コネクタハウジング部9bの一部内面を形成するための金型部分のケース内側から抜く部分9eよりも底側に設定する。すなわち、コネクタハウジング部9bの一部内面を形成するための金型部分のケース内側から抜く部分9eは、ケース9の分割面9dよりも上側のカバー8側に設定されている。
また、コネクタハウジング部9bにはロック機構などに用いる突起部9fが設けられ、その複雑形状を金型により成形する必要があるが、コネクタハウジング部9bの突起部9fを成形する金型部分の成形作業後のスライド抜き方向S1は、コネクタハウジング部9bの一部内面を成形した後の金型部分12のケース内側からのスライド抜き方向S2と逆方向となっており、困難な成形作業を円滑に進めることができる。
そして、プリント基板10を実施の形態1と同様に設置し、実装部品の端子5を部分噴流半田接続すると同時に、接続ピン11とプリント基板10を半田接続により電気的接続する。なお、筐体1のその他の構造は、実施の形態1と同様であるので、詳細な説明は省略する。
Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. 6 is an exploded perspective view showing a housing structure of an in-vehicle electronic device according to Embodiment 2 of the present invention, and FIG. 7 is a side sectional view of the case portion.
In the second embodiment, as shown in FIG. 6, the case 9 is integrally formed with a connector housing portion 9 b that constitutes a jacket of a connector that performs electrical connection to the printed circuit board 4. The case 9 and the connector housing portion 9b are integrally molded with a resin by a mold apparatus including a plurality of mold parts. The cover 8 that covers the case 9 is provided with a fitting hook 8a.
A large number of connecting pins 11 are arranged in the connector housing portion 9b in a state of being bent vertically toward the opening of the case 9 by being press-fitted into the connector housing portion 9b or integrally formed with the connector housing portion 9b. Configure.
The dividing surface 9d of the case 9 (corresponding to the dividing surface 3d of the case 3 in the first embodiment) is on the bottom side of the portion 9e to be extracted from the inside of the case of the mold portion for forming the partial inner surface of the connector housing portion 9b. Set to. That is, a portion 9e of the mold portion for forming a partial inner surface of the connector housing portion 9b is set on the cover 8 side above the dividing surface 9d of the case 9.
Further, the connector housing portion 9b is provided with a projection portion 9f used for a lock mechanism or the like, and it is necessary to mold the complicated shape with a mold. However, the mold portion for molding the projection portion 9f of the connector housing portion 9b is molded. The slide-out direction S1 after the operation is opposite to the slide-out direction S2 from the inside of the case of the mold part 12 after forming a part of the inner surface of the connector housing portion 9b, so that difficult molding work can be smoothly performed. Can proceed.
Then, the printed circuit board 10 is installed in the same manner as in the first embodiment, and the terminals 5 of the mounted components are connected by partial jet soldering, and at the same time, the connection pins 11 and the printed circuit board 10 are electrically connected by solder connection. Since the other structure of the housing 1 is the same as that of the first embodiment, detailed description thereof is omitted.

このように構成した実施の形態2においては、コネクタ形状にロック機構など内側からスライドする構造があるような複雑なコネクタ形状、例えば図7に示すような部分9eがある場合も、傾斜ピンなどを用いることなくスライド構造を構成できると共に、部品点数削減と品質向上を同時に実施することができる。   In Embodiment 2 configured as described above, even if the connector has a complicated connector shape such as a lock mechanism that slides from the inside, such as a portion 9e as shown in FIG. The slide structure can be configured without using it, and the number of parts can be reduced and the quality can be improved at the same time.

以上のように、本発明によれば、プリント基板を保持する座面を有する柱を設け、前記座面をケースの分割面よりも高い位置、すなわち前記プリント基板を保持する側の筐体と組み合わされる筐体側に近い位置に設定し、プリント基板は前記座面から突出したリブにて保持することにより、部分噴流半田のスペースを確保することができ、プリント基板及び筐体を小型化することができるため、コストダウンを図ることができると共に、筐体と複雑なコネクタを一体成形する場合、筐体内側よりスライドを抜く構造を構成できると共に、コネクタ接続ピンとプリント基板を半田接続後、プリント基板の表裏両面の状態を目視確認できることにより、品質を向上することができる。   As described above, according to the present invention, a column having a seating surface for holding a printed circuit board is provided, and the seating surface is combined with a housing at a position higher than the dividing surface of the case, that is, the printed circuit board. The position near the housing side is set, and the printed circuit board is held by a rib protruding from the seating surface, so that a space for partial jet solder can be secured, and the printed circuit board and the housing can be downsized. As a result, the cost can be reduced and a structure in which the slide is pulled out from the inside of the case when the case and the complicated connector are integrally formed can be configured, and the connector connection pin and the printed circuit board can be connected by soldering. Quality can be improved by being able to visually check the state of both front and back surfaces.

なお、本発明はその発明の範囲内において、各実施の形態の一部または全部を自由に組合わせたり、各実施の形態を適宜、変形、省略することが可能である。   Note that the present invention can be partly or wholly combined with each other within the scope of the invention, or can be appropriately modified or omitted.

1 電子機器筐体、2 カバー、2a 嵌合フック、2x 板状蓋部、2y 周壁部、3 ケース、3a 嵌合リブ、3b プリント基板保持座面、3c プリント基板圧入リブ、3d ケース・カバー分割面、3e 柱、3x 板状底部、3y 周壁部、4 プリント基板、4a U字状切欠部、4b 半田回りこみ回避領域、5 実装部品の端子、8 カバー、8a 嵌合フック、9 ケース(コネクタハウジング部一体成形)、9a 嵌合リブ、9b コネクタハウジング部、9c 柱、9d ケース分割面、9e コネクタハウジング内抜き部、9f 突起部、10 プリント基板、11 コネクタ接続ピン、12 金型部分、19 部分噴流半田、20 半田の流れ、L ケース側壁・基板間距離、Y 実装部品の端子・基板端面間の距離。   DESCRIPTION OF SYMBOLS 1 Electronic device housing | casing, 2 cover, 2a fitting hook, 2x plate-shaped cover part, 2y peripheral wall part, 3 case, 3a fitting rib, 3b printed circuit board holding seat surface, 3c printed circuit board press-fitting rib, 3d case and cover division | segmentation Surface, 3e pillar, 3x plate-like bottom part, 3y peripheral wall part, 4 printed circuit board, 4a U-shaped notch, 4b solder sneak avoidance area, 5 mounting component terminal, 8 cover, 8a fitting hook, 9 case (connector) Housing part integrated molding), 9a Fitting rib, 9b Connector housing part, 9c Pillar, 9d Case dividing surface, 9e Inner part of connector housing, 9f Projection part, 10 Printed circuit board, 11 Connector connection pin, 12 Mold part, 19 Partial jet solder, 20 Solder flow, L Case side wall / distance between boards, Y Distance between terminals of mounting parts and board end face.

本発明は、電子部品を実装し実装された前記電子部品の端子を有するプリント基板と前記プリント基板を内蔵する筐体を有し、前記筐体は、前記プリント基板を保持する側の筐体部品としてのケースとこのケースを覆い前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品としてのカバーとにより構成されるとともに、前記ケースと前記カバーとは角筒状の周壁部をそれぞれ有し、前記筐体を構成する前記ケース及び前記カバーにおける周壁部の各々には互いに嵌合する嵌合部を備え、前記ケース及び前記カバーは前記プリント基板面に平行な平面にて互いに分割可能に構成されるものであって、前記ケースは前記周壁部から前記周壁部の延在方向に突出し前記周壁部と一体に形成されて前記プリント基板を保持する座面がそれぞれ設けられた複数の柱を有し、前記柱の座面により前記プリント基板を保持することによって前記プリント基板を前記ケースの前記周壁部から離隔して配設するようにしたことを特徴とするものである。 The present invention includes a housing that incorporates a printed circuit board to have a terminal of the electronic component which is mounted with electronic component mounting said printed circuit board, wherein the housing, on the side housing for holding the printed circuit board together they are constituted by the cover of the housing parts to be combined with the case of the component to the side of the housing part which holds the printed circuit board to cover the case, the case and the square tube-shaped peripheral wall portion and cover Each of the peripheral wall portions of the case and the cover constituting the casing includes a fitting portion that fits to each other , and the case and the cover are separated from each other by a plane parallel to the printed circuit board surface. capable be those that are configured, wherein the case seating surface pixel for holding the printed circuit board are formed integrally with projecting peripheral wall portion in the extending direction of the peripheral wall portion from said peripheral wall A plurality of pillars Re provided respectively, and characterized in that so as to dispose at a distance of the printed circuit board from the peripheral wall of the case by holding the printed circuit board by the seating surface of said post To do.

本発明によれば、ケースの周壁部から突出して延在する複数の柱に設けられた座面によりプリント基板を保持してプリント基板をケースの周壁部から離隔して配設するようにしたことにより、プリント基板の端子に係る半田接続作業のための部分噴流半田のスペースを確保することができ、プリント基板及び筐体を小型化することができるため、コストダウンを図ることができると共に、プリント基板における半田接続を行った後に、プリント基板の表裏両面の状態を目視確認できることにより、品質を向上することができるという効果がある。 According to the present invention, the printed circuit board is held by the seating surfaces provided on the plurality of pillars that protrude from the peripheral wall portion of the case, and the printed circuit board is disposed separately from the peripheral wall portion of the case. Accordingly, it is possible to secure a portion jet solder space for soldering connection work of the printed circuit board terminals, a printed circuit board and the housing it is possible to miniaturize, it is possible to reduce the cost, printing Since the state of both the front and back surfaces of the printed circuit board can be visually confirmed after the solder connection on the circuit board is performed , the quality can be improved.

Claims (7)

電子部品を実装するプリント基板と前記プリント基板を内蔵する筐体を有し、前記筐体は前記プリント基板面に平行な平面にて、前記プリント基板を保持する側の筐体部品と前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品との2つの部品により構成され、前記2つの筐体部品のうち、前記プリント基板を保持する側の筐体部品は、プリント基板を保持する座面を有する柱を備え、前記座面は筐体の分割面よりも前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品側に近い位置に設定したことを特徴とする車載用電子機器の筐体構造。   A printed circuit board on which an electronic component is mounted; and a housing containing the printed circuit board, wherein the housing is a plane parallel to the printed circuit board surface, and the housing component on the side for holding the printed circuit board and the printed circuit board The housing part is combined with a housing part to be combined with the housing part, and the housing part on the side that holds the printed circuit board of the two housing parts holds the printed circuit board. It is provided with a pillar having a seating surface, and the seating surface is set at a position closer to the housing component side combined with the housing component on the side holding the printed circuit board than the division surface of the housing. Electronic equipment housing structure. 電子部品を実装するプリント基板と前記プリント基板を内蔵する筐体を有し、前記筐体は前記プリント基板面に平行な平面にて、ケースとこのケースを覆うカバーとにより分割構成されるとともに、前記ケース及び前記カバーの各々には互いに嵌合する嵌合部を備え、前記ケースの内壁には前記プリント基板を保持する座面を有する柱を有し、前記柱の座面は筐体の分割面よりも高い位置に設定したことを特徴とする車載用電子機器の筐体構造。   It has a printed circuit board on which electronic components are mounted and a housing containing the printed circuit board, and the housing is divided into a plane parallel to the printed circuit board surface and a case and a cover that covers the case, Each of the case and the cover includes a fitting portion that fits to each other, and an inner wall of the case has a column having a seat surface that holds the printed circuit board, and the seat surface of the column is a division of the housing An in-vehicle electronic device casing structure characterized by being set at a position higher than the surface. 前記プリント基板は、前記プリント基板上の係合部を前記座面から突出しているリブに圧入することにより固定され、保持されていることを特徴とする請求項1または請求項2に記載の車載用電子機器の筐体構造。   The in-vehicle device according to claim 1, wherein the printed circuit board is fixed and held by press-fitting an engagement portion on the printed circuit board into a rib protruding from the seating surface. Housing structure for electronic equipment. 前記プリント基板は、前記2つの筐体部品の内、前記プリント基板を保持する側の筐体部品の内寸法に対し、縦或いは横方向の外形サイズが同じ或いは大きいこと特徴とする請求項1から請求項3のいずれかに記載の車載用電子機器の筐体構造。   2. The printed circuit board according to claim 1, wherein an outer size in the vertical or horizontal direction is the same as or larger than an inner dimension of a housing part on a side of holding the printed circuit board among the two housing parts. The case structure of the vehicle-mounted electronic device in any one of Claim 3. 前記プリント基板を保持する側の筐体部品は前記プリント基板に対する外被を構成するコネクタハウジング部と金型によって一体成形され、前記筐体が前記コネクタハウジング部と一体構造となっていることを特徴とする請求項1から請求項4のいずれかに記載の車載用電子機器の筐体構造。   The housing component on the side that holds the printed circuit board is integrally formed by a connector housing portion and a mold that form an outer cover for the printed circuit board, and the housing is integrated with the connector housing portion. The housing structure of the in-vehicle electronic device according to any one of claims 1 to 4. 前記プリント基板を保持する側の筐体部品で前記コネクタハウジング部の内側が、前記コネクタハウジングの突起部を形成する第1の金型部分と逆方向のスライド抜き方向を持つ第2の金型部分によって形成される構造であることを特徴とする請求項5に記載の車載用電子機器の筐体構造。   A second mold part having a slide-out direction opposite to the first mold part forming the projection of the connector housing, the inner side of the connector housing part being a housing part on the side holding the printed circuit board The case structure of the vehicle-mounted electronic device according to claim 5, wherein the case structure is formed by: 前記コネクタハウジング部を形成するための金型部分を前記プリント基板を保持する側の筐体内側から抜く部分は、前記2つの筐体部品の分割面よりも前記プリント基板を保持する側の筐体部品と組み合わされる筐体部品側に位置していることを特徴とする請求項5または請求項6に記載の車載用電子機器の筐体構造。   The part for removing the mold part for forming the connector housing portion from the inside of the casing on the side holding the printed board is the casing on the side holding the printed board with respect to the divided surface of the two casing parts. The case structure of the vehicle-mounted electronic device according to claim 5, wherein the case structure is located on a case component side combined with the component.
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JPH05275869A (en) * 1992-03-25 1993-10-22 Fujitsu Ltd Small casing for electric equipment
JP2001102785A (en) * 1999-09-30 2001-04-13 Denso Corp Electronic controller

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JPH0365288U (en) * 1989-10-30 1991-06-25
JPH0484497A (en) * 1990-07-27 1992-03-17 Mitsubishi Electric Corp Circuit board supporting device
JPH05275869A (en) * 1992-03-25 1993-10-22 Fujitsu Ltd Small casing for electric equipment
JP2001102785A (en) * 1999-09-30 2001-04-13 Denso Corp Electronic controller

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JP2016197687A (en) * 2015-04-06 2016-11-24 株式会社デンソー Electronic control device
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